WO2016153298A1 - 접착제 조성물 - Google Patents
접착제 조성물 Download PDFInfo
- Publication number
- WO2016153298A1 WO2016153298A1 PCT/KR2016/003009 KR2016003009W WO2016153298A1 WO 2016153298 A1 WO2016153298 A1 WO 2016153298A1 KR 2016003009 W KR2016003009 W KR 2016003009W WO 2016153298 A1 WO2016153298 A1 WO 2016153298A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive composition
- weight
- parts
- group
- resin
- Prior art date
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 123
- 239000000853 adhesive Substances 0.000 title claims abstract description 122
- 239000000203 mixture Substances 0.000 title claims description 143
- 229920005989 resin Polymers 0.000 claims description 125
- 239000011347 resin Substances 0.000 claims description 125
- 238000005538 encapsulation Methods 0.000 claims description 47
- 229920005672 polyolefin resin Polymers 0.000 claims description 42
- 150000001875 compounds Chemical class 0.000 claims description 37
- 125000004432 carbon atom Chemical group C* 0.000 claims description 36
- 239000003795 chemical substances by application Substances 0.000 claims description 35
- 239000003463 adsorbent Substances 0.000 claims description 27
- 239000003999 initiator Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 21
- 125000000524 functional group Chemical group 0.000 claims description 18
- 239000011256 inorganic filler Substances 0.000 claims description 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 17
- 125000003342 alkenyl group Chemical group 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 8
- 230000009477 glass transition Effects 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000003368 amide group Chemical group 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 3
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 3
- 125000003566 oxetanyl group Chemical group 0.000 claims description 3
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 125000004018 acid anhydride group Chemical group 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate group Chemical group [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 abstract description 5
- 239000001301 oxygen Substances 0.000 abstract description 5
- 230000001747 exhibiting effect Effects 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 54
- 239000010410 layer Substances 0.000 description 42
- 239000003822 epoxy resin Substances 0.000 description 22
- 229920000647 polyepoxide Polymers 0.000 description 22
- 238000000034 method Methods 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- -1 hydrazide groups Chemical group 0.000 description 16
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 15
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 14
- 239000000292 calcium oxide Substances 0.000 description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 13
- 238000002156 mixing Methods 0.000 description 13
- 229920002367 Polyisobutene Polymers 0.000 description 12
- 230000004888 barrier function Effects 0.000 description 12
- 229920001187 thermosetting polymer Polymers 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 239000007788 liquid Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 9
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 8
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 229910002012 Aerosil® Inorganic materials 0.000 description 7
- 229910021485 fumed silica Inorganic materials 0.000 description 7
- 239000011368 organic material Substances 0.000 description 7
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 239000008393 encapsulating agent Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 5
- 150000002460 imidazoles Chemical class 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 229920001195 polyisoprene Polymers 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 230000009974 thixotropic effect Effects 0.000 description 5
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 125000001118 alkylidene group Chemical group 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 229920005549 butyl rubber Polymers 0.000 description 4
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000002518 antifoaming agent Substances 0.000 description 3
- 238000012663 cationic photopolymerization Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000004843 novolac epoxy resin Substances 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000005361 soda-lime glass Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical compound CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- UAHWPYUMFXYFJY-UHFFFAOYSA-N beta-myrcene Chemical compound CC(C)=CCCC(=C)C=C UAHWPYUMFXYFJY-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical compound CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229940117969 neopentyl glycol Drugs 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- RLUFBDIRFJGKLY-UHFFFAOYSA-N (2,3-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1Cl RLUFBDIRFJGKLY-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- SMYPNMJNLGQRRL-UHFFFAOYSA-N 1h-imidazole;1,3,5-triazinane-2,4,6-trione Chemical compound C1=CNC=N1.O=C1NC(=O)NC(=O)N1 SMYPNMJNLGQRRL-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- ZIHDWZZSOZGDDK-UHFFFAOYSA-N 2-(2,3-dihydroxy-2-phenylpropanoyl)benzenesulfonic acid Chemical compound OCC(C(C=1C(=CC=CC=1)S(=O)(=O)O)=O)(O)C1=CC=CC=C1 ZIHDWZZSOZGDDK-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- XOGPDSATLSAZEK-UHFFFAOYSA-N 2-Aminoanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(N)=CC=C3C(=O)C2=C1 XOGPDSATLSAZEK-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- YJQMXVDKXSQCDI-UHFFFAOYSA-N 2-ethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3SC2=C1 YJQMXVDKXSQCDI-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- MHNNAWXXUZQSNM-UHFFFAOYSA-N 2-methylbut-1-ene Chemical compound CCC(C)=C MHNNAWXXUZQSNM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- OBOSXEWFRARQPU-UHFFFAOYSA-N 2-n,2-n-dimethylpyridine-2,5-diamine Chemical compound CN(C)C1=CC=C(N)C=N1 OBOSXEWFRARQPU-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical class [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 1
- MPCRDALPQLDDFX-UHFFFAOYSA-L Magnesium perchlorate Chemical compound [Mg+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O MPCRDALPQLDDFX-UHFFFAOYSA-L 0.000 description 1
- 101100496858 Mus musculus Colec12 gene Proteins 0.000 description 1
- 229910019800 NbF 5 Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 125000004036 acetal group Chemical group 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- VYBREYKSZAROCT-UHFFFAOYSA-N alpha-myrcene Natural products CC(=C)CCCC(=C)C=C VYBREYKSZAROCT-UHFFFAOYSA-N 0.000 description 1
- LBDSXVIYZYSRII-IGMARMGPSA-N alpha-particle Chemical compound [4He+2] LBDSXVIYZYSRII-IGMARMGPSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- SGUXGJPBTNFBAD-UHFFFAOYSA-L barium iodide Chemical compound [I-].[I-].[Ba+2] SGUXGJPBTNFBAD-UHFFFAOYSA-L 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- OOULUYZFLXDWDQ-UHFFFAOYSA-L barium perchlorate Chemical compound [Ba+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O OOULUYZFLXDWDQ-UHFFFAOYSA-L 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- QDVNNDYBCWZVTI-UHFFFAOYSA-N bis[4-(ethylamino)phenyl]methanone Chemical compound C1=CC(NCC)=CC=C1C(=O)C1=CC=C(NCC)C=C1 QDVNNDYBCWZVTI-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000004292 cyclic ethers Chemical group 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 125000005520 diaryliodonium group Chemical group 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- XNMQEEKYCVKGBD-UHFFFAOYSA-N dimethylacetylene Natural products CC#CC XNMQEEKYCVKGBD-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- GCSJLQSCSDMKTP-UHFFFAOYSA-N ethenyl(trimethyl)silane Chemical compound C[Si](C)(C)C=C GCSJLQSCSDMKTP-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- SBDRYJMIQMDXRH-UHFFFAOYSA-N gallium;sulfuric acid Chemical compound [Ga].OS(O)(=O)=O SBDRYJMIQMDXRH-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AHAREKHAZNPPMI-UHFFFAOYSA-N hexa-1,3-diene Chemical compound CCC=CC=C AHAREKHAZNPPMI-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 125000000686 lactone group Chemical group 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- AOLPZAHRYHXPLR-UHFFFAOYSA-I pentafluoroniobium Chemical compound F[Nb](F)(F)(F)F AOLPZAHRYHXPLR-UHFFFAOYSA-I 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001631 strontium chloride Inorganic materials 0.000 description 1
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- HDUMBHAAKGUHAR-UHFFFAOYSA-J titanium(4+);disulfate Chemical compound [Ti+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O HDUMBHAAKGUHAR-UHFFFAOYSA-J 0.000 description 1
- 125000005106 triarylsilyl group Chemical group 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- ZOYIPGHJSALYPY-UHFFFAOYSA-K vanadium(iii) bromide Chemical compound [V+3].[Br-].[Br-].[Br-] ZOYIPGHJSALYPY-UHFFFAOYSA-K 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
- C08F255/08—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms
- C08F255/10—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms on to butene polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/66—Substances characterised by their function in the composition
- C08L2666/78—Stabilisers against oxidation, heat, light or ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
- G01N25/48—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation
- G01N25/4846—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation for a motionless, e.g. solid sample
- G01N25/4866—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation for a motionless, e.g. solid sample by using a differential method
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the present application relates to an adhesive composition, an organic electronic device including the same, and a manufacturing method of the organic electronic device.
- An organic electronic device refers to a device including an organic material layer that generates an exchange of electric charges using holes and electrons, and examples thereof include a photovoltaic device, a rectifier, Transmitters and organic light emitting diodes (OLEDs); and the like.
- organic light emitting diodes have low power consumption, fast response speed, and are advantageous for thinning a display device or lighting, as compared with conventional light sources.
- OLED has excellent space utilization, and is expected to be applied in various fields including various portable devices, monitors, notebooks, and TVs.
- Patent document 1 is an adhesive encapsulation composition film and an organic electroluminescent element, which is poor in workability with an adhesive based on PIB (polyisobutylene) and poor in high temperature and high humidity conditions.
- PIB polyisobutylene
- Patent Document 1 Korean Unexamined Patent No. 2008-0088606
- the present application is possible to form a structure that can effectively block the moisture or oxygen flowing into the organic electronic device from the outside to ensure the life of the organic electronic device, it is possible to implement the top-emitting organic electronic device, the water blocking
- the present invention provides an adhesive composition having excellent adhesive durability and reliability at high temperature and high humidity, and an organic electronic device including the same.
- the present application relates to an adhesive composition.
- the adhesive composition may be, for example, an encapsulant applied to encapsulating or encapsulating an organic electronic device such as an OLED.
- the adhesive composition of the present application can be applied to encapsulating or encapsulating at least one side of the organic electronic device. Thus, after the adhesive has been applied to the encapsulation, it may be present at the periphery of the organic electronic device.
- organic electronic device means an article or device having a structure including an organic material layer that generates an exchange of electric charge using holes and electrons between a pair of electrodes facing each other.
- the photovoltaic device, a rectifier, a transmitter, and an organic light emitting diode (OLED) may be mentioned, but is not limited thereto.
- the organic electronic device may be an OLED.
- An exemplary organic electronic device encapsulation adhesive composition has a first peak in a range of 20 ° C. to 60 ° C. and 80 ° C. to 120 ° C. upon measurement of glass transition temperature by differential scanning calorimetry after curing. It can represent the second peak within the range of. That is, the cured adhesive according to the present application may have at least two peaks, which peaks may be in the range of 20 ° C. to 60 ° C. and the range of 80 ° C. to 120 ° C., respectively. In addition, in an embodiment of the present application, the adhesive composition may have a tensile modulus at 25 ° C.
- the tensile modulus can be measured by the Texture Analyzer, the specimen was measured by preparing a thickness of 1cm ⁇ 3cm and 200 ⁇ m.
- the present application by controlling the glass transition temperature and the tensile modulus of the cured adhesive in the above range, it is possible to provide excellent durability reliability at high temperature and high humidity while at the same time realizing excellent moisture barrier performance.
- the moisture absorbent is included in the encapsulant, and thus, the encapsulant has a problem in that it is difficult to maintain the adhesion durability by the expansion stress generated as the adsorbent absorbs the moisture. Accordingly, the present application can maintain the adhesion durability by reducing the expansion stress by using the adhesive composition showing the first and second peaks as an encapsulant so as to relieve the stress.
- the adhesive composition having the glass transition temperature and the tensile modulus it is possible to control the composition constituting the adhesive composition and the content of the composition.
- the material constituting the composition is not particularly limited.
- the present application by controlling the composition of the adhesive composition, by implementing an appropriate range of elastic modulus, the degree of crosslinking between the composition and the crosslinked structure in the desired range, it is possible to maintain excellent adhesion durability reliability.
- the term adhesive herein may be used in the same sense as the adhesive composition.
- the adhesive composition may include an olefinic resin and a curable resin having a water vapor transmission rate of 50 g / m 2 ⁇ day or less.
- the adhesive composition of the present application may include an olefin resin having a water vapor transmission rate of 50 g / m 2 ⁇ day or less.
- an olefin resin having a water vapor transmission rate of 50 g / m 2 ⁇ day or less refers to a water vapor transmission rate measured for the thickness direction of the film in a state in which the resin is manufactured in a film form formed of a resin layer having a thickness of 100 ⁇ m.
- Transmission Rate may refer to a resin measured below 50 g / m 2 ⁇ day.
- the water vapor transmission rate is 50 g / m 2 ⁇ day or less, 40 g / m 2 ⁇ day or less, 30 g / m 2 ⁇ day or less, 20 g / m 2 ⁇ day or less or 10 under 100 ° F. and 100% relative humidity. g / m 2 ⁇ day or less.
- exemplary olefinic resins of the present application include resins derived from mixtures of monomers, which mixtures may have at least 4 to 7 isoolefin monomer components or multiolefin monomer components.
- Isoolefins can be present, for example, in the range of 70 to 100 weight percent, or 85 to 99.5 weight percent, by total monomer weight.
- the multiolefin derived component may be present in the range of 0.5 to 30 weight percent, 0.5 to 15 weight percent, or 0.5 to 8 weight percent.
- Isoolefins are, for example, isobutylene, 2-methyl-1-butene, 3-methyl-1-butene, 2-methyl-2-butene, 1-butene, 2-butene, methyl vinyl ether, indene, Vinyltrimethylsilane, hexene, or 4-methyl-1-pentene can be exemplified.
- Multiolefins may have 4 to 14 carbon atoms, for example isoprene, butadiene, 2,3-dimethyl-1,3-butadiene, myrcene, 6,6-dimethyl-pulbene, hexadiene, cyclopentadiene, or Piperylylene can be exemplified.
- Other polymerizable monomers such as styrene and dichlorostyrene can also be homopolymerized or copolymerized.
- the olefin resin may include isobutylene homopolymer or copolymer.
- isobutylene-based olefinic resins or polymers may refer to olefinic resins or polymers comprising at least 70 mol% repeating units and one or more other polymerizable units from isobutylene.
- the olefinic resin may be butyl rubber or branched butyl rubber.
- Exemplary olefinic resins are copolymers of unsaturated butyl rubbers such as olefins or isoolefins with multiolefins.
- the olefin resin included in the adhesive composition of the present invention poly (isobutylene-co-isoprene), polyisoprene, polybutadiene, polyisobutylene, poly (styrene-co-butadiene), natural rubber, butyl rubber, and Mixtures of these can be exemplified.
- the olefinic resins useful in the present application may be prepared by any suitable means known in the art, and the present invention is not limited thereto by the method of making the olefinic resin.
- the olefin resin may be a low molecular weight polyisobutylene resin.
- the olefin resin may have a weight average molecular weight of 100,000 or less and 500 or more or 55,000 or more.
- the present application can implement the adhesive composition suitable for the coating and encapsulation process by controlling the weight average molecular weight of the olefin resin in the above range.
- the adhesive composition may have a liquid form and may be appropriately applied to the side bag of the organic electronic device described below.
- the olefin resin may be a resin having at least one functional group reactive with the aforementioned thermosetting resin.
- the reactive functional group included in the olefin resin may be a polar functional group.
- the kind of the reactive functional group is not particularly limited, and examples thereof include acid anhydride groups, carboxyl groups, epoxy groups, amino groups, hydroxy groups, isocyanate groups, oxazoline groups, oxetane groups, cyanate groups, phenol groups, hydrazide groups, Or an amide group.
- olefinic resin having the reactive functional group examples include succinic anhydride modified polyisobutylene, maleic anhydride modified liquid polyisobutylene, maleic anhydride modified liquid polyisoprene, epoxy modified polyisoprene, and hydroxyl group modified liquid. Polyisoprene or allyl modified liquid polyisoprene.
- the present application may provide an adhesive having a physical property such as moisture barrier properties, durability reliability, etc. which are desired in the present application after curing by forming a crosslinked structure with the thermosetting resin which the olefin resin as described above will be described later.
- the adhesive composition may include a curable resin.
- the curable resin may be a thermosetting resin or a photocurable resin.
- the curable resin may be a resin containing at least one curable functional group.
- the specific kind of curable resin that can be used in the present application is not particularly limited, and for example, various curable resins known in the art may be used.
- thermosetting resin means a resin that can be cured through an appropriate heat application or aging process
- photocurable resin refers to a resin that can be cured by irradiation of electromagnetic waves. it means.
- the photocurable resin may be a photocationic curable resin.
- curable resin in this application may be cured to exhibit adhesive properties, and may include at least one thermosetting functional group such as an epoxy group, a glycidyl group, an isocyanate group, a hydroxy group, a carboxyl group, or an amide group, or may be an epoxide group or a ring.
- resins containing at least one functional group that can be cured by irradiation of electromagnetic waves such as a cyclic ether group, a sulfide group, an acetal group, or a lactone group.
- specific types of the resin may include an acrylic resin, a polyester resin, an isocyanate resin or an epoxy resin, but is not limited thereto.
- an epoxy acrylate or a urethane acrylate may be exemplified. Can be.
- the curable resin aromatic or aliphatic; Or an epoxy resin of linear or branched chain type can be used.
- an epoxy resin having an epoxy equivalent of 180 g / eq to 1,000 g / eq may be used.
- an epoxy resin having an epoxy equivalent in the above range it is possible to effectively maintain properties such as adhesion performance and glass transition temperature of the cured product.
- examples of such epoxy resins include cresol novolac epoxy resins, bisphenol A epoxy resins, bisphenol A novolac epoxy resins, phenol novolac epoxy resins, tetrafunctional epoxy resins, biphenyl epoxy resins, and triphenol methane types.
- a kind or mixture of an epoxy resin, an alkyl modified triphenol methane epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, or a dicyclopentadiene modified phenol type epoxy resin is mentioned.
- an epoxy resin containing a cyclic structure in a molecular structure can be used as the thermosetting resin, for example, an alicyclic epoxy resin can be used.
- the alicyclic epoxy resin is excellent in compatibility with the olefin resin, it can be cured without phase separation to implement a uniform crosslinking of the adhesive.
- the curable resin may be included in 10 to 80 parts by weight based on 100 parts by weight of the olefin resin. Specifically, the curable resin may be included in 10 to 80 parts by weight, 20 to 75 parts by weight or 40 to 75 parts by weight based on 100 parts by weight of the olefin resin. According to the present application, by controlling the content range, it is possible to secure heat resistance after the adhesive composition is cured, and can provide an adhesive composition having excellent moisture barrier properties, durability, and reliability at the same time.
- the adhesive composition may include a curing agent.
- the curing agent may be a thermosetting or photocuring agent.
- an appropriate type can be selected and used according to the kind of curable resin or the functional group contained in curable resin, and can be used 1 or more types.
- the adhesive composition of the present application may include a cationic photocuring agent and a thermosetting agent together, and the present application may implement the temporary curing and the main curing process by using two or more kinds of curing agents, as described below.
- the curing agent may be a curing agent of an epoxy resin known in the art, for example, an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent or an acid anhydride curing agent.
- an epoxy resin known in the art, for example, an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent or an acid anhydride curing agent.
- One kind or more than one kind may be used, but is not limited thereto.
- the curing agent may be an imidazole compound which is solid at room temperature and has a melting point or decomposition temperature of 80 ° C. or higher.
- an imidazole compound which is solid at room temperature and has a melting point or decomposition temperature of 80 ° C. or higher.
- the curing agent may be a latent thermosetting agent such as imidazole-isocyanuric acid adduct, amine-epoxy adduct, boron trifluoride-amine complex or encapsulated imidazole. That is, in the present invention, light irradiation proceeds first in the curing process of the adhesive composition to control initial fluidity, and the curing agent may cure the curable resin as a latent curing agent in the main curing step after light irradiation.
- a latent thermosetting agent such as imidazole-isocyanuric acid adduct, amine-epoxy adduct, boron trifluoride-amine complex or encapsulated imidazole. That is, in the present invention, light irradiation proceeds first in the curing process of the adhesive composition to control initial fluidity, and the curing agent may cure the curable resin as a latent curing agent in the main curing step after light irradiation.
- the content of the curing agent may be selected according to the composition of the composition, for example, the type or ratio of the curable resin.
- the curing agent may include 1 part by weight to 100 parts by weight, 1 part by weight to 90 parts by weight, or 1 part by weight to 80 parts by weight based on 100 parts by weight of the curable resin.
- the weight ratio may be adjusted according to the type and ratio of the curable resin or the functional group of the curable resin, or the crosslinking density to be implemented.
- the curable resin is a resin that can be cured by irradiation of active energy rays
- the initiator for example, a cationic photopolymerization initiator or an optical radical initiator can be used.
- an onium salt or an organometallic salt-based ionizing cation initiator or an organosilane or a latent sulfuric acid-based or non-ionized cationic photopolymerization initiator may be used.
- the onium salt-based initiator include a diaryliodonium salt, a triarylsulfonium salt, an aryldiazonium salt, and the like.
- the zero, iron arene and the like can be exemplified.
- the organosilane-based initiator include o-nitrobenzyl triaryl silyl ether and triaryl silyl peroxide.
- the latent sulfuric acid-based initiator may be exemplified by ⁇ -sulfonyloxy ketone or ⁇ -hydroxymethylbenzoin sulfonate and the like, but is not limited thereto. .
- the adhesive composition may further include a radical photocurable compound.
- the radical photocurable compound may be different from the curable resin described above.
- the liquid adhesive composition is subjected to a process of applying, but there is a problem in that it is difficult to maintain a desired encapsulation shape due to high fluidity of the composition after application.
- temporary curing may be performed by irradiating light to an adhesive composition applied at a desired position, thereby advancing the temporary curing, thereby controlling fluidity. Accordingly, the present application can maintain the applied adhesive composition in the desired encapsulation shape until main curing. That is, the present application may introduce a dual curing method by including the curable resin and / or the radical photocurable compound together, thereby allowing flow control at a high temperature after the adhesive composition is applied.
- the radical photocurable compound may include, for example, a polyfunctional polymerizable compound having high compatibility with the above-described olefin resin and curable resin and capable of forming a specific crosslinked structure.
- the crosslinked structure may be a crosslinked structure formed by application of heat, a crosslinked structure formed by irradiation of active energy rays, or a crosslinked structure formed by aging at room temperature.
- active energy rays not only microwaves, infrared rays (IR), ultraviolet rays (UV), X rays and gamma rays, but also alpha-particle beams and proton beams , Particle beams such as neutron beams or electron beams, and the like, and typically may be ultraviolet rays or electron beams.
- the radical photocurable compound may be a polyfunctional active energy ray polymerizable compound, and the multifunctional active energy ray polymerizable compound may participate in a polymerization reaction, for example, by irradiation of active energy rays.
- Two or more functional groups such as functional groups including ethylenically unsaturated double bonds such as acryloyl group, methacryloyl group, acryloyloxy group or methacryloyloxy group, epoxy group or oxetane group It may mean a compound containing.
- the multifunctional active energy ray polymerizable compound may be a bifunctional or higher compound.
- multifunctional active energy ray polymerizable compound for example, multifunctional acrylate (MFA) may be used.
- MFA multifunctional acrylate
- the radical photocurable compound may satisfy the following Formula 1.
- R 1 is hydrogen or an alkyl group having 1 to 4 carbon atoms
- n is an integer of 2 or more
- X represents a residue derived from a straight, branched or cyclic alkyl group having 3 to 30 carbon atoms or an alkenyl group.
- X is, for example, a ring having 3 to 30 carbon atoms, 4 to 28 carbon atoms, 6 to 28 carbon atoms, 8 to 22 carbon atoms, or 12 to 20 carbon atoms. It may be a residue derived from a type alkyl group or alkenyl group.
- X when X is a residue derived from a linear alkyl group or an alkenyl group, X may be a residue derived from a straight alkyl group or alkenyl group having 3 to 30 carbon atoms, 6 to 25 carbon atoms or 8 to 20 carbon atoms. have.
- X when X is a residue derived from a branched alkyl or alkenyl group, X is a residue derived from a branched alkyl or alkenyl group having 3 to 30 carbon atoms, 4 to 28 carbon atoms, 5 to 25 carbon atoms, or 6 to 20 carbon atoms. It may be a flag.
- the term “residue derived from an alkyl group or an alkenyl group” may mean a residue composed of an alkyl group or an alkenyl group as a residue of a specific compound.
- X when n is 2, X may be an alkylene group or an alkylidene group.
- X when n is 3 or more, X may be bonded to the (meth) acryloyl group of Formula 1 by desorbing two or more hydrogens of an alkyl group or an alkenyl group.
- n may be 2 to 20.
- alkyl group or “alkenyl group” includes 1 to 30 carbon atoms, 1 to 25 carbon atoms, 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, and 1 to 8 carbon atoms. Or an alkyl group or alkenyl group having 1 to 4 carbon atoms.
- the alkyl group or alkenyl group may have a linear, branched or cyclic structure, and may be optionally substituted with one or more substituents.
- alkylene group or “alkylidene group” includes 2 to 30 carbon atoms, 2 to 25 carbon atoms, 2 to 20 carbon atoms, 2 to 16 carbon atoms, and 2 to 12 carbon atoms. It may mean an alkylene group or an alkylidene group having 2 to 10 carbon atoms or 2 to 8 carbon atoms.
- the alkylene group or alkylidene group may have a linear, branched or cyclic structure, and may be optionally substituted with one or more substituents.
- alkoxy group may mean an alkoxy group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms, unless otherwise specified.
- the alkoxy group may be linear, branched or cyclic.
- the alkoxy group may be optionally substituted with one or more substituents.
- the polyfunctional active energy ray-polymerizable compound which can be polymerized by irradiation of the active energy ray is polybutadiene dimethacrylate, 1,4-butanediol di (meth) acrylate, 1,3-butyl Lene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,8-octanediol di (meth) acrylate, 1,12-dodecanediol di (meth) acrylic Latex, neopentylglycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, cyclohexane-1,4-dimethanol di (meth) acrylate, tricyclodecane dimethanol (meth) di Acrylate, dimethylol dicyclopentane di (meth) acrylate, neopentylglycol modified trimethyl
- the radical photocurable compound is 10 parts by weight to 100 parts by weight, 10 parts by weight to 90 parts by weight, 13 parts by weight to 80 parts by weight, 14 parts by weight to 70 parts by weight, or 14 parts by weight based on 100 parts by weight of the olefin resin. It may be included in 65 parts by weight.
- the present application may provide an adhesive cured material that can maintain the encapsulated structure during temporary curing by adjusting the content of the radical photocurable compound in the above range.
- the adhesive composition may comprise a radical initiator with a radical photocurable compound.
- the radical initiator may be a photoradical initiator.
- Specific types of photoinitiators may be appropriately selected in consideration of the curing rate and the possibility of yellowing. For example, a benzoin type, a hydroxy ketone type, an amino ketone type, or a phosphine oxide type photoinitiator etc.
- benzoin benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether , Benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylanino acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2 -Hydroxy-2-methyl-1-phenylpropane-1one, 1-hydroxycyclohexylphenylketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propane-1- On, 4- (2-hydroxyethoxy) phenyl-2- (hydroxy-2-propyl) ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-
- the content of the photoradical initiator may be changed depending on the kind and ratio of the functional groups of the radical photocurable compound, the crosslinking density to be implemented, and the like.
- the optical radical initiator may be blended in a ratio of 0.1 part by weight to 120 parts by weight or 0.1 part by weight to 110 parts by weight with respect to 100 parts by weight of the radical photocurable compound.
- an appropriate crosslinking structure can be introduced into the adhesive composition, thereby realizing flow control at a high temperature.
- the adhesive composition of the present application may include 40 to 90 parts by weight of an olefin resin having a moisture permeability of 50 g / m 2 ⁇ day or less, 5 to 50 parts by weight of a curable resin, and 1 to 40 parts by weight of a radical photocurable compound. have.
- the adhesive composition may include 50 to 80 parts by weight of an olefinic resin having a water vapor transmission rate of 50 g / m 2 ⁇ day or less, 10 to 40 parts by weight of the curable resin, and 5 to 30 parts by weight of the radical photocurable compound.
- the present application by adjusting the content range of each component of the adhesive composition as described above, while realizing excellent moisture barrier performance and at the same time excellent durability at high temperature and high humidity, and also the sealing material that can easily implement the desired sealing structure shape Can provide.
- the adhesive composition of the present application may include a moisture adsorbent as needed.
- moisture adsorbent may be used as a generic term for components that can adsorb or remove moisture or moisture introduced from the outside through physical or chemical reactions. That is, it means a moisture reactive adsorbent or a physical adsorbent, and mixtures thereof may also be used.
- the moisture reactive adsorbent chemically reacts with moisture, moisture, or oxygen introduced into the resin composition or the cured product to adsorb moisture or moisture.
- the physical adsorbent may inhibit the penetration by lengthening the movement path of moisture or moisture that penetrates into the resin composition or the cured product thereof, and interacts with the matrix composition of the resin composition or the cured product and the moisture reactive adsorbent and the like. Maximize moisture barrier.
- the specific kind of water adsorbent that can be used in the present application is not particularly limited, and, for example, in the case of the water reactive adsorbent, there may be mentioned one kind or a mixture of two or more kinds of metal oxides, metal salts or phosphorus pentoxide (P 2 O 5 ). In the case of a physical adsorbent, zeolite, zirconia or montmorillonite may be mentioned.
- the metal oxides include lithium oxide (Li 2 O), sodium oxide (Na 2 O), barium oxide (BaO), calcium oxide (CaO), magnesium oxide (MgO), and the like.
- Examples include lithium sulfate (Li 2 SO 4 ), sodium sulfate (Na 2 SO 4 ), calcium sulfate (CaSO 4 ), magnesium sulfate (MgSO 4 ), cobalt sulfate (CoSO 4 ), gallium sulfate (Ga 2 (SO 4 ) 3 ), sulfates such as titanium sulfate (Ti (SO 4 ) 2 ) or nickel sulfate (NiSO 4 ), etc., calcium chloride (CaCl 2 ), magnesium chloride (MgCl 2 ), strontium chloride (SrCl 2 ), yttrium chloride (YCl 3 ) , Copper chloride (CuCl 2 ), cesium fluoride (CsF), tantalum flu
- a moisture adsorbent such as the metal oxide may be blended into the composition in a state in which the adsorbent is properly processed.
- a grinding step of the moisture adsorbent may be required, and a process such as a three roll mill, a bead mill or a ball mill may be used for grinding the moisture adsorbent.
- the adhesive composition of the present application may include a moisture adsorbent in an amount of 5 parts by weight to 100 parts by weight, 5 to 90 parts by weight, 5 parts by weight to 80 parts by weight, or 10 to 50 parts by weight with respect to 100 parts by weight of the olefin resin. Can be.
- the adhesive composition of the present application preferably by controlling the content of the moisture adsorbent to 5 parts by weight or more, the adhesive composition or its cured product can be made to exhibit excellent moisture and moisture barrier properties.
- the adhesive composition of the present application preferably by controlling the content of the moisture adsorbent to 100 parts by weight or less, when forming the sealing structure of the thin film, it is possible to exhibit excellent moisture barrier properties.
- the thixotropic index (T.I.) according to the general formula 1 may be in the range of 1.35 to 5.
- V 0.5 is the viscosity of the adhesive composition measured by a Brookfield viscometer at a temperature of 25 °C, a rotation speed of 0.5 rpm and a spindle RV-7
- V 5 is a temperature of 25 °C
- the thixotropic index may be in the range of 1.35 to 5 or 1.39 to 3.3.
- the term thixotropy may refer to a property having fluidity when the composition is in a stationary state but does not have fluidity.
- the present application by controlling the thixotropy index of the adhesive composition as described above, while providing an encapsulation structure having an excellent moisture barrier performance through the olefin resin, at the same time the inflow of air bubbles into the encapsulant in the encapsulation process of the organic electronic device It is possible to prevent problems such as clogging of the nozzle during application of the composition, thereby improving processability and productivity.
- the adhesive composition may have a viscosity measured according to torque at a temperature of 25 ° C., a rotational speed of 0.5 rpm and a Brookfield viscometer at spindle RV-7 in a range of 100,000 cPs to 1,000,000 cPs. have.
- the viscosity in the present application can be measured on the RV-7 spindle using DV-II + Pro as Brookfield viscometer, unless otherwise specified, and the conditions of the temperature of 25 ° C. and the rotational speed of 0.5 rpm In the range from 100,000 cPs to 1,000,000 cPs, 200,000 cPs to 900,000 cPs or 300,000 cPs to 800,000 cPs.
- the present application by controlling the room temperature viscosity of the composition to 100,000 cPs or more, it is possible to prevent the sedimentation of the material, for example, moisture adsorbents or inorganic fillers, etc. present in the composition, by applying the composition in a desired position to encapsulate In forming the structure, it may be possible to implement and maintain the desired shape.
- the adhesive composition may further comprise an inorganic filler.
- a filler may be included to control the thixotropic index of the adhesive composition, apart from the moisture adsorbent described above.
- the adhesive composition should have a thixotropic index controlled in a specific range, and the method of controlling the thixotropic index within the above range is not particularly limited.
- the adhesive composition may include an inorganic filler in an appropriate amount.
- the specific kind of filler that can be used in the present application is not particularly limited, and for example, one kind or a mixture of two or more kinds of clay, talc alumina, calcium carbonate or silica can be used.
- a product surface-treated with an organic material may be used as the filler, or a coupling agent may be additionally added.
- the adhesive composition of the present application may include an inorganic filler in an amount of 0 to 50 parts by weight, 1 to 40 parts by weight, or 1 to 20 parts by weight based on 100 parts by weight of the olefin resin.
- the inorganic filler may be controlled to preferably 1 part by weight or more, to provide an encapsulation structure having excellent moisture or moisture barrier properties and mechanical properties.
- the present invention by controlling the inorganic filler content to 50 parts by weight or less, it is possible to manufacture a film form, it is possible to provide a cured product exhibiting excellent moisture barrier properties even when formed into a thin film.
- the BET surface area of the inorganic filler may be in the range of 35 to 500m 2 / g, 40 to 400m 2 / g, 50 to 300m 2 / g or 60 to 200m 2 / g.
- the specific surface area was measured using the BET method, specifically, by adding a sample of 1 g of the inorganic filler to the tube, it can be measured using ASAP2020 (Micromeritics, USA) without pretreatment at -195 ° C. The average value can be obtained by measuring three times on the same sample.
- the present application may provide an encapsulant that can easily implement the encapsulation structure shape desired in the present application by adjusting the specific surface area of the inorganic filler within the above range.
- the adhesive composition according to the present application may include various additives in a range that does not affect the effects of the above-described invention.
- the resin composition may include an antifoaming agent, a coupling agent, a tackifier, an ultraviolet stabilizer, an antioxidant, or the like in an appropriate range of content depending on the desired physical properties.
- the adhesive composition may further comprise an antifoaming agent.
- the present application may include a defoaming agent, thereby implementing the defoaming characteristics in the above-described application process of the adhesive composition, it is possible to provide a reliable sealing structure.
- the kind of antifoamer is not specifically limited as long as the physical property of the adhesive composition required by this application is satisfied.
- the adhesive composition may be liquid at room temperature, for example about 25 ° C.
- the adhesive composition may be a liquid type of a solventless type.
- the radical photocurable compound may act as a reactive diluent in a liquid composition of a solventless type.
- the adhesive composition may be applied to encapsulating the organic electronic device, and specifically, may be applied to encapsulating the side surface of the organic electronic device.
- the adhesive composition has a liquid form at room temperature, so that the device may be encapsulated in such a manner that the composition is applied to the side of the organic electronic device.
- An exemplary, adhesive composition may have a viscosity of 700 Pa ⁇ s to 5,000 Pa ⁇ s after light irradiation. Within the above viscosity range, the adhesive composition can maintain the shape of the desired encapsulation structure. In one example, the viscosity of the adhesive composition may be measured after irradiating the adhesive composition with light having a wavelength range of the UV-A range of 3 J / cm 2 light amount. In addition, the viscosity of the adhesive composition may be a viscosity measured according to the shear stress at a temperature of 25 °C, 10% strain and frequency conditions of 1Hz. In one example, the viscosity of the composition may be 700 Pa.s to 4,000 Pa.s, 800 Pa.s to 3,000 Pa.s or 900 Pa.s to 2,000 Pa.s.
- UV-A region may mean a wavelength range of 315 nm to 400 nm.
- the light having a wavelength range in the UV-A region herein means light including any wavelength in the wavelength range of 315 nm to 400 nm, or includes two or more wavelengths in the wavelength range of 315 nm to 400 nm. It can mean light.
- the adhesive composition may form an encapsulation structure of an organic electronic device by irradiating the light, followed by main curing.
- the main curing may proceed by irradiation with heat or light.
- the physical property that the UV curable adhesive composition can be main cured without changing the shape is required. That is, it is necessary to prevent the phenomenon which the adhesive composition spreads at high temperature.
- the adhesive composition may be temporarily cured by irradiating light having a wavelength range in the UV-A region with a light amount of 3 J / cm 2 as described above, and the temporarily cured resin composition may be 80
- the viscosity according to the shear stress at a temperature of °C, 10% strain and a frequency of 1Hz may be 500 Pa ⁇ s to 2,000 Pa ⁇ s.
- the viscosity may be, for example, 500 Pa ⁇ s to 1,800 Pa ⁇ s, 500 Pa ⁇ s to 1,600 Pa ⁇ s or 600 Pa ⁇ s to 1,500 Pa ⁇ s.
- the adhesive composition of the present application can be effectively applied to the side bag of the organic electronic device by satisfying the viscosity range as described above.
- the present application also relates to an organic electronic device.
- Exemplary organic electronic devices include a substrate 21, as shown in FIG. An organic electronic element 23 formed on the substrate 21; And a side encapsulation layer 10 formed on the periphery of the substrate 21 to surround side surfaces of the organic electronic device 23 and including the adhesive composition described above.
- the exemplary organic electronic device may further include a front encapsulation layer 11 covering the entire surface of the organic electronic device 23.
- the front encapsulation layer and the side encapsulation layer may be coplanar.
- “same” may mean substantially the same.
- substantially the same in the same plane means that it may have an error of ⁇ 5 ⁇ m or ⁇ 1 ⁇ m in the thickness direction.
- the front encapsulation layer may encapsulate the upper surface of the device, and may encapsulate the upper surface as well as the side surface together.
- the side encapsulation layer may be formed on the side of the device, but may not directly contact the side of the organic electronic device.
- the front encapsulation layer can be encapsulated in direct contact with the top and side surfaces of the device. That is, the side encapsulation layer may be positioned at the periphery of the substrate in a plan view of the organic electronic device without contacting the device.
- peripheral part means a peripheral edge portion. That is, in the above, the peripheral portion of the substrate may mean a peripheral portion of the substrate.
- the material constituting the side encapsulation layer is not particularly limited, but may include the adhesive composition described above.
- the front encapsulation layer may include an encapsulation resin
- the encapsulation resin may be an acrylic resin, an epoxy resin, a silicone resin, a fluorine resin, a styrene resin, a polyolefin resin, a thermoplastic elastomer, a polyoxyalkylene resin, a polyester resin, a poly Vinyl chloride resins, polycarbonate resins, polyphenylene sulfide resins, polyamide resins, or mixtures thereof.
- the components constituting the front encapsulation layer may be the same as or different from the adhesive composition described above.
- the front encapsulation layer since the front encapsulation layer is in direct contact with the device, the front encapsulation layer may not include or contain a small amount of the above-described moisture adsorbent.
- the front encapsulation layer may be included in an amount of 0 to 20 parts by weight based on 100 parts by weight of the encapsulation resin.
- the organic electronic device may include a reflective electrode layer formed on the substrate, an organic layer formed on the reflective electrode layer and including at least a light emitting layer, and a transparent electrode layer formed on the organic layer.
- the organic electronic device 23 may be an organic light emitting diode.
- the organic electronic device according to the present application may be a top emission type, but is not limited thereto, and may be applied to a bottom emission type.
- the organic electronic device may further include a protective film protecting the organic electronic device between the front encapsulation layer or the side encapsulation layer and the organic electronic device.
- the present application relates to a method for manufacturing an organic electronic device.
- the manufacturing method may include applying the above-described adhesive composition on the periphery of the substrate 21 on which the organic electronic device 23 is formed to surround the side surface of the organic electronic device 23.
- Applying the adhesive composition may be a step of forming the above-described side encapsulation layer 10.
- the forming of the side encapsulation layer may include applying the above-described adhesive composition to surround the side surface of the organic electronic device 23, and additionally curing and curing the adhesive composition. It may comprise the step of curing.
- the step of preliminary curing may include irradiating light
- the step of real curing may include irradiating light or applying heat.
- the substrate 21 on which the organic electronic device 23 is formed for example, to form a reflective electrode or a transparent electrode on the substrate 21, such as glass or film, by vacuum deposition or sputtering, and the It can be prepared by forming an organic material layer on the reflective electrode.
- the organic material layer may include a hole injection layer, a hole transport layer, a light emitting layer, an electron injection layer and / or an electron transport layer.
- a second electrode is further formed on the organic material layer.
- the second electrode may be a transparent electrode or a reflective electrode.
- the above-described side encapsulation layer 10 is applied to side-cover the organic electronic device 23 on the periphery of the substrate 21.
- a method of forming the side encapsulation layer 10 is not particularly limited, and the above-described adhesive composition may be used on the side of the substrate 21 by screen printing, dispenser coating, or the like.
- the front encapsulation layer 11 may be applied to encapsulate the entire surface of the organic electronic device 23.
- a method known in the art may be applied, and for example, a liquid crystal drop injection process may be used.
- a curing process may be performed on the front or side encapsulation layer encapsulating the organic electronic device.
- the curing process (main curing) may be performed in, for example, a heating chamber or a UV chamber, and is preferably performed. Can proceed in both ways. Conditions in the present curing may be appropriately selected in consideration of the stability of the organic electronic device.
- the composition may be irradiated with light to induce crosslinking.
- Irradiating the light may include irradiating light having a wavelength range in the UV-A region with a light amount of 0.3 to 6 J / cm 2 or a light amount of 0.5 to 4 J / cm 2 .
- the shape of the encapsulation structure which can be the basis, can be realized by temporarily curing through light irradiation.
- the manufacturing method may include main curing the temporary cured adhesive composition after light irradiation.
- the main curing may further include heat curing at a temperature of 40 ° C. to 100 ° C. for 1 hour to 24 hours, 1 hour to 20 hours, 1 hour to 10 hours, or 1 hour to 5 hours.
- the main curing may include irradiating light having a wavelength range in the UV-A region with a light amount of 0.3 to 6 J / cm 2 or a light amount of 0.5 to 4 J / cm 2 .
- the adhesive composition may be subjected to the main curing.
- the present application is possible to form a structure that can effectively block the moisture or oxygen introduced into the organic electronic device from the outside to ensure the life of the organic electronic device, it is possible to implement a top-emitting organic electronic device, the adhesion durability Provided is an adhesive composition having excellent reliability and reliability at high temperature and high humidity, and an organic electronic device including the same.
- FIG. 1 is a cross-sectional view illustrating an organic electronic device according to one example of the present invention.
- alicyclic epoxy resin Kerdo Chemical, ST-3000
- epoxy acrylate Siliconomer, CN110
- HDDA radical photocurable 1,6-hexanediol diacrylate
- the mixing vessel was prepared using a Planetary mixer (Kurabo, KK-250s) to prepare a uniform composition solution.
- cycloaliphatic epoxy resin Kerdo Chemical, ST-3000
- celloxide 2021P another cycloaliphatic epoxy resin
- 25 parts by weight of a photocationic initiator San-apro, CPI-101A
- an imidazole series curing agent San-apro, CPI-101A
- the mixing vessel was prepared using a Planetary mixer (Kurabo, KK-250s) to prepare a uniform composition solution.
- the mixing vessel was prepared using a Planetary mixer (Kurabo, KK-250s) to prepare a uniform composition solution.
- Alicyclic epoxy resin Kerdo Chemical, ST-3000
- another cycloaliphatic epoxy resin Celloxide 2021P
- a curable resin at room temperature 10 parts by weight of a photocationic initiator (San-apro, CPI-101A) is added to 100 parts by weight of the curable resin, and 100 parts by weight of an imidazole series curing agent (Shikoku, 2P4MHZ) is used as the thermosetting agent. 10 parts by weight of the solution was added.
- Fumed silica (Aerosil, Evonik, R805, particle size 10 ⁇ 20nm) as an inorganic filler was added to the container in an amount of 3 parts by weight based on 100 parts by weight of the curable resin.
- the mixing vessel was prepared using a Planetary mixer (Kurabo, KK-250s) to prepare a uniform composition solution.
- polybutadiene dimethacrylate (Sartomer, CN301) and 1,6-hexanediol diacrylate (HDDA) as radical photocurable compounds )
- B14: CN301: HDDA 1,6-hexanediol diacrylate
- Irgacure651, Ciba 2,2-dimethoxy-1,2-diphenylethan-1-one
- Fumed silica (Aerosil, Evonik, R805, particle size 10 ⁇ 20nm) as an inorganic filler was added to the container in an amount of about 3.75 parts by weight based on 100 parts by weight of the olefin resin.
- the mixing vessel was prepared using a Planetary mixer (Kurabo, KK-250s) to prepare a uniform composition solution.
- alicyclic epoxy resin Kerdo Chemical, ST-3000
- epoxy acrylate Siliconomer, CN110
- HDDA radical photocurable 1,6-hexanediol diacrylate
- the mixing vessel was prepared using a Planetary mixer (Kurabo, KK-250s) to prepare a uniform composition solution.
- a photocationic initiator San-apro, CPI-101A
- the mixing vessel was prepared using a Planetary mixer (Kurabo, KK-250s) to prepare a uniform composition solution.
- the adhesive composition prepared in Example and Comparative Example was applied to 0.7T Soda-lime glass, and then bonded to the same glass, and the light having a wavelength range in the UV-A region of the adhesive composition was lighted at a light amount of 3 J / cm 2 . After irradiation, heat is applied in an oven at 100 ° C. for 3 hours. 3 to 8 mg of the adhesive according to the cured examples and comparative examples through the above process was collected and placed in a dedicated aluminum pan, DSC, and -50 °C to 300 °C section by differential scanning calorimetry (TA :, Q2000 model) The glass transition temperature was measured at (Scanning rate: 10 ° C./min).
- the adhesive composition solution prepared in Example or Comparative Example was applied to the release surface of the release PET, and the light having a wavelength range of the UV-A region was irradiated with a light amount of 3 J / cm 2 , and then in an oven at 100 °C for 3 hours Heat was applied to prepare a coating film having a thickness of 200 ⁇ m. After preparing the specimen by cutting the prepared coating film into a length of 30 mm ⁇ 10 mm (length ⁇ width), the tape was taped at both ends so that only 10 mm was left in the longitudinal direction. It was. Next, the tensile modulus was measured while the tapered portion was grasped and stretched at 25 ° C. at a speed of 18 mm / min (measured by Texture Analyzer).
- the adhesive composition prepared in Example and Comparative Example was applied to 0.7T Soda-lime glass, and then bonded to the same glass, and the light having a wavelength range in the UV-A region of the adhesive composition was lighted at a light amount of 3 J / cm 2 .
- heat was applied in an oven at 100 ° C. for 3 hours to prepare specimens. Thereafter, the specimen was maintained in an 85 ° C. oven for about 500 hours while observing whether bubbles were generated between the glass substrate and the adhesive layer.
- X a large amount of bubbles generated between the glass substrate and the pressure-sensitive adhesive layer was indicated as X, a case where a small amount of bubbles occurred, ⁇ , and a case where no bubbles were generated.
- the adhesive composition prepared in Example and Comparative Example was applied to 0.7T Soda-lime glass, and then bonded to the same glass, and the light having a wavelength range in the UV-A region of the adhesive composition was lighted at a light amount of 3 J / cm 2 . After irradiation, heat was applied in an oven at 100 ° C. for 3 hours to prepare specimens. Thereafter, while maintaining the specimen in a constant temperature and humidity chamber at 85 ° C. and 85% relative humidity for about 500 hours, it was observed whether the lifting occurred at the interface between the glass substrate and the adhesive layer. Visually, it was indicated by X when the floating occurred at the interface between the glass substrate and the pressure-sensitive adhesive layer, and O when not generated.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electroluminescent Light Sources (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
Abstract
Description
Tg | 인장 탄성률 | 내열성 | 고온고습 접착신뢰성 | |
℃ | MPa | |||
실시예1 | 38℃, 107℃ | 45 | O | O |
실시예2 | 42℃, 115℃ | 80 | O | O |
실시예3 | 47℃, 102℃ | 28 | O | O |
비교예1 | 112℃ | 970 | O | X |
비교예2 | -40℃ | 12 | X | O |
비교예3 | 45℃, 110℃ | 350 | △ | X |
비교예4 | 15℃ | 7 | X | O |
Claims (20)
- 경화 후 시차주사 열량측정법(Differential Scanning Calorimetry)에 의한 유리전이온도의 측정 시에 20℃ 내지 60℃의 범위 내에 있는 제1피크와 80℃ 내지 120℃의 범위 내에 있는 제2피크를 나타내고, 경화 후 25℃에서의 인장 탄성률이 1MPa 내지 300MPa의 범위 내에 있는 유기전자소자 봉지용 접착제 조성물.
- 제 1 항에 있어서, 투습도가 50 g/m2·day 이하인 올레핀계 수지 및 경화성 수지를 포함하는 접착제 조성물.
- 제 2 항에 있어서, 경화성 수지는 경화성 관능기를 하나 이상 포함하는 수지인 접착제 조성물.
- 제 2 항에 있어서, 경화성 수지는 올레핀계 수지 100중량부에 대하여 10 내지 70중량부로 포함되는 접착제 조성물.
- 제 2 항에 있어서, 올레핀계 수지는 중량평균분자량이 10만 이하인 접착제 조성물.
- 제 2 항에 있어서, 올레핀계 수지는 경화성 수지와 반응성을 갖는 반응성 관능기를 적어도 하나 이상 가지는 접착제 조성물.
- 제 6 항에 있어서, 반응성 관능기는 산무수물기, 카르복실기, 에폭시기, 아미노기, 히드록실기, 이소시아네이트기, 옥사졸린기, 옥세탄기, 시아네이트기, 페놀기, 하이드라지드기 또는 아미드기를 포함하는 접착제 조성물.
- 제 2 항에 있어서, 경화성 수지 100중량부에 대하여 1 내지 100 중량부의 경화제를 추가로 포함하는 접착제 조성물.
- 제 2 항에 있어서, 라디칼 광경화성 화합물을 추가로 포함하는 접착제 조성물.
- 제 9 항에 있어서 라디칼 광경화성 화합물은 다관능성의 활성 에너지선 중합성 화합물을 포함하는 접착제 조성물.
- 제 9 항에 있어서, 라디칼 광경화성 화합물은 올레핀계 수지 100 중량부에 대하여 10 내지 100 중량부로 포함되는 접착제 조성물.
- 제 9 항에 있어서, 라디칼 광경화성 화합물 100 중량부에 대하여 0.1 내지 20 중량부의 광라디칼 개시제를 추가로 포함하는 접착제 조성물.
- 제 2 항에 있어서, 수분 흡착제를 추가로 포함하는 접착제 조성물.
- 제 14 항에 있어서, 수분 흡착제는 올레핀계 수지 100 중량부에 대하여 5 내지 100중량부로 포함되는 접착제 조성물.
- 제 2 항에 있어서, 무기 필러를 추가로 포함하는 접착제 조성물.
- 제 9 항에 있어서, 올레핀계 수지, 경화성 수지 및 라디칼 광경화성 화합물은 각각 40 내지 90 중량부, 5 내지 50 중량부 및 1 내지 40 중량부로 포함되는 접착제 조성물.
- 기판; 기판 상에 형성된 유기전자소자; 및 상기 기판의 주연부 상에 상기 유기전자소자의 측면을 둘러싸도록 형성되고, 제 1 항에 따른 접착제 조성물을 포함하는 측면 봉지층을 포함하는 유기전자장치.
- 제 18 항에 있어서, 유기전자소자의 전면을 커버하는 전면 봉지층을 추가로 포함하고, 상기 전면 봉지층 및 측면 봉지층은 동일 평면상에 존재하는 유기전자장치.
- 상부에 유기전자소자가 형성된 기판의 주연부 상에 제 1 항의 접착제 조성물을 상기 유기전자소자의 측면을 둘러싸도록 도포하는 단계; 상기 접착제 조성물에 광을 조사하는 단계; 및 상기 접착제 조성물에 열을 가하는 단계를 포함하는 유기전자장치의 제조 방법.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017549729A JP6557352B2 (ja) | 2015-03-24 | 2016-03-24 | 接着剤組成物 |
EP16769116.1A EP3275944B1 (en) | 2015-03-24 | 2016-03-24 | Adhesive composition, organic electronic device and method of manufacturing organic electronic device |
US15/560,870 US11319468B2 (en) | 2015-03-24 | 2016-03-24 | Adhesive composition |
CN202211682530.XA CN116023886A (zh) | 2015-03-24 | 2016-03-24 | 粘合剂组合物 |
CN201680027064.8A CN107580619A (zh) | 2015-03-24 | 2016-03-24 | 粘合剂组合物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20150040741 | 2015-03-24 | ||
KR10-2015-0040741 | 2015-03-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016153298A1 true WO2016153298A1 (ko) | 2016-09-29 |
Family
ID=56978515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2016/003009 WO2016153298A1 (ko) | 2015-03-24 | 2016-03-24 | 접착제 조성물 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11319468B2 (ko) |
EP (1) | EP3275944B1 (ko) |
JP (1) | JP6557352B2 (ko) |
KR (1) | KR101746333B1 (ko) |
CN (2) | CN116023886A (ko) |
TW (1) | TWI654268B (ko) |
WO (1) | WO2016153298A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111492498A (zh) * | 2017-12-18 | 2020-08-04 | 株式会社Lg化学 | 有机电子器件 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150016879A (ko) * | 2013-08-05 | 2015-02-13 | 주식회사 엘지화학 | 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법 |
TW201828505A (zh) * | 2017-01-20 | 2018-08-01 | 聯京光電股份有限公司 | 光電封裝體及其製造方法 |
JP7170387B2 (ja) * | 2017-08-21 | 2022-11-14 | リンテック株式会社 | 粘着シートおよび表示体 |
KR102316235B1 (ko) * | 2017-12-18 | 2021-10-25 | 주식회사 엘지화학 | 봉지용 조성물 |
EP3800228B1 (en) * | 2018-06-12 | 2024-07-31 | Lg Chem, Ltd. | Sealant composition |
KR20210116425A (ko) * | 2019-01-18 | 2021-09-27 | 세키스이가가쿠 고교가부시키가이샤 | 유기 el 표시 소자용 봉지제 세트 및 유기 el 표시 소자 |
JPWO2020149358A1 (ja) * | 2019-01-18 | 2021-12-02 | 積水化学工業株式会社 | 有機el表示素子封止用樹脂組成物、硬化物、及び、有機el表示素子 |
WO2020149362A1 (ja) * | 2019-01-18 | 2020-07-23 | 積水化学工業株式会社 | 硬化物及び有機el表示素子 |
US20220195203A1 (en) * | 2019-06-05 | 2022-06-23 | Lg Chem, Ltd. | Composition for encapsulation |
KR102534539B1 (ko) * | 2019-10-25 | 2023-05-19 | 주식회사 엘지화학 | 봉지용 조성물 |
JP7528605B2 (ja) | 2020-07-22 | 2024-08-06 | 味の素株式会社 | 封止用シートおよびポリマー組成物層 |
WO2023241881A1 (en) * | 2022-06-17 | 2023-12-21 | Henkel Ag & Co. Kgaa | High hardness, low viscosity uv curable potting adhesive composition |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040061570A (ko) * | 2002-12-31 | 2004-07-07 | 제일모직주식회사 | 반도체 봉지용 액상 에폭시 수지 조성물 |
KR20120091349A (ko) * | 2009-11-18 | 2012-08-17 | 아지노모토 가부시키가이샤 | 수지 조성물 |
KR20130081261A (ko) * | 2012-01-06 | 2013-07-16 | 주식회사 엘지화학 | 봉지용 필름 |
KR20140136902A (ko) * | 2013-05-21 | 2014-12-01 | 주식회사 엘지화학 | 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
KR20150010667A (ko) * | 2013-07-19 | 2015-01-28 | 주식회사 엘지화학 | 봉지 조성물 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6512051B2 (en) * | 1998-01-22 | 2003-01-28 | The Yokohama Rubber Co., Ltd. | Elastomer composition |
JP3803033B2 (ja) * | 2001-01-11 | 2006-08-02 | 日東電工株式会社 | 半導体封止用樹脂組成物、およびそれを用いた半導体装置 |
JP2007197517A (ja) | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | 接着性封止組成物、封止フィルム及び有機el素子 |
JP5890177B2 (ja) | 2008-06-02 | 2016-03-22 | スリーエム イノベイティブ プロパティズ カンパニー | 接着剤封入組成物及びそれを用いて作製される電子デバイス |
TWI443166B (zh) * | 2010-11-23 | 2014-07-01 | Lg Chemical Ltd | 黏著劑組成物 |
DE102013214168A1 (de) * | 2012-08-15 | 2014-02-20 | Sumitomo Rubber Industries, Ltd. | Luftreifen |
EP2759514A1 (de) | 2013-01-29 | 2014-07-30 | tesa SE | Haftklebemasse enthaltend ein verbundenes Nanopartikelnetzwerk, Verfahren zu ihrer Herstellung sowie die Verwendung derselben |
JP6203383B2 (ja) | 2013-05-21 | 2017-09-27 | エルジー・ケム・リミテッド | 封止フィルム及びそれを用いた有機電子デバイスの封止方法 |
JP6195099B2 (ja) | 2013-06-19 | 2017-09-13 | エルジー・ケム・リミテッド | 封止材フィルム及びこれを含む電子装置 |
KR101740183B1 (ko) * | 2015-03-24 | 2017-05-25 | 주식회사 엘지화학 | 접착제 조성물 |
TWI589688B (zh) * | 2015-03-24 | 2017-07-01 | Lg化學股份有限公司 | 黏合組成物 |
WO2016153296A1 (ko) * | 2015-03-24 | 2016-09-29 | 주식회사 엘지화학 | 접착제 조성물 |
TWI626281B (zh) * | 2015-03-24 | 2018-06-11 | Lg化學股份有限公司 | 黏合組成物 |
-
2016
- 2016-03-24 KR KR1020160035552A patent/KR101746333B1/ko active IP Right Grant
- 2016-03-24 CN CN202211682530.XA patent/CN116023886A/zh active Pending
- 2016-03-24 US US15/560,870 patent/US11319468B2/en active Active
- 2016-03-24 JP JP2017549729A patent/JP6557352B2/ja active Active
- 2016-03-24 CN CN201680027064.8A patent/CN107580619A/zh active Pending
- 2016-03-24 TW TW105109221A patent/TWI654268B/zh active
- 2016-03-24 WO PCT/KR2016/003009 patent/WO2016153298A1/ko active Application Filing
- 2016-03-24 EP EP16769116.1A patent/EP3275944B1/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040061570A (ko) * | 2002-12-31 | 2004-07-07 | 제일모직주식회사 | 반도체 봉지용 액상 에폭시 수지 조성물 |
KR20120091349A (ko) * | 2009-11-18 | 2012-08-17 | 아지노모토 가부시키가이샤 | 수지 조성물 |
KR20130081261A (ko) * | 2012-01-06 | 2013-07-16 | 주식회사 엘지화학 | 봉지용 필름 |
KR20140136902A (ko) * | 2013-05-21 | 2014-12-01 | 주식회사 엘지화학 | 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
KR20150010667A (ko) * | 2013-07-19 | 2015-01-28 | 주식회사 엘지화학 | 봉지 조성물 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111492498A (zh) * | 2017-12-18 | 2020-08-04 | 株式会社Lg化学 | 有机电子器件 |
EP3716350A4 (en) * | 2017-12-18 | 2021-01-20 | LG Chem, Ltd. | ORGANIC ELECTRONIC DEVICE |
US11283048B2 (en) | 2017-12-18 | 2022-03-22 | Lg Chem, Ltd. | Organic electronic device |
CN111492498B (zh) * | 2017-12-18 | 2023-05-30 | 株式会社Lg化学 | 有机电子器件 |
Also Published As
Publication number | Publication date |
---|---|
KR20160114541A (ko) | 2016-10-05 |
EP3275944A1 (en) | 2018-01-31 |
TWI654268B (zh) | 2019-03-21 |
TW201708473A (zh) | 2017-03-01 |
EP3275944B1 (en) | 2023-09-27 |
JP6557352B2 (ja) | 2019-08-07 |
CN107580619A (zh) | 2018-01-12 |
EP3275944A4 (en) | 2018-07-04 |
KR101746333B1 (ko) | 2017-06-12 |
US20180118984A1 (en) | 2018-05-03 |
CN116023886A (zh) | 2023-04-28 |
US11319468B2 (en) | 2022-05-03 |
JP2018513889A (ja) | 2018-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2016153298A1 (ko) | 접착제 조성물 | |
WO2016153297A1 (ko) | 접착제 조성물 | |
WO2016126130A1 (ko) | 점착제 조성물 | |
WO2016153294A1 (ko) | 접착제 조성물 | |
WO2016153296A1 (ko) | 접착제 조성물 | |
WO2015020413A1 (ko) | 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 제조방법 | |
WO2016133361A1 (ko) | 봉지 필름 | |
WO2014189291A1 (ko) | 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법 | |
WO2018056776A2 (ko) | 접착제 조성물 | |
WO2017155367A1 (ko) | 봉지 필름 | |
KR102176228B1 (ko) | 봉지용 조성물 | |
WO2016153292A1 (ko) | 접착제 조성물 | |
WO2019124923A1 (ko) | 유기전자장치 | |
WO2017171518A1 (ko) | 봉지 필름 | |
WO2019124934A1 (ko) | 봉지 필름 | |
US11479664B2 (en) | Encapsulating composition | |
WO2019235850A1 (ko) | 봉지 필름 | |
WO2020246847A1 (ko) | 봉지용 조성물 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16769116 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2017549729 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15560870 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2016769116 Country of ref document: EP |