WO2016152385A1

WO2016152385A1 - Anisotropically conductive film, connection method and bonded structure

Info

Publication number: WO2016152385A1
Application number: PCT/JP2016/055866
Authority: WO
Inventors: 将大伊藤; 克哉工藤
Original assignee: デクセリアルズ株式会社
Priority date: 2015-03-24
Filing date: 2016-02-26
Publication date: 2016-09-29
Also published as: KR20170107530A; KR102026547B1; CN107429125A; HK1245316A1; JP6510846B2; CN107429125B; JP2016180047A; TW201635312A; TWI690945B

Abstract

This anisotropically conductive film connects a terminal of a first electronic component and a terminal of a second electronic component in an anisotropically conductive manner, and is characterized by containing at least conductive particles, a cation-curable resin, a cationic curing agent, an organic peroxide and a radical scavenger, and in that the reaction start temperature of the organic peroxide is higher than the reaction start temperature of the cationic curing agent.

Description

Anisotropic conductive film, connection method, and joined body

The present invention relates to an anisotropic conductive film, a connection method, and a joined body.

Conventionally, an anisotropic conductive film (ACF) has been used as means for connecting electronic components.

The anisotropic conductive film is prepared by applying a resin mixture containing conductive particles on a film and drying it. As a method for connecting electronic components, one of the circuits to be connected (or both of the circuits to be connected) is placed on the anisotropic conductive film, and a predetermined temperature and pressure are applied. The electrical connection between them is performed.

A cation-curing anisotropic conductive film (ACF) is used for mounting an IC chip or a flexible substrate on a glass substrate such as a liquid crystal display.
However, the cationic curable anisotropic conductive film has excellent adhesion to glass, but the acid generated when using a cationic curing agent has contributed to the polymerization of the curable resin. Since it remains in the film, there arises a problem of corroding metal parts such as wiring of electronic parts.

Therefore, in order to prevent corrosion of the wiring, it is known to add an alkali filler such as aluminum hydroxide for the purpose of neutralizing the acid (for example, see Patent Document 1).

JP 2014-62184 A

However, if the alkali filler is simply blended in the anisotropic conductive film, the neutralization reaction starts from the beginning when the cationic curing agent generates an acid, which affects the reactivity in the curing reaction.
From the viewpoint of obtaining an anisotropic conductive film satisfying both good adhesiveness and good corrosion resistance without lowering the curing reactivity, the technique described in Patent Document 1 is sufficient. I couldn't.
An object of the present invention is to solve the above-described problems and achieve the following objects. That is, an object of the present invention is to provide an anisotropic conductive film excellent in adhesion and corrosion resistance without reducing curing reactivity.

Means for solving the problems are as follows. That is,
<1> An anisotropic conductive film for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component,
The anisotropic conductive film contains at least conductive particles, a cationic curable resin, a cationic curing agent, an organic peroxide, and a radical scavenger,
The anisotropic conductive film is characterized in that a reaction start temperature of the organic peroxide is higher than a reaction start temperature of the cationic curing agent.
<2> A connection method for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component,
A first disposing step of disposing the anisotropic conductive film according to <1> on a terminal of the second electronic component;
A second disposing step of disposing the first electronic component on the anisotropic conductive film such that a terminal of the first electronic component is in contact with the anisotropic conductive film;
And a heating and pressing step in which the first electronic component is heated and pressed by a heating and pressing member.
<3> The connection method according to <2>, further including a heat treatment step of heating at a temperature equal to or higher than a reaction start temperature of the organic peroxide after the heating and pressing step.
<4> A joined body connected by the connection method according to any one of <2> to <3>.

According to the present invention, an anisotropic conductive film that solves the above-described problems and can achieve the above-described object, has excellent adhesion without reducing curing reactivity, and excellent corrosion resistance. Can be provided.

(Anisotropic conductive film)
The anisotropic conductive film of the present invention contains at least conductive particles, a cationic curable resin, a cationic curing agent, an organic peroxide, and a radical scavenger, preferably a film-forming resin, and further necessary. Depending on the situation, other components are contained.
The anisotropic conductive film is an anisotropic conductive film that anisotropically connects the terminals of the first electronic component and the terminals of the second electronic component.

The inventors of the present invention have conducted research on a cationically curable anisotropic conductive film. As a result, the cationic curable anisotropic conductive film is polymerized with at least a cationic curing agent, an organic peroxide, and a radical scavenger. When an organic peroxide having a reaction initiation temperature higher than the reaction initiation temperature of the cationic curing agent is contained, the corrosion due to the acid generated by the cationic curing agent can be effectively prevented and the curing reaction can be performed. The present inventors have found that an anisotropic conductive film having good adhesiveness without affecting the above can be obtained.
This is probably because the acid was trapped as follows to effectively prevent the corrosiveness.
・ The organic peroxide is thermally decomposed to generate radical compounds.
-The radical of the generated radical compound is trapped by the radical scavenger.
A compound formed by removing radicals from a radical compound traps acid generated from a cationic curing agent (acid trapping by an organic peroxide).
In addition, the use of an organic peroxide whose reaction start temperature is higher than that of the cationic curing agent and delaying the timing of trapping the acid ensured good adhesion without impairing the reactivity of the curing reaction. I think that the.

<Conductive particles>
There is no restriction | limiting in particular as said electroconductive particle, According to the objective, it can select suitably, For example, a metal particle, a metal covering resin particle, etc. are mentioned.

There is no restriction | limiting in particular as said metal particle, According to the objective, it can select suitably, For example, nickel, cobalt, silver, copper, gold | metal | money, palladium etc. are mentioned. These may be used individually by 1 type and may use 2 or more types together.
Among these, nickel, silver, and copper are preferable. These metal particles may be provided with gold or palladium on the surface for the purpose of preventing surface oxidation. Furthermore, you may use what gave the metal film and the insulating film with the organic substance on the surface.

The metal-coated resin particles are not particularly limited as long as the surfaces of the resin particles are coated with metal, and can be appropriately selected according to the purpose. For example, the surface of the resin particles is nickel, copper, gold And particles coated with at least any one metal of palladium. Furthermore, you may use what gave the metal film and the insulating film with the organic substance on the surface.
There is no restriction | limiting in particular as the coating method of the metal to the said resin particle, According to the objective, it can select suitably, For example, an electroless-plating method, sputtering method, etc. are mentioned.
The material of the resin particles is not particularly limited and may be appropriately selected depending on the intended purpose. For example, styrene-divinylbenzene copolymer, benzoguanamine resin, cross-linked polystyrene resin, acrylic resin, styrene-silica composite resin, etc. Is mentioned.

The conductive particles only need to have conductivity during anisotropic conductive connection. For example, even if the surface of the metal particle has an insulating coating, it functions as the conductive particle as long as the particle is deformed during the anisotropic conductive connection and the metal particle is exposed. .

The content of the conductive particles in the anisotropic conductive film is not particularly limited and can be appropriately adjusted depending on the wiring pitch of the circuit member, the connection area, and the like.

<Cation curable resin>
The cationic curable resin is not particularly limited as long as it is a resin that is cured by the action of a cationic curing agent, and can be appropriately selected according to the purpose. Examples thereof include an epoxy resin.
There is no restriction | limiting in particular as said epoxy resin, According to the objective, it can select suitably, For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, those modified epoxy resins etc. are mentioned. .
There is no restriction | limiting in particular as content of the said cationic curable resin in the said anisotropic conductive film, According to the objective, it can select suitably.

<Cationic curing agent>
The cationic curing agent is not particularly limited as long as it is a curing agent that generates a cationic species, and can be appropriately selected according to the purpose. Examples thereof include onium salts.
Examples of the onium salt include a sulfonium salt and an iodonium salt.
Examples of the sulfonium salt include a triarylsulfonium salt.
The counter anion in the onium salt is not particularly limited and may be appropriately selected depending on the intended purpose. For example, SbF ₆ ⁻ , AsF ₆ ⁻ , PF ₆ ⁻ , BF ₄ ⁻ , CH ₃ SO ₃ ⁻ , CF ₃ SO _3- ^{and the} like.
The cationic curing agent may be a commercial product. Examples of the commercially available products include Adeka optomer SP-172 (manufactured by ADEKA Corporation), Adeka optomer SP-170 (manufactured by ADEKA Corporation), Adeka optomer SP-152 (manufactured by ADEKA Corporation), and Adeka optomer. SP-150 (manufactured by ADEKA Corporation), Sun Aid SI-60L (manufactured by Sanshin Chemical Industry Co., Ltd.), Sun Aid SI-80L (manufactured by Sanshin Chemical Industry Co., Ltd.), Sun Aid SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd.) ), Sun Aid SI-150L (manufactured by Sanshin Chemical Industry Co., Ltd.), CPI-100P (manufactured by San Apro Co., Ltd.), CPI-101A (manufactured by San Apro Co., Ltd.), CPI-200K (manufactured by San Apro Co., Ltd.), IRGACURE250 (BASF Corporation) Manufactured).

There is no restriction | limiting in particular as content of the said cationic hardening | curing agent in the said anisotropic conductive film, Although it can select suitably according to the objective, Film formation resin and cation contained in the said anisotropic conductive film The amount is preferably 10 to 40 parts by mass and more preferably 15 to 30 parts by mass with respect to 100 parts by mass of the total amount of the curable resin.

<Organic peroxide>
The organic peroxide is not particularly limited and may be appropriately selected depending on the intended purpose. For example, diacyl peroxide, peroxydicarbonate, peroxyketal, dialkyl peroxide, hydroperoxide, peroxyester , Ketone peroxide, and other peroxides.

In the present invention, the reaction start temperature of the organic peroxide is preferably higher than the reaction start temperature of the cationic curing agent.
In the present invention, the reaction start temperature of the cationic curing agent refers to the heat generation start temperature of DSC measurement.
The reaction start temperature of the organic peroxide refers to the heat generation start temperature by the rapid heating test, for example, the heat generation start temperature described in NOF 10th edition, Table-3.

The reaction start temperature of the organic peroxide is preferably 15 ° C. or more higher than the reaction start temperature of the cationic curing agent, and more preferably 30 ° C. or more. However, it is difficult to activate the organic peroxide at a temperature of 50 ° C. away from the heat at the time of mounting, so that the corrosion prevention effect is exhibited. is there. When the annealing treatment is performed, the corrosion prevention effect can be sufficiently exerted.
The reaction initiation temperature between the organic peroxide and the cationic curing agent is preferably 25 ° C. to 45 ° C., more preferably 30 ° C. to 40 ° C.
The annealing treatment refers to a heat treatment step in which heating is performed at a temperature equal to or higher than the reaction start temperature of the organic peroxide as described in the section <Heat treatment step> in the following (connection method).

The content of the organic peroxide is preferably 1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the film-forming resin, the cationic curable resin, and the cationic curing agent.

<Radical scavenger>
There is no restriction | limiting in particular as said radical scavenger, According to the objective, it can select suitably, For example, what is generally used as a polymerization inhibitor, such as a hydroquinone derivative, is applicable.

The content of the radical scavenger is preferably 0.1 to 3 parts by mass with respect to 100 parts by mass of the total amount of the film-forming resin, the cationic curable resin, and the cationic curing agent.

<Film forming resin>
There is no restriction | limiting in particular as said film formation resin, According to the objective, it can select suitably, For example, phenoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide resin, polyolefin Resin etc. are mentioned. The film forming resin may be used alone or in combination of two or more. Among these, phenoxy resin is preferable from the viewpoint of film forming property, processability, and connection reliability.
Examples of the phenoxy resin include a resin synthesized from bisphenol A and epichlorohydrin.
As the phenoxy resin, an appropriately synthesized product or a commercially available product may be used.
There is no restriction | limiting in particular as content of the said film formation resin in the said anisotropic conductive film, According to the objective, it can select suitably.

<Other ingredients>
There is no restriction | limiting in particular as said other component, According to the objective, it can select suitably, For example, a silane coupling agent etc. are mentioned.
The silane coupling agent is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include an epoxy silane coupling agent, an acrylic silane coupling agent, a thiol silane coupling agent, and an amine silane. A coupling agent etc. are mentioned.
There is no restriction | limiting in particular as content of the said silane coupling agent in the said anisotropic conductive film, According to the objective, it can select suitably.

The average thickness of the anisotropic conductive film is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 3 μm to 30 μm, more preferably 5 μm to 25 μm, and particularly preferably 8 μm to 20 μm.

The method for producing the anisotropic conductive film is not particularly limited and may be appropriately selected depending on the purpose. For example, the conductive particles, the cationic curable resin, and the cationic curing agent, Polyethylene terephthalate (PET) containing the organic peroxide and the radical scavenger, and preferably mixed with the film-forming resin, so that the mixture is uniformly mixed, and then the mixture is peeled. ) A method of coating on a film.

<First electronic component and second electronic component>
The first electronic component and the second electronic component are not particularly limited as long as they are electronic components having terminals, which are targets for anisotropic conductive connection using the anisotropic conductive film. For example, a glass substrate, a flexible substrate, a rigid substrate, an IC (Integrated Circuit) chip, a TAB (Tape Automated Bonding), a liquid crystal panel, and the like can be given. As said glass substrate, Al wiring formation glass substrate, ITO wiring formation glass substrate, etc. are mentioned, for example. Examples of the IC chip include a liquid crystal screen control IC chip in a flat panel display (FPD).

(Connection method and joined body)
The connection method of the present invention includes at least a first arrangement step, a second arrangement step, and a heating and pressing step, and further includes other steps as necessary.
The connection method is a method in which the terminal of the first electronic component and the terminal of the second electronic component are anisotropically conductively connected.
The joined body of the present invention is obtained by the connection method of the present invention.
As a more preferable aspect of the present invention, the connection method may further include a heat treatment step of heating at a temperature equal to or higher than a reaction start temperature of the organic peroxide after the heating and pressing step.

There is no restriction | limiting in particular as said 1st electronic component and said 2nd electronic component, According to the objective, it can select suitably, For example, the said illustrated by description of the said anisotropic conductive film of this invention The first electronic component and the second electronic component can be cited respectively.

<First arrangement step>
The first arrangement step is not particularly limited as long as it is a step of arranging the anisotropic conductive film of the present invention on the terminal of the second electronic component, and can be appropriately selected according to the purpose. it can.
In the case where the second electronic component is a substrate such as a glass substrate or a flexible substrate and the first electronic component is an IC chip, a TAB, or the like, in the first arrangement step, for example, the second electronic component The anisotropic conductive film is disposed on the terminal of the electronic component so that the terminal and the conductive particle-containing layer of the anisotropic conductive film are in contact with each other.

<Second arrangement step>
The second placement step is a step of placing the first electronic component on the anisotropic conductive film so that a terminal of the first electronic component is in contact with the anisotropic conductive film. There is no particular limitation, and it can be appropriately selected according to the purpose.

<Heat pressing process>
The heating and pressing step is not particularly limited as long as it is a step of heating and pressing the electronic component with a heating and pressing member, and can be appropriately selected according to the purpose.
Examples of the heating and pressing member include a pressing member having a heating mechanism. Examples of the pressing member having the heating mechanism include a heat tool.
The heating temperature is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 160 ° C. to 190 ° C.
The pressing pressure is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 40 MPa to 80 MPa.
The heating and pressing time is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 5 seconds to 10 seconds.

<Heat treatment process>
As a further preferred aspect of the connection method of the present invention, the connection method may further include a heat treatment step (annealing) for heating at a temperature equal to or higher than the reaction start temperature of the organic peroxide after the heating and pressing step.
By applying a heat treatment step of heating at a temperature equal to or higher than the reaction temperature of the organic peroxide to the joined body obtained after the heating and pressing step, the activation of the organic peroxide is performed at the time of mounting. Even if the amount of heat is insufficient, it can be sufficiently activated after mounting. Thereby, the prevention performance of corrosion can be raised.
In the heat treatment step, a temperature equal to or higher than the reaction start temperature of the organic peroxide is applied. The heating time in the heat treatment step may be a level at which it is considered that the acid trap reaction by the organic peroxide has been sufficiently performed. For example, after reaching a predetermined temperature equal to or higher than the reaction start temperature, heating is performed for about 1 minute. do it.
Specifically, the assembled assembly is placed in a heater manufactured by SU-222, ESPEC (Espec) Co., Ltd., which is set to the predetermined temperature, heat treated for several minutes, and then removed from the heater. A treated bonded body (annealed product) can be obtained.

Examples of the present invention will be described below, but the present invention is not limited to these examples.

(Example 1)
<Preparation of anisotropic conductive film>
34.5 parts by mass of phenoxy resin (trade name: YP-50, manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.), 35 parts by mass of epoxy resin (EP828, manufactured by Mitsubishi Chemical Co., Ltd.), cationic curing agent (Sun-Aid SI-60L, Sanshin) Chemical Industry Co., Ltd., 10 parts by mass of a sulfonium salt type cationic curing agent (reaction start temperature 90 ° C.), 5 parts by mass of a silane coupling agent (KBE403, manufactured by Shin-Etsu Silicone Co., Ltd.), conductive particles (AUL704, Sekisui Chemical) Manufactured by Kogyo Co., Ltd., 10 parts by mass of metal-coated resin particles having an Ni / Au plating film formed on the surface of acrylic resin particles, average particle diameter of 4.0 μm, organic peroxide (Perbutyl L, manufactured by NOF CORPORATION ( Reaction start temperature 108 ° C.)) 5 parts by mass, and radical scavenger (tetrabutylhydroquinone (TBHQ) manufactured by Tokyo Chemical Industry Co., Ltd.) 0.5 quality The parts were mixed uniformly. The mixture after mixing was applied onto a PET film subjected to a release treatment so that the average thickness after drying was 10 μm, to prepare an anisotropic conductive film.
Table 1-1 shows the composition of the anisotropic conductive film.

<Manufacture of joined body and evaluation of joined body>
The joined body was manufactured by the following method and evaluated as follows. The results are shown in Table 2-1.
On the 2nd electronic component, the anisotropic conductive film obtained above was arrange | positioned so that the said 2nd electronic component might be contact | connected. Then, the 1st electronic component was arrange | positioned on the anisotropic conductive film. Subsequently, using a Teflon (registered trademark) sheet having an average thickness of 50 μm as a buffer material, the first electronic component was heated and pressed with a heating tool at 170 ° C. and 60 MPa for 5 seconds.

<< Joint after annealing (annealed product) >>
After the above mounting, the bonded product was put into a heater manufactured by SU-222, ESPEC Co., Ltd. set at 110 ° C. and taken out from the heater after 5 minutes to obtain an annealed product subjected to a heat treatment step. .
The annealed product was also evaluated for corrosivity similar to the following.

<< Corrosive evaluation >>
-Test IC chip and glass substrate-
A test IC chip (size 1.8 mm × 20 mm, thickness 0.5 mm, gold plating bump size 30 μm × 85 μm, bump height 15 μm) was used as the first electronic component.
As the second electronic component, a 0.7 mm thick glass substrate on which an Al comb wiring was formed was used.

-Evaluation-
DC 5 V was applied to the Al comb-shaped wiring of the obtained joined body for 12 hours. 12 sets of Al comb-shaped wirings after application were observed with a metallographic microscope and evaluated according to the following evaluation criteria.
〔Evaluation criteria〕
5: Corrosion is not observed 4: Corrosion spot is observed in 1 to 2 places 3: Corrosion spot is observed in 3 to 5 places 2: Corrosion spot is observed in 6 or more places 1: Disconnection is confirmed However, when the result is so subtle that it is unclear which of the above five-step evaluations is applicable, it may be expressed as “.5” in the middle of both. For example, when it is determined that it is between 2 and 3, 2.5 is written.

<< Adhesion evaluation >>
-Test IC chip and glass substrate-
A test IC chip (size 1.8 mm × 20 mm, thickness 0.5 mm, gold-plated bump size 30 μm × 85 μm, bump height 15 μm) was used as the first electronic component.
As the second electronic component, a glass substrate having a thickness of 0.5 mm having an ITO film formed on the entire surface was used.

-Evaluation-
The degree of floating of the anisotropic conductive film with respect to the glass substrate after the pressure cooker test (PCT) was visually observed and evaluated according to the following evaluation criteria. PCT was performed under the conditions of 121 ° C., 2 atm, and 5 hours.
〔Evaluation criteria〕
5: Lifting is not observed 4: Lifting of more than 0% and less than 10% is observed with respect to the crimping area 3: Lifting of approximately 10% is observed with respect to the crimping area 2: With respect to the crimping area About 20% lift was observed. 1: Lift was observed on the entire surface of the crimping area. However, if the result is so subtle that it falls into any of the above five-level evaluation, In some cases, it may be written as “.5” in the middle. For example, when it is determined that it is between 2 and 3, 2.5 is written.

<< Comprehensive evaluation >>
When the result of corrosion evaluation and adhesion evaluation is 3 or more, it is set as “◯”. However, even if the corrosion evaluation is 2 or more and less than 3, the corrosion evaluation after annealing may be 3 or more.
If one of the results of the corrosion evaluation or the adhesion evaluation is 3 or more and the other is 2 or more and less than 3, the result is Δ.
When at least one of the results of the corrosion evaluation or the adhesion evaluation contains 1, it is marked as x.

(Examples 2 to 7)
In Example 1, the anisotropic compositions of Examples 2-7 were changed in the same manner as in Example 1 except that the composition of the anisotropic conductive film was changed as shown in Table 1-1 and Table 1-2. A conductive film and a joined body were produced.
In Example 2 and Examples 4 to 7, an annealed product was obtained in the same manner as in Example 1 except that the annealing temperature was set to 125 ° C. In Example 3, an annealed product was obtained in the same manner as in Example 1 except that the set temperature of the heater was 150 ° C.
Evaluation similar to Example 1 was performed about the obtained joined body. The results are shown in Table 2-1 and Table 2-2.

(Comparative Examples 1 to 3)
The anisotropic conductive films and joined bodies of Comparative Examples 1 to 3 were obtained in the same manner as in Example 1, except that the composition of the anisotropic conductive film was changed as shown in Table 1-2. Produced.
In Comparative Examples 1 and 2, an annealed product was obtained in the same manner as in Example 1 except that the set temperature of the heater was 125 ° C. as the annealing treatment. In Comparative Example 3, an annealed product was obtained in the same manner as in Example 1 except that the set temperature of the heater was 90 ° C.
Evaluation similar to Example 1 was performed about the obtained joined body. The results are shown in Table 2-2.

In Table 1-1 and Table 1-2, PKHH represents a phenoxy resin manufactured by Sakai Chemical Industry Co., Ltd. JER806 indicates a bisphenol F type epoxy resin manufactured by Mitsubishi Chemical Corporation. Parmec N indicates an organic peroxide (reaction start temperature 90 ° C.) manufactured by NOF Corporation. Perbutyl L represents an organic peroxide (reaction start temperature: 108 ° C.) manufactured by NOF Corporation. Percure HB indicates an organic peroxide (reaction start temperature 125 ° C.) manufactured by NOF Corporation. Park mill P represents an organic peroxide (reaction start temperature 149 ° C.) manufactured by NOF Corporation. The radical scavenger MEHQ (methylhydroquinone) is manufactured by Tokyo Chemical Industry Co., Ltd.

From the results of Examples 1 to 7, it was confirmed that the anisotropic conductive film of the present invention can suppress the corrosion of the wiring and has good corrosion resistance.
During the above evaluation, it is not desirable that at least one evaluation is included in the evaluation of corrosiveness or adhesiveness. If the evaluation is greater than 2, comprehensive evaluation is performed in consideration of the evaluation results of other items. If the evaluation of corrosivity or adhesiveness is an evaluation of 3 or more, it can be said that it is a practically preferable result. As a result, it can be said that Example 2 showed the most preferable result in terms of good corrosivity and good adhesion without annealing.
Moreover, Example 3 can improve corrosion performance by performing an annealing process. It was confirmed that Example 3 also showed good results in both corrosiveness and adhesiveness, although there was a condition of annealing treatment.

The anisotropic conductive film of the present invention can be suitably used for production of a bonded body having excellent corrosion resistance and adhesiveness.

Claims

An anisotropic conductive film for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,
The anisotropic conductive film contains at least conductive particles, a cationic curable resin, a cationic curing agent, an organic peroxide, and a radical scavenger,
An anisotropic conductive film, wherein the reaction start temperature of the organic peroxide is higher than the reaction start temperature of the cationic curing agent.
A method of connecting anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component,
A first disposing step of disposing the anisotropic conductive film according to claim 1 on a terminal of the second electronic component;
A second disposing step of disposing the first electronic component on the anisotropic conductive film such that a terminal of the first electronic component is in contact with the anisotropic conductive film;
A heating and pressing step of heating and pressing the first electronic component with a heating and pressing member.
The connection method according to claim 2, further comprising a heat treatment step of heating at a temperature equal to or higher than a reaction start temperature of the organic peroxide after the heating and pressing step.
A joined body connected by the connection method according to any one of claims 2 to 3.