CN102167964B - Circuit connecting material, connecting structure for circuit parts and connecting method for circuit parts - Google Patents
Circuit connecting material, connecting structure for circuit parts and connecting method for circuit parts Download PDFInfo
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Abstract
The invention provides a circuit connecting material, a connecting structure for circuit parts and a connecting method for the circuit parts. The circuit connecting material contains an adhesive composition which is cured by light or heat and an organic compound with urethane and ester and is used for mutually connecting the circuit parts with substrates and circuit electrodes formed on the main surfaces of the substrates; and the organic compound comprises an aromatic group and a ringlike cycloaliphatic group. The circuit connecting material can get sufficient bonding strength even for connecting the circuit parts with the substrates formed by polyethylene terephthalate, polyimide resin, polyethersulfone, acrylic resin or glass or the circuit parts the surfaces of which are provided withlayers made of organosilicon resin, polyimide resin, acrylic resin and the like.
Description
The application is to be on July 21st, 2006 applying date of original application, and application number is 200680055407.8, and denomination of invention is divided an application for the Chinese patent application of " syndeton of circuit connection material, circuit block and the method for attachment of circuit block ".
Technical field
The present invention relates to for the syndeton of the circuit block that will have circuit electrode circuit connection material connected to one another, circuit block and the method for attachment of circuit block.
Background technology
In recent years, in the precision electronic device field, because the densification development of circuit, electrode width, electrode space become minimum, and therefore coming off, peel off or the position skew of distribution occur easily.In order to address this problem, the electric and electronic of developing the low temperature having excellent fast curing and having a sufficiently long serviceable time is with circuit connection material (for example, patent documentation 1,2).
Patent documentation 1: the international brochure that discloses No. 98/44067
Patent documentation 2: the international brochure that discloses No. 01/015505
Summary of the invention
But according to the kind of the material that consists of the circuit block that connects, can there be not fully problem of bonding strength in above-mentioned circuit connection material in the past.Particularly the substrate of support circuit electrode is when the substrate that is formed by polyethylene terephthalate, polyimide resin, polyethersulfone, acrylic resin or glass or the surface of circuit block is formed with when layer that is made of silicone resin, polyimide resin, acrylic resin etc., can exist bonding strength significantly to reduce such problem.
Therefore, the object of the invention is to, a kind of such circuit connection material is provided, namely, even connect circuit block with the substrate that is formed by polyethylene terephthalate, polyimide resin, polyethersulfone, acrylic resin or glass or surface be formed with by silicone resin, polyimide resin, acrylic resin etc. consist of layer circuit block the time, also can obtain enough bonding strengths.
Circuit connection material of the present invention contains the adhesive composite by light or thermofixation and has urethano and the organic compound of ester group, and the circuit block that is used for having substrate and is formed at the circuit electrode on its interarea is connected to each other.
Circuit connection material of the present invention, by and with adhesive composite and have urethano and the organic compound of ester group, become circuit connection material as described below: though connection have the substrate that is formed by polyethylene terephthalate, polyimide resin, polyethersulfone, acrylic resin or glass circuit block or the surface be formed with by silicone resin, polyimide resin, acrylic resin etc. consist of the layer circuit block the time, also can obtain enough bonding strengths.
Above-mentioned adhesive composite preferably contains free-radical polymerised compound and produces the radical initiator of free radical by heating or light.At this moment, consider from the angle of the bonding strength on the inorganics surfaces such as further raising and metal that more preferably free-radical polymerised compound comprises and has acrylate-based or methacrylate based phosphate compound.
The second-order transition temperature of above-mentioned organic compound is preferably more than 50 ℃.It is more than 50 ℃ that organic compound has urethano and ester group and second-order transition temperature simultaneously, thereby can further improve especially the bonding strength behind the high temperature and humidity test.When organic compound only had in urethano and the ester group any, if second-order transition temperature is more than 50 ℃, although then can suppress the reduction of the bonding strength under the hot and humid environment, it is insufficient that the bonding strength at initial stage can become.Relative therewith, if use the circuit connection material of the organic compound that has simultaneously urethano and ester group, then when keeping fully high initial stage bonding strength, can further suppress the reduction of the bonding strength under the hot and humid environment.
In addition, have the above-mentioned organic compound of urethano and ester group, preferably have aromatic group and/or cyclic aliphatic group, weight-average molecular weight is preferably 5000～100000.
Circuit connection material of the present invention preferably contains electroconductive particle.Thereby, not only can keep the circuit electrode state of insulation each other on the same substrate, and circuit block more stably can be electrically connected each other.
The syndeton of circuit block of the present invention is, have first substrate and be formed at the first circuit block of the first circuit electrode on its interarea and have second substrate and the second circuit parts that are formed at the second circuit electrode on its interarea, the electric circuit connection member that consists of by the cured article by the invention described above circuit connection material, be arranged between described the first and second circuit blocks connects, and makes and the electrical connection relative with the second circuit electrode of the first circuit electrode.
In addition, the method of attachment of circuit block of the present invention is, according to having first substrate and the first circuit block that is formed at the first circuit electrode on its interarea, the layer that is consisted of by the circuit connection material of the invention described above, and have second substrate and be formed at the order of the second circuit parts of the second circuit electrode on its interarea, so that the first circuit electrode relative with the second circuit electrode to mode carry out stacked, form duplexer with this, by to the heating of this duplexer and pressurization, according to making described the first circuit electrode and being connected the second circuit electrode and being electrically connected to fetch and connecting described the first circuit block and described second circuit parts.
The syndeton of circuit block of the present invention, because circuit block connects by circuit connection material of the present invention each other, so circuit block bonding strength each other is high, hot and humid lower weather resistance is excellence also.In addition, utilize the method for attachment of circuit block of the present invention, because circuit block connects by circuit connection material of the present invention each other, therefore can access the also syndeton of the circuit block of excellence of high, the hot and humid lower weather resistance of circuit block bonding strength each other.
In the syndeton of foregoing circuit parts and the method for attachment of circuit block, the surface of at least one in preferred the first and second circuit electrodes is made of the material that comprises at least a material of selecting from the group that gold and silver, tin, platinum metals and indium-tin-oxide form.
In the syndeton of foregoing circuit parts and the method for attachment of circuit block, the substrate that at least one in preferred the first and second substrates is made of the material that comprises at least a material of selecting from the group that polyethylene terephthalate, polyethersulfone, Resins, epoxy, acrylic resin, polyimide resin and glass form.In addition, between at least one in preferred the first and second circuit blocks and the electric circuit connection member, be formed with the layer that comprises at least a material of from the group that silicone resin, acrylic resin and polyimide resin form, selecting.The circuit connection material of these the invention described above, when solidifying to form electric circuit connection member, and the layer that consists of of these specific materials between the high bonding strength of performance.
According to the present invention, have the circuit block of the substrate that is formed by polyethylene terephthalate, polyimide resin, polyethersulfone, acrylic resin or glass or surface when being formed with the circuit block of the layer that is consisted of by silicone resin, polyimide resin, acrylic resin etc. even can provide in connection, also can obtain the circuit connection material of enough strong bonding strength.In addition, according to the present invention, take into account easily bonding strength and demand characteristics (contact resistance, insulativity etc.) in addition.In addition, according to the present invention, it is also wider to form the scope of selecting for the material that obtains above-mentioned effect.
Description of drawings
Fig. 1 is the sectional view of an embodiment of the circuit connection material of expression film like of the present invention.
Fig. 2 is the sectional view of an embodiment of the syndeton of expression circuit block of the present invention.
Fig. 3 is the sectional view of other embodiments of the syndeton of expression circuit block of the present invention.
Nomenclature
1 ... the circuit connection material of film like
1a ... electric circuit connection member
5 ... electroconductive particle
10 ... the first circuit block
11 ... first substrate
12 ... bond layer
13 ... the first circuit electrode
20 ... the second circuit parts
21 ... second substrate
23 ... the second circuit electrode
101 ... the syndeton of circuit block
102 ... the syndeton of circuit block
Embodiment
Below, according to circumstances present invention will be described in detail with reference to the accompanying preferred embodiment.But the invention is not restricted to following embodiment.
Circuit connection material of the present invention contains the adhesive composite by light or thermofixation.This adhesive composite preferably contains free-radical polymerised compound and produces the radical initiator of free radical by heating or light.
Free-radical polymerised compound has the functional group that carries out polymerization by living radical.For example, suitable acrylic compound, methacrylate compound, the maleimide compound of using.As the optical free radical polymerizable compound, polymer monomer and polyreactive oligomers etc. are arranged.Because polyreactive oligomers is normally full-bodied, when therefore using polyreactive oligomers, preferably by also adjusting viscosity with polymerizable monomers such as low viscous polymerizability polyfunctional acrylic ester monomers.
As acrylic compound or methacrylate compound, can use the polyreactive oligomerses such as epoxy (methyl) origoester acrylate, ammonia ester (methyl) origoester acrylate, polyethers (methyl) origoester acrylate, polyester (methyl) origoester acrylate, or the polymerizable monomers such as acrylate, methacrylic ester.
As acrylate, can enumerate Viscoat 295, polyethyleneglycol diacrylate, the polyalkylene glycol diacrylate, pentaerythritol acrylate, 2-cyano ethyl acrylate, the cyclohexyl acrylate, the dicyclopentenyl acrylate, two cyclopentenes oxygen base ethyl propylene acid esters, 2-(2-ethoxy ethoxy) ethyl propylene acid esters, 2-ethoxyethyl group acrylate, the 2-ethylhexyl acrylate, the n-hexyl acrylate, the 2-hydroxyethylmethacry,ate, the hydroxypropyl acrylate, iso-bornyl acrylate, the isodecyl acrylate, isooctyl acrylate, the dodecyl acrylate, 2-methoxy ethyl acrylate, the 2-phenoxyethyl acrylate, the tetrahydrofurfuryl acrylate, neopentylglycol diacrylate, dipentaerythritol acrylate, simple function or the polyfunctional acrylate monomers such as allyl acrylate.
As methacrylic ester, can use the acryl of aforesaid propylene acid esters to replace with compound of methacryloyl etc.Specifically, can enumerate simple function or the polyfunctional methacrylate monomer such as tertiary butyl amino-ethyl methacrylic ester, cyclohexyl methyl acrylate, two cyclopentenes oxygen base ethyl-methyl acrylate, 2-HEMA, isobornyl methacrylic ester, isodecyl methacrylic ester, dodecyl acrylate, stearyl methacrylic ester, tridecyl methacrylic ester, glycidyl methacrylate, allyl methacrylate(AMA).
As acrylate or methacrylic ester, except above-mentioned, can also suitably use to have acrylate-based or methacrylate based and phosphate-based phosphate compound.As this phosphate compound, the compound of preferred following general formula (1) expression.In the formula (1), n represents 1～3 integer, and R represents hydrogen atom or methyl.As the object lesson of the phosphate compound of formula (1) expression, can enumerate list (2-methacryloxyethyl) phosphate ester acid, two (2-methacryloxyethyl) phosphate ester acid.As skilled in the art can understand, this phosphate compound for example can synthesize by the reaction of phosphoric anhydride and 2-hydroxyethylmethacry,ate.
As maleimide compound, preferably has at least the compound of the dimaleoyl imino more than 2.As the maleimide compound with the dimaleoyl imino more than 2, for example can enumerate, 1-methyl-2,4-bismaleimides benzene, N, N '-meta-phenylene bismaleimide, N, N '-TOPOT 2,2′ p phenylenebis maleimide, N, a N '-tolylene bismaleimides, N, N '-4,4-biphenylene bismaleimides, N, N '-4,4-(3,3 '-dimethyl biphenylene) bismaleimides, N, N '-4,4-(3,3 '-dimethyl diphenylmethane) bismaleimides, N, N '-4,4-(3,3 '-diethyl ditan) bismaleimides, N, N '-4,4-ditan bismaleimides, N, N '-4,4-diphenyl propane bismaleimides, N, N '-4,4-diphenyl ether bismaleimides, N, N '-3,3 '-sulfobenzide bismaleimides, 2, two (4-(4-maleimide phenoxyl) phenyl) propane of 2-, two (3-sec-butyl-4-8 (4-maleimide phenoxyl) phenyl) propane of 2,2-, two (4-(4-maleimide phenoxyl) phenyl) decane of 1,1-, 4,4 '-cyclohexylene-two (1-(4 maleimide phenoxyl)-2-phenylcyclohexane, two (4-(4-maleimide phenoxyl) phenyl) HFC-236fa of 2,2-etc.These compounds can use separately or multiple combination uses.
As free-radical polymerised compound, can as required above-claimed cpd be used separately or the multiple combination use.From the cure shrinkage that can suppress circuit connection material or give cured article flexibility angle and consider, ammonia ester origoester acrylate particularly preferably is more preferably with this ammonia ester acrylate and the polymerizable monomer more than a kind and usefulness.
As the radical initiator that produces free radical by heating or light, can use organo-peroxide, azo based compound, light trigger such pass through in heating and the rayed compound that at least processing of any produces living radical.
Organo-peroxide and azo based compound are mainly by adding the thermogenesis living radical.When using these compounds as radical initiator, one kind or two or more according to coming the connection temperature of purpose, tie-time, working life etc. from organo-peroxide and/or azo based compound, to select aptly.
Organo-peroxide, from taking into account hyperergy and enough aspect considerations working lives two, the temperature of preferred 10 hours transformation period is more than 40 ℃ and the temperature of 1 minute transformation period is below 180 ℃, and more preferably the temperature of 10 hours transformation period is more than 60 ℃ and the temperature of 1 minute transformation period is below 170 ℃.In addition, for the corrosion of the circuit electrode (splicing ear) that prevents circuit block, in the organo-peroxide, preferred chlorion or organic acid content are below the 5000ppm, and then, the material that the organic acid that more preferably produces after the thermal degradation is few.
As organo-peroxide, specifically, suitable diacyl peroxide, dialkyl peroxide, peroxy dicarbonate, peroxyester, ketal peroxide, hydroperoxide, the silyl superoxide etc. of using.
As diacyl peroxide; can enumerate isobutyl peroxide, 2; 4-dichloro-benzoyl base superoxide, 3; 5,5-trimethyl acetyl base superoxide, sim peroxides, lauroyl superoxide, stearyl-superoxide, succinyl superoxide, benzoyl peroxidation toluene, benzoyl peroxide etc.
As dialkyl peroxide, can enumerate α, α ' two (tert-butyl hydroperoxide) diisopropyl benzene, dicumyl peroxide, 2,5-dimethyl-2,5-two (tert-butyl hydroperoxide) hexane, tertiary butyl cumyl peroxide etc.
As peroxy dicarbonate, can enumerate diη-propyl peroxy dicarbonate, diisopropyl peroxydicarbonate, two (4-tert-butylcyclohexyl) peroxy dicarbonate, two-2-oxyethyl group methoxy base peroxy dicarbonate, two (peroxidation of 2-ethylhexyl), two carbonic ethers, dimethoxy butyl peroxyization two carbonic ethers, two (3-methyl-3-methoxyl group butyl peroxy) two carbonic ethers etc.
As peroxyester; can enumerate the cumyl new decanoate ester peroxide; 1; 1; 3; 3-tetramethyl butyl new decanoate ester peroxide; 1-cyclohexyl-1-methylethyl new decanoate ester peroxide; uncle's hexyl new decanoate ester peroxide; tert-butyl hydroperoxide trimethylacetic acid ester; 1; 1; 3; 3-tetramethyl butyl peroxidation-2-ethylhexanoate; 2; 5-dimethyl-2; 5-two (peroxidation of 2-ethyl hexyl acyl group) hexane; 1-cyclohexyl-1-methylethyl peroxidation-2-ethylhexanoate; uncle's hexyl peroxidation-2-ethylhexanoate; tert-butyl hydroperoxide-2-ethylhexanoate; the tert-butyl hydroperoxide isobutyrate; 1; two (tert-butyl hydroperoxide) hexanaphthenes of 1-; uncle's hexyl peroxidation sec.-propyl monocarbonate; tert-butyl hydroperoxide-3; 5; 5-tri-methyl hexanoic acid ester; the tert-butyl hydroperoxide laurate; 2; 5-dimethyl-2,5-two (a benzoyl peroxidation) hexane; tert-butyl hydroperoxide sec.-propyl monocarbonate; tert-butyl hydroperoxide-2-ethylhexyl monocarbonate; uncle's hexyl peroxide benzoate; the tert-butyl hydroperoxide acetic ester; two (tert-butyl hydroperoxide) six hydrogen terephthalate etc.
As ketal peroxide, can enumerate two (peroxidation of uncle's hexyl)-3,3 of 1,1-, 5-trimethyl-cyclohexane, 1, two (peroxidation of the uncle's hexyl) hexanaphthenes, 1,1 of 1-,-two (tert-butyl hydroperoxide)-3,3,5-trimethyl-cyclohexane, 1,1-(tert-butyl hydroperoxide) cyclododecane, 2, two (tert-butyl hydroperoxide) decane of 2-etc.
As hydroperoxide, can enumerate diisopropyl benzene hydrogen peroxide, cumene hydroperoxide etc.
As the silyl superoxide, can enumerate tertiary butyl trimethyl silyl superoxide, two (tertiary butyl) dimetylsilyl superoxide, tertiary butyl trivinyl silyl superoxide, two (tertiary butyl) divinyl silyl superoxide, three (tertiary butyl) vinyl silyl superoxide, tertiary butyl triallyl silyl superoxide, two (tertiary butyl) diallyl silyl superoxide, three (tertiary butyl) allyl group silyl superoxide etc.
These organo-peroxides and azo based compound can use separately or multiple mixing is used.In addition, also may be used decomposition accelerating agent, inhibitor etc.And then, be the coating such as macromolecular compound and the material of micro encapsulation with these compounds with polyurethane series, polyester, owing to can obtain the long serviceable time, thereby preferred.
As light trigger, for example, the suitable ketone such as the benzil ketals such as benzoin ether, benzil, hydroxycyclohexylphenylketone, benzophenone, the methyl phenyl ketones such as bitter almond oil camphor ethyl ether, sec.-propyl benzoin ether and derivative thereof, thioxanthene ketone, the diimidazole class etc. used.
When using light trigger, according to the wavelength of the light source that uses or the curing characteristics of expectation etc., select the suitableeest light trigger.In addition, light trigger as required, also can and be used the sensitizing agents such as amine, sulfide, phosphide according to arbitrary proportion.
As sensitizing agent, preferred aliphat amine, aromatic amine, the cyclic amine such as piperidines with nitrogenous ring texture, o-tolyl thiocarbamide, diethyldithiophosphoric acid sodium, the soluble salt of aromatic series-sulfinic acid, N, N '-dimethyl-p-aminophenyl formonitrile HCN, N, N '-diethyl-p-aminophenyl formonitrile HCN, N, N '-two (beta-cyano ethyl)-p-aminophenyl formonitrile HCN, N, N '-two (β-chloroethyl)-p-aminophenyl formonitrile HCN, tri-n-butyl phosphine etc.
Perhaps, can use Propiophenone, methyl phenyl ketone, xanthone, 4-methyl acetophenone, benzophenone, fluorenes, benzophenanthrene, biphenyl, thioxanthone, anthraquinone, 4,4 '-two (dimethylamino) benzophenone, 4,4 '-two (diethylamino) benzophenone, phenanthrene, naphthalene, 4-phenyl methyl phenyl ketone, 4-phenyl benzophenone, 1-naphthalene iodide, 2-naphthalene iodide, acenaphthene, 2-naphthyl cyanide, 1-naphthyl cyanide,
Benzil, fluoranthene, pyrene, 1, the non-pigmenteds such as 2-benzanthrene, acridine, En, perylene, tetracene, 2-methoxynaphthalene are sensitizing agent, thionine, methylenum coeruleum, lumiflavin, riboflavin, photopigment, tonka bean camphor, psoralene, 8-methoxypsoralen, 6-Methylcoumarin, 5-MOP, 5-hydroxyl psoralene, coumaric acyl pyrone (Network マ リ Le ピ ロ Application), acridine orange, trypaflavine, proflavin, fluorescent yellow, eosin W or W S, Eosin B, erythrosine sodium salt, rose-red isochrome prime system sensitizing agent.
As radical initiator, also can be with aforesaid light trigger and organo-peroxide, azo based compound etc. by the compound of thermogenesis free radical and use.
Adhesive composite also can be the composition that contains Resins, epoxy and solidifying agent thereof.As Resins, epoxy, can with the various epoxy compoundss etc. that have 2 above glycidyls in 1 molecule separately or mix 2 kinds with on use.Specifically, can enumerate the bisphenol-type epoxy resin of being derived by Epicholorohydrin and dihydroxyphenyl propane, F, AD etc., the epoxy group(ing) novolac resin of being derived by Epicholorohydrin and phenol phenolic varnish or cresols phenolic varnish or the naphthalene type Resins, epoxy with naphthalene-ring containing skeleton, glycidyl amine type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin etc.Resins, epoxy is with foreign ion (Na
+, Cl
-Deng) or water-disintegrable alkali etc. be reduced to high purity product below the 300ppm owing to prevent electromigration, thereby preferred.
As the solidifying agent of Resins, epoxy, in order to obtain fully long working life, preferred potentiality solidifying agent.As the potentiality solidifying agent, imidazoles system, hydrazides system, boron trifluoride-amine complex, sulfonium salt, amine imide, the salt of polyamines, Dyhard RU 100 are arranged.Also can be to be that these solidifying agent of coating such as macromolecular compound carry out the material that microencapsulation obtains with polyurethane series, polyester.These solidifying agent can use separately also can mix use, can also and use with decomposition accelerating agent, inhibitor etc.
Circuit connection material of the present invention is with aforesaid adhesive composite and has urethano and material that the organic compound of ester group (below be sometimes referred to as " ester urethane compound ") combination obtains.The ester urethane compound preferably has urethano and ester group in its main chain.
This ester urethane compound for example can obtain by the reaction of the pure and mild vulcabond of polyester polyols.Ester urethane compound by this reaction obtains is called as the poly ester urethane resin usually sometimes.
As vulcabond, suitable use 2,4-inferior cresyl vulcabond (TDI), 4,4 '-diphenylmethanediisocyanate (MDI), 1, aromatic series, the alicyclic or aliphatic vulcabond such as 6-hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI).
Polyester polyol is the polymkeric substance with a plurality of ester groups and a plurality of hydroxyls.Polyester polyol for example can obtain by the reaction of dicarboxylic acid and glycol.As dicarboxylic acid, aromatic series or the aliphatic dicarboxylic acids such as preferred terephthalic acid, m-phthalic acid, hexanodioic acid, sebacic acid.As glycol, preferred ethylene glycol, propylene glycol, BDO, hexylene glycol, neopentyl glycol, glycol ether, the such glycols of triglycol.
The second-order transition temperature of ester urethane compound is preferably more than 50 ℃.The ester urethane compound, the kind by suitable adjustment polyester polyol, vulcabond or molecular weight etc. can make its second-order transition temperature reach more than 50 ℃.
The ester urethane compound preferably has anionic property.Thereby bonding strength further improves.Ester urethane compound with anionic property, by when the pure and mild di-isocyanate reaction of polyester polyols, make have sulfonic group, the glycol of carboxyl or Diamines copolymerization obtain in side chain.That is, the ester urethane compound preferably has sulfonic group or carboxyl.
The ester urethane compound preferably has the aromatic group that contains phenyl ring etc., the cyclic aliphatic group that contains cyclohexane ring etc.
The ester urethane compound can mix use more than 2 kinds.The material that the material that for example, the reaction by aromatic polyester polyol and aliphatic diisocyanate can be obtained and the reaction by aliphatic polyester polyols and aromatic diisocyanate obtain makes up.
The weight-average molecular weight of ester urethane compound is preferably 5000～100000.If weight-average molecular weight, then has the tendency that the film-shaped when being shaped to film like becomes second nature and reduces less than 5000; If weight-average molecular weight surpasses 100000, the solvability or the intermiscibility that then have in solvent reduce, and are difficult to the tendency for the preparation of the coating fluid that is shaped to film like.
The ester urethane compound preferably comprises and has free-radical polymerised unsaturated double-bond and at least one in the epoxy group(ing).Thus, when the curing circuit connecting material, with Resins, epoxy or free-radical polymerised compound reaction in the adhesive composite, the Young's modulus of the cured article of circuit connection material, thermotolerance improve.
Circuit connection material except composition described above, can also contain hydroxy-containing resin.As hydroxy-containing resin, can use the resins such as polyvinyl butyral acetal, polyvinyl formal, polymeric amide, polyester, phenol resins, Resins, epoxy, phenoxy resin, urethane (not comprising above-mentioned ester urethane compound).Wherein, phenoxy resin particularly preferably.By using these hydroxy-containing resins, the stress retentivity during curing is excellent, because the hydroxyl cementability further improves.
The weight-average molecular weight of hydroxy-containing resin is preferably more than 10000, and more preferably 10000～1000000.If the weight-average molecular weight of hydroxy-containing resin surpasses 1000000, then have and be difficult to the tendency of mixing with other compositions.In addition, the second-order transition temperature of hydroxy-containing resin is preferably more than-50 ℃.
In order further to improve thermotolerance, hydroxy-containing resin preferably has free-radical polymerised functional group.Has the hydroxy-containing resin of free-radical polymerised functional group as above-mentioned free-radical polymerised compound.Hydroxy-containing resin also can be by containing the carboxyl elastomerics, containing the modifications such as epoxy group(ing) elastomerics.
Circuit connection material in order to become the material in excellence aspect the stress mitigation, preferably contains acrylic rubber.As acrylic elastomer, can use polymkeric substance or multipolymer that at least a acrylic monomer polymerization in vinylformic acid, acrylate, methacrylic ester and the vinyl cyanide is obtained.Acrylic rubber also can be the multipolymer of above-mentioned monomer and glycidyl acrylate or glycidyl methacrylate.Consider that from the cohesive force aspect that improves circuit connection material the weight-average molecular weight of acrylic rubber (weighted average) is preferably more than 200,000.
Circuit connection material also can contain styrene resin.Styrene resin can be the resin that the polymerizing styrene monomer obtains, and also can be the multipolymer that at least one copolymerization in vinylbenzene and maleic anhydride compound, the maleimide compound is obtained.Consider that from the cohesive force aspect that improves circuit connection material the weight-average molecular weight of styrene resin (weighted average) is preferably more than 100,000.
Circuit connection material can also further contain weighting agent, tenderizer, promotor, antiaging agent, tinting material, fire retardant, thixotropic agent, coupling agent and phenol resins, melamine resin, isocyanates etc.
When containing weighting agent, connection reliability etc. can be improved, thereby preferred.The maximum diameter of weighting agent is preferably the particle diameter less than electroconductive particle, and its amount is preferably in the scope of 5～60 parts by volume (with respect to adhesive composite 100 parts by volume).If surpass 60 parts by volume, then the effect of Reliability Enhancement can be saturated, if less than 5 parts by volume, the effect of then adding is little.As coupling agent, consider from the aspect that cementability improves, preferably contain vinyl, acryl, amino, epoxy group(ing), and the material of isocyanate group.
Circuit connection material preferably contains electroconductive particle.Even although do not contain electroconductive particle, also can the junction circuit parts by circuit electrode direct contact each other, by containing conducting particles, can more stably connect.
As electroconductive particle, can enumerate the metallicss such as Au, Ag, Ni, Cu, scolder or carbon particles etc.In order fully to prolong working life, electroconductive particle preferably comprises Au, Ag, platinum metals, more preferably comprises Au.
Electroconductive particle is preferably, and the particle that forms with the transition metal such as Ni or dielectric glass, pottery, plastics etc. is as nuclear, the particle that its surface uses the coating coating that is made of precious metals such as Au to obtain.The electroconductive particle with precious metal coating like this, distortion with circuit connection material heating and pressurization the time, thus increasing with the contact area of circuit electrode, reliability further improves.In order to obtain good contact resistance, the thickness of the coating of precious metal is preferably more than 100 dusts.And then when examining the particle into transition metal such as Ni, the thickness of coating is more preferably more than 300 dusts.The thickness of coating is during less than 300 dust, when being scattered in electroconductive particle in the resin etc. in the situation, when the part of coating is damaged, because redoxomorphism produces free free radical, has the tendency that the storage stability of circuit connection material reduces.
The amount of electroconductive particle with respect to adhesive composite 100 parts by volume, is preferably 0.1～30 parts by volume.In order to prevent that superfluous electroconductive particle from causing the short circuit of adjacent circuit etc., more preferably 0.1～10 parts by volume.
Fig. 1 is the sectional view of an embodiment of the circuit connection material of film like of the present invention.The circuit connection material 1 of film like is that a plurality of electroconductive particles 5 are scattered in the circuit connection material that obtains in the resin combination layer 3 that contains adhesive composite and ester urethane compound etc. and are shaped to the material that film like obtains.The circuit connection material 1 of film like for example can be made by with specific thickness circuit connection material being coated on the support film.As support film, surface treatment has been carried out in suitable use so that it has PET film of release property etc.
The circuit connection material 1 of film like, being clipped in that relative 1 pair of circuit block state each other is heated and when pressurizeing, melt-flow after relative circuit electrode is electrically connected to each other, is solidified, and shows bonding strength.So the flowability of the circuit connection material 1 of film like is important.Specifically, in that (thick 35 μ m, 5mm * 5mm) are clipped in 2 glass sheets (under the state between thick 0.7mm, the 15mm * 15mm) with the circuit connection material 1 of film like, carry out 150 ℃, 2MPa, heating and when pressurization of 10 seconds, value with the index (B)/(A) of the flowability of the initial stage area (A) of circuit connection material 1 and the expression of the area (B) after the heating and pressurizing is preferably 1.3～3.0, and more preferably 1.5～2.5.If value (B)/(A) less than 1.3, then has illiquidity, can't obtain the tendency of good connection; If surpass 3.0, then can produce bubble, the tendency that has reliability to reduce.
The circuit connection material 1 of film like only has 1 layer, but circuit connection material of the present invention also can replace this 1 layer, and uses to be shaped to the state with a plurality of layers different film of composition.Particularly circuit connection material contains adhesive composite in electroconductive particle, the circuit connection material and contains when producing the radical initiator of free radical by heating or light, circuit connection material is become separately have contain by heating or light produce free radical radical initiator layer and contain the multilayer film of the layer of electroconductive particle.The serviceable time that like this, can obtain more to grow.
The circuit connection material 1 of film like is connected to each other such circuit blocks such as chip part, printed base plate such as semi-conductor chip, resistance chip, capacitor chip such as being used for.
Fig. 2 is the sectional view of an embodiment of the syndeton of expression circuit block of the present invention.The syndeton 101 of circuit block shown in Figure 2 is following syndeton: has first substrate 11 and is formed at the first circuit block 10 of the first circuit electrode 13 on its interarea and has second substrate 21 and be formed at the second circuit parts 20 of the second circuit electrode 23 on its interarea by bond layer 12, and that the cured article that obtains consists of by being solidified by the foregoing circuit connecting material, be formed at the structure that the electric circuit connection member 1a between the first and second circuit blocks 10,20 is formed by connecting.In the syndeton 101 of circuit block, the first circuit electrode 13 and second circuit electrode 23 are relative and be electrically connected.
Electric circuit connection member 1a is made of the cured article 3a of the resin combination that contains adhesive composite and ester urethane compound etc. and the electroconductive particle 5 that is scattered in wherein.The first circuit electrode 13 and second circuit electrode 23 are electrically connected by electroconductive particle 5.40 ℃ the Young's modulus of electric circuit connection member 1a is preferably 100～3000MPa, more preferably 500～2000MPa.
The syndeton 101 of circuit block, for example can obtain by the following method: according to the order of circuit connection material 1 and the second circuit parts 20 of the first circuit block 10, said film shape, so that the first circuit electrode 13 and second circuit electrode 23 relative to mode carry out stacked, form duplexer with this, by to this duplexer heating and pressurization, connect the first circuit block 10 and second circuit parts 20 according to the first circuit electrode 13 being connected with the second circuit electrode being electrically connected to fetch.
In the method, at first, the circuit connection material 1 that is formed at the film like on the support film is heated under the state that is pasted on the second circuit parts 20 and pressurize, thereby circuit connection material 1 is bonding in advance, after peeling off support film, the position of alignment circuit electrode is placed the first circuit block 10 on one side on one side, can prepare duplexer.
The condition of above-mentioned heating and pressurization duplexer is suitably adjusted according to the solidified nature of the adhesive composite in the circuit connection material etc., so that circuit connection material solidifies and can obtain sufficient bonding strength.
Fig. 3 is the sectional view of other embodiments of the syndeton of expression circuit block of the present invention.The syndeton 102 of circuit block shown in Figure 3, the first circuit electrode 13 directly was formed on the interarea of first substrate 11 in the first circuit block 10, all the other were identical with the syndeton 101 of circuit block.
As the syndeton 102 of circuit block, in electric circuit connection member 1a and the situation with the such structure of the direct driving fit of substrate of the materials such as polyethylene terephthalate, polyethersulfone, Resins, epoxy, acrylic resin, polyimide resin and glass formation, circuit connection material in the past is difficult to obtain sufficient bonding strength.Relative therewith, in the syndeton 102 of circuit block, electric circuit connection member 1a is the cured article of the circuit connection material of the invention described above, even thereby also can keep sufficient bonding strength under hot and humid environment.Such effect is even also can obtain in the situation that is formed with the layer that contains polyimide resin, acrylic resin, silicone resin etc. between electric circuit connection member and the circuit block.
Embodiment
Below, enumerate embodiment and comparative example, be described more specifically the present invention.But, the invention is not restricted to following embodiment.
(preparation method of poly ester urethane resin)
The polyester polyol that will obtain by the reaction of dicarboxylic acid and glycol is dissolved in and obtains solution in the methyl ethyl ketone, this solution is dropped into possess in the stainless steel autoclave with well heater of stirrer, thermometer, condenser and vacuum generating device and nitrogen ingress pipe.Then, drop into the isocyanic ester of specified amount, dropping into respect to polyester polyol 100 weight parts is the dibutyl tin laurate as catalyzer of 0.02 weight part, after 10 hours, is cooled to 40 ℃ 75 ℃ of reactions.And then, by adding after piperidines makes its reaction carry out chain extension in 30 minutes, neutralize with triethylamine.
Above-mentioned reacted solution is added drop-wise in the pure water, and not only solvent and catalyst dissolution and are separated out as the poly ester urethane resin of ester urethane compound in water.With the poly ester urethane resin drying of separating out, obtain the poly ester urethane resin with Vacuumdrier.
(synthesizing of poly ester urethane Resin A)
Will be as the terephthalic acid of dicarboxylic acid, as the propylene glycol of glycol, as 4 of isocyanic ester, 4 '-diphenylmethanediisocyanate, with terephthalic acid/propylene glycol/4, the mol ratio of 4 '-diphenylmethanediisocyanate is that the amount of 1.0/1.3/0.25 is used, and obtains the poly ester urethane Resin A according to above-mentioned steps.The weight-average molecular weight of poly ester urethane Resin A when using gel permeation chromatography, is 27000.
The poly ester urethane Resin A is dissolved in reaches 20 % by weight in the methyl ethyl ketone, form methyl ethyl ketone solution, with apparatus for coating this solution coat has been carried out by 70 ℃, 10 minutes warm air drying, forming the film of thick 35 μ m on the surface-treated PET film (thick 80 μ m) at single face.For this film, use wide area Measurement of Dynamic Viscoelasticity device, under the condition of stretching loading 5gf, frequency 10Hz, measure the temperature dependency of Young's modulus.In the Young's modulus-temperature curve that obtains, with on the y direction with the glass transition zone before and after the equidistant straight line of straight line behind separately the base line extension, with the temperature (intermediate point second-order transition temperature) of the intersection point of the curve of the stepped changing unit in glass transition zone as the second-order transition temperature of poly ester urethane Resin A, trying to achieve the result is 105 ℃.
(circuit connection material)
On one side with polycaprolactone glycol 400 weight parts of weight-average molecular weight 800,2-hydroxypropyl acrylate 131 weight parts, be heated to 50 ℃ as dibutyltin dilaurate 0.5 weight part of catalyzer with as hydroquinone monomethyl ether 1.0 weight parts of stopper, Yi Bian mix.Then, drip isophorone diisocyanate 222 weight parts, and then, be warming up to 80 ℃ while stir, carry out the ammonia esterification.The reactivity of confirming isocyanate group be 99% or more after, the reduction temperature obtains the ammonia ester acrylate as free-radical polymerised compound.
Take the surface of polystyrene as the particle of nuclear, form in turn the nickel dam of thick 0.2 μ m and the gold layer of thick 0.04 μ m, make the electroconductive particle of median size 10 μ m.
With the solids component weighing scale, according to poly ester urethane Resin A 50g, chlorinated polyethylene 49g, phosphate type acrylate 1g, mix each composition as uncle's hexyl peroxidation 2-ethylhexanoate 5g of radical initiator, and then, adding electroconductive particle makes its amount be 3 whole volume %, make its Uniform Dispersion, obtain being coated with the dispersion liquid of usefulness.During the modulation dispersion liquid, under the state of poly ester urethane Resin A for the solution that is dissolved in methyl ethyl ketone with the concentration of 20 quality %, be that (NOF Corp makes 50 % by weight DOP solution at uncle's hexyl peroxidation 2-ethylhexanoate, trade(brand)name " cross can (パ one キ ユ ア) HO ") under the state, mixes with other compositions.With apparatus for coating the dispersion liquid that obtains being coated on single face has carried out by 70 ℃, 10 minutes warm air drying, obtaining the circuit connection material of the film like of thick 20 μ m on the surface-treated PET film (thick 80 μ m).
Embodiment 2
Will be as m-phthalic acid, terephthalic acid and the hexanodioic acid of dicarboxylic acid, ethylene glycol, neopentyl glycol and 1 as glycol, the 6-hexylene glycol, as 4 of vulcabond, 4 '-diphenylmethanediisocyanate, with m-phthalic acid/terephthalic acid/hexanodioic acid/ethylene glycol/neopentyl glycol/1,6-hexylene glycol/4, the mol ratio of 4 '-diphenylmethanediisocyanate is that the amount of 0.21/0.21/0.58/0.19/0.55/0.46/0.3 is used, according to above-mentioned steps synthesizing polyester ammonia ester resin B.The weight-average molecular weight of poly ester urethane resin B when using gel permeation chromatography, is 60000.In addition, measure similarly to Example 1 the second-order transition temperature of poly ester urethane resin B, the result is-3 ℃.
Except using poly ester urethane resin B replacement poly ester urethane Resin A, operate similarly to Example 1, make the circuit connection material of film like.
Embodiment 3
Except the 20g among the poly ester urethane resin B 50g being replaced to phenoxy resin (Union Carbide Corporation makes, trade(brand)name " PKHC ", weight-average molecular weight 45000) in addition, operate similarly to Example 2, make the circuit connection material of film like.
Comparative example 1
Except using when the synthesizing polyester ammonia ester Resin A used polyester polyol (85 ℃ of second-order transition temperatures) to replace the poly ester urethane Resin A, the circuit connection material of film like is made in similarly to Example 1 operation.
Comparative example 2
Except using polyester polyol used when the synthesizing polyester ammonia ester resin B (second-order transition temperature-5 ℃) to replace the poly ester urethane resin B, the circuit connection material of film like is made in similarly to Example 2 operation.
Comparative example 3
Except using polyester polyol used when the synthesizing polyester ammonia ester resin B (second-order transition temperature-5 ℃) to replace the poly ester urethane resin B, the circuit connection material of film like is made in similarly to Example 3 operation.
Comparative example 4
(DIC Bayer Polymer company makes except using the urethane resin that does not have ester group, trade(brand)name " Pan's Otto Dix T-8175 (パ Application デ Star Network ス T-8175) ") (second-order transition temperature-30 ℃) replaces beyond the poly ester urethane Resin A, operate similarly to Example 1, make the circuit connection material of film like.
(making of the syndeton of circuit block)
Preparation is formed with the circuit block of 500 chromium circuit as circuit electrode (live width 50 μ m, spacing 100 μ m, thick 0.4 μ m) at glass substrate (manufacturing of CORNING company, trade(brand)name " #1737 ").On this circuit block, paste the circuit connection material of the film like that embodiment 1 makes, heating and pressurizing is 5 seconds under 70 ℃, the condition of 0.5MPa, and it is bonding in advance.
Then, peel off the PET film, will be in Kapton (Ube Industries, Ltd's manufacturing, trade(brand)name " UPILEX ", thick 75 μ m) the upper flexible circuit parts (FPC1) that are bonded with the 3-tier architecture that 500 copper circuits (live width 50 μ m, spacing 100 μ m, thick 18 μ m) form across bond layer are placed on the circuit connection material of film like, and heating and pressurizing is 10 seconds under 160 ℃, the condition of 3MPa.Thereby the circuit block that will have glass substrate is connected the width connection of 2mm with FPC1.
In addition, (Ube Industries, Ltd makes at Kapton in use, trade(brand)name " UPILEX25S ", thick 25 μ m) flexible electric circuit board (FPC2) of 2 layers of structure that directly is formed with the copper circuit of 500 live widths, 50 μ m, spacing 100 μ m, thick 8 μ m replaces FPC1, with above-mentioned similarly operation, the circuit block that will have glass substrate is connected the width connection of 2mm with FPC2.
The circuit connection material of the film like that use embodiment 2～3, comparative example 1～4 are made similarly operates with above-mentioned, FPC1 is connected with FPC2 with the circuit block with glass substrate be connected.
(contact resistance)
For the syndeton of the circuit block of making, use the resistance value (contact resistance) between the relative circuit electrode of multitester measuring.Mensuration is in the early stage, keeps carrying out after 500 hours the hot and humid processing in 85 ℃, the hot and humid groove of 85%RH.The mean value that resistance value shown in the table 1 is 150 (x+3 σ) is as contact resistance.
(bonding strength)
For the syndeton of the circuit block of making, the bonding strength when peeling off with 90 ° of peeling rate 50mm/min mensuration.Mensuration is in the early stage, carries out after the hot and humid processing same as described above.
Table 1
The syndeton of the circuit block that the circuit connection material of use embodiment 1～3 connects, the contact resistance at initial stage is fully low, and does not also almost find the rising of contact resistance after the hot and humid processing, demonstrates high weather resistance.Wherein, in the situation of the embodiment 1 of the poly ester urethane resin of use second-order transition temperature more than 50 ℃, weather resistance is excellent especially.In addition, use in the situation of second-order transition temperature less than the embodiment 2 of 50 ℃ poly ester urethane resin, although the connection after the hot and humid processing fluffs a little, it is large that the rising of contact resistance and embodiment 1 compare relative change, in practical in tolerable limit.And then, and with poly ester urethane resin and second-order transition temperature in the situation of the embodiment 3 of the phenoxy resin more than 50 ℃, the almost inhibition of equal extent of the rising acquisition of the contact resistance that hot and humid processing causes and embodiment 1.
Relative therewith, to use not have ester bond and the low comparative example 4 that reaches-30 ℃ urethane resin of second-order transition temperature, after the hot and humid processing, contact resistance raises greatly.And, comparative example 4, although demonstrate reasonable bonding strength in the syndeton of using FPC1, in the syndeton of using FPC2, after the hot and humid processing, bonding strength reduces greatly.Comparative example 1～3, bonding strength are below about 6N/cm, aspect bonding strength, do not demonstrate in practical sufficient characteristic at least.
Claims (18)
1. composition is as the application of circuit connection material, it is characterized in that, described composition contains by the adhesive composite of light or thermofixation and has urethano and the organic compound of ester group, described organic compound is the compound that the reaction by the pure and mild vulcabond of polyester polyols obtains, described polyester polyol by containing aromatic dicarboxylic acid dicarboxylic acid and the reaction of glycol obtain;
Described circuit connection material is used for having substrate and is connected to each other with the circuit block that is formed at the circuit electrode on its interarea.
2. the application of composition in the manufacturing of circuit connection material, it is characterized in that, described composition contains by the adhesive composite of light or thermofixation and has urethano and the organic compound of ester group, described organic compound is the compound that the reaction by the pure and mild vulcabond of polyester polyols obtains, described polyester polyol by containing aromatic dicarboxylic acid dicarboxylic acid and the reaction of glycol obtain;
Described circuit connection material is used for having substrate and is connected to each other with the circuit block that is formed at the circuit electrode on its interarea.
3. the according to claim 1 and 2 application of record, wherein, described aromatic dicarboxylic acid contains terephthalic acid or m-phthalic acid.
4. the according to claim 1 and 2 application of record, wherein, described organic compound has described urethano and described ester group in main chain.
5. the according to claim 1 and 2 application of record, wherein, described organic compound has anionic property.
6. the according to claim 1 and 2 application of record, wherein, described vulcabond contains aromatic series, alicyclic or aliphatic vulcabond.
7. the according to claim 1 and 2 application of record, wherein, described adhesive composite contains free-radical polymerised compound and produces the radical initiator of free radical by heating or light.
8. the according to claim 7 application of record, wherein, described free-radical polymerised compound comprises and has acrylate-based or methacrylate based phosphate compound.
9. the according to claim 7 application of record, wherein, described free-radical polymerised compound comprises at least a compound that is selected from the group that is comprised of acrylic compound, methacrylate compound and maleimide compound.
10. the according to claim 7 application of record, wherein, described radical initiator comprises at least a compound that is selected from the group that is comprised of organo-peroxide, azo based compound and light trigger.
11. the according to claim 10 application of record; wherein, described organo-peroxide comprises at least a compound that is selected from the group that is comprised of diacyl peroxide, dialkyl peroxide, peroxy dicarbonate, peroxyester, ketal peroxide, hydroperoxide and silyl superoxide.
12. the according to claim 1 and 2 application of record, wherein, the second-order transition temperature of described organic compound is more than 50 ℃.
13. the according to claim 1 and 2 application of record, wherein, described organic compound has at least one group in aromatic group and the cyclic aliphatic group.
14. the according to claim 1 and 2 application of record, wherein, described organic compound is the poly ester urethane resin.
15. the according to claim 1 and 2 application of record, wherein, the weight-average molecular weight of described organic compound is 5000～100000.
16. the according to claim 1 and 2 application of record, described composition contains electroconductive particle.
17. the according to claim 16 application of record, wherein, the content of described electroconductive particle is 0.1～30 parts by volume with respect to described adhesive composite 100 parts by volume.
18. the according to claim 1 and 2 application of record, wherein, described circuit connection material is film like.
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| CN1737075A (en) * | 1999-08-25 | 2006-02-22 | 日立化成工业株式会社 | Wiring-connecting material and process for producing circuit board with the same |
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| JP特开2006-52258A 2006.02.23 |
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