WO2016147810A1 - 切屑堆積状態検出装置 - Google Patents

切屑堆積状態検出装置 Download PDF

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Publication number
WO2016147810A1
WO2016147810A1 PCT/JP2016/055189 JP2016055189W WO2016147810A1 WO 2016147810 A1 WO2016147810 A1 WO 2016147810A1 JP 2016055189 W JP2016055189 W JP 2016055189W WO 2016147810 A1 WO2016147810 A1 WO 2016147810A1
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Prior art keywords
accumulation state
light source
light
chip
illuminance sensor
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PCT/JP2016/055189
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English (en)
French (fr)
Japanese (ja)
Inventor
静雄 西川
佐藤　則夫
隆史 星
隆之 中村
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Dmg森精機株式会社
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Priority to DE112016001235.7T priority Critical patent/DE112016001235T5/de
Publication of WO2016147810A1 publication Critical patent/WO2016147810A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042—Devices for removing chips

Definitions

  • the present invention relates to a detection device that detects the accumulation state of chips generated by removal processing of a machine tool.
  • This chip detection device has a configuration in which a plurality of sets of light emitting units and light receiving units are arranged opposite to each other around a hermetic cover that defines a processing area, and is a straight light (generally a laser beam) emitted from the light emitting unit. Is received by the light receiving unit. When chips accumulate, the straight light is blocked by the chips and does not reach the light receiving unit. Therefore, when the light receiving unit cannot receive light, it can be determined that the chips have accumulated. Moreover, it is said that the three-dimensional accumulation state of chips can be grasped by providing a plurality of sets of light portions and light receiving portions with a height difference.
  • the conventional chip detection device described above has the following problems. That is, first, since the conventional chip detection device uses a light emitting unit that irradiates straight light (generally laser light), there is a problem that erroneous detection is likely to occur.
  • the shape of the chips varies depending on the material of the workpiece, the type of tool, the shape of the tool, and the like. Among them, there is a chip having a curled shape. Such a chip deposit is bulky due to its curl shape and has many spaces. Therefore, in the conventional chip detection device, although the chip deposit exists between the light emitting unit and the light receiving unit, the straight light emitted from the light emitting unit passes through the space and passes through the light receiving unit. This may cause a problem that chips are not detected by the light receiving unit.
  • coolant In general machining fields using machine tools, coolant is used for the purpose of cooling the machining area and reducing cutting resistance. In the machining area, the coolant floats in the form of mist. Fine chips, for example, powdered chips are floating. Therefore, when the above-described conventional chip detection device is installed in this processing region, the straight light emitted from the light emitting unit may be blocked by the coolant mist or fine chips. In this case, conversely, In spite of the fact that no chips are deposited, there is a problem in that it is erroneously detected that chips are accumulated.
  • the light emitting unit and the light receiving unit of the conventional chip detection device can only determine the presence or absence of an object, in other words, only binary determination, it is not possible to determine the accumulation state including the chip accumulation shape.
  • the light emitting part and the light receiving part are contaminated by the coolant mist or fine chips as much as possible, accurate determination cannot be made.
  • the present invention has been made in view of the above circumstances, and has a curled shape, and can accurately detect the accumulation state even if it is a bulky chip deposit, as well as coolant mist and fine particles. It is an object of the present invention to provide a detection device that can accurately detect the accumulation state of chips even in a processing region in which chips float.
  • the present invention for solving the above problems is an apparatus for detecting the accumulation state of chips generated by removal processing of a machine tool, At least one light source that irradiates diffused light and that is disposed so as to face each other with a detection region set in the chip accumulation region, and at least one illuminance sensor that outputs a signal corresponding to the amount of received light
  • a light source control unit that supplies power to the light source to irradiate light
  • the present invention relates to a chip accumulation state detection apparatus including a deposition state determination unit that receives a signal output from the illuminance sensor and determines the accumulation state of the chips in the accumulation region.
  • this chip accumulation state detection apparatus first, after disposing at least one light source and at least one illuminance sensor so as to face each other with a detection area appropriately set in the chip accumulation area, Light is emitted from the light source under the control of the light source control unit.
  • the illuminance sensor outputs a signal corresponding to the amount of received light, such as a current, and is composed of a phototransistor or a photodiode.
  • the light source emits diffused light, and a general light bulb, fluorescent lamp, LED, or the like can be applied.
  • the configuration is different from a conventional light emitting unit that emits light having directivity such as laser light.
  • the wavelength of the light emitted from the light source needs to be a wavelength that can be sensed by the illuminance sensor, and is preferably the wavelength with the highest sensitivity.
  • the illuminance sensor receives the maximum amount of light, and a signal having a value corresponding to the maximum amount of light is output from the illuminance sensor.
  • the amount of light received by the illuminance sensor gradually decreases according to the amount of deposition.
  • the signal value (output value) output from the sensor also decreases. Finally, almost no light is received by the illuminance sensor, and the output value from the illuminance sensor is also minimized.
  • the accumulation state determination unit determines the accumulation state of the chips in the accumulation region based on an output value from the illuminance sensor that changes according to the accumulation state of the chips.
  • the relative relationship between the accumulation state of the chips and the output value from the illuminance sensor is obtained empirically in advance, and the accumulation state determination unit determines whether the current output value output from the illuminance sensor is Thus, it is possible to adopt a mode in which the accumulation state of chips is determined from the relative relationship obtained in (1).
  • the said chip in this invention points out all the things produced by a removal process, and is a concept including a chip-shaped thing, a curled thing, and a powdery thing.
  • this chip accumulation state detection apparatus unlike the conventional chip detection apparatus, since the light source (light emission part) which irradiates straight light is not used, the problem regarding the erroneous detection mentioned above does not arise.
  • the detection light can pass through the curled chip space.
  • the diffused light emitted from the light source is the amount of light received by the illuminance sensor, and the amount of received light that changes continuously according to the chip accumulation state. Since the chip accumulation state is determined based on the above, the above-described erroneous detection is unlikely to occur.
  • the conventional chip detection device erroneous detection is likely to occur due to the influence of coolant mist and fine chips, but in this chip accumulation state detection device, even if coolant mist and fine chips exist, the light source from the light source Since the light is scattered by these and received by the illuminance sensor, the illuminance sensor receives the light from the light source without being affected by the coolant mist or fine chips. Therefore, in this chip accumulation state detection device, the conventional erroneous detection is unlikely to occur.
  • the chip accumulation state detection apparatus it is preferable that a plurality of the illuminance sensors are arranged in a line along the vertical direction. In this way, the chip accumulation state can be determined based on the output values from the illuminance sensors arranged in the vertical direction, so that more accurate determination can be performed.
  • the chip accumulation state detection apparatus it is preferable that a plurality of the light sources are arranged in a line along the vertical direction. In this way, the amount of light received from each light source by the illuminance sensor changes more clearly according to the chip accumulation state, so the chip accumulation state can be determined more accurately. be able to.
  • the light source control unit is configured to irradiate light by selectively supplying power to a plurality of light sources
  • the accumulation state determination unit is configured to determine the accumulation state of the chips in the accumulation region based on a signal output from the illuminance sensor according to a light reception state of light emitted from each light source. May be.
  • the chip accumulation state detection device power is selectively supplied from the light source control unit to the plurality of light sources and light is emitted from the light sources, and the accumulation state determination unit emits light from each light source.
  • the chip accumulation state is determined based on a signal output from the illuminance sensor according to the light receiving state of the light.
  • the chips are usually accumulated in a mountain shape.
  • the amount of light received by the illuminance sensor varies greatly depending on the shape of chips. Therefore, according to this configuration, it is possible to determine the accumulation state including the chip accumulation shape.
  • the accumulation state determination unit is configured such that the value of an output signal received from the illuminance sensor when the light source is turned off is equal to or less than a predetermined reference value. It may be configured to execute the determination.
  • disturbance light may exist in addition to the light emitted from the light source.
  • the output value from the illuminance sensor increases by an amount corresponding to this, so that the accumulation state determination unit cannot make an accurate determination. Therefore, when the output value output from the illuminance sensor when the light source is turned off is equal to or less than a predetermined reference value, that is, when it is determined that the illuminance sensor does not receive the disturbing light having an influence, the accumulation is performed.
  • the accumulation state determination unit includes a value of an output signal received from the illuminance sensor when the light source is turned off, and an output signal received from the illuminance sensor when the light source is turned on.
  • the difference from the value is equal to or greater than a predetermined reference value, the determination of the deposition state may be performed.
  • the output value output from the illuminance sensor when the light source is turned off is a larger value than when there is no ambient light. If the difference between the output value from the illuminance sensor and the time is equal to or greater than a predetermined reference value, it can be determined that the illuminance sensor has not received the disturbing light that has an influence. By determining the chip accumulation state by the state determination unit, it is possible to perform an accurate determination that is not affected by ambient light.
  • the chip accumulation state detection device unlike the conventional chip detection device, a light source (light emitting unit) that irradiates straight light is not used. Does not cause any problems.
  • the chip accumulation state can be determined based on the output values from the illuminance sensors arranged in the vertical direction. Therefore, the chip accumulation state can be determined more accurately.
  • the amount of light emitted from each light source and received by the illuminance sensor changes more clearly according to the accumulation state of chips, It is possible to determine the chip accumulation state more accurately.
  • the light source control unit alternatively supplies power to the plurality of light sources to irradiate the light, and the deposition state determination unit determines the illuminance according to the light reception state of the light emitted from each light source. If the chip accumulation state is determined based on the signal output from the sensor, the accumulation state including the chip accumulation shape can be determined.
  • the output value output from the illuminance sensor when the light source is turned off is equal to or less than a predetermined reference value, or the difference between the output values from the illuminance sensor when the light source is turned off and when the light source is turned on is predetermined. If the determination of the deposition state is executed by the deposition state determination unit when the value is equal to or greater than the reference value, an accurate determination that is not affected by ambient light can be performed.
  • FIG. 1 shows a configuration in which a chip accumulation state detection apparatus according to an embodiment of the present invention is applied to a chip bucket
  • FIG. 2 is a left side view thereof
  • FIG. 3 is a right side view thereof.
  • the chip bucket 50 includes a housing-like main body 51 having an open upper surface, four wheels 52 fixed to the lower surface of the main body 51, and a handle 53 provided on the right side surface of the main body 51.
  • the chip is disposed below a chip discharge port of a chip conveyor (not shown) provided in a machine tool (not shown).
  • the chips discharged from the chip discharge port of the chip conveyor are collected in the main body 51 of the chip bucket 50 and accumulated in the main body 51.
  • the said chip refers to all things produced by removal processing, and is a concept including a chip-like thing, a curled thing, and a powdery thing.
  • the inside of the main body 51 is a chip accumulation region.
  • the chip accumulation state detection device 1 includes a light emitting unit 2, a light receiving unit 10, a light source control unit 15, an accumulation state determination unit 16, a reference data storage unit 17, and a display device 18.
  • the light emitting unit 2 and the light receiving unit 10 are disposed in the main body 51 so as to face each other, and are appropriately mounted on the main body 51 so as to contact the inner surface of the main body 51.
  • a region between the light emitting unit 2 and the light receiving unit 10 in the main body 51 is set as a detection region 55.
  • the light source control unit 15, the deposition state determination unit 16, and the reference data storage unit 17 are mounted on one board, and this board is attached to the chip bucket 50.
  • the light emitting unit 2 includes an elongated substrate 3 arranged along the vertical direction, two light sources L1 and L2 provided on the substrate 3, a connector 4 provided on the upper end of the substrate 3,
  • the substrate 3 is provided with a transparent and liquid-tight container 5 that accommodates the substrate 3 provided with the two light sources L1 and L2 in a state where the connector 4 protrudes upward.
  • wirings connected to the light sources L ⁇ b> 1 and L ⁇ b> 2 are formed, and the other ends of the wirings are connected to the connector 4.
  • each of the light sources L1 and L2 includes an LED, the light source L1 is provided near the upper edge of the detection region 55, and the light source L2 is provided near the middle in the height direction of the detection region 55. Yes.
  • the light receiving unit 10 includes an elongated substrate 11 that is also disposed along the vertical direction, and seven illuminance sensors S1 to S7 disposed on the substrate 11 at equal intervals along the vertical direction.
  • the connector 12 provided at the upper end of the substrate 11 and the substrate 11 provided with the illuminance sensors S1 to S7 are composed of a transparent and liquid-tight container 13 that accommodates the connector 12 protruding upward.
  • the uppermost illuminance sensor S1 is provided near the upper edge of the detection area 55, and the lowermost illuminance sensor S7 is provided slightly above the lower edge of the detection area 55.
  • the light sources L1 and L2 and the illuminance sensors S1 to S7 are provided so that the light irradiation side of the light sources L1 and L2 and the light receiving side of the illuminance sensors S1 to S7 face each other. It has been.
  • the illuminance sensors S1 to S7 output a signal corresponding to the amount of received light, and can be applied to those composed of a phototransistor or a photodiode.
  • a phototransistor having a sensitivity characteristic close to human visibility characteristics was used.
  • FIG. 4 shows the relationship between the wavelength of light and the relative sensitivity.
  • the solid line shows the characteristics of the illuminance sensors S1 to S7, and the broken line shows the characteristics of a person.
  • FIG. 5 shows relative sensitivity characteristics according to the angle of incident light of the illuminance sensors S1 to S7.
  • the angle 0 degree is the front of the illuminance sensors S1 to S7.
  • the illuminance sensors S1 to S7 exhibit high sensitivity to light whose light receiving direction is within a certain angle (for example, within 20 degrees) from the front, and provide a certain degree of directivity to the light receiving sensitivity.
  • FIG. 6 shows output characteristics of the illuminance sensors S1 to S7 of this example.
  • the illuminance sensors S1 to S7 in this example output current as shown in FIG. 6 according to the amount of received light.
  • the light source control unit 15 has a battery as appropriate, and is connected to the light sources L1 and L2 on the substrate 3 via the connector 4, and supplies power to the light sources L1 and L2, respectively.
  • L1 and L2 are turned on, that is, light is emitted from the light sources L1 and L2.
  • the light sources L1 and L2 are made of LEDs, and the light emitted from the light sources L1 and L2 does not have directivity like laser light, and is irradiated to the surroundings in a diffused state to some extent.
  • the light source control unit 15 turns on the light sources L1 and L2 in addition to a mode in which these light sources are alternatively turned on, and a mode in which both are turned on simultaneously. .
  • the accumulation state determination unit 16 is connected to the illuminance sensors S1 to S7 on the substrate 11 via the connector 12, and outputs signals (current signals) output from the illuminance sensors S1 to S7. Each is received, and the accumulation state of the chips in the main body 51, that is, in the accumulation region is determined.
  • the chip accumulation state is the state shown in FIG. 7, if only the light source L1 is turned on, the illuminance sensors S1 to S6 above the illuminance sensors S1 to S6 are removed except for the illuminance sensor S7 buried in the accumulated chips. Irradiation light from L1 is received (see solid line arrows shown in FIG. 7). From the sensitivity characteristics of the illuminance sensors S1 to S7 shown in FIG. 5, the amount of light received by the illuminance sensor S1 located in front of the light source L1 is the largest. The amount of light received by the sensor S6 is the smallest.
  • the output value from the illuminance sensor S1 is the largest, and the output value decreases in the order of the illuminance sensors S2, S3, S4, S5, and S6.
  • Such output signals are input to the accumulation state determination unit 16 from the illuminance sensors S1, S2, S3, S4, S5, and S6, respectively.
  • the illumination light from the light source L2 is not received by the illuminance sensor S7 buried in the chips.
  • the upper illuminance sensors S1 to S3 receive the irradiation light from the light source L2 without being blocked by the chips.
  • the illuminance sensors S4 to S6 below the illuminance sensor S3 the irradiation light from the light source L2 is blocked by the chips, so that the irradiation light is not directly received, and the scattered light scattered around is small. Is received.
  • the amount of light received by the illuminance sensor S3 close to the front of the light source L2 among the illuminance sensors S1 to S3 that directly receive the light emitted from the light source L2.
  • the amount of light received is the largest, and the light receiving amount decreases in order.
  • the illuminance sensors S4 to S6 that receive a small amount of scattered light
  • the light reception amount of the uppermost illuminance sensor S4 is large, and the light reception amount decreases in sequence as it is located below this. Then, such output signals are input to the accumulation state determination unit 16 from the illuminance sensors S1, S2, S3, S4, S5, and S6, respectively.
  • the accumulation state determination unit 16 outputs the output values of the illuminance sensors S1 to S7 that are input when only the light source L1 is lit, and the illuminance sensors S1 to S7 that are input when only the light source L2 is lit.
  • the chip accumulation state is determined from the output value of S7. That is, when only the light source L1 is lit, relatively large output values are input from the illuminance sensors S1 to S6, while when only the light source L2 is lit, relatively large output values are output from the illuminance sensors S1 to S3.
  • the chip accumulation state is a mountain shape, and further, the highest output value is input from the illuminance sensor S3 with only the light source L2 turned on, so that the top of the deposit Is near the height position of the illuminance sensor S3.
  • the chip can be determined according to the determination criteria as described above as long as the chip is in a state where chips are accumulated so that the irradiation light from the light source L2 is received by at least the illuminance sensor S1.
  • the accumulation state determination unit 16 determines that the chips are accumulated above the light source L2.
  • the tops of the accumulated chips are estimated from the output values of the illuminance sensors S1 to S7 inputted with only the light source L1 turned on.
  • the accumulation state determination unit 16 is configured such that the accumulated chips are located near the lowest illuminance sensor S2 among the illuminance sensors S1 and S2 that directly receive the light emitted from the light source L2. It is determined that there is a top.
  • the value differs depending on the chip deposition state, that is, the deposition shape such as flat deposition or mountain deposition, and the position of the top of the deposit. Therefore, the accumulation state determination unit 16 outputs the output values of the illuminance sensors S1 to S7 that are input with only the light source L1 lit, and the illuminance sensors that are input with only the light source L2 lit.
  • the chip accumulation state can be determined based on the output values of S1 to S7.
  • the correlation with the deposition state (that is, the deposition shape such as flat or mountain-shaped deposition, the position of the top of the deposit, etc.) can be obtained empirically in advance. Therefore, in this example, the data (correlation data) related to the correlation acquired empirically in this way is stored in the reference data storage unit 17, and the deposition state determination unit 16 turns on only the light source L1.
  • the reference data storage is based on the output values of the illuminance sensors S1 to S7 that are input in a state of being turned on, and the output values of the illuminance sensors S1 to S7 that are input in the state of turning on only the light source L2.
  • the accumulated state of chips is determined with reference to the correlation data stored in the unit 17.
  • the deposition state determination unit 16 transmits data related to the determination result executed as described above to the display device 18 via wireless or wired, and causes the display device 18 to display the determination result.
  • the display device 18 may be unique, it is preferable to use the display attached to the machine tool because it is easy for the operator to confirm. As a display mode, it may be displayed as text information or a display using a figure or the like, but a display capable of alerting the operator according to the accumulation state is preferable.
  • the chip bucket 50 to which the chip accumulation state detection device 1 is mounted is provided on a chip conveyor (not shown). Chips that are disposed below the chip discharge port of the chip conveyor and are discharged from the chip discharge port of the chip conveyor are collected in the main body 51 of the chip bucket 50 and accumulated in the main body 51.
  • the chip accumulation state in the chip bucket 50 is detected regularly or irregularly by the chip accumulation state detection device 1. That is, under the control of the light source control unit 15, only the light source L1 is turned on, and in this state, output signals output from the illuminance sensors S1 to S7 are input to the deposition state determination unit 16, and only the light source L2 is turned on. In this state, an output signal output from each of the illuminance sensors S1 to S7 is input to the deposition state determination unit 16, and the deposition state determination unit 16 outputs from the input illuminance sensors S1 to S7. Based on the value, the correlation data stored in the reference data storage unit 17 is referred to, and the chip accumulation state (the chip accumulation shape, the top position of the deposit, etc.) is determined. The result determined by the accumulation state determination unit 16 is displayed on the display device 18.
  • the operator can confirm the chip accumulation state in the chip bucket 50 by confirming the determination result displayed on the display device 18.
  • the chip bucket 50 can be selected according to the accumulation state. It is possible to take measures such as exchanging and scraping the chips.
  • the chip bucket 50 is replaced with another one, the board on which the light source control unit 15, the deposition state determination unit 16, and the reference data storage unit 17, the light emitting unit 2, and the light receiving unit 10 are replaced before replacement. Are attached to a new chip bucket 50 after replacement.
  • the chip accumulation state detection device 1 of the present example since the light source (light emitting unit) that irradiates straight light is not used unlike the conventional chip detection device, the above-described problem relating to erroneous detection does not occur.
  • the detection light can pass through the curled chip space.
  • the chip accumulation state detection device 1 of this example the light emitted from the light sources L1 and L2 is diffused light, so that the irradiation light passes through the curled chip space. Even if the light passes through, the amount of light received by the illuminance sensors S1 to S7 is very small. It will not be judged.
  • illuminance sensors S1 to S7 arranged in a line are provided, but the number of illuminance sensors is not limited, and may be more or less than this. If the accumulation state of chips can be detected, only one illuminance sensor may be provided. If there is nothing between the light source and the illuminance sensor that blocks the light emitted from the light source, the illuminance sensor receives the maximum amount of light, and a signal with a value corresponding thereto is output from the illuminance sensor.
  • the illuminance sensors may be provided in double rows and double columns. If it does in this way, the various accumulation state of chips can be judged from the output value of the illuminance sensor arranged in double rows and double columns.
  • the two light sources L1 and L2 are provided, but the number of light sources to be provided is not limited, and may be more or less than this. If the accumulated state of chips can be detected, only one light source may be provided. Alternatively, as shown in FIG. 9, seven light sources L1 to L7 may be provided to face the illuminance sensors S1 to S7, respectively. In this case, it is preferable that the light source control unit 15 is configured to selectively supply power to the light sources L1 to L7 to light them. In this way, various accumulation states of chips can be determined. Further, the light sources may be provided in double rows and double columns.
  • the accumulation state determination unit 16 determines that the accumulation state is determined when a value of an output signal received from the illuminance sensor S1 when the light sources L1 and L2 are turned off is equal to or less than a predetermined reference value.
  • the determination process may be executed.
  • disturbance light may exist in addition to the light emitted from the light sources L1 and L2, and in this case, the disturbance light is received by the illuminance sensors S1 to S7. Then, the output value from the illuminance sensors S1 to S7 increases by the amount of the disturbance light, and the accumulation state determination unit 16 cannot perform accurate determination.
  • the accumulation state determination unit 16 determines the chip accumulation state, so that an accurate determination that is not affected by ambient light can be performed.
  • the illuminance sensor for determining whether or not ambient light is present is preferably the uppermost illuminance sensor S1 that is not easily affected by the accumulation state of chips, but is not limited thereto.
  • the accumulation state determination unit 16 receives the value of the output signal received from the illuminance sensor S1 when the light sources L1 and L2 are turned off and the illuminance sensor S1 when the light source L1 is turned on.
  • the deposition state determination process may be executed.
  • the illuminance sensor for determining whether or not ambient light is present is preferably the uppermost illuminance sensor S1 that is not easily affected by the state of chip accumulation, but is not limited thereto.
  • the chip accumulation state detection device 1 is applied to the chip bucket 50.
  • the present invention is not limited to this, and the chip accumulation state detection device 1 is disposed in the machining area of the machine tool. You may make it monitor the accumulation state of the chip in an area
  • erroneous detection is likely to occur due to the influence of the coolant mist and fine chips.
  • the light source L1 even if the coolant mist and fine chips exist, the light source L1.
  • L2 are scattered by these and received by the illuminance sensors S1 to S7, so that the illuminance sensors S1 to S7 are not affected by the coolant mist or fine chips, and the light from the light sources L1 and L2 Is received. Therefore, in this chip accumulation state detection apparatus 1, erroneous detection as in the prior art does not occur.
  • the chip accumulation state detection device 1 is disposed in the chip input portion of the chip conveyor, and the chip accumulation state detection device 1 provides a predetermined amount of chips. Power consumption can be reduced by driving the chip conveyor only when necessary, such as driving the chip conveyor and discharging chips when it is detected that .
  • the chip accumulation state detection device 1 may be disposed in the middle of the chip conveyor conveyance path to detect the chip conveyance state. In the case where chips are not detected by the chip accumulation state detection device 1 even though the removal processing is executed by the machine tool and the chip conveyor is driven, the chips are clogged in the conveying path of the chip conveyor. There is a possibility, and in such a case, by appropriately issuing an alarm to the operator, it is possible to take appropriate measures such as removing clogged chips.

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  • Physics & Mathematics (AREA)
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  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
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PCT/JP2016/055189 2015-03-17 2016-02-23 切屑堆積状態検出装置 WO2016147810A1 (ja)

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JP7483162B1 (ja) 2023-07-26 2024-05-14 三菱電機株式会社 切粉堆積領域推定装置、切粉除去装置、切粉堆積領域推定方法及びプログラム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486691A (en) * 1992-10-07 1996-01-23 Erwin Sick Gmbh Optik-Eletronik Monitoring apparatus in machines
JPH1142531A (ja) * 1997-07-28 1999-02-16 Yamaha Motor Co Ltd 切屑処理機における水抜き装置
JP2003145388A (ja) * 2001-11-14 2003-05-20 Enshu Ltd 密閉カバーのシャッター装置とこの制御方法及び光学式切粉検知装置、切粉除去方法、工作機械の運転制御方法
JP2005306519A (ja) * 2004-04-19 2005-11-04 Matsushita Electric Works Ltd ごみ収納装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486691A (en) * 1992-10-07 1996-01-23 Erwin Sick Gmbh Optik-Eletronik Monitoring apparatus in machines
JPH1142531A (ja) * 1997-07-28 1999-02-16 Yamaha Motor Co Ltd 切屑処理機における水抜き装置
JP2003145388A (ja) * 2001-11-14 2003-05-20 Enshu Ltd 密閉カバーのシャッター装置とこの制御方法及び光学式切粉検知装置、切粉除去方法、工作機械の運転制御方法
JP2005306519A (ja) * 2004-04-19 2005-11-04 Matsushita Electric Works Ltd ごみ収納装置

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