WO2016147284A1

WO2016147284A1 - Formation method and formation device

Info

Publication number: WO2016147284A1
Application number: PCT/JP2015/057632
Authority: WO
Inventors: 明宏川尻; 政利藤田; 良崇橋本; 謙磁塚田; 雅登鈴木
Original assignee: 富士機械製造株式会社
Priority date: 2015-03-16
Filing date: 2015-03-16
Publication date: 2016-09-22
Also published as: JP6479957B2; JPWO2016147284A1

Abstract

In this formation device, cavity partitions 112 are formed on a circuit board 70, and an electronic component 82 is mounted inside the cavity partitions 112. An ultraviolet curing resin 114 is discharged so as to cover the electronic component 82. If the height of the discharged ultraviolet curing resin 114 surpasses a top end position of the cavity partitions 112, the top end of the ultraviolet curing resin 114 is flattened to the top end position of the cavity partitions 112 by a flattening device 78. Due to this configuration, the ultraviolet curing resin 114 can be appropriately flattened even when the electronic component 82 is mounted inside the cavity partitions 112.

Description

Forming method and forming apparatus

The present invention relates to a forming method and a forming apparatus for forming a structure using a discharge device for discharging a curable resin.

When a structure is formed using a discharge device that discharges a curable resin, generally, after the curable resin is discharged in a thin film shape and the thin film curable resin is cured, On the cured curable resin, the curable resin is discharged again in a thin film shape. And a structure is formed by laminating those thin film-like curable resins. Thus, when thin film-like curable resin is laminated | stacked, it is preferable that the location where curable resin is discharged is a flat surface. For this reason, in the forming apparatus described in the following patent document, before the discharged curable resin is cured, the surface of the curable resin is flattened by a flattening device such as a roller or a squeegee, and thereafter The curable resin is cured. Then, the curable resin is discharged again on the flat curable resin.

Special table 2007-551641 gazette

According to the forming apparatus described in the above-mentioned patent document, it is possible to flatten the surface of the curable resin discharged from the discharging apparatus to some extent and form an appropriate structure. However, there may be a case where a protrusion or the like is disposed on the base material from which the curable resin is discharged. In such a case, the projections may hinder the operation of the flattening device, and the curable resin may not be flattened. Further, for example, there is a case where a component is placed around the protruding portion and the curable resin is discharged onto the component. In such a case, the upper end portion of the curable resin discharged onto the part and the upper end portion of the curable resin discharged to a place other than the component are likely to be uneven, but the protrusions are appropriately cured. There is a possibility that the functional resin cannot be flattened. This invention is made | formed in view of such a situation, and makes it a subject to planarize curable resin appropriately even when it is a case where components are mounted in the circumference | surroundings etc. of a projection part. .

In order to solve the above problems, a forming method of the present invention is a forming method for forming a structure using a curable resin by using a discharge device that discharges a curable resin, wherein the forming method includes a protrusion portion. A placement step of placing a component having a dimension in the height direction smaller than the protruding portion on the disposed base material, and a top of the base material so as to cover the component placed in the placement step. A discharge step of discharging a curable resin by the discharge device, and a hardening discharged in the discharge step when the height of the curable resin discharged in the discharge step exceeds the upper end position of the protrusion. A flattening step of flattening the upper end of the conductive resin at the upper end position of the protrusion.

In order to solve the above problems, a forming apparatus of the present invention includes a discharge device that discharges a curable resin, a flattening device that flattens the curable resin discharged by the discharge device, and the discharge device. And a control device for controlling the operation of the flattening device, and forming a structure made of a curable resin, wherein the control device is provided with a protrusion and is higher than the protrusion. A discharge device operation control unit that discharges a curable resin with the discharge device so as to cover the component on a substrate on which a component with a small size is placed, and the curable property discharged with the discharge device When the height of the resin exceeds the upper end position of the protrusion, the flattening device operates to flatten the upper end of the curable resin discharged by the discharge device by the flattening device at the upper end position of the protrusion. With control unit And wherein the Rukoto.

In the forming method and the forming apparatus of the present invention, when a component is placed around the protrusion and the curable resin is discharged so as to cover the component, the discharged curable resin When the height exceeds the upper end position of the protrusion, the upper end of the curable resin is flattened at the upper end position of the protrusion by the flattening device. Thereby, even if it is a case where components are mounted in the circumference | surroundings etc. of a projection part, it becomes possible to planarize hardening resin appropriately.

It is a figure which shows an electronic device manufacturing apparatus. It is the schematic which shows the printing part of a modeling unit. It is the schematic which shows the hardening part of a modeling unit. It is the schematic which shows the mounting part of a component mounting unit. It is a block diagram which shows a control apparatus. It is a schematic diagram for demonstrating the formation process of a structure. It is a schematic diagram for demonstrating the formation process of a structure. It is a schematic diagram for demonstrating the formation process of a structure. It is a schematic diagram for demonstrating the formation process of a structure. It is a schematic diagram for demonstrating the formation process of a structure. It is a schematic diagram for demonstrating the formation process of a structure. It is a schematic diagram for demonstrating the formation process of a structure. It is a schematic diagram for demonstrating the formation process of a structure. It is a schematic diagram for demonstrating the formation process of a structure. It is a schematic diagram for demonstrating the formation process of a structure.

FIG. 1 shows an electronic device manufacturing apparatus 10. The electronic device manufacturing apparatus (hereinafter sometimes abbreviated as “manufacturing apparatus”) 10 includes a transport apparatus 20, a modeling unit 22, a component mounting unit 24, and a control apparatus (see FIG. 5) 26. The conveying device 20, the modeling unit 22, and the component mounting unit 24 are disposed on the base 28 of the manufacturing apparatus 10. The base 28 has a generally rectangular shape. In the following description, the longitudinal direction of the base 28 is orthogonal to the X-axis direction, and the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction will be described as the Z-axis direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 5) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38. The Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 5) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 has a base 60, a holding device 62, and a lifting device 64. The base 60 is formed in a flat plate shape, and a circuit board or the like is placed on the upper surface. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edge portions in the X-axis direction of the circuit board or the like placed on the base 60 are sandwiched by the holding device 62, whereby the circuit board or the like is fixedly held. The lifting device 64 is disposed below the base 60 and lifts the base 60.

The modeling unit 22 is, for example, a unit that models a three-dimensional structure with an ultraviolet curable resin on a circuit board (see FIG. 2) 70 placed on the base 60 of the stage 52, and includes a printing unit 72 and a curing unit. Part 74. As shown in FIG. 2, the printing unit 72 includes an inkjet head 76, and discharges an ultraviolet curable resin onto the circuit board 70 placed on the base 60. Note that the inkjet head 76 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles to be discharged from a nozzle port.

The curing unit 74 includes a flattening device 78 and an irradiation device 80 as shown in FIG. The flattening device 78 flattens the upper surface of the ultraviolet curable resin discharged onto the circuit board 70 by the ink jet head 76. For example, the surface of the ultraviolet curable resin is smoothed while the surface of the ultraviolet curable resin is leveled. Alternatively, the thickness of the ultraviolet curable resin is made uniform by scraping with a blade. Further, the irradiation device 80 includes a mercury lamp or LED as a light source, and irradiates the ultraviolet curable resin discharged on the circuit board 70 with ultraviolet rays. Thereby, the ultraviolet curable resin discharged on the circuit board 70 is cured, and a three-dimensional structure is formed.

The component mounting unit 24 is, for example, a unit for mounting an electronic component (see FIG. 4) 82 on a circuit board 70 placed on the base 60 of the stage 52. As shown in FIG. And a mounting portion 88. The supply unit 86 includes a plurality of tape feeders 90 (see FIG. 5) for feeding out the taped electronic components 82 one by one, and supplies the electronic components 82 at the supply position. The supply unit 86 is not limited to the tape feeder 90, and may be a tray-type supply device that picks up and supplies the electronic component 82 from the tray. Further, the supply unit 86 may be configured to include both a tape type and a tray type, or other supply devices.

The mounting unit 88 includes a mounting head (see FIG. 5) 96 and a moving device (see FIG. 5) 98. As shown in FIG. 4, the mounting head 96 has a suction nozzle 100 for holding the electronic component 82. The moving device 98 moves the mounting head 96 between the supply position of the electronic component 82 by the tape feeder 90 and the circuit board 70 placed on the base 60. As a result, in the mounting portion 88, the electronic component 82 supplied from the tape feeder 90 is held by the suction nozzle 100, and the electronic component 82 held by the suction nozzle 100 is mounted on the circuit board 70. The mounting head 96 includes a nozzle lifting device (not shown) that lifts and lowers the suction nozzle 100 and a nozzle rotation device (not shown) that rotates the suction nozzle 100 about its axis. Thereby, the position of the electronic component 82 held by the suction nozzle 100 in the Z-axis direction and the holding posture of the electronic component 82 can be changed. The mounting head 96 also has an imaging device (not shown) for imaging the circuit board 70 and the tape feeder 90. Accordingly, it is possible to confirm the mounting position of the electronic component 82 on the circuit board 70, the supply position of the electronic component 82 by the tape feeder 90, and the like based on the imaging data.

The control device 26 includes a controller 102 and a plurality of drive circuits 104 as shown in FIG. The plurality of drive circuits 104 are connected to the

electromagnetic motors

38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the flattening device 78, the irradiation device 80, the tape feeder 90, the mounting head 96, and the moving device 98. Yes. The controller 102 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 104. Thereby, the operation of the transport device 20, the modeling unit 22, and the component mounting unit 24 is controlled by the controller 102.

<Operation of manufacturing equipment>
In the manufacturing apparatus 10, the electronic component 82 is mounted on the circuit board 70 with the above-described configuration, and the electronic component 82 is sealed with an ultraviolet curable resin. Specifically, the circuit board 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the modeling unit 22. In the modeling unit 22, the ultraviolet curable resin is discharged onto the circuit board 70 by the inkjet head 76. At this time, first, as shown in FIG. 6, the ultraviolet curable resin 110 a is discharged in a thin film shape onto the circuit board 70 by the inkjet head 76. In addition, the ultraviolet curable resin 110 a is discharged on the circuit board 70 in a generally “B” shape. The thin-film ultraviolet curable resin 110 a is flattened at the upper end by the flattening device 78, and the flattened ultraviolet curable resin 110 a is irradiated with ultraviolet rays by the irradiation device 80. As a result, the thin film ultraviolet curable resin 110a is cured.

When the ultraviolet curable resin 110a is cured, the ultraviolet curable resin 110b is discharged onto the ultraviolet curable resin 110a by the inkjet head 76 in a thin film shape. Then, the flattening of the ultraviolet curable resin 110b by the flattening device 78 and the curing of the ultraviolet curable resin 110b by the irradiation device 80 are performed. Further, the ultraviolet curable resin 110c is ejected in a thin film shape onto the ultraviolet curable resin 110b by the inkjet head 76, the flattening of the ultraviolet curable resin 110c by the flattening device 78, and the curing of the ultraviolet curable resin 110c by the irradiation device 80. And done. As described above, the ultraviolet curable resin is laminated, so that a three-dimensional structure 112 (hereinafter sometimes referred to as “cavity compartment”) that divides a cavity by four wall surfaces is formed on the circuit board 70. It is formed. In addition, the height dimension of this cavity division 112 is made higher than the height dimension of the electronic component 82 mentioned later.

When the cavity partition 112 is formed on the circuit board 70, the stage 52 is moved below the component mounting unit 24. In the component mounting unit 24, the electronic component 82 is supplied by the tape feeder 90, and the electronic component 82 is held by the suction nozzle 100 of the mounting head 96. Then, the electronic component 82 held by the suction nozzle 100 is mounted inside the cavity partition 112 of the circuit board 70 as shown in FIG.

When the electronic component 82 is mounted on the circuit board 70, the stage 52 is moved below the modeling unit 22. In the modeling unit 22, the ultraviolet curable resin is discharged into the cavity partition 112 by the inkjet head 76. Specifically, first, as shown in FIG. 8, the ultraviolet curable resin 114 is discharged into a thin film shape at a location where the electronic component 82 inside the cavity partition 112 is not mounted. Then, since the cavity partition 112 hinders the operation of the flattening device 78, the ultraviolet curable resin 114 is discharged into the cavity partition 112 by the irradiation device 80 without being flattened. Are irradiated with ultraviolet rays. Thereby, the ultraviolet curable resin of the location in which the electronic component 82 inside the cavity partition 112 is not mounted is hardened.

Next, as shown in FIG. 9, the ultraviolet curable resin is discharged in a thin film shape by the inkjet head 76 onto the electronic component 82 inside the cavity partition 112 and the cured ultraviolet curable resin 114. When the height of the ultraviolet curable resin 114 discharged into the cavity compartment 112 exceeds the upper end position of the cavity compartment 112, the upper end portion of the ultraviolet curable resin 114 is flattened by the flattening device 78. It becomes. At this time, as shown in FIG. 10, the upper end portion of the ultraviolet curable resin 114 is flattened by the flattening device 78 at the upper end position of the cavity partition 112. Accordingly, the upper end surface of the ultraviolet curable resin 114 and the upper end surface of the cavity partition 112 are flush with each other.

Then, when the flattening of the upper end portion of the ultraviolet curable resin 114 is completed, the ultraviolet curable resin 114 is irradiated with ultraviolet rays by the irradiation device 80, and the ultraviolet curable resin 114 is cured. Thereby, the electronic component 82 is sealed inside the three-dimensional structure formed of the ultraviolet curable resin. Thus, in the manufacturing apparatus 10, the electronic component 82 is mounted on the circuit board 70, and the electronic component 82 is sealed with the three-dimensional structure made of ultraviolet curable resin.

In the above description, the case where the electronic component 82 is mounted at an appropriate position inside the cavity partition 112 of the circuit board 70 has been described. However, as shown in FIG. 11, the electronic component 82 may be mounted at a position shifted from an appropriate position (dotted line in the figure). In such a case, as in the situation where the electronic component 82 is mounted at an appropriate position, when the ultraviolet curable resin 114 is discharged into the cavity partition 112, as shown in FIG. There are places where there are too many and too few places. Thereby, a part of the upper end portion of the ultraviolet curable resin 114 discharged into the cavity compartment 112 becomes considerably higher than the upper end surface of the cavity compartment 112, and the other part of the ultraviolet curable resin 114 becomes the cavity compartment. It becomes considerably lower than the upper end surface of 112. If the electronic component 82 is mounted at an appropriate position (dotted line in the figure), a small amount of ultraviolet curable resin 114 is applied on the electronic component 82 mounted at the appropriate position. This is because a large amount of the ultraviolet curable resin 114 is applied between the electronic component 82 and the cavity partition 112 mounted at various positions.

As described above, a part of the upper end portion of the ultraviolet curable resin 114 discharged into the cavity compartment 112 is considerably higher than the upper end surface of the cavity compartment 112, and the other part of the ultraviolet curable resin 114 becomes the cavity compartment. Even when it is considerably lower than the upper end surface of the object 112, the interior of the cavity object 112 is made of the ultraviolet curable resin 114 by being flattened by the flattening device 78 at the upper end position of the cavity object 112. Filled and the electronic component 82 is properly sealed. Specifically, the flattening device 78 scrapes the excess UV curable resin 114 at a location higher than the upper end surface of the cavity partition 112 to the planarization device 78 at the upper end position of the cavity partition 112. The excess UV curable resin 114 is filled in a portion lower than the upper end surface of the cavity partition 112. Thus, as shown in FIG. 10, the upper end portion of the ultraviolet curable resin 114 is made uniform with the upper end surface of the cavity partition 112, and the upper end surface of the ultraviolet curable resin 114 and the upper end surface of the cavity partition 112 are surfaces. Become one. As described above, even when the mounting position of the electronic component 82 is shifted from an appropriate position, the electronic component 82 can be appropriately sealed inside the three-dimensional structure formed of the ultraviolet curable resin. It becomes.

In the above description, the electronic component 82 is mounted on the circuit board 70, and the electronic component 82 is sealed with a three-dimensional structure made of an ultraviolet curable resin. It is also possible to seal predetermined parts with a three-dimensional structure formed of an ultraviolet curable resin. Specifically, for example, as shown in FIG. 13, the existing molded product 120 is placed on the base 60 of the stage 52. The molded product 120 is generally in the shape of a rectangular parallelepiped, and is formed with a recess 122 that opens to the upper end surface. That is, the molded product 120 has a bottomed quadrangular cylindrical shape, in other words, a bowl shape. A component 124 is placed in the recess 122 of the molded product 120.

When the molded product 120 containing the component 124 is placed on the base 60, the stage 52 is moved below the modeling unit 22. In the modeling unit 22, first, the ultraviolet curable resin 114 is discharged in a thin film shape by the inkjet head 76 onto a portion where the component 124 in the concave portion 122 of the molded product 120 is not placed. Then, since the molded product 120 hinders the operation of the flattening device 78, the ultraviolet curable resin 114 is not flattened and the ultraviolet curable resin 114 discharged into the concave portion 122 of the molded product 120 by the irradiation device 80. Are irradiated with ultraviolet rays. Thereby, the ultraviolet curable resin of the location in which the component 124 in the recessed part 122 of the molded object 120 is not mounted is hardened | cured.

Next, as shown in FIG. 14, the ultraviolet curable resin is discharged in a thin film shape by the inkjet head 76 onto the component 124 in the recess 122 of the molded product 120 and the cured ultraviolet curable resin 114. When the height of the ultraviolet curable resin 114 discharged into the concave portion 122 of the molded product 120 exceeds the upper end position of the molded product 120, the upper end portion of the ultraviolet curable resin 114 is flattened by the flattening device 78. It becomes. At this time, as shown in FIG. 15, the upper end portion of the ultraviolet curable resin 114 is flattened by the flattening device 78 at the upper end position of the molded product 120. Thereby, the upper end surface of the ultraviolet curable resin 114 and the upper end surface of the molded product 120 are flush with each other.

Then, when the flattening of the upper end portion of the ultraviolet curable resin 114 is completed, the ultraviolet curable resin 114 is irradiated with ultraviolet rays by the irradiation device 80, and the ultraviolet curable resin 114 is cured. Thereby, inside the existing molded object 120, the component 124 is sealed by the three-dimensional structure molded by the ultraviolet curable resin.

The controller 102 of the control device 26 includes an inkjet operation control unit 130 and a flattening device operation control unit 132, as shown in FIG. The ink jet operation control unit 130 is a functional unit for controlling the operation of the ink jet head 76 and discharging the ultraviolet curable resin into the cavity partition 112 or the molded product 120. The flattening device operation control unit 132 is a functional unit for controlling the operation of the flattening device 78 to flatten the upper end portion of the ultraviolet curable resin at the upper end position of the cavity partition 112 or the molded product 120.

Incidentally, in the above-described embodiment, the manufacturing apparatus 10 is an example of a forming apparatus. The control device 26 is an example of a control device. The circuit board 70 is an example of a base material. The ink jet head 76 is an example of an ejection device. The flattening device 78 is an example of a flattening device. The electronic component 82 is an example of a component. The cavity partition 112 is an example of a protrusion. The molded product 120 is an example of a protrusion. The part 124 is an example of a part. The ink jet operation control unit 130 is an example of a discharge device operation control unit. The flattening device operation control unit 132 is an example of a flattening device operation control unit.

In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. For example, in the above embodiment, the components in the cavity such as the inside of the cavity partition 112 and the inside of the concave portion 122 of the molded product 120 are sealed with a three-dimensional structure made of an ultraviolet curable resin. It is possible to place a component such as the electronic component 82 on the side of the non-membered member and seal the component with a three-dimensional structure made of an ultraviolet curable resin.

Further, in the above embodiment, an ultraviolet curable resin that is cured by irradiation with ultraviolet rays is employed, but various curable resins such as a thermosetting resin that is cured by heat can be employed.

10: Manufacturing device (forming device) 26: Control device 70: Circuit board (base material) 76: Inkjet head (ejection device) 78: Flattening device 82: Electronic component (component) 112: Cavity partition (projection) 120 : Molded product (projection) 124: Parts 130: Inkjet operation control unit (discharge device operation control unit) 132: Flattening device operation control unit

Claims

In a forming method of forming a structure with a curable resin using a discharge device that discharges the curable resin,
The forming method is
On the base material on which the protruding portion is disposed, a mounting step of mounting a component having a smaller dimension in the height direction than the protruding portion;
A discharge step of discharging a curable resin by the discharge device on the base material so as to cover the components placed in the placement step;
When the height of the curable resin discharged in the discharge step exceeds the upper end position of the protrusion, the upper end of the curable resin discharged in the discharge step is flattened at the upper end position of the protrusion. And a planarization step.
The protrusion is
The forming method according to claim 1, wherein the curable resin discharged onto the substrate by the discharge device is cured.
The protrusion is
The forming method according to claim 1, wherein the forming method is preformed and placed on the base material.
A discharge device for discharging a curable resin;
In a forming apparatus comprising a flattening device for flattening the curable resin discharged by the discharge device, and a control device for controlling the operation of the discharge device and the flattening device, and forming a structure made of the curable resin,
The control device is
Discharge that discharges the curable resin by the discharge device so as to cover the component on the base material on which the component having a protrusion with a smaller dimension in the height direction is placed. A device operation control unit;
When the height of the curable resin discharged by the discharge device exceeds the upper end position of the protrusion, the upper end of the curable resin discharged by the discharge device is flattened at the upper end position of the protrusion. A forming apparatus, comprising: a flattening device operation control unit configured to flatten by the apparatus.