JPWO2021214813A1 - - Google Patents
Info
- Publication number
- JPWO2021214813A1 JPWO2021214813A1 JP2022516470A JP2022516470A JPWO2021214813A1 JP WO2021214813 A1 JPWO2021214813 A1 JP WO2021214813A1 JP 2022516470 A JP2022516470 A JP 2022516470A JP 2022516470 A JP2022516470 A JP 2022516470A JP WO2021214813 A1 JPWO2021214813 A1 JP WO2021214813A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/017010 WO2021214813A1 (en) | 2020-04-20 | 2020-04-20 | Circuit forming method and circuit forming device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021214813A1 true JPWO2021214813A1 (en) | 2021-10-28 |
Family
ID=78270903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022516470A Pending JPWO2021214813A1 (en) | 2020-04-20 | 2020-04-20 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2021214813A1 (en) |
| WO (1) | WO2021214813A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023148888A1 (en) * | 2022-02-03 | 2023-08-10 | 株式会社Fuji | Electrical circuit forming method and electrical circuit forming apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209217A (en) * | 1997-01-24 | 1998-08-07 | Matsushita Electric Ind Co Ltd | Method for mounting work with bumps |
| JP2010199621A (en) * | 2010-05-31 | 2010-09-09 | Murata Mfg Co Ltd | Multilayer ceramic substrate |
| WO2016147284A1 (en) * | 2015-03-16 | 2016-09-22 | 富士機械製造株式会社 | Formation method and formation device |
| WO2019193644A1 (en) * | 2018-04-03 | 2019-10-10 | 株式会社Ｆｕｊｉ | Three-dimensional structure formation method and three-dimensional structure formation device |
-
2020
- 2020-04-20 WO PCT/JP2020/017010 patent/WO2021214813A1/en active Application Filing
- 2020-04-20 JP JP2022516470A patent/JPWO2021214813A1/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209217A (en) * | 1997-01-24 | 1998-08-07 | Matsushita Electric Ind Co Ltd | Method for mounting work with bumps |
| JP2010199621A (en) * | 2010-05-31 | 2010-09-09 | Murata Mfg Co Ltd | Multilayer ceramic substrate |
| WO2016147284A1 (en) * | 2015-03-16 | 2016-09-22 | 富士機械製造株式会社 | Formation method and formation device |
| WO2019193644A1 (en) * | 2018-04-03 | 2019-10-10 | 株式会社Ｆｕｊｉ | Three-dimensional structure formation method and three-dimensional structure formation device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021214813A1 (en) | 2021-10-28 |
Similar Documents
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