JPWO2021181561A1 - - Google Patents

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Publication number
JPWO2021181561A1
JPWO2021181561A1 JP2022507077A JP2022507077A JPWO2021181561A1 JP WO2021181561 A1 JPWO2021181561 A1 JP WO2021181561A1 JP 2022507077 A JP2022507077 A JP 2022507077A JP 2022507077 A JP2022507077 A JP 2022507077A JP WO2021181561 A1 JPWO2021181561 A1 JP WO2021181561A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022507077A
Other languages
Japanese (ja)
Other versions
JP7316742B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021181561A1 publication Critical patent/JPWO2021181561A1/ja
Application granted granted Critical
Publication of JP7316742B2 publication Critical patent/JP7316742B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022507077A 2020-03-11 2020-03-11 Manufacturing method of mounting board by 3D additive manufacturing Active JP7316742B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/010522 WO2021181561A1 (en) 2020-03-11 2020-03-11 Manufacturing method for mounting substrate by three-dimensional laminate molding

Publications (2)

Publication Number Publication Date
JPWO2021181561A1 true JPWO2021181561A1 (en) 2021-09-16
JP7316742B2 JP7316742B2 (en) 2023-07-28

Family

ID=77671320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022507077A Active JP7316742B2 (en) 2020-03-11 2020-03-11 Manufacturing method of mounting board by 3D additive manufacturing

Country Status (2)

Country Link
JP (1) JP7316742B2 (en)
WO (1) WO2021181561A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023210021A1 (en) * 2022-04-29 2023-11-02 株式会社Fuji Application information generation method, information processing apparatus, and three-dimensional modeling apparatus
WO2024101211A1 (en) * 2022-11-09 2024-05-16 株式会社村田製作所 Method for producing ceramic electronic component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016147284A1 (en) * 2015-03-16 2016-09-22 富士機械製造株式会社 Formation method and formation device
WO2018138755A1 (en) * 2017-01-24 2018-08-02 株式会社Ｆｕｊｉ Circuit forming method and circuit forming device
WO2019193644A1 (en) * 2018-04-03 2019-10-10 株式会社Ｆｕｊｉ Three-dimensional structure formation method and three-dimensional structure formation device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100735411B1 (en) 2005-12-07 2007-07-04 삼성전기주식회사 Method For Forming Printed Wiring Board and Printed Wiring Board Thus Obtained
KR20160023874A (en) 2013-06-24 2016-03-03 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 Printed three-dimensional (3d) functional part and method of making
GB2538522B (en) 2015-05-19 2019-03-06 Dst Innovations Ltd Electronic circuit and component construction

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016147284A1 (en) * 2015-03-16 2016-09-22 富士機械製造株式会社 Formation method and formation device
WO2018138755A1 (en) * 2017-01-24 2018-08-02 株式会社Ｆｕｊｉ Circuit forming method and circuit forming device
WO2019193644A1 (en) * 2018-04-03 2019-10-10 株式会社Ｆｕｊｉ Three-dimensional structure formation method and three-dimensional structure formation device

Also Published As

Publication number Publication date
WO2021181561A1 (en) 2021-09-16
JP7316742B2 (en) 2023-07-28

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