WO2016146323A3 - Chip assembly and method for forming a contact connection - Google Patents

Chip assembly and method for forming a contact connection Download PDF

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Publication number
WO2016146323A3
WO2016146323A3 PCT/EP2016/053169 EP2016053169W WO2016146323A3 WO 2016146323 A3 WO2016146323 A3 WO 2016146323A3 EP 2016053169 W EP2016053169 W EP 2016053169W WO 2016146323 A3 WO2016146323 A3 WO 2016146323A3
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WO
WIPO (PCT)
Prior art keywords
chip
material strip
forming
paste
conductor material
Prior art date
Application number
PCT/EP2016/053169
Other languages
German (de)
French (fr)
Other versions
WO2016146323A2 (en
Inventor
Heinrich LÜDEKE
Ricardo GEELHAAR
Original Assignee
Pac Tech - Packaging Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pac Tech - Packaging Technologies Gmbh filed Critical Pac Tech - Packaging Technologies Gmbh
Priority to CN201680015610.6A priority Critical patent/CN107431058A/en
Priority to JP2017548176A priority patent/JP2018511175A/en
Priority to US15/557,591 priority patent/US20180047697A1/en
Priority to KR1020177026415A priority patent/KR102082037B1/en
Priority to EP16706510.1A priority patent/EP3271938A2/en
Priority to TW105106213A priority patent/TWI625801B/en
Publication of WO2016146323A2 publication Critical patent/WO2016146323A2/en
Publication of WO2016146323A3 publication Critical patent/WO2016146323A3/en
Priority to HK18105700.0A priority patent/HK1246503A1/en

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    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

Abstract

The invention relates to a chip arrangement (10) and a method for forming a contact connection (11) between a chip (18), in particular a power transistor or the like, and a conductor material strip (14), said conductor material strip being formed on a non-conductive substrate (12) and the chip being arranged on the substrate or on a conductor material strip (15). A silver paste (29) or copper paste is applied to a chip contact surface (25) of the chip and of the conductor material strip (28), a contact conductor (30) is dipped into the silver paste or the copper paste on the chip contact surface and into the silver paste or the copper paste on the conductor material strip, and a solvent contained in the silver paste or the copper paste is at least partially evaporated by heating. The silver paste or the copper paste is then sintered by means of laser energy, thereby forming the contact connection.
PCT/EP2016/053169 2015-03-16 2016-02-15 Chip assembly and method for forming a contact connection WO2016146323A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN201680015610.6A CN107431058A (en) 2015-03-16 2016-02-15 Chip apparatus and the method for forming contact connecting portion
JP2017548176A JP2018511175A (en) 2015-03-16 2016-02-15 Chip arrangement and method for forming contact connections
US15/557,591 US20180047697A1 (en) 2015-03-16 2016-02-15 Chip arrangement and method for forming a contact connection
KR1020177026415A KR102082037B1 (en) 2015-03-16 2016-02-15 How to form a chip arrangement and contact connections
EP16706510.1A EP3271938A2 (en) 2015-03-16 2016-02-15 Chip assembly and method for forming a contact connection
TW105106213A TWI625801B (en) 2015-03-16 2016-03-01 Chip arrangement and method for forming a contact connection
HK18105700.0A HK1246503A1 (en) 2015-03-16 2018-05-03 Chip arrangement and method for forming a contact connection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015103779.3A DE102015103779A1 (en) 2015-03-16 2015-03-16 Chip arrangement and method for forming a contact connection
DE102015103779.3 2015-03-16

Publications (2)

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WO2016146323A2 WO2016146323A2 (en) 2016-09-22
WO2016146323A3 true WO2016146323A3 (en) 2016-11-03

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EP (1) EP3271938A2 (en)
JP (1) JP2018511175A (en)
KR (1) KR102082037B1 (en)
CN (1) CN107431058A (en)
DE (1) DE102015103779A1 (en)
HK (1) HK1246503A1 (en)
TW (1) TWI625801B (en)
WO (1) WO2016146323A2 (en)

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Publication number Publication date
EP3271938A2 (en) 2018-01-24
CN107431058A (en) 2017-12-01
DE102015103779A1 (en) 2016-09-22
HK1246503A1 (en) 2018-09-07
TWI625801B (en) 2018-06-01
KR102082037B1 (en) 2020-04-29
JP2018511175A (en) 2018-04-19
WO2016146323A2 (en) 2016-09-22
KR20170126469A (en) 2017-11-17
US20180047697A1 (en) 2018-02-15
TW201642366A (en) 2016-12-01

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