WO2016141704A1 - Oled显示母板、封装系统及其封装方法 - Google Patents

Oled显示母板、封装系统及其封装方法 Download PDF

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Publication number
WO2016141704A1
WO2016141704A1 PCT/CN2015/089760 CN2015089760W WO2016141704A1 WO 2016141704 A1 WO2016141704 A1 WO 2016141704A1 CN 2015089760 W CN2015089760 W CN 2015089760W WO 2016141704 A1 WO2016141704 A1 WO 2016141704A1
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WIPO (PCT)
Prior art keywords
oled display
package cover
mother board
hot melt
oled
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Ceased
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PCT/CN2015/089760
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English (en)
French (fr)
Inventor
白雪飞
崔富毅
杨久霞
李发顺
阮士薪
肖昂
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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Priority to US14/912,252 priority Critical patent/US20170040568A1/en
Publication of WO2016141704A1 publication Critical patent/WO2016141704A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques

Definitions

  • the invention belongs to the technical field of organic electroluminescence display, and particularly relates to an OLED display mother board, a packaging system and a packaging method thereof.
  • OLED Organic Light-Emitting Diode
  • Organic layer materials that are extremely sensitive to moisture and oxygen are present in current OLED devices, which greatly reduces the lifetime of OLED devices.
  • the prior art mainly uses various materials to isolate the organic layer material of the OLED from the outside, so that the sealing property reaches the following standard, that is, the water vapor amount is less than 10 -6 g/m 2 /day, and the oxygen amount is less than 10 -3 cm 3 /m 2 /day.
  • the main sealing method includes: placing an OLED substrate including a plurality of display areas on a machine of the bonding machine; and coating a peripheral area on the package cover that is bonded to the OLED substrate UV glue, coating the glass frit on the packaging area around the display area on the OLED substrate; then vacuuming the environment where the bonding machine is located, and bonding the package cover to the OLED substrate to form an OLED display mother board After the bonding is completed, the environment is evacuated to a vacuum state, and then the laminated package cover and the OLED substrate are placed in an atmosphere. At this time, the peripheral area of the package cover is irradiated with a UV lamp to cure the UV glue at the position.
  • the laser light is then emitted at a position where the frit is located such that the OLED substrate of the OLED panel corresponding to each display area is attached to the package substrate, and then each OLED panel is formed by cutting the OLED display mother board in accordance with each package area.
  • the inventors have found that at least the following problems exist in the prior art: before the UV lamp is applied to the peripheral region of the package cover, the UV glue in the box has a pressure difference between the UV glue in the atmosphere and the atmosphere, resulting in the UV glue here. Easy to be "punctured” so that the outside air enters the box, and at this time the frit is not cured, resulting in OLED devices are contaminated.
  • the technical problem to be solved by the present invention includes providing an OLED display mother board with good sealing performance, a packaging method thereof, and a packaging system for the above problems existing in the sealing of the existing OLED display mother board.
  • the technical solution adopted to solve the technical problem of the present invention is an OLED display mother board, including a package cover plate and an OLED substrate facing each other, and a sealant is disposed between the package cover plate and the OLED substrate, The sealant is disposed in a peripheral region of the OLED display mother board, and the sealant includes a hot melt adhesive.
  • the hot melt adhesive is any one of an EVA hot melt adhesive, a polyester hot melt adhesive, and a hot melt seal adhesive.
  • the intermediate region of the OLED display mother board has a plurality of display regions and a package region surrounding each of the display regions, at a position corresponding to the package region between the package cover plate and the OLED substrate Set with sealant.
  • the material of the sealant is a frit.
  • the technical solution adopted to solve the technical problem of the present invention is a packaging system comprising a sealant wiring device, the sealant wiring device comprising: a first carrier machine for carrying a package cover; and a wiring mechanism for The sealant is routed to a peripheral region of the package cover, the sealant comprising a hot melt adhesive.
  • the wiring mechanism includes: a collecting unit, a tray, a plurality of fixing posts disposed on the tray, and a driver.
  • the collecting unit is configured to collect a positional relationship between each fixing post and a reference point on the package cover to be wired.
  • the driver is configured to adjust each fixed column in a corresponding initial active area on the tray according to a positional relationship between the fixed post collected by the collecting unit and a reference point on the package cover to be wired, and
  • Each of the fixing posts is driven to be routed by hot melt adhesive in a peripheral region of the package cover.
  • the collecting unit comprises a plurality of cameras corresponding to the plurality of fixing columns, and each camera is fixed on a fixed column corresponding thereto.
  • each fixed column is adjacent to the first carrier machine
  • the end is further provided with a heating head for preheating at least part of the hot melt adhesive after the wiring is completed by using hot melt adhesive in the peripheral region of the package cover.
  • the number of the fixing columns is four, and the four fixing columns are respectively disposed at four corner positions of the tray.
  • the packaging system further includes a bonding device, the bonding device includes: a second carrier platform, the second carrier platform is configured to carry an OLED display motherboard; and a heating unit, the heating unit After forming the OLED display mother board on the package cover and the OLED substrate, the peripheral area of the package cover is heated.
  • the bonding device includes: a second carrier platform, the second carrier platform is configured to carry an OLED display motherboard; and a heating unit, the heating unit After forming the OLED display mother board on the package cover and the OLED substrate, the peripheral area of the package cover is heated.
  • the heating unit is an electric resistance bar.
  • the bonding apparatus further includes a pressing unit for pressing the peripheral region of the OLED display mother board after the package cover and the OLED substrate are formed into the OLED display mother board.
  • the press unit is a flexible material.
  • the technical solution adopted for solving the technical problem of the present invention is a packaging method of an OLED display mother board, which comprises the steps of: wiring with a hot melt adhesive in a peripheral region of the package cover; and encapsulating the cover plate and the OLED that complete the above steps
  • the substrate is paired to form an OLED display mother board; and the peripheral area of the OLED display mother board is heated to seal the package cover sheet from the OLED substrate.
  • the step of using the hot melt adhesive to perform wiring in a peripheral region of the package cover comprises: determining a position of a plurality of reference points in a peripheral region of the package cover, and determining a plurality of reference points to be routed through the hot melt adhesive. The positional relationship between the regions is routed through the hot melt adhesive in the peripheral region of the package cover.
  • the packaging method further comprises: preheating a region of the plurality of reference points of the package cover plate which is completed by the hot melt adhesive in the peripheral region, In order to pre-bond the hot melt adhesive to the package cover.
  • the number of the plurality of reference points may be four.
  • the heating temperature for preheating the region where the plurality of reference points are located may be 95 ⁇ 5° C.
  • the heating of the peripheral region of the OLED display mother board is performed
  • the thermal temperature range is 95 ⁇ 5 °C.
  • the packaging method further comprises: pressing a peripheral region of the OLED display mother board by a pressing unit.
  • the package cover plate and the OLED substrate are sealed by hot melt adhesive, so that the sealing performance of the OLED display mother board formed by the two boxes is better.
  • the package cover plate of the OLED display mother board and the OLED substrate are sealed by using hot melt adhesive. Since the hot melt adhesive is cheaper than the UV adhesive, the hot melt adhesive wiring process is simple and easy. The realization, and the curing process is not required after the package cover and the OLED substrate are completed, thereby saving cost and improving production efficiency.
  • the packaging system of the embodiment of the invention has a simple structure and can perfectly seal the package cover plate and the OLED substrate, so that the performance of the sealed OLED display mother board is better.
  • FIG. 1 is a schematic diagram of a package cover plate of an OLED display mother board according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of an OLED substrate of an OLED display mother board according to an embodiment of the present invention.
  • FIG 3 is a schematic view of a sealant wiring apparatus in a package system according to an embodiment of the present invention.
  • FIG. 4 is a schematic view of a wiring mechanism in the sealant wiring device shown in FIG.
  • Figure 5 is a schematic illustration of a bonding apparatus in a package system in accordance with an embodiment of the present invention.
  • an embodiment of the present invention provides an OLED display.
  • a mother board comprising a package cover 10 and an OLED substrate 20 opposite to each other, and a sealant disposed between the package cover 10 and the OLED substrate 20, the sealant being disposed at a periphery of the OLED display mother board In the region, the sealant comprises a hot melt adhesive 11.
  • the hot melt adhesive 11 is used for sealing between the package cover 10 and the OLED substrate 20, and the adhesive property of the hot melt adhesive 11 itself is more than that of the UV adhesive. Therefore, the package cover 10 and the OLED substrate 20 can be well sealed, which can effectively prevent particles and impurities in the external environment from entering the OLED display mother board, thereby avoiding contamination of the devices in the OLED display mother board, thereby avoiding The OLED display mother board has a low bonding yield problem.
  • the hot melt adhesive 11 in the present embodiment is any one of EVA (ethylene and vinyl acetate copolymer) hot melt adhesive, polyester hot melt adhesive, and hot melt seal adhesive.
  • EVA ethylene and vinyl acetate copolymer
  • the hot melt adhesive 11 in this embodiment is not limited to the above-mentioned types, and may be other hot melt adhesives similar to the above materials, and will not be described in detail herein.
  • the intermediate area of the OLED display mother board has a plurality of display areas 21 and a package area 22 surrounding the display area, and the package cover 10 and the OLED substrate 20 correspond to the package.
  • a sealant is provided at the location of the zone 22.
  • the material of the sealant is a frit.
  • the package cover 10 and the OLED substrate 20 are sealed by the hot melt adhesive 11, so that the sealing performance of the OLED display mother board formed by the two is better.
  • FIGS. 3 and 4 another embodiment of the present invention provides a package system including a sealant wiring apparatus including: a first carrier machine 30 for carrying a package cover 10 And a wiring mechanism 40 for routing the hot melt adhesive 11 to a peripheral region of the package cover 10.
  • the sealant wiring device included in the package system is better sealed by encapsulating the hot melt adhesive 11 to the peripheral region of the package cover 10 so that the package cover 10 and the OLED substrate 20 are placed on the package.
  • the wiring mechanism 40 of the present embodiment includes a collecting unit 43, a tray 41, a plurality of fixing posts 42 provided on the tray 41, and a driver (not shown).
  • the collecting unit 43 is configured to collect each of the fixing posts 42 and the package cover 10 to be wired. The positional relationship between the reference points on the top.
  • the driver is used for the corresponding initial active area on the tray 41 according to the positional relationship between the fixed post 42 collected by the collecting unit 43 and the reference point on the package cover 10 to be wired (the initial active area refers to The area where each of the fixing posts 42 allows the fixing post 42 to move when the initial position on the tray is adjusted to an appropriate initial position corresponding to the reference point, that is, the area A) circled as shown in the figure
  • the fixing post 42 is adjusted to be in an appropriate initial position, and is used to drive each of the fixing posts 42 to be routed with a hot melt adhesive 11 in a peripheral region of the package cover 10.
  • the acquisition unit 43 of the present embodiment includes a plurality of cameras in one-to-one correspondence with the plurality of fixing posts 42, each of which is fixed to a corresponding fixing post 42 corresponding thereto.
  • a heating head 44 is further disposed at an end of each of the fixing posts 42 adjacent to the first carrier table 30, and the heating head 44 is used after the wiring is completed by using the hot melt adhesive 11 in the peripheral region of the package cover 10. At least a portion of the hot melt adhesive 11 is heated to pre-bond the hot melt adhesive 11 to the peripheral region of the package cover 10.
  • the number of the fixing posts 42 is four, and the four fixing posts 42 are respectively disposed at the four corners of the tray 41, and the number of cameras corresponding thereto is also four.
  • the wiring mechanism The structure of 40 is simple and easy to operate.
  • the packaging system of this embodiment may further include: a bonding device, the bonding device comprising: a second carrier platform 50 and a heating unit 51.
  • the second carrier platform 50 is configured to carry an OLED display mother board, and the OLED display mother board is formed by the package cover 10 and the OLED substrate 20 which are completed by using the hot melt adhesive 11 to form a box.
  • the heating unit 51 is configured to heat the peripheral area of the package cover 10 after the package cover 10 and the OLED substrate 20 form a OLED display mother board, so that the package cover 10 and the OLED substrate 20 are sufficiently adhered. In order to obtain an OLED display mother board with good sealing properties.
  • the heating unit 51 of the present embodiment is an electric resistance bar.
  • the heating unit 51 of the present embodiment is not limited to the electric resistance bar, and other devices having a heating function may be used. Many devices having a heating function in the prior art are not described in detail herein.
  • the bonding apparatus further includes a pressing unit 52, and the pressing unit
  • the element 52 is used to press the peripheral area of the OLED display mother board after the package cover 10 and the OLED substrate 20 form a OLED display mother board, so that the package cover 10 and the OLED substrate 20 are sufficiently adhered to An OLED display mother board having good sealing properties is obtained.
  • the nip unit 52 is a flexible material. The flexible material has a soft texture, and the pressing of the peripheral region of the OLED display mother board does not cause damage to the OLED display mother board due to excessive pressure.
  • Another embodiment of the present invention provides a packaging method for packaging an OLED display mother board.
  • the OLED display mother board may be the OLED display mother board described in the foregoing embodiments, and the packaging method may be applied to the foregoing.
  • the packaging method includes the following steps S01 to S03.
  • step S01 the hot melt adhesive 11 is used to perform wiring in the peripheral region of the package cover 10.
  • the step specifically includes: first placing the package cover 10 on the first carrier platform 30, determining the positions of the plurality of reference points in the peripheral area of the package cover 10, and determining a plurality of reference points and the hot melt adhesive 11 to be passed.
  • the positional relationship between the areas of the wiring, and the wiring of the package cover 10 is performed by using the hot melt adhesive 11; after that, the plurality of reference points of the package cover 10 which are completed by the hot melt adhesive 11 in the peripheral area are disposed.
  • Heat up In this step, the hot melt adhesive 11 is heated at a range of 95 ⁇ 5 ° C (that is, the softening point of the hot melt adhesive 11).
  • Preheating the plurality of reference point locations in this step may cause the hot melt adhesive 11 to be pre-bonded to the plurality of reference point locations of the package cover 10 to avoid voids between the package cover 10 and the hot melt adhesive 11.
  • the number of reference points is four.
  • Step S02 The package cover 10 and the OLED substrate 20 that complete the above steps are paired in a vacuum environment to form an OLED display mother board.
  • the OLED substrate 20 is first disposed on the second carrier platform 50, and the package cover 10 that has been wired in step S01 is mechanically aligned with the OLED substrate 20 by a robot, and then accurately aligned.
  • the alignment method is consistent with the existing method of aligning the OLED substrate 20 with the package cover 10, and thus will not be described in detail herein.
  • Step S03 performing a peripheral area of the OLED display mother board in a vacuum environment. Heating is performed to seal the package cover 10 from the OLED substrate 20.
  • the peripheral region of the OLED display mother board is heated, that is, the side of the OLED substrate 20 away from the package cover 10 is heated, wherein, at 95 ⁇ 5 ° C (that is, the hot melt adhesive 11 ).
  • the hot melt adhesive 11 is heated within the softening point to sufficiently bond the package cover 10 to the OLED substrate 20.
  • nitrogen is introduced into the environment of the OLED display mother board.
  • the encapsulation method further includes: pressing a peripheral region of the OLED display mother board by using a pressing unit, that is, pressing a pressing unit on a side of the package cover 10 away from the OLED substrate 20, thereby making the package cover 10 is more fully bonded to the OLED substrate 20, wherein the press unit is made of a flexible material to prevent breakage of the package cover during the pressing process.
  • the package cover 10 of the OLED display mother board and the OLED substrate 20 are sealed by using the hot melt adhesive 11.
  • the hot melt adhesive 11 is cheaper than the UV adhesive, and the wiring of the hot melt adhesive 11 is used. The process is simple, easy to implement, and does not require a curing process after the package cover 10 and the OLED substrate 20 are completed, thereby saving cost and improving production efficiency.

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  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED显示母板、封装系统及其封装方法，属于有机电致发光显示技术领域，其可解决现有的OLED显示母板的密封性能不好的问题。该OLED显示母板包括相互对盒的封装盖板（10）和OLED基板（20），在所述封装盖板（10）与所述OLED基板（20）之间设置有密封胶，所述密封胶设置在OLED显示母板的周边区域，所述密封胶包括热熔胶（11）。

Description

OLED显示母板、封装系统及其封装方法 技术领域
本发明属于有机电致发光显示技术领域，具体涉及OLED显示母板、封装系统及其封装方法。
背景技术
有机电致发光显示(Organic Light-Emitting Diode；OLED)器件作为一种新型的平板显示器件，由于具有主动发光、发光亮度高、视角宽、响应速度快、能耗低以及可柔性化等特点，受到了越来越多的关注，成为可能取代液晶显示的下一代显示技术。
目前的OLED器件中存在对于水汽和氧气极为敏感的有机层材料，这使得OLED器件的寿命大大降低。为了解决这个问题，现有技术中主要是利用各种材料将OLED的有机层材料与外界隔离，使得密封性达到以下标准，即，水汽量小于10-6g/m2/天，氧气量小于10-3cm3/m2/天。现有技术中，主要的密封方法包括：将包括多个显示区的OLED基板放置在贴合机的机台上；将与该OLED基板进行贴合的封装盖板上的周边区域涂布一圈UV胶，在与OLED基板上各个显示区周边的封装区上涂布玻璃料；随后将贴合机所处的环境抽真空，将封装盖板与OLED基板相贴合，以形成OLED显示母板；贴合完毕后，将该环境通入氮气解除真空状态，然后将贴合后的封装盖板与OLED基板置于大气环境中。此时，对封装盖板的周边区域采用UV灯照射，使得该位置的UV胶固化。然后在对玻璃料所在位置发射激光，使得对应于每一个显示区的OLED面板的OLED基板与封装基板相贴合，随后通过将OLED显示母板按照各个封装区切割来形成各OLED面板。
发明人发现现有技术中至少存在如下问题：在对封装盖板的周边区域采用UV灯照射之前，由于处于盒内的UV胶与大气环境中的UV胶存在压力差，导致此处的UV胶容易被“穿刺”使得外界的气体进入盒内，而此时玻璃料也没有被固化，从而导致 OLED器件被污染。
发明内容
本发明所要解决的技术问题包括，针对现有的OLED显示母板在密封时存在的上述问题，提供密封性能好的OLED显示母板及其封装方法、封装系统。
解决本发明技术问题所采用的技术方案是一种OLED显示母板，包括相互对盒的封装盖板和OLED基板，在所述封装盖板与所述OLED基板之间设置有密封胶，所述密封胶设置在OLED显示母板的周边区域，所述密封胶包括热熔胶。
优选的是，所述热熔胶为EVA热熔胶、聚酯类热熔剂、热熔密封性胶粘剂中的任意一种。
优选的是，所述OLED显示母板的中间区域具有多个显示区和围绕每个显示区的封装区，在所述封装盖板与所述OLED基板之间对应于所述封装区的位置处设置有封框胶。
进一步优选的是，所述封框胶的材料为玻璃料。
解决本发明技术问题所采用的技术方案是一种封装系统，其包括密封胶布线设备，所述密封胶布线设备包括：第一承载机台，用于承载封装盖板；以及布线机构，用于将密封胶布线至封装盖板的周边区域，所述密封胶包括热熔胶。
优选的是，所述布线机构包括：采集单元、托盘、设置在托盘上的多个固定柱、以及驱动器。所述采集单元用于采集各个固定柱与待布线的封装盖板上的参考点之间的位置关系。所述驱动器用于根据所述采集单元采集的固定柱与待布线的封装盖板上的参考点之间的位置关系，在托盘上的对应初始活动区域内对各个固定柱进行调整，以及用于驱动各个固定柱在所述封装盖板的周边区域采用热熔胶进行布线。
进一步优选的是，所述采集单元包括与多个固定柱一一对应的多个摄像头，每个摄像头固定在与其对应的一个固定柱上。
进一步优选的是，在每个固定柱靠近所述第一承载机台的一 端还设置有加热头，其用于在所述封装盖板的周边区域采用热熔胶进行布线完成之后，对至少部分热熔胶进行预加热。
进一步优选的是，所述固定柱的个数为四个，所述四个固定柱分别设置在所述托盘的四角位置。
优选的是，所述封装系统还包括贴合设备，所述贴合设备包括：第二承载机台，所述第二承载机台用于承载OLED显示母板；以及加热单元，所述加热单元用于在封装盖板与OLED基板对盒形成OLED显示母板之后，对所述封装盖板的周边区域进行加热。
进一步优选的是，所述加热单元为电热阻条。
进一步优选的是，所述贴合设备还包括压合单元，其用于在封装盖板与OLED基板对盒形成OLED显示母板之后，对所述OLED显示母板的周边区域进行压合。
更进一步优选的是，所述压合单元为柔性材料。
解决本发明技术问题所采用的技术方案是一种OLED显示母板的封装方法，其包括如下步骤：采用热熔胶在封装盖板的周边区域进行布线；将完成上述步骤的封装盖板与OLED基板对盒，形成OLED显示母板；以及对OLED显示母板的周边区域进行加热，以使封装盖板与OLED基板密封。
优选的是，所述采用热熔胶在封装盖板的周边区域进行布线的步骤包括：确定封装盖板的周边区域多个参考点的位置，以及确定多个参考点与待通过热熔胶布线的区域之间的位置关系，并通过热熔胶在封装盖板的周边区域进行布线。
优选的是，在将封装盖板与OLED基板对盒的步骤之前，所述封装方法还包括：对通过热熔胶在周边区域布线完成的封装盖板的多个参考点所在区域进行预加热，以使热熔胶与封装盖板预粘结。
在所述封装方法中，所述多个参考点的数量可以为四个。
在所述封装方法中，对所述多个参考点所在区域进行预加热的加热温度范围可以为95±5℃。
优选的是，所述对OLED显示母板的周边区域进行加热的加 热温度范围为95±5℃。
优选的是，在所述对OLED显示母板的周边区域进行加热的步骤之后，所述封装方法还包括：采用压合单元对OLED显示母板的周边区域进行压合。
本发明实施例的OLED显示母板中，通过热熔胶对封装盖板与OLED基板进行密封，使得两者对盒形成的OLED显示母板的密封性能更好。
本发明实施例的封装方法中，采用热熔胶对OLED显示母板的封装盖板和OLED基板进行密封，由于热熔胶较UV胶而言，价格便宜，而且热熔胶布线工艺简单、易于实现，且在封装盖板和OLED基板对盒完成后无需固化工艺，因此可以节约成本、提高生产效率。
本发明实施例的封装系统结构简单，并且能够使得封装盖板和OLED基板完美密封，从而使密封形成的OLED显示母板的性能更好。
附图说明
图1为本发明的实施例的OLED显示母板的封装盖板的示意图。
图2为本发明的实施例的OLED显示母板的OLED基板的示意图。
图3为本发明的实施例的封装系统中的密封胶布线设备的示意图。
图4为图3所示的密封胶布线设备中的布线机构的示意图。
图5为本发明的实施例的封装系统中的贴合设备的示意图。
具体实施方式
为使本领域技术人员更好地理解本发明的技术方案，下面结合附图和具体实施方式对本发明作进一步详细描述。
参照图1和图2，本发明的一个实施例提供一种OLED显示 母板，其包括相互对盒的封装盖板10和OLED基板20，在所述封装盖板10与所述OLED基板20之间设置有密封胶，所述密封胶设置在OLED显示母板的周边区域，所述密封胶包括热熔胶11。
在本实施例的OLED显示母板的周边区域中，由于在封装盖板10和OLED基板20之间采用热熔胶11进行密封，并且热熔胶11本身的粘合性能较UV胶而言更好，因此能够将封装盖板10与OLED基板20很好地密封，可以有效地避免外界环境中的颗粒、杂质进入到OLED显示母板内部，避免污染OLED显示母板中的器件，从而避免造成OLED显示母板的贴合良率较低问题。
例如，本实施例中的热熔胶11为EVA(乙烯和醋酸乙烯共聚)热熔胶、聚酯类热熔剂、热熔密封性胶粘剂中的任意一种。当然，本实施例中的热熔胶11也不局限上述的这几种，也可以是其他与上述材料类似的热熔胶，在此不一一详细描述。
在本实施例中，OLED显示母板的中间区域具有多个显示区21和围绕所述显示区的封装区22，在所述封装盖板10与所述OLED基板20之间对应于所述封装区22的位置处设置有封框胶。例如，所述封框胶的材料为玻璃料。
在本实施例的OLED显示母板中，通过热熔胶11对封装盖板10与OLED基板20进行密封，使得两者对盒形成的OLED显示母板的密封性能更好。
参照图3和图4，本发明的另一个实施例提供一种封装系统，其包括密封胶布线设备，所述密封胶布线设备包括：第一承载机台30，其用于承载封装盖板10；以及布线机构40，其用于将热熔胶11布线至封装盖板10的周边区域。
本实施例中，所述封装系统所包括的密封胶布线设备通过将热熔胶11布线至封装盖板10的周边区域，使得在封装盖板10与OLED基板20进行对盒时密封更好。
例如，本实施例的布线机构40包括采集单元43、托盘41、设置在托盘41上的多个固定柱42以及驱动器(未示出)。所述采集单元43用于采集各个所述固定柱42与待布线的封装盖板10 上的参考点之间的位置关系。所述驱动器用于根据所述采集单元43采集的固定柱42与待布线的封装盖板10上的参考点之间的位置关系，在托盘41上的对应初始活动区域(初始活动区域指为了将每个固定柱42在托盘上的初始位置调整为适当的与参考点对应的初始位置时允许固定柱42移动的区域，即，如图所示的圆圈所圈定的区域A)内对各个所述固定柱42进行调整以使其处于适当的初始位置，以及用于驱动各个所述固定柱42在所述封装盖板10的周边区域采用热熔胶11进行布线。
例如，本实施例的采集单元43包括与多个固定柱42一一对应的多个摄像头，每个摄像头固定在与其对应的一个固定柱42上。在每个固定柱42靠近所述第一承载机台30的一端还设置有加热头44，所述加热头44用于在所述封装盖板10的周边区域采用热熔胶11进行布线完成之后，对至少部分热熔胶11进行加热，以使热熔胶11与封装盖板10的周边区域进行预粘结。例如，固定柱42的个数为四个，四个所述固定柱42分别设置在所述托盘41的四角位置，与此相对应的摄像头个数也为四个，在此情况下，布线机构40的结构简单，且操作方便。
结合图5所示，本实施例的封装系统还可以包括：贴合设备，所述贴合设备包括：第二承载机台50和加热单元51。所述第二承载机台50用于承载OLED显示母板，OLED显示母板通过采用热熔胶11布线完成的封装盖板10和OLED基板20对盒形成。所述加热单元51用于在封装盖板10与OLED基板20对盒形成OLED显示母板之后，对所述封装盖板10的周边区域进行加热，以使封装盖板10与OLED基板20充分粘合，以得到密封性良好的OLED显示母板。
例如，本实施的加热单元51为电热阻条。当然，本实施例的加热单元51也不局限于电热阻条，也可以采用其他的具有加热功能的器件，在现有产品中具有加热功能的器件很多，在此不详细描述。
本实施例中，所述贴合设备还包括压合单元52，所述压合单 元52用于在封装盖板10与OLED基板20对盒形成OLED显示母板之后，对所述OLED显示母板的周边区域进行按压，以使封装盖板10与OLED基板20充分粘合，以得到密封性良好的OLED显示母板。例如，压合单元52为柔性材料。柔性材料质地柔和，用其对OLED显示母板的周边区域进行压合不会由于压力过大而造成OLED显示母板的破损。
本发明的另一个实施例提供一种封装方法，其用于对OLED显示母板进行封装，该OLED显示母板可以为前述实施例中所述的OLED显示母板，该封装方法可以应用至前述实施例的封装设备中，所述封装方法包括如下步骤S01至步骤S03。
步骤S01、采用热熔胶11在封装盖板10的周边区域进行布线。
该步骤具体包括：首先将封装盖板10放置在第一承载机台30上，确定封装盖板10的周边区域中多个参考点的位置，以及确定多个参考点与待通过热熔胶11布线的区域之间的位置关系，并采用热熔胶11在封装盖板10的周边区域进行布线；之后将通过热熔胶11在周边区域布线完成的封装盖板10的多个参考点所在区域进行加热。该步骤中，在95±5℃(也就是热熔胶11的软化点)范围内对热熔胶11加热。在该步骤中对多个参考点位置预加热可以使得热熔胶11与封装盖板10的多个参考点位置进行预粘结，避免封装盖板10与热熔胶11之间存在空隙。例如，参考点的数量为四个。
步骤S02、在真空环境中将完成上述步骤的封装盖板10与OLED基板20对盒，形成OLED显示母板。
在该步骤中，首先将OLED基板20设置在第二承载机台50上，并通过机械手将步骤S01中已经布线完成的封装盖板10与OLED基板20进行机械对位，之后进行精准对位，对位方法与现有的OLED基板20与封装盖板10对位的方法一致，因此在此不再详细描述。
步骤S03、在真空环境中对OLED显示母板的周边区域进行 加热，以使封装盖板10与OLED基板20密封。
在该步骤中，对OLED显示母板的周边区域进行加热，也即在OLED基板20远离所述封装盖板10的一侧进行加热，其中，在95±5℃(也就是热熔胶11的软化点)范围内对热熔胶11加热，以使封装盖板10与OLED基板20充分粘合。特别的是，为了使得封装盖板10与OLED基板20更好的粘合，例如，在对OLED显示母板的周边区域进行加热之后，将OLED显示母板所在环境中通入氮气，此时所述封装方法还包括：采用压合单元对OLED显示母板的周边区域进行压合，也就是说，在封装盖板10远离OLED基板20的一侧采用压合单元进行按压，从而使得封装盖板10与OLED基板20更加充分地粘合在一起，其中，压合单元采用柔性材料，以防止在压合过程中造成封装盖板的破损。
在本实施例的封装方法中采用热熔胶11对OLED显示母板的封装盖板10和OLED基板20进行密封，热熔胶11较UV胶而言，价格便宜，而且热熔胶11的布线工艺简单、易于实现，且在封装盖板10和OLED基板20对盒完成后无需固化工艺，因此可以节约成本、提高生产效率。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (20)

  1. 一种OLED显示母板，包括相互对盒的封装盖板和OLED基板，在所述封装盖板与所述OLED基板之间设置有密封胶，所述密封胶设置在OLED显示母板的周边区域，其中，所述密封胶包括热熔胶。
  2. 根据权利要求1所述的OLED显示母板，其中，所述热熔胶为EVA热熔胶、聚酯类热熔剂、热熔密封性胶粘剂中的任意一种。
  3. 根据权利要求1所述的OLED显示母板，其中，所述OLED显示母板的中间区域具有多个显示区和围绕每个显示区的封装区，在所述封装盖板与所述OLED基板之间对应于所述封装区的位置处设置有封框胶。
  4. 根据权利要求3所述的OLED显示母板，其中，所述封框胶的材料为玻璃料。
  5. 一种封装系统，包括密封胶布线设备，所述密封胶布线设备包括：
    第一承载机台，用于承载封装盖板；以及
    布线机构，用于将密封胶布线至封装盖板的周边区域，所述密封胶包括热熔胶。
  6. 根据权利要求5所述的封装系统，其中，所述布线机构包括：采集单元、托盘、设置在托盘上的多个固定柱、以及驱动器，其中，
    所述采集单元用于采集各个固定柱与待布线的封装盖板上的参考点之间的位置关系；以及
    所述驱动器用于根据所述采集单元采集的各个固定柱与待布 线的封装盖板上的参考点之间的位置关系，在托盘上的对应初始活动区域内对各个固定柱进行调整，以及用于驱动各个固定柱在所述封装盖板的周边区域采用热熔胶进行布线。
  7. 根据权利要求6所述的封装系统，其中，所述采集单元包括与多个固定柱一一对应的多个摄像头，每个摄像头固定在与其对应的一个固定柱上。
  8. 根据权利要求6或7所述的封装系统，其中，在每个固定柱靠近所述第一承载机台的一端还设置有加热头，其用于在所述封装盖板的周边区域采用热熔胶进行布线完成之后，对至少部分热熔胶进行预加热。
  9. 根据权利要求6或7所述的封装系统，其中，所述固定柱的个数为四个，所述四个固定柱分别设置在所述托盘的四角位置。
  10. 根据权利要求5所述的封装系统，还包括贴合设备，其中，所述贴合设备包括：
    第二承载机台，所述第二承载机台用于承载OLED显示母板；以及
    加热单元，所述加热单元用于在封装盖板与OLED基板对盒形成OLED显示母板之后，对所述封装盖板的周边区域进行加热。
  11. 根据权利要求10所述的封装系统，其中，所述加热单元为电热阻条。
  12. 根据权利要求10或11所述的封装系统，其中，所述贴合设备还包括压合单元，其用于在封装盖板与OLED基板对盒形成OLED显示母板之后，对所述OLED显示母板的周边区域进行压合。
  13. 根据权利要求12所述的封装系统，其中，所述压合单元为柔性材料。
  14. 一种OLED显示母板的封装方法，包括如下步骤：
    采用热熔胶在封装盖板的周边区域进行布线；
    将完成上述步骤的封装盖板与OLED基板对盒，形成OLED显示母板；以及
    对OLED显示母板的周边区域进行加热，以使封装盖板与OLED基板密封。
  15. 根据权利要求14所述的OLED显示母板的封装方法，其中，所述采用热熔胶在封装盖板的周边区域进行布线的步骤包括：
    确定封装盖板的周边区域中多个参考点的位置，以及确定多个参考点与待通过热熔胶布线的区域之间的位置关系，并通过热熔胶在封装盖板的周边区域进行布线。
  16. 根据权利要求15所述的OLED显示母板的封装方法，其中，在将封装盖板与OLED基板对盒的步骤之前，所述封装方法还包括：
    对通过热熔胶在周边区域布线完成的封装盖板的多个参考点所在区域进行预加热，以使热熔胶与封装盖板预粘结。
  17. 根据权利要求16所述的OLED显示母板的封装方法，其中，所述多个参考点的数量为四个。
  18. 根据权利要求16所述的OLED显示母板的封装方法，其中，对所述多个参考点所在区域进行预加热的加热温度范围为：95±5℃。
  19. 根据权利要求14所述的OLED显示母板的封装方法，其中，对OLED显示母板的周边区域进行加热的加热温度范围为：95±5℃。
  20. 根据权利要求14所述的OLED显示母板的封装方法，其中，在所述对OLED显示母板的周边区域进行加热的步骤之后，所述封装方法还包括：采用压合单元对OLED显示母板的周边区域进行压合。
PCT/CN2015/089760 2015-03-06 2015-09-16 Oled显示母板、封装系统及其封装方法 Ceased WO2016141704A1 (zh)

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