WO2016117720A1 - Feuille de protection contre les ondes électromagnétiques et son procédé de fabrication - Google Patents

Feuille de protection contre les ondes électromagnétiques et son procédé de fabrication Download PDF

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Publication number
WO2016117720A1
WO2016117720A1 PCT/KR2015/000590 KR2015000590W WO2016117720A1 WO 2016117720 A1 WO2016117720 A1 WO 2016117720A1 KR 2015000590 W KR2015000590 W KR 2015000590W WO 2016117720 A1 WO2016117720 A1 WO 2016117720A1
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WIPO (PCT)
Prior art keywords
electromagnetic wave
wave shielding
shielding sheet
layer
protective film
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Application number
PCT/KR2015/000590
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English (en)
Inventor
Seung Jin Yang
Shin Young Park
Yoon Hyun Kim
Original Assignee
Chang Sung Co., Ltd.
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Publication date
Application filed by Chang Sung Co., Ltd. filed Critical Chang Sung Co., Ltd.
Priority to PCT/KR2015/000590 priority Critical patent/WO2016117720A1/fr
Priority to KR1020157004463A priority patent/KR20160103502A/ko
Publication of WO2016117720A1 publication Critical patent/WO2016117720A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/095—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes

Definitions

  • Embodiments of the inventive concept relate to an electromagnetic wave shielding sheet, a manufacturing method of the same, and a forming method of the electromagnetic wave shielding sheet on a flexible printed circuit board, and more particularly, to an electromagnetic wave shielding sheet having an adhesive property and capable of securing a shielding characteristic with respect to an electromagnetic wave by obtaining an adhesive property and adjusting a sheet resistance with respect to a medium such as an FPCB (flexible printed circuit board), a manufacturing method of the same, and a forming method of the electromagnetic wave shielding sheet on the flexible printed circuit board.
  • a medium such as an FPCB (flexible printed circuit board)
  • a flexible printed circuit board may include a print circuit on at least one surface of a flexible insulating film such as a polyimide film or a polyester film with or without an adhesive interlaid therebetween.
  • a flexible insulating film including an opening corresponding to a portion where a terminal for mounting a circuit component on an upper surface of the print circuit or a terminal for connection with an external substrate is formed may be attached with an adhesive as necessary.
  • a surface protective layer may be formed by forming an opening through coating, drying, exposing, developing, and heating processes to a photosensitive insulating resin.
  • the FPCB In electronic devices such as mobile phones, video cameras, notebookcomputers, etc. of which miniaturization and high functionalization have been rapidly progressing in recent years, the FPCB has been used in various ways in order to insert a circuit into a complicated device. Further, with its excellent flexibility, the FPCB has been used to connect a moving unit such as a print head with a control unit. Electronic devices using an FPCB in various ways have been required to prepare a measure to shield an electromagnetic wave, and as for an FPCB used in a device, a shield flexible print circuit board (hereinafter, referred to as "shield FPCB") having a measure to shield an electromagnetic wave has been used.
  • shield FPCB shield flexible print circuit board
  • a shield FPCB disclosed in Patent Literature 1 is formed by coating a resin on one surface of a separate film so as to form a cover film (protective layer), laminating a shield layer on one side of the cover film (protective layer), and heating/pressing a shield film so as to attach the shield film while electrically connecting the shield layer to a ground circuit mounted on the FPCB with a conductive adhesive and then peeling off the separate film.
  • a shield FPCB disclosed in Patent Literature 1 is formed by coating a resin on one surface of a separate film so as to form a cover film (protective layer), laminating a shield layer on one side of the cover film (protective layer), and heating/pressing a shield film so as to attach the shield film while electrically connecting the shield layer to a ground circuit mounted on the FPCB with a conductive adhesive and then peeling off the separate film.
  • an electromagnetic wave shielding film having an adhesive property and capable of effectively implementing the characteristic of the shield layer has not been achieved so far since adhesion with respect
  • the present invention is conceived to solve the above-described problems, and directed to providing an electromagnetic wave shielding sheet having anadhesive property and capable of securing initial adhesion and a sheet resistance property by adding two elements epoxy and polyurethane to a conductive metal-based substance.
  • the present invention is directed to providing a method for improvingelectromagnetic wave shielding performance by adding an epoxy resin to conductive metal powder to increase a cross-linkability in the metal powder and forming the electromagnetic wave shielding sheet on a flexible printed circuit board.
  • An electromagnetic wave shielding sheet having an adhesive property may include: a shielding layer including a conductive substance containing Ag and Cu, bisphenol A added to the conductive substance, a polymer substance containing CTBN modified epoxy and thermoplastic polyurethane, a curing accelerator, an epoxy curing agent, and a solvent; and an insulating layer formed on one surface of the shielding layer.
  • the insulating layer includes a resin containing 5 to 15 wt% of a polyurethane resin, 2 to 4 wt% of bisphenol A-type epoxy, and 2 to 5 wt% of isocyanate and a filler containing 1 to 3 wt% of carbon black and 2 to 5 wt% of alumina, and may include ethyl acetate as the solvent.
  • the electromagnetic wave shielding sheet having an adhesive property may have an initial adhesion of 300 to 500 gf/inch.
  • the electromagnetic wave shielding sheet having an adhesive property may have a sheet resistance of 100 to 200 m ⁇ /sq.
  • a manufacturing method of an electromagnetic wave shielding sheet having an adhesive property may include: (a) a step of forming a first protective film layer made of poly ethylene terephethalate (PET) (S10); (b) a step of preparing an insulating layer coating solution by mixing an insulating layer composition (S20); (c) a step of coating and drying the insulating layer coating solution on the first protective film layer (S30); (d) a step of preparing a shielding layer coating solution by mixing and dispersing a shielding layer composition (S40); (e) a step of coating the shielding layer coating solution on the insulating layer (S50); and (e) a step of laminating a second protective film layer on the shielding layer (S60).
  • PET poly terephethalate
  • a forming method of an electromagnetic wave shielding sheet on a flexible printed circuit board may include: (A) a step of removing the second protective film layer from the electromagnetic wave shielding sheet manufactured according to claim 6 (S110); (B) a step of temporarily bonding the electromagnetic wave shielding sheet, from which the second protective film layer is removed, to an upper surface of an FPCB (flexible printed circuit board) by way of hot pressing (S120); (C) a step of bonding the temporarily bonded electromagnetic wave shielding sheet to the upper surface of an FPCB by pressing at a high temperature (S130); and (D) a step of removing the first protective film layer from the electromagnetic wave shielding sheet (S140).
  • an electromagnetic wave shielding sheet having an adhesive property in an exemplary embodiment of the present invention, it is possible to appropriately adjust adhesion with respect to a metal layer, and, thus, a release property is excellent when the electromagnetic wave shielding sheet is attached to the metal layer.
  • the electromagnetic wave shielding sheet includes a conductive substance, and, thus, it is possible to provide the electromagnetic wave shielding sheet having an excellent electromagnetic wave shielding performance.
  • an adhesive property between the electromagnetic wave shielding sheet and the flexible printed circuit board can be secured and an electromagnetic wave shielding property can be improved.
  • EMI electromagnetic wave
  • Figure 1 is a schematic diagram showing a configuration of an electromagnetic wave shielding sheet according to an exemplary embodiment of the present invention.
  • Figure 2 is a figure showing a device capable of performing an adhesive property test to an electromagnetic wave shielding sheet having an adhesive property according to an exemplary embodiment of the present invention.
  • Figure 3 provides figures respectively showing results of adhesive property tests according to Example 2 of the present invention and Comparative Examples 3 and 4.
  • Figure 4 is a graph comparing and showing the sheet resistance and an electromagnetic wave shielding property.
  • Figure 5 is a graph showing electromagnetic wave shielding efficiency according to an exemplary embodiment of the present invention.
  • Figure 6 provides figures showing a process of measuring a step coverage of an electromagnetic wave shielding sheet manufactured according to an exemplary embodiment of the present invention.
  • Figure 7 provides figures showing results of measurement of a step coverage according to Experimental Example 4.
  • Figure 8 schematically shows steps of forming an electromagnetic wave shielding sheet on an FPCB according to an exemplary embodiment of the present invention.
  • Figure 1 is a cross-sectional view of an electromagnetic wave shielding sheet according to an exemplary embodiment of the present invention.
  • An electromagnetic wave shielding sheet 100 may include: a shielding layer 130 including a conductive substance containing Ag and Cu, bisphenol A-type epoxy added to the conductive substance, a polymer substance containing CTBN modified epoxy and thermoplastic polyurethane, a curing accelerator, and an epoxy curing agent; and an insulating layer 120 formed on one surface of the shielding layer 130.
  • the resin contained in the conductive substance may function as a bonding material of the conductive substance with respect to the shielding layer 130.
  • a polymer resin may be included for the function as a bonding material of the conductive substance as described above.
  • the polymer resin may include a bisphenol A-type epoxy resin, a CTBN modified epoxy resin, and a thermoplastic polyurethane resin.
  • Bisphenol A is an organic compound prepared by condensation of one molecule of acetone and two molecules of phenol.
  • the bisphenol A has been mainly used as a synthetic material of polycarbonate plastic and epoxy resins.
  • the bisphenol A has a low resistance since it is greatly contracted during curing, and may impart adhesion when the electromagnetic wave shielding sheet according to the exemplary embodiment of the present invention is bonded.
  • the polyurethane resin may be a polyurethane prepolymer which is obtained by reacting organic isocyanate with polyol in the presence of a silicon modifier.
  • the organic isocyanate may include those known in the art for preparing polyurethane and may be selected from aromatic, aliphatic, cycloaliphatic, and aromatic polyisocyanates.
  • the polyol has a molecular weight Mw of 400 to 6000, preferably, 1000 to 4000, in order for the polyurethane resin to maintain viscosity at a certain level. It is desirable to use a product having -OH of 35 to 250, preferably, 35 to 180.
  • the polyurethane resin may improve the adhesion of the electromagnetic wave shielding layer 130 according to the exemplary embodiment of the present invention.
  • the polyurethane resin may improve a surface characteristic of the electromagnetic wave shielding layer 130. At the time of release after a temporary bond, hard release can be achieved. If the polyurethane resin is increased, a sheet resistance of the electromagnetic wave shielding layer 130 may be decreased, and, thus, the electromagnetic wave shielding efficiency may be decreased.
  • the CTBN (Carboxylic Terminated Butadiene Acryylonitrile) modified epoxy resin is compatible with a typical epoxy resin and has an excellent adhesion strength and may have an excellent elasticity.
  • the CTBN modified epoxy resin may improve workability of the electromagnetic wave shielding sheet 100 having an adhesive property and make it possible to softly release the electromagnetic wave shielding sheet 100 during a temporary bond.
  • CTBN modified epoxy resin is added to DGEBA (diglycidyl ether of bisphenol A)-based epoxy, it is possibleto prevent brittle fracture by reducing a high cross-linking structure of DGEBA and also possible to improve flexibility, adhesion, etc. by mixing a liquid elastomer such as CTBN rubber.
  • DGEBA diglycidyl ether of bisphenol A
  • the electromagnetic wave shielding sheet 100 having an adhesive property may include copper, silver, or silver-coated copper as the conductive filler.
  • the silver, copper, or silver-coated copper may be contained in an amount of about 30 to 40 wt% with respect to the total weight of the shielding layer composition.
  • the silver-coated copper may be in the form of dendrite, flake, or spherical copper powder coated with about 5 to 25 wt% of silver particles as a measure to solve the problem of high reactivity of copper occurring when copper is used solely. Since the silver-coated copper is contained in the composition of the electromagnetic wave shielding layer 130 having an adhesive property, it is possible to reduce reactivity of copper and improve an electromagnetic wave shielding property.
  • the shielding layer 130 may have a thickness of 5 to 20 ⁇ m.
  • the electromagnetic wave shielding performance may be decreased. If the thickness of the shielding layer 130 is greater than 20 ⁇ m, the shielding performance may be increased but flexibility may be decreased.
  • an epoxy curing agent or a curing accelerator may be further added.
  • trimethyl phosphate may be included.
  • the electromagnetic wave shielding sheet 100 having an adhesive property may include the insulating layer 120.
  • the insulating layer 120 includes a resin containing 5 to 15 wt% of a polyurethane resin, 2 to 4 wt% of bisphenol A-type epoxy, and 2 to 5 wt% of isocyanate and a filler containing 1 to 3 wt% of carbon black and 2 to 5 wt% of alumina, and may include ethyl acetate as the solvent.
  • the filler included in the insulating layer 120 protects a surface of the shielding layer 130 and prevents a possibility of an electrical short from the external environment.
  • the filler mixed in a resin composition can minimize resin flow occurring at a high temperature and minimize product modification caused by heat. Further, even under repeated sliding bending loads, the filler can prevent damage to the surface and the shape caused by physical wear.
  • the electromagnetic wave shielding sheet 100 having an adhesive property may include a second protective film layer 140 containing silicon-coated PET.
  • the second protective film layer 140 may have an adhesive force of 200 gf/inch to 300 gf/inch.
  • the electromagnetic wave shielding sheet 100 may have an adhesive property.
  • the adhesive property refers to a temporary bond of the sheet so as to be attachable to and detachable from the printed circuit board.
  • the shielding layer 130 including the conductive filler may include an adhesive resin.
  • the adhesive resin may include 10 to 30 wt% of bisphenol A-type epoxy, 2 to 10 wt% of CTBN modified epoxy, and 1 to 5 wt% of thermoplastic polyurethane with respect to the total weight of the shielding layer.
  • any one or more of toluene, MEK (methyl ethyl ketone), and ethyl acetate may be mixed and used as the solvent.
  • the solvents may be mixed so as to account for the rest of the weight.
  • a first protective film layer 110 was formed to a thickness of 50 ⁇ m.
  • an insulating layer 120 including 2.5 wt% of epoxy (bisphenol A-type), 10 wt% of polyurethane, 4 wt% of isocyanate, 5 wt% of polyamide,2 wt% of carbon black, 5 wt% of Al 2 O 3 , and 71.5 wt% of ethyl acetate was formed and then dried.
  • a thickness of the insulating layer 120 was 6 ⁇ m.
  • a shielding layer composition including Ag-coated copper limited to 34.1 wt%, 20.9 wt% of bisphenol A-type epoxy, 1.9 wt% of CTBN modified epoxy, 1.9 wt% of thermoplastic polyurethane, 1.3 wt% of an epoxy curing agent, 1.3 wt% of a curing accelerator, and 38.6 wt% of ethyl acetate as an organic solvent was coated and then dried by heating.
  • a thickness of the shielding layer 130 was 10 ⁇ m.
  • a second protective film layer 140 was formed of releasable PET coated with silicon.
  • the second protective film layer 140 was formed to a thickness of 75 ⁇ m.
  • An electromagnetic wave shielding sheet was manufactured under the same conditions as Example 1 except that a shielding layer composition included 19 wt% of bisphenol A-type epoxy, 3.8 wt% of CTBN modified epoxy, and 1.9 wt% of thermoplastic polyurethane.
  • An electromagnetic wave shielding sheet was manufactured under the same conditions as Example 1 except that a shielding layer composition included 18.6 wt% of bisphenol A-type epoxy, 1.9 wt% of CTBN modified epoxy, and 3.8 wt% of thermoplastic polyurethane.
  • An electromagnetic wave shielding sheet 100 was manufactured under the same conditions as Example 1 except that a shielding layer composition included 24.7 wt% of bisphenol A-type epoxy, 0 wt% of CTBN modified epoxy, and 0 wt% of thermoplastic polyurethane.
  • An electromagnetic wave shielding sheet 100 was manufactured under the same conditions as Example 1 except that a shielding layer composition included 20.9 wt% of bisphenol A-type epoxy, 3.8 wt% of CTBN modified epoxy, and 0 wt% of thermoplastic polyurethane.
  • An electromagnetic wave shielding sheet 100 was manufactured under the same conditions as Example 1 except that a shielding layer composition included 17.1 wt% of bisphenol A-type epoxy, 3.8 wt% of CTBN modified epoxy, and 3.8 wt% of thermoplastic polyurethane.
  • An electromagnetic wave shielding sheet 100 was manufactured under the same conditions as Example 1 except that a shielding layer composition included 20.9 wt% of bisphenol A-type epoxy, 0 wt% of CTBN modified epoxy, and 3.8 wt% of thermoplastic polyurethane.
  • the adhesive property refers to a temporary bond of the sheet so as to be attachable to and detachable from the printed circuit board.
  • the adhesive property can be measured as initial adhesion (gf/inch).
  • Figure 2 is a figure showing a device capable of performing an adhesive property test to an electromagnetic wave shielding sheet having an adhesive property according to an exemplary embodiment of the present invention.
  • the adhesive property test can be performed with a universal testing machine.
  • the adhesive property test was performed after the first protective film layer 110, the insulating layer 120, and the shielding layer 130 laminated in sequence were attached to a polyimide (KEPTON) film 150.
  • the electromagnetic wave shielding sheet 100 was manufactured to 20 mm across ⁇ 100 mm wide and attached to the polyimide (Kapton) film of 25 ⁇ m and then pressed under the hot pressing conditions (1000 gf/cm 2 ) for 10 seconds. Then, under the conditions of 23°C and a relative humidity of 50%, a 180 degree peel test was performed at a tension speed of 60 mm/min using a universal testing machine.
  • thermoplastic polyurethane and CTBN modified epoxy are essential elements to attach the electromagnetic wave shielding sheet 100 to a flexible printed circuit board 200.
  • Figure 3 provides figures respectively showing results of adhesive property tests according to Example 2 of the present invention and Comparative Examples 3 and 4.
  • Example 2 the electromagnetic wave shielding sheet 100 is softly released from the polyimide (PI) during the adhesive property test.
  • adhesion between the shielding layer 130 and the polyimide (PI) is strong, and, thus, the first protective film layer 110 is peeled from the insulating layer 120.
  • a black area in Figure 3(b) is a part of the insulating layer 120 from which the first protective film layer 110 is peeled.
  • Figure 3(c) relates to Comparative Example 4 where CTBN modified epoxy is not included but only thermoplastic urethane is included. In this case, it can be seen that the shielding layer 130 is stuck to the polyimide film 150. Such a phenomenon may cause a decrease in step coverage of the electromagnetic wave shielding sheet 100.
  • Comparative Example 4 where CTBN modified epoxy is not included has a high initial adhesion value (500 gf/inch) due to addition of 3.8 wt% of thermoplastic polyurethane, but does not have flexibility, and, thus, it is released hard during the adhesive property test and a shielding composition of a surface of the shielding layer 130 is stuck to a surface of the PI film.
  • the second protective film layer 140 of the electromagnetic wave shielding sheet 100 was removed and then hot-pressed (pressed at a temperature of 150°C under a pressure of 40 kgf/cm 2 for 1 hour) to a release paper layer. Then, a conductivity of the shielding sheet 100 was measured using a 4-point terminal measurement method (Mitsubishi Chemical. Co., apparatus: Loresta GP).
  • Table 1 shows a sheet resistance, electromagnetic wave shielding efficiency, initial adhesion, a status of a released surface, and presence or absence of a step crack.
  • Figure 4 is a graph comparing and showing the sheet resistance and an electromagnetic wave shielding property.
  • the following standard is applied to a level of a shielding effect.
  • a shielding effect In a range from about 0 dB to about 10 dB, there is little shielding effect, and in a range from about 10 dB to about 30 dB, there is a shielding effect to a certain extent or more.
  • an average shielding effect can be expected, in a range from about 60 dB to about 90 dB, a shielding effect is above the average, and in a range of about 90 dB or more, almost all of electromagnetic waves can be shielded.
  • electromagnetic wave shielding sheets using metals have a shielding effect of about 60 dB or more.
  • shielding efficiency is not good in a range of 50 dB or less.
  • Figure 5 is a graph showing electromagnetic wave shielding efficiency according to an exemplary embodiment of the present invention.
  • Comparative Example 1(3) where only bisphenol A-type epoxy was employed, due to a high cross-linking density, the resin was greatly contracted during curing, which is advantageous to contacts in powder. Thus, the sheet resistance value was low and the shielding efficiency was the highest and measured at 58.2 dB.
  • Comparative Example 2(2) where 3.8 wt% of CTBN modified epoxy was mixed, due to addition of epoxy modified into CTBN as a liquid elastomer, a cross-linking density was slightly lower than that of bisphenol A-type epoxy, and, thus, the sheet resistance value was increased to 171 m ⁇ /sq and the shielding efficiency was decreased to 53.5 dB.
  • the adhesive property and the electromagnetic wave shielding property can be controlled by varying the amounts of bisphenol A-type epoxy,CTBN modified epoxy, and thermoplastic polyurethane in the shielding layer 130 of the present invention.
  • Presence or absence of a step crack was checked by varying the amounts of bisphenol A-type epoxy, CTBN modified epoxy, and thermoplastic polyurethane in shielding layers 130 respectively included in an exemplary embodiment of the present invention and Comparative Example.
  • Figure 6 provides figures showing a process of measuring a step coverage of an electromagnetic wave shielding sheet manufactured according to an exemplary embodiment of the present invention.
  • two FR-4 substrates 160 each having a thickness of 0.2 mm were placed with a gap of 2 cm on a polyimide (PI) film 150 and bonded to the PI film 150 under hot pressing conditions (at 150°C under a pressure of 40 kgf/cm 2 for 1 hour).
  • a electromagnetic wave shielding sheet 100 manufactured into 2 cm wide 10 cm long was placed on a plate including a step and bonded under hot pressing conditions (at 150°C under a pressure of 40 kgf/cm 2 for 1 hour).
  • a first protective film layer 110 was removed, and the stepped portion was observed with a microscope to check presence or absence of a crack.
  • Figure 7 provides figures showing results of measurement of a step coverage according to Experimental Example 4.
  • a manufacturing method of an electromagnetic wave shielding sheet may include: (a) a step of forming a first protective film layer 110 made of poly ethylene terephethalate (PET) (S10); (b) a step of preparing an insulating layer coating solution by mixing an insulating layer composition (S20); (c) a step of coating and drying the insulating layer coating solution on the first protective film layer 110(S30); (d) a step of preparing a shielding layer coating solution by mixing and dispersing a shielding layer composition (S40); (e) a step of coating the shielding layer coating solution on the insulating layer 120 (S50); and (e) a step of laminating a second protective film layer on the shielding layer (S60).
  • a matted release film may be used as the first protective film layer 110.
  • the matted release film may be a matted PET film.
  • Examples of a method of matting a PET film include a method of forming a matted layer on a surface of a typical PET film to form a dual structure and a method of matting a PET film itself to form a single structure.
  • the matted PET film is rough (surface roughness of 30% or more) as compared with the typical PET film. Therefore, the matted PET film has a small adhesive surface and a small contact area and thus has a high peeling force and is stable in change with lapse of time.
  • the first protective film layer 110 may have adhesion of 180 gf/in or more and less than 250 gf/in. If the adhesion is less than 180 gf/in, the first protective film layer 110 may be peeled off more easily than the second protective film layer 140 attached on the shielding layer 130, and, thus, it may be difficult to perform a bonding operation with respect to a printed circuit board (PCB). If the adhesion is more than 250 gf/in, it may be difficult to perform a release operation after attachment of the electromagnetic wave shielding sheet 100 by way of hot pressing.
  • PCB printed circuit board
  • the step (S20) of coating and drying the insulating layer composition on the first protective film layer 110 may be performed.
  • the insulating layer composition includes a resin containing 5 to 15 wt% of a polyurethane resin, 2 to 4 wt% of bisphenol A-type epoxy, and 2 to 5 wt% of isocyanate and a filler containing 1 to 3 wt% of carbon black and 2 to 5 wt% of alumina, and may include ethyl acetate as the solvent.
  • the step (S20) of coating the insulating layer composition may include coating with a microgravure coater or a slot die.
  • the microgravure coater enables continuous process and mass production unlike coating methods such as ESD (electro static deposition), aerosol jetting using an air pressure, etc.
  • coating methods such as ESD (electro static deposition), aerosol jetting using an air pressure, etc.
  • ESD electro static deposition
  • aerosol jetting method using an air pressure it is possible to form a film layer having a stable surface roughness after a coating process.
  • the microgravure coating method is a kind of simple precise coating method in which a radius of a coating roll is reduced to minimize a wrap angle between a fabric and the coating roll during a kiss coating operation, thereby minimizing a vortex range of paint and ink on the roll surface and processed fabric, and, thus, the paint and ink is uniformly coated in a thin film.
  • Slot die coating refers to supplying a liquefied fluid (slurry, an adhesive, a hard coating agent, ceramic, etc.) to a space between upper and lower mold plates having the interior designed by Rheology called slot die and processed, by using a pulseless pump or a piston pump to coat the fluid supplied through a liquid supply pipe with a uniform thickness in a widthwise direction of a proceeding direction of a fabric, a film, a glass plate, or a sheet.
  • a liquefied fluid slurry, an adhesive, a hard coating agent, ceramic, etc.
  • the above-described insulating layer 120 can be formed in a semi-cured state by drying the insulating layer 120 at a temperature of 100 to 150°C.
  • a shielding layer composition may be formed by the same method as the method of coating the insulating layer.
  • the insulating layer may be formed to a thickness of 3 to 10 ⁇ m .
  • the shielding layer 130 may be electrically conductive and may have adhesiveness.
  • the shielding layer 130 is designed to have adhesiveness in order to improve a bonding force with respect to a flexible printed circuit board.
  • the electromagnetic wave shielding layer 130 may include a polymer resin in order to improve adhesion.
  • the polymer resin may include a bisphenol A-type epoxy resin, a CTBN modified epoxy resin, and a thermoplastic polyurethane resin.
  • a process of coating the shielding layer composition using a slot die coater or a comma coater and drying the shielding layer composition at 100 to 150C may be included. Through the above-described drying process, a shielding layer 130 in a semi-cured state can be formed.
  • the second protective film layer 140 may be laminated.
  • a silicon-coated PET release film may be used as the second protective film layer 140.
  • a forming method of an electromagnetic wave shielding sheet on a flexible printed circuit board may include: (A) a step of removing the second protective film layer 140 from the manufactured electromagnetic wave shielding sheet (S110); (B) a step of temporarily bonding the electromagnetic wave shielding sheet 100, from which the second protective film layer 140 is removed, to an upper surface of an FPCB (flexible printed circuit board) by way of hot pressing (S120); (C) a step of bonding the temporarily bonded electromagnetic wave shielding sheet 100 to the upper surface of an FPCB 200 by pressing at a high temperature (S130); and (D) a step of removing the first protective film layer 110 from the electromagnetic wave shielding sheet 100 (S140).
  • the flexible printed circuit board 200 may include a stepped portion, including an FR-4 (Flame Retardant-4), on a surface layer.
  • the FR-4 refers toa laminate of glass fiber in which an epoxy resin is immersed.
  • Figure 8 schematically shows steps of forming an electromagnetic wave shielding sheet on an FPCB according to an exemplary embodiment of the present invention.
  • the second protective film layer 140 can be removed from the electromagnetic wave shielding sheet 100 having an adhesive property (S110).
  • the electromagnetic wave shielding sheet 100 from which the second protective film layer 140 is removed can be temporarily bonded to the flexible printed circuit board 200 (S120).
  • the temporary bonding step is maintained at a temperature of 40 to 80°C under a pressure of 1000 gf/cm 2 for 1 minute.
  • the temporarily bonded electromagnetic wave shielding sheet 100 can be bonded under hot pressing conditions (maintained at 120 to 200°C under 30 to 50 kgf/cm 2 for 1 hour) (S130). Through the above-described bonding step, the shielding layer 130 can be attached to the surface of the FPCB 200.
  • the first protective film layer 110 can be removed from the electromagnetic wave shielding sheet 100 after the bonding step.
  • the first protective film layer 110 has a low bonding force, and, thus, it can be easily removed.
  • Embodiments of the inventive concept relate to an electromagnetic wave shielding sheet, a manufacturing method of the same, and a forming method of the electromagnetic wave shielding sheet on a flexible printed circuit board.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne une feuille de protection contre les ondes électromagnétiques qui présente une propriété adhésive, et plus particulièrement, une feuille de protection contre les ondes électromagnétiques qui présente une propriété adhésive et est capable d'améliorer l'efficacité de protection contre les ondes électromagnétiques en ajoutant de l'époxy et du polyuréthanne à une couche de protection contre les ondes électromagnétiques afin de commander une résistance de feuille servant d'indice pour une propriété de protection.
PCT/KR2015/000590 2015-01-20 2015-01-20 Feuille de protection contre les ondes électromagnétiques et son procédé de fabrication WO2016117720A1 (fr)

Priority Applications (2)

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PCT/KR2015/000590 WO2016117720A1 (fr) 2015-01-20 2015-01-20 Feuille de protection contre les ondes électromagnétiques et son procédé de fabrication
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WO2019231028A1 (fr) * 2018-06-01 2019-12-05 (주)잉크테크 Film isolant et procédé de fabrication d'un film isolant
KR102007807B1 (ko) * 2018-09-18 2019-08-06 주학식 실리콘 복합 시트 및 그 제조 방법

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KR101081524B1 (ko) * 2004-04-07 2011-11-08 나노캠텍주식회사 도전성 필름 및 시트, 및 이의 제조 방법
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US20110186324A1 (en) * 2008-09-04 2011-08-04 Eun-Kwang Hur Electromagnetic interference suppressing hybrid sheet
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