WO2016104459A1 - はんだ転写シート、はんだバンプ及びはんだ転写シートを用いたはんだプリコート方法 - Google Patents
はんだ転写シート、はんだバンプ及びはんだ転写シートを用いたはんだプリコート方法 Download PDFInfo
- Publication number
- WO2016104459A1 WO2016104459A1 PCT/JP2015/085731 JP2015085731W WO2016104459A1 WO 2016104459 A1 WO2016104459 A1 WO 2016104459A1 JP 2015085731 W JP2015085731 W JP 2015085731W WO 2016104459 A1 WO2016104459 A1 WO 2016104459A1
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- WO
- WIPO (PCT)
- Prior art keywords
- solder
- solder powder
- adhesive layer
- layer
- powder
- Prior art date
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 533
- 238000000034 method Methods 0.000 title claims description 18
- 239000000843 powder Substances 0.000 claims abstract description 367
- 239000012790 adhesive layer Substances 0.000 claims abstract description 179
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
- H01L23/4928—Bases or plates or solder therefor characterised by the materials the materials containing carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
- H01L2021/60015—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using plate connectors, e.g. layer, film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Definitions
- the present invention relates to a solder transfer sheet for transferring a solder for forming a solder bump to a solder bump formation target portion, a solder bump prepared using the solder transfer sheet, and a solder precoat method using the solder transfer sheet.
- the electrode of the electronic part or the like is soldered to the electrode of the board.
- a method of forming solder bumps on the substrate-side electrodes in advance and soldering the solder bumps and electrodes such as electronic components by a reflow method is simple.
- Solder bumps are most commonly formed by solder paste printing using a mask and subsequent melting of the solder by heating.
- the yield decreases due to the generation of bridges and variations in the amount of solder, resulting in an increase in manufacturing cost. Inevitable.
- Patent Document 1 proposes a transfer sheet in which a recess formed by a solder resist layer is filled with solder powder.
- the concave portion of the transfer sheet has the same pattern as the electrode of the substrate.
- solder transfer sheet When this solder transfer sheet is arranged so that the concave portion faces the electrode of the substrate and heated under pressure to melt the solder powder, solder bumps are formed on the electrode of the substrate.
- alignment of the transfer sheet is indispensable.
- the manufacturing cost of a transfer sheet becomes high.
- Patent Document 2 there is also a method of using a transfer sheet in which solder powder adheres in a single layer using an adhesive layer on the entire surface of a support substrate.
- the transfer sheet is arranged so that the solder powder surface faces the electrode on the substrate.
- the substrate is pre-coated with a solder resist in areas other than the electrodes.
- the electrode portion wets the molten solder and adheres to the solder, but the solder resist portion does not wet the molten solder.
- Patent Document 3 As a method of forming a solder bump having a fine pattern, heating and pressurizing at a temperature lower than the melting point of the solder without melting the solder powder during transfer as in Patent Document 2
- solder bump forming method in which the solder powder of the solder transfer sheet is transferred to the electrode by solid phase diffusion bonding.
- solder transfer sheet having a solder layer made of a solder powder sintered body obtained by sintering a plurality of layers of solder powder by solid phase diffusion bonding in order to transfer without causing problems such as transfer defects.
- solder transfer sheets of Patent Document 2 and Patent Document 3 do not require alignment and are excellent in that a fine pattern can be soldered, but the solder powder on the adhesive is formed in one layer. Therefore, there is a problem that the amount of solder transferred to the electrode cannot be increased.
- a solder transfer sheet capable of increasing the amount of solder transfer without generating a bridge, a solder bump and a solder formed using the solder transfer sheet.
- An object is to provide a solder pre-coating method using a transfer sheet.
- the present inventors have mixed solder powder with an adhesive component to provide a multilayer layer of solder powder, thereby ensuring transferability and increasing the particle size of the solder powder that directly touches the electrode surface. It has been found that the transfer amount of solder can be increased without any problems.
- the present invention provides a base material, an adhesive layer formed on one surface of the base material, a solder powder-containing adhesive layer formed on one surface of the adhesive layer, and one surface of the solder powder-containing adhesive layer.
- a solder powder layer, the solder powder is arranged in a plane of a single layer, and the solder powder-containing adhesive layer has a predetermined amount of solder by mixing the solder powder and the adhesive component It is a solder transfer sheet.
- the present invention is characterized in that the adhesive component of the solder powder-containing pressure-sensitive adhesive layer contains a side chain crystalline polymer, exhibits adhesiveness by having fluidity at the melting point or higher of the side chain crystalline polymer, and the side It is a solder transfer sheet which is an adhesive layer whose adhesive strength is reduced by crystallization at a temperature lower than the melting point of the chain crystalline polymer.
- the present invention is a solder transfer sheet in which the side chain crystalline polymer has a melting point of 30 ° C. or higher and lower than 70 ° C.
- the present invention is also a solder transfer sheet in which the adhesive strength of the adhesive is less than 2.0 N / 25 mm at a temperature below the melting point of the side chain crystalline polymer.
- the present invention is a solder bump formed using the above-described solder transfer sheet.
- the present invention is a solder pre-coating method using a solder transfer sheet comprising the following steps.
- E. A step of superposing the solder powder layer, the solder powder-containing adhesive layer, and the solder powder layer of the solder transfer sheet provided with the solder powder layer on the electrode side of the workpiece;
- the solder transfer sheet is bonded to the electrode so that the solder powder layer faces the electrode of the substrate that is the object to be joined.
- the solder powder in the solder powder layer is diffusion bonded to the electrode by being heated and pressurized. Note that the diffusion bonding refers to both the case where the solder is melted and bonded and the case where the solder is bonded by a solid phase diffusion phenomenon at a temperature below the solidus.
- the solder powder of the solder powder layer is diffusion-bonded to the electrode, and the solder powder of the adhesive layer containing the solder powder is directly connected to the solder powder of the solder powder layer. And in the site
- the solder powder layer and the solder powder-containing adhesive layer remain on the substrate side.
- solder layer of the solder transfer sheet and the solder powder-containing adhesive layer bonded to the electrode are put into a reflow furnace and soldered, so that the solder powder of the solder layer and the solder powder of the adhesive layer containing the solder powder Melts and spreads on the electrodes, forming solder bumps.
- the present invention unlike Patent Document 4 in which solder powder is stacked in multiple layers by solid phase diffusion bonding, has a solder powder-containing adhesive layer having a predetermined amount of solder mixed with solder powder and an adhesive component. There is a feature in the point.
- a solder powder-containing adhesive layer having a predetermined amount of solder is provided, thereby increasing the particle size of the solder powder in the solder powder layer. Without increasing the solder transfer amount, the height of the formed solder bumps can be increased. There is no need to increase the particle size of the solder particles in the solder powder layer, and the solder powder in the adhesive layer containing the solder powder is fixed by an adhesive, so that the solder powder is less likely to be misaligned during transfer, etc. Occurrence can be suppressed.
- the solder powder layer is not mixed with the adhesive component, and the solder powder is in direct contact with the electrode, so that the solder powder and the electrode are reliably diffusion-bonded at temperature and pressure.
- the force to join the solder powder with the adhesive component in the adhesive layer containing solder powder is weaker than the force that the solder powder in the adhesive layer containing solder powder directly and indirectly connects with the solder powder in the solder powder layer by diffusion bonding.
- the solder powder of the adhesive layer containing the solder powder is separated from the part where the solder powder of the powder layer is directly and indirectly diffusion-bonded with the part which is not directly or indirectly diffusion-bonded. Transferred from the material side to the electrode side.
- the height of the solder bump to be formed can be increased while suppressing the occurrence of defects such as a solder bridge. Furthermore, if the heating temperature from the electrode side during transfer is set higher than the heating temperature from the substrate side, the solder that directly and indirectly diffusely bonds the solder powder of the adhesive layer containing the solder powder and the solder powder of the solder powder layer Since the amount of solder powder in the powder-containing adhesive layer is increased, the amount of solder powder in the solder powder-containing adhesive layer transferred from the substrate side to the electrode side can be increased.
- FIG. 1 is a configuration diagram illustrating an example of a solder transfer sheet according to the present embodiment.
- the solder transfer sheet 1 ⁇ / b> A of the present embodiment includes a solder powder layer 2, a solder powder-containing adhesive layer 3, an adhesive layer 4, and a base material 5.
- the adhesive layer 4 is formed on the surface that is one surface of the substrate 5, and the solder powder-containing adhesive layer 3 is formed on the surface that is one surface of the adhesive layer 4. Then, the solder powder layer 2 is formed on the surface that is one surface of the solder powder-containing adhesive layer 3.
- the solder powder-containing adhesive layer 3 is adhered to the base material 5 by the adhesiveness of the adhesive component 41 constituting the adhesive layer 4.
- the solder powder-containing adhesive layer 3 is a mixture of the solder powder 30 and the adhesive component 31 and has a predetermined amount of solder.
- the solder powder 30 that is not in contact with the pressure-sensitive adhesive layer 4 is joined by the pressure-sensitive adhesive component 31.
- the solder powder layer 2 is attached to the solder powder-containing adhesive layer 3 by the adhesiveness of the adhesive component 31 of the solder powder-containing adhesive layer 3.
- the pressure-sensitive adhesive component 31 of the solder powder-containing pressure-sensitive adhesive layer 3 is made of a side-chain crystalline polymer, exhibits adhesiveness by having fluidity at a temperature equal to or higher than the melting point of the side-chain crystalline polymer, and has side-chain crystals. Those whose adhesive strength is reduced by crystallization at a temperature lower than the melting point of the adhesive polymer are preferred. Specifically, it is preferable to use an adhesive component having an adhesive strength of less than 2.0 N / 25 mm at a temperature below the melting point of the side chain crystalline polymer.
- the melting point of the side chain crystalline polymer means a temperature at which a specific portion of the polymer originally aligned in an ordered arrangement becomes disordered by an equilibrium process, and is a differential thermal scanning calorimeter (DSC). ) Is a value obtained by measurement under measurement conditions of 10 ° C./min.
- the step of forming the solder powder layer 2 made of the solder powder 20 on the solder powder-containing pressure-sensitive adhesive layer 3 made of the solder powder 30 and the pressure-sensitive adhesive component 31 is made from 30 to 30% from the viewpoint of increasing the adhesiveness. It is performed while heating around 70 ° C.
- the step of forming the solder powder layer 2 is performed while the base material 5 is heated to about 30 to 70 ° C., but is cooled to about 10 ° C. after the step of forming the solder powder layer 2. . And in this cooling, since the side chain of a side chain crystalline polymer crystallizes, the solder powder layer 2 formed in the solder powder containing adhesion layer 3 can be hold
- the adhesive component 41 of the adhesive layer 4 the adhesiveness (sticking property) with the solder powder-containing adhesive layer 3 is not impaired, and the storage elastic modulus during transfer of the transfer sheet is 1 ⁇ 10 6 Pa or less. There is no particular limitation.
- the adhesive component 41 it is preferable to use the same adhesive component as the solder powder-containing adhesive layer 3 in consideration of adhesion.
- the storage elastic modulus of the adhesive component 31 used for the solder powder-containing adhesive layer 3 it is preferable to adjust the pressure-sensitive adhesive component 31 so that it is harder than the pressure-sensitive adhesive component 41 of the pressure-sensitive adhesive layer 4.
- the side chain crystalline polymer that the pressure-sensitive adhesive component 41 has As the side chain crystalline polymer that the pressure-sensitive adhesive component 41 has, a polymer having a melting point of 30 ° C. or higher and lower than 70 ° C. is used. Therefore, in the step of forming the solder powder-containing adhesive layer 3 composed of the solder powder 30 and the adhesive component 31 on the adhesive layer 4, the base material 5 is heated to around 30 to 70 ° C. from the viewpoint of increasing the adhesiveness. While done.
- the step of forming the solder powder-containing adhesive layer 3 is performed while heating the base material to about 30 to 70 ° C., but after the step of forming the solder powder-containing adhesive layer 3, the temperature is about 10 ° C. To be cooled. And in this cooling, since the side chain of the side chain crystalline polymer is crystallized, the solder powder-containing adhesive layer 3 formed on the adhesive layer 4 can be held more strongly.
- the side chain crystalline polymer is an acrylic ester having a linear alkyl group having 16 or more carbon atoms, or 30 to 90% by weight of methacrylic acid ester and an alkyl having 1 to 6 carbon atoms.
- examples thereof include a polymer obtained by polymerizing 10 to 70% by weight of an acrylic acid ester having a group or a methacrylic acid ester and 1 to 10% by weight of a polar monomer.
- the acrylic ester copolymer also has a function as a flux for removing the metal oxide film during transfer to the electrode.
- the acrylic acid ester copolymer has a boiling point higher than the melting point of the solder powder 30 of the solder powder-containing adhesive layer 3 and the solder powder 20 of the solder powder layer 2, and does not volatilize at a temperature at which the solder powder 30 and the solder powder 20 melt. .
- the adhesive component 31 of the solder powder-containing adhesive layer 3 and the adhesive component 41 of the adhesive layer 4 contain a crosslinking agent.
- the crosslinking agent include isocyanate compounds, aziridine compounds, epoxy compounds, metal chelate compounds, and the like. These may be used alone or in combination of two or more.
- the solder powder 20 of the solder powder layer 2 is composed of a solder alloy containing Sn as a main component.
- the solder powder 20 is composed of Sn-2.5Ag (Ag: 2.5% by weight, Sn: balance).
- the solder powder 30 of the solder powder-containing adhesive layer 3 is composed of Sn-2.5Ag in this example, like the solder powder layer 2.
- the solder powder 20 of the solder powder layer 2 and the solder powder 30 of the solder powder-containing adhesive layer 3 may have the same composition or a combination of different compositions. Moreover, the particle diameters of the solder powder 20 and the solder powder 30 may be the same, but the particle diameter of the solder powder 20 is smaller than the particle diameter of the solder powder 30 (the particle diameter of the solder powder 20 ⁇ the solder powder 30 (Particle diameter) may be satisfied. The reason for this is that if the particle size of the solder powder 20 is increased in order to increase the amount of solder transferred, solder bridges are likely to occur as described above. However, the solder powder 30 in the adhesive layer 3 containing solder powder depends on the adhesive.
- the composition of the solder powder is not limited to the above example, and any solder alloy containing Sn, Ag, Cu, Pb, Zn, Bi, In, Sb as a main component may be used, and Sn, Ag, Cu, Pb may be used. Zn, Bi, In, Sb, Ge, Ga, Co, Ni, Fe, Au and Cr may be added with an element other than at least one element as a main component.
- the base material 5 is made of synthetic resin such as polyethylene terephthalate, polyethylene, polypropylene, polyester, polyamide, polyimide, polycarbonate, ethylene vinyl acetate copolymer, ethylene ethyl acrylate copolymer, ethylene polypropylene copolymer, polyvinyl chloride.
- the substrate 5 may have either a single layer structure or a multi-layer structure, and the thickness is usually preferably 5 ⁇ m to 500 ⁇ m.
- the substrate can be subjected to surface treatment such as corona discharge treatment, plasma treatment, blast treatment, chemical etching treatment, primer treatment, etc., in order to improve the adhesion to the adhesive layer.
- the particle sizes of the solder powder 20 and the solder powder 30 are 4 ⁇ m.
- the thickness of the solder powder-containing adhesive layer 3 was 15 ⁇ m.
- Example of manufacturing method of solder transfer sheet of this embodiment> 2A, 2 ⁇ / b> B, and 2 ⁇ / b> C are explanatory views illustrating an example of a method for manufacturing a solder transfer sheet according to the present embodiment.
- (A) Method for Producing Adhesive Layer 4 In order to provide adhesive layer 4 on at least one surface of base material 5, a solution prepared by adding a solvent to adhesive component 41 constituting adhesive layer 4 is applied to base material 5 using a coater or the like. Is applied to at least one side of and dried. Thereby, as shown to FIG. 2A, the adhesion layer 4 is formed in the surface of the base material 5 by predetermined thickness.
- the pressure-sensitive adhesive layer 4 also has a role of sticking a solder powder-containing pressure-sensitive adhesive layer 3 to be described later and a role of a cushion during a pressurizing step when transferring the transfer sheet.
- various additives such as a crosslinking agent, a tackifier, a plasticizer, an anti-aging agent, and an ultraviolet absorber may be added to the solder powder-containing pressure-sensitive adhesive layer 3 and the solution at the time of preparing the pressure-sensitive adhesive layer 4. it can.
- Examples of the coater used for applying the solvent include a knife coater, a roll coater, a calendar coater, a comma coater, a gravure coater, and a rod coater.
- the step of adhering the solder powder-containing pressure-sensitive adhesive layer 3 and the pressure-sensitive adhesive layer 4 is, for example, increasing the adhesiveness at the melting point of the pressure-sensitive adhesive component 41 of the pressure-sensitive adhesive layer 4 and the pressure-sensitive adhesive component 31 of the solder powder-containing pressure-sensitive adhesive layer 3.
- the base material 5 on which the adhesive layer 4 is formed is placed on a hot plate that is set to a predetermined temperature capable of the above. In a state where the adhesive layer 4 is heated via the base material 5, another base material (not shown) on which the solder powder-containing adhesive layer 3 is formed is placed with the adhesive layer 4 and the solder powder-containing adhesive layer 3 facing each other. By doing so, the solder powder-containing adhesive layer 3 and the adhesive layer 4 are adhered.
- solder powder-containing adhesive layer 3 in which a solder powder 30 is mixed with an adhesive component 31 and a plurality of solder powders 30 are stacked on the surface of the adhesive layer 4 formed on the substrate 5. It is formed.
- the thickness of the adhesive layer 4 is preferably 5 ⁇ m or more and 60 ⁇ m or less, more preferably 5 ⁇ m or more and 50 ⁇ m or less, and further preferably 5 ⁇ m or more and 40 ⁇ m or less.
- the thickness of the solder powder-containing adhesive layer 3 is preferably 5 ⁇ m to 60 ⁇ m, more preferably 5 ⁇ m to 40 ⁇ m, and even more preferably 10 ⁇ m to 30 ⁇ m.
- solder powder layer 2 is composed of one or more solder layers by attaching the solder powder 20 to the surface of the solder powder-containing adhesive layer 3 formed on the base material 5 via the adhesive layer 4. A layer of powder 20 is formed.
- the step of attaching the solder powder 20 includes, for example, the adhesive layer 4 on a hot plate set to a predetermined temperature that is higher than the melting point of the adhesive component 31 of the solder powder-containing adhesive layer 3 and can increase the adhesiveness. And a substrate 5 on which the solder powder-containing adhesive layer 3 is formed.
- the solder powder 20 is sprinkled on the surface of the solder powder-containing adhesive layer 3, and uniformized using an electrostatic brush and a puff. As a result, the solder powder 20 is adhered to the surface of the solder powder-containing adhesive layer 3 and the excess powder is removed.
- solder powder layer 2 composed of one or more solder powders 20 is formed on the surface of the adhesive layer 3 containing the solder powder.
- the solder powder layer 2 may be a continuous film of a solder alloy.
- solder transfer sheet 1 ⁇ / b> A is bonded to the electrode 60 of the substrate 6 so that the solder powder layer 2 faces the electrode 60 formed on the substrate 6.
- the solder powder 20 of the solder powder layer 2 is diffusion bonded to the electrode 60 by being pressurized and heated.
- the electrode 60 for example, a cylindrical electrode called a Cu pillar formed of Cu is used.
- the base material 5 is peeled from the solder transfer sheet 1 ⁇ / b> A bonded to the electrode 60 of the substrate 6.
- the solder powder 20 of the solder powder layer 2 is diffusion bonded to the electrode 60, and the solder powder 30 of the solder powder-containing adhesive layer 3 is the solder powder layer 2.
- the substrate 5 and the adhesive layer 4 are peeled off from the solder powder-containing adhesive layer 3.
- the solder powder layer 2 and the solder powder containing adhesion layer 3 remain in the base-material 5 side. That is, the solder powder-containing adhesive layer 3 includes a portion where the solder powder 30 of the solder powder-containing adhesive layer 3 is directly and indirectly diffusion-bonded with the solder powder 20 of the solder powder layer 2, and a portion where the solder powder 30 is not diffused. Will be separated.
- the solder powder 20 is not mixed with the adhesive component, and the solder powder 20 is in direct contact with the electrode 60. For this reason, the solder powder 20 and the electrode 60 are reliably diffusion-bonded by temperature and pressure.
- the solder of the adhesive layer 3 containing the solder powder that comes into contact with the solder of the solder powder layer 2 diffusion-bonded to the electrode 60 is diffusion-bonded.
- the solder powder 30 is joined by the adhesive component 31, but the force that the solder powders 30 are joined by the adhesive component 31 is diffusion-bonded to the electrode 60. Since the solder powder 20 is weaker than the force connected by direct and indirect diffusion bonding, the portion that is diffusion-bonded and the portion that is not diffusion-bonded in the solder powder-containing adhesive layer 3 are separated.
- solder powder layer 2 and the solder powder-containing adhesive layer 3 prevents the solder powder layer 2 and the solder powder-containing adhesive layer 3 from remaining on the side of the substrate 5 to be peeled off at the portion where the solder powder 20 of the solder powder layer 2 is diffusion bonded to the electrode 60. It becomes possible to selectively transfer the solder powder 20 and the solder powder 30 only on the top. Therefore, it is possible to cope with fine electrodes with a narrow pitch by reducing the particle size of the solder powder.
- FIG. 4 is an explanatory view showing an example of solder bumps formed using the solder transfer sheet of the embodiment of the present invention.
- the substrate 6 is put into a reflow furnace and soldered.
- the solder powder layer 2 and the solder powder-containing adhesive layer 3 are heated by reflow, the solder powder 20 and the solder powder 30 are melted and spread on the electrode 60 of the substrate 6, and the solder bumps 7 are formed as shown in FIG. It is formed.
- the adhesive component 31 is suppressed from volatilizing at a temperature at which the solder powder 20 and the solder powder 30 are melted, generation of voids in which bubbles remain in the solder bumps 7 can be suppressed.
- solder transfer sheet 1A of the present embodiment by having the solder powder-containing adhesive layer 3 in addition to the solder powder layer 2, the height of the solder bumps 7 is increased without increasing the particle size of the solder powder 20. be able to. Thereby, generation
- the solder powder 30 of the adhesive layer 3 containing solder powder of the present invention may be spherical or granular, and its shape is not specified. Moreover, you may comprise so that the several solder powder 30 may be piled up, and it may comprise so that the solder powder 30 may become one layer (planar shape) using the solder powder 30 with a large particle size. .
- solder powder layer 2 of the present invention may be joined by using solid phase diffusion of the solder powder 20 and stacked so that the solder powder 20 has two or more layers.
- solder transfer sheet 1A of the present embodiment a workpiece such as a substrate on which the solder is transferred is manufactured by the pre-coating method shown below.
- D. Removing the excess powder solder of the solder powder 20 spread on the surface of the solder powder-containing adhesive layer 3 to form the solder powder layer 2; E.
- the transferability of the solder powder and the shape of the solder bump after reflow were compared using the solder transfer sheet of the comparative example provided with only the solder powder layer arranged in the layer.
- FIG. 5A and FIG. 5B are explanatory views showing the shapes of solder bumps of examples and comparative examples.
- the composition of the solder powder used for the solder transfer sheet was Sn-2.5Ag.
- the electrode pitch was 50 ⁇ m.
- the substrate size was 20 ⁇ 20 mm.
- the solder powder-containing adhesive layer and the substrate on which the adhesive layer was adhered were taken out from the hot plate, cooled, and after cooling, the PET film adhered to the solder powder-containing adhesive layer was peeled off.
- seat in which the solder powder containing adhesion layer in which the solder powder mixed with the adhesive component was piled up in multiple layers was formed on the surface of the adhesion layer formed in the base material.
- solder powder is sprinkled on the surface of the solder powder-containing adhesive layer, and uniformized using an electrostatic brush and puff, thereby containing the solder powder. Solder powder was adhered to the surface of the adhesive layer and excess powder was removed.
- solder transfer sheet of the Example in which the solder powder layer which consists of one or more layers of solder powder was formed was obtained.
- the solder powder is sprinkled on the surface of the adhesive layer containing the solder powder, and uniformized by using an electrostatic brush and a puff. The powder was attached and excess powder was removed.
- a nano-imprinter device (hereinafter referred to as an experimental device) manufactured by Myeongchang Kiko Co., Ltd. was used, and solder bumps were created in the following steps.
- a ceramic plate was placed on the lower surface heater stage of the experimental apparatus, a cushion material was placed thereon, a solder transfer sheet of Examples and Comparative Examples was placed thereon, and finally a work with a pitch of 50 ⁇ m was placed thereon.
- the temperature of the lower heater stage is set to 40 ° C.
- the temperature of the upper heater stage of the experimental apparatus is set to 201 ° C.
- the lower heater stage is raised, the work is pressed against the upper heater stage, and pressure is applied.
- the upper heater stage temperature is set to 225 ° C. and the pressurization and heating are performed for 1 sec while the lower heater stage temperature is kept at 40 ° C. Thereafter, the temperature of the upper surface heater stage is lowered to 100 ° C. Next, the lower heater stage is lowered to reduce the pressure. Thereafter, the workpiece was taken out from the experimental apparatus, and the solder bumps on the created workpiece were observed.
- the mechanism by which diffusion coupling is performed is considered as follows. That is, the solder transfer sheet is also heated from the electrode 60 side of the substrate 6 by the upper surface heater stage. However, since the solder powder layer 2, the solder powder-containing adhesive layer 3, and the adhesive layer 4 are gradually heated in this order, first, the solder of the solder powder layer 2 is diffusion-bonded to the electrode on the surface of the electrode 60. Thereafter or simultaneously, the solder of the solder powder-containing adhesive layer 3 that is in contact with the solder of the solder powder layer 2 is diffusion-bonded. The diffusion bonding range in the solder powder-containing adhesive layer 3 is expanded based on the diffusion bonded portion.
- solder powder layer 2 and the solder powder-containing adhesive layer 3 are diffused as shown in FIG. 3B. Unbonded parts are peeled off together with the adhesive layer 4.
- solder bump shape after reflow is such that the bump shape is more spherical and the solder volume is larger in the example shown in FIG. 5A than in the comparative example shown in FIG. Is guessed.
- the solder transfer sheet of the example can increase the amount of solder transfer without generating a bridge while ensuring good transferability.
- the solder powder layer Good results were also obtained for the peelability from the adhesive layer.
- SYMBOLS 1A ... Solder transfer sheet, 2 ... Solder powder layer, 20 ... Solder powder, 3 ... Solder powder containing adhesion layer, 30 ... Solder powder, 31 ... Adhesive component, 4. ..Adhesive layer, 41 ... adhesive material component, 5 ... base material
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Abstract
Description
A.基材上へ粘着剤を塗布して粘着層を形成する工程;
B.前記粘着層上にはんだ粉末と粘着剤からなるはんだ粉末含有粘着層を形成する工程;
C.前記はんだ粉末含有粘着層上にはんだ粉末を散布する工程;
D.上記はんだ粉末含有粘着層上の余剰粉末はんだを除去して、はんだ粉末層を形成する工程;
E.前記粘着層と、はんだ粉末含有粘着層、および前記はんだ粉末層を備えたはんだ転写シートの前記はんだ粉末層をワークの電極側に重ねる工程;
F.前記はんだ転写シートとワークとを重ね合せたものへ加熱と加圧を同時に行う工程;
G.はんだ固化後、前記はんだ転写シートを除去する工程。
図1は、本実施の形態のはんだ転写シートの一例を示す構成図である。本実施の形態のはんだ転写シート1Aは、はんだ粉末層2と、はんだ粉末含有粘着層3と、粘着層4と、基材5を備える。
図2A、図2B及び図2Cは、本実施の形態のはんだ転写シートの製造方法の一例を示す説明図である。
基材5の少なくとも片面に粘着層4を設けるには、粘着層4を構成する粘着剤成分41に溶剤を加えて作成した溶液を、コーター等によって基材5の少なくとも片面に塗布して乾燥させる。これにより、図2Aに示すように、基材5の表面に所定の厚さで粘着層4が形成される。この粘着層4は、後述するはんだ粉末含有粘着層3を貼着する役割と、転写シートを転写する際の加圧工程時のクッションとなる役割も有する。
はんだ粉末含有粘着層3を構成する粘着剤成分31、本例では、粘着層4を構成する粘着剤成分41と同じものに溶剤に加え、さらに、はんだ粉末30を加えて作成した溶液を、コーター等によって、図示しない他の基材の片面に塗布して乾燥させる。なお、はんだ粉末含有粘着層3の作製で使用される基材は、後の工程ではんだ粉末含有粘着層3から剥離されるので、溶剤を塗布する前に、剥離が容易になるような表面処理を行うと良い。
基材5に形成された粘着層4と、図示しない他の基材に形成されたはんだ粉末含有粘着層3とを所定の温度で貼り合わせることで、はんだ粉末含有粘着層3と粘着層4が貼着される。
はんだ粉末層2は、基材5に粘着層4を介して形成されたはんだ粉末含有粘着層3の表面にはんだ粉末20を付着させ、1層以上のはんだ粉末20からなる層が形成される。
図3A及び図3Bは、本実施の形態のはんだ転写シートの使用例を示す説明図である。まず、図3Aに示すように、はんだ粉末層2が基板6に形成された電極60に対向する向きとして、はんだ転写シート1Aが基板6の電極60に貼り合わせられる。そして、加圧及び加熱されることで、はんだ粉末層2のはんだ粉末20が電極60に拡散接合される。電極60としては、例えば、Cuで形成されたCuピラーと称される円柱形状の電極が使用される。
A.基材5の表面へ粘着剤成分41を塗布して粘着層4を形成する工程;
B.粘着層4の表面にはんだ粉末30と粘着剤成分31からなるはんだ粉末含有粘着層3を形成する工程;
C.はんだ粉末含有粘着層3の表面にはんだ粉末20を散布する工程;
D.はんだ粉末含有粘着層3の表面に散布したはんだ粉末20の余剰粉末はんだを除去して、はんだ粉末層2を形成する工程;
E.粘着層4と、はんだ粉末含有粘着層3、及びはんだ粉末層2を備えたはんだ転写シート1Aのはんだ粉末層2をワークの電極側に重ねる工程;
F.はんだ転写シート1Aとワークとを重ね合せたものへ加熱と加圧を同時に行う工程;
G.はんだ固化後、はんだ転写シート1Aを除去する工程
(合成例)
炭素数16以上の直鎖アルキル基を有するアクリル酸エステルまたはメタクリル酸エスエルとしてベヘニルアクリレートを用い、炭素数1~6のアルキル基を有するアクリル酸エスエルまたはメタクリル酸エステルとしてアクリル酸メチルを用い、極性モノマーとしてアクリル酸を用いた。なお、以下で「部」は質量部を意味する。
(実施例)
(1-a)粘着層の作製
上記合成例で得られたポリマー溶液に溶剤(酢酸エチル)を用いて固形分%が25%になるように調製した。このポリマー溶液に架橋剤としてケミタイトPZ-33(日本触媒製)をポリマー100部に対して0.2部添加した。基材として、100μmのポリエチレンテレフタレート(PET)フィルムを用意し、このフィルムのコロナ処理した面に、上記溶液をコンマコーターにて塗布し、アクリル系の粘着剤成分からなる40μmの粘着層を得た。
上記合成例で得られたポリマー溶液に溶剤(酢酸エチル)を用いて固形分%が25%になるように調製した。このポリマー溶液に架橋剤としてケミタイトPZ-33(日本触媒製)をポリマー100部に対して0.2部添加し、さらに、はんだ粉末と上記ポリマーの体積比がはんだ粉末:ポリマー=74:26となるよう添加した。50μmのポリエチレンテレフタレート(PET)フィルムに、剥離性を向上させるためシリコーン処理を行い、このフィルムのシリコーン処理した面に、上記はんだ粉末が混合された溶液をコンマコーターにて塗布し、はんだ粉末とアクリル系の粘着剤成分を有する15μmのはんだ粉末含有粘着層を得た。
上記合成例で得られたポリマー溶液の融点以上で、粘着性を高めることが可能な所定の温度、本例では60℃に設定したホットプレート上に、粘着層が形成された基材を載せた。基材を介して粘着層が加熱された状態で、粘着層とはんだ粉末含有粘着層を対向する向きとして、はんだ粉末含有粘着層が形成されたPETフィルムを載せて、はんだ粉末含有粘着層と粘着層を貼着した。
上記合成例で得られたポリマー溶液の融点以上で、粘着性を高めることが可能な所定の温度、本例では80℃に設定されたホットプレート上に、粘着層とはんだ粉末含有粘着層が形成された基材を置いた。
(2-a)粘着層の作製
上記合成例で得られたポリマー溶液に溶剤(酢酸エチル)を用いて固形分%が25%になるように調製した。このポリマー溶液に架橋剤としてケミタイトPZ-33(日本触媒製)をポリマー100部に対して0.2部添加し、100μmのポリエチレンテレフタレート(PET)フィルムのコロナ処理した面に、上記溶液をコンマコーターにて塗布し、アクリル系の粘着剤成分からなる40μmの粘着層を得た。
上記合成例で得られたポリマー溶液の融点以上で、粘着性を高めることが可能な所定の温度、本例では80℃に設定されたホットプレート上に、粘着層が形成された基材を置いた。
転写時の条件として、明昌機工(株)製のナノインプリンター装置(以下、実験装置)を使用して、下記の工程にてはんだバンプを作成した。まず実験装置の下面ヒータステージ上にセラミック板を載せ、その上にクッション材、さらにその上に実施例・比較例のはんだ転写シート、最後に50μピッチのワークを載せた。次に下面ヒータステージの温度を40℃、実験装置の上面ヒータステージの温度を201℃に設定し、下面ヒータステージを上昇させ、ワークを上面ヒータステージに押し当て、加圧する。加圧力が目標とする0.4kN/pcsとなったら、下面ヒータステージの温度を40℃に保った状態で、上面ヒータステージの温度を225℃にし1sec加圧と加熱を行う。その後、上面ヒータステージの温度を100℃まで低下させる。次に下面ヒータステージを下降させて、減圧する。その後、ワークを実験装置から取り出して、作成したワーク上のはんだバンプを観察した。
Claims (9)
- 基材と、
前記基材の一の面に形成された粘着層と、
前記粘着層の一の面に形成されたはんだ粉末含有粘着層と、
前記はんだ粉末含有粘着層の一の面に形成されたはんだ粉末層とを備え、
前記はんだ粉末層は、はんだ粉末が面状に配列され、
前記はんだ粉末含有粘着層は、はんだ粉末と粘着剤成分が混合され所定の量となる厚さを有する
ことを特徴とするはんだ転写シート。 - 前記はんだ粉末層は、はんだ粉末が1層の面状に配列されている
ことを特徴とする請求項1に記載のはんだ転写シート。 - 前記はんだ粉末含有粘着層の粘着剤成分は、はんだ粉末の融点で揮発しない化合物で構成される
ことを特徴とする請求項1または請求項2に記載のはんだ転写シート。 - 前記はんだ粉末含有粘着層の粘着剤成分が、側鎖結晶性ポリマーを含有し、
前記側鎖結晶性ポリマーの融点以上の温度下で流動性を持つことで粘着力が発現し、かつ、
前記側鎖結晶性ポリマーの融点未満の温度下で結晶化することで粘着力が低下する粘着剤成分である
ことを特徴とする請求項1~請求項3のいずれかに記載のはんだ転写シート。 - 前記側鎖結晶性ポリマーが、30℃以上70℃未満の融点を有する
ことを特徴とする請求項4に記載のはんだ転写シート。 - 前記側鎖結晶性ポリマーの融点未満の温度下において、前記粘着剤成分の粘着力が2.0N/25mm未満である
ことを特徴とする請求項4~請求項5のいずれかに記載のはんだ転写シート。 - 前記はんだ粉末含有粘着層を構成するはんだ粉末と粘着剤成分との体積比が
はんだ粉末:粘着剤成分=74:26である
ことを特徴とする請求項1~請求項6のいずれかに記載のはんだ転写シート。 - 請求項1~請求項7に記載のはんだ転写シートを用いて形成した
ことを特徴とするはんだバンプ。 - 以下の各工程を備えたことを特徴とするはんだ転写シートを用いたはんだプリコート方法。
A.基材上へ粘着剤を塗布して粘着層を形成する工程;
B.前記粘着層上にはんだ粉末と粘着剤からなるはんだ粉末含有粘着層を形成する工程;
C.前記はんだ粉末含有粘着層上にはんだ粉末を散布する工程;
D.上記はんだ粉末含有粘着層上の余剰粉末はんだを除去して、はんだ粉末層を形成する工程;
E.前記粘着層と、はんだ粉末含有粘着層、および前記はんだ粉末層を備えたはんだ転写シートの前記はんだ粉末層をワークの電極側に重ねる工程;
F.前記はんだ転写シートとワークとを重ね合せたものへ加熱と加圧を同時に行う工程;
G.はんだ固化後、前記はんだ転写シートを除去する工程
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CN107113979A (zh) | 2017-08-29 |
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TWI622146B (zh) | 2018-04-21 |
TW201642418A (zh) | 2016-12-01 |
US20170354042A1 (en) | 2017-12-07 |
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