WO2016095517A1 - 基板检查装置及方法 - Google Patents

基板检查装置及方法 Download PDF

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Publication number
WO2016095517A1
WO2016095517A1 PCT/CN2015/084373 CN2015084373W WO2016095517A1 WO 2016095517 A1 WO2016095517 A1 WO 2016095517A1 CN 2015084373 W CN2015084373 W CN 2015084373W WO 2016095517 A1 WO2016095517 A1 WO 2016095517A1
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Prior art keywords
substrate
area
inspecting
scanning
camera
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PCT/CN2015/084373
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English (en)
French (fr)
Inventor
李庸珍
李彦燮
尹泰赫
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京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Priority to US14/895,703 priority Critical patent/US9880408B2/en
Publication of WO2016095517A1 publication Critical patent/WO2016095517A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10004—Still image; Photographic image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30121—CRT, LCD or plasma display

Definitions

  • Embodiments of the present invention relate to a substrate inspection apparatus and method.
  • a substrate is generally required in a display device.
  • an array substrate, a color filter substrate, or the like is generally used in an LCD (Liquid Crystal Display) device. Therefore, the selection of the substrate is very important for the display device. If the substrate is a bad product, the display device is likely to malfunction during use. For this reason, the substrate usually needs to be rigorously inspected before leaving the factory.
  • Embodiments of the present invention provide a substrate inspection apparatus and method for performing effective inspection on a substrate other than a regular square shape.
  • At least one embodiment of the present invention provides a substrate inspection apparatus including: a transfer table for carrying the substrate on a surface thereof; an area scanning camera located on a first side of the transfer table, and a surface oppositely disposed for inspecting a standard specification of the substrate; a line scan camera positioned on a first side of the transfer table opposite the surface for inspecting edge lines and dimensions of the substrate; It is located on a second side opposite the first side of the transfer station for illuminating light onto the substrate for inspection by the area scanning camera and the line scan camera.
  • At least one embodiment of the present invention also provides a method of inspecting a substrate using the above substrate inspection apparatus, the method comprising: loading the substrate on a surface of the transfer table; and scanning the camera by using the area Standard specifications of the substrate; the edge line and size of the substrate are inspected using the line scan camera.
  • 1a is a schematic structural diagram of a substrate inspection apparatus according to an embodiment of the present invention.
  • Figure 1b is a top plan view of a substrate
  • FIG. 2 is a schematic flow chart of a substrate inspection method according to an embodiment of the present invention.
  • FIG. 3 is a schematic view showing a circular area of a measuring substrate and a C-shaped cutting area according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of a circular area of a measuring substrate according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a C-shaped cutting area of a measuring substrate according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a practical operation process of a substrate inspection method according to an embodiment of the present invention.
  • the apparatus for inspecting a substrate generally can only inspect a standard positive quadrilateral form substrate, and cannot effectively inspect an irregular shaped substrate other than a regular square shape, thereby causing a shaped substrate.
  • the pass rate is greatly reduced.
  • At least one embodiment of the present invention provides a substrate inspection apparatus including: an area scan camera 1, a line scan camera 2, a light source 3, and a transfer stage 4.
  • the transfer table 4 is used to carry the substrate 5 on its surface 41.
  • the transfer station 4 can be a circular rotary table.
  • the area scanning camera 1 is located on a first side of the transfer table 4, opposite to the surface 41, for inspecting a standard specification of the substrate 5, that is, an actual inspection substrate
  • the size is the same as the size of the substrate (for example, the lateral size, the vertical size, etc.) defined by the standard specifications.
  • the line scan camera 2 is located on a first side of the transfer table 4 opposite to the surface 41 for inspecting edge lines of the substrate 5 (eg, edge lines 51, 52, At least one of 53 and 54) and size.
  • the light source 3 is located on a second side opposite to the first side of the transfer table 4 for illuminating light onto the substrate 5 for scanning the camera 1 and the line Sweep The camera 2 checks the use of the substrate 5.
  • the light source 3 can be a stroboscopic flash.
  • the embodiments of the present invention include, but are not limited to, the following.
  • the substrate inspection apparatus is suitable for inspecting a substrate of any plate structure, such as an array substrate, a color filter substrate, a touch substrate, and the like.
  • the area scanning camera 1 inspecting the standard specifications of the substrate 5 may include: as shown in FIG. 1b, the area scanning camera 1 scans the calibration mark 55 on the substrate 5 ( FIG. 1b shows a schematic diagram of the enlarged alignment mark 55 in the circular dotted line frame, and acquires the position coordinates of the calibration mark 55 by scanning the circular area 56 of the substrate 5 (as shown by the dotted line in FIG. 1b). Obtaining the circular region 56 and/or the C-shaped cutting region, as shown by the curved portion and/or the C-shaped cutting region 57 (shown as a broken line portion in another dashed box in FIG. 1b)) The data of 57 is combined with the actual coordinates of the graphic design of the substrate 5 to check the standard specifications of the substrate 5.
  • the substrate is available in a variety of sizes.
  • the graphic design of the substrate refers to the design drawings of various dimensions of the substrate (for example, CAD file), and the coordinates of the positions of the portions of the substrate are indicated by coordinates in the design surface.
  • the line scan camera 2 inspecting the edge line of the substrate 5 may include: checking whether the substrate 5 has burrs, cracks, and notches, and judging whether the substrate 5 is good according to the inspection result. .
  • the substrate inspection apparatus may further include: an operation controller 6 for controlling movement of the transfer table 4, movement of the area scan camera 1, and the line scan camera 2 The movement.
  • the substrate inspection apparatus may further include a light source controller 7 for controlling the light source 3 to emit light.
  • the substrate inspection apparatus may further include: a user interface 8 for the user to control the substrate inspection apparatus to perform operations, for example, may include controlling the operation controller 6 and the light source
  • the controller 7 operates, and in addition, the user can also provide relevant data of the graphic design of the substrate 5 to the substrate inspection device, and provide the related image acquired by the area scanning camera 1 and the line scanning camera 2. To the user.
  • At least one embodiment of the present invention provides a method of using any of the above A method of inspecting the substrate by a substrate inspection apparatus, the method comprising the steps of: S1, loading the substrate on a surface of the transfer table; S2, checking a standard specification of the substrate by using the area scanning camera; and S3 The edge line and size of the substrate are inspected by the line scan camera.
  • the step S2 may include: the area scanning camera acquires position coordinates of the calibration mark by scanning a calibration mark on the substrate, by scanning a circular area of the substrate and And/or a C-shaped cutting area, acquiring data of the circular area and/or the C-shaped cutting area, and checking the standard specifications of the substrate in combination with actual coordinates of the graphic design of the substrate.
  • determining the circular area of the substrate may include the following steps S211 through S215, which are described in detail below.
  • Step S211 A reference line A of the calibration mark is made based on a calibration mark (shown by a plus sign in FIG. 3) on the substrate (for example, a glass substrate).
  • Step S212 Make virtual lines 101 and 102 symmetrical with the reference line A.
  • Step S213 Based on the line 105, a circular area on the substrate, that is, the line 106 is set, as shown by the curve between the coordinates (A, B) and the coordinates (C, D) in FIG.
  • Step S214 The line 105 is used as the data of the coordinate location registered on the CAD software, and the equidistant circular coordinate points B are made on the line 106 (the circular coordinate points are equally spaced in the direction of the line 106).
  • Step S215 Comparing the circular coordinate points B with the equally spaced coordinate points in the circular area on the CAD design drawing surface, and measuring the circular area of the substrate.
  • FIG. 3 is only a schematic diagram for measuring a circular area and a C-shaped cutting area on the substrate.
  • the plus sign in FIG. 3 is not an actual calibration mark, and is only used to indicate the position of the actual calibration mark on the actual substrate.
  • determining the C-shaped cutting area of the substrate may include the following steps S221 to S224, which are described in detail below.
  • Step S221 Set (C, D) and (G, H) to make measurement points of 1 to 5 at the start and end (i.e., measurements 1 to 5).
  • the selected measurement point is a C-shaped curve (as measured in Figure 5) along the (G, H) direction from (C, D) to the lower (ie, from the top to the bottom shown in Figure 5).
  • the points extending along the direction between the X direction and the Y direction shown by the curves of points 1 to 5 are equally spaced (the measurement points are equally spaced along the C-shaped curve); at this time, the CAD design surface
  • the measured coordinate points on the same are also in CAD On the design drawing, the points extending along the direction between the X direction and the Y direction of the C-shaped curve from the (C, D) to the lower (G, H) direction are measured at equal intervals. Coordinate points.
  • Step S222 according to the curve detected by the view (as shown by the curve of the measurement points 1 to 5 in FIG. 5) and the boundary of the straight line (E, F) (for indicating one edge of the substrate, but does not represent the actual substrate
  • the actual distance of the actual edge) to the inside of the substrate is made by the amount of displacement (A, B) that meets the edge of the substrate.
  • Step S223 according to the curve detected by the view and the vertical distance from the boundary of the line (G, H) (for indicating the other edge of the substrate, but not representing the actual edge of the actual substrate) to the inner side of the substrate, The shift amount makes (C, D) that meets the boundary of the substrate.
  • Step S224 The calculation is started from the intersection (X, Y) of (A, B) and (C, D), and the distance from the plus point to each of the measurement points 1 to 5 is measured.
  • the calibration mark on the substrate is indicated by a plus sign for measuring the coordinates of each of the measurement points 1 to 5 as shown in FIG. 5, and the plus sign is used as a reference point, and the measurement point is obtained based on this.
  • the distance between the coordinates and the coordinates of the reference point is compared with the data read in the CAD software, and the actual object (ie, the actual substrate, that is, the image of the substrate scanned by the area scan camera) and the design drawing are calculated.
  • the difference in the face ie, the graphic design of the substrate).
  • the step S3 may include: checking whether the substrate has burrs, cracks, and notches, and determining whether the substrate is good according to the inspection result.
  • the application flow of the substrate inspection apparatus for inspecting the substrate in actual operation is specifically described below.
  • the application flow may include the following steps S01 to S08, which are described in detail below.
  • Step S01 Start inspection of a substrate (for example, a glass substrate).
  • Step S02 Check the initialization of the device.
  • Step S03 Calibration of the substrate, in which the CAD software automatically inputs the coordinates.
  • the CAD software is designed to have the function of automatically setting the inspection data after the main inspection device is turned on.
  • Step S04 The calibration mark formed on the substrate is inspected using an area scan camera. In this step, it is necessary to utilize the Vision Alignment function of the area scan camera.
  • Step S05 It is detected whether the calibration mark is good.
  • Step S06 If the calibration mark is good, the edge area of the substrate is inspected using a line scan camera. In this step, the function of comparing the CAD design data of the symmetric algorithm with the data on the actually captured image is applied.
  • Step S07 It is determined whether the coordinate data of the substrate on the CAD design surface and the measured coordinate data are consistent, and if so, the substrate state is normally determined.
  • Step S08 The inspection ends.
  • step S05 if the calibration fails in step S05, the process returns to step S03.
  • step S07 if the calibration is unsatisfactory (that is, the coordinate data of the substrate on the CAD design surface does not coincide with the measured coordinate data), the damaged area is inspected by the calibration line and transferred to the lower portion of the line scan camera, thereby using the calibration inspection lens. Taking a picture of the damaged area to determine whether the next process can be performed: if the next process can be performed, the process of judging the state of the substrate is normally entered; if it is not possible to proceed to the next process, the state of the substrate is determined to be bad, and the process proceeds to step S08. The inspection is over.
  • the substrate inspection apparatus and method provided by the embodiment of the present invention, it is possible to inspect the specifications of a plurality of types of substrates, in particular, to inspect a substrate having a profiled characteristic, thereby accurately determining a defective substrate.

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Abstract

一种基板检查装置及方法。该基板检查装置包括：传送台(4)，用于在其表面(41)上承载所述基板(5)；区域扫描相机(1)，其位于所述传送台(4)的第一侧，与所述表面(41)相对设置，用于检查所述基板(5)的标准规格；线扫描相机(2)，其位于所述传送台(4)的第一侧，与所述表面(41)相对设置，用于检查所述基板(5)的边缘线及尺寸；光源(3)，其位于与所述传送台(4)的第一侧相反的第二侧，用于将光线照射到所述基板(5)上，供所述区域扫描相机(1)及所述线扫描相机(2)检查所述基板(5)使用。

Description

基板检查装置及方法 技术领域
本发明实施例涉及一种基板检查装置及方法。
背景技术
众所周知，显示设备中通常需要使用基板，例如，LCD(Liquid Crystal Display，液晶显示器)设备中一般会使用阵列基板、彩膜基板，等等。因此，基板的选用对显示设备非常重要，如果基板是不良产品，显示设备很可能在使用中会出现故障。为此，基板在出厂前通常需要进行严格的检查。
发明内容
本发明实施例提供了一种基板检查装置及方法，以实现对正四角形以外形态的基板进行有效的检查。
本发明的至少一个实施例提供了一种基板检查装置，其包括：传送台，用于在其表面上承载所述基板；区域扫描相机，其位于所述传送台的第一侧，与所述表面相对设置，用于检查所述基板的标准规格；线扫描相机，其位于所述传送台的第一侧，与所述表面相对设置，用于检查所述基板的边缘线及尺寸；光源，其位于与所述传送台的第一侧相反的第二侧，用于将光线照射到所述基板上，供所述区域扫描相机及所述线扫描相机检查所述基板使用。
本发明的至少一个实施例还提供了一种利用上述基板检查装置对所述基板进行检查的方法，该方法包括：在所述传送台的表面上装载所述基板；利用所述区域扫描相机检查所述基板的标准规格；利用所述线扫描相机检查所述基板的边缘线及尺寸。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1a为本发明实施例提供的基板检查装置的结构示意图；
图1b为一种基板的俯视示意图；
图2为本发明实施例提供的基板检查方法的流程示意图；
图3为本发明实施例提供的测定基板的圆形区域以及C形切削区域的示意图；
图4为本发明实施例提供的测定基板的圆形区域的示意图；
图5为本发明实施例提供的测定基板的C形切削区域的示意图；
图6为本发明实施例提供的基板检查方法实际操作流程示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
在研究中，本申请的发明人注意到，用于检查基板的设备一般只能对标准的正四角形形态的基板进行检查，而不能对正四角形以外的异形基板进行有效的检查，从而导致异形基板的合格率大大降低。
如图1a所示，本发明的至少一个实施例提供了一种基板检查装置，其包括：区域扫描相机1、线扫描相机2、光源3、以及传送台4。
在基板检查装置中，所述传送台4用于在其表面41上承载基板5。
例如，所述传送台4可以是圆形旋转工作台。
在基板检查装置中，所述区域扫描相机1位于所述传送台4的第一侧，与所述表面41相对设置，用于检查所述基板5的标准规格，即，用于检查基板的实际尺寸与标准规格定义的基板的尺寸(例如，横向尺寸、竖向尺寸等尺寸)是否一致。
在基板检查装置中，所述线扫描相机2位于所述传送台4的第一侧，与所述表面41相对设置，用于检查所述基板5的边缘线(例如，边缘线51、52、53和54中的至少一个)及尺寸。
在基板检查装置中，所述光源3位于与所述传送台4的第一侧相反的第二侧，用于将光线照射到所述基板5上，供所述区域扫描相机1及所述线扫 描相机2检查所述基板5使用。
例如，所述光源3可以是频闪闪光灯。当然，本发明实施例包括、但不限于此。
需要说明的是，本发明实施例提供的基板检查装置适用于检查任何板状结构的基板，例如阵列基板、彩膜基板、触控基板等。
根据本发明的至少一个实施例，所述区域扫描相机1检查所述基板5的标准规格可以包括：如图1b所示，所述区域扫描相机1通过扫描所述基板5上的校准标记55(图1b中圆形虚线框中示出了校准标记55放大后的结构示意图)，获取所述校准标记55的位置坐标，通过扫描所述基板5的圆形区域56(如图1b的虚线框中的弧形部分所示)和/或C形切削区域57(如图1b的另一虚线框中的折线形部分所示))，获取所述圆形区域56和/或所述C形切削区域57的数据，并结合所述基板5的图形设计的实际坐标，检查所述基板5的标准规格。
基板有多种尺寸。基板的图形设计指基板的各种尺寸的设计图面(例如，CAD设计图面，CAD file)，这个设计图面中用坐标标示出基板的各部分的位置坐标。
根据本发明的至少一个实施例，所述线扫描相机2检查所述基板5的边缘线可以包括：检查所述基板5是否存在毛刺、裂纹、缺口，并根据检查结果判断所述基板5是否良好。
根据本发明的至少一个实施例，所述基板检查装置还可以包括：运行控制器6，用于控制所述传送台4的移动、所述区域扫描相机1的移动、以及所述线扫描相机2的移动。
根据本发明的至少一个实施例，所述基板检查装置还可以包括：光源控制器7，用于控制所述光源3发光。
根据本发明的至少一个实施例，所述基板检查装置还可以包括：用户接口8，用于供用户控制所述基板检查装置进行工作，例如，可以包括控制所述运行控制器6以及所述光源控制器7工作，另外，还可以供用户将所述基板5的图形设计的有关数据提供给所述基板检查装置，并且将所述区域扫描相机1以及所述线扫描相机2获取的有关图像提供给用户。
如图2所示，本发明的至少一个实施例提供了一种利用上述任一种所述 基板检查装置对所述基板进行检查的方法，该方法包括步骤：S1、在所述传送台的表面上装载所述基板；S2、利用所述区域扫描相机检查所述基板的标准规格；以及S3、利用所述线扫描相机检查所述基板的边缘线及尺寸。
根据本发明的至少一个实施例，所述步骤S2可以包括：所述区域扫描相机通过扫描所述基板上的校准标记，获取所述校准标记的位置坐标，通过扫描所述基板的圆形区域和/或C形切削区域，获取所述圆形区域和/或所述C形切削区域的数据，并结合所述基板的图形设计的实际坐标，检查所述基板的标准规格。
如图3和图4所示，根据本发明的至少一个实施例，测定所述基板的圆形区域可以包括以下步骤S211至步骤S215，下面详细介绍这些步骤。
步骤S211：以所述基板(例如，玻璃(glass)基板)上的校准标记(如图3中的加号所示)为基准，作出所述校准标记的基准线A。
步骤S212：再作出与基准线A相对称的虚拟的线101和102。
步骤S213：以线105为基准，设定基板上的圆形区域，即，线106，如图4中的坐标(A，B)至坐标(C，D)之间的曲线所示。
步骤S214：把线105作为CAD软件上登录的坐标地点的数据，在线106上作出等间距的圆形坐标点B(圆形坐标点沿线106方向上等间距)。
步骤S215：把这些圆形坐标点B与CAD设计图面上圆形区域内的等间距的坐标点比较后，测定所述基板的圆形区域。
需要说明的是，图3只是测定基板上的圆形区域及C形切削区域的原理图，图3中的加号不是实际校准标记，只用来表示实际校准标记在实际基板上的位置。
如图3和图5所示，根据本发明的至少一个实施例，测定所述基板的C形切削区域可以包括以下步骤S221至步骤S224，下面详细介绍这些步骤。
步骤S221：设定(C,D)和(G,H)，以作出开始和结束的1～5的测定点(即测定1至5)。
选定的测定点是在沿着从(C,D)到下面的(G,H)方向(即图5所示的从上向下的方向)上，将C形曲线(如图5中测定点1～5所在的曲线所示)的沿着X方向和Y方向之间的方向延伸的部分以等间距划分的点(测定点沿C形曲线方向上等间距)；这时CAD设计图面上的测定坐标点也是在CAD 设计图面上沿着从(C,D)到下面的(G,H)方向，将C形曲线的沿着X方向和Y方向之间的方向延伸的部分以等间距划分的点作为其测定坐标点。
步骤S222：根据视图检出的曲线(如图5中测定点1～5所在的曲线所示)和从直线的边界(E,F)(用于表示基板的一个边缘，但并不表示实际基板的实际边缘)到所述基板内侧(如图5中的加号所示)的垂直距离，通过位移量作出与所述基板的边缘相遇的(A,B)。
步骤S223：根据视图检出的曲线和从直线的边界(G,H)(用于表示基板的另一个边缘，但并不表示实际基板的实际边缘)到所述基板内侧的垂直距离，通过偏移量作出与所述基板的边界相遇的(C,D)。
步骤S224：从(A,B)和(C,D)的交叉点(X,Y)开始进行计算，测定加号到各测定点1～5的距离。
本实施例中将基板上的校准标记用如图5所示的用于测定各测定点1～5的坐标的加号表示之后，把该加号作为基准点，以此为基准，取得测定点的坐标和该基准点的坐标之间的距离，再和CAD软件中读取的数据进行比较，并计算实际对象物(即实际基板，也即区域扫描相机扫描到的基板的图像)和设计图面(即，基板的图形设计)上的差异。
根据本发明的至少一个实施例，所述步骤S3可以包括：检查所述基板是否存在毛刺、裂纹、缺口，并根据检查结果判断所述基板是否良好。
需要说明的是，上述步骤S2和步骤S3的顺序可以互换。
如图6所示，下面具体描述实际操作中基板检查装置对所述基板进行检查的应用流程，例如，该应用流程可以包括以下步骤S01至步骤S08，下面进行详细介绍。
步骤S01：开始检查基板(例如，玻璃(glass)基板。
步骤S02：检查装置的初始化。
步骤S03：对基板的校准，在该步骤中，CAD软件自动输入坐标。
该步骤中，把CAD软件设计成带有在主检查设备打开后自动设定检查数据的功能。
步骤S04：利用区域扫描相机检查基板上面形成的校准标记。该步骤中，需要利用区域扫描相机的视觉对准(Vision Alignment)功能。
步骤S05：检测该校准标记是否良好。
步骤S06：若校准标记良好，则利用线扫描相机检查基板的边缘区域。该步骤中，应用对称算法的CAD设计数据与实际拍摄的影像上的数据相比较的功能。
步骤S07：判断基板在CAD设计图面上的坐标数据和测定的坐标数据是否一致，若是，则正常判断基板状态。
步骤S08：检查结束。
在该应用流程中，在步骤S05中，若校准不合格，则返回步骤S03中。
在步骤S07中，若不合格(即基板在CAD设计图面上的坐标数据和测定的坐标数据不一致)，则破损的区域通过校准线检查并移送到线扫描相机的下部，进而利用校准检查镜头，对破损的区域进行拍照，以判断是否可以进行下一个工艺：若可以进行下一个工艺，则正常进入判断基板状态的工艺；若不可以进入下一个工艺，则判定基板状态不良，进入步骤S08，检查结束。
根据本发明实施例提供的基板检查装置及方法，可以检查多种多样形态基板的规格，特别是对有着异形特性的基板进行检查，从而能够准确的判定不良的基板。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2014年12月18日递交的中国专利申请第201410803896.7号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (8)

  1. 一种基板检查装置，包括：
    传送台，用于在其表面上承载所述基板；
    区域扫描相机，其位于所述传送台的第一侧，与所述表面相对设置，用于检查所述基板的标准规格；
    线扫描相机，其位于所述传送台的第一侧，与所述表面相对设置，用于检查所述基板的边缘线及尺寸；以及
    光源，其位于与所述传送台的第一侧相反的第二侧，用于将光线照射到所述基板上，供所述区域扫描相机及所述线扫描相机检查所述基板使用。
  2. 如权利要求1所述的装置，其中，所述区域扫描相机用于检查所述基板的标准规格包括：
    所述区域扫描相机通过扫描所述基板上的校准标记，获取所述校准标记的位置坐标，通过扫描所述基板的圆形区域和/或C形切削区域，获取所述圆形区域和/或所述C形切削区域的数据，并结合所述基板的图形设计的实际坐标，检查所述基板的标准规格。
  3. 如权利要求1或2所述的装置，其中，所述线扫描相机用于检查所述基板的边缘线包括：
    检查所述基板是否存在毛刺、裂纹、缺口，并根据检查结果判断所述基板是否良好。
  4. 如权利要求1至3中任一项所述的装置，还包括：
    运行控制器，用于控制所述传送台、所述区域扫描相机、以及所述线扫描相机的移动。
  5. 如权利要求1至4中任一项所述的装置，还包括：
    光源控制器，用于控制所述光源发光。
  6. 一种利用权利要求1～5任一项所述的基板检查装置对所述基板进行检查的方法，包括：
    在所述传送台的表面上装载所述基板；
    利用所述区域扫描相机检查所述基板的标准规格；以及
    利用所述线扫描相机检查所述基板的边缘线及尺寸。
  7. 如权利要求6所述的方法，其中，利用所述区域扫描相机检查所述基板的标准规格包括：
    所述区域扫描相机通过扫描所述基板上的校准标记，获取所述校准标记的位置坐标，通过扫描所述基板的圆形区域和/或C形切削区域，获取所述圆形区域和/或所述C形切削区域的数据，并结合所述基板的图形设计的实际坐标，检查所述基板的标准规格。
  8. 如权利要求6或7所述的方法，其中，利用所述线扫描相机检查所述基板的边缘线包括：
    检查所述基板是否存在毛刺、裂纹、缺口，并根据检查结果判断所述基板是否良好。
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