WO2016090679A1 - 激光切割装置 - Google Patents

激光切割装置 Download PDF

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Publication number
WO2016090679A1
WO2016090679A1 PCT/CN2014/094833 CN2014094833W WO2016090679A1 WO 2016090679 A1 WO2016090679 A1 WO 2016090679A1 CN 2014094833 W CN2014094833 W CN 2014094833W WO 2016090679 A1 WO2016090679 A1 WO 2016090679A1
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Prior art keywords
laser cutting
liquid crystal
crystal panel
cutting head
image sensor
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French (fr)
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符夏龙
黄皓
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

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  • the present invention relates to a laser cutting apparatus, and more particularly to a laser cutting apparatus for cutting a short-circuit loop of a liquid crystal panel.
  • the conventional laser cutting device can use a laser to cut a short-circuit loop and detect the cut-off condition of the short-circuit loop.
  • the laser cutting device cannot detect the damage at the edge of the liquid crystal panel, so that the defective liquid crystal panel cannot be found, and these defective liquid crystal panels flow into the next workshop or manufacturer.
  • an object of the present invention is to provide a laser cutting device capable of detecting damage at the edge of a liquid crystal panel, so as to timely and effectively detect a liquid crystal panel with defects, thereby preventing liquid crystal with defects The panel flows into the next workshop or manufacturer.
  • the present invention provides a laser cutting apparatus for cutting a short-circuit loop of a liquid crystal panel.
  • the light cutting device includes a laser cutting head for cutting a short-circuit loop of the liquid crystal panel, and a first detector disposed outside the laser cutting head for detecting breakage at the edge of the liquid crystal panel.
  • the first detector can detect the damage at the edge of the liquid crystal panel in time and accurately, and judge whether it belongs to the defective product according to the damage condition. In this way, the defective liquid crystal panel can be prevented from flowing into the next workshop or manufacturer.
  • the first detector includes a first image sensor for detecting a lateral edge of the liquid crystal panel and a second image sensor for detecting a longitudinal edge of the liquid crystal panel. Thereby, the edge of the liquid crystal panel can be completely detected.
  • the first image sensor is disposed on a transverse line on which the laser cutting head is located, and the second image sensor is disposed on a longitudinal line on which the laser cutting head is located.
  • the first image sensor is capable of effectively detecting the lateral edges of the liquid crystal panel when the laser cutting head moves along the lateral direction.
  • the second image sensor is capable of effectively detecting the longitudinal edges of the liquid crystal panel as the laser cutting head moves along the longitudinal direction.
  • the first image sensor is movable following the laser cutting head and is always behind the laser cutting head when the laser cutting head is moved laterally; the second image sensor can follow the laser cutting when the laser cutting head moves longitudinally The head moves and is always behind the laser cutting head. In this way, it is possible to perform the cutting and re-detection in advance to prevent missing defects caused by improper cutting.
  • the first and second image sensors are both CCD sensors.
  • the CCD sensor is used to detect the damage at the edge of the liquid crystal panel, and the detection result can be obtained in time and accurately to prevent missing the slightly damaged liquid crystal panel.
  • the laser cutting device is used for shorting loop wiring of a liquid crystal panel of a thin film transistor liquid crystal display.
  • the laser cutting apparatus further includes a fill light for illuminating the liquid crystal panel.
  • the fill light can illuminate the liquid crystal panel to improve the accuracy of the test results.
  • a second detector for detecting the cut-off condition of the short-circuit loop is provided on the outside of the laser cutting head. Thereby, it can be ensured that each short-circuit ring connection can be cut by the laser cutting head.
  • the second detector includes a third image sensor disposed on a transverse line on which the laser cutting head is located, and a fourth image sensor disposed on a longitudinal line on which the laser cutting head is located.
  • the third and fourth image sensors are both CCD sensors.
  • the laser cutting device detects the damage at the edge of the liquid crystal panel through the first detector, so that the defective liquid crystal panel can be accurately and timely discovered, thereby preventing the defective liquid crystal panel from flowing into the next workshop or manufacturer. .
  • the laser cutting apparatus detects the cutoff of the short-circuit loop by the second detector to ensure that each short-circuit loop can be cut by the laser cutting head.
  • the laser cutting device according to the invention has the advantages of simple structure, convenient processing, easy assembly, safe and reliable use, and convenient implementation and popularization.
  • Figure 1 shows a laser cutting device according to the present invention and a liquid crystal panel to be cut by a short-circuit ring;
  • Figure 2 shows a laser cutting head, first and second detectors of a laser cutting device in accordance with the present invention.
  • FIG. 1 shows a laser cutting apparatus 10 according to the present invention, which is commonly referred to as a liquid crystal short circuit ring laser cutting machine.
  • the laser cutting device 10 can be used to cut a short-circuit loop of a TFT-LCD liquid crystal panel (ie, a liquid crystal panel of a thin film transistor liquid crystal display).
  • TFT-LCD liquid crystal panel ie, a liquid crystal panel of a thin film transistor liquid crystal display.
  • the T axis represents the lateral direction
  • the V axis represents the longitudinal direction.
  • the laser cutting device 10 includes a laser cutting head 2 that is capable of emitting a laser beam.
  • the pulsed laser light emitted by the laser cutting head 2 can reach an appropriate energy density after being expanded and focused, and cuts the short-circuiting ring line at the edge of the liquid crystal panel 5 along the moving path 6, prompting the electrode material to instantaneously vaporize, forming a slit. Achieve the cutting requirements of the short circuit ring.
  • the laser cutting device 10 further includes a first detector 3 disposed outside the laser cutting head 2.
  • the first detector 3 can follow the movement of the laser cutting head 2 and detect the damage at the edge of the liquid crystal panel 5.
  • the defective liquid crystal panel 5 can be detected in time and accurately to prevent the defective liquid crystal panel 5 from flowing into the next shop or manufacturer.
  • the specific content of the detection of the damage at the edge of the liquid crystal panel 5 includes whether there are protrusions or depressions, whether there is a corrosion site, whether there is a short circuit portion, and whether there is a burr or a saw tooth.
  • the first detector 3 includes a first image sensor 3a for detecting the lateral edge 5a of the liquid crystal panel 5, and a second image sensor 3b for detecting the longitudinal edge 5b of the liquid crystal panel 5.
  • first The image sensor 3a and the second image sensor 3b may also be replaced by a displacement sensor such as an infrared sensor.
  • the first image sensor 3a is disposed on the transverse line L1 where the laser cutting head 2 is located, and the second image sensor 3b is disposed on the longitudinal line L2 where the laser cutting head 2 is located.
  • the first image sensor 3a is capable of detecting the lateral edge 5a of the liquid crystal panel 5 when the laser cutting head 2 is moved in the lateral direction.
  • the second image sensor 3b detects the longitudinal edge 5b of the liquid crystal panel 5 as the laser cutting head 2 moves along the longitudinal direction. In this way, the entire edges of the liquid crystal panel 5 can be completely detected.
  • the first image sensor 3a and the second image sensor 3b are each selectable as a CCD sensor (Charge-coupled Device).
  • the damage at the edge of the liquid crystal panel 5 is detected by the CCD sensor, and the detection result can be known in time and accurately, thereby ensuring that the liquid crystal panel 5 with defects is not easily missed.
  • the laser cutting device 10 further includes a fill light.
  • the fill light can be selected as an LED light or an incandescent light, which can be disposed around the laser cutting head 2 for illuminating the liquid crystal panel 5, thereby improving the accuracy of the detection result.
  • the first image sensor 3a is configured to be movable following the laser cutting head 2 while the laser cutting head 2 is moving laterally and always behind the laser cutting head 2, while the second image sensor 3b is also configured to When the laser cutting head 2 is moved longitudinally it is able to follow the laser cutting head 2 and is always behind the laser cutting head 2. In this way, it is possible to perform the first cutting and re-detection to prevent missing defective products caused by improper cutting.
  • the laser cutting apparatus 10 further includes a processor connected to both the first image sensor 3a and the second image sensor 3b.
  • the processor can be selected as a computer.
  • the computer can judge whether or not the liquid crystal panel 5 is qualified based on the detection results with the first image sensor 3a and the second image sensor 3b. How the computer detects the damage at the edge of the liquid crystal panel 5 is well known to those skilled in the art and will not be described herein.
  • a second detector is provided on the outside of the laser cutting head 2.
  • the second detector is used to detect the cut-off condition of the short-circuit ring connection to prevent the liquid crystal panel 5 after the IC driving component and the circuit board from being mounted from operating normally.
  • the IC driver components and circuit boards are well known to those skilled in the art and will not be described in detail herein.
  • the second detector comprises a transverse line disposed in the laser cutting head 2 A third image sensor 4a on L1, and a fourth image sensor 4b disposed on the longitudinal line L2 where the laser cutting head 2 is located.
  • the number of the third image sensors 4a may be two, which are symmetrical with respect to each other with respect to the laser cutting head 2.
  • the number of the fourth image sensors 4b may also be two, which are symmetrical with respect to each other with respect to the laser cutting head 2.
  • the third image sensor 4a and the fourth image sensor 4b are each selected as a CCD sensor.
  • the laser cutting device 10 detects the damage at the edge of the liquid crystal panel 5 by the first detector 3, so that the defective liquid crystal panel 5 can be accurately and timely discovered, preventing the defective liquid crystal panel 5 from flowing into the lower portion. Workshop or manufacturer.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Liquid Crystal (AREA)

Abstract

一种激光切割装置（10），用于切割液晶面板（5）的短路环连线。激光切割装置（10）包括用于切割液晶面板（5）的短路环连线的激光切割头（2），以及设在激光切割头（2）外的用于检测液晶面板（5）的边缘处破损情况的第一检测器（3）。激光切割装置（10）通过第一检测器（3）来检测液晶面板（5）边缘处的破损情况，使得带有缺陷的液晶面板（5）能够被及时发现，从而防止带有缺陷的液晶面板（5）流入下个车间或厂商。

Description

激光切割装置
相关申请的交叉引用
本申请要求享有于2014年12月10日提交的名称为“激光切割装置”的中国专利申请CN201410755724.7的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本发明涉及一种激光切割装置，尤其是一种用于切割液晶面板的短路环连线的激光切割装置。
背景技术
随着如今社会高速的发展，推动了液晶面板自动化生产走向高效、高质的生产道路，在生产液晶面板中每个环节都需要严格监督质量，以防缺陷产品流入下个车间或厂商。
在液晶面板的生产工艺中，需要利用现有的激光切割装置来切割液晶面板的边缘处的短路环连线，以确保安装了IC驱动元件和电路板后的液晶面板能够正常运行。
然而，现有的激光切割装置能够利用激光切割短路环连线，并对短路环连线的切断晴况进行检测。但是，该激光切割装置不能对液晶面板边缘处的破损情况进行检测，使得带有缺陷的液晶面板不能被发现，导致这些带有缺陷的液晶面板流入下个车间或厂商。
发明内容
为了解决上述问题，本发明的目的是提供一种激光切割装置，其能对液晶面板边缘处的破损情况进行检测，以便及时有效地检测出带有缺陷的液晶面板，从而防止带有缺陷的液晶面板流入下个车间或厂商。
本发明提供了一种激光切割装置，其用于切割液晶面板的短路环连线。该激 光切割装置包括用于切割液晶面板的短路环连线的激光切割头，以及设在激光切割头外的用于检测液晶面板的边缘处破损情况的第一检测器。通过第一检测器能够及时准确地检测的液晶面板的边缘处破损情况，并根据破损情况判断其是否属于缺陷产品，通过这种方式可以防止带有缺陷的液晶面板流入下个车间或厂商。
在一个实施例中，第一检测器包括用于检测液晶面板的横向边缘的第一图像传感器和用于检测液晶面板的纵向边缘的第二图像传感器。由此，可以完整地检测液晶面板的边缘。
在一个实施例中，第一图像传感器设置在激光切割头所在的横向线上，而第二图像传感器设置在激光切割头所在的纵向线上。当激光切割头沿着横向移动过程时，第一图像传感器能够有效地检测液晶面板的横向边缘。当激光切割头沿着纵向移动过程时，第二图像传感器能够有效地检测液晶面板的纵向边缘。
在一个实施例中，在激光切割头横向移动时，第一图像传感器能够跟随激光切割头进行移动并始终处于激光切割头的后方；在激光切割头纵向移动时，第二图像传感器能够跟随激光切割头进行移动并始终处于激光切割头的后方。通过这种方式，能够实现先切割再检测，以防遗漏掉由切割不当造成的缺陷。
在一个实施例中，第一和第二图像传感器均为CCD传感器。通过CCD传感器来检测液晶面板的边缘处破损情况，能够及时准确地获知检测结果，以防遗漏掉轻微破损的液晶面板。
在一个实施例中，激光切割装置用于薄膜晶体管液晶显示器的液晶面板的短路环连线。
在一个实施例中，上述激光切割装置还包括用于照射液晶面板的补光灯。补光灯能够照射液晶面板，提高检测结果的准确性。
在一个实施例中，在激光切割头的外侧设有用于检测短路环连线的切断晴况的第二检测器。由此，能够保证每个短路环连线都能被激光切割头切断。
在一个实施例中，第二检测器包括设置在激光切割头所在的横向线上的第三图像传感器，以及设置在激光切割头所在的纵向线上的第四图像传感器。
在一个实施例中，第三和第四图像传感器均为CCD传感器。
根据本发明的激光切割装置通过第一检测器来检测液晶面板边缘处的破损情况，使得带有缺陷的液晶面板能够被准确及时的发现，从而防止带有缺陷的液晶面板流入下个车间或厂商。
另外，根据本发明的激光切割装置通过第二检测器来检测短路环连线的切断情况，以确保每个短路环连线都能被激光切割头切断。
根据本发明的激光切割装置的结构简单，加工方便，组装容易，使用安全可靠，便于实施推广应用。
附图说明
在下文中将基于实施例并参考附图来对本发明进行更详细的描述。其中：
图1显示了根据本发明的激光切割装置和待要切割短路环连线的液晶面板；以及
图2显示了根据本发明的激光切割装置的激光切割头、第一和第二检测器。
在附图中，相同的部件使用相同的附图标记。附图并未按照实际的比例绘制。
具体实施方式
下面将结合附图对本发明作进一步说明。
图1显示了根据本发明的激光切割装置10，其俗称液晶屏短路环激光切割机。该激光切割装置10可以用于切割TFT-LCD液晶面板(即薄膜晶体管液晶显示器的液晶面板)的短路环连线。在图1所示的坐标系内，T轴表示横向，V轴表示纵向。
该激光切割装置10包括能够发出激光束的激光切割头2。激光切割头2发出的脉冲激光经扩束和聚焦后能够达到适当的能量密度，并沿着移动路径6对液晶面板5边缘处的短路环连线进行切割，促使电极材料瞬间汽化，形成切口以实现短路环的切割要求。
根据本发明的激光切割装置10还包括设置在激光切割头2外的第一检测器3。在切割过程中，第一检测器3能够跟随激光切割头2移动，并对液晶面板5的边缘处破损情况进行检测。通过这种方式，能够及时准确地检测出带有缺陷的液晶面板5，以便防止带有缺陷的液晶面板5流入下个车间或厂商。其中，对液晶面板5边缘处的破损情况检测的具体内容包括：是否存在凸起或凹陷，是否存在腐蚀部位，是否存在短路部位，以及是否存在毛刺或锯齿。
第一检测器3包括用于检测液晶面板5的横向边缘5a的第一图像传感器3a，以及用于检测液晶面板5的纵向边缘5b的第二图像传感器3b。除此之外，第一 图像传感器3a和第二图像传感器3b也可以由位移传感器、例如红外线传感器替换。
如图2所示，第一图像传感器3a设置在激光切割头2所在的横向线L1上，而第二图像传感器3b设置在激光切割头2所在的纵向线L2上。当激光切割头2沿着横向移动过程时，第一图像传感器3a能够对液晶面板5的横向边缘5a进行检测。当激光切割头2沿着纵向移动过程时，第二图像传感器3b对液晶面板5的纵向边缘5b进行检测。通过这种方式，可以完整地检测液晶面板5的全部边缘。
在一个实施例中，第一图像传感器3a和第二图像传感器3b均可选为CCD传感器(电荷耦合元件，Charge-coupled Device)。通过CCD传感器来检测液晶面板5的边缘处破损情况，能够及时准确地获知检测结果，从而确保带有缺陷的液晶面板5不易被遗漏掉。
为了提高检测结果的准确性，激光切割装置10还包括补光灯。补光灯可选为LED灯或白炽灯，其可设置在激光切割头2的周围，用于照射液晶面板5，提高检测结果的准确性。
在一个实施例中，第一图像传感器3a构造成在激光切割头2横向移动时其能够跟随激光切割头2进行移动并始终处于激光切割头2的后方，同时第二图像传感器3b也构造成在激光切割头2纵向移动时其能够跟随激光切割头2进行移动并始终处于激光切割头2的后方。通过这种方式，能够实现先切割再检测，防遗漏掉由切割不当造成的缺陷产品。
根据本发明的激光切割装置10还包括与第一图像传感器3a和第二图像传感器3b均相连的处理器。处理器可选择为计算机。该计算机可根据与第一图像传感器3a和第二图像传感器3b的检测结果判断液晶面板5是否合格。关于计算机如何检测液晶面板5的边缘处破损情况属于本领域技术人员熟知内容，在此不再赘述。
在一个实施例中，在激光切割头2的外侧设有第二检测器。第二检测器用于检测短路环连线的切断晴况，以防止安装IC驱动元件和电路板后的液晶面板5不能正常运行。所述的IC驱动元件和电路板属于本领域技术人员熟知的，在此不再详细叙述。
在一个优选的实施例中，第二检测器包括设置在激光切割头2所在的横向线 L1上的第三图像传感器4a，以及设置在激光切割头2所在的纵向线L2上的第四图像传感器4b。通过这种方式，能够对液晶面板5边缘处的全部短路环进行检测，以避免出现切割不良的短路环。其中，第三图像传感器4a的数量可是两个，它们关于激光切割头2相互对称。第四图像传感器4b的数量也可是两个，它们关于激光切割头2相互对称。
在一个优选的实施例中，第三图像传感器4a和第四图像传感器4b均选为CCD传感器。通过CCD传感器检测短路环连线的切断晴况，能够及时准确地获知检测结果，避免出现切割不良的短路环。
根据本发明的激光切割装置10通过第一检测器3来检测液晶面板5边缘处的破损情况，使得带有缺陷的液晶面板5能够被准确及时的发现，防止带有缺陷的液晶面板5流入下个车间或厂商。
虽然已经参考优选实施例对本发明进行了描述，但在不脱离本发明的范围的情况下，可以对其进行各种改进并且可以用等效物替换其中的部件。尤其是，只要不存在结构冲突，各个实施例中所提到的各项技术特征均可以任意方式组合起来。本发明并不局限于文中公开的特定实施例，而是包括落入权利要求的范围内的所有技术方案。

Claims (14)

  1. 一种激光切割装置，其用于切割液晶面板的短路环连线，其中，所述激光切割装置包括用于切割所述液晶面板的短路环连线的激光切割头，以及设在所述激光切割头外的用于检测所述液晶面板的边缘处破损情况的第一检测器。
  2. 根据权利要求1所述的激光切割装置，其中，所述第一检测器包括用于检测所述液晶面板的横向边缘的第一图像传感器和用于检测所述液晶面板的纵向边缘的第二图像传感器。
  3. 根据权利要求2所述的激光切割装置，其中，所述第一图像传感器设置在所述激光切割头所在的横向线上，而所述第二图像传感器设置在所述激光切割头所在的纵向线上。
  4. 根据权利要求3所述的激光切割装置，其中，在所述激光切割头横向移动时，所述第一图像传感器能够跟随所述激光切割头进行移动并处于所述激光切割头的后方；
    在所述激光切割头纵向移动时，所述第二图像传感器能够跟随所述激光切割头进行移动并处于所述激光切割头的后方。
  5. 根据权利要求4所述的激光切割装置，其中，所述第一和第二图像传感器均为CCD传感器。
  6. 根据权利要求5所述的激光切割装置，其中，在所述激光切割头的外侧设有用于检测所述短路环连线的切断情况的第二检测器。
  7. 根据权利要求6所述的激光切割装置，其中，所述第二检测器包括设置在所述激光切割头所在的横向线上的第三图像传感器和设置在所述激光切割头所在的纵向线上的第四图像传感器。
  8. 根据权利要求7所述的激光切割装置，其中，所述第三和第四图像传感器均为CCD传感器。
  9. 根据权利要求8所述的激光切割装置，其中，所述激光切割装置用于切割薄膜晶体管液晶显示器的液晶面板的短路环连线。
  10. 根据权利要求9所述的激光切割装置，其中，还包括用于照射所述液晶面板的补光灯。
  11. 根据权利要求1所述的激光切割装置，其中，在所述激光切割头的外侧设有用于检测所述短路环连线的切断情况的第二检测器。
  12. 根据权利要求11所述的激光切割装置，其中，所述第二检测器包括设置在所述激光切割头所在的横向线上的第三图像传感器和设置在所述激光切割头所在的纵向线上的第四图像传感器。
  13. 根据权利要求12所述的激光切割装置，其中，所述第三和第四图像传感器均为CCD传感器。
  14. 根据权利要求12所述的激光切割装置，其中，所述激光切割装置用于切割薄膜晶体管液晶显示器的液晶面板的短路环连线。
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