WO2016086892A1 - 金属层积连接电路及其制备方法 - Google Patents

金属层积连接电路及其制备方法 Download PDF

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WO2016086892A1
WO2016086892A1 PCT/CN2015/096371 CN2015096371W WO2016086892A1 WO 2016086892 A1 WO2016086892 A1 WO 2016086892A1 CN 2015096371 W CN2015096371 W CN 2015096371W WO 2016086892 A1 WO2016086892 A1 WO 2016086892A1
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metal
circuit
layer
connection circuit
substrate
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PCT/CN2015/096371
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English (en)
French (fr)
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孔星
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广东明路电力电子有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing

Definitions

  • the present invention relates to a power circuit, particularly a metal layered connection circuit and a method of fabricating the same.
  • the current circuits mainly include PCBA, thin film circuits and thick film circuits using ceramics as substrates. These three circuits are well known to those skilled in the art, and the main disadvantages thereof are: complicated production process and low production efficiency.
  • a metal layered connection circuit comprising: a substrate, a bottom layer circuit, an electronic component, and at least one upper layer circuit; the bottom layer line is disposed on the substrate; the electronic component is disposed on the bottom layer line, and the upper layer line is disposed on the bottom layer line, And combined with the underlying line connection into a circuit with a certain thickness.
  • the above metal layer connection circuit is a completely new technology, and its circuit is named MLC/MLCA because its circuit is layered on one layer of metal and formed on a plane. This circuit is different from current PCBA, thin film circuits and thick film circuits.
  • the electronic component has a pin that is in conductive contact with the circuit, and the pin is fixed between the lower layer line and the upper layer line.
  • the substrate may be a flexible fiber sheet or a rigid fiber sheet.
  • Fiber sheet is a new kind of heat conduction and insulation material, which is like paper thin, has good thermal conductivity and insulation performance, and has not been used as a substrate for power circuits.
  • Another object of the present invention is to provide a method for preparing a metal laminated connection circuit which is simple in process, can improve production efficiency, and reduces manufacturing cost.
  • Another object of the invention is achieved in this way:
  • a method for preparing a metal layer connection circuit characterized in that:
  • the substrate is prepared, and a conductive and thermally conductive slurry is coated on the surface of the substrate according to the layout requirement of the circuit to form an underlying circuit;
  • the second step is to mount the electronic components on the underlying line by using the viscosity of the slurry
  • a cover mask is placed on the electronic component, and a corresponding portion of the cover mask is provided with a hollow portion;
  • the upper layer line having a certain thickness is formed on the hollow portion by using a metal thermal spraying technique or a laser printing sintering technology, and the pin fixing of the electronic component is completed at the same time;
  • the cover mask is removed.
  • the metal thermal spraying technology is: spraying a metal layer on the hollow portion, and the metal layer is an upper layer circuit, and the metal layer electrically connects and fixes the pin of the electronic component with the lower layer line.
  • the distance between the head and the cover mask is 40 mm or less.
  • the laser printing and sintering technology is: first, filling the hollow portion with metal powder; then, irradiating the metal powder with a laser head of the printing device to melt the metal powder to form an upper layer, The pins of the electronic component are electrically connected to the lower layer and fixed together.
  • the metal layer connection circuit includes a plurality of sub-power circuits, and the metal layer connection circuit is cut after the fifth step to separate the respective sub-power circuits.
  • the substrate is selected from fiber sheets (including flexible fiber sheets and rigid fiber sheets).
  • the upper layer line is at least one layer, and the number of layers of the upper layer line is appropriately increased or decreased according to the power requirement of the circuit to change the thickness of the circuit.
  • the invention adopts a completely new design concept, and the power circuit is arranged on the substrate by a new process to form a circuit by layer-by-layer metal superposition, and the bottom line of the circuit mainly adopts coating (coating heat conduction, conductive paste).
  • the method is formed, and the superimposed circuit is mainly formed by metal thermal spraying technology or laser printing sintering technology, thereby realizing the small volume of the circuit, simple production process, low cost, no pollution, high production efficiency (may be current process) 10 times) and other advantages;
  • the upper layer can be formed while fixing the pins of the electronic component that need to be soldered to the circuit, and the pins form a good conductive contact with the circuit;
  • the working temperature is below 80 ° C, and no damage is caused to the electronic components.
  • FIG. 1 is a schematic structural view of an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of the A-A of FIG. 1.
  • FIG. 2 is a schematic cross-sectional view of the A-A of FIG. 1.
  • FIG. 3 is a block diagram showing the manufacturing process of the metal layered connection circuit of the present invention.
  • a metal layer connection circuit includes a substrate 1, a bottom line 2, an electronic component 3, and at least one upper layer line 5.
  • the bottom layer 2 is disposed on the substrate 1, and the electronic component 3 is disposed on
  • the upper line 5 is disposed on the bottom line 2 and connected to the bottom line 2 to form a circuit having a certain thickness.
  • the electronic component 3 has a pin 4 that is in conductive contact with a circuit, and the pin 4 is fixed between the lower layer line and the upper layer line 5.
  • the substrate 1 is a fiber sheet.
  • the metal layer connection circuit includes a plurality of sub power circuits.
  • a method for preparing a metal layer connection circuit is as follows:
  • the substrate 1 (preferably a fiber sheet) is prepared, and the surface of the substrate 1 is coated with a conductive and thermally conductive slurry according to the layout requirements of the circuit to form the bottom layer 2;
  • the second step using the viscosity of the slurry to mount the electronic component 3 on the bottom line 2;
  • a cover mask is placed on the electronic component 3, and a corresponding portion of the cover mask is provided with a hollow portion;
  • the upper layer 5 having a certain thickness is formed on the hollow portion by using a metal thermal spraying technique or a laser printing sintering technique, and the pin 4 of the electronic component 3 is simultaneously fixed;
  • the fifth step is to remove the cover mask
  • the metal layer connection circuit is cut to separate the respective sub power circuits.
  • the metal thermal spraying technology is: spraying a metal layer on the hollow portion, and the metal layer is an upper layer 5, and the metal layer electrically connects and fixes the pin 4 of the electronic component 3 with the lower layer.
  • the distance between the head and the cover mask is 40 mm or less.
  • the laser printing and sintering technology is: first, filling the hollow portion with the metal powder; then, irradiating the metal powder with the laser head of the printing device to melt the metal powder to form the upper layer 5, and the pin of the electronic component 3 4 is connected to the lower line and fixed together.
  • pin 4 of the electronic component 3 when the pin 4 of the electronic component 3 is narrow, it is fixed by laser printing and sintering technology; when the pin 4 of the electronic component 3 is wider, it is fixed by metal thermal spraying technology.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

一种金属层积连接电路及其制备方法，金属层积连接电路包括基板（1）、底层线路（2）、电子元件（3）和至少一层上层线路（5），底层线路（2）设置在基板（1）上，电子元件（3）设置在底层线路（2）上，上层线路（5）设置在底层线路（2）上、并与底层线路（2）连接结合成具有一定厚度的电路，将功率电路采用全新的工艺设置在基板（1）上通过一层一层的金属叠加形成电路，该电路的底层线路（2）主要采用涂浆的方式形成，而上层叠加的线路主要通过金属热喷涂技术或激光打印熔结技术形成，从而实现了该电路的体积小，生产工艺简单、成本低、无污染、生产效率高等优点，生产效率可以是目前工艺的10倍。

Description

金属层积连接电路及其制备方法 技术领域
本发明涉及功率电路，特别是金属层积连接电路及其制备方法。
背景技术
目前的电路主要有PCBA、薄膜电路和采用陶瓷作为基板的厚膜电路，这三种电路都是本领域技术人员所熟知的，其不足主要有：生产工艺较为复杂、生产效率较低等。
发明内容
本发明的一目的在于提供一种结构简单、合理，体积小的金属层积连接电路。
本发明的一目的是这样实现的：
一种金属层积连接电路，其特征在于：包括基板、底层线路、电子元件和至少一层上层线路，底层线路设置在基板上，电子元件设置在底层线路上，上层线路设置在底层线路上、并与底层线路连接结合成具有一定厚度的电路。
上述金属层积连接电路是一种全新的技术，由于其电路是靠金属一层一层层积并形成于平面上，所以命名为MLC/MLCA。这种电路有别于目前的PCBA、薄膜电路和厚膜电路等。
本发明的目的还可以采用以下技术措施解决：
作为更具体的方案，所述电子元件具有与电路导电接触的引脚，引脚固定在下层线路与上层线路之间。
所述基板可以是柔性纤维片材，也可以是硬性纤维片材。纤维片材是一种新型的导热、绝缘材料，其彷如纸薄，具有良好的导热性能和绝缘性能，目前还没有用作于功率电路的基板。
本发明的另一目的在于提供一种工艺简单、能提高生产效率、降低制造成本的金属层积连接电路制备方法。
本发明的另一目的是这样实现的：
一种金属层积连接电路的制备方法，其特征在于：
第一步，准备好基板，并根据电路的布局要求在基板表面涂上导电导热的浆料，以形成底层线路；
第二步，利用浆料的粘性在底层线路上贴装电子元件；
第三步，在电子元件上放置盖掩模板，盖掩模板对应电路设有镂空部；
第四步，采用金属热喷涂技术或激光打印熔结技术对所述镂空部形成具有一定厚度的上层线路、并同时完成电子元件的引脚固定；
第五步，取走盖掩模板。
所述金属热喷涂技术为：对镂空部喷涂金属层，金属层即为上层线路，金属层将电子元件的引脚与下层线路导通并固定在一起。
喷涂金属层时，喷头与盖掩模板的距离在40mm或以内。
作为更具体另一种的方案，所述激光打印熔结技术为：首先，向镂空部内填充金属粉末；然后，利用打印设备的激光头对金属粉末进行照射，使金属粉末熔化后形成上层线路、并将电子元件的引脚与下层线路导通并固定在一起。
作为更佳的方案，所述金属层积连接电路包括多个子功率电路，在第五步之后对金属层积连接电路进行切割，以将各个子功率电路分开。
所述基板选用纤维片材(包括柔性纤维片材和硬性纤维片材)。
所述上层线路至少为一层，根据电路的功率要求，适当增加或减小上层线路的层数，以改变电路的厚度。
本发明的有益效果如下：
(1)本发明采用全新的设计理念，将功率电路采用全新的工艺设置在基板上通过一层一层的金属叠加形成电路，该电路的底层线路主要采用涂浆(涂导热、导电浆料)的方式形成，而上层叠加的线路主要通过金属热喷涂技术或激光打印熔结技术形成，从而实现了该电路的体积小，生产工艺简单、成本低、无污染、生产效率高(可以是目前工艺的10倍)等优点；
(2)上层线路形成的同时可以把电子元件需要与电路焊接的引脚固定在电路上、并且使得引脚与电路形成良好的导电接触；
(3)采用金属热喷涂技术或激光打印熔结技术制备上层电路时，其工作温度在80℃以下，不对电子元件造成伤害。
附图说明
图1为本发明一实施例结构示意图。
图2为图1的A-A剖视结构示意图。
图3为本发明金属层积连接电路制作流程框图。
具体实施方式
下面结合附图及实施例对本发明作进一步描述。
参见图1和图2所示，一种金属层积连接电路，包括基板1、底层线路2、电子元件3和至少一层上层线路5，底层线路2设置在基板1上，电子元件3设置在底层线路2上，上层线路5设置在底层线路2上、并与底层线路2连接结合成具有一定厚度的电路。
所述电子元件3具有与电路导电接触的引脚4，引脚4固定在下层线路与上层线路5之间。
所述基板1为纤维片材。
所述金属层积连接电路包括多个子功率电路。
结合图3所示，一种金属层积连接电路的制备方法：
第一步，准备好基板1(优选为纤维片材)，并根据电路的布局要求在基板1表面涂上导电导热的浆料，以形成底层线路2；
第二步，利用浆料的粘性在底层线路2上贴装电子元件3；
第三步，在电子元件3上放置盖掩模板，盖掩模板对应电路设有镂空部；
第四步，采用金属热喷涂技术或激光打印熔结技术对所述镂空部形成具有一定厚度的上层线路5、并同时完成电子元件3的引脚4固定；
第五步，取走盖掩模板；
第六步，对金属层积连接电路进行切割，以将各个子功率电路分开。
所述金属热喷涂技术为：对镂空部喷涂金属层，金属层即为上层线路5，金属层将电子元件3的引脚4与下层线路导通并固定在一起。
喷涂金属层时，喷头与盖掩模板的距离在40mm或以内。
所述激光打印熔结技术为：首先，向镂空部内填充金属粉末；然后，利用打印设备的激光头对金属粉末进行照射，使金属粉末熔化后形成上层线路5、并将电子元件3的引脚4与下层线路导通并固定在一起。
一般情况下，当电子元件3的引脚4较窄时，采用激光打印熔结技术对其进行固定；当电子元件3的引脚4较宽时，采用金属热喷涂技术对其进行固定。

Claims (10)

  1. 一种金属层积连接电路，其特征在于：包括基板、底层线路、电子元件和至少一层上层线路，底层线路设置在基板上，电子元件设置在底层线路上，上层线路设置在底层线路上、并与底层线路连接结合成具有一定厚度的电路。
  2. 根据权利要求1所述金属层积连接电路，其特征在于：所述电子元件具有与电路导电接触的引脚，引脚固定在下层线路与上层线路之间。
  3. 根据权利要求1所述金属层积连接电路，其特征在于：所述基板为柔性纤维片材或硬性纤维片材。
  4. 根据权利要求1所述金属层积连接电路的制备方法，其特征在于：
    第一步，准备好基板，并根据电路的布局要求在基板表面涂上导电导热的浆料，以形成底层线路；
    第二步，利用浆料的粘性在底层线路上贴装电子元件；
    第三步，在电子元件上放置盖掩模板，盖掩模板对应电路设有镂空部；
    第四步，采用金属热喷涂技术或激光打印熔结技术对所述镂空部形成具有一定厚度的上层线路、并同时完成电子元件的引脚固定；
    第五步，取走盖掩模板。
  5. 根据权利要求4所述金属层积连接电路的制备方法，其特征在于：所述金属热喷涂技术为：对镂空部喷涂金属层，金属层即为上层线路，金属层将电子元件的引脚与下层线路导通并固定在一起。
  6. 根据权利要求5所述金属层积连接电路的制备方法，其特征在于：喷涂金属层时，喷头与盖掩模板的距离在40mm或以内。
  7. 根据权利要求4所述金属层积连接电路的制备方法，其特征在于：所述激光打印熔结技术为：首先，向镂空部内填充金属粉末；然后，利用打印设备的激光头对金属粉末进行照射，使金属粉末熔化后形成上层线路、并将电子元件的引脚与下层线路导通并固定在一起。
  8. 根据权利要求4所述金属层积连接电路的制备方法，其特征在于：所述金属层积连接电路包括多个子功率电路，在第五步之后对金属层积连接电路进行切割，以将各个子功率电路分开。
  9. 根据权利要求4所述金属层积连接电路的制备方法，其特征在于：所述基板选用柔性纤维片材或硬性纤维片材。
  10. 根据权利要求4所述金属层积连接电路的制备方法，其特征在于：所述上层线路至少为一层。
PCT/CN2015/096371 2014-12-05 2015-12-04 金属层积连接电路及其制备方法 WO2016086892A1 (zh)

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