CN104582270A - 金属层积连接电路及其制备方法 - Google Patents
金属层积连接电路及其制备方法 Download PDFInfo
- Publication number
- CN104582270A CN104582270A CN201410731005.1A CN201410731005A CN104582270A CN 104582270 A CN104582270 A CN 104582270A CN 201410731005 A CN201410731005 A CN 201410731005A CN 104582270 A CN104582270 A CN 104582270A
- Authority
- CN
- China
- Prior art keywords
- circuit
- metal
- connecting circuit
- metal laminate
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410731005.1A CN104582270B (zh) | 2014-12-05 | 2014-12-05 | 金属层积连接电路的制备方法 |
PCT/CN2015/096371 WO2016086892A1 (zh) | 2014-12-05 | 2015-12-04 | 金属层积连接电路及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410731005.1A CN104582270B (zh) | 2014-12-05 | 2014-12-05 | 金属层积连接电路的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104582270A true CN104582270A (zh) | 2015-04-29 |
CN104582270B CN104582270B (zh) | 2018-04-27 |
Family
ID=53097163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410731005.1A Active CN104582270B (zh) | 2014-12-05 | 2014-12-05 | 金属层积连接电路的制备方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN104582270B (zh) |
WO (1) | WO2016086892A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016086892A1 (zh) * | 2014-12-05 | 2016-06-09 | 广东明路电力电子有限公司 | 金属层积连接电路及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040142505A1 (en) * | 2003-01-21 | 2004-07-22 | Siliconware Precision Industries Co., Ltd. | Semiconductor package free of substrate and fabrication method thereof |
CN103855037A (zh) * | 2012-11-28 | 2014-06-11 | 同和金属技术有限公司 | 电子部件安装基板及其制造方法 |
CN204335151U (zh) * | 2014-12-05 | 2015-05-13 | 广东明路电力电子有限公司 | 金属层积连接电路 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102065645B (zh) * | 2009-11-17 | 2012-10-10 | 王定锋 | 带元件的双面电路板及其互连导通方法 |
US9799627B2 (en) * | 2012-01-19 | 2017-10-24 | Semiconductor Components Industries, Llc | Semiconductor package structure and method |
CN104582270B (zh) * | 2014-12-05 | 2018-04-27 | 广东明路电力电子有限公司 | 金属层积连接电路的制备方法 |
CN204497998U (zh) * | 2015-01-28 | 2015-07-22 | 广东明路电力电子有限公司 | 电动车用驱动厚膜电路逆变模块 |
-
2014
- 2014-12-05 CN CN201410731005.1A patent/CN104582270B/zh active Active
-
2015
- 2015-12-04 WO PCT/CN2015/096371 patent/WO2016086892A1/zh active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040142505A1 (en) * | 2003-01-21 | 2004-07-22 | Siliconware Precision Industries Co., Ltd. | Semiconductor package free of substrate and fabrication method thereof |
CN103855037A (zh) * | 2012-11-28 | 2014-06-11 | 同和金属技术有限公司 | 电子部件安装基板及其制造方法 |
CN204335151U (zh) * | 2014-12-05 | 2015-05-13 | 广东明路电力电子有限公司 | 金属层积连接电路 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016086892A1 (zh) * | 2014-12-05 | 2016-06-09 | 广东明路电力电子有限公司 | 金属层积连接电路及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2016086892A1 (zh) | 2016-06-09 |
CN104582270B (zh) | 2018-04-27 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Preparation method for metal lamination connecting circuit Effective date of registration: 20200609 Granted publication date: 20180427 Pledgee: Agricultural Bank of China Limited Shunde Lunjiao sub branch Pledgor: GUANGDONG MENLO ELECTRIC POWER Co.,Ltd. Registration number: Y2020980002875 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230317 Granted publication date: 20180427 Pledgee: Agricultural Bank of China Limited Shunde Lunjiao sub branch Pledgor: GUANGDONG MENLO ELECTRIC POWER Co.,Ltd. Registration number: Y2020980002875 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Preparation method of metal layer connection circuit Effective date of registration: 20230323 Granted publication date: 20180427 Pledgee: Agricultural Bank of China Limited Shunde Lunjiao sub branch Pledgor: GUANGDONG MENLO ELECTRIC POWER Co.,Ltd. Registration number: Y2023980035893 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |