WO2016078052A1 - Led支架及led发光单元 - Google Patents

Led支架及led发光单元 Download PDF

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Publication number
WO2016078052A1
WO2016078052A1 PCT/CN2014/091726 CN2014091726W WO2016078052A1 WO 2016078052 A1 WO2016078052 A1 WO 2016078052A1 CN 2014091726 W CN2014091726 W CN 2014091726W WO 2016078052 A1 WO2016078052 A1 WO 2016078052A1
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Prior art keywords
region
led
radial dimension
bonding
transition
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PCT/CN2014/091726
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English (en)
French (fr)
Inventor
史利利
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史利利
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Application filed by 史利利 filed Critical 史利利
Priority to CN201490000319.8U priority Critical patent/CN205845998U/zh
Priority to PCT/CN2014/091726 priority patent/WO2016078052A1/zh
Publication of WO2016078052A1 publication Critical patent/WO2016078052A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present application relates to the field of light emitting diodes, and in particular, to an LED bracket and an LED lighting unit.
  • the existing LED bracket comprises a pedestal, and a accommodating cavity is arranged on the pedestal, and further comprises a positive electrode piece and a negative electrode piece, the positive electrode piece comprises a positive electrode lead and a positive electrode bonding wire area, and the negative electrode piece comprises a negative electrode lead and a negative electrode bonding wire.
  • the region and the die bonding region for fixing the LED chip are connected to the negative bonding wire region.
  • the solid crystal region is disposed horizontally adjacent to the positive electrode bonding zone.
  • the LED chip When soldering, the LED chip is first placed in the solid crystal region, and then the two poles of the LED chip are respectively led out and soldered to the positive electrode bonding wire region and the negative electrode bonding wire region.
  • the solid crystal region and the negative electrode bonding region are connected together without a boundary, the negative electrode bonding region is too close to the negative electrode, and the customer is soldering the LED soldering pins (including the negative terminal).
  • the generated heat is rapidly transferred to the solder joints in the negative wire bonding area, causing the solder joints to fall off to form a virtual soldering phenomenon, thereby affecting the reliability of the LED.
  • the present application aims to solve at least one of the above technical problems to some extent.
  • the present application provides an LED bracket, comprising: a base provided with a receiving cavity, an electrode piece disposed on the base, and a die bonding metal piece, the electrode piece comprising: a bonding wire region and a pin located in the accommodating cavity, and a transition region transitioning from the wire bonding region to the pin, the die bonding metal piece having a die bond for fixing the LED chip a region in which a direction in which the wire bonding region transitions to the pin is an axial direction, a radial dimension of the transition region is smaller than a radial dimension of a region on both sides of the transition region, the die bond metal sheet and the The wire bonding regions of the electrode sheets are connected.
  • the radial extent of the transition zone is less than 1/2 of the radial dimension of the zones on both sides of the transition zone.
  • the radial dimension of the transition zone is 1/3 or 1/4 of the radial dimension of the zones on both sides of the transition zone.
  • the LED bracket comprises: a positive electrode sheet and a negative electrode sheet.
  • the die bonding metal piece is connected to the bonding wire area of the positive electrode sheet or the negative electrode sheet.
  • the die bond metal sheet has heat dissipation legs in communication with the die bonding region.
  • the present application provides an LED lighting unit, including: an LED bracket and mounting An LED chip on the LED holder, the LED holder includes: a base provided with a receiving cavity, an electrode piece disposed on the base, and a die-bonding metal piece, the electrode piece comprising: a bonding wire region and a pin located in the accommodating cavity, and a transition region transitioning from the bonding wire region to the pin, the die bonding metal piece having a die bond for fixing the LED chip a region in which a direction in which the wire bonding region transitions to the pin is an axial direction, a radial dimension of the transition region is smaller than a radial dimension of a region on both sides of the transition region, the die bond metal sheet and the The wire bonding regions of the electrode sheets are connected.
  • the radial extent of the transition zone is less than 1/2 of the radial dimension of the zones on both sides of the transition zone.
  • the radial dimension of the transition zone is 1/3 or 1/4 of the radial dimension of the zones on both sides of the transition zone.
  • the LED bracket comprises: a positive electrode sheet and a negative electrode sheet.
  • the die bonding metal piece is connected to the bonding wire area of the positive electrode sheet or the negative electrode sheet.
  • the die bond metal sheet has heat dissipation legs in communication with the die bonding region.
  • the LED bracket comprises: a base provided with a receiving cavity, an electrode piece disposed on the base, and a die bonding metal piece, the electrode piece comprising: communicating a wire bond region and a pin located in the accommodating cavity, and a transition region transitioning from the wire bonding region to the pin, the die bonding metal piece having a solid for fixing the LED chip a crystal region, wherein a direction in which the wire bonding region transitions toward the pin is taken as an axial direction, and a radial dimension of the transition region is smaller than a radial dimension of a region on both sides of the transition region, the die bonding metal sheet and the The wire bonding regions of the electrode sheets are connected.
  • FIG. 1 is a schematic structural diagram of an LED lighting unit according to an embodiment of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • installation shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.
  • the embodiment provides an LED lighting unit, which can be used in various fields of display, illumination, signal indication, etc., and can be integrated into an LED display, an LED light bar or an LED signal light.
  • the above LED lighting unit mainly includes an LED bracket 1 and an LED chip 2 mounted on the LED bracket 1.
  • the LED holder 1 includes a susceptor 11 provided with a accommodating cavity 111, an electrode piece 12 disposed on the susceptor 11, and a fixed metal piece 13.
  • the electrode piece is divided into a positive electrode piece and a negative electrode piece, and the electrode piece mainly comprises: The interconnecting wire region 121 and the pin 122 in the accommodating cavity 111 and the transition region 123 extending from the wire bonding region 121 to the pin 122.
  • the die bond metal sheet 13 has a die bonding region 131 for fixing the LED chip 2.
  • the direction in which the bonding wire region 121 transitions to the pin 122 is taken as the axial direction, and the radial dimension of the transition region 123 is smaller than the radial dimension of the region on both sides of the transition region 123, and the die bonding metal sheet 13 and the electrode sheet The wire bond areas 121 of 12 are connected.
  • the radial dimension from the wire bonding zone to the transition zone may gradually become smaller or abruptly smaller, or the radial dimension from the lead to the transition zone may gradually become smaller or abruptly smaller, or by the wire bonding zone.
  • the radial dimension of the lead-to-transition zone can be gradually reduced or abruptly smaller, or the radial dimension of the transition zone from the wire-bonding zone can be gradually reduced or abruptly smaller, and the transition from pin to pin
  • the radial dimension of the zone can be abruptly smaller or tapered.
  • the radial dimension of the transition region is small, so that the solder is produced by the lead solder.
  • the generated heat does not quickly diffuse into the wire area (thermal isolation), causing the solder joints to fall off and form a solder joint phenomenon, which ensures the reliability of the LED.
  • the radial extent of the transition zone 123 is less than 1/2 of the radial dimension of the zones on either side of the transition zone 123.
  • the radial extent of the transition zone 123 is 1/3 or 1/4 of the radial dimension of the zone on either side of the transition zone 123.
  • the die bonding metal piece 13 is connected to the bonding wire area of the positive electrode piece.
  • the die attach metal sheet 13 can be attached to the bond pad region of the negative electrode tab.
  • the solid crystal metal sheet has a heat dissipation leg that communicates with the solid crystal region.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED支架（1）及LED发光单元。LED支架（1）包括设置有容置腔（111）的基座（11）、设置于基座（11）上的电极片（12）以及固晶金属片（13）。电极片（12）包括相连通的、位于容置腔（111）内的焊线区（121）及引脚（122），以及由焊线区（121）向引脚（122）过渡的过渡区（123）。固晶金属片（13）具有用于固定LED芯片（2）的固晶区（131）。以焊线区（121）向引脚（122）过渡的方向作为轴向，过渡区（123）的径向尺寸小于过渡区（123）两侧区域的径向尺寸。固晶金属片（13）与电极片（12）的焊线区（121）相连。当进行电极片引脚（122）的焊锡时，由于过渡区（123）径向尺寸较小，使得引脚（122）焊锡所产生的热量不会迅速扩散到焊线区（121）导致焊线区（121）焊点脱落而形成虚焊现象，保证了LED的可靠性。

Description

LED支架及LED发光单元 技术领域
本申请涉及发光二极管领域，尤其涉及一种LED支架及LED发光单元。
背景技术
由于发光二极管(Light Emitting Diode，LED)具有高安全性、运行平稳、低能耗、高光效、寿命长等多种优点被越来越广泛地应用于平板电脑、笔记本电脑、液晶显示器、大尺寸液晶电视及室内照明和室外照明领域。现有的LED支架，包括基座，在基座上设置有容置腔，还包括正极片和负极片，正极片包括正极引脚和正极焊线区，负极片包括负极引脚、负极焊线区和用于固定LED芯片的固晶区，固晶区与负极焊线区连通在一起。固晶区靠近正极焊线区水平设置。
焊接时，先将LED芯片摆放在固晶区，然后通过引线分别将LED芯片的两极引出焊接在正极焊线区和负极焊线区。采用这种方式会存在以下问题：由于固晶区和负极焊线区连通在一起无界限区分，导致负极焊线区过于靠近负极引脚，客户在焊接LED的焊锡引脚时(包括负极引脚)产生的热量会急速传递到负极焊线区中的焊点，导致该焊点脱落形成虚焊的现象，从而影响LED的可靠性。
发明内容
本申请旨在至少在一定程度上解决上述技术问题之一。
根据本申请的第一方面，本申请提供一种LED支架，包括：设置有容置腔的基座、设置于所述基座上的电极片以及固晶金属片，所述电极片包括：相连通的、位于所述容置腔内的焊线区及引脚，以及由所述焊线区向所述引脚过渡的过渡区，所述固晶金属片具有用于固定LED芯片的固晶区，以所述焊线区向所述引脚过渡的方向作为轴向，所述过渡区的径向尺寸小于所述过渡区两侧区域的径向尺寸，所述固晶金属片与所述电极片的所述焊线区相连。
进一步地，所述过渡区的径向尺寸小于所述过渡区两侧区域的径向尺寸的1/2。
进一步地，所述过渡区的径向尺寸为所述过渡区两侧区域的径向尺寸的1/3或1/4。
进一步地，所述LED支架包括：正电极片及负电极片。
进一步地，所述固晶金属片与所述正电极片或所述负电极片的所述焊线区相连。
进一步地，所述固晶金属片具有与所述固晶区相连通的散热支脚。
根据本申请的第二方面，本申请提供一种LED发光单元，包括：LED支架以及安装 于所述LED支架上的LED芯片，所述LED支架包括：设置有容置腔的基座、设置于所述基座上的电极片以及固晶金属片，所述电极片包括：相连通的、位于所述容置腔内的焊线区及引脚，以及由所述焊线区向所述引脚过渡的过渡区，所述固晶金属片具有用于固定所述LED芯片的固晶区，以所述焊线区向所述引脚过渡的方向作为轴向，所述过渡区的径向尺寸小于所述过渡区两侧区域的径向尺寸，所述固晶金属片与所述电极片的所述焊线区相连。
进一步地，所述过渡区的径向尺寸小于所述过渡区两侧区域的径向尺寸的1/2。
进一步地，所述过渡区的径向尺寸为所述过渡区两侧区域的径向尺寸的1/3或1/4。
进一步地，所述LED支架包括：正电极片及负电极片。
进一步地，所述固晶金属片与所述正电极片或所述负电极片的所述焊线区相连。
进一步地，所述固晶金属片具有与所述固晶区相连通的散热支脚。
本申请的有益效果是：
通过提供一种LED支架及LED发光单元，所述LED支架包括：设置有容置腔的基座、设置于所述基座上的电极片以及固晶金属片，所述电极片包括：相连通的、位于所述容置腔内的焊线区及引脚，以及由所述焊线区向所述引脚过渡的过渡区，所述固晶金属片具有用于固定所述LED芯片的固晶区，以所述焊线区向所述引脚过渡的方向作为轴向，所述过渡区的径向尺寸小于所述过渡区两侧区域的径向尺寸，所述固晶金属片与所述电极片的所述焊线区相连。这样，当进行电极片引脚的焊锡时，由于过渡区径向尺寸较小，使得引脚焊锡所产生的热量不会迅速扩散到焊线区导致焊线区焊点脱落而形成虚焊现象，保证了LED的可靠性。
附图说明
图1为本申请实施例的LED发光单元的结构示意图。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度小于第二特征。
下面通过具体实施方式结合附图对本申请作进一步详细说明。
请参考图1，本实施例提供了一种LED发光单元，其可用于各种显示、照明、信号指示等领域，具体可集成为LED显示屏、LED灯条或LED信号灯等。
上述LED发光单元主要包括：LED支架1以及安装于LED支架1上的LED芯片2。LED支架1包括：设置有容置腔111的基座11、设置于基座11上的电极片12以及固晶金属片13，电极片分为正电极片及负电极片，电极片主要包括：相连通的、位于容置腔111内的焊线区121及引脚122，以及由焊线区121向引脚122过渡的过渡区123。固晶金属片13具有用于固定LED芯片2的固晶区131。为实现本实施例目的，以焊线区121向引脚122过渡的方向作为轴向，过渡区123的径向尺寸小于过渡区123两侧区域的径向尺寸，固晶金属片13与电极片12的焊线区121相连。
具体地，由焊线区向过渡区的径向尺寸可逐渐变小或陡然变小，或者，由引脚向过渡区的径向尺寸可逐渐变小或陡然变小，或者，由焊线区及引脚向过渡区的径向尺寸均可逐渐变小或陡然变小，或者，在由焊线区向过渡区的径向尺寸可逐渐变小或陡然变小的同时，由引脚向过渡区的径向尺寸可陡然变小或逐渐变小。
这样，当进行电极片引脚的焊锡时，由于过渡区径向尺寸较小，使得引脚焊锡所产 生的热量不会迅速扩散到焊线区(热隔离作用)导致焊线区焊点脱落而形成虚焊现象，保证了LED的可靠性。
在具体应用时，为提高热隔离作用，过渡区123的径向尺寸小于过渡区123两侧区域的径向尺寸的1/2。而作为优选实施例，过渡区123的径向尺寸为过渡区123两侧区域的径向尺寸的1/3或1/4。
在本实施例中，固晶金属片13与正电极片的焊线区相连。在其他实施例中，固晶金属片13可与负电极片的焊线区相连。
作为一种优选实施例，为了增强LED支架及LED发光单元的散热效果，固晶金属片具有与固晶区相连通的散热支脚。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上内容是结合具体的实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干简单推演或替换。

Claims (10)

  1. 一种LED支架，包括：设置有容置腔的基座、设置于所述基座上的电极片以及固晶金属片，所述电极片包括：相连通的、位于所述容置腔内的焊线区及引脚，以及由所述焊线区向所述引脚过渡的过渡区，所述固晶金属片具有用于固定LED芯片的固晶区，其特征在于，以所述焊线区向所述引脚过渡的方向作为轴向，所述过渡区的径向尺寸小于所述过渡区两侧区域的径向尺寸，所述固晶金属片与所述电极片的所述焊线区相连。
  2. 如权利要求1所述的LED支架，其特征在于，所述过渡区的径向尺寸小于所述过渡区两侧区域的径向尺寸的1/2。
  3. 如权利要求2所述的LED支架，其特征在于，所述过渡区的径向尺寸为所述过渡区两侧区域的径向尺寸的1/3或1/4。
  4. 如权利要求1所述的LED支架，其特征在于，所述LED支架包括：正电极片及负电极片。
  5. 如权利要求4所述的LED支架，其特征在于，所述固晶金属片与所述正电极片或所述负电极片的所述焊线区相连。
  6. 如权利要求5所述的LED支架，其特征在于，所述固晶金属片具有与所述固晶区相连通的散热支脚。
  7. 一种LED发光单元，包括：LED支架以及安装于所述LED支架上的LED芯片，所述LED支架包括：设置有容置腔的基座、设置于所述基座上的电极片以及固晶金属片，所述电极片包括：相连通的、位于所述容置腔内的焊线区及引脚，以及由所述焊线区向所述引脚过渡的过渡区，所述固晶金属片具有用于固定所述LED芯片的固晶区，其特征在于，以所述焊线区向所述引脚过渡的方向作为轴向，所述过渡区的径向尺寸小于所述过渡区两侧区域的径向尺寸，所述固晶金属片与所述电极片的所述焊线区相连。
  8. 如权利要求7所述的LED发光单元，其特征在于，所述过渡区的径向尺寸小于所述过渡区两侧区域的径向尺寸的1/2。
  9. 如权利要求8所述的LED发光单元，其特征在于，所述过渡区的径向尺寸为所述过渡区两侧区域的径向尺寸的1/3或1/4。
  10. 如权利要求7所述的LED发光单元，其特征在于，所述LED支架包括：正电极片及负电极片。
PCT/CN2014/091726 2014-11-20 2014-11-20 Led支架及led发光单元 WO2016078052A1 (zh)

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CN107946432A (zh) * 2017-12-13 2018-04-20 博罗县正润光电有限公司 一种注塑均匀的led支架
CN110529766A (zh) * 2019-09-29 2019-12-03 周莉莉 一种可变形多用途led灯

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CN101834267A (zh) * 2010-04-30 2010-09-15 深圳市奥伦德元器件有限公司 平面支架及封装方法
CN201628185U (zh) * 2009-07-02 2010-11-10 弘凯光电(深圳)有限公司 发光二极管支架及其封装结构
CN201732814U (zh) * 2010-07-20 2011-02-02 深圳市聚飞光电股份有限公司 一种提高可靠性的led支架和led
CN202167539U (zh) * 2011-07-28 2012-03-14 深圳市聚飞光电股份有限公司 一种led支架及led
CN203445146U (zh) * 2013-07-17 2014-02-19 邓青平 直贴式led支架

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CN101834267A (zh) * 2010-04-30 2010-09-15 深圳市奥伦德元器件有限公司 平面支架及封装方法
CN201732814U (zh) * 2010-07-20 2011-02-02 深圳市聚飞光电股份有限公司 一种提高可靠性的led支架和led
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