WO2016078021A1 - Led背光源及led模组 - Google Patents

Led背光源及led模组 Download PDF

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Publication number
WO2016078021A1
WO2016078021A1 PCT/CN2014/091573 CN2014091573W WO2016078021A1 WO 2016078021 A1 WO2016078021 A1 WO 2016078021A1 CN 2014091573 W CN2014091573 W CN 2014091573W WO 2016078021 A1 WO2016078021 A1 WO 2016078021A1
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WIPO (PCT)
Prior art keywords
led
mounting area
substrate
led chip
led module
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PCT/CN2014/091573
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English (en)
French (fr)
Inventor
魏晓敏
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魏晓敏
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Application filed by 魏晓敏 filed Critical 魏晓敏
Priority to PCT/CN2014/091573 priority Critical patent/WO2016078021A1/zh
Publication of WO2016078021A1 publication Critical patent/WO2016078021A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B31/00—Electric arc lamps
    • H05B31/48—Electric arc lamps having more than two electrodes
    • H05B31/50—Electric arc lamps having more than two electrodes specially adapted for ac
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means

Definitions

  • the present application relates to the field of light emitting diodes, and in particular, to an LED backlight and an LED module.
  • the liquid crystal display is a passive light emitting display device that requires a backlight to operate.
  • backlights for liquid crystal displays, which are backlights using cold cathode fluorescent (CCFL) and backlights of LEDs.
  • CCFL cold cathode fluorescent
  • LED backlights have gradually replaced CCFL backlights due to their high definition, energy saving, long life, ultra-wide color gamut and ultra-thin appearance, making them the main backlights for LCD screens.
  • the main component used for illumination in the LED backlight is an LED module, which includes a PCB substrate and a plurality of LED chips for light emission densely distributed on the PCB substrate. Among them, all LED chips use the same forward voltage range, such as forward voltage: 3.1 ⁇ 3.2 volts (V).
  • This structure has the following problems:
  • the temperature of each part of the PCB substrate is tested by an infrared camera.
  • the test results show that the temperature of the PCB substrate decreases from the central region to the edge region, especially the temperature difference between the central region and the edge region can reach above 8 °C.
  • the temperature of the PCB substrate will directly affect the performance of the LED.
  • the higher the temperature of the PCB substrate the higher the junction temperature of the LED chip, and the lower the luminous efficiency of the LED chip.
  • Related studies have also shown that when the junction temperature of the LED chip rises to 75 ° C, its brightness will be reduced to 80%; to 125 ° C, reduced to 60%; to 175 ° C, reduced to 40%.
  • the cloth is disposed on the PCB substrate, and all the LED chips adopt the same forward voltage range, and the heat generated by the operation of the LED chip in the edge region diffuses to the intermediate region, so that the temperature in the central region is higher, and the temperature difference between the central region and the edge region is larger.
  • the light effect of the central LED chip is much lower than that of the edge LED chip, and the reliability of the central LED chip is reduced.
  • the present application aims to solve at least one of the above technical problems to some extent.
  • the present application provides an LED backlight, which is composed of a plurality of LED modules, the LED module includes: a substrate, the substrate is spaced apart from the center to the edge in the same direction.
  • the LED module further includes: a first LED chip disposed on the first mounting area, and a second LED chip disposed on the second mounting area, the The forward voltage of an LED chip is less than The forward voltage of the second LED chip.
  • the center of the LED module is the first installation area.
  • the center of the LED module is the second installation area.
  • the substrate is a ceramic substrate or a metal substrate.
  • the substrate is a circular substrate or a square substrate.
  • first LED chips and/or the second LED chips are arranged at equal intervals.
  • a forward voltage difference between the first LED chip and the second LED chip is 0.1-0.2 volts.
  • the first LED chip is connected in series with the second LED chip.
  • first LED chips are connected in series with the second LED chip in parallel.
  • first LED chip and the second LED chip are SMD chips.
  • the present application provides an LED module including: a substrate, wherein the substrate is spaced apart from the center to the edge by a first mounting area and a second mounting area, and the LED module is further The method includes: a first LED chip disposed on the first mounting area, and a second LED chip disposed on the second mounting area, wherein a forward voltage of the first LED chip is smaller than the second LED chip Forward voltage.
  • the center of the LED module is the first installation area.
  • the center of the LED module is the second installation area.
  • the substrate is a ceramic substrate or a metal substrate.
  • the substrate is a circular substrate or a square substrate.
  • first LED chips and/or the second LED chips are arranged at equal intervals.
  • a forward voltage difference between the first LED chip and the second LED chip is 0.1-0.2 volts.
  • the first LED chip is connected in series with the second LED chip.
  • first LED chips are connected in series with the second LED chip in parallel.
  • first LED chip and the second LED chip are SMD chips.
  • the LED module includes a substrate, and the substrate includes a first mounting area and a second mounting area spaced apart from each other in a direction from the center to the edge.
  • the LED module further includes: a first LED chip disposed on the first mounting area, and a second LED chip disposed on the second mounting area, a forward voltage of the first LED chip is smaller than a smoothness of the second LED chip To the voltage.
  • the first safety The heat generated in the loading area will be less than the heat generated in the second mounting area, and the heat in the second mounting area can be evenly distributed to the first mounting area to reduce the temperature difference between the first mounting area and the second mounting area, so that the entire LED module
  • the heat distribution is more uniform, balancing the light effect between different mounting areas, making the backlight more uniform, and improving the reliability of the LED chip in the first mounting area.
  • FIG. 1 is a schematic structural view of an LED module according to an embodiment of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • installation shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.
  • the present application provides an LED backlight that can be used for devices for LED lighting, such as mobile phones, televisions, and the like.
  • the LED backlight is composed of a plurality of LED modules, and each of the LED modules mainly includes a substrate 1 and an LED chip 2 disposed on the substrate 1.
  • the substrate 1 is provided with a first mounting region 11 and a second mounting region 12 at intervals from the center to the edge.
  • the LED chip 2 is mainly divided into: a first LED chip 21 disposed on the first mounting region 11 and a second LED chip 22 disposed on the second mounting region 12, wherein the forward voltage of the first LED chip 21 It is smaller than the forward voltage of the second LED chip 22.
  • the heat generated in the first mounting area will be less than the heat generated in the second mounting area, and the heat in the second mounting area can be equally spread to the first mounting area to reduce the first mounting area and the second
  • the temperature difference in the installation area makes the heat distribution of the entire LED module more uniform, balances the light effect between different installation areas, makes the backlight light more uniform, and improves the reliability of the LED chip in the first installation area.
  • the center of the LED module is the first mounting area 11.
  • the center of the LED module can also be the second mounting area 12.
  • the substrate 1 is a square ceramic substrate.
  • the substrate 1 may also be a metal substrate or other type of substrate, such as a transparent ceramic substrate, a glass substrate, or the like, and the shape thereof may also be a circular shape or the like.
  • the first LED chips 21, and/or the second LED chips 22 are arranged at equal intervals. Of course, non-equal spacing is also an alternative solution.
  • the forward voltage difference between the first LED chip 21 and the second LED chip 22 is 0.1-0.2 volts.
  • the first LED chip 21 may have a forward voltage of 3.1 volts and the second LED chip 22 has a forward voltage of 3.3 volts.
  • the first LED chip 21 and the second LED chip 22 may be disposed on the substrate 1 in series, or the first LED chip 21 may be connected in parallel and then connected in series with the second LED chip 22.
  • the first LED chip 21 and the second LED chip 22 are Surface Mounted Devices (SMD) chips.
  • SMD Surface Mounted Devices

Abstract

一种LED背光源及LED模组，LED模组包括基板（1），基板（1）从中心向边缘的同一方向上间隔设置第一安装区域（11）及第二安装区域（12）。LED模组还包括设置于第一安装区域（11）上的第一LED芯片（21），以及设置于第二安装区域（12）上的第二LED芯片（22），第一LED芯片（21）的顺向电压小于第二LED芯片（22）的顺向电压。LED模组工作时，第一安装区域（11）产生的热量将小于第二安装区域（12）产生的热量，第二安装区域的热量能有效向第一安装区域均摊，以减小第一安装区域（11）与第二安装区域（12）的温差，使整个LED模组的热量分布更加均匀，平衡了不同安装区域之间的光效，使背光源发光更加均匀，提高了第一安装区域（11）中LED芯片（21）的可靠性。

Description

LED背光源及LED模组 技术领域
本申请涉及发光二极管领域，尤其涉及一种LED背光源及LED模组。
背景技术
液晶显示屏是被动发光显示器件，需要提供背光源才能工作。目前，液晶显示屏的背光源有两种，分别是采用冷阴极荧光(CCFL)的背光源和LED的背光源。LED背光源由于具备高清晰度、节能环保、寿命长、超广色域和超薄外观等特点而逐渐取代CCFL背光源，成为液晶显示屏主要采用的背光源。
LED背光源中主要用于发光的部件是LED模组，所述LED模组包括PCB基板和密集分布在PCB基板上的众多用于发光的LED芯片。其中，所有的LED芯片采用同一顺向电压范围，比如顺向电压均为：3.1～3.2伏特(V)。这种结构存在如下问题：
当LED背光源正常工作时，采用红外热像仪测试PCB基板各部分的温度。测试结果显示PCB基板的温度由中心区域向边缘区域递减，尤其是中心区域与边缘区域的温差可达8℃以上。然而，PCB基板的温度将直接影响LED的性能。通常PCB基板的温度越高，LED芯片的结温也越高，LED芯片的发光效率则越低。相关研究还表明，当LED芯片的结温升高到75℃时，其亮度将减至80％；到125℃时，减小到60％；到175℃时，减小到40％。
因此，如何平衡PCB基板各部分的温差一直是本领域技术人员致力于解决的问题。分析表明，PCB基板中心区域和边缘区域存在较大温差的原因在于，LED芯片等距间隔地分
布在PCB基板上，且所有的LED芯片采用同一顺向电压范围，边缘区域的LED芯片工作产生的热量向中间区域扩散，致使中心区域的温度较高，中心区域和边缘区域的温差较大，导致中心LED芯片的光效大大低于边缘LED芯片的光效，同时降低了中心LED芯片的可靠性。
发明内容
本申请旨在至少在一定程度上解决上述技术问题之一。
根据本申请的第一方面，本申请提供一种LED背光源，其由若干LED模组拼接组成，所述LED模组包括：基板，所述基板从中心向边缘的同一方向上间隔设置第一安装区域及第二安装区域，所述LED模组还包括：设置于所述第一安装区域上的第一LED芯片，以及设置于所述第二安装区域上的第二LED芯片，所述第一LED芯片的顺向电压小于所述 第二LED芯片的顺向电压。
进一步地，所述LED模组的中心为所述第一安装区域。
进一步地，所述LED模组的中心为所述第二安装区域。
进一步地，所述基板为陶瓷基板或金属基板。
进一步地，所述基板为圆形基板或方形基板。
进一步地，所述第一LED芯片之间，和/或，所述第二LED芯片之间等间距排列。
进一步地，所述第一LED芯片与所述第二LED芯片之间顺向电压差值为0.1-0.2伏特。
进一步地，所述第一LED芯片与所述第二LED芯片串联。
进一步地，所述第一LED芯片并联后与所述第二LED芯片串联。
进一步地，所述第一LED芯片及所述第二LED芯片为SMD芯片。
根据本申请的第二方面，本申请提供一种LED模组，包括：基板，所述基板从中心向边缘的同一方向上间隔设置第一安装区域及第二安装区域，所述LED模组还包括：设置于所述第一安装区域上的第一LED芯片，以及设置于所述第二安装区域上的第二LED芯片，所述第一LED芯片的顺向电压小于所述第二LED芯片的顺向电压。
进一步地，所述LED模组的中心为所述第一安装区域。
进一步地，所述LED模组的中心为所述第二安装区域。
进一步地，所述基板为陶瓷基板或金属基板。
进一步地，所述基板为圆形基板或方形基板。
进一步地，所述第一LED芯片之间，和/或，所述第二LED芯片之间等间距排列。
进一步地，所述第一LED芯片与所述第二LED芯片之间顺向电压差值为0.1-0.2伏特。
进一步地，所述第一LED芯片与所述第二LED芯片串联。
进一步地，所述第一LED芯片并联后与所述第二LED芯片串联。
进一步地，所述第一LED芯片及所述第二LED芯片为SMD芯片。
本申请的有益效果是：
通过提供一种LED背光源及LED模组，LED模组包括：基板，所述基板从中心向边缘的同一方向上间隔设置第一安装区域及第二安装区域，所述LED模组还包括：设置于所述第一安装区域上的第一LED芯片，以及设置于所述第二安装区域上的第二LED芯片，所述第一LED芯片的顺向电压小于所述第二LED芯片的顺向电压。这样，LED模组工作时，第一安 装区域产生的热量将小于第二安装区域产生的热量，第二安装区域的热量能有效向第一安装区域均摊，以减小第一安装区域与第二安装区域的温差，使整个LED模组的热量分布更加均匀，平衡了不同安装区域之间的光效，使背光源发光更加均匀，提高了第一安装区域中LED芯片的可靠性。
附图说明
图1为本申请实施例的LED模组的结构示意图。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度小于第二特征。
下面通过具体实施方式结合附图对本申请作进一步详细说明。
请参考图1，本申请提供一种LED背光源，可用于LED照明用设备，比如手机、电视等。
LED背光源由若干LED模组拼接组成，每个LED模组主要包括：基板1及设置于基板1上的LED芯片2。
基板1从中心向边缘的同一方向上间隔设置第一安装区域11及第二安装区域12。而LED芯片2主要分为：设置于第一安装区域11上的第一LED芯片21，以及设置于第二安装区域12上的第二LED芯片22，其中，第一LED芯片21的顺向电压小于第二LED芯片22的顺向电压。
这样，LED模组工作时，第一安装区域产生的热量将小于第二安装区域产生的热量，第二安装区域的热量能有效向第一安装区域均摊，以减小第一安装区域与第二安装区域的温差，使整个LED模组的热量分布更加均匀，平衡了不同安装区域之间的光效，使背光源发光更加均匀，提高了第一安装区域中LED芯片的可靠性。
在本实施例中，LED模组的中心为第一安装区域11。但是，在其他实施例中，LED模组的中心也可以为第二安装区域12。
在本实施例中，基板1为方形陶瓷基板。在其他实施例中，基板1还可以为金属基板或其他类型基板，如透明陶瓷基板、玻璃基板等，其形状还可以为圆形等形状。
一般的，为方便加工，第一LED芯片21之间，和/或，第二LED芯片22之间等间距排列，当然，非等间距排列也是可选的方案。
通常，第一LED芯片21与第二LED芯片22之间顺向电压差值为0.1-0.2伏特。例如，第一LED芯片21顺向电压可以为3.1伏特，而第二LED芯片22顺向电压为3.3伏特等。
在具体进行电路排布时，第一LED芯片21与第二LED芯片22可采用串联方式布设于基板1上，或者，第一LED芯片21并联后再与第二LED芯片22串联。
为减小设备体积，第一LED芯片21及第二LED芯片22为表面贴装(Surface Mounted Devices，SMD)芯片。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体 特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上内容是结合具体的实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干简单推演或替换。

Claims (10)

  1. 一种LED背光源，其由若干LED模组拼接组成，所述LED模组包括：基板，其特征在于，所述基板从中心向边缘的同一方向上间隔设置第一安装区域及第二安装区域，所述LED模组还包括：设置于所述第一安装区域上的第一LED芯片，以及设置于所述第二安装区域上的第二LED芯片，所述第一LED芯片的顺向电压小于所述第二LED芯片的顺向电压。
  2. 如权利要求1所述的LED背光源，其特征在于，所述LED模组的中心为所述第一安装区域。
  3. 如权利要求1所述的LED背光源，其特征在于，所述LED模组的中心为所述第二安装区域。
  4. 如权利要求1所述的LED背光源，其特征在于，所述基板为陶瓷基板或金属基板。
  5. 如权利要求1所述的LED背光源，其特征在于，所述基板为圆形基板或方形基板。
  6. 如权利要求1所述的LED背光源，其特征在于，所述第一LED芯片之间，和/或，所述第二LED芯片之间等间距排列。
  7. 如权利要求1所述的LED背光源，其特征在于，所述第一LED芯片与所述第二LED芯片之间顺向电压差值为0.1-0.2伏特。
  8. 一种LED模组，包括：基板，其特征在于，所述基板从中心向边缘的同一方向上间隔设置第一安装区域及第二安装区域，所述LED模组还包括：设置于所述第一安装区域上的第一LED芯片，以及设置于所述第二安装区域上的第二LED芯片，所述第一LED芯片的顺向电压小于所述第二LED芯片的顺向电压。
  9. 如权利要求8所述的LED模组，其特征在于，所述LED模组的中心为所述第一安装区域。
  10. 如权利要求8所述的LED模组，其特征在于，所述LED模组的中心为所述第二安装区域。
PCT/CN2014/091573 2014-11-19 2014-11-19 Led背光源及led模组 WO2016078021A1 (zh)

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CN202074441U (zh) * 2011-05-10 2011-12-14 西安西科节能技术服务有限公司 一种角度和强度按区分配的led装置
CN102661590A (zh) * 2012-04-18 2012-09-12 天津工业大学 Led照明灯散热优化与温度在线监测系统
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CN201521811U (zh) * 2009-06-26 2010-07-07 惠州市斯科电气照明有限公司 一种色温可调的led灯
CN202032395U (zh) * 2011-03-15 2011-11-09 深圳市聚飞光电股份有限公司 具有led模块的背光源和led模块
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