WO2016078012A1 - Led发光单元 - Google Patents

Led发光单元 Download PDF

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Publication number
WO2016078012A1
WO2016078012A1 PCT/CN2014/091548 CN2014091548W WO2016078012A1 WO 2016078012 A1 WO2016078012 A1 WO 2016078012A1 CN 2014091548 W CN2014091548 W CN 2014091548W WO 2016078012 A1 WO2016078012 A1 WO 2016078012A1
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WIPO (PCT)
Prior art keywords
led chip
lighting unit
led
accommodating cavity
pin
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PCT/CN2014/091548
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English (en)
French (fr)
Inventor
史伯梅
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史伯梅
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Application filed by 史伯梅 filed Critical 史伯梅
Priority to PCT/CN2014/091548 priority Critical patent/WO2016078012A1/zh
Priority to CN201490000318.3U priority patent/CN204879502U/zh
Publication of WO2016078012A1 publication Critical patent/WO2016078012A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present application relates to the field of light emitting diodes, and in particular to an LED lighting unit.
  • LED Light Emitting Diode
  • LED Light Emitting Diode
  • LEDs are commonly used in bulbs, fluorescent lamps, flat lamps, etc.
  • customers in the market are more convenient and cheaper to use. It is hoped that the color temperature and index (color rendering index, referred to as the index) of a single white LED lighting unit can be Tune.
  • the white LED light-emitting unit is composed of a susceptor provided with a accommodating cavity, a fluorescent glue layer, a solid crystal region and an electrode region.
  • a die bonding region is disposed at the bottom of the accommodating cavity, and the die bonding region is connected to the electrode region.
  • the blue LED chip is placed in the solid crystal region, and the fluorescent cavity layer is filled in the accommodating cavity, and the fluorescent adhesive layer is a combination of the phosphor and the encapsulant, and the phosphor may be a single powder such as a yellow phosphor or a combination powder such as red fluorescent. Powder and green phosphors, etc.
  • the white LED light-emitting unit of this structure cannot adjust the color temperature and the index, and cannot meet the current demand for the tonable temperature and adjustable index finger.
  • the present application aims to solve at least one of the above technical problems to some extent.
  • the present application provides an LED lighting unit, including: a susceptor having a receiving cavity, an opening on one side of the accommodating cavity, a first LED chip disposed at a bottom of the accommodating cavity and having a first wavelength, and a cover a phosphor layer disposed above the first LED chip and emitting white light with the first LED chip, the LED lighting unit further comprising: disposed in the accommodating cavity above the first LED chip a light transmissive substrate, and a second LED chip fixed on the light transmissive substrate and having a second wavelength to adjust a color temperature/color rendering index.
  • the second LED chip and the first LED chip are disposed offset from each other along the bottom of the accommodating cavity to the opening direction.
  • the second LED chip and the first LED chip are disposed opposite to each other along the bottom of the accommodating cavity to the opening direction.
  • the light transmissive substrate is a transparent substrate.
  • the light transmissive substrate is a hollow bracket.
  • the bottom of the accommodating cavity is provided with: a first die bonding region for setting the first LED chip, and The first LED chip is electrically connected to the first electrode region of the first lead;
  • the transparent substrate is provided with: a second die bonding region for setting the second LED chip, and the second The LED chip is electrically connected and has a second electrode region of the second pin, and the first pin and the second pin penetrate the pedestal to extend a certain length from an outer side surface of the pedestal.
  • first pin is disposed at an equal height to a portion of the second pin that extends out of an outer side surface of the base.
  • first pin and the second pin are disposed at a non-equal height from a portion extending from an outer side of the base.
  • first die bonding region and the second die bonding region have heat dissipation pins, and the heat dissipation guides penetrate the pedestal to extend a certain length from an outer side surface of the susceptor.
  • the fluorescent glue layer uses a yellow phosphor having an excitation peak at 530-590 nm; the first LED chip is a blue LED chip having a wavelength of 430-470 nm; and the second LED chip is a red LED chip.
  • an LED lighting unit comprising: a susceptor having a accommodating cavity, the accommodating cavity having an opening, a first LED chip disposed at the bottom of the accommodating cavity and having a first wavelength, and arranging a phosphor layer that is disposed above the first LED chip and that emits white light with the first LED chip, the LED light emitting unit further includes: a transparent layer disposed above the first LED chip in the accommodating cavity a light substrate, and a second LED chip fixed on the light-transmitting substrate and having a second wavelength to adjust a color temperature/color rendering index.
  • the light component of the second LED chip can be increased in the spectrum of the original white light excited by the first LED chip and the fluorescent layer, and the color of the second LED chip is used to change the color. Moderately speaking, meeting people's needs.
  • FIG. 1 is a schematic structural diagram of an LED lighting unit according to an embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional view of an LED lighting unit according to an embodiment of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • installation shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.
  • the embodiment provides an LED lighting unit, which can be used in the fields of illumination or signal indication.
  • the LED light-emitting unit mainly includes a susceptor 1 having a accommodating cavity 11 having an opening 111, a first LED chip 2 disposed at the bottom of the accommodating cavity 11 and having a first wavelength, and a cover The phosphor layer 3 above the first LED chip 2 and acting as a white light with the first LED chip 2 acts.
  • the LED lighting unit further includes: a transparent substrate 4 disposed in the accommodating cavity 11 above the first LED chip 2, and fixed on the transparent substrate 4 and having a second wavelength to adjust the color temperature/display The second LED chip 5 of the color index.
  • the light component of the second LED chip can be increased in the spectrum of the original white light excited by the first LED chip and the fluorescent layer, and the color of the second LED chip is used to change the color. Moderately speaking, meeting people's needs.
  • the second LED chip 5 and the first LED chip 2 are arranged offset along the bottom of the accommodating cavity 11 in the direction of the opening 111.
  • the second LED chip can be along with the first LED chip along the bottom of the receiving cavity to the opening direction Just facing the settings.
  • the transparent substrate 4 may be a transparent substrate or a hollow support to ensure that the light emitted from the first LED chip 2 can be emitted normally and efficiently.
  • the bottom of the accommodating cavity 11 is provided with: a first die bonding region for arranging the first LED chip 2, and a first electrode region electrically connected to the first LED chip 2 and having the first pin 112
  • the transparent substrate 4 is provided with: a second die bonding region for arranging the second LED chip 5, and a second electrode region electrically connected to the second LED chip 5 and having the second pin 41, first The pin 112 and the second pin 41 penetrate the susceptor 1 and extend from the outer side of the susceptor 1 by a certain length.
  • the first pin 112 is disposed at the same height as the portion of the second pin 41 extending from the outer side of the pedestal, so that the existing substrate can be adapted, of course, due to the transparent substrate 4 and the accommodating The bottom of the cavity 11 is not in the same plane. Therefore, the first pin 112 or the second pin 41 needs to be bent to meet the above-mentioned contour setting requirements.
  • the portions of the first pin 112 and the second pin 41 that extend out of the outer side of the susceptor 1 may also be disposed at non-equal heights.
  • the first die-bonding region and the second die-bonding region have heat-dissipating pins 100, and the heat-dissipating pins 100 penetrate the susceptor 1 and extend from the outer side of the susceptor 1 by a certain length.
  • the fluorescent glue layer 3 can adopt a yellow phosphor with an excitation peak at 530-590 nm, or a mixed powder of a red phosphor and a green phosphor;
  • the first LED chip 2 can be a blue LED chip with a wavelength of 430-470 nm.
  • the second LED chip 5 can be a red LED chip.

Abstract

一种LED发光单元，包括具有容置腔（11）的基座（1）、第一LED芯片（2）、荧光胶层（3）、透光基板（4）和第二LED芯片（5）。容置腔（11）一侧具有开口（111），第一LED芯片（2）具有第一波长且设置于容置腔（11）底部，荧光胶层（3）覆设于第一LED芯片（2）上方且与第一LED芯片（2）作用发出白光，透光基板（4）位于容置腔（11）中第一LED芯片（2）上方，第二LED芯片（5）固定于透光基板（4）上且具有第二波长以调整色温/显色指数。通过调节第二LED芯片（5）的电流，第一LED芯片（2）与荧光胶层（3）共同激发的白光光谱中可增加第二LED芯片（5）的光成分，从而改变色温和显色指数。

Description

LED发光单元 技术领域
本申请涉及发光二极管领域，尤其涉及一种LED发光单元。
背景技术
随着半导体照明技术的发展，LED(Light Emitting Diode，发光二极管)作为背光源已广泛应用于平板电脑、笔记本电脑、液晶显示器、大尺寸液晶电视及室内外照明等领域中。照明LED普通应用于球泡灯、日光灯、平面灯等领域，目前市场客户为了应用更简便和成本更低，希望单颗白光LED发光单元的色温和显指(显色指数，简称显指)可调。
目前白光LED发光单元由设置有容置腔的基座、荧光胶层、固晶区和电极区组成。在容置腔底部设置有固晶区，固晶区连接于电极区。蓝光LED芯片放置于固晶区，在容置腔中填充有荧光胶层，荧光胶层为荧光粉和封装胶组合，荧光粉可以为单粉比如黄色荧光粉，也可以是组合粉比如红色荧光粉和绿色荧光粉等。
蓝光LED芯片通电后，发蓝光激发黄色荧光粉或红绿荧光粉，在容置腔中混光后形成白光。显然，这种结构的白光LED发光单元不能调整色温和显指的，无法满足目前对可调色温和可调显指的需求。
发明内容
本申请旨在至少在一定程度上解决上述技术问题之一。
本申请提供一种LED发光单元，包括：具有容置腔的基座，所述容置腔一侧具有开口、设置于所述容置腔底部且具有第一波长的第一LED芯片，以及覆设于所述第一LED芯片上方且与所述第一LED芯片作用发出白光的荧光胶层，所述LED发光单元还包括：设置于所述容置腔中位于所述第一LED芯片上方的透光基板，以及固定于所述透光基板上且具有第二波长以调整色温/显色指数的第二LED芯片。
进一步地，所述第二LED芯片与所述第一LED芯片沿所述容置腔底部到开口方向错位设置。
进一步地，所述第二LED芯片与所述第一LED芯片沿所述容置腔底部到开口方向正对设置。
进一步地，所述透光基板为透明基板。
进一步地，所述透光基板为镂空支架。
进一步地，所述容置腔底部设置有：用于设置第一LED芯片的第一固晶区，以及与 所述第一LED芯片相电连接且具有第一引脚的第一电极区；所述透光基板上设置有：用于设置第二LED芯片的第二固晶区，以及与所述第二LED芯片相电连接且具有第二引脚的第二电极区，所述第一引脚与所述第二引脚穿透所述基座而从所述基座的外侧面延伸出一定长度。
进一步地，所述第一引脚与所述第二引脚的延伸出所述基座的外侧面的部分等高设置。
进一步地，所述第一引脚与所述第二引脚的延伸出所述基座的外侧面的部分非等高设置。
进一步地，所述第一固晶区及所述第二固晶区具有散热导脚，所述散热导脚穿透所述基座而从所述基座的外侧面延伸出一定长度。
进一步地，所述荧光胶层采用激发峰值在530-590nm的黄色荧光粉；所述第一LED芯片为波长为430-470nm的蓝光LED芯片；所述第二LED芯片为红光LED芯片。
本申请的有益效果是：
通过提供一种LED发光单元，包括：具有容置腔的基座，所述容置腔一侧具有开口、设置于所述容置腔底部且具有第一波长的第一LED芯片，以及覆设于所述第一LED芯片上方且与所述第一LED芯片作用发出白光的荧光胶层，所述LED发光单元还包括：设置于所述容置腔中位于所述第一LED芯片上方的透光基板，以及固定于所述透光基板上且具有第二波长以调整色温/显色指数的第二LED芯片。这样，通过调节第二LED芯片的电流，在第一LED芯片与荧光胶层共同激发出的原白光的光谱中可增加第二LED芯片的光成分，以第二LED芯片的光能量来改变色温和显指，满足人们的需求。
附图说明
图1为本申请实施例的LED发光单元的结构示意图。
图2为本申请实施例的LED发光单元的剖面示意图。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置 关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度小于第二特征。
下面通过具体实施方式结合附图对本申请作进一步详细说明。
请参考图1-2，本实施例提供了一种LED发光单元，可用于照明或信号指示等领域。
上述LED发光单元主要包括：具有容置腔11的基座1，容置腔11一侧具有开口111、设置于容置腔11底部且具有第一波长的第一LED芯片2，以及覆设于第一LED芯片2上方且与第一LED芯片2作用发出白光的荧光胶层3。为实现本申请目的，LED发光单元还包括：设置于容置腔11中位于第一LED芯片2上方的透光基板4，以及固定于透光基板4上且具有第二波长以调整色温/显色指数的第二LED芯片5。
这样，通过调节第二LED芯片的电流，在第一LED芯片与荧光胶层共同激发出的原白光的光谱中可增加第二LED芯片的光成分，以第二LED芯片的光能量来改变色温和显指，满足人们的需求。
在本实施例中，第二LED芯片5与第一LED芯片2沿容置腔11底部到开口111方向错位设置。在其他实施例中，第二LED芯片可与第一LED芯片沿容置腔底部到开口方向 正对设置等。
而透光基板4可以为透明基板或镂空支架，以保证从第一LED芯片2发出的光能正常有效地散发出来。
在具体应用时，容置腔11底部设置有：用于设置第一LED芯片2的第一固晶区，以及与第一LED芯片2相电连接且具有第一引脚112的第一电极区；而透光基板4上设置有：用于设置第二LED芯片5的第二固晶区，以及与第二LED芯片5相电连接且具有第二引脚41的第二电极区，第一引脚112与第二引脚41穿透基座1而从基座1的外侧面延伸出一定长度。在本实施例中，第一引脚112与第二引脚41的延伸出基座的外侧面的部分等高设置，这样可适配现有的基板，当然，由于透光基板4与容置腔11底部并不在同一平面上，因此，第一引脚112或第二引脚41需要折弯，才能满足上述等高设置要求。在其他实施例中，第一引脚112与第二引脚41的延伸出基座1的外侧面的部分也可以非等高设置。为保证散热性能，第一固晶区及所述第二固晶区具有散热导脚100，散热导脚100穿透基座1而从基座1的外侧面延伸出一定长度。
一般的，荧光胶层3可采用激发峰值在530-590nm的黄色荧光粉，也可以采用红色荧光粉与绿色荧光粉的混合粉；第一LED芯片2可为波长为430-470nm的蓝光LED芯片，而第二LED芯片5可为红光LED芯片。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上内容是结合具体的实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干简单推演或替换。

Claims (10)

  1. 一种LED发光单元，包括：具有容置腔的基座，所述容置腔一侧具有开口、设置于所述容置腔底部且具有第一波长的第一LED芯片，以及覆设于所述第一LED芯片上方且与所述第一LED芯片作用发出白光的荧光胶层，其特征在于，所述LED发光单元还包括：设置于所述容置腔中位于所述第一LED芯片上方的透光基板，以及固定于所述透光基板上且具有第二波长以调整色温/显色指数的第二LED芯片。
  2. 如权利要求1所述的LED发光单元，其特征在于，所述第二LED芯片与所述第一LED芯片沿所述容置腔底部到开口方向错位设置。
  3. 如权利要求1所述的LED发光单元，其特征在于，所述第二LED芯片与所述第一LED芯片沿所述容置腔底部到开口方向正对设置。
  4. 如权利要求1所述的LED发光单元，其特征在于，所述透光基板为透明基板。
  5. 如权利要求1所述的LED发光单元，其特征在于，所述透光基板为镂空支架。
  6. 如权利要求1所述的LED发光单元，其特征在于，所述容置腔底部设置有：用于设置第一LED芯片的第一固晶区，以及与所述第一LED芯片相电连接且具有第一引脚的第一电极区；所述透光基板上设置有：用于设置第二LED芯片的第二固晶区，以及与所述第二LED芯片相电连接且具有第二引脚的第二电极区，所述第一引脚与所述第二引脚穿透所述基座而从所述基座的外侧面延伸出一定长度。
  7. 如权利要求6所述的LED发光单元，其特征在于，所述第一引脚与所述第二引脚的延伸出所述基座的外侧面的部分等高设置。
  8. 如权利要求6所述的LED发光单元，其特征在于，所述第一引脚与所述第二引脚的延伸出所述基座的外侧面的部分非等高设置。
  9. 如权利要求6所述的LED发光单元，其特征在于，所述第一固晶区及所述第二固晶区具有散热导脚，所述散热导脚穿透所述基座而从所述基座的外侧面延伸出一定长度。
  10. 如权利要求1至9中任一项所述的LED发光单元，其特征在于，所述荧光胶层采用激发峰值在530-590nm的黄色荧光粉；所述第一LED芯片为波长为430-470nm的蓝光LED芯片；所述第二LED芯片为红光LED芯片。
PCT/CN2014/091548 2014-11-19 2014-11-19 Led发光单元 WO2016078012A1 (zh)

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CN1929710A (zh) * 2005-09-05 2007-03-14 林文钦 可调色温的白光发光装置
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CN201795337U (zh) * 2010-08-18 2011-04-13 廖炳明 一种可调色温的led灯
CN102157507A (zh) * 2011-01-25 2011-08-17 北京工业大学 一种色温和显色指数可调的白光led集成模块
EP2407706A1 (en) * 2010-07-14 2012-01-18 Civilight Shenzhen Semiconductor Lighting Co., Ltd Warm white light LED lamp with high luminance and high color rendering index and led module
US20120223660A1 (en) * 2005-12-27 2012-09-06 Samsung Led Co., Ltd. White light emitting device

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CN1929710A (zh) * 2005-09-05 2007-03-14 林文钦 可调色温的白光发光装置
US20120223660A1 (en) * 2005-12-27 2012-09-06 Samsung Led Co., Ltd. White light emitting device
CN101373763B (zh) * 2007-08-24 2010-11-10 富士迈半导体精密工业（上海）有限公司 发光二极管
EP2407706A1 (en) * 2010-07-14 2012-01-18 Civilight Shenzhen Semiconductor Lighting Co., Ltd Warm white light LED lamp with high luminance and high color rendering index and led module
CN201795337U (zh) * 2010-08-18 2011-04-13 廖炳明 一种可调色温的led灯
CN102157507A (zh) * 2011-01-25 2011-08-17 北京工业大学 一种色温和显色指数可调的白光led集成模块

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