WO2016078001A1 - Led点胶治具 - Google Patents

Led点胶治具 Download PDF

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Publication number
WO2016078001A1
WO2016078001A1 PCT/CN2014/091509 CN2014091509W WO2016078001A1 WO 2016078001 A1 WO2016078001 A1 WO 2016078001A1 CN 2014091509 W CN2014091509 W CN 2014091509W WO 2016078001 A1 WO2016078001 A1 WO 2016078001A1
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Prior art keywords
led
hole
led chip
holes
jig according
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PCT/CN2014/091509
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English (en)
French (fr)
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何素华
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何素华
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Priority to PCT/CN2014/091509 priority Critical patent/WO2016078001A1/zh
Priority to CN201490000313.0U priority patent/CN206122108U/zh
Publication of WO2016078001A1 publication Critical patent/WO2016078001A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface

Definitions

  • the present application relates to the field of light emitting diodes, and in particular to an LED dispensing fixture.
  • LED Light Emitting Diode
  • the dispensing is carried out by using a special device such as a dispenser, which has a needle set composed of a plurality of dispensing needles.
  • a dispenser which has a needle set composed of a plurality of dispensing needles.
  • the LED chip of a certain area on the carrier is dispensed by the needle group.
  • the needle set moves to another area to complete dispensing of the area. In this way, the serial operation of dispensing is completed one by one, which reduces the production efficiency of the LED and is not conducive to mass production of the LED chip.
  • the present application aims to solve at least one of the above technical problems to some extent.
  • the present application provides an LED dispensing fixture, comprising: a hard plate body, and a plurality of through holes for curing the dispensing gel on the hard plate body, the through hole size and the LED chip dispensing The area size matches.
  • the inner wall of the through hole is provided with a concavo-convex structure for increasing the contact area with the colloid.
  • the uneven structure is a stepped body in which an inner diameter of the through hole extends along an axial direction of the through hole.
  • the concave-convex structure is a sawtooth ring body disposed on the inner wall of the through hole along the axial direction of the through hole.
  • the hard plate body is provided with a positioning structure positioned adjacent to the LED chip carrier.
  • the positioning structure is a positioning hole.
  • the positioning structure is a positioning protrusion.
  • the through holes are arranged on the hard plate body in an LED chip arrangement manner.
  • the LED dispensing fixture is made of stainless steel or copper.
  • an LED dispensing fixture comprising: a hard plate body, and a plurality of through holes for curing the dispensing gel on the hard plate body, the through hole size and the LED chip dispensing area Size matching.
  • the hard plate is placed in one
  • the auxiliary jig is closed on one side of the through hole, so that the colloid can be injected and accommodated in the through hole through the other side of the through hole, and the colloid is temporarily solidified in the through hole by heating, and the hard plate is taken out from the auxiliary jig.
  • the hard plate body is assembled with the LED chip carrier body so that the through hole is opposite to the LED chip, and the colloid in the through hole is melted, so that the colloid adheres to the LED chip, and the fixture is reheated to form the LED chip, thereby carrying the whole block
  • the LED chip on the body can be dispensed through a one-time process, which improves production efficiency.
  • FIG. 1 is a schematic structural view of an LED dispensing fixture according to an embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional view of an LED dispensing fixture according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of an LED chip carrier according to an embodiment of the present application.
  • FIG. 4 is a cross-sectional view of an LED chip carrier of an embodiment of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • installation shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. Not directly contact but through Additional feature contact between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.
  • the embodiment provides an LED dispensing fixture, which is matched with an auxiliary fixture and a heating device to implement an LED chip dispensing process.
  • the LED dispensing fixture mainly comprises: a hard plate body 1 and a plurality of through holes 2 for solidifying the dispensing gel on the hard plate body 1.
  • the size of the through hole 2 matches the size of the LED chip 3 dispensing area .
  • the hard plate body is placed on an auxiliary jig to close one side of the through hole, so that the colloid can be injected and accommodated in the through hole through the other side of the through hole, and the colloid is temporarily solidified in the through hole by drying.
  • the hard plate body is taken out from the auxiliary jig, and the hard plate body is assembled with the LED chip carrier body so that the through hole is opposite to the LED chip, and the colloid in the through hole is melted, so that the colloid adheres to the LED chip, and the jig is removed.
  • the LED chip is then baked, so that the LED chip on the whole carrier can be dispensed through a one-time process, thereby improving production efficiency.
  • the inner wall of the through hole 2 is provided with a concavo-convex structure 21 for increasing the contact area with the colloid.
  • the uneven structure is a stepped body in which the inner diameter of the through hole 2 is reduced in the axial direction of the through hole 2 .
  • the uneven structure is a sawtooth ring body or the like which is arranged axially along the through hole on the inner wall of the through hole 2.
  • the colloid and the through hole are more solidified due to the uneven structure, and the colloid does not fall off the through hole during the moving process.
  • the hard plate body 1 is provided with a positioning structure 11 positioned with the LED chip carrier 4.
  • the positioning structure may be a positioning hole.
  • the carrier body 4 has a positioning protrusion, and the positioning hole is assembled with the positioning protrusion to complete precise positioning of the hard plate body and the carrier body.
  • the positioning structure 11 can also be a positioning protrusion, and correspondingly, the carrier 4 has a positioning hole or the like.
  • the through holes 2 are arranged on the hard plate body 1 in accordance with the arrangement of the LED chips 3, thereby providing better positioning of the through holes and the LED chips.
  • the LED glue fixture can generally be made of metal material, such as stainless steel or copper material, of course, ceramics and other hard textures can also be used. material.

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Abstract

一种LED点胶治具，包括硬质板体（1），以及开设于所述硬质板体上的若干用于固化点胶胶体的通孔（2），所述通孔大小与LED芯片（3）点胶区域尺寸匹配。硬质板体置于一辅助治具上以封闭通孔一面，从而通过通孔另一面可将胶体注入并容置于通孔内，通过烘干，将胶体暂时固化于通孔内，从辅助治具上取出硬质板体，将硬质板体与LED芯片承载体（4）相装配使通孔与LED芯片相对，再融化通孔内的胶体，使胶体附着在LED芯片上，取走治具再烘干成型LED芯片，从而整块承载体上的LED芯片可通过一次性的工艺完成点胶，提高了生产效率。

Description

LED点胶治具 技术领域
本申请涉及发光二极管领域，尤其涉及一种LED点胶治具。
背景技术
随着发光二极管(Light Emitting Diode，LED)制造工艺的迅猛发展，LED已在诸多领域有着广泛应用。由于LED的能耗低、寿命长，并且随着LED芯片的亮度的提高，LED灯具取代传统光源进入照明领域是大势所趋，因此对LED生产工艺的逐步改进以提高生产效率，对于LED的应用产品意义十分重大。
在LED芯片制程中，需要对承载于LED芯片承载体上的数量较庞大的LED芯片进行荧光胶点胶。通常，点胶是采用点胶机这种特有装置进行，其具有多个点胶针组成的针组，在进行点胶时，由针组对承载体上某个区域的LED芯片进行点胶，当完成这个区域的点胶时，针组移动到另一区域完成该区域的点胶。这样，逐个区域完成点胶的串行式动作，降低了LED的生产效率，不利于大批量生产LED芯片。
发明内容
本申请旨在至少在一定程度上解决上述技术问题之一。
本申请提供一种LED点胶治具，包括：硬质板体，以及开设于所述硬质板体上的若干用于固化点胶胶体的通孔，所述通孔大小与LED芯片点胶区域尺寸匹配。
进一步地，所述通孔的内壁设置有用于增加与所述胶体接触面积的凹凸结构。
进一步地，所述凹凸结构为所述通孔内壁延伸出的沿所述通孔轴向内径变小的台阶体。
进一步地，所述凹凸结构为所述通孔内壁上沿所述通孔轴向排布的锯齿环体。
进一步地，所述硬质板体上设置有与LED芯片承载体相定位的定位结构。
进一步地，所述定位结构为定位孔。
进一步地，所述定位结构为定位凸起。
进一步地，所述通孔按照LED芯片排布方式排布于所述硬质板体上。
进一步地，所述LED点胶治具采用不锈钢或铜材料。
本申请的有益效果是：
通过提供一种LED点胶治具，包括：硬质板体，以及开设于所述硬质板体上的若干用于固化点胶胶体的通孔，所述通孔大小与LED芯片点胶区域尺寸匹配。这样，硬质板体置于一 辅助治具上以封闭通孔一面，从而通过通孔另一面可将胶体注入并容置于通孔内，通过加热，将胶体暂时固化于通孔内，从辅助治具上取出硬质板体，将硬质板体与LED芯片承载体相装配使通孔与LED芯片相对，再融化通孔内胶体，使胶体附着在LED芯片上，取走治具再加热成型LED芯片，从而整块承载体上的LED芯片可通过一次性的工艺完成点胶，提高了生产效率。
附图说明
图1为本申请实施例的LED点胶治具的结构示意图。
图2为本申请实施例的LED点胶治具的剖面示意图。
图3为本申请实施例的LED芯片承载体的结构示意图。
图4为本申请实施例的LED芯片承载体的剖面示意图。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通 过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度小于第二特征。
下面通过具体实施方式结合附图对本申请作进一步详细说明。
请参考图1-4，本实施例提供了一种LED点胶治具，其与辅助治具、加热设备配套使用，实现LED芯片点胶工艺。
上述LED点胶治具主要包括：硬质板体1，以及开设于硬质板体1上的若干用于固化点胶胶体的通孔2，通孔2大小与LED芯片3点胶区域尺寸匹配。
这样，硬质板体置于一辅助治具上以封闭通孔一面，从而通过通孔另一面可将胶体注入并容置于通孔内，通过烘干，将胶体暂时固化于通孔内，从辅助治具上取出硬质板体，将硬质板体与LED芯片承载体相装配使通孔与LED芯片相对，再融化通孔内胶体，使胶体附着在LED芯片上，取走治具再烘干成型LED芯片，从而整块承载体上的LED芯片可通过一次性的工艺完成点胶，提高了生产效率。
作为一种优选实施例，通孔2的内壁设置有用于增加与胶体接触面积的凹凸结构21。具体地，凹凸结构为通孔2内壁延伸出的沿通孔2轴向内径变小的台阶体。或者，凹凸结构为通孔2内壁上沿通孔轴向排布的锯齿环体等。
这样，胶体进入通孔2后，由于凹凸结构使得胶体与通孔固化更加牢固，在搬移过程中，胶体不会从通孔中脱落。
为了精确定位通孔与LED芯片，硬质板体1上设置有与LED芯片承载体4相定位的定位结构11。具体地，定位结构可以为定位孔，相应地，承载体4上具有定位凸起，定位孔与定位凸起相装配以完成硬质板体与承载体的精确定位。当然，定位结构11还可以为定位凸起，相应地，承载体4上具有定位孔等。
通常，通孔2按照LED芯片3排布方式排布于硬质板体1上，从而为通孔与LED芯片提供更好的定位。
为了保证治具的使用寿命以及与点胶胶体之间不会发生相似相容，LED点胶治具一般可采用金属材料制成，如不锈钢或铜材料，当然也可以采用陶瓷等其他质地坚硬的材料。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本 说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上内容是结合具体的实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干简单推演或替换。

Claims (9)

  1. 一种LED点胶治具，其特征在于，包括：硬质板体，以及开设于所述硬质板体上的若干用于固化点胶胶体的通孔，所述通孔大小与LED芯片点胶区域尺寸匹配。
  2. 如权利要求1所述的LED点胶治具，其特征在于，所述通孔的内壁设置有用于增加与所述胶体接触面积的凹凸结构。
  3. 如权利要求2所述的LED点胶治具，其特征在于，所述凹凸结构为所述通孔内壁延伸出的沿所述通孔轴向内径变小的台阶体。
  4. 如权利要求2所述的LED点胶治具，其特征在于，所述凹凸结构为所述通孔内壁上沿所述通孔轴向排布的锯齿环体。
  5. 如权利要求1所述的LED点胶治具，其特征在于，所述硬质板体上设置有与LED芯片承载体相定位的定位结构。
  6. 如权利要求5所述的LED点胶治具，其特征在于，所述定位结构为定位孔。
  7. 如权利要求5所述的LED点胶治具，其特征在于，所述定位结构为定位凸起。
  8. 如权利要求1所述的LED点胶治具，其特征在于，所述通孔按照LED芯片排布方式排布于所述硬质板体上。
  9. 如权利要求1至8中任一项所述的LED点胶治具，其特征在于，所述LED点胶治具采用不锈钢或铜材料。
PCT/CN2014/091509 2014-11-19 2014-11-19 Led点胶治具 WO2016078001A1 (zh)

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CN201490000313.0U CN206122108U (zh) 2014-11-19 2014-11-19 Led点胶治具

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CN111471975A (zh) * 2020-04-10 2020-07-31 甬矽电子(宁波)股份有限公司 一种镀膜治具和镀膜方法
CN113213948A (zh) * 2021-05-31 2021-08-06 福建工程学院 一种多级结构氮化硅陶瓷材料制备方法

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