WO2016056427A1 - レーザ接合構造および電子制御装置、ならびにレーザ接合構造の製造方法 - Google Patents
レーザ接合構造および電子制御装置、ならびにレーザ接合構造の製造方法 Download PDFInfo
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- WO2016056427A1 WO2016056427A1 PCT/JP2015/077503 JP2015077503W WO2016056427A1 WO 2016056427 A1 WO2016056427 A1 WO 2016056427A1 JP 2015077503 W JP2015077503 W JP 2015077503W WO 2016056427 A1 WO2016056427 A1 WO 2016056427A1
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- resin
- laser
- molded body
- metal
- polymer alloy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
- B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
- B29C65/1606—Ultraviolet [UV] radiation, e.g. by ultraviolet excimer lasers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
- B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
- B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
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- B29C65/1638—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding focusing the laser beam on the interface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B29C65/16—Laser beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
- B29C65/1661—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined scanning repeatedly, e.g. quasi-simultaneous laser welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1677—Laser beams making use of an absorber or impact modifier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/44—Joining a heated non plastics element to a plastics element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/82—Testing the joint
- B29C65/8207—Testing the joint by mechanical methods
- B29C65/8215—Tensile tests
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/82—Testing the joint
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7311—Thermal properties
- B29C66/73117—Tg, i.e. glass transition temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7316—Surface properties
- B29C66/73161—Roughness or rugosity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/735—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the extensive physical properties of the parts to be joined
- B29C66/7352—Thickness, e.g. very thin
- B29C66/73521—Thickness, e.g. very thin of different thickness, i.e. the thickness of one of the parts to be joined being different from the thickness of the other part
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/737—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined
- B29C66/7377—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined amorphous, semi-crystalline or crystalline
- B29C66/73771—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined amorphous, semi-crystalline or crystalline the to-be-joined area of at least one of the parts to be joined being amorphous
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/737—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined
- B29C66/7377—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined amorphous, semi-crystalline or crystalline
- B29C66/73775—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the state of the material of the parts to be joined amorphous, semi-crystalline or crystalline the to-be-joined area of at least one of the parts to be joined being crystalline
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
- B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
- B29C66/73941—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset characterised by the materials of both parts being thermosets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
- B29C66/7422—Aluminium or alloys of aluminium
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/95—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
- B29C66/959—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 characterised by specific values or ranges of said specific variables
- B29C66/9592—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 characterised by specific values or ranges of said specific variables in explicit relation to another variable, e.g. X-Y diagrams
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/022—Mechanical pre-treatments, e.g. reshaping
- B29C66/0224—Mechanical pre-treatments, e.g. reshaping with removal of material
- B29C66/02245—Abrading, e.g. grinding, sanding, sandblasting or scraping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/026—Chemical pre-treatments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
- B29C66/7428—Transition metals or their alloys
- B29C66/74283—Iron or alloys of iron, e.g. steel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
- B29C66/8122—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the composition of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
- B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
- B29C66/81266—Optical properties, e.g. transparency, reflectivity
- B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
Definitions
- the present invention relates to a laser bonding structure in which a resin molded body and a metal body are laser bonded, an electronic control device including the laser bonding structure, and a method for manufacturing the laser bonding structure.
- Bonding is performed by superposing a resin molded body made of a thermoplastic resin composition and a metal body, irradiating a laser beam from the metal body side, and softening and / or melting at least a part of the resin molded body made of the thermoplastic resin composition.
- a method for producing a composite of a resin molded body made of a thermoplastic resin composition and a metal body see Patent Document 1.
- Patent Document 1 does not have a specific description of a configuration for suppressing a decrease in bonding strength of a laser bonding portion due to a gap between a resin molded body and a metal body.
- the laser junction structure comprises a resin molded body made of a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal.
- the glass transition temperature of the laser-bonded amorphous resin is lower than the melting start temperature of the crystalline resin.
- the laser bonding structure is such that a resin molded body made of a thermoplastic polymer alloy alloyed with another resin in a crystalline resin and a metal body made of metal are lasers.
- a method for producing a laser junction structure comprising: a resin molded body made of a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin, and a metal made of a metal.
- the glass transition temperature of the amorphous resin is lower than the melting start temperature of the crystalline resin, and at least the portion of the resin molded body that is laser-bonded to the metal body is subjected to a treatment for increasing oxygen functional groups.
- the resin molded body is heated to a temperature equal to or higher than the glass transition temperature of the amorphous resin, and the resin molded body and the metal body are laser-bonded in a state where the resin molded body and the metal body are pressed against each other.
- the disassembled perspective view which shows the outline of an electronic controller.
- the functional block diagram of an electronic control apparatus. The flowchart for demonstrating the process of manufacturing an electronic control apparatus.
- the perspective view which shows typically the procedure which scans a laser beam in the state which pressed the metal base against the resin molding with the pressing jig.
- Sectional drawing which shows typically the state which pressed the metal base against the resin molding with the pressing jig.
- FIG. 1 The figure which shows the temperature characteristic of the elasticity modulus of a polymer alloy.
- the perspective view which shows the cover and connector of an electronic control apparatus which concern on 2nd Embodiment.
- Sectional drawing explaining the laser joining method in the electronic controller which concerns on the modification 1 and the modification 2.
- FIG. Sectional drawing explaining the laser joining method in the electronic control apparatus which concerns on the modification 3.
- FIG. 1 is a perspective view showing an outline of an electronic control device 100 having a laser junction structure according to the first embodiment of the present invention
- FIG. 2 is an exploded perspective view showing an outline of the electronic control device 100.
- Electronic control apparatus 100 according to the present embodiment is an engine controller unit (ECU) that is mounted on an automobile and electronically controls an engine.
- the electronic control device 100 includes a circuit board 5 for engine control, a resin molded body 1, and a metal base 4.
- the resin molded body 1 includes a cover 1a covering the circuit board 5 disposed on the metal base 4, and a connector 1b for exchanging signals between the circuit board 5 and external devices (such as various sensors and actuators).
- the resin molded body 1 is made of a polymer alloy that is a thermoplastic resin composition containing a thermoplastic crystalline resin and a thermoplastic amorphous resin, and the cover 1a and the connector 1b are formed by injection molding. It is an integrally molded body that is integrally molded.
- terminal pins (not shown) electrically connected to the circuit board 5 are insert-molded, and the terminal pins (not shown) are held by the connector 1b.
- the cover 1a is provided with a recess 1c in which the circuit board 5 is disposed.
- the opening peripheral part of the recessed part 1c of the cover 1a is a joining surface (henceforth described as the resin joining surface 1d) which contact
- the metal base 4 is laser-bonded to the resin molded body 1 so as to block the recess 1c of the cover 1a, whereby the opening of the recess 1c is closed by the metal base 4, and the circuit board is formed by the recess 1c and the metal base 4.
- a storage space for storing 5 is defined.
- a plurality of electronic components 6 for engine control are mounted on the circuit board 5 and a predetermined wiring pattern is formed to constitute an electronic circuit unit.
- the metal base 4 has a function as a heat radiator that radiates heat generated by the electronic components 6 of the circuit board 5 to the outside air.
- the metal base 4 is made of aluminum die cast, is formed in a rectangular flat plate shape, and a plurality of cooling fins 7 are formed in parallel to each other.
- the edge part (outer peripheral part) of the metal base 4 is a connection part 4a to be joined by a laser joining process described later.
- One surface of the connection portion 4a of the metal base 4 is a bonding surface (hereinafter referred to as a metal bonding surface 4d (see FIG. 7)) that is in contact with the resin bonding surface 1d of the resin molded body 1, and is formed as a flat surface.
- the other surface of the connection portion 4a of the metal base 4 is a laser irradiation surface 11 on which laser light is irradiated.
- the laser irradiation surface 11 is a flat surface in order to perform laser irradiation uniformly.
- a width of a laser bonding portion 11a (see a broken line in FIG. 1) formed by laser bonding described later from at least 1 mm from the viewpoint of sealing performance at the laser bonding portion 11a.
- the width of the laser irradiation surface 11 is set to such a size that the width of the laser bonding portion 11a can be secured at least 1 mm or more.
- the thickness of the connecting portion 4a of the metal base 4 is preferably about 0.5 to 2.0 mm from the viewpoint of laser bonding.
- the surface roughness of the laser irradiation surface 11 is determined in consideration of the manufacturing cost. In general, when the surface roughness is large compared to when the surface roughness is small, the reflectance is reduced due to the effect of scattering, and the laser energy required for bonding can be reduced, so the laser output is set low during laser bonding. Thus, the manufacturing cost can be reduced, and the manufacturing process can be shortened by setting the scanning speed of the laser light high.
- the surface roughness of the metal base 4 can be increased by performing a blast process or a chemical process. Further, from the viewpoint of increasing the absorption rate, not only the roughness may be increased, but an alumite treatment may be performed.
- FIG. 3 is a functional block diagram of the electronic control device 100.
- the circuit board 5 includes a CPU 201, a ROM 202, a RAM 203, and an input / output port 204, an input circuit 205, and a drive circuit that controls operations of various actuators that are connected to each other via a bus.
- Detected signals from various sensors are input to the input circuit 205 via the terminal of the connector 1b.
- the drive circuit includes an ignition output circuit 206 that outputs a drive control signal at a predetermined timing to the spark plug 208 via a terminal of the connector 1b, and a fuel injection valve 209 via a terminal of the connector 1b at a predetermined timing. And an injection valve drive circuit 207 that outputs a drive control signal.
- FIG. 4 is a flowchart for explaining a process of manufacturing the electronic control device 100.
- the manufacturing method of the electronic control device 100 includes a resin selection step S110, an injection molding step S120, an assembly preparation step S130, an assembly step S140, a surface modification treatment step S145, and a laser bonding step S150.
- a crystalline resin and an amorphous resin to be alloyed are selected.
- a crystalline resin and an amorphous resin are selected so as to satisfy the following selection conditions.
- the selected crystalline resin and non-crystalline resin are alloyed to form a pellet-shaped polymer alloy.
- FIG. 5 is a diagram for explaining a method for selecting a crystalline resin and an amorphous resin.
- the curve drawn with a solid line is a DSC curve showing the measurement result of differential scanning calorimetry (DSC) of the crystalline resin.
- the curve drawn with a two-dot chain line is a DSC curve showing a DSC measurement result of a polymer alloy in which a crystalline resin is alloyed with an amorphous resin as an alloy material, and is near the recrystallization temperature Tca.
- a curve is shown.
- a straight line drawn with a one-dot chain line indicates the glass transition temperature Tg of the amorphous resin.
- the melting start temperature Ti, the melting point Tm, and the recrystallization temperatures Tc and Tca of the crystalline resin can be measured using a known differential scanning calorimeter.
- the melting start temperature Ti refers to the temperature at which heat absorption by melting starts in the DSC curve during heating. For example, extrapolation from the DSC curve obtained by differential scanning calorimetry in accordance with JISK7121 It can be defined as the value obtained as the melting start temperature.
- the recrystallization temperature refers to the temperature at the exothermic peak in the DSC curve during cooling.
- polybutylene terephthalate PBT
- PA6 polyamide 6
- PA66 polyamide 66
- PA6T polyamide 6T
- PA9T polyamide 9T
- PPS polyphenylene sulfide
- polystyrene examples include polystyrene (PS), acrylonitrile styrene (AS), polycarbonate (PC), acrylonitrile butadiene styrene copolymer (ABS), polymethyl methacrylate (PMMA), and cycloolefin polymer (COP). It is preferable to select one of them.
- Polystyrene (PS) includes high impact polystyrene (HIPS).
- the resin molded body 1 is formed by heating and melting the pellet-shaped polymer alloy obtained in the resin selection step S110 and performing injection molding with an injection molding machine (not shown).
- the nozzle of the injection molding machine is disposed at a position corresponding to the central portion of the cover 1a.
- the polymer alloy injected from the nozzle injection port spreads from the center to the periphery, and the cover 1a and the connector 1b are integrally formed.
- the resin molded body 1, the circuit board 5 on which the electronic component 6 is mounted, and the metal base 4 are prepared.
- the circuit board 5 is disposed in the recess 1c of the resin molded body 1, the terminal pins of the connector 1b and the circuit board 5 are soldered together by spot flow (local soldering) or the like, and the two are electrically connected. .
- the circuit board 5 is fixed to the resin molded body 1 by an adhesive, heat caulking, screwing or the like. In the case of fixing using an adhesive, it is preferable to fix using an ultraviolet curable adhesive or a two-component adhesive that cures at room temperature because the process time can be shortened.
- a heat dissipating material may be applied so that a heat dissipating material is interposed between the metal base 4 and the circuit board 5.
- a heat dissipating material for example, an epoxy-based or silicon-based thermosetting resin can be employed as the heat dissipation material.
- the heat dissipating material can be cured by heat generated during laser joining described later.
- the surface modification treatment step S145 atmospheric pressure plasma treatment is performed on the joint surface between the resin molded body 1 and the metal base 4.
- plasma is generated under atmospheric pressure, and the plasma is irradiated toward the resin bonding surface 1d of the resin molded body 1 and the metal bonding surface 4d of the metal base 4.
- an oxygen functional group is generated and increased on the resin bonding surface 1d, and the surface energy is increased.
- the atmospheric pressure plasma treatment is performed on the metal bonding surface 4d, the surface energy is increased by cleaning the surface and forming a strong oxide film.
- the surface modification step may be performed at any portion after the injection step and before joining.
- the laser bonding step S150 when the laser light 10 is irradiated with the reflected light reflected by the surface of the metal base 4, the laser light source may be deteriorated. For this reason, the laser beam 10 is irradiated obliquely so that the reflected light of the laser beam 10 is not irradiated to the laser light source. Therefore, the case where laser irradiation is performed in two steps is shown below.
- the laser bonding step S150 includes a first pressurizing step S152, a first laser irradiating step S154, a second pressurizing step S156, and a second laser irradiating step S158.
- FIG. 6 is a perspective view schematically showing a procedure for scanning the laser beam 10 in a state where the metal base 4 is pressed against the resin molded body 1 by the pressing jig 190. In FIG. 6, the locus of the laser beam 10 is schematically shown by a broken line.
- FIG. 7 is a cross-sectional view schematically showing a state in which the metal base 4 is pressed against the resin molded body 1 by the pressing jig 190.
- the resin molded body 1 is mounted on a mounting table (not shown) so that the resin bonding surface 1d is on the upper side, and the resin molded body 1 is fixed to the mounting table.
- the metal base 4 is disposed on the resin molded body 1 so that the metal bonding surface 4d of the metal base 4 is brought into contact with the resin bonding surface 1d of the resin molded body 1.
- a pressing jig 190 having a flat pressing surface is prepared.
- the edge of the pressing jig 190 is positioned in the vicinity of the laser irradiation surface 11 along one side of the rectangular metal base 4. Then, the pressing jig 190 is positioned, the pressing jig 190 is applied to the metal base 4 from above, and the metal base 4 is pressed downward. Thereby, the metal joint surface 4d of the metal base 4 and the resin joint surface 1d of the resin molded body 1 are pressed against each other.
- the metal bonding surface 4d and the resin bonding surface 1d are formed with minute irregularities, “the metal bonding surface 4d and the resin bonding surface 1d are in pressure contact with each other” means the resin bonding surface 1d. It does not mean that the metal bonding surface 4d is pressed and contacted over the entire region, and includes that a gap is formed in part. As the contact area of the pressing jig 190 with the metal base 4 is increased, warpage of the metal base 4 and a decrease in adhesion between the metal base 4 and the resin molded body 1 can be suppressed.
- the first laser irradiation step S154 is performed in a state where the resin molded body 1 and the metal base 4 are pressed against each other by the pressing jig 190.
- the first laser irradiation step S154 as shown in FIGS. 6A and 7, the laser irradiation surface 11 along one side of the rectangular metal base 4 is irradiated with the laser beam 10, and the broken line in FIG.
- the laser beam 10 is scanned in a straight line from the start point (point A) to the end point (point B) to join the metal joint surface 4d and the resin joint surface 1d.
- the edge of the pressing jig 190 is positioned in the vicinity of the laser irradiation surface 11 along the three sides of the rectangular metal base 4. Then, the pressing jig 190 is positioned, the pressing jig 190 is applied to the metal base 4 from above, and the metal base 4 is pressed downward. Thereby, the metal joint surface 4d of the metal base 4 and the resin joint surface 1d of the resin molded body 1 are pressed against each other.
- the second laser irradiation step S158 is performed in a state in which the resin molded body 1 and the metal base 4 are pressed against each other by the pressing jig 190.
- the laser irradiation surface 11 along the three sides of the rectangular metal base 4 is irradiated with the laser beam 10, and in FIG.
- the laser beam 10 is scanned in a substantially U shape from the start point (point A) to the end point (point B) to join the metal joint surface 4d and the resin joint surface 1d.
- the resin molded body 1 and the metal base 4 are joined, and the electronic control device 100 is completed.
- a laser junction 11a is formed as schematically shown by a broken line in FIG.
- the accommodation space for accommodating the circuit board 5 is sealed by the laser bonding portion 11a.
- the start point (point A) and the end point (point B) are irradiated in both the first laser irradiation step S154 and the second laser irradiation step S158, the amount of heat input of the laser beam 10 tends to increase. is there. Therefore, in order to make the heat input uniform, the positions of the start point (point A) and the end point (point B) may be slightly shifted in each of the first laser irradiation step S154 and the second laser irradiation step S158.
- a series of steps of the first pressurizing step S152 ⁇ the first laser irradiation step S154 ⁇ the second pressurizing step S156 ⁇ the second laser irradiation step S158 may be repeated a plurality of times.
- Patent Document 1 PBT resin is mixed with at least one selected from polycarbonate resin, acrylonitrile styrene copolymer, polyphenylene oxide, styrene resin, acrylic resin, polyethersulfone, polyarylate, and polyethylene terephthalate resin. It is described that it is suitable for practical use from the required characteristics such as moldability, toughness, and low warpage of the molded product (see paragraph [0104] of Patent Document 1).
- Patent Document 1 does not describe any configuration for preventing a decrease in bonding strength due to the gap between the resin molded body and the metal body, and the resin used as the alloy material is the resin molded body and There is no description about contributing to the laser bonding strength with the metal body.
- the present inventors pay attention to the properties of a resin useful for preventing a decrease in bonding strength due to the gap between the resin molded body and the metal body, and the resin used as the alloy material is a laser bonding strength with the metal body.
- a resin piece TPp made of an alloyed resin composition and a metal piece TPm are provided.
- a laser joined body obtained by laser joining was prepared, and a joining strength test was performed.
- a laser joined body in which a resin piece TPp made of an unalloyed resin composition and a metal piece TPm were laser joined was produced, and the same joining strength test was performed.
- FIG. 8 is a diagram for explaining a state in which the resin piece TPp and the metal piece TPm are laser-joined.
- each of the resin piece TPp and the metal piece TPm is a rectangular flat test piece.
- the resin piece TPp and the metal piece TPm are overlapped in a 20 mm square region, and a pressure of 0.3 MPa is applied from the outside so that they are pressed against each other.
- the metal piece TPm is irradiated with laser light, and the resin piece TPp and the metal piece TPm are laser-joined.
- the maximum gap between the resin piece TPp and the metal piece TPm is about 20 ⁇ m.
- a semiconductor laser device was used as the laser device.
- the laser irradiation conditions are an output of 350 W, a laser scanning speed of 3 mm / s, and a scanning length of 10 mm.
- the spot size of the laser beam irradiated to the metal piece TPm is ⁇ 0.6 mm.
- Two types of resin pieces TPp were used, one that had been previously subjected to atmospheric pressure plasma treatment and one that was not subjected to atmospheric pressure plasma treatment.
- the metal piece TPm was formed by JIS A5052, which is an aluminum alloy plate.
- As the surface roughness (centerline average roughness) Ra of the joint surface of the metal piece TPm with the resin piece TPp two types of 0.3 ⁇ m and 2.0 ⁇ m were used.
- Resin piece TPp is formed of PBT resin. About 30% by weight of glass fiber is added to the PBT resin.
- First resin piece The resin piece TPp is formed by a polymer alloy using a PBT resin as a base material and a polystyrene (hereinafter referred to as PS) resin as an alloy material. The blending ratio of the PBT resin and the PS resin contained in the polymer alloy is about 70% for the PBT resin and about 30% for the PS resin. About 30% by weight of glass fiber is added to the polymer alloy.
- PS polystyrene
- the resin piece TPp is molded by a polymer alloy using a PBT resin as a base material and an acrylonitrile styrene (hereinafter referred to as AS) resin as an alloy material.
- AS acrylonitrile styrene
- the blending ratio of the PBT resin and the AS resin contained in the polymer alloy is about 80% for the PBT resin and about 20% for the AS resin.
- About 30% by weight of glass fiber is added to the polymer alloy.
- the resin piece TPp is molded from a polymer alloy using a PBT resin as a base material and a polycarbonate (hereinafter referred to as PC) resin as an alloy material.
- the blending ratio of the PBT resin and the PC resin contained in the polymer alloy is about 80% for the PBT resin and about 20% for the PC resin.
- About 40% by weight of glass fiber is added to the polymer alloy.
- the resin piece TPp is molded from a polymer alloy using a PBT resin as a base material and a polyethylene terephthalate (hereinafter referred to as PET) resin as an alloy material.
- PET polyethylene terephthalate
- the blending ratio of the PBT resin and the PET resin contained in the polymer alloy is about 70% for the PBT resin and about 30% for the PET resin.
- About 30% by weight of glass fiber is added to the polymer alloy.
- an amorphous resin is used for the alloy material
- a crystalline resin is used for the alloy material.
- Each of the comparative resin piece and the first to fourth resin pieces contains various additives including an antioxidant in an amount of several% or less.
- FIG. 9 is a diagram showing the strength evaluation results.
- the strength evaluation result shown in FIG. 9 shows that the joining strength in a laser joined body composed of a comparative resin piece subjected to plasma treatment before laser joining and a metal piece TPm with an average roughness of the joining surface of Ra 0.3 ⁇ m is 1
- the bonding strength of each laser bonded body is represented by a value (that is, a relative value) when (ie, a reference value).
- the glass fiber addition amount in the third resin piece is about 40% by weight, while the glass fiber addition amount in the comparative resin piece, the first, second and fourth resin pieces is about 30% by weight.
- the difference in the amount of glass fiber added has little effect on the laser bonding strength.
- each of the laser joined bodies obtained by laser joining the resin pieces for comparison, the first to fourth resin pieces, and the metal pieces TPm having an average roughness Ra of the joining surface of 0.3 ⁇ m are provided. It turned out that when it returns to room temperature, it will peel at an interface, or even if it irradiates the laser beam 10, it will not join.
- the laser joined body using the first to fourth resin pieces is joined as compared with the laser joined body using the comparative resin piece.
- Strength improved In particular, the effect of improving the joining strength of the laser joined body using the third resin piece and the laser joined body using the fourth resin piece was remarkable, and the ratio of cohesive failure was increased.
- the laser joined body using the first to fourth resin pieces is joined as compared with the laser joined body using the comparative resin piece.
- Strength improved In particular, the effect of improving the bonding strength of the laser bonded body using the third resin piece was remarkable, and the ratio of cohesive failure was increased.
- FIG. 10 is a graph showing the temperature characteristics of the elastic modulus of a polymer alloy.
- the horizontal axis indicates the temperature, and the vertical axis indicates the elastic modulus.
- the broken line indicates the temperature characteristic of the elastic modulus of the non-alloyed PBT resin (characterized as non-alloy in the figure).
- the solid line indicates the temperature characteristic of the elastic modulus of the polymer alloy containing the PC resin as the alloy material in the PBT resin which is the base material (characterized as PC alloy in the figure).
- the alternate long and short dash line indicates the temperature characteristic of the elastic modulus of an alloyed polymer alloy containing PS resin as an alloy material in the PBT resin which is a base material (characterized as PS alloy in the figure).
- the elastic modulus decreases with increasing temperature.
- the elastic modulus of the polymer alloy PC alloy and PS alloy
- the elastic modulus of the polymer alloy is higher than that of the PBT resin (non-alloy)
- the elastic modulus is higher than that of the PBT resin (non-alloy).
- the modulus of elasticity of polymer alloys is lower.
- the elastic modulus decreases with the temperature rise, that is, softens.
- the gap amount between the resin piece TPp and the metal piece TPm at the time of laser bonding. Is reduced with the polymer alloy resin piece TPp.
- the gap strength with the metal piece Tpm at the time of laser bonding is sufficiently smaller than that in the non-alloy resin piece TPp, so that the bonding strength is improved.
- the bonding strength improves as the surface roughness of the bonding surface of the metal piece TPm with the resin piece TPp increases.
- the contact area between the resin piece TPp and the metal piece TPm is considered to contribute to the improvement of the bonding strength as compared with the case where the surface roughness is small.
- the resin piece TPp made of a resin containing an ester similar to the PBT resin, such as PC resin and PET resin, as an alloy material (third resin).
- Piece and fourth resin piece This is presumably because the effect of improving the adhesion is greater as the crystallization rate is slower. For this reason, it is also effective to delay the crystallization rate and improve the bonding strength by using the PBT copolymer together so as not to deteriorate the moldability. However, it is effective to use the amorphous resin alone only on the PBT copolymer alone because the moldability is greatly deteriorated.
- the evaluation of the bonding strength was performed not only in the laser bonded body in which the resin piece TPp and the metal piece TPm described above were bonded, but also in the electronic control device 100.
- the polymer alloy constituting the resin molded body 1 is alloyed with PBT resin as a base material and containing about 20% of PC resin, and about 40% by weight of glass fiber is added. We adopted what we did.
- the metal base 4 of each of the electronic control device 100 according to the present embodiment and the electronic control device according to the comparative example has the same material and configuration and employs JIS12ADC12 (aluminum die cast).
- each of the electronic control device 100 according to the present embodiment and the electronic control device according to the comparative example a large amount is applied to the resin bonding surface 1d of the resin molded body 1 and the metal bonding surface 4d of the metal base 4 before the laser light irradiation. Atmospheric pressure plasma treatment was performed.
- the laser bonding conditions were the same in the present embodiment and the comparative example, and the resin molded body 1 and the metal base 4 were laser bonded in both cases.
- the resin molded body 1 and the metal base 4 could be joined with each of the electronic control device 100 according to the present embodiment and the electronic control device according to the comparative example.
- the resin molded body 1 made of a thermoplastic polymer alloy that contains a crystalline resin and an amorphous resin and alloyed with the metal base 4 made of metal is laser-bonded to form the electronic control device 100. did.
- the crystalline resin and the amorphous resin were selected so that the glass transition temperature Tg of the amorphous resin was lower than the melting start temperature Ti of the crystalline resin.
- the laser bonding strength can be improved as compared with the case where the resin molded body 1 is formed of a crystalline resin that is not alloyed. As a result, the vibration resistance and impact resistance of the electronic control device 100 can be improved.
- a crystalline resin alloyed with an amorphous resin as an alloy material that is, a polymer alloy has a low elastic modulus in a high temperature region, so the above (1)
- the anisotropy of shrinkage during injection molding can be reduced, which greatly contributes to the improvement of the dimensional accuracy of the resin molded body 1.
- the time required for the resin in the molten state to crystallize can be made longer than that of the crystalline resin not alloyed.
- the laser joined body of the third resin piece and the metal piece compared with the laser joined body of the resin molded body made of a crystalline resin that is not alloyed and the metal body.
- a crystalline resin as a base material and a crystalline resin as an alloy material for example, PET resin
- an alloy material for example, PET resin
- a polymer alloy containing both is formed, so that the time until the resin in the molten state is crystallized again after the laser irradiation is longer than that of the non-alloyed crystalline resin.
- the base material and the alloy material are selected so that the recrystallization temperature Tca of the polymer alloy is lower than the recrystallization temperature Tc of the crystalline resin that is the base material of the polymer alloy, and both are contained.
- the electronic control device 100 includes an electronic circuit unit (circuit board 5) housed in a housing space defined by the metal base 4 and the resin molded body 1. Since the housing space is sealed by laser-bonding the resin molded body 1 and the metal base 4, waterproofness, dustproofness, and rustproofness can be ensured. That is, according to this embodiment, it is not necessary to seal using a liquid adhesive or the like.
- the sealing material When the adhesive is used as a sealing material, the sealing material is good in water tightness, but easily passes water vapor and absorbs water, so that the metal base 4 may be corroded. Moreover, when using a sealing material, there exists a possibility that sealing performance may deteriorate with the void contained in a sealing material. Furthermore, if a large amount of sealing material is used in order to prevent the deterioration of the sealing performance, there is a problem that the cost increases.
- Auto-curing adhesives are mainly used as sealing materials for automobile parts.
- a thermosetting adhesive when used, it takes 10 minutes or more to cure by heating, which causes a problem of poor productivity.
- voids are generated due to gas generated during heating, resulting in poor yield.
- the degree of freedom of design is restricted.
- the present embodiment since it is not necessary to use a sealing material, the above-mentioned problems do not occur, and it is possible to prevent an increase in manufacturing man-hours and an increase in cost, and to the sealing material. Compared to a long period of time, waterproof, dustproof and rustproof properties can be ensured.
- the cover 1a that covers the electronic circuit portion (circuit board 5) and the connector 1b that holds terminal pins that are electrically connected to the electronic circuit portion (circuit board 5) are integrated by injection molding. It is a molded integrally molded body. Cost reduction can be achieved by using the resin molded body 1 as an integral molded body. Further, when an electronic control device is formed by combining a plurality of resin parts, the flatness at the resin bonding surface 1d may not be ensured due to the influence of assembly tolerance, whereas in the present embodiment, the resin molding 1 Therefore, the flatness required for laser joining the metal joint surface 4d and the resin joint surface 1d can be easily ensured.
- FIG. 11 is a perspective view showing a cover 201a and a connector 201b of an electronic control device according to the second embodiment.
- the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
- differences from the first embodiment will be described in detail.
- the cover 1a and the connector 1b are integrally formed by injection molding.
- the second embodiment is different from the first embodiment in that the cover 201a that covers the circuit board 5 and the connector 1b that holds terminal pins (not shown) are separated. . That is, the cover 201a and the connector 201b are each configured as a resin molded body made of the polymer alloy described in the first embodiment.
- the connector 201b is inserted and welded into the notch 211 of the cover 201a.
- various welding methods such as laser welding, ultrasonic welding, and hot plate welding can be adopted.
- the connector 201b and the cover 201a may be coupled to each other using an adhesive or snap fit.
- the cover 201a and the connector 201b are separate bodies (separate parts), the cover 201a and the connector 201b can be made of different materials.
- the connector 201b having high flame retardancy requirements grade and environmental regulations
- a material containing a greater amount of flame retardant than the cover 201a can be used. Thereby, material cost can be reduced compared with the case where a cover and a connector are integrally molded and the requirement of flame retardance is satisfied.
- the flame retardance of the connector 201b is increased as compared with the cover 201a, the alloy material contained in the polymer alloy constituting the cover 201a and the alloy material contained in the polymer alloy constituting the connector 201b are separated. May be.
- the cover 201a and the connector 201b are joined by welding, and PBT resin is used for the base material of each of the cover 201a and the connector 201b, even if many flame retardants are blended in the connector 201b It has been found that the weldability of the two is not greatly affected.
- the color of the connector 201b and the cover 201a can be made different.
- a black resin can be used for the connector 201b and a natural color resin can be used for the cover 201a.
- a natural color resin that is, a natural material to which an additive for coloring is not added, an appearance inspection can be easily performed. If the cover 201a has a thickness of about 1.0 to 1.5 mm, the transmittance is relatively high, so that the joined state can be easily confirmed.
- a pressing jig 290 may be disposed on the outer end portion of the metal base 4, that is, outside the laser irradiation surface 11 and pressed.
- the outer edge of the metal base 4 is scanned by scanning the laser beam 10 in a straight line in the first laser irradiation step S154 and scanning the laser beam 10 in a U-shape in the second laser irradiation step S158.
- One round scanning was performed (see FIG. 6). That is, although the example which divided the process which scans the laser irradiation surface 11 of the metal base 4 over a perimeter into two procedures was demonstrated, this invention is not limited to this.
- the laser beam 10 may be scanned all around in one procedure.
- a pressing jig 290 is applied to the outer ends corresponding to the four sides of the metal base 4, the metal base 4 is pressed against the resin molded body 1, and a laser is provided from a laser device equipped with a galvano scanner.
- the laser light 10 can be scanned over the entire circumference without dividing the procedure. If the mirror of the galvano scanner is arranged right above the center of the metal base 4, the laser beam 10 can be scanned in a square shape.
- a laser device including a galvano scanner is suitable for manufacturing an electronic control device having a relatively small size.
- the size of the metal base 4 may be slightly smaller than the size of the cover 1 a of the resin molded body 1.
- the laser beam 10 is irradiated onto the laser irradiation surface 11 and the resin molded body 1 is heated through the metal base 4
- a sudden drop in elastic modulus occurs (see FIG. 10).
- the gap between the resin molded body 1 and the metal base 4 can be reduced, and both can be sufficiently adhered to each other.
- the outer peripheral part of the metal base 4 is embedded in the resin molding 1 as shown in FIG.13 (b).
- the embedding depth is preferably set to 1/2 or more of the thickness of the metal base 4. Thereby, a leak path becomes long and can improve waterproofness, dustproof property, and rustproofness further.
- a convex portion 21 that protrudes toward the resin molded body 1 may be provided on the outer peripheral portion of the metal base 4, and the top surface of the convex portion 21 may be pressed against the resin molded body 1. .
- the pressurization force required for the pressing jig 290 can be reduced, and the necessary embedding amount can be easily ensured as shown in FIG. Further, it is possible to prevent the resin burr generated during the pressurizing process from jumping out.
- a groove 22 may be provided between the cooling fin 7 of the metal base 4 and the laser irradiation surface 11.
- the pressing jigs 190, 290 may be heated with a heater or the like, and the metal base 4 may be pressed in the heated state.
- the amount of embedding can be increased by heating the resin molded body 1 to a temperature equal to or higher than the glass transition temperature Tg of the alloy material as compared with the case where the resin molded body 1 is not heated.
- crystallization proceeds slowly even after laser bonding, and rapid cooling after bonding can be suppressed, so that thermal stress can also be reduced.
- the laser energy required for laser bonding can be greatly reduced.
- the pressing jigs 190 and 290 may be provided with a glass plate having high heat resistance and high transmittance that transmits the laser beam 10, and the laser irradiation surface 11 may be irradiated with the laser beam 10 through the glass plate.
- the metal base 4 can be formed of various metals such as stainless steel in addition to the above-described aluminum die cast, JIS A5052, and galvanized steel sheet.
- the surface modification treatment is preferably performed at least on the resin bonding surface 1 d of the resin molded body 1, and more preferably performed on the metal bonding surface 4 d of the metal base 4. Even if only one of the resin side or the metal side is effective.
- the content of the amorphous resin contained in the polymer alloy exceeds 40%, the characteristics of the amorphous resin may appear strongly, and the heat resistance may deteriorate.
- the content of the conductive resin is preferably 40% or less.
- the content rate of the amorphous resin contained in the polymer alloy is 40% or less, the reliability is not significantly lowered even in a long-term high-temperature test at 150 ° C., and sufficient heat resistance can be secured.
- the strength evaluation for the laser bonded body using the resin piece TPp in which about 30 to 40% by weight of glass fiber is added to the polymer alloy has been described, but the present invention is not limited to this. If the glass fiber added to the polymer alloy is less than 20% by weight, the effect of improving the rigidity is small, so the glass fiber to be added is preferably 20% by weight or more. Further, if the glass fiber added to the polymer alloy exceeds 50% by weight, the moldability may be deteriorated. Therefore, the glass fiber to be added is preferably 50% by weight or less.
- the surface roughness Ra on the joint surface of the metal piece TPm exceeds 7.0 ⁇ m, the resin is not sufficiently filled in the unevenness, and the joint strength is lowered. Therefore, the surface roughness Ra on the joint surface of the metal piece TPm is 7.0 ⁇ m or less is preferable, and from the viewpoint of airtightness, 5.0 ⁇ m or less is more preferable.
- the polymer alloy that is the material of the resin molded body 1 includes various additives such as antioxidants, ultraviolet absorbers, heat stabilizers, antistatic agents and other stabilizers, crystal nucleating agents, plasticizers, lubricants, and the like. It may be added.
- the content of the additive is preferably set to such an extent that the effect of improving the bonding strength is not hindered.
- PBT resin has the property of being easily hydrolyzed. For this reason, when using PBT resin for the base material of a polymer alloy, it is suitable to add the additive (for example, epoxy resin) which suppresses hydrolysis.
- the additive for example, epoxy resin
- the hydrolyzability is similar to that of PBT, so it is preferable to add an additive that suppresses hydrolysis.
- productivity may fall or the physical property of a molded object may fall because transesterification progresses too much.
- a transesterification reaction terminator for example, phosphorus compound
- a flame retardant for example, phosphorus-based, bromine-based, etc. may be added according to the demand for flame retardancy.
- the metal base 4 is formed in a rectangular flat plate shape and the recess 1c is formed in the resin molded body 1 has been described, but the present invention is not limited to this.
- the metal base 4 may be provided with a recess that accommodates the circuit board 5 and the resin molded body 1 may have a flat plate shape.
- each of the cover 201 a and the connector 201 b is laser-bonded to the metal base 4.
- One of the cover 201a and the connector 201b may be laser-bonded to the metal base 4 and the other may be bonded to the metal base 4 with an adhesive or the like. Even when laser bonding and an adhesive are used in combination, the amount of adhesive used can be reduced as compared with a case where all of the components are bonded with an adhesive.
- the resin to be alloyed only needs to be at least a portion corresponding to the laser bonding portion 11a.
- the outer peripheral portion of the cover 1a is made of a molded body made of an alloy, and the center portion of the cover 1a is made of a molded body made of a resin that is not alloyed. It can also be joined by welding.
- the method for manufacturing the electronic control device 100 described above is merely an example, and the electronic control device 100 can be manufactured by various manufacturing methods.
- the example in which the metal base 4 is joined to the resin molded body 1 after the circuit board 5 is arranged and fixed in the recess 1c of the resin molded body 1 in the assembly step S140 has been described.
- the present invention is not limited to this.
- the resin molded body 1 may be bonded to the metal base 4 after the circuit board 5 is arranged and fixed to the metal base 4.
- the gap amount is larger than 50 ⁇ m and equal to or smaller than 100 ⁇ m, many voids remain in the laser joining portion 11a due to thermal decomposition of the resin piece TPp, so that it is difficult to maintain the joining strength for a long period. For this reason, it is preferable to make the gap
- the present invention is not limited to the above-described embodiments, and other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention. .
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Abstract
Description
本発明の第2の態様によると、レーザ接合構造は、結晶性樹脂に他の樹脂を含有してアロイ化された熱可塑性のポリマーアロイからなる樹脂成形体と、金属からなる金属体とがレーザ接合され、ポリマーアロイの結晶化速度が結晶性樹脂の結晶化速度よりも低い、または、ポリマーアロイの再結晶化温度が結晶性樹脂の再結晶化温度よりも低い。
本発明の第3の態様によると、レーザ接合構造の製造方法は、結晶性樹脂および非結晶性樹脂を含有してアロイ化された熱可塑性のポリマーアロイからなる樹脂成形体と、金属からなる金属体とを準備し、非結晶性樹脂のガラス転移温度は、結晶性樹脂の溶融開始温度よりも低く、少なくとも樹脂成形体における金属体にレーザ接合される部分に、酸素官能基を増大させる処理を施し、樹脂成形体を非結晶性樹脂のガラス転位温度以上の温度まで加熱し、樹脂成形体および金属体を互いに押圧接触させた状態で、樹脂成形体と金属体とをレーザ接合する。
-第1の実施の形態-
図1は本発明の第1の実施の形態に係るレーザ接合構造を有する電子制御装置100の概略を示す斜視図であり、図2は電子制御装置100の概略を示す分解斜視図である。本実施の形態に係る電子制御装置100は、自動車に搭載され、エンジンを電子制御するエンジンコントローラユニット(ECU)である。図2に示すように、電子制御装置100は、エンジン制御用の回路基板5と、樹脂成形体1と、金属ベース4とを備えている。
図4は電子制御装置100を製造する工程を説明するためのフローチャートである。電子制御装置100の製造方法は、樹脂選定工程S110と、射出成形工程S120と、組立準備工程S130と、組立工程S140と、表面改質処理工程S145と、レーザ接合工程S150とを含む。
樹脂選定工程S110では、結晶性樹脂と、アロイ化する非結晶性樹脂とを選定する。選定の際、以下の選定条件を満足するように、結晶性樹脂および非結晶性樹脂をそれぞれ選定する。選定された結晶性樹脂および非結晶性樹脂をアロイ化し、ペレット状のポリマーアロイを形成する。
<選定条件>非結晶性樹脂のガラス転移温度Tg<結晶性樹脂の溶融開始温度Ti
図4に示す射出成形工程S120では、樹脂選定工程S110で得られたペレット状のポリマーアロイを加熱溶融し、射出成形機(不図示)により射出成形することで樹脂成形体1を形成する。例えば、射出成形機のノズルは、カバー1aの中央部に対応する位置に配置される。ノズルの射出口から射出されたポリマーアロイは、中央部から周囲に拡がり、カバー1aおよびコネクタ1bが一体的に成形される。
組立準備工程S130では、樹脂成形体1と、電子部品6が実装された回路基板5と、金属ベース4とを準備する。
組立工程S140では、回路基板5を樹脂成形体1の凹部1cに配置し、コネクタ1bの端子ピンと回路基板5とをスポットフロー(局所半田付け)などによって半田接合し、両者を電気的に接続する。回路基板5を樹脂成形体1に接着剤、熱カシメ、ねじ止めなどにより固定する。接着剤を用いて固定する場合、紫外線硬化接着剤、あるいは、室温で硬化する2液接着剤を用いて固定することで、工程時間の短縮化を図ることができるので好適である。
表面改質処理工程S145では、大気圧プラズマ処理を樹脂成形体1および金属ベース4の接合面に施す。表面改質処理工程S145では、大気圧下でプラズマを発生させ、樹脂成形体1の樹脂接合面1dおよび金属ベース4の金属接合面4dに向けてプラズマを照射する。これにより、樹脂接合面1dに酸素官能基が生成、増大され、表面エネルギーが増大する。また、金属接合面4dに大気圧プラズマ処理を施すと、表面の洗浄や強固な酸化膜の形成によって、表面エネルギーは増大する。なお、表面改質工程は、射出工程の後以降及び接合前であればどの部分で行っても良い。
レーザ接合工程S150において、レーザ光10を照射する際、金属ベース4の表面で反射した反射光がレーザ光源に照射されると、レーザ光源が劣化してしまうおそれがある。このため、レーザ光10の反射光がレーザ光源に照射されないように、斜めにレーザ光10を照射する。そのため、2工程でレーザ照射する場合を以下に示す。
第1加圧工程S152では、図6(a)および図7に示すように、押圧治具190の縁部が矩形状の金属ベース4の一辺に沿うレーザ照射面11の近傍に位置するように、押圧治具190を位置決めし、押圧治具190を上方から金属ベース4に当て、金属ベース4を下方に向けて押圧する。これにより、金属ベース4の金属接合面4dと、樹脂成形体1の樹脂接合面1dとが互いに押圧接触される。なお、金属接合面4dおよび樹脂接合面1dには、それぞれ微小な凹凸が形成されているため、「金属接合面4dと樹脂接合面1dとが互いに押圧接触される」とは、樹脂接合面1dと金属接合面4dとが全領域に亘って押圧接触されることを意味するものではなく、一部に隙間が形成されていることを含む。金属ベース4に対する押圧治具190の接触面積を大きくするほど、金属ベース4の反りや、金属ベース4と樹脂成形体1との密着性の低下を抑制できる。
第1レーザ照射工程S154は、押圧治具190により樹脂成形体1と金属ベース4とが互いに押圧接触された状態で行われる。第1レーザ照射工程S154では、図6(a)および図7に示すように、矩形状の金属ベース4の一辺に沿うレーザ照射面11にレーザ光10を照射し、図6(a)において破線で模式的に示すように、始点(A点)から終点(B点)まで一直線状にレーザ光10を走査し、金属接合面4dと樹脂接合面1dとを接合する。
第2加圧工程S156では、図6(b)および図7に示すように、押圧治具190の縁部が矩形状の金属ベース4の三辺に沿うレーザ照射面11の近傍に位置するように、押圧治具190を位置決めし、押圧治具190を上方から金属ベース4に当て、金属ベース4を下方に向けて押圧する。これにより、金属ベース4の金属接合面4dと、樹脂成形体1の樹脂接合面1dとが互いに押圧接触される。
第2レーザ照射工程S158は、押圧治具190により樹脂成形体1と金属ベース4とが互いに押圧接触された状態で行われる。第2レーザ照射工程S158では、図6(b)および図7に示すように、矩形状の金属ベース4の三辺に沿うレーザ照射面11にレーザ光10を照射し、図6(b)において破線で模式的に示すように、始点(A点)から終点(B点)まで略コ字状にレーザ光10を走査し、金属接合面4dと樹脂接合面1dとを接合する。
自動車に搭載される電子制御装置100のように、振動や衝撃が作用する電子制御装置では、樹脂成形体1と金属ベース4との接合強度を高くすることが重要である。ところで、特許文献1には、PBT樹脂に、ポリカーボネート樹脂、アクリロニトリルスチレン共重合体、ポリフェニレンオキシド、スチレン樹脂、アクリル樹脂、ポリエーテルスルホン、ポリアリレート、ポリエチレンテレフタレート樹脂の中から選ばれる少なくとも1種を混合物として用いることが、成形性、靭性、成形体低反り性などの必要特性から実用上好適であるということが記載されている(特許文献1の段落[0104]参照)。
[比較用樹脂片]
樹脂片TPpが、PBT樹脂により成形されている。PBT樹脂には、ガラスファイバーが約30重量%添加されている。
[第1樹脂片]
樹脂片TPpが、PBT樹脂を母材として、ポリスチレン(以下、PSと記す)樹脂をアロイ材としたポリマーアロイにより成形されている。ポリマーアロイに含有されるPBT樹脂とPS樹脂の配合比率は、PBT樹脂が70%程度、PS樹脂が30%程度とされている。ポリマーアロイには、ガラスファイバーが約30重量%添加されている。
樹脂片TPpが、PBT樹脂を母材として、アクリロニトリルスチレン(以下、ASと記す)樹脂をアロイ材としたポリマーアロイにより成形されている。ポリマーアロイに含有されるPBT樹脂とAS樹脂の配合比率は、PBT樹脂が80%程度、AS樹脂が20%程度とされている。ポリマーアロイには、ガラスファイバーが約30重量%添加されている。
樹脂片TPpが、PBT樹脂を母材として、ポリカーボネート(以下、PCと記す)樹脂をアロイ材としたポリマーアロイにより成形されている。ポリマーアロイに含有されるPBT樹脂とPC樹脂の配合比率は、PBT樹脂が80%程度、PC樹脂が20%程度とされている。ポリマーアロイには、ガラスファイバーが約40重量%添加されている。
樹脂片TPpが、PBT樹脂を母材として、ポリエチレンテレフタレート(以下、PETと記す)樹脂をアロイ材としたポリマーアロイにより成形されている。ポリマーアロイに含有されるPBT樹脂とPET樹脂の配合比率は、PBT樹脂が70%程度、PET樹脂が30%程度とされている。ポリマーアロイには、ガラスファイバーが約30重量%添加されている。
図9は、強度評価結果を示す図である。図9に示す強度評価結果は、レーザ接合前にプラズマ処理を施した比較用樹脂片と、接合面の平均粗さをRa0.3μmとした金属片TPmとからなるレーザ接合体における接合強度を1(すなわち基準値)としたときの値(すなわち相対値)により、各レーザ接合体の接合強度を表している。なお、比較用樹脂片、第1、第2および第4樹脂片におけるガラスファイバーの添加量が約30重量%であるのに対し、第3樹脂片におけるガラスファイバーの添加量は約40重量%であるが、このガラスファイバーの添加量の差がレーザ接合強度に与える影響はわずかである。
図9に示すように、比較用樹脂片、第1~第4樹脂片のそれぞれと、接合面の平均粗さRaが0.3μmの金属片TPmとをレーザ接合したレーザ接合体は、いずれも室温に戻ると界面で剥離してしまう、もしくは、レーザ光10を照射しても接合しないことが判明した。
金属片TPmの接合面の平均粗さRaが0.3μmの場合は、第1~第4樹脂片を用いたレーザ接合体は、いずれも比較用樹脂片を用いたレーザ接合体に比べて接合強度が向上した。特に、第3樹脂片を用いたレーザ接合体の接合強度の向上効果が顕著であり、凝集破壊の割合がその他の場合に比べて多くなっていた。
接合強度の評価は、上述の樹脂片TPpと金属片TPmとを接合したレーザ接合体だけでなく、電子制御装置100でも実施した。本実施の形態に係る電子制御装置100において、樹脂成形体1を構成するポリマーアロイは、PBT樹脂を母材として、PC樹脂を20%程度含有してアロイ化し、ガラスファイバーを約40重量%添加したものを採用した。
比較例に係る電子制御装置の樹脂成形体1と金属ベース4とを引きはがすように外部から力を加えたところ、樹脂成形体1と金属ベース4との界面で破壊され、樹脂成形体1自体での破壊は確認されなかった。これに対して、本実施の形態に係る電子制御装置100の樹脂成形体1と金属ベース4とを引きはがすように外部から力を加えたところ、樹脂成形体1自体が破壊され、樹脂成形体1と金属ベース4との界面での破壊は確認されなかった。なお、破壊試験において、本実施の形態の電子制御装置を破壊させるために必要な力は、比較例の電子制御装置を破壊させるために必要な力よりも大きかった。つまり、本実施の形態では、レーザ接合強度が比較例に比べて向上していることが確認できた。なお、その時の最大隙間量は40μmほどであったため、アロイ系を用いると、接合強度の向上効果が非常に大きいと言える。
比較例に係る電子制御装置を水没させ、樹脂成形体1に孔を形成して、その孔から収容空間内に0.3MPa程度の圧力をかけたところ、レーザ接合部11aからの気泡漏れが確認できた。これに対して、本実施の形態に係る電子制御装置100を水没させ、樹脂成形体1に孔を形成して、その孔から収容空間内に0.3MPa程度の圧力をかけたところ、レーザ接合部11aからの気泡漏れは確認できなかった。つまり、本実施の形態では、レーザ接合部11aによる収容空間内の気密性が比較例に比べて向上していることが確認できた。
(1)結晶性樹脂および非結晶性樹脂を含有してアロイ化された熱可塑性のポリマーアロイからなる樹脂成形体1と、金属からなる金属ベース4とをレーザ接合し、電子制御装置100を形成した。結晶性樹脂および非結晶性樹脂は、非結晶性樹脂のガラス転移温度Tgが結晶性樹脂の溶融開始温度Tiよりも低くなるように選定した。このため、レーザ走査領域の全体における樹脂接合面1dと金属接合面4dとの隙間量にばらつきがある場合でも、レーザ照射時の樹脂成形体1の温度上昇による軟化(弾性率の低下)により、樹脂接合面1dと金属接合面4dとの隙間量が効果的に低減されるので、十分な接合強度を確保することができる。このように、本実施の形態によれば、アロイ化されていない結晶性樹脂により樹脂成形体1を形成した場合に比べて、レーザ接合強度を向上できる。その結果、電子制御装置100の耐振動性および耐衝撃性を向上できる。
同様に、ポリマーアロイの結晶化速度が母材となる結晶性樹脂の結晶化速度よりも低くなるように、母材となる結晶性樹脂と、アロイ材となる結晶性樹脂(たとえば、PET樹脂)とを選定し、両者を含有させたポリマーアロイを形成することで、レーザ照射後、溶融状態の樹脂が再び結晶化するまでの時間を、アロイ化されていない結晶性樹脂に比べて、長くすることができる。これにより、本実施の形態(たとえば、第4樹脂片と金属片とのレーザ接合体)によれば、アロイ化されていない結晶性樹脂からなる樹脂成形体と金属体とのレーザ接合体に比べて、レーザ接合強度を向上できる。
図11を参照して、第2の実施の形態に係る電子制御装置について説明する。図11は、第2の実施の形態に係る電子制御装置のカバー201aおよびコネクタ201bを示す斜視図である。図中、第1の実施の形態と同一もしくは相当部分には同一符号を付し、説明を省略する。以下、第1の実施の形態との相違点について詳しく説明する。
(9)カバー201aとコネクタ201bとが別体(別部品)であるため、カバー201aとコネクタ201bの材料を別にすることができる。たとえば、難燃性の要求(グレードや環境規制)の高いコネクタ201bについては、カバー201aに比べて難燃剤が多く配合された材料を採用できる。これにより、カバーとコネクタとを一体成形として、難燃性の要求を満足させる場合に比べて、材料費を低減できる。
上述した実施の形態では、金属ベース4の中央部に押圧治具190を配置し、加圧する例について説明したが、本発明はこれに限定されない。たとえば、図12に示すように、金属ベース4の外側端部、すなわちレーザ照射面11よりも外側に押圧治具290を配置し、加圧してもよい。
上述した実施の形態では、第1レーザ照射工程S154で一直線状にレーザ光10を走査し、第2レーザ照射工程S158でコ字状にレーザ光10を走査することで、金属ベース4の外縁を1周走査するようにした(図6参照)。すなわち、金属ベース4のレーザ照射面11を全周に亘って走査する工程を2手順に分けた例について説明したが、本発明はこれに限定されない。1手順で、レーザ光10を全周走査するようにしてもよい。
図13(a)に示すように、金属ベース4の大きさを、樹脂成形体1のカバー1aの大きさよりも一回り小さくしてもよい。この場合、レーザ光10がレーザ照射面11に照射され、金属ベース4を介して樹脂成形体1が熱せられることで、急激な弾性率の低下が起こるため(図10参照)、樹脂成形体1の融点Tmに達する前に樹脂成形体1と金属ベース4との隙間量を低減させ、両者を十分に密着させることができる。さらに、樹脂成形体1の融点Tm以上になると、図13(b)に示すように、樹脂成形体1に金属ベース4の外周部が埋め込まれる。なお、埋め込み深さは、金属ベース4の厚みの1/2以上とすることが好ましい。これにより、リークパスが長くなり、防水性、防塵性、防錆性をさらに向上できる。
図14(a)に示すように、金属ベース4の外周部に樹脂成形体1に向かって突出する凸部21を設け、凸部21の頂面を樹脂成形体1に押し付けるようにしてもよい。これにより、押圧治具290に必要な加圧力を低減させることができ、図14(b)に示すように、容易に必要な埋め込み量を確保することができる。また、加圧工程の際に発生する樹脂バリが外方に飛び出すことを防止できる。
図14に示すように、金属ベース4の冷却フィン7とレーザ照射面11の間に溝部22を設けておいてもよい。このような構造にしておくと、レーザ照射時に発生した熱の接合部以外への逃げが悪化するため、低エネルギーでレーザ接合が可能となる。ただし、剛性の悪化によって、金属ベース4が反る可能性があるため、溝部22の深さは剛性を考慮して設計する必要がある。
加圧工程(S152,S156)において、押圧治具190,290をヒータ等で加熱し、加熱した状態で金属ベース4を加圧してもよい。この場合、樹脂成形体1をアロイ材のガラス転移温度Tg以上の温度まで加熱することで、加熱しない場合に比べて埋め込み量を増加できる。また、ポリマーアロイの再結晶化温度以上であってポリマーアロイの溶融開始温度以下の温度に樹脂成形体1を加熱した状態でレーザ接合することが好ましい。これにより、レーザ接合後も結晶化が遅く進み、接合後の急冷をも抑制できるため、熱応力も低減できる。さらに、レーザ接合に必要なレーザエネルギーを大幅に低減できるメリットもある。
押圧治具190,290に、レーザ光10を透過する耐熱性および透過率の高いガラス板を設け、レーザ光10をガラス板を介してレーザ照射面11に照射してもよい。
上述した実施の形態では、金属ベース4にレーザ照射面11を設けて、金属ベース4にレーザ光10を照射する例について説明したが、本発明はこれに限定されない。樹脂成形体1の透過率が高い場合、樹脂成形体1にレーザ光10を照射して、レーザ接合してもよい。
上述した実施の形態では、金属ベース4は、上述したアルミダイキャストやJISA5052、亜鉛メッキ鋼板の他、ステンレススチール等の種々の金属により形成することもできる。
上述した実施の形態では、樹脂側の酸素官能基を生成、増大させる処理および金属側の表面洗浄、強固な酸化膜形成する処理として、大気圧プラズマ処理の例について説明したが、本発明はこれに限定されない。大気圧プラズマ処理に代えて、減圧プラズマ処理を施してもよい。なお、大気圧プラズマ処理は、生産性の点で減圧プラズマ処理に比べて有効であり、減圧プラズマ処理は、様々な気体を付与できる点で有効である。その他、プラズマ処理に代えて、たとえば、UVオゾン、エキシマレーザ、短パルス照射などのドライ処理を施してもよい。
表面改質処理は、少なくとも樹脂成形体1の樹脂接合面1dに施すことが好ましく、さらに金属ベース4の金属接合面4dに施すことがより好ましい。樹脂側もしくは金属側の一方のみでも効果は大きい。
上述した実施の形態では、ポリマーアロイに含有される非結晶性樹脂の含有率が20~30%程度の樹脂片TPpを用いたレーザ接合体に対する強度評価について説明したが、本発明はこれに限定されない。なお、ポリマーアロイに含有される非結晶性樹脂の含有率が5%未満であると、接合強度の向上効果が小さいため、ポリマーアロイに含有される非結晶性樹脂の含有率は5%以上とすることが好ましい。
上述した実施の形態では、ポリマーアロイにガラスファイバーが約30~40重量%程度添加された樹脂片TPpを用いたレーザ接合体に対する強度評価について説明したが、本発明はこれに限定されない。なお、ポリマーアロイに添加されるガラスファイバーが20重量%未満であると、剛性の向上効果が小さいため、添加するガラスファイバーは20重量%以上とすることが好ましい。また、ポリマーアロイに添加されるガラスファイバーが50重量%を超えると、成形性が悪化する場合があるので、添加するガラスファイバーは50重量%以下とすることが好ましい。
上述した実施の形態では、ガラスファイバーをポリマーアロイに添加する例について説明したが本発明はこれに限定されない。ポリマーアロイの剛性を向上させるために、無機物からなる種々の無機フィラーを添加することができる。たとえば、ガラスファイバーに代えて、ガラスフレークや特殊形状のガラスなどを添加してもよい。また、ガラスファイバーに代えて、カーボンファイバーを添加することもできる。これにより、剛性の向上に加え、電磁波シールド性を向上することができる。電磁波シールド性を向上できる無機フィラーとして、導電カーボン(たとえば、ケッチェンブラック、アセチレンブラック、カーボンビーズ、黒鉛等)を採用することもできる。なお、無機フィラーをポリマーアロイに添加しない場合も本発明の範囲内である。
上述した実施の形態では、金属片TPmにおける樹脂片TPpとの接合面の表面粗さRaが0.3μmのものと、2.0μmのものを用いたレーザ接合体に対する強度評価について説明したが、本発明はこれに限定されない。なお、金属片TPmの接合面における表面粗さRaが0.1μm未満であると、接合強度の向上効果が小さく、剥離するおそれがあるため、金属片TPmの接合面における表面粗さRaは0.1μm以上とすることが好ましい。なお、表面粗さRaが0.1μm未満であっても、レーザ接合前にプラズマ処理を施すことで、樹脂片TPpと金属片TPmとを接合させることができる。
樹脂成形体1の材料であるポリマーアロイには、各種添加剤、たとえば、酸化防止剤、紫外線吸収剤、熱安定剤、帯電防止剤等の安定剤や結晶核剤、可塑剤、潤滑剤などを添加してもよい。添加剤の含有量は、接合強度の向上効果を阻害しない程度に設定することが好ましい。
上述した実施の形態では、金属ベース4が矩形平板状に形成され、樹脂成形体1に凹部1cが形成されている例について説明したが、本発明はこれに限定されない。たとえば、金属ベース4に回路基板5を収容する凹部を設け、樹脂成形体1を平板状としてもよい。
第2の実施の形態では、カバー201aとコネクタ201bとを溶着等で結合する例について説明したが、本発明はこれに限定されない。カバー201aとコネクタ201bとは結合しなくてもよい。この場合、カバー201aおよびコネクタ201bのそれぞれを金属ベース4にレーザ接合する。なお、カバー201aおよびコネクタ201bのいずれか一方を金属ベース4にレーザ接合し、他方を接着剤等で金属ベース4に結合させてもよい。レーザ接合と接着剤とを併用する場合であっても、各部品の全てを接着剤で結合する場合に比べて接着剤の使用量を低減することができる。
上述した実施の形態では、自動車に搭載されるエンジンコントローラとしての電子制御装置100に本発明を適用した例について説明したが、本発明はこれに限定されない。樹脂成形体と金属体とをレーザ接合する種々の部品、装置に本発明を適用することができる。
アロイ化する樹脂は、少なくともレーザ接合部11aに対応する部分だけであればよい。たとえば、第1の実施の形態において、カバー1aの外周部だけをアロイ化した樹脂からなる成形体で構成し、カバー1aの中央部はアロイ化していない樹脂からなる成形体で構成し、両者を溶着で結合することもできる。
上述した電子制御装置100の製造方法は、あくまでも一例であって、種々の製造方法により電子制御装置100を製造することができる。たとえば、上述した実施の形態では、組立工程S140において、回路基板5を樹脂成形体1の凹部1cに配置、固定してから、金属ベース4を樹脂成形体1に接合する例について説明したが、本発明はこれに限定されない。回路基板5を金属ベース4に配置、固定してから、樹脂成形体1を金属ベース4に接合してもよい。
上述した実施の形態では、樹脂片TPpと金属片TPmとの最大隙間量は20μm程度の例について説明したが、本発明はこれに限定されない。なお、樹脂片TPpと金属片TPmとの隙間量が大きくなるほど接合強度が低下するので、隙間量はできるだけ低減することが望ましい。隙間量が100μmを超えると、樹脂片TPpと金属片TPmとを接合できない。このため、隙間量は100μm以下とする必要がある。ただし、隙間量が50μmよりも大きく100μm以下の場合は、樹脂片TPpの熱分解によって、レーザ接合部11aにボイドが多く残存することになるので、接合強度を長期的に維持することが難しい。このため、樹脂片TPpと金属片TPmとを加圧した状態で、できる限り隙間量を小さくしておくことが好ましく、50μm以下とすることが好ましい。
日本国特許出願2014年第209352号(2014年10月10日出願)
Claims (14)
- 結晶性樹脂および非結晶性樹脂を含有してアロイ化された熱可塑性のポリマーアロイからなる樹脂成形体と、金属からなる金属体とがレーザ接合され、
前記非結晶性樹脂のガラス転移温度は、前記結晶性樹脂の溶融開始温度よりも低いレーザ接合構造。 - 結晶性樹脂に他の樹脂を含有してアロイ化された熱可塑性のポリマーアロイからなる樹脂成形体と、金属からなる金属体とがレーザ接合され、
前記ポリマーアロイの結晶化速度が前記結晶性樹脂の結晶化速度よりも低い、または、前記ポリマーアロイの再結晶化温度が前記結晶性樹脂の再結晶化温度よりも低いレーザ接合構造。 - 請求項1に記載のレーザ接合構造において、
前記ポリマーアロイの結晶化速度が前記結晶性樹脂の結晶化速度よりも低い、または、前記ポリマーアロイの再結晶化温度が前記結晶性樹脂の再結晶化温度よりも低いレーザ接合構造。 - 請求項1乃至3のいずれか一項に記載のレーザ接合構造において、
少なくとも前記樹脂成形体における前記金属体との接合面には、酸素官能基を増大させる処理が施されているレーザ接合構造。 - 請求項1乃至3のいずれか一項に記載のレーザ接合構造において、
前記ポリマーアロイには、前記結晶性樹脂の共重合体が含有されているレーザ接合構造。 - 請求項1に記載のレーザ接合構造において、
前記ポリマーアロイに含有される前記非結晶性樹脂の含有率は、5~40%であるレーザ接合構造。 - 請求項1乃至3のいずれか一項に記載のレーザ接合構造において、
前記ポリマーアロイには、無機フィラーが添加されているレーザ接合構造。 - 請求項1乃至3のいずれか一項に記載のレーザ接合構造において、
前記金属体における前記樹脂成形体との接合面の表面粗さがRa0.1μm~5.0μmとされているレーザ接合構造。 - 請求項1乃至3のいずれか一項に記載のレーザ接合構造において、
少なくとも前記金属体の一部が前記樹脂成形体に埋め込まれているレーザ接合構造。 - 請求項1乃至3のいずれか一項に記載のレーザ接合構造を有する電子制御装置であって、
前記電子制御装置は、前記金属体と前記樹脂成形体とにより画成される収容空間に収容された電子回路部を備え、
前記樹脂成形体と前記金属体とがレーザ接合されることにより、前記収容空間が封止されている電子制御装置。 - 請求項10に記載の電子制御装置において、
前記樹脂成形体は、前記電子回路部を覆うカバーと前記電子回路部に電気的に接続される端子を保持するコネクタとが一体成形された一体成形体である電子制御装置。 - 請求項10に記載の電子制御装置において、
前記電子回路部を覆うカバーと、前記カバーとは別体とされ、前記電子回路部に電気的に接続される端子を保持するコネクタとを備え、
前記カバーおよび前記コネクタは、それぞれ前記樹脂成形体であり、互いに結合されている電子制御装置。 - 結晶性樹脂および非結晶性樹脂を含有してアロイ化された熱可塑性のポリマーアロイからなる樹脂成形体と、金属からなる金属体とを準備し、
前記非結晶性樹脂のガラス転移温度は、前記結晶性樹脂の溶融開始温度よりも低く、
少なくとも前記樹脂成形体における前記金属体にレーザ接合される部分に、酸素官能基を増大させる処理を施し、
前記樹脂成形体を前記非結晶性樹脂のガラス転位温度以上の温度まで加熱し、
前記樹脂成形体および前記金属体を互いに押圧接触させた状態で、前記樹脂成形体と前記金属体とをレーザ接合するレーザ接合構造の製造方法。 - 請求項13に記載のレーザ接合構造の製造方法において、
前記樹脂成形体と前記金属体とは、前記ポリマーアロイの再結晶化温度以上であって前記ポリマーアロイの溶融開始温度以下の温度に前記樹脂成形体を加熱した状態でレーザ接合されるレーザ接合構造の製造方法。
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IT201700124246A1 (it) * | 2017-10-31 | 2019-05-01 | Magneti Marelli Spa | Procedimento per l'assemblaggio di dispositivi meccatronici per applicazioni automobilistiche e dispositivo meccatronico ottenuto attraverso tale procedimento |
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CN111971165B (zh) * | 2018-04-13 | 2023-02-28 | 东京应化工业株式会社 | 覆层用组合物及金属/树脂接合部件的制造方法 |
JP7313946B2 (ja) * | 2019-07-19 | 2023-07-25 | ニデックコンポーネンツ株式会社 | 電子部品とその製造方法 |
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