WO2016054845A1 - 掩膜板、掩膜板的制造方法以及oled面板的制造方法 - Google Patents

掩膜板、掩膜板的制造方法以及oled面板的制造方法 Download PDF

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Publication number
WO2016054845A1
WO2016054845A1 PCT/CN2014/089313 CN2014089313W WO2016054845A1 WO 2016054845 A1 WO2016054845 A1 WO 2016054845A1 CN 2014089313 W CN2014089313 W CN 2014089313W WO 2016054845 A1 WO2016054845 A1 WO 2016054845A1
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Prior art keywords
region
occlusion
area
coating
skeleton
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PCT/CN2014/089313
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English (en)
French (fr)
Inventor
李金川
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/406,216 priority Critical patent/US9437837B2/en
Publication of WO2016054845A1 publication Critical patent/WO2016054845A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04B—KNITTING
    • D04B17/00—Repairing knitted fabrics by knitting operations
    • D04B17/04—Repairing knitted fabrics by knitting operations by picking-up dropped stitches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a mask, a method of manufacturing the mask, and a method of manufacturing the OLED panel.
  • Organic Light-Emitting Device (Organic Light-Emitting) Due to its advantages of active illumination, fast response, flexibility and ultra-thin, Diode, OLED has been continuously invested in research and development by major manufacturers around the world, and has achieved mass production, and market demand is rising.
  • the OLED device needs to be packaged to form an OLED package structure.
  • the prior art packaging method is to apply a glass paste on a package cover (also referred to as a substrate) by dispensing or screen printing to achieve the purpose of packaging the OLED device.
  • the prior art dispensing method is slow in speed, the pressure of the dispensing is difficult to control, and it is easy to cause the phenomenon of breaking the glue, applying more glue or less glue, thereby causing the disadvantage of poor packaging.
  • the screen printing method improves the speed of coating, the screen printing plate has the disadvantages that the screen is easy to break, the service life is not long, the screen is not on a plane, and the cross-type impression is usually left on the glass, which also causes the package. bad.
  • the technical problem to be solved by the present invention is to provide a mask, a method for manufacturing the mask, and a method for manufacturing the OLED panel, which can improve the disadvantages of poor packaging in the prior art.
  • a technical solution adopted by the present invention is to provide a method for manufacturing a mask, the method comprising the steps of: providing a metal plate; defining a first occlusion region and a second occlusion on the metal plate a region and a coating region between the first occlusion region and the second occlusion region; reducing a thickness of the coating region such that a thickness of the coating region is lower than a thickness of the first occlusion region and the second occlusion region; Performing a hollowing process of the interval, so that the coating area is formed to be spaced apart and connected to the skeleton between the first shielding area and the second shielding area and the hollow area surrounded by the first shielding area, the second shielding area and the skeleton;
  • the step of reducing the thickness of the coating region comprises: etching the coating region to etch away a portion of the coating region along the thickness direction of the coating region.
  • the step of etching the coated region further comprises: etching one side or both sides of the coated region.
  • the step of performing the hollowing treatment on the coating region includes: performing a hollowing process of the coating region by etching or laser cutting.
  • the method further comprises: removing the burrs on the metal sheet, so that the metal sheet is cut or the edge after the etching is smooth.
  • another technical solution adopted by the present invention is to provide a method for manufacturing a mask, the method comprising the steps of: providing a metal plate; defining a first occlusion region on the metal plate, and second An occlusion region and a coating region between the first occlusion region and the second occlusion region; reducing a thickness of the coating region such that a thickness of the coating region is lower than a thickness of the first occlusion region and the second occlusion region; The area is subjected to a space-cutting process such that the coating area forms a skeleton that is spaced apart and connected between the first occlusion area and the second occlusion area and a hollow area surrounded by the first occlusion area, the second occlusion area, and the skeleton.
  • the method further comprises: providing a frame, mounting the metal sheet subjected to the hollowing treatment to the frame to obtain the mask.
  • the step of reducing the thickness of the coating region comprises: etching the coating region to etch away a portion of the coating region along the thickness direction of the coating region.
  • the step of etching the coated region further comprises: etching one side or both sides of the coated region.
  • the step of performing the hollowing treatment on the coating region includes: performing a hollowing process of the coating region by etching or laser cutting.
  • the method further comprises: removing the burrs on the metal sheet, so that the metal sheet is cut or the edge after the etching is smooth.
  • the mask includes: a metal plate, the metal plate includes a first shielding area, a second shielding area, and the first shielding area and a coating area between the second occlusion regions, wherein the coating area includes a skeleton that is spaced apart and connected between the first occlusion area and the second occlusion area and is surrounded by the first occlusion area, the second occlusion area, and the skeleton
  • the thickness of the skeleton is lower than the thickness of the first occlusion area and the second occlusion area; the frame and the metal sheet are mounted on the frame.
  • the skeleton is formed by etching one side or both sides.
  • the hollowed out area is formed by etching or laser cutting.
  • another technical solution adopted by the present invention is to provide a method for manufacturing an OLED panel, comprising: providing a first substrate; and providing a mask on the first substrate, the mask comprising a metal sheet, the metal sheet includes a first occlusion region, a second occlusion region, and a coating region between the first occlusion region and the second occlusion region, wherein the coating region includes an interval and is connected to the first occlusion region and a skeleton between the second occlusion regions and a hollow region surrounded by the first occlusion region, the second occlusion region, and the skeleton, the thickness of the skeleton being lower than the thickness of the first occlusion region and the second occlusion region; the frame, the metal plate is mounted on On the frame; coating the glass paste on the first substrate through the hollow region, and flowing the glass paste between the skeleton and the first substrate; removing the mask; bonding the second substrate on the first substrate, and The second substrate is
  • the skeleton is formed by etching one side or both sides.
  • the hollowed out area is formed by etching or laser cutting.
  • the present invention reduces the thickness of the coating region by making the thickness of the coating region lower than the thickness of the first shielding region and the second shielding region, and further to the coating region.
  • the spaced hollowing process is performed such that the coating area forms a skeleton that is spaced apart and connected between the first occlusion area and the second occlusion area, and a hollow area surrounded by the first occlusion area, the second occlusion area, and the skeleton.
  • the thickness of the skeleton is lower than that of the first shielding region and the second shielding region, and a partial hollowing phenomenon occurs on the skeleton, so that part of the glass paste can be flowed to the skeleton when the glass paste is applied.
  • Retaining in the skeleton increases the amount of the glass paste of the skeleton, so that when the pressing is performed, the amount of glue in the skeleton can be ensured to be on the same level as the amount of glue in the hollow region, and not in the substrate during sintering.
  • a gap is created between the substrate and the substrate, thereby increasing production yield.
  • FIG. 1 is a schematic structural view of a mask according to an embodiment of the present invention.
  • Figure 2 is a cross-sectional view of the mask shown in Figure 1 taken along the broken line EF;
  • FIG. 3 is a flow chart of a method for manufacturing a mask according to an embodiment of the present invention.
  • FIG. 4 is a flow chart of a method of fabricating an OLED panel according to an embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of a mask according to an embodiment of the present invention.
  • the mask 10 of the present invention includes a metal sheet 11 including a first occlusion region 111, a second occlusion region 112, and a coating between the first occlusion region 111 and the second occlusion region 112.
  • Cloth area 113 The coating area 113 includes a skeleton 114 that is spaced apart and connected between the first occlusion area 111 and the second occlusion area 112 and a hollow area 115 surrounded by the first occlusion area 111, the second occlusion area 112, and the skeleton 114.
  • the thickness of the skeleton 114 is lower than the thickness of the first shielding region 111 and the second shielding region 112, as shown in FIG. 2 .
  • the mask 10 also includes a frame 12 on which the sheet metal 11 is mounted.
  • the frame 12 is disposed on the periphery of the metal sheet 11, that is, the periphery of the first shielding area 111, to prevent the coating area 113 of the metal sheet 11 from being subjected to the coating operation.
  • the thickness of the skeleton 114 by providing the thickness of the skeleton 114 to be lower than the first occlusion region 111 and the second occlusion region 112, a phenomenon of partial hollowing occurs on the skeleton 114, so that when the glass paste is applied, the portion can be made
  • the glass paste flows into the skeleton 114 to increase the amount of the glass paste of the skeleton 114, so that at the time of pressing, the amount of glue at the skeleton 114 can be ensured to maintain the same level as the amount of glue in the hollow region 115.
  • the position does not create a gap between the substrate and the substrate during sintering, thereby improving the production yield.
  • the frame 12 is preferably stainless steel
  • the metal sheet 11 is preferably a stainless steel sheet or a metal alloy sheet made of SUS304 or INVAR36 or other similar metal sheets.
  • the thickness may range from 0.02 mm to 0.5 mm.
  • the thickness of the coated glass paste that can be obtained can be as small as 0.004 to 0.006 mm.
  • the height of the metal sheet 11 can be adjusted by using metal sheets of different thicknesses according to actual needs.
  • the skeleton 114 is preferably formed in an etched manner.
  • the hollow region 115 is formed by etching or laser cutting. Specifically, the coating region 113 is first etched to etch away a portion of the coating region 113 in the thickness direction of the coating region 113. The coated regions are then subjected to a spaced etch or laser cut for the hollowing process to provide the skeleton 114 and the hollow regions 115.
  • the coating region 113 when the coating region 113 is first etched to etch away the portion of the coating region 113 along the thickness direction of the coating region 113, one or both sides of the coating region 113 may be specifically etched to A skeleton 114 that is etched on one or both sides is obtained. As shown in FIG. 2, the double-sided etched skeleton 114 has a height lower than that of the first region 111 and the second region 112.
  • the width of the skeleton 114 of the present embodiment is several micrometers to several hundred micrometers, and the number and width of the skeletons 114 can be set according to the tension of the metal plate material 11. In the case where the tension of the metal sheet 11 is constant, if the number of the skeletons 114 is set to be large, a narrower width is set correspondingly, and vice versa.
  • the position of the skeleton 114 in the sheet material may be completely symmetrically disposed, or may be set in a staggered position, and may be specifically set according to actual needs.
  • the width of each of the skeletons 114 may be identical, and the skeletons 114 having different widths may be provided depending on the tension of the metal sheets 11 and the distribution of the hollow regions 15.
  • the skeleton 114 shown in Fig. 1 has two widths of W1 and W2.
  • the present invention also removes burrs on the metal sheet 11 so that the metal sheet 11 is cut or the edge after etching is smooth. Specifically, the burrs on the metal sheet 11 can be removed by chemical electropolishing.
  • the specific operation of mounting the metal sheet 11 after the hollowing treatment on the frame 12 is as follows: first, the metal sheet 11 is aligned with the frame 12, and then welded by laser welding, and then the metal sheet exceeding the portion of the frame 12 is used. 11 is cut away so that the frame 12 is at the outer position of the metal sheet 11.
  • the amount of the glass paste at the skeleton 114 can be increased when the glass paste is applied, thereby causing sintering.
  • the production yield is improved.
  • the present invention also provides a method of fabricating the mask 10 based on the mask 10 described above, as specifically shown in FIG.
  • the manufacturing method of the mask 10 of the present invention comprises the following steps:
  • Step S1 A metal plate 11 is provided.
  • the metal sheet 11 is preferably a stainless steel sheet or a metal alloy sheet made of SUS304 or INVAR36 or other similar metal sheets.
  • the thickness may range from 0.02 mm to 0.5 mm.
  • the use of the metal sheet 11 to manufacture the mask 10 can effectively extend the service life of the mask 10, and the metal sheet 11 is in the same plane, and does not cause crushing on the substrate when the glass paste is applied, nor Will leave a cross mark, maintain aesthetics, and increase production yield.
  • Step S2 A first occlusion area 111, a second occlusion area 112, and a coating area 113 between the first occlusion area 111 and the second occlusion area 112 are defined on the metal sheet 11.
  • the first occlusion region 111 is located at the outermost periphery of the metal plate 11 than the second occlusion region 112 and the coating region 113.
  • Step S3 The thickness of the coating region 113 is reduced such that the thickness of the coating region 113 is lower than the thickness of the first shielding region 111 and the second shielding region 112.
  • the coating region 113 is etched to etch away a portion of the coated region in the thickness direction of the coating region 113. Further, in this step, one or both sides of the coating region 113 are etched so that the thickness of one or both sides of the coating region 113 is etched away.
  • a cross-sectional view of the coating region 113 is shown in FIG. 2 when double-sided etching is performed.
  • Step S4 performing a hollowing process on the coating area 113 such that the coating area 113 forms a skeleton 114 that is spaced apart and connected between the first occlusion area 111 and the second occlusion area 112 and the first occlusion area 111, The second occlusion area 112 and the hollow area 115 surrounded by the skeleton 114.
  • the coating region is subjected to a hollowing process by etching or laser cutting.
  • the burrs on the metal sheet 11 are further removed, so that the metal sheet 11 is cut or the edge after etching is smooth.
  • the burrs on the metal sheet 11 can be removed by chemical electropolishing.
  • the embodiment further includes: providing a frame 12 for mounting the metal sheet 11 subjected to the hollowing treatment to the frame 12 to obtain the mask 10.
  • the frame 12 is disposed on the outer periphery of the metal plate 11 to prevent the coating region 113 of the metal plate 11 from being subjected to the coating operation.
  • the specific operation of mounting the metal sheet 11 after the hollowing treatment on the frame 12 is as follows: first, after the metal sheet 11 is aligned with the frame 12, the welding is performed by laser welding, and then the metal sheet 11 exceeding the portion of the frame 12 is cut. It is dropped so that the frame 12 is at the peripheral position of the metal sheet 11.
  • the present invention also provides a method for fabricating an OLED panel based on the mask 10 described above. Please refer to FIG. 4 for details.
  • the manufacturing method of the OLED panel of this embodiment includes the following steps:
  • Step S11 providing a first substrate, wherein the first substrate comprises a display area and a non-display area.
  • Step S12 The mask 10 is placed on the first substrate.
  • the first occlusion area 111 and the second occlusion area 112 of the reticle 10 are both located in the non-display area of the first substrate, and the hollow area 115 of the reticle 10 is aligned with the display area of the first substrate. Thereby, the light-emitting elements in the display area can be encapsulated by the hollowed out region 115.
  • Step S13 coating the glass paste onto the first substrate through the hollow region 115, and causing the glass paste to flow between the skeleton 114 and the first substrate. Thereby, a glass paste remains in the skeleton 114, and the glass paste there and the glass paste at the hollow region 115 are at the same level.
  • Step S14 The mask 10 is removed.
  • Step S15 bonding the second substrate on the first substrate, and fixing the second substrate to the first substrate by using the glass paste.
  • step S13 is such that both the hollow region 115 and the skeleton 114 are coated with the glass paste, voids are not generated between the first substrate and the second substrate, thereby improving the package yield.
  • the thickness of the skeleton 114 of the present invention is lower than that of the first shielding region 111 and the second shielding region 112, and a phenomenon of partial hollowing occurs on the skeleton 114, so that part of the glass paste can be obtained when the glass paste is coated.
  • the material can flow into the skeleton 114 to retain the amount of glue of the glass paste of the skeleton 114, so that when the pressing is performed, the amount of glue at the skeleton 114 can be ensured to maintain the same level as the amount of glue in the hollow region 115.
  • a void is not generated between the first substrate and the second substrate during sintering, thereby improving production yield.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Textile Engineering (AREA)
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Abstract

一种掩膜板（10）、掩膜板（10）的制造方法以及OLED面板的制造方法，其中掩膜板（10）的制造方法包括以下步骤：（S1）提供金属板材（11）；（S2）并定义出第一遮挡区域（111）、第二遮挡区域（112）以及位于第一遮挡区域（111）和第二遮挡区域（112）之间的涂布区域（113）；（S3）消减涂布区域（113）的厚度；（S4）对涂布区域（113）进行间隔的镂空处理，使得其形成间隔设置且连接于第一遮挡区域（111）和第二遮挡区域（112）之间的骨架（114）以及由第一遮挡区域（111）、第二遮挡区域（112）以及骨架（114）围设的镂空区（115）。因此，这样的技术方案可以提高产品的良率。

Description

掩膜板、掩膜板的制造方法以及OLED面板的制造方法
【技术领域】
本发明涉及显示技术领域，尤其是涉及一种掩膜板、掩膜板的制造方法以及OLED面板的制造方法。
【背景技术】
有机电致发光器件（Organic Light-Emitting Diode，OLED）因具备主动发光、响应速度快、可弯曲以及超轻薄等优点，被全球各大厂商纷纷持续投入资金与技术进行研发，并已达成量产，市场需求高涨。
由于OLED对水气和氧气非常敏感，如果有水气或氧气渗入OLED器件内，会腐蚀OLED器件的有机功能层及电极材料，严重影响OLED器件寿命，因此为了延长OLED器件寿命以及提高OLED器件稳定性，需要对OLED器件进行封装处理以形成OLED封装结构。现有技术的封装方法为：使用点胶或者丝网印刷的方式将玻璃浆料涂布在封装盖板（也可称为基板）上，以达到封装OLED器件的目的。
但是，现有技术的点胶的方式速度慢，点胶的压力不易控制，容易造成断胶、多涂胶或少涂胶的现象，从而造成封装不良的缺点。而丝网印刷的方式虽然提高涂胶速度，但丝网印刷板存在丝网易断、使用寿命不长、丝网不在一个平面上以及通常在玻璃上留下十字型印痕等缺点，同样会造成封装不良。
【发明内容】
本发明主要解决的技术问题是提供一种掩膜板、掩膜板的制造方法以及OLED面板的制造方法，能够改善现有技术中封装不良的缺点。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种掩膜板的制造方法，该方法包括以下步骤：提供一金属板材；在金属板材上定义出第一遮挡区域、第二遮挡区域以及位于第一遮挡区域和第二遮挡区域之间的涂布区域；消减涂布区域的厚度，使得涂布区域的厚度低于第一遮挡区域和第二遮挡区域的厚度；对涂布区域进行间隔的镂空处理，使得涂布区域形成间隔设置且连接于第一遮挡区域和第二遮挡区域之间的骨架以及由第一遮挡区域、第二遮挡区域以及骨架围设的镂空区；
提供一框架，将经过镂空处理后的金属板材安装到框架上，以制得掩膜板；
其中，消减涂布区域的厚度的步骤包括：对涂布区域进行蚀刻，以沿涂布区域的厚度方向蚀刻掉部分涂布区域。
其中，对涂布区域进行蚀刻的步骤进一步包括：对涂布区域的单面或双面进行蚀刻。
其中，对涂布区域进行间隔的镂空处理的步骤包括：通过蚀刻或激光切割的方式对涂布区域进行间隔的镂空处理。
其中，将经过镂空处理后的金属板材安装到框架上之前还包括：去除金属板材上的毛刺，使得金属板材被切割或者蚀刻后的边缘平滑。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种掩膜板的制造方法，该方法包括以下步骤：提供一金属板材；在金属板材上定义出第一遮挡区域、第二遮挡区域以及位于第一遮挡区域和第二遮挡区域之间的涂布区域；消减涂布区域的厚度，使得涂布区域的厚度低于第一遮挡区域和第二遮挡区域的厚度；对涂布区域进行间隔的镂空处理，使得涂布区域形成间隔设置且连接于第一遮挡区域和第二遮挡区域之间的骨架以及由第一遮挡区域、第二遮挡区域以及骨架围设的镂空区。
其中，方法进一步包括：提供一框架，将经过镂空处理后的金属板材安装到框架上，以制得掩膜板。
其中，消减涂布区域的厚度的步骤包括：对涂布区域进行蚀刻，以沿涂布区域的厚度方向蚀刻掉部分涂布区域。
其中，对涂布区域进行蚀刻的步骤进一步包括：对涂布区域的单面或双面进行蚀刻。
其中，对涂布区域进行间隔的镂空处理的步骤包括：通过蚀刻或激光切割的方式对涂布区域进行间隔的镂空处理。
其中，将经过镂空处理后的金属板材安装到框架上之前还包括：去除金属板材上的毛刺，使得金属板材被切割或者蚀刻后的边缘平滑。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种掩膜板，掩膜板包括：金属板材，金属板材包括第一遮挡区域、第二遮挡区域以及位于第一遮挡区域和第二遮挡区域之间的涂布区域，其中，涂布区域包括间隔设置且连接于第一遮挡区域和第二遮挡区域之间的骨架以及由第一遮挡区域、第二遮挡区域以及骨架围设的镂空区，，骨架的厚度低于第一遮挡区域和第二遮挡区域的厚度；框架，金属板材安装在框架上。
其中，骨架以蚀刻单面或双面的方式形成。
其中，镂空区以蚀刻或激光切割的方式形成。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种OLED面板的制造方法，制造方法包括：提供第一基板；在第一基板上设置一掩膜板，该掩膜板包括：金属板材，金属板材包括第一遮挡区域、第二遮挡区域以及位于第一遮挡区域和第二遮挡区域之间的涂布区域，其中，涂布区域包括间隔设置且连接于第一遮挡区域和第二遮挡区域之间的骨架以及由第一遮挡区域、第二遮挡区域以及骨架围设的镂空区，骨架的厚度低于第一遮挡区域和第二遮挡区域的厚度；框架，金属板材安装在框架上；经过镂空区向第一基板上涂布玻璃浆料，并使得玻璃浆料流动至骨架与第一基板之间；移除掩膜板；在第一基板上贴合第二基板，并利用玻璃浆料将第二基板固定至第一基板上。
其中，骨架以蚀刻单面或双面的方式形成。
其中，镂空区以蚀刻或激光切割的方式形成。
本发明的有益效果是：区别于现有技术的情况，本发明通过消减涂布区域的厚度，使得涂布区域的厚度低于第一遮挡区域和第二遮挡区域的厚度，进而对涂布区域进行间隔的镂空处理，使得涂布区域形成间隔设置且连接于第一遮挡区域和第二遮挡区域之间的骨架以及由第一遮挡区域、第二遮挡区域以及骨架围设的镂空区。通过上述方式，使得骨架的厚度低于第一遮挡区域和第二遮挡区域，在骨架上出现部分镂空的现象，进而使得在涂布玻璃浆料时，可使部分玻璃浆料流动到骨架处，在骨架处中存留，增加了骨架的玻璃浆料的胶量，使得在压合时，骨架处能有足够的胶量保证与镂空区的胶量在同一水平面上，在烧结时不会在基板和基板之间产生空隙，从而提高了生产良率。
【附图说明】
图1是本发明实施例提供的一种掩膜板的结构示意图；
图2是图1所示的掩膜板沿虚线EF切割的剖视图；
图3是本发明实施例提供的一种掩膜板的制造方法的流程图；
图4是本发明实施例提供的一种OLED面板的制造方法的流程图。
【具体实施方式】
请参阅图1，图1是本发明实施例提供的一种掩膜板的结构示意图。如图1所示，本发明的掩膜板10包括金属板材11，金属板材11包括第一遮挡区域111、第二遮挡区域112以及位于第一遮挡区域111和第二遮挡区域112之间的涂布区域113。其中，涂布区域113包括间隔设置且连接于第一遮挡区域111和第二遮挡区域112之间的骨架114以及由第一遮挡区域111、第二遮挡区域112以及骨架114围设的镂空区115。其中，骨架114的厚度低于第一遮挡区域111和第二遮挡区域112的厚度，具体如图2所示。
掩膜板10还包括框架12，金属板材11安装在框架12上。其中，框架12是设置在金属板材11的外围，即第一遮挡区域111的外围，避免阻碍金属板材11的涂布区113进行涂布操作。
因此，在本实施例中，通过设置骨架114的厚度低于第一遮挡区域111和第二遮挡区域112，在骨架114上出现部分镂空的现象，使得在涂布玻璃浆料时，可使部分玻璃浆料流动到骨架114处中存留，增加了骨架114的玻璃浆料的胶量，使得在压合时，骨架114处能有足够的胶量保证与镂空区115的胶量保持在同一水平位置，在烧结时不会在基板和基板之间产生空隙，从而提高了生产良率。
本实施例中，框架12优选为不锈钢，金属板材11优选为不锈钢片或金属合金片，材质为SUS304或INVAR36或其他类似的金属片。厚度可以为0.02mm至0.5mm的范围。可得到的涂布后的玻璃浆料的厚度最小可达到0.004——0.006mm。其中，金属板材11的高度可根据实际需求通过使用不同厚度的金属板材来进行调整。
骨架114优选以蚀刻的方式形成。镂空区115以蚀刻或激光切割的方式形成。具体来说，首先对涂布区域113进行蚀刻，以沿涂布区域113的厚度方向蚀刻掉部分涂布区域113。然后对涂布区域进行间隔的蚀刻或激光切割以进行镂空处理的，从而得到骨架114和镂空区115。
进一步的，在对涂布区域113进行第一次蚀刻，以沿涂布区域113的厚度方向蚀刻掉部分涂布区域113时，具体可以对涂布区域113的单面或者双面进行蚀刻，以得到单面或双面被蚀刻的骨架114。如图2所示的为双面被蚀刻的骨架114，其两个面的高度均低于第一区域111和第二区域112的高度。
其中，本实施例的骨架114的宽度为几微米至几百微米，骨架114的数量和宽度可以根据金属板材11的张力设置。在金属板材11的张力一定的情况下，若骨架114的数量设置得较多，那么就相应的设置较窄的宽度，反之亦然。
此外，骨架114在板材中的位置可以是完全对称设置的，也可以是错开位置设置的，具体可以根据实际需要设置。同样，在一个金属板材11中，各骨架114的宽度可以是完全相同的，也可以根据金属板材11的张力以及镂空区15的分布来设置宽度不同的骨架114。如图1所示的骨架114，其宽度就有W1和W2两种。
其中，在将进行镂空处理后的金属板材11安装在框架12上之前，本发明还会去除金属板材11上的毛刺，使得金属板材11被切割或者蚀刻后的边缘平滑。具体可以利用化学电抛光的方式去除金属板材11上的毛刺。
其中，将进行镂空处理后的金属板材11安装在框架12上的具体操作为：首先将金属板材11与框架12对位后，利用激光焊接的方式进行焊接，然后将超过框架12部分的金属板材11切掉，以使得框架12处于金属板材11的外围位置。
承前所述，通过设置骨架114的厚度低于第一遮挡区域111和第二遮挡区域112，使得在涂布玻璃浆料时，可增加骨架114处的玻璃浆料的胶量，从而使得在烧结时不会在基板和基板之间产生空隙，提高了生产良率。
本发明还基于前文所述的掩膜板10提供一种掩膜板10的制造方法，具体请参阅图3所示。
如图3所示，本发明的掩膜板10的制造方法包括以下步骤：
步骤S1：提供一金属板材11。
本步骤中，金属板材11优选为不锈钢片或金属合金片，材质为SUS304或INVAR36或其他类似的金属片。厚度可以为0.02mm至0.5mm的范围。
选用金属板材11来制造掩膜板10，可有效延长掩膜板10的使用寿命，并且，金属板材11在同一个平面内，在涂布玻璃浆料时不会对基板造成压伤，也不会留下十字印点，保持美观，并提高生产良率。
步骤S2：在金属板材11上定义出第一遮挡区域111、第二遮挡区域112以及位于第一遮挡区域111和第二遮挡区域112之间的涂布区域113。
其中，第一遮挡区域111较第二遮挡区域112和涂布区域113位于金属板材11的最外围的位置。
步骤S3：消减涂布区域113的厚度，使得涂布区域113的厚度低于第一遮挡区域111和第二遮挡区域112的厚度。
本步骤中，具体为对涂布区域113进行蚀刻，以沿涂布区域113的厚度方向蚀刻掉部分涂布区域。进一步的，本步骤是对涂布区域113的单面或双面进行蚀刻，以使得涂布区域113的单面或双面的厚度被蚀刻掉部分。其中，在进行双面蚀刻时，涂布区域113的剖视图如图2所示。
步骤S4：对涂布区域113进行间隔的镂空处理，使得涂布区域113形成间隔设置且连接于第一遮挡区域111和第二遮挡区域112之间的骨架114以及由第一遮挡区域111、第二遮挡区域112以及骨架114围设的镂空区115。
本步骤中，具体为通过蚀刻或激光切割的方式对涂布区域进行间隔的镂空处理。
在进行镂空处理之后，进一步去除金属板材11上的毛刺，使得金属板材11被切割或者蚀刻后的边缘平滑。具体可以利用化学电抛光的方式去除金属板材11上的毛刺。
本实施例还进一步包括：提供一框架12，将经过镂空处理后的金属板材11安装到框架12上，以制得掩膜板10。其中，框架12是设置在金属板材11的外围，避免阻碍金属板材11的涂布区113进行涂布操作。
将经过镂空处理后的金属板材11安装到框架12上的具体操作为：首先将金属板材11与框架12对位后，利用激光焊接的方式进行焊接，然后将超过框架12部分的金属板材11切掉，以使得框架12处于金属板材11的外围位置。
本发明还基于前文所述的掩膜板10提供一种OLED面板的制造方法，具体请参阅图4所示。
如图4所示，本实施例的OLED面板的制造方法包括以下步骤：
步骤S11：提供第一基板，其中，第一基板包括了显示区域和非显示区域。
步骤S12：在第一基板上设置掩膜板10。
其中，掩膜板10的第一遮挡区域111和第二遮挡区域112均位于第一基板的非显示区域，掩膜板10的镂空区115对准第一基板的显示区域。由此可通过镂空区115对显示区域中的发光元件进行封装。
步骤S13：经过镂空区115向第一基板上涂布玻璃浆料，并使得玻璃浆料流动至骨架114与第一基板之间。由此使得骨架114处存留有玻璃浆料，并且该处的玻璃浆料和镂空区115处的玻璃浆料处于同一水平面。
步骤S14：移除掩膜板10。
步骤S15：在第一基板上贴合第二基板，并利用玻璃浆料将第二基板固定至第一基板上。
由于步骤S13使得镂空区115和骨架114处均涂布有玻璃浆料，因此，不会在第一基板和第二基板之间产生空隙，从而提高了封装良率。
综上所述，本发明设置骨架114的厚度低于第一遮挡区域111和第二遮挡区域112，在骨架114上出现部分镂空的现象，使得在涂布玻璃浆料时，可使部分玻璃浆料可以流动到骨架114处中存留，增加了骨架114的玻璃浆料的胶量，使得在压合时，骨架114处能有足够的胶量保证与镂空区115的胶量保持在同一水平位置，在烧结时不会在第一基板和第二基板之间产生空隙，从而提高了生产良率。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (16)

  1. 一种掩膜板的制造方法，其特征在于，所述方法包括以下步骤：
    提供一金属板材；
    在所述金属板材上定义出第一遮挡区域、第二遮挡区域以及位于所述第一遮挡区域和所述第二遮挡区域之间的涂布区域；
    消减所述涂布区域的厚度，使得所述涂布区域的厚度低于所述第一遮挡区域和所述第二遮挡区域的厚度；
    对所述涂布区域进行间隔的镂空处理，使得所述涂布区域形成间隔设置且连接于所述第一遮挡区域和所述第二遮挡区域之间的骨架以及由所述第一遮挡区域、所述第二遮挡区域以及所述骨架围设的镂空区；
    提供一框架，将所述经过镂空处理后的所述金属板材安装到所述框架上，以制得所述掩膜板；
    其中，所述消减所述涂布区域的厚度的步骤包括：
    对所述涂布区域进行蚀刻，以沿所述涂布区域的厚度方向蚀刻掉部分所述涂布区域。
  2. 根据权利要求1所述的方法，其特征在于，所述对所述涂布区域进行蚀刻的步骤进一步包括：
    对所述涂布区域的单面或双面进行蚀刻。
  3. 根据权利要求1所述的方法，其特征在于，所述对所述涂布区域进行间隔的镂空处理的步骤包括：
    通过蚀刻或激光切割的方式对所述涂布区域进行间隔的镂空处理。
  4. 根据权利要求3所述的方法，其特征在于，所述将所述经过镂空处理后的所述金属板材安装到所述框架上之前还包括：
    去除所述金属板材上的毛刺，使得金属板材被切割或者蚀刻后的边缘平滑。
  5. 一种掩膜板的制造方法，其特征在于，所述方法包括以下步骤：
    提供一金属板材；
    在所述金属板材上定义出第一遮挡区域、第二遮挡区域以及位于所述第一遮挡区域和所述第二遮挡区域之间的涂布区域；
    消减所述涂布区域的厚度，使得所述涂布区域的厚度低于所述第一遮挡区域和所述第二遮挡区域的厚度；
    对所述涂布区域进行间隔的镂空处理，使得所述涂布区域形成间隔设置且连接于所述第一遮挡区域和所述第二遮挡区域之间的骨架以及由所述第一遮挡区域、所述第二遮挡区域以及所述骨架围设的镂空区。
  6. 根据权利要求5所述的方法，其特征在于，所述方法进一步包括：
    提供一框架，将所述经过镂空处理后的所述金属板材安装到所述框架上，以制得所述掩膜板。
  7. 根据权利要求5所述的方法，其特征在于，所述消减所述涂布区域的厚度的步骤包括：
    对所述涂布区域进行蚀刻，以沿所述涂布区域的厚度方向蚀刻掉部分所述涂布区域。
  8. 根据权利要求7所述的方法，其特征在于，所述对所述涂布区域进行蚀刻的步骤进一步包括：
    对所述涂布区域的单面或双面进行蚀刻。
  9. 根据权利要求6所述的方法，其特征在于，所述对所述涂布区域进行间隔的镂空处理的步骤包括：
    通过蚀刻或激光切割的方式对所述涂布区域进行间隔的镂空处理。
  10. 根据权利要求9所述的方法，其特征在于，所述将所述经过镂空处理后的所述金属板材安装到所述框架上之前还包括：
    去除所述金属板材上的毛刺，使得金属板材被切割或者蚀刻后的边缘平滑。
  11. 一种掩膜板，其特征在于，所述掩膜板包括：
    金属板材，所述金属板材包括第一遮挡区域、第二遮挡区域以及位于所述第一遮挡区域和所述第二遮挡区域之间的涂布区域，其中，所述涂布区域包括间隔设置且连接于所述第一遮挡区域和所述第二遮挡区域之间的骨架以及由所述第一遮挡区域、所述第二遮挡区域以及所述骨架围设的镂空区，所述骨架的厚度低于所述第一遮挡区域和所述第二遮挡区域的厚度；
    框架，所述金属板材安装在所述框架上。
  12. 根据权利要求11所述的掩膜板，其特征在于，所述骨架以蚀刻单面或双面的方式形成。
  13. 根据权利要求11所述的掩膜板，其特征在于，所述镂空区以蚀刻或激光切割的方式形成。
  14. 一种OLED面板的制造方法，其特征在于，所述制造方法包括：
    提供第一基板；
    在所述第一基板上设置一掩膜板，所述掩膜板包括：
    金属板材，所述金属板材包括第一遮挡区域、第二遮挡区域以及位于所述第一遮挡区域和所述第二遮挡区域之间的涂布区域，其中，所述涂布区域包括间隔设置且连接于所述第一遮挡区域和所述第二遮挡区域之间的骨架以及由所述第一遮挡区域、所述第二遮挡区域以及所述骨架围设的镂空区，所述骨架的厚度低于所述第一遮挡区域和所述第二遮挡区域的厚度；
    框架，所述金属板材安装在所述框架上；
    经过所述镂空区向所述第一基板上涂布玻璃浆料，并使得所述玻璃浆料流动至所述骨架与所述第一基板之间；
    移除所述掩膜板；
    在所述第一基板上贴合第二基板，并利用所述玻璃浆料将所述第二基板固定至所述第一基板上。
  15. 根据权利要求14所述的制造方法，其特征在于，所述骨架以蚀刻单面或双面的方式形成。
  16. 根据权利要求14所述的制造方法，其特征在于，所述镂空区以蚀刻或激光切割的方式形成。
PCT/CN2014/089313 2014-10-10 2014-10-23 掩膜板、掩膜板的制造方法以及oled面板的制造方法 Ceased WO2016054845A1 (zh)

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CN104393195B (zh) * 2014-10-10 2016-03-30 深圳市华星光电技术有限公司 掩膜板、掩膜板的制造方法以及oled面板的制造方法
CN104966791B (zh) * 2015-07-01 2018-05-11 深圳市华星光电技术有限公司 一种掩膜板及其制造方法、oled器件封装方法
CN106086781B (zh) * 2016-06-15 2018-09-11 京东方科技集团股份有限公司 掩膜组件及其制造方法、显示装置
CN107248520B (zh) 2017-06-07 2019-10-01 京东方科技集团股份有限公司 一种掩模板、有机电致发光显示面板及其封装方法
CN110129724B (zh) * 2019-07-03 2021-09-10 京东方科技集团股份有限公司 掩膜板组件及其制备方法
CN111273515B (zh) * 2020-02-14 2023-10-20 合肥鑫晟光电科技有限公司 一种掩膜板及制作方法、显示面板及显示装置
CN112599479A (zh) * 2020-12-10 2021-04-02 深圳市华星光电半导体显示技术有限公司 显示面板及其制作方法
CN114182204A (zh) * 2022-01-26 2022-03-15 福建华佳彩有限公司 一种异形屏的掩膜条结构及其制备方法
CN115488508A (zh) * 2022-11-08 2022-12-20 徐州西斯博朗智能科技有限公司 一种开窗设备组装用的激光焊接装置
CN117810174A (zh) * 2023-07-31 2024-04-02 云谷（固安）科技有限公司 一种芯片封装结构及芯片封装方法、芯片、掩膜版组件

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CN104393195A (zh) 2015-03-04
US20160343996A1 (en) 2016-11-24

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