WO2016042909A1 - Dispositif de refroidissement - Google Patents

Dispositif de refroidissement Download PDF

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Publication number
WO2016042909A1
WO2016042909A1 PCT/JP2015/070489 JP2015070489W WO2016042909A1 WO 2016042909 A1 WO2016042909 A1 WO 2016042909A1 JP 2015070489 W JP2015070489 W JP 2015070489W WO 2016042909 A1 WO2016042909 A1 WO 2016042909A1
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WO
WIPO (PCT)
Prior art keywords
cooling device
resin
particles
manufacturing
insulating
Prior art date
Application number
PCT/JP2015/070489
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English (en)
Japanese (ja)
Inventor
功一郎 兵頭
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株式会社村田製作所
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Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2016042909A1 publication Critical patent/WO2016042909A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G31/00—Compounds of vanadium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/82—Coating or impregnation with organic materials
    • C04B41/83—Macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a material for manufacturing a cooling device and a cooling device obtained using the material.
  • the cooling device combining the Peltier element, fan, heat sink, and the like as described above has a relatively complicated structure, and the size of the device is large. It is also disadvantageous. Moreover, since power is consumed, it is also disadvantageous from the viewpoint of low power consumption (battery life). Therefore, there is a strong demand for a cooling device that can be used without a power source and is small.
  • a heat sink or a graphite sheet is used as a cooling device without a power source.
  • the heat sink simply assists in heat dissipation, and the graphite sheet only has the effect of diffusing heat and eliminating heat spots.
  • the installation location is limited in accordance with the shape. For example, the graphite sheet is difficult to install in a place where the surface is uneven.
  • the present inventor paid attention to a ceramic material that absorbs heat accompanying a crystal structure phase transition, a magnetic phase transition, or the like, and first examined the configuration of a cooling device using such a ceramic material. And when ceramic material was used with the form of particle
  • the ceramic materials as described above are not sufficiently insulating (electrically insulating, the same applies hereinafter).
  • the ceramic material is mounted on an electronic circuit board and has electrodes, leads, and the like. When applied to an exposed electronic component, it has been found that the reliability of the electronic component or an electronic device including the electronic component may be impaired.
  • the thermal conductivity to the soft magnetic metal particles is not a problem, but when the insulating particles made of silicone resin are coated with the ceramic particles that absorb heat as described above, Heat conduction to the ceramic particles is hindered and is not suitable for use as a material for manufacturing a cooling device.
  • a heat-resistant insulating oxide powder such as alumina or magnesia powder is adhered to a member such as a ribbon made of a metal magnetic material such as permalloy by a treatment method using an air stream or a suspension.
  • a metal magnetic material such as a metal magnetic material
  • the heat-resistant insulating oxide powder is used to insulate the component surface or layer surface in order to prevent fusion during annealing due to metal-to-metal contact between components formed between metal magnetic materials. It is required to withstand the heat during annealing.
  • thermal conductivity to the main body portion made of the metal magnetic material is not considered.
  • it is not easy to coat the ceramic particles as described above with the insulating oxide powder it is not easy to coat the ceramic particles as described above with the insulating oxide powder, and there is a problem in terms of production and cost.
  • An object of the present invention is to provide a material for manufacturing a cooling device that can be used without a power source and can obtain high reliability even when applied to an electronic component or an electronic device.
  • a cooling device manufacturing material including composite particles in which first particles composed of a ceramic material that absorbs heat by latent heat are surface-coated with an insulating coating,
  • the conductive film includes a first insulating resin and a material for manufacturing a cooling device, which includes second particles having insulating properties and thermal conductivity dispersed in the first insulating resin.
  • a cooling device obtained by using the cooling device manufacturing material or including the cooling device manufacturing material or a material derived therefrom.
  • an electronic component comprising the cooling device.
  • the first particles composed of a ceramic material that absorbs heat by latent heat are insulated from the first insulating resin and the insulating and thermally conductive second particles dispersed therein.
  • Composite particles whose surface is coated with a conductive film are used as materials for manufacturing cooling devices, so that both high cooling performance and high insulation can be realized.
  • a cooling device manufacturing material capable of obtaining high reliability even when applied to an electronic apparatus is provided.
  • the electronic device using such a material for cooling device manufacture is also provided.
  • cooling device manufacturing material and the electronic component on which the cooling device is formed in one embodiment of the present invention will be described in detail, the present invention is not limited to such an embodiment.
  • the cooling device manufacturing material 10 in the present embodiment is a first particle (hereinafter also referred to as “endothermic particle”) 1 made of a ceramic material that absorbs heat by latent heat.
  • the material 10 for manufacturing a cooling device includes an insulating film 7 in which an endothermic particle (first particle) 1 includes an insulating resin (first insulating resin) 3 and a heat conductive particle (second particle) 5.
  • first particle an endothermic particle
  • second particle a heat conductive particle
  • the endothermic particles 1 are not particularly limited as long as they are made of a ceramic material that absorbs heat by latent heat (hereinafter also simply referred to as “ceramic material”). The heat absorption of this ceramic material is done by absorbing latent heat. Such a ceramic material obtains a high cooling effect as compared with a conventional cooling device such as a graphite sheet by temporarily absorbing excess heat by latent heat to standardize temporal heat. It becomes possible.
  • the ceramic material a ceramic material mainly composed of vanadium oxide is preferable.
  • the ceramic material mainly composed of vanadium oxide means a ceramic material containing V and O.
  • V and O a ceramic material containing V and O.
  • VO 2 , V 2 O 3 , V 4 O 7 , V 6 O 11, etc. Including those doped with the above atoms.
  • the ceramic material preferably has a latent heat amount of 5 J / g or more, more preferably 20 J / g or more.
  • latent heat is the total amount of thermal energy required when the phase of a substance changes, and in this specification, solid-solid phase transitions such as electrical, magnetic, and structural phase transitions are used. This refers to the amount of heat generated and absorbed.
  • Specific ceramic material is not particularly limited, for example, JP-ceramic material described in JP 2010-163510, specifically, VO 2, LiVS 2, LiVO 2, V 2 O 3, V 4 O 7 , V 6 O 11 , A y VO 2 (wherein A is Li or Na, 0.1 ⁇ y ⁇ 2.0, preferably 0.5 ⁇ y ⁇ 1.0), V 1-x M x O 2 (wherein M is W, Ta, Mo, Nb, Ru or Re, and 0 ⁇ x ⁇ 0.2, preferably 0 ⁇ x ⁇ 0.05).
  • the ceramic material is an oxide containing vanadium V and M (where M is at least one selected from W, Ta, Mo and Nb), and the total of V and M is 100 mol parts.
  • the molar part of M is 0 mol part or more and about 5 mol part or less, preferably 1 mol part or less. Note that M is not an essential component, and the content molar part of M may be 0.
  • the ceramic material is an oxide containing A (where A is Li or Na) and vanadium V, and when A is 100 mol parts, It is 50 to about 100 parts by mole.
  • the ceramic material has the composition formula: V 1-x M x O 2 (Wherein, M is W, Ta, Mo or Nb, 0 ⁇ x ⁇ 0.05) Or the composition formula: A y VO 2 (Wherein, A is Li or Na, 0.5 ⁇ y ⁇ 1.0)
  • a y VO 2 As a main component, one or more substances represented by the formula:
  • the ceramic material has a composition formula: V 1-x W x O 2 (Where 0 ⁇ x ⁇ 0.01) The substance shown by is included as a main component.
  • the main component means a component contained in the ceramic material by 50% by mass or more, particularly 60% by mass or more, preferably 80% by mass or more, more preferably 90% by mass or more, and further preferably 98% by mass. For example, it means 98.0 to 99.8% by mass.
  • Other components include VO x having a different oxygen content from VO 2 .
  • the temperature indicating the latent heat of the ceramic material that is, the temperature at which the ceramic material undergoes phase transition can be adjusted by the amount of element to be added (dope).
  • the ceramic material has the composition formula: V 1-x W x O 2 When x is 0.005, the phase transition occurs at about 50 ° C., and when x is 0.01, the phase transition occurs at about 40 ° C.
  • the temperature at which the ceramic material undergoes phase transition is appropriately selected according to the object to be cooled, the purpose of cooling, and the like.
  • the heat generating component or object to be cooled
  • the temperature is raised to 20 to 100 ° C., preferably The phase transition is preferably performed at 30 to 70 ° C.
  • the endothermic particles 1 made of the ceramic material have a particle (powder) form.
  • the ceramic material By using the ceramic material as particles, the occurrence of cracks can be suppressed even when the phase transition is repeated, and the durability of the cooling device is enhanced.
  • the average particle diameter of the endothermic particles is not particularly limited, but is, for example, 0.1 to several hundred ⁇ m, specifically 0.1 to 900 ⁇ m, typically 0.2 to 50 ⁇ m, and preferably 0 .5 to 50 ⁇ m.
  • the average particle diameter of the endothermic particles is preferably 0.2 ⁇ m or more from the viewpoint of ease of handling, and from the viewpoint of being applicable to a more complicated surface shape and a narrower space, it may be 50 ⁇ m or less. preferable.
  • the average particle diameter means D50 (the particle diameter at which the cumulative value is 50% in a cumulative curve obtained by determining the particle size distribution on a volume basis and the total volume is 100%), and the average The particle size can be measured using a laser diffraction / scattering particle size / particle size distribution measuring device or an electronic scanning microscope.
  • the endothermic particles are coated with an insulating film to form composite particles 9.
  • the cooling device is formed by applying the material for manufacturing a cooling device of the present invention to an electronic component or an electronic device by coating the surface of the endothermic particles with an insulating film, the cooling device exhibits insulating properties as a whole. Therefore, high reliability can be obtained. Specifically, even when the composite particles come into contact with each other for some reason, the composite particles themselves appear to be electrically insulating, so that short-circuiting between electrodes or wirings of electronic devices can be prevented more reliably. be able to.
  • the material for manufacturing a cooling device of the present invention is used in an extremely fine space, for example, a space having a width equivalent to the particle diameter of the composite particle, it is possible to more reliably prevent short-circuiting by the composite particle. It becomes possible.
  • the insulating film includes the insulating resin 3 and the thermally conductive particles 5 dispersed in the insulating resin 3, and may include any other component as long as it exhibits insulating properties as a whole.
  • the heat conductive particles 5 are not particularly limited as long as they are made of a material having insulating properties and heat conductivity.
  • the heat conductive particles may be made of a metal oxide having an insulating property.
  • metal oxides have high thermal conductivity and contribute greatly to the improvement of heat exchange efficiency.
  • the metal oxide having insulating properties include oxides of metals such as aluminum, magnesium, and iron, and a mixture of two or more selected from these.
  • the average particle size of the heat conductive particles is not particularly limited, but in order to effectively coat the surface of the endothermic particles and contribute to providing insulation and improving heat exchange efficiency, the average particle size of the endothermic particles is not limited. It is preferably smaller than the diameter.
  • the average particle size of the thermally conductive particles is, for example, preferably about 50% or less, particularly about 10% or less, more particularly about 10% or less about 1% or more of the average particle size of the endothermic particles.
  • the insulating resin 3 covers the surface of the endothermic particles 1 with an insulating material including the insulating resin 3 and the heat conductive particles 5 in a state where the heat conductive particles 5 are arranged in the vicinity of the endothermic particles 1. Fulfills the function of
  • the specific insulating resin is not particularly limited, but is preferably a thermosetting resin such as a fluorine resin, a silicone resin, a urethane resin, an epoxy resin, a polyimide resin, a liquid crystal polymer resin, a polyphenyl sulfide resin, and these.
  • a thermosetting resin such as a fluorine resin, a silicone resin, a urethane resin, an epoxy resin, a polyimide resin, a liquid crystal polymer resin, a polyphenyl sulfide resin, and these.
  • silica resins obtained by mixing silica into any of the above can be used.
  • the content of the heat conductive particles in the insulating film can be appropriately selected according to the thermal conductivity, average particle diameter, and the like of the heat conductive particles to be used.
  • the content of the heat conductive particles may be, for example, about 5% by weight or more, preferably about 10% by weight or more, and for example, about 50% by weight or less, preferably about 30% by weight or less, By setting it within such a numerical range, a sufficiently high heat exchange efficiency can be obtained.
  • Insulating coatings contain, in addition to thermally conductive particles and insulating resins, additives such as dispersants, curing accelerators, antifoaming agents, and residues such as solvents that may remain due to the production method of composite particles. You may go out.
  • a dispersing agent, a hardening accelerator, an antifoaming agent, etc. can be suitably selected as needed from what is used in a general polymer composition.
  • the shape of the insulating film covering the endothermic particles is not limited as long as the cooling device exhibits insulating properties as a whole.
  • the thickness of the insulating film is not particularly limited, but is preferably in the range of 5 nm to 1 ⁇ m, for example. By setting the thickness to 5 nm or more, it is possible to ensure the insulation more reliably. Further, by setting the thickness to 1 ⁇ m or less, the composite particles can be made smaller, and the composite particles can be provided even in a finer region.
  • the method for coating the surface of the endothermic particles with an insulating film is not particularly limited, and known coating methods such as sol-gel method, mechanochemical method, spray drying method, fluidized bed granulation method, atomizing method, barrel sputtering. It can be performed using a law or the like.
  • the following method can be used.
  • the insulating resin is dissolved in a solvent.
  • the solvent can be appropriately selected according to the insulating resin to be used, and for example, alcohol or the like can be used.
  • the endothermic particles, the thermally conductive particles, and the liquid mixture in which the insulating resin is dissolved in the solvent are mixed (with additives when used) to form a slurry. These may be mixed simultaneously or sequentially in any order.
  • the slurry is subjected to a treatment such as stirring and / or spraying to remove (volatilize) the solvent, and thereby coat the surface of the endothermic particles with an insulating material containing thermally conductive particles and an insulating resin. be able to.
  • thermosetting resin When a thermosetting resin is used as the insulating resin, the resin can be subsequently cured by heat treatment.
  • a curing treatment may be appropriately performed.
  • the cooling device manufacturing material of the present embodiment further includes a second insulating resin, and the composite particles 9 may be dispersed in the second insulating resin.
  • a second insulating resin is in an uncured state before the cooling device is manufactured, and can impart fluidity to the cooling device manufacturing material.
  • the composition for manufacturing a cooling device may be in a liquid or pasty form. When it does not have fluidity at room temperature, it may be fluidized, for example, by heating or adding a solvent.
  • the cooling device is obtained by providing the cooling device manufacturing material to a predetermined portion of the electronic component or the electronic apparatus, where the material is cured and / or solidified there.
  • the material for manufacturing a cooling device of this embodiment When the material for manufacturing a cooling device of this embodiment is provided to a predetermined part of an electronic component or an electronic device, the material for manufacturing a cooling device of this embodiment has a shape corresponding to the part provided by its fluidity, and is substantially Thus, it is cured and solidified in that shape to form a cooling device (cured and / or solidified product). Therefore, by using the material for manufacturing a cooling device of the present embodiment, it is possible to install the cooling device at a location having a fine and complicated shape.
  • the second insulating resin is not particularly limited, and for example, a thermosetting resin, more specifically, the same one as described above for the first insulating resin obtained 3 can be used.
  • the second insulating resin may be the same as or different from the first insulating resin.
  • the second insulating resin can be appropriately selected according to the type and application of the electronic device to which the cooling device manufacturing material of the present embodiment is applied.
  • an epoxy resin or polyimide resin having solder heat resistance and high versatility is preferable.
  • a glass such as a phenol novolac type epoxy resin or polyimide resin is used.
  • a resin having a transition temperature of 150 ° C. or higher is preferred.
  • the composition for manufacturing a cooling device further includes the second insulating resin
  • the composition for manufacturing a cooling device includes third particles having insulating properties and thermal conductivity dispersed in the second insulating resin. May further be included.
  • the third particle is not particularly limited as long as it is made of a material having insulating properties and thermal conductivity. More specifically, the same particles as the heat conductive particles described above can be used as the second particles 5. The third particles may be the same as or different from the second particles.
  • the cooling device manufacturing material of the present embodiment may further contain a solvent.
  • a solvent for example, dipropylene methyl ether acetate, toluene, methyl ethyl ketone and the like are used.
  • the material for manufacturing a cooling device of the present embodiment may appropriately include additives such as a dispersant, a curing accelerator, and an antifoaming agent.
  • the effective content of the ceramic material in the cooling device manufacturing material is preferably 20 vol% or more, from the viewpoint of obtaining a larger endothermic amount, and 30 vol. % Or more is more preferable, and it is further more preferable that it is 50 vol% or more. Moreover, it is preferable that it is 90 vol% or less from a viewpoint of ensuring the intensity
  • a cooling device By using the cooling device manufacturing material of the present embodiment as described above, a cooling device can be obtained, and more specifically, a cooling device can be provided in an electronic device.
  • the cooling device 11 formed of the cooling device manufacturing material is replaced with the heat generating component 15. Can be placed in contact.
  • the cooling device 11 exhibits high heat exchange efficiency between the outside of the cooling device, in the illustrated case, the heat generating component 15 and the endothermic particles 1, and also exhibits high insulation as the entire cooling device.
  • the cooling device 11 can exhibit a resistance value of 10 5 ⁇ ⁇ cm or more at room temperature, but is not limited thereto.
  • the cooling device 11 may be formed by providing the cooling device manufacturing material in contact with the heat generating component 15 and then performing post-processing as appropriate as necessary.
  • the post-processing is performed by heat drying for the purpose of thermosetting the second insulating resin and removing the solvent when a solvent is present.
  • the cooling device manufacturing material can be cured and solidified in situ.
  • Such a cooling device can be of any shape and size.
  • a method for providing a material for manufacturing a cooling device having fluidity is not particularly limited, and examples thereof include dispenser application, dispenser injection, screen printing, electrostatic application, inkjet printing, spray spraying, dipping, die coating, blade coating, and the like. It is done.
  • the heat generating component 15 is not particularly limited.
  • an integrated circuit such as a central processing unit (CPU), a power management IC (PMIC), a power amplifier (PA), a transceiver IC, and a voltage regulator (VR).
  • IC integrated circuit
  • CPU central processing unit
  • PMIC power management IC
  • PA power amplifier
  • VR voltage regulator
  • LEDs Light emitting diodes
  • LEDs incandescent bulbs
  • FETs field effect transistors
  • the cooling device of the present embodiment may be disposed so as to be thermally coupled to other components, for example, components commonly used in electronic devices such as a substrate, a heat sink, and a housing.
  • the cooling device of the present embodiment may be formed integrally with such a component to constitute an electronic component.
  • the electronic device including the cooling device and / or the electronic component of the present embodiment is not particularly limited, and examples thereof include a mobile phone, a smartphone, a personal computer (PC), and a tablet terminal.
  • the present invention is not limited to such an embodiment.
  • the second insulating resin is not essential in the cooling device manufacturing material of the present invention, and only the composite particles may be used alone as the cooling device manufacturing material. In this case, it is possible to use the composite particles as they are, for example, by filling at least part of the space between the heat generating component and the housing of the electronic device.
  • the material for manufacturing a cooling device of the present invention is applicable to electronic devices such as small communication terminals, for example, where the problem of countermeasures against heat has become prominent, and can be used to cool heat-generating components, but is limited to such applications. It is not something.
  • First particle (endothermic particle) 3 First insulating resin 5 Second particle (thermally conductive particle) 7 Insulating film 9 Composite particle 10 Cooling device manufacturing material 11 Cooling device 13 Substrate 15 Heating component 20 Electronic equipment

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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un matériau de fabrication de dispositif de refroidissement qui comprend des particules composites dans lesquelles des premières particules composées d'un matériau céramique qui absorbe la chaleur par l'intermédiaire de la chaleur latente sont revêtues en surface à l'aide d'un film isolant, le film isolant comprenant une première résine isolante ainsi que des secondes particules ayant des propriétés isolantes et une conductivité thermique et étant dispersées dans la première résine isolante.
PCT/JP2015/070489 2014-09-17 2015-07-17 Dispositif de refroidissement WO2016042909A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014188832 2014-09-17
JP2014-188832 2014-09-17

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Publication Number Publication Date
WO2016042909A1 true WO2016042909A1 (fr) 2016-03-24

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018174210A1 (fr) * 2017-03-24 2018-09-27 国立大学法人東京大学 Composition de résine contenant de l'oxyde de titane ayant des propriétés de stockage de chaleur et de rayonnement thermique, et matériau de stockage de chaleur obtenu à l'aide de ladite composition de résine
EP3827974A1 (fr) 2016-11-03 2021-06-02 Continuous Composites Inc. Carrosserie de véhicule composite

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181612A (ja) * 1999-12-24 2001-07-03 Sekisui Chem Co Ltd 蓄熱用マイクロカプセル
JP2006016573A (ja) * 2004-07-05 2006-01-19 Honda Motor Co Ltd マイクロカプセル及び熱輸送流体
JP2010163510A (ja) * 2009-01-14 2010-07-29 Institute Of Physical & Chemical Research 蓄熱材
WO2013107081A1 (fr) * 2012-01-19 2013-07-25 中国科学院上海硅酸盐研究所 Revêtement de dioxyde de vanadium pour un contrôle intelligent de la température

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181612A (ja) * 1999-12-24 2001-07-03 Sekisui Chem Co Ltd 蓄熱用マイクロカプセル
JP2006016573A (ja) * 2004-07-05 2006-01-19 Honda Motor Co Ltd マイクロカプセル及び熱輸送流体
JP2010163510A (ja) * 2009-01-14 2010-07-29 Institute Of Physical & Chemical Research 蓄熱材
WO2013107081A1 (fr) * 2012-01-19 2013-07-25 中国科学院上海硅酸盐研究所 Revêtement de dioxyde de vanadium pour un contrôle intelligent de la température

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3827974A1 (fr) 2016-11-03 2021-06-02 Continuous Composites Inc. Carrosserie de véhicule composite
WO2018174210A1 (fr) * 2017-03-24 2018-09-27 国立大学法人東京大学 Composition de résine contenant de l'oxyde de titane ayant des propriétés de stockage de chaleur et de rayonnement thermique, et matériau de stockage de chaleur obtenu à l'aide de ladite composition de résine

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