WO2016032395A1 - Device having a single-sided printed circuit board - Google Patents

Device having a single-sided printed circuit board Download PDF

Info

Publication number
WO2016032395A1
WO2016032395A1 PCT/SG2015/000137 SG2015000137W WO2016032395A1 WO 2016032395 A1 WO2016032395 A1 WO 2016032395A1 SG 2015000137 W SG2015000137 W SG 2015000137W WO 2016032395 A1 WO2016032395 A1 WO 2016032395A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
sided printed
metallized
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/SG2015/000137
Other languages
English (en)
French (fr)
Inventor
Eng Kim Teo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Home Control Singapore Pte Ltd
Original Assignee
Home Control Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Home Control Singapore Pte Ltd filed Critical Home Control Singapore Pte Ltd
Priority to BR112017003491-3A priority Critical patent/BR112017003491B1/pt
Priority to CN201580045626.7A priority patent/CN106576420B/zh
Priority to US15/328,322 priority patent/US10206282B2/en
Priority to JP2017510835A priority patent/JP6890537B2/ja
Publication of WO2016032395A1 publication Critical patent/WO2016032395A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process

Definitions

  • the invention relates to a device having a single-sided printed circuit board.
  • Single-sided printed circuit boards are known in the art, and have the advantage that they are cheaper than double-sided printed circuit boards.
  • the obvious disadvantage of a single-sided printed circuit board is that connections are only possible at one side. While metallized vias or holes through the printed circuit board are known as well, such metallized holes also result in a price increase.
  • printed wiring boards alternatively called printed wiring boards
  • One aspect of the invention provides a device comprising a single-sided printed circuit board having a non-metallized hole, and a connection area close to the non-metallized hole on a metallized side of the single-sided printed circuit board; and a conducting bridge from the connection area and at least partially covering the non-metallized hole, for allowing the connection area to be contacted (e.g. by a probe) from a non-metallized side of the single- sided printed circuit board through the non-metallized hole.
  • connection bridge can be formed by part of a key-mat having a carbon print area that forms the connection bridge.
  • the probe can be used for testing purposes, or for allowing the IC to be programmed.
  • a reset button at the bottom side of a single-sided printed circuit board if that reset button bridges two connection areas on the wired top side of the printed circuit board via respective connection bridges.
  • Figs. 1A and IB show exploded views of a remote control device in accordance with an embodiment of the invention.
  • Figs. 2 and 3 show other views of a remote control device in accordance with an embodiment of the invention. DESCRIPTION OF EMBODIMENTS
  • the figures show various views of a remote control device in accordance with an embodiment of the invention.
  • the embodiment is a rather simple remote control, with buttons B for channel up, channel down, volume up, volume down, ' and a standby button.
  • the invention can alternatively be used with remote controls having more buttons.
  • a button is pressed down, a carbon print area CP on the lower side of the key-mat KM makes a connection on the printed circuit board PCB by bridging two contact areas (in this embodiment, these contact areas are represented by half circles; contact areas having other shapes are alternatively possible).
  • the printed circuit board PCB has several other components customary for a remote control device, such as an integrated circuit and an infra-red light emitting diode.
  • a carbon print area CP on the key-mat KM that is not below a button B, but that serves to make a connection between a probe P if and when inserted from the bottom side of the printed circuit board, through a hole in the bottom casing BC and a matching hole in the printed circuit board PCB, to a connection area CA on the top side of the single-sided printed circuit board PCB.
  • the top casing TC of the remote control device in accordance with the embodiment of the invention is preferably formed such that the carbon print area above the hole in the printed circuit board PCB is firmly pressed onto the connection area, so that if and when the probe P is inserted through the hole and touches the carbon print, it gets a good connection with the connection are.
  • connection area CA is a circle around the hole in the printed circuit board PCB.
  • it may be a metalized area adjacent to just one side of the hole.
  • the carbon print areas CP do not need to have a circle shape, and they do not need to cover the entire hole as long as they ensure that a connection is made between a probe P inserted through the hole and the connection area CA.
  • the bottom side of the key-mat KM may alternatively have metallized contact areas instead of carbon print areas, as all what matters is that an electrical connection can be made so that a conducting bridge is formed. While the invention is illustrated by means of an embodiment formed by a remote control device, the invention can be used with any device having a single side printed circuit board that needs to be contacted from the other side. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.
  • the word “comprising” does not exclude the presence of elements or steps other than those listed in a claim.
  • the word "a” or “an” preceding an element does not exclude the presence of a plurality of such elements.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Selective Calling Equipment (AREA)
  • Structure Of Printed Boards (AREA)
  • Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Push-Button Switches (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
PCT/SG2015/000137 2014-08-25 2015-08-24 Device having a single-sided printed circuit board Ceased WO2016032395A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
BR112017003491-3A BR112017003491B1 (pt) 2014-08-25 2015-08-24 Dispositivo de controle remoto
CN201580045626.7A CN106576420B (zh) 2014-08-25 2015-08-24 具有单侧印刷电路板的设备
US15/328,322 US10206282B2 (en) 2014-08-25 2015-08-24 Device having a single-sided printed circuit board
JP2017510835A JP6890537B2 (ja) 2014-08-25 2015-08-24 片面プリント回路基板を有するデバイス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP14182073.8A EP2991459B1 (en) 2014-08-25 2014-08-25 Device having a single-sided printed circuit board
EP14182073.8 2014-08-25

Publications (1)

Publication Number Publication Date
WO2016032395A1 true WO2016032395A1 (en) 2016-03-03

Family

ID=51390047

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2015/000137 Ceased WO2016032395A1 (en) 2014-08-25 2015-08-24 Device having a single-sided printed circuit board

Country Status (6)

Country Link
US (1) US10206282B2 (https=)
EP (1) EP2991459B1 (https=)
JP (1) JP6890537B2 (https=)
CN (1) CN106576420B (https=)
BR (1) BR112017003491B1 (https=)
WO (1) WO2016032395A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2991459B1 (en) 2014-08-25 2018-02-14 Home Control Singapore Pte. Ltd. Device having a single-sided printed circuit board
DE102016123917A1 (de) * 2016-12-09 2018-06-14 Endress+Hauser SE+Co. KG Elektronik-Baugruppe
DE102018217349A1 (de) * 2018-10-10 2020-04-16 Conti Temic Microelectronic Gmbh Leiterplatte
DE102024203579A1 (de) * 2024-04-18 2025-10-23 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung und Verfahren zum Auslesen eines Datenträgers eines Kraftfahrzeugs

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883335A (en) * 1995-03-23 1999-03-16 International Business Machines Corporation Electrical connection substrate having a through hole for connecting a chip to an opposite surface of the substrate
US7618846B1 (en) * 2008-06-16 2009-11-17 Stats Chippac, Ltd. Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device
US8115108B2 (en) * 2008-03-03 2012-02-14 Nippon Mektron, Ltd. Flexible printed circuit board and manufacturing method for the same

Family Cites Families (15)

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DE2827640A1 (de) * 1978-06-23 1980-01-10 Chuo Meiban Mfg Co Verfahren zur befestigung von leitungsdraehten von bauteilen an einer grundplatte fuer eine gedruckte schaltung und grundplatte zur durchfuehrung des verfahrens
JPS5523503A (en) * 1978-07-10 1980-02-20 Tokai Tsushin Kogyo Kk Switch board
JPS6081718A (ja) * 1983-10-12 1985-05-09 松下電器産業株式会社 押釦スイツチ
JPS61196420U (https=) * 1985-05-29 1986-12-08
JP2977145B2 (ja) * 1993-03-18 1999-11-10 富士通株式会社 キーボード回路装置
US6064576A (en) * 1997-01-02 2000-05-16 Texas Instruments Incorporated Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board
JPH10288638A (ja) * 1997-04-15 1998-10-27 Nemic Lambda Kk 電源装置のフレーム構造
JP2002523756A (ja) * 1998-08-18 2002-07-30 インフィネオン テクノロジース アクチエンゲゼルシャフト 電気的な構成素子を検査する場合に使用するためのプリント配線板および該プリント配線板を製造する方法
US6285081B1 (en) * 1999-07-13 2001-09-04 Micron Technology, Inc. Deflectable interconnect
ATE325422T1 (de) * 2002-05-23 2006-06-15 Digit Wireless Llc Tastaturen und tastschalter
US7391342B1 (en) * 2003-02-05 2008-06-24 Zilog, Inc. Low-cost keypad encoding circuit
TW200839823A (en) * 2007-03-23 2008-10-01 Jensin Intl Technology Corp Membrane switch
KR100991749B1 (ko) * 2008-05-20 2010-11-03 (주)미내사시스템 멤브레인 스위치시트
US8896743B2 (en) * 2011-06-08 2014-11-25 Omnivision Technologies, Inc. Enclosure for image capture systems with focusing capabilities
EP2991459B1 (en) 2014-08-25 2018-02-14 Home Control Singapore Pte. Ltd. Device having a single-sided printed circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883335A (en) * 1995-03-23 1999-03-16 International Business Machines Corporation Electrical connection substrate having a through hole for connecting a chip to an opposite surface of the substrate
US8115108B2 (en) * 2008-03-03 2012-02-14 Nippon Mektron, Ltd. Flexible printed circuit board and manufacturing method for the same
US7618846B1 (en) * 2008-06-16 2009-11-17 Stats Chippac, Ltd. Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device

Also Published As

Publication number Publication date
CN106576420B (zh) 2019-11-08
US10206282B2 (en) 2019-02-12
EP2991459B1 (en) 2018-02-14
EP2991459A1 (en) 2016-03-02
BR112017003491B1 (pt) 2022-03-15
CN106576420A (zh) 2017-04-19
JP6890537B2 (ja) 2021-06-18
BR112017003491A2 (pt) 2017-12-05
US20170215283A1 (en) 2017-07-27
JP2017535055A (ja) 2017-11-24

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