WO2016029430A1 - 一种电子产品 - Google Patents

一种电子产品 Download PDF

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Publication number
WO2016029430A1
WO2016029430A1 PCT/CN2014/085514 CN2014085514W WO2016029430A1 WO 2016029430 A1 WO2016029430 A1 WO 2016029430A1 CN 2014085514 W CN2014085514 W CN 2014085514W WO 2016029430 A1 WO2016029430 A1 WO 2016029430A1
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WO
WIPO (PCT)
Prior art keywords
electronic product
fan
switch
area
state
Prior art date
Application number
PCT/CN2014/085514
Other languages
English (en)
French (fr)
Inventor
钟镭
靳林芳
邹杰
康南波
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201480047917.5A priority Critical patent/CN105766072B/zh
Priority to KR1020177007916A priority patent/KR101967321B1/ko
Priority to US15/507,597 priority patent/US10130005B2/en
Priority to JP2017511749A priority patent/JP6436467B2/ja
Priority to PCT/CN2014/085514 priority patent/WO2016029430A1/zh
Publication of WO2016029430A1 publication Critical patent/WO2016029430A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H15/00—Switches having rectilinearly-movable operating part or parts adapted for actuation in opposite directions, e.g. slide switch
    • H01H15/005—Switches having rectilinearly-movable operating part or parts adapted for actuation in opposite directions, e.g. slide switch adapted for connection with printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H23/00—Tumbler or rocker switches, i.e. switches characterised by being operated by rocking an operating member in the form of a rocker button
    • H01H23/02—Details
    • H01H23/12—Movable parts; Contacts mounted thereon
    • H01H23/16—Driving mechanisms
    • H01H23/164—Driving mechanisms with rectilinearly movable member carrying the contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20181—Filters; Louvers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10196—Variable component, e.g. variable resistor

Definitions

  • the present invention relates to the field of heat dissipation technologies, and in particular, to an electronic product.
  • the heat dissipation method of such an electronic product mainly utilizes a natural heat dissipation method, that is, heat exchange is performed by the natural flow of air in the external environment and the air inside the electronic product, thereby achieving the purpose of heat dissipation.
  • the heat dissipation efficiency of the heat dissipation method is low, and the electronic product using the heat dissipation method has low reliability and a short service life.
  • an embodiment of the present invention provides an electronic product, which has high heat dissipation efficiency, thereby making the reliability higher and the service life longer.
  • the embodiment of the present invention provides the following technical solutions:
  • the invention provides an electronic product comprising:
  • the housing is provided with a ventilation hole
  • the PCB board located in the housing, the PCB board is provided with a positive pole and a negative pole of a power source;
  • a fan located between the PCB board and the housing, a projection of the fan on the PCB board and a projection of the vent hole on the PCB board;
  • a switch strip between the fan and the housing, slidably connected to the housing, the switch
  • the strip includes: a first state that does not completely block the vent hole and a second state that completely blocks the vent hole;
  • the switch strip includes a conductive area.
  • the conductive area is electrically connected to the positive and negative poles of the power supply on the PCB, and the first drive signal is provided to the fan. The fan is operated.
  • a projection of the fan on the PCB board coincides with a projection of the vent hole on the PCB board.
  • the switch bar in combination with the first aspect or the first possible implementation of the first aspect, in a second possible implementation, includes a ventilation area and a non-ventilated area enclosing the ventilation area, and the switch bar includes : the ventilation area is facing the second state of the ventilation hole by the first state of the ventilation hole and the non-ventilation area;
  • the conductive area is located in a non-ventilated area of the switch strip.
  • the conductive area is electrically connected to the positive and negative power sources of the PCB board, and the fan is electrically connected to the fan.
  • a first drive signal is provided to operate the fan.
  • the projection of the ventilation area on the PCB covers a projection of the ventilation hole on the PCB.
  • the non-ventilated area further includes: an insulating region, where the insulating region is located in the conductive region Between the venting areas, and wrapping the venting area.
  • the ventilation area is through the switch strip Through hole.
  • the electronic product further includes: a dustproof net located in a ventilation area of the switch strip, and air passing through the ventilation area Filter.
  • the air filter is connected to the switch bar in a fixed manner.
  • the conductive region is a conductive copper sheet.
  • the electronic product further includes: a thermistor disposed on the PCB board and disposed at the a temperature switch on a PCB, wherein the thermistor is configured to receive the first driving signal, and when the first driving signal is received, detect a temperature of the electronic product, and detect a temperature signal thereof Converting into an electrical signal output to a temperature switch, the temperature switch is configured to determine an electrical signal output by the thermistor, and when it reaches a preset value, output a second driving signal to the fan, the fan The operation starts when the second drive signal is received.
  • the electronic product further includes: a toggle switch fixedly connected to the switch strip, The toggle switch implements the transition of the state of the switch strip.
  • the electronic product provided by the embodiment of the present invention includes: a housing, the housing is provided with a ventilation hole; a PCB board located in the housing, the PCB board is provided with a power source positive pole and a negative pole; a fan between the board and the housing, a projection of the fan on the PCB board and a projection of the vent hole on the PCB board; between the fan and the housing, With the shell a switch strip that is slidably connected, the switch strip includes: a first state that does not completely block the vent hole and a second state that completely blocks the vent hole; wherein the switch bar includes a conductive area when the switch When the strip is placed in the first state, the conductive region is electrically connected to the positive and negative poles of the power supply on the PCB, and the fan is provided with a first driving signal, and the fan starts to operate.
  • the switch strip can be placed in the first state, and the fan is actively dissipated through the vent hole disposed on the housing to enhance the external environment.
  • the heat exchange between the air and the internal air of the electronic product in the environment to improve the heat dissipation efficiency of the electronic product, thereby improving the reliability of the electronic product and prolonging its service life.
  • the switch strip can be placed in the second state, and the ventilating hole on the housing is blocked by the switch strip, thereby avoiding the external environment.
  • the dust enters the interior of the electronic product through the vent holes on the casing, affecting the performance of the electronic product, and shortening the service life of the electronic product.
  • FIG. 1 is a schematic structural view of an electronic product according to an embodiment of the present invention, when a switch strip is placed in a first state;
  • FIG. 2 is a schematic structural view of an outer casing of an electronic product according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a PCB board in an electronic product according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of the electronic product provided in FIG. 1 when the switch strip is placed in the second state;
  • FIG. 5 is a top plan view of a switch bar in an electronic product according to an embodiment of the present invention.
  • FIG. 6 is a top plan view of a switch bar in an electronic product according to another embodiment of the present invention.
  • FIG. 7 is a schematic structural view of the electronic product provided in FIG. 6 when the switch strip is placed in the first state;
  • FIG. 8 is a schematic structural view of the electronic product provided in FIG. 6 when the switch strip is placed in the second state;
  • FIG. 9 is a top plan view of a switch bar in an electronic product according to still another embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of a switch bar placed in a first state in an electronic product according to still another embodiment of the present invention.
  • FIG. 11 is a schematic structural view showing the switch bar placed in the second state in the electronic product provided in FIG. 10 of the present invention.
  • FIG. 12 is a schematic structural view showing a switch bar placed in a first state in an electronic product according to still another embodiment of the present invention.
  • FIG. 13 is a schematic diagram showing the working principle of an electronic product according to still another embodiment of the present invention.
  • FIG. 14 is a partial schematic structural view of an electronic product according to still another embodiment of the present invention.
  • the electronic products in the prior art mainly use the natural heat dissipation method to dissipate heat, but the heat dissipation efficiency of the heat dissipation method is low, and the reliability of the electronic product using the heat dissipation method is low. Short service life.
  • an electronic product including:
  • the housing is provided with a ventilation hole
  • the PCB board located in the housing, the PCB board is provided with a positive pole and a negative pole of a power source;
  • a switch bar slidably connected to the casing between the fan and the casing, the switch bar comprising: a first state that does not completely block the vent hole and a second state that completely blocks the vent hole status;
  • the switch strip includes a conductive area.
  • the conductive area is electrically connected to the positive and negative poles of the power supply on the PCB, and the first drive signal is provided to the fan. The fan starts to run.
  • the switch strip can be placed in the first state, and the fan is actively dissipated through the vent hole disposed on the housing to enhance the external environment.
  • the heat exchange between the air and the internal air of the electronic product in the environment to improve the heat dissipation efficiency of the electronic product, thereby improving the reliability of the electronic product and prolonging its service life.
  • the switch strip can be placed in the second state, and the ventilating hole on the housing is blocked by the switch strip, thereby avoiding the external environment.
  • the dust enters the interior of the electronic product through the vent holes on the casing, affecting the performance of the electronic product, and shortening the service life of the electronic product.
  • an embodiment of the present invention provides an electronic product, including:
  • the housing 1 is provided with a venting opening 11 through which air in an external environment can enter the interior of the housing 1 of the electronic product, and the housing The air inside the body 1 is heat exchanged.
  • the PCB board 2 located in the casing 1 is provided with a power source positive electrode 21 and a negative electrode 22 on the PCB board 2 as shown in FIG.
  • the power source positive electrode 21 and the negative electrode 22 may be fixed to the PCB board 2 in the form of a spring piece.
  • a fan 3 between the PCB board 2 and the housing 1 to facilitate active heat dissipation by the fan 3 through a venting opening 11 provided in the housing 1 during operation of the electronic product.
  • the heat exchange between the air and the internal air of the electronic product in the external environment is enhanced to improve the heat dissipation efficiency of the electronic product, thereby improving the reliability of the electronic product and prolonging the service life thereof.
  • the projection of the fan 3 on the PCB board 2 overlaps with the projection of the vent hole 11 on the PCB board 2, so that the air flow generated by the fan 3 can pass through the housing.
  • the venting opening 11 on the 1 enters the external environment, further improving the heat dissipation efficiency of the electronic product.
  • the fan 3 is a micro fan, but the invention is not limited in specific terms, and depends on the size and heat dissipation performance requirements of the electronic product.
  • the switch strip 4 includes: a first state that does not completely block the vent hole 11 (see FIG. 1). Shown and completely occlude the second state of the venting opening 11 (as shown in Figure 4).
  • the switch strip 4 includes a conductive area. When the switch strip 4 is placed in the first state, the conductive area is electrically connected to the power source positive electrode 21 and the negative electrode 22 on the PCB board 2 to make the power source positive pole. 21 and the negative electrode 22 are turned on to provide the fan 3 with a first drive signal to operate the fan 3.
  • the switch bar 4 is placed In the two states, the conductive region of the switch strip 4 is disconnected from the power source positive electrode 21 and the negative electrode 22, so that the power source positive electrode 21 and the negative electrode 22 are in an open state, and the fan 3 is stopped.
  • the switch strip 4 is a full-face airtight area, as shown in FIG. 5, in another embodiment of the invention, the switch strip 4 includes a venting area 41 and a wrap
  • the non-ventilated area 42 of the venting area 41 is not limited as shown in FIG. 6 , as the case may be.
  • the switch bar 4 includes the ventilation area 41 and the non-ventilation area 42 that wraps the ventilation area 41
  • the switch strip 4 includes: the ventilation area 41 facing the ventilation hole 11 A state (shown in Figure 7) and the non-vented region 42 completely obscure the second state of the venting opening 11 (as shown in Figure 8).
  • the conductive area 421 is located in the non-ventilated area 42, and when the switch strip 4 is placed in the first state, the conductive area 421 is The power source positive electrode 21 and the negative electrode 22 on the PCB board 2 are electrically connected (as shown in FIG.
  • the switch strip 4 When the switch strip 4 is placed in the second state, the conductive region 421 of the switch strip 4 is disconnected from the power source cathode 21 and the cathode 22 (as shown in FIG. 11), so the power source cathode 21 and the cathode 22 are in an open state. The fan 3 is stopped.
  • the switch bar 4 is placed in the first state, and the fan 3 can actively dissipate heat through the vent hole 11 on the casing 1 .
  • the switch bar 4 is placed in the second state, the fan 3 is not working to reduce the power loss of the electronic product, and the switch strip 4 can also be used to
  • the venting hole 11 on the casing 1 is shielded to avoid dust in the external environment, and enters the inside of the electronic product through the vent hole 11 in the casing 1 to affect the performance of the electronic product and shorten The service life of the electronic product.
  • the projection of the fan 3 on the PCB board 2 is located within a projection range of the vent hole 11 on the PCB board 2, so as to utilize the fan 3. Most of the generated air flow can enter the external environment through the vent holes 11 in the casing 1 to improve the heat dissipation efficiency of the electronic product. More preferably, the projection of the fan 3 on the PCB board 2 coincides with the projection of the vent hole 11 on the PCB board 2 to fully utilize the effective area of the vent hole 11 and the fan 3. To maximize heat dissipation efficiency.
  • the projection of the ventilation area 41 on the PCB board 2 covers the projection of the ventilation hole 11 on the PCB board 2, so that The air flow generated by the fan 3 can enter the vent hole 11 through the venting area 41 to the maximum extent, and then enter the external environment through the vent hole 11 to exchange heat with the air in the external environment.
  • the projection of the ventilation area 41 on the PCB board 2 coincides with the projection of the ventilation hole 11 on the PCB board 2, but the invention is not limited thereto, as the case may be.
  • the non-ventilated area 42 further includes: an insulating area 422, the insulating area 422 is located in the The conductive region 421 is interposed between the ventilation region 41 and wraps the ventilation region 41.
  • the conductive region 421 is a conductive copper sheet, but the invention is not limited thereto, and may be made of a conductive material.
  • the ventilation area 41 may be formed by a plurality of meshes disposed in the insulating region 422, or may be a through hole disposed in the insulating region 422, that is, the ventilation area 41 is The through hole of the switch strip 4 is penetrated, but the invention is not limited thereto, as the case may be.
  • the ventilation area 41 is a through hole disposed in the insulation area 422, and the area of the through hole matches the area of the ventilation hole 11 to ensure heat dissipation efficiency.
  • the electronic product further includes: an air filter 5 located in the ventilation area 41 of the switch strip 4, The air in the ventilation area 41 is filtered to avoid dust in the external environment passing through the shell once the electronic product is dissipated by the fan 3, that is, when the switch strip 4 is placed in the first state.
  • the venting opening 11 on the body 1 and the through hole in the switch strip 4 enter the interior of the electronic product, affecting the reliability of the electronic product and shortening the service life of the electronic product.
  • connection manner of the air filter 5 and the switch bar 4 is fixedly bonded, but the invention is not limited thereto, as the case may be.
  • the operating state of the fan 3 is determined only by the state of the switch bar 4, that is, when the switch bar 4 is placed in the first state, The conductive region 421 of the switch strip 4 electrically connects the positive electrode 21 and the negative electrode 22 of the power supply on the PCB board 2, and the fan 3 starts to operate; when the switch strip 4 is placed in the second state, the switch strip 4 The conductive region 421 does not electrically connect the positive electrode 21 and the negative electrode 22 of the power source on the PCB board 2, and the fan 3 stops operating.
  • the electronic product further includes: a thermistor disposed on the PCB board 2 and a temperature switch disposed on the PCB board 2, as shown in FIG.
  • the thermistor 23 is configured to receive the first driving signal, when receiving the first driving signal, detect the temperature of the electronic product, and convert the detected temperature signal into an electrical signal and output the signal to the temperature switch 24,
  • the temperature switch 24 is configured to determine an electrical signal output by the thermistor 23, and when it reaches its preset value, output a second driving signal to the fan 3, and the fan 3 receives the second drive. The signal starts to run.
  • the operating state of the fan 3 is determined jointly by the switch strip 4 and the temperature switch 24.
  • the switch strip 4 When the switch strip 4 is placed in the first state, the conductive region 421 of the switch strip 4 is electrically connected to the positive electrode 21 and the negative electrode 22 of the power supply on the PCB 2, and outputs a first driving signal, and the thermistor 23 Receiving the first driving signal, and when receiving the first driving signal, that is, when the switch bar 4 is placed in the first state, starting to detect the temperature of the electronic product, and then detecting the same
  • the temperature signal is converted into an electrical signal and output to the temperature switch 24; the temperature switch 24 determines the signal it receives (ie, the electrical signal output by the thermistor 23), and determines whether the received signal reaches a preset.
  • the temperature switch 24 When the signal received by the temperature switch 24 reaches a preset value, the temperature switch 24 outputs a second driving signal to the fan 3, and the fan 3 starts to operate; when the temperature switch 24 receives a signal not When the preset value is reached, the temperature switch 24 does not output a second drive signal to the fan 3, and the fan 3 does not operate.
  • the electronic product provided by the embodiment of the present invention uses the fan 3 to actively dissipate heat only when the temperature of the electronic product reaches a certain value.
  • the temperature of the electronic product does not reach a certain value, That is, when the temperature of the electronic product is low, the fan 3 is not used for active heat dissipation, but the heat dissipation is performed by the ventilation hole 11 on the casing 1 to reduce the power loss of the electronic product and reduce
  • the passive intake of dust in the external environment under the action of the fan 3 reduces the influence of dust on the performance of the electronic product and prolongs the service life of the electronic product.
  • the thermistor 23 detects the temperature of the electronic product in real time, or detects the preset time interval.
  • the temperature of the electronic product is further reduced to reduce the power loss of the electronic product, which is not limited by the present invention, as the case may be.
  • the specific value of the preset value is not limited in the embodiment of the present invention, and specifically depends on the heat loss of the electronic product and its performance requirement.
  • the switching between the first state and the second state of the switch bar 4 can be automatically controlled or manually controlled.
  • the present invention does not limit this, and the specific situation depends on the situation. .
  • the operating state of the switch strip 4 is preferably controlled by the power switch of the electronic product. Control is performed such that when the power switch of the electronic product is turned on, the switch bar 4 is placed in the first state, and when the power switch of the electronic product is turned off, the switch bar 4 is placed in the second state.
  • the method further includes: a toggle switch 6 fixedly connected to the switch strip 4, so that the state of the switch strip 4 can be converted by the toggle switch 6.
  • the ventilation hole 11 in the casing 1 may be a through hole penetrating the casing 1 or may be penetrated by the plurality.
  • the mesh structure of the casing 1 is not limited in the present invention, and is specifically determined as the case may be. It should be noted that, when the ventilation hole 11 on the housing 1 can be a through hole penetrating the housing 1, in another embodiment of the present invention, the electronic product further includes: a setting and a The air filter at the venting opening 11 is arranged to facilitate filtering of the air passing through the hole 11, but the invention is not limited thereto, as the case may be.
  • the shape of the cross section of the vent hole 11 on the housing 1 perpendicular to the direction of the PCB board 2 to the housing 1 may be circular or Ellipse
  • the shape or any other shape is not limited by the present invention, and is determined by the circumstances.
  • the shape of the through hole on the switch strip 4 is not limited as long as it matches the shape of the vent hole 11 on the housing 1.
  • the electronic product provided by the embodiment of the present invention includes: a housing 1 , the housing 1 is provided with a ventilation hole 11; a PCB board 2 located in the housing 1 , the PCB board 2 A power supply positive electrode 21 and a negative electrode 22 are disposed thereon; a fan 3 between the PCB board 2 and the casing 1 is located between the fan 3 and the casing 1 and is slidably connected to the casing 1 a switch strip 4 comprising: a first state that does not completely block the venting opening 11 and a second state that completely blocks the venting opening 11; wherein the switch strip 4 includes a conductive area, When the switch strip 4 is placed in the first state, the conductive region is electrically connected to the power source positive electrode 21 and the negative electrode 22 on the PCB board 2, and the fan 3 is provided with a first driving signal, and the fan 3 starts to operate.
  • the switch strip 4 can be placed in the first state, and the fan 3 is actively dissipated through the vent hole 11 disposed on the housing 1 . Enhancing the heat exchange between the air and the air inside the electronic product in the external environment to enhance the electronic product The heat dissipation efficiency of the product, thereby improving the reliability of the electronic product and prolonging its service life.
  • the switch bar 4 can be placed in the second state, and the vent hole 11 on the casing 1 is blocked by the switch bar 4, Thereby, dust in the external environment is avoided, and the inside of the electronic product is entered through the vent hole 11 in the casing 1, affecting the performance of the electronic product, and shortening the service life of the electronic product.

Abstract

一种电子产品，包括：壳体（1），所述壳体（1）上设置有通风孔（11）；位于壳体（1）内的PCB板（2），所述PCB板（2）上设置有电源正极（21）和负极（22）；位于PCB板（2）与壳体（1）之间的风扇（3），所述风扇（3）在所述PCB板（2）上的投影与所述通风孔（11）在所述PCB板（2）上的投影相交叠；位于风扇（3）与所述壳体（1）之间，与壳体（1）滑动连接的开关条（4），所述开关条（4）包括：不完全遮挡所述通风孔（11）的第一状态和完全遮挡所述通风孔（11）的第二状态；其中，所述开关条（4）包括导电区域，当所述开关条（4）置于第一状态时，所述导电区域与所述PCB板（2）上的电源正极（21）和负极（22）电连接，给所述风扇（3）提供第一驱动信号，所述风扇（3）开始运转。该电子产品散热效率较高，从而使得其可靠性较好，使用寿命较长。

Description

一种电子产品 技术领域
本发明涉及散热技术领域，尤其涉及一种电子产品。
背景技术
随着无线上网卡和数据卡等电子产品性能的不断提升，其产品热耗也相应的大幅增长。现有技术中这类电子产品的散热方式，主要是利用自然散热的方式，即通过外界环境中空气的自然流动与电子产品内部的空气进行热交换，从而实现散热的目的。但是，这种散热方式的散热效率较低，导致利用这种散热方式散热的电子产品的可靠性较低，使用寿命较短。
发明内容
为解决上述技术问题，本发明实施例提供了一种电子产品，该电子产品的散热效率较高，从而使得其可靠性较高，使用寿命较长。
为解决上述问题，本发明实施例提供了如下技术方案：
第一方面，本发明提出了一种电子产品，包括：
壳体，所述壳体上设置有通风孔；
位于所述壳体内的PCB板，所述PCB板上设置有电源正极和负极；
位于所述PCB板与所述壳体之间的风扇，所述风扇在所述PCB板上的投影与所述通风孔在所述PCB板的投影相交叠；
位于所述风扇与所述壳体之间，与所述壳体滑动连接的开关条，所述开关 条包括：不完全遮挡所述通风孔的第一状态和完全遮挡所述通风孔的第二状态；
其中，所述开关条包括导电区域，当所述开关条置于第一状态时，所述导电区域与所述PCB板上的电源正极和负极电连接，给所述风扇提供第一驱动信号，使所述风扇运转。
在第一方面的第一种可能的实现方式中，所述风扇在所述PCB板上的投影与所述通风孔在所述PCB板上的投影重合。
结合第一方面或第一方面的第一种可能的实现方式，在第二种可能的实现方式中，所述开关条包括通风区域和包裹所述通风区域的非通风区域，所述开关条包括：所述通风区域正对所述通风孔的第一状态和所述非通风区域完全遮挡所述通风孔的第二状态；
其中，所述导电区域位于所述开关条的非通风区域，当所述开关条置于第一状态时，所述导电区域与所述PCB板上的电源正极和负极电连接，给所述风扇提供第一驱动信号，使所述风扇运转。
结合第一方面的第二种可能的实现方式，在第三种可能的实现方式中，所述通风区域在所述PCB板上的投影覆盖所述通风孔在所述PCB板上的投影。
结合第一方面的第二种可能实现方式或第三种可能实现方式，在第四种可能的实现方式中，所述非通风区域还包括：绝缘区域，所述绝缘区域位于所述导电区域与所述通风区域之间，且包裹所述通风区域。
结合第一方面的第二种可能的实现方式至第四种可能的实现方式中的任一种可能的实现方式，在第五种可能的实现方式中，所述通风区域为贯穿所述开关条的通孔。
结合第一方面的第五种可能的实现方式，在第六种可能的实现方式中，所述电子产品还包括：位于所述开关条通风区域的防尘网，对经过所述通风区域的空气进行过滤。
结合第一方面的第六种可能实现方式，在第七种可能的实现方式中，所述防尘网与所述开关条的连接方式为固定粘接。
结合第一方面或第一方面的上述任一种可能的实现方式，在第八种可能的实现方式中，所述导电区域为导电铜片。
结合第一方面或第一方面的上述任一种可能的实现方式，在第九种可能的实现方式中，所述电子产品还包括：设置于所述PCB板上的热敏电阻以及设置于所述PCB板上的温度开关，其中，所述热敏电阻用于接收所述第一驱动信号，当接收到第一驱动信号时，检测所述电子产品的温度，并将其检测到的温度信号转换成电信号输出给温度开关，所述温度开关用于对所述热敏电阻输出的电信号进行判断，当其达到其预设值时，输出第二驱动信号给所述风扇，所述风扇在接收到第二驱动信号时开始运转。
结合第一方面或第一方面的上述任一种可能的实现方式，在第十种可能的实现方式中，所述电子产品还包括：与所述开关条固定连接的拨动开关，通过所述拨动开关实现所述开关条状态的转换。
与现有技术相比，上述技术方案具有以下优点：
本发明实施例所提供的电子产品，包括：壳体，所述壳体上设置有通风孔；位于所述壳体内的PCB板，所述PCB板上设置有电源正极和负极；位于所述PCB板与所述壳体之间的风扇，所述风扇在所述PCB板上的投影与所述通风孔在所述PCB板上的投影相交叠；位于所述风扇与所述壳体之间，与所述壳 体滑动连接的开关条，所述开关条包括：不完全遮挡所述通风孔的第一状态和完全遮挡所述通风孔的第二状态；其中，所述开关条包括导电区域，当所述开关条置于第一状态时，所述导电区域与所述PCB板上的电源正极和负极电连接，给所述风扇提供第一驱动信号，所述风扇开始运转。
由此可见，本发明实施例所提供的电子产品在工作时，可以将所述开关条置于第一状态，利用所述风扇通过设置于所述壳体上的通风孔进行主动散热，增强外界环境中空气与电子产品内部空气的热交换，以提高所述电子产品的散热效率，从而提高所述电子产品的可靠性，延长其使用寿命。
而且，本发明实施例所提供的电子产品在非工作时，可以将所述开关条置于第二状态，利用所述开关条对所述壳体上的通风孔进行遮挡，从而避免外界环境中的灰尘，通过所述壳体上的通风孔进入所述电子产品内部，影响所述电子产品的性能，缩短所述电子产品的使用寿命。
附图说明
图1为本发明一个实施例所提供的电子产品中，开关条置于第一状态时的结构示意图；
图2为本发明一个实施例所提供的电子产品中，壳体的外观结构示意图；
图3为本发明一个实施例所提供的电子产品中，PCB板的结构示意图；
图4为本发明图1所提供的电子产品中，开关条置于第二状态时的结构示意图；
图5为本发明一个实施例所提供的电子产品中，开关条的俯视图；
图6为本发明另一个实施例所提供的电子产品中，开关条的俯视图；
图7为本发明图6所提供的电子产品中，开关条置于第一状态时的结构示意图；
图8为本发明图6所提供的电子产品中，开关条置于第二状态时的结构示意图；
图9为本发明又一个实施例所提供的电子产品中，开关条的俯视图；
图10为本发明又一个实施例所提供的电子产品中，开关条置于第一状态的结构示意图；
图11为本发明图10所提供的电子产品中，开关条置于第二状态的结构示意图；
图12为本发明再一个实施例所提供的电子产品中，开关条置于第一状态的结构示意图；
图13为本发明又一个实施例所提供的电子产品的工作原理示意图；
图14为本发明再一个实施例所提供的电子产品的局部结构示意图。
具体实施方式
正如背景技术部分所述，现有技术中的电子产品主要利用自然散热的方式进行散热，但是这种散热方式的散热效率较低，导致利用这种散热方式散热的电子产品的可靠性较低，使用寿命较短。
有鉴于此，本发明实施例提供了一种电子产品，包括：
壳体，所述壳体上设置有通风孔；
位于所述壳体内的PCB板，所述PCB板上设置有电源正极和负极；
位于所述PCB板与所述壳体之间的风扇，所述风扇在所述PCB板上的投 影与所述通风孔在所述PCB板上的投影相交叠；
位于所述风扇与所述壳体之间，与所述壳体滑动连接的开关条，所述开关条包括：不完全遮挡所述通风孔的第一状态和完全遮挡所述通风孔的第二状态；
其中，所述开关条包括导电区域，当所述开关条置于第一状态时，所述导电区域与所述PCB板上的电源正极和负极电连接，给所述风扇提供第一驱动信号，所述风扇开始运转。
由此可见，本发明实施例所提供的电子产品在工作时，可以将所述开关条置于第一状态，利用所述风扇通过设置于所述壳体上的通风孔进行主动散热，增强外界环境中空气与电子产品内部空气的热交换，以提高所述电子产品的散热效率，从而提高所述电子产品的可靠性，延长其使用寿命。
而且，本发明实施例所提供的电子产品在非工作时，可以将所述开关条置于第二状态，利用所述开关条对所述壳体上的通风孔进行遮挡，从而避免外界环境中的灰尘，通过所述壳体上的通风孔进入所述电子产品内部，影响所述电子产品的性能，缩短所述电子产品的使用寿命。
为使本发明的上述目的、特征和优点能够更为明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。
在以下描述中阐述了具体细节以便于充分理解本发明。但是本发明能够以多种不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本发明内涵的情况下做类似推广。因此本发明不受下面公开的具体实施的限制。
如图1所示，本发明实施例提供了一种电子产品，包括：
壳体1，如图2所示，所述壳体1上设置有通风孔11，以便外界环境中的空气可以通过所述通风孔11进入所述电子产品的壳体1内部，与所述壳体1内部的空气进行热交换。
位于所述壳体1内的PCB板2，如图3所示，所述PCB板2上设置有电源正极21和负极22。优选的，电源正极21和负极22可以采用弹簧片的形式固定在所述PCB板2上。
位于所述PCB板2与所述壳体1之间的风扇3，以便于在所述电子产品工作时，利用所述风扇3通过设置于所述壳体1上的通风孔11进行主动散热，增强外界环境中空气与电子产品内部空气的热交换，以提高所述电子产品的散热效率，从而提高所述电子产品的可靠性，延长其使用寿命。其中，所述风扇3在所述PCB板2上的投影与所述通风孔11在所述PCB板2上的投影相交叠，以便于利用所述风扇3产生的空气流动可以通过所述壳体1上的通风孔11进入外界环境中，进一步提高所述电子产品的散热效率。优选的，所述风扇3为微型风扇，但本发明具体并不做限定，具体视所述电子产品的尺寸和散热性能要求而定。
位于所述风扇3与所述壳体1之间，与所述壳体1滑动连接的开关条4，所述开关条4包括：不完全遮挡所述通风孔11的第一状态(如图1所示)和完全遮挡所述通风孔11的第二状态(如图4所示)。其中，所述开关条4包括导电区域，当所述开关条4置于第一状态时，所述导电区域与所述PCB板2上的电源正极21和负极22电连接，使所述电源正极21和负极22导通，从而给所述风扇3提供第一驱动信号，使所述风扇3运转。当所述开关条4置于第 二状态时，所述开关条4的导电区域与电源正极21和负极22断开连接，所以电源正极21和负极22处于开路状态，使所述风扇3停止运转。
在本发明的一个实施例中，所述开关条4为一整面不透风区域，如图5所示，在本发明的另一个实施例中，所述开关条4包括通风区域41和包裹所述通风区域41的非通风区域42，如图6所示，本发明对此并不做限定，具体视情况而定。
需要说明的是，当所述开关条4包括通风区域41和包裹所述通风区域41的非通风区域42时，所述开关条4包括：所述通风区域41正对所述通风孔11的第一状态(如图7所示)和所述非通风区域42完全遮挡所述通风孔11的第二状态(如图8所示)。在本实施例的一个优选实施例中，如图9所示，所述导电区域421位于所述非通风区域42，当所述开关条4置于第一状态时，所述导电区域421与所述PCB板2上的电源正极21和负极22电连接(如图10所示)，使所述电源正极21和负极22导通，从而给所述风扇3提供第一驱动信号，使所述风扇3运转。当所述开关条4置于第二状态时，所述开关条4的导电区域421与电源正极21和负极22断开连接(如图11所示)，所以电源正极21和负极22处于开路状态，使所述风扇3停止运转。
由此可见，本发明实施例只有在所述电子产品工作时，将所述开关条4置于第一状态，所述风扇3才可以通过所述壳体1上的通风孔11进行主动散热，而当所述电子产品不工作时，所述开关条4置于第二状态，所述风扇3不工作，以降低所述电子产品的电能损耗，而且还可以利用所述开关条4对所述壳体1上的通风孔11进行遮挡，从而避免外界环境中的灰尘，通过所述壳体1上的通风孔11进入所述电子产品内部，影响所述电子产品的性能，缩短 所述电子产品的使用寿命。
优选的，在本发明的一个实施例中，所述风扇3在所述PCB板2上的投影位于所述通风孔11在所述PCB板2上的投影范围内，以便于利用所述风扇3产生的空气流动大部分都可以通过所述壳体1上的通风孔11进入外界环境中，提高所述电子产品的散热效率。更优选的，所述风扇3在所述PCB板2上的投影与所述通风孔11在所述PCB板2上的投影重合，以充分利用所述通风孔11与所述风扇3的有效面积，最大限度的提高散热效率。
在上述任一实施例的基础上，在本发明的一个实施例中，所述通风区域41在所述PCB板2上的投影覆盖所述通风孔11在所述PCB板2上的投影，以便于利用所述风扇3产生的空气流动可以最大限度的通过所述通风区域41进入所述通风孔11，再通过所述通风孔11进入外界环境中，与外界环境中的空气进行热交换。
优选的，所述通风区域41在所述PCB板2上的投影与所述通风孔11在所述PCB板2上的投影重合，但本发明对此并不做限定，具体视情况而定。
在上述任一实施例的基础上，在本发明的另一个实施例中，如图10和图11所示，所述非通风区域42还包括：绝缘区域422，所述绝缘区域422位于所述导电区域421与所述通风区域41之间，且包裹所述通风区域41。优选的，所述导电区域421为导电铜片，但本发明对此并不做限定，只要由导电材质制作而成即可。需要说明的是，所述通风区域41可以由设置于所述绝缘区域422中的多个网孔构成，也可以为设置于所述绝缘区域422内的一个通孔，即所述通风区域41为贯穿所述开关条4的通孔，但本发明对此并不做限定，具体视情况而定。
优选的，所述通风区域41为设置于所述绝缘区域422内的一个通孔，所述通孔的面积与所述通风孔11的面积相匹配，以保证散热效率。在本实施例的基础上，在本发明的又一个实施例中，如图12所示，所述电子产品还包括：位于所述开关条4通风区域41的防尘网5，对经过所述通风区域41的空气进行过滤，以便于在所述电子产品利用所述风扇3进行散热的过程中，即所述开关条4置于第一状态时，避免外界环境中的灰尘一次通过所述壳体1上的通风孔11和所述开关条4上的通孔，进入所述电子产品内部，影响所述电子产品的可靠性，缩短所述电子产品的使用寿命。
优选的，在本发明的一个具体实施例中，所述防尘网5与所述开关条4的连接方式为固定粘接，但本发明对此并不做限定，具体视情况而定。
在上述任一实施例的基础上，在本发明的一个实施例中，所述风扇3的工作状态仅由开关条4的状态决定，即当所述开关条4置于第一状态时，所述开关条4的导电区域421电连接所述PCB板2上电源的正极21和负极22，所述风扇3即开始运转；当所述开关条4置于第二状态时，所述开关条4的导电区域421不电连接所述PCB板2上的电源的正极21和负极22，所述风扇3即停止运转。
在本发明的另一个实施例中，所述电子产品还包括：设置于所述PCB板2上的热敏电阻以及设置于所述PCB板2上的温度开关，如图13所示，所述热敏电阻23用于接收所述第一驱动信号，当接收到第一驱动信号时，检测所述电子产品的温度，并将其检测到的温度信号转换成电信号输出给温度开关24，所述温度开关24用于对所述热敏电阻23输出的电信号进行判断，当其达到其预设值时，输出第二驱动信号给所述风扇3，所述风扇3在接收到第二驱 动信号时开始运转。
在该实施例中，所述风扇3的工作状态由所述开关条4和所述温度开关24共同决定。当所述开关条4置于第一状态时，所述开关条4的导电区域421电连接所述PCB板2上电源的正极21和负极22，输出第一驱动信号，所述热敏电阻23接收所述第一驱动信号，并在接收到第一驱动信号时，也即当所述开关条4置于第一状态时，开始对所述电子产品的温度进行检测，然后将其检测到的温度信号转换成电信号，输出给温度开关24；所述温度开关24对其接收到的信号(即所述热敏电阻23输出的电信号)进行判断，判断其接收到的信号是否达到预设值。当所述温度开关24接收到的信号达到预设值时，所述温度开关24输出第二驱动信号给所述风扇3，所述风扇3开始运转；当所述温度开关24接收到的信号未达到预设值时，所述温度开关24不输出第二驱动信号给所述风扇3，所述风扇3不运转。
由此可见，本发明实施例所提供的电子产品，只有当所述电子产品的温度达到一定值时，才利用所述风扇3进行主动散热，当所述电子产品的温度未达到一定值时，即所述电子产品的温度较低时，不利用所述风扇3进行主动散热，而是利用所述壳体1上的通风孔11进行自然散热，以降低所述电子产品的电能损耗，同时减少外界环境中的灰尘在所述风扇3作用下的被动吸入量，减弱灰尘对所述电子产品性能的影响，延长所述电子产品的使用寿命。
需要说明的是，在本发明实施例中，当所述开关条4置于第一状态时，所述热敏电阻23或实时检测所述电子产品的温度，或以预设时间间隔检测所述电子产品的温度，以进一步降低所述电子产品的电能损耗，本发明对此并不做限定，具体视情况而定。
还需要说明的是，在上述实施例中，本发明实施例对所述预设值的具体数值并不做限定，具体视所述电子产品的热量损耗及其性能要求而定。
在上述任一实施例的基础上，所述开关条4在第一状态和第二状态之间的切换可以自动控制，也可以人为控制，本发明对此并不做限定，具体视情况而定。
在本发明的一个实施例中，当所述开关条4在第一状态和第二状态之间的切换由自动控制实现时，所述开关条4的工作状态优选由所述电子产品的电源开关进行控制，即当所述电子产品的电源开关打开时，所述开关条4即置于第一状态，当所述电子产品的电源开关关闭时，所述开关条4即置于第二状态。
在本发明的另一个实施例中，当所述开关条4在第一状态和第二状态之间的切换由人为控制实现时，在本实施例中，如图14所示，所述电子产品优选为还包括：与所述开关条4固定连接的拨动开关6，从而可以通过所述拨动开关6实现所述开关条4状态的转换。
在上述任一实施例的基础上，在本发明的一个实施例中，所述壳体1上的通风孔11可以为一个贯穿所述壳体1的通孔，也可以由多个贯穿所述壳体1的网孔构成，本发明对此并不做限定，具体视情况而定。需要说明的是，当所述壳体1上的通风孔11可以为一个贯穿所述壳体1的通孔时，在本发明的另一个实施例中，所述电子产品还包括：设置与所述通风孔11处的防尘网，以便于对经过所述孔11的空气进行过滤，但本发明对此也不做限定，具体视情况而定。
还需要说明的是，在上述任一实施例中，所述壳体1上通风孔11的垂直于所述PCB板2至所述壳体1方向上截面的形状可以为圆形，也可以为椭圆 形或其他任意形状，本发明对此并不做限定，具体视情况而定。同理，本发明实施例对所述开关条4上通孔的形状也不做限定，只要其与所述壳体1上通风孔11的形状相匹配即可。
综上所述，本发明实施例所提供的电子产品，包括：壳体1，所述壳体1上设置有通风孔11；位于所述壳体1内的PCB板2，所述PCB板2上设置有电源正极21和负极22；位于所述PCB板2与所述壳体1之间的风扇3；位于所述风扇3与所述壳体1之间，与所述壳体1滑动连接的开关条4，所述开关条4包括：不完全遮挡所述通风孔11的第一状态和完全遮挡所述通风孔11的第二状态；其中，所述开关条4包括导电区域，当所述开关条4置于第一状态时，所述导电区域与所述PCB板2上的电源正极21和负极22电连接，给所述风扇3提供第一驱动信号，所述风扇3开始运转，从而使得本发明实施例所提供的电子产品在工作时，可以将所述开关条4置于第一状态，利用所述风扇3通过设置于所述壳体1上的通风孔11进行主动散热，增强外界环境中空气与电子产品内部空气的热交换，以提高所述电子产品的散热效率，从而提高所述电子产品的可靠性，延长其使用寿命。
而且，本发明实施例所提供的电子产品在非工作时，可以将所述开关条4置于第二状态，利用所述开关条4中对所述壳体1上的通风孔11进行遮挡，从而避免外界环境中的灰尘，通过所述壳体1上的通风孔11进入所述电子产品内部，影响所述电子产品的性能，缩短所述电子产品的使用寿命。
本说明书中各个部分采用递进的方式描述，每个部分重点说明的都是与其 他部分的不同之处，各个部分之间相同相似部分互相参见即可。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (11)

  1. 一种电子产品，其特征在于，包括：
    壳体，所述壳体上设置有通风孔；
    位于所述壳体内的PCB板，所述PCB板上设置有电源正极和负极；
    位于所述PCB板与所述壳体之间的风扇，所述风扇在所述PCB板上的投影与所述通风孔在所述PCB板的投影相交叠；
    位于所述风扇与所述壳体之间，与所述壳体滑动连接的开关条，所述开关条包括：不完全遮挡所述通风孔的第一状态和完全遮挡所述通风孔的第二状态；
    其中，所述开关条包括导电区域，当所述开关条置于第一状态时，所述导电区域与所述PCB板上的电源正极和负极电连接，给所述风扇提供第一驱动信号，使所述风扇运转。
  2. 根据权利要求1所述的电子产品，其特征在于，所述风扇在所述PCB板上的投影与所述通风孔在所述PCB板上的投影重合。
  3. 根据权利要求1或2所述的电子产品，其特征在于，所述开关条包括通风区域和包裹所述通风区域的非通风区域，所述开关条包括：所述通风区域正对所述通风孔的第一状态和所述非通风区域完全遮挡所述通风孔的第二状态；
    其中，所述导电区域位于所述开关条的非通风区域，当所述开关条置于第一状态时，所述导电区域与所述PCB板上的电源正极和负极电连接，给所述风扇提供第一驱动信号，使所述风扇运转。
  4. 根据权利要求3所述的电子产品，其特征在于，所述通风区域在所述 PCB板上的投影覆盖所述通风孔在所述PCB板上的投影。
  5. 根据权利要求3或4所述的电子产品，其特征在于，所述非通风区域还包括：绝缘区域，所述绝缘区域位于所述导电区域与所述通风区域之间，且包裹所述通风区域。
  6. 根据权利要求3-5任一项所述的电子产品，其特征在于，所述通风区域为贯穿所述开关条的通孔。
  7. 根据权利要求6所述的电子产品，其特征在于，所述电子产品还包括：位于所述开关条通风区域的防尘网，对经过所述通风区域的空气进行过滤。
  8. 根据权利要求7所述的电子产品，其特征在于，所述防尘网与所述开关条的连接方式为固定粘接。
  9. 根据权利要求1-8任一项所述的电子产品，其特征在于，所述导电区域为导电铜片。
  10. 根据权利要求1-9任一项所述的电子产品，其特征在于，所述电子产品还包括：设置于所述PCB板上的热敏电阻以及设置于所述PCB板上的温度开关，其中，所述热敏电阻用于接收所述第一驱动信号，当接收到第一驱动信号时，检测所述电子产品的温度，并将其检测到的温度信号转换成电信号输出给温度开关，所述温度开关用于对所述热敏电阻输出的电信号进行判断，当其达到其预设值时，输出第二驱动信号给所述风扇，所述风扇在接收到第二驱动信号时开始运转。
  11. 根据权利要求1-10任一项所述的电子产品，其特征在于，所述电子产品还包括：与所述开关条固定连接的拨动开关，通过所述拨动开关实现所述开关条状态的转换。
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