WO2016027777A1 - 接合構造体の製造方法および接合構造体 - Google Patents

接合構造体の製造方法および接合構造体 Download PDF

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Publication number
WO2016027777A1
WO2016027777A1 PCT/JP2015/073042 JP2015073042W WO2016027777A1 WO 2016027777 A1 WO2016027777 A1 WO 2016027777A1 JP 2015073042 W JP2015073042 W JP 2015073042W WO 2016027777 A1 WO2016027777 A1 WO 2016027777A1
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Prior art keywords
laser
perforated
manufacturing
joined
pulse
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PCT/JP2015/073042
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English (en)
French (fr)
Inventor
和義 西川
彰朗 角谷
聡 廣野
博田　知之
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オムロン株式会社
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Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to US15/327,380 priority Critical patent/US20180207847A1/en
Priority to CN201580040009.8A priority patent/CN106573342A/zh
Priority to EP15833742.8A priority patent/EP3184233B1/en
Priority to KR1020177001689A priority patent/KR101893073B1/ko
Publication of WO2016027777A1 publication Critical patent/WO2016027777A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0078—Measures or configurations for obtaining anchoring effects in the contact areas between layers
    • B29C37/0082—Mechanical anchoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K26/20—Bonding
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • B29C66/73941—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset characterised by the materials of both parts being thermosets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7422—Aluminium or alloys of aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7428—Transition metals or their alloys
    • B29C66/74281—Copper or alloys of copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7428—Transition metals or their alloys
    • B29C66/74283—Iron or alloys of iron, e.g. steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
    • B29K2067/006—PBT, i.e. polybutylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B29K2705/08—Transition metals
    • B29K2705/12—Iron

Definitions

  • the present invention relates to a method for manufacturing a bonded structure and a bonded structure.
  • Patent Document 1 discloses a joining method in which a dissimilar material such as a resin is joined to a metal material. Specifically, a laser scanning process is performed in a cross shape on the surface of the metal material, whereby a large number of protrusions (uneven portions) are formed on the surface. And when a dissimilar material is joined to the metal material on which the protrusions are formed, the dissimilar material enters the concave portion, so that the anchor effect is exhibited, so that the joining strength between the metal material and the dissimilar material is improved. Is done.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a bonded structure and a bonded structure capable of improving the bonding strength. .
  • a method for manufacturing a bonded structure according to the present invention is a method for manufacturing a bonded structure in which a first member and a second member are bonded, and a laser in which one pulse is composed of a plurality of sub-pulses is applied to the surface of the first member. Irradiation includes a step of forming a perforated portion having an opening on the surface of the first member, and a step of filling the second member into the perforated portion of the first member and solidifying the second member.
  • the perforated portion can be deepened with respect to the opening diameter of the surface by forming the perforated portion with a laser in which one pulse is composed of a plurality of sub-pulses, so that the bonding strength can be improved. Can be planned.
  • a protruding portion protruding inward may be formed on the inner peripheral surface of the perforated portion.
  • the first member may be a metal, a thermoplastic resin, or a thermosetting resin.
  • the second member may be a thermoplastic resin or a thermosetting resin.
  • one period of the sub-pulse may be 15 ns or less.
  • the number of subpulses per pulse may be 2 or more and 50 or less.
  • the bonded structure according to the present invention is manufactured by any one of the above-described bonded structure manufacturing methods.
  • the perforated portion can be deepened with respect to the opening diameter of the surface by forming the perforated portion with a laser in which one pulse is composed of a plurality of sub-pulses, so that the bonding strength can be improved. Can be planned.
  • FIG. 1 It is a schematic diagram of the cross section of the joining structure body by 1st Embodiment of this invention. It is a figure for demonstrating the manufacturing method of the joining structure of FIG. 1, Comprising: It is the schematic diagram which showed the state in which the perforated part was formed in the 1st member. It is a schematic diagram of the cross section of the joining structure body by 2nd Embodiment of this invention. It is a figure for demonstrating the manufacturing method of the joining structure of FIG. 3, Comprising: It is the schematic diagram which showed the state in which the perforated part was formed in the 1st member. It is the perspective view which showed the state by which the 1st member of an Example was processed with a laser. It is the perspective view which showed the joining structure of the Example.
  • the joined structure 100 is obtained by joining a first member 10 and a second member 20 made of different materials.
  • a perforated part 11 having an opening is formed on the surface 13 of the first member 10, and a projecting part 12 projecting inward is formed on the inner peripheral surface of the perforated part 11.
  • the second member 20 is filled in the perforated part 11 of the first member 10 and solidified.
  • FIG. 1 is a diagram schematically showing an enlarged joining interface between the first member 10 and the second member 20, and a plurality of perforated portions 11 are actually provided. In FIG. Only shown.
  • the material of the first member 10 is a metal, a thermoplastic resin, or a thermosetting resin
  • the material of the second member 20 is a thermoplastic resin or a thermosetting resin.
  • the metal examples include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof.
  • a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.
  • thermoplastic resin examples include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile styrene), ABS (acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP (Polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF ( Polysulfone), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyethersulfone), PEEK (polyetheretherketone), P I (polyamideimide), LCP (liquid crystal polymer), PVDC (polyvinylidene chloride), PTFE (polyteth
  • TPE thermoplastic elastomer
  • examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.
  • thermosetting resin examples include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone).
  • EP epoxy
  • PUR polyurethane
  • UF urea formaldehyde
  • MF melamine formaldehyde
  • PF phenol formaldehyde
  • UP unsaturated polyester
  • SI silicone
  • FRP fiber reinforced plastic
  • a filler may be added to the above-described thermoplastic resin and thermosetting resin.
  • the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.
  • the perforated part 11 is a substantially circular non-through hole when seen in a plan view, and a plurality of perforated parts 11 are formed on the surface 13 of the first member 10.
  • the opening diameter R1 of the surface 13 of the perforated part 11 is preferably 30 ⁇ m or more and 100 ⁇ m or less. This is because when the opening diameter R1 is less than 30 ⁇ m, the filling property of the second member 20 is deteriorated and the anchor effect may be reduced. On the other hand, when the opening diameter R1 exceeds 100 ⁇ m, the number of the perforated portions 11 per unit area is reduced, and the anchor effect may be lowered.
  • the interval between the perforated parts 11 is preferably 200 ⁇ m or less. This is because when the interval between the perforated portions 11 exceeds 200 ⁇ m, the number of the perforated portions 11 per unit area decreases, and the anchor effect may be reduced.
  • interval of the punching part 11 it is the distance which the punching part 11 does not overlap and crush.
  • interval of the perforated part 11 is the same. This is because the joint strength in the shear direction becomes isotropic when the perforated portions 11 are equally spaced.
  • the perforated part 11 of the first embodiment includes an enlarged diameter part 111 whose opening diameter increases from the surface 13 side toward the bottom part 113 in the depth direction (Z direction), and a bottom part from the surface 13 side in the depth direction. It is formed so that the reduced diameter portion 112 whose opening diameter becomes smaller toward 113 is connected.
  • the enlarged diameter portion 111 is formed so as to increase in diameter in a curved shape, and the reduced diameter portion 112 is formed so as to reduce in diameter in a curved shape.
  • the enlarged diameter portion 111 is disposed on the surface 13 side, and the reduced diameter portion 112 is disposed on the bottom 113 side.
  • the opening diameter (inner diameter) R2 of the boundary part between the enlarged diameter part 111 and the reduced diameter part 112 is the largest, and the opening diameter R1 is smaller than the opening diameter R2.
  • the protrusion part 12 is arrange
  • This protrusion 12 is formed over the entire length in the circumferential direction, for example, and is formed in an annular shape.
  • the perforated portion 11 is formed by irradiating a processing laser.
  • a processing laser As the type of laser, a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected from the viewpoint of enabling pulse oscillation, and considering the laser wavelength, a fiber laser, a YAG laser, a YAG The second harmonic of the laser, YVO 4 laser, and semiconductor laser are preferred.
  • the laser output is set in consideration of the laser irradiation diameter, the type of material of the first member 10, the shape (for example, thickness) of the first member 10, and the like.
  • the output upper limit of the laser is preferably 40W. This is because when the laser output exceeds 40 W, the energy is large and it is difficult to form the perforated part 11 having the protruding part 12.
  • the perforated part 11 is formed by irradiating a laser in which one pulse is composed of a plurality of sub-pulses.
  • a laser As an example of an apparatus for emitting such a laser, OMRON fiber laser marker MX-Z2000 or MX-Z2050 can be cited.
  • the first member 10 is irradiated with a laser, the first member 10 is locally melted so that the formation of the perforated part 11 proceeds.
  • the laser is composed of a plurality of sub-pulses, the melted first member 10 is not easily scattered and easily deposited in the vicinity of the perforated portion 11.
  • the melted first member 10 is deposited inside the perforated part 11, thereby forming the protruding part 12.
  • the reflected portion of the laser is confined inside the perforated portion 11 by the protruding portion 12, and the processing by the laser proceeds in the depth direction. That is, it is easy to concentrate the laser energy in the depth direction.
  • the depth becomes larger than the opening diameter R1 on the surface.
  • the laser irradiation direction is, for example, a direction perpendicular to the surface 13, and the axis of the perforated part 11 is perpendicular to the surface 13.
  • the depth of the perforated portion 11 can be increased with respect to the surface opening diameter R1, so that the anchor effect is increased and the bonding strength is increased. Can be improved. Furthermore, even if the peeling stress resulting from the linear expansion coefficient difference of the 1st member 10 and the 2nd member 20 generate
  • one period of the subpulse is 15 ns or less. This is because if one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it becomes difficult to form the perforated part 11 having the protruding part 12.
  • one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.
  • the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because if the number of subpulses exceeds 50, the output per unit of subpulses becomes small, and it becomes difficult to form the perforated part 11 having the protruding parts 12.
  • the 2nd member 20 is joined to the surface 13 of the 1st member 10 in which the perforated part 11 was formed.
  • the second member 20 is joined to the first member 10 by, for example, injection molding, hot plate welding, laser welding, cast hardening, ultrasonic welding, or vibration welding. Thereby, the 2nd member 20 is solidified in the state with which the perforated part 11 was filled.
  • Such a bonded structure 100 is applicable, for example, when a resin cover (not shown) is bonded to a metal case (not shown) of a photoelectric sensor.
  • the metal case corresponds to the first member 10
  • the resin cover corresponds to the second member 20.
  • the perforated portion 11 is formed on the surface 13 of the first member 10
  • a protruding portion 12 is formed on the inner peripheral surface of the perforated portion 11.
  • the second member 20 is filled in the perforated portion 11 of the first member 10 and the second member 20 is solidified. Thereby, the 1st member 10 and the 2nd member 20 are joined, and joined structure 100 (refer to Drawing 1) is formed.
  • the second member 20 is joined by, for example, injection molding, hot plate welding, laser welding, cast hardening, ultrasonic welding, or vibration welding.
  • the joined structure 200 is obtained by joining the first member 30 and the second member 20 made of different materials.
  • a perforated part 31 having an opening is formed on the surface 33 of the first member 30, and a projecting part 32 projecting inward is formed on the inner peripheral surface of the perforated part 31.
  • the perforated portion 31 of the first member 30 is filled with the second member 20 and solidified.
  • the perforated part 31 of the second embodiment has a reduced diameter part 311 in which the opening diameter decreases from the surface 33 side toward the bottom part 314 in the depth direction (Z direction), and from the surface 33 side toward the bottom part 314 in the depth direction.
  • the enlarged diameter portion 312 having a larger opening diameter and the reduced diameter portion 313 having a smaller opening diameter from the surface 33 side toward the bottom portion 314 in the depth direction are connected.
  • the reduced diameter portion 311 is formed to linearly reduce the diameter
  • the enlarged diameter portion 312 is formed to increase in a curved shape
  • the reduced diameter portion 313 is formed to reduce in a curved shape. ing.
  • the diameter-reduced part 311, diameter-expanded part 312 and diameter-reduced part 313 are arrange
  • the opening diameter (inner diameter) R4 of the boundary part between the reduced diameter part 311 and the enlarged diameter part 312 is the opening diameter R3 of the surface 33 and the enlarged diameter part 312 and the reduced diameter part 313. It is smaller than the opening diameter R5 of the boundary portion.
  • the protrusion part 32 is arrange
  • the protrusion 32 is formed over the entire length in the circumferential direction, and is formed in an annular shape.
  • the other configuration of the first member 30 is the same as that of the first member 10 described above.
  • the perforated part 31 is formed on the surface 33 of the first member 30.
  • a protruding portion 32 is formed on the inner peripheral surface of the perforated portion 31.
  • the protruding portion 32 is disposed at a position where it enters the bottom portion 314 side.
  • Such a difference may be caused by, for example, the material of the first member 30 or laser irradiation conditions. Due to such differences.
  • the second member 20 is filled in the perforated part 31 of the first member 30, and the second member 20 is solidified. Thereby, the 1st member 30 and the 2nd member 20 are joined, and joined structure 200 (refer to Drawing 3) is formed.
  • the second member 20 is joined by, for example, injection molding, hot plate welding, laser welding, cast hardening, ultrasonic welding, or vibration welding.
  • Example 1 In Experimental Example 1, a bonded structure 500 (see FIG. 6) according to Examples 1 to 4 corresponding to the second embodiment and a bonded structure according to Comparative Example 1 were produced, and bonding evaluation was performed on each. . In addition, as joint evaluation, while joining strength was measured about the thing which has not performed the thermal shock test, joining strength was measured about the thing after a thermal shock test, and the pass / fail determination was performed based on the measurement result. The results are shown in Table 1.
  • the first member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • a laser is irradiated to a predetermined region R on the surface of the first member 501.
  • the predetermined region R is an area where the bonded structure 500 is bonded, and is 12.5 mm ⁇ 20 mm.
  • the laser irradiation conditions common to Examples 1 to 4 are as follows.
  • Example 1 Laser: Fiber laser (wavelength 1062nm) Frequency: 10kHz Output: 3.8W Scanning speed: 650mm / sec Number of scans: 20 times Irradiation interval: 65 ⁇ m
  • the number of subpulses was set to 20, and one period of the subpulses was set to 15.0 ns.
  • Example 2 the number of subpulses was set to 2, and one period of the subpulses was set to 15.0 ns.
  • Example 3 the number of subpulses was set to 20, and one period of the subpulses was set to 10.5 ns.
  • Example 4 the number of subpulses was set to 50, and one period of the subpulses was set to 15.0 ns.
  • the frequency is a pulse frequency composed of a plurality of sub-pulses. That is, under this irradiation condition, laser (pulse) is irradiated 10,000 times at an interval of 65 ⁇ m while moving 650 mm per second, and the pulse is composed of a plurality of subpulses. Note that the number of scans is the number of times the laser is repeatedly irradiated to the same location.
  • the irradiation time for one subpulse is 7.5 ns
  • the subpulse irradiation interval is 7.5 ns.
  • the irradiation time for one sub-pulse is 3 ns
  • the sub-pulse irradiation interval is 7.5 ns.
  • a perforated part is formed in the predetermined region R on the surface of the first member 501, and a protruding part is formed in the perforated part.
  • the 2nd member 502 was joined to the surface of the 1st member 501 by insert molding.
  • PBT Japanese trademark
  • J35EL3 made from Japan Steel Works was used for the molding machine. The molding conditions are as follows.
  • the second member 502 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
  • the same materials as in Examples 1 to 4 were used as the materials for the first member and the second member, and the molding conditions were set to be the same.
  • the perforated part was formed using the fiber laser without a pulse control function. That is, a perforated part was formed by irradiating a laser (single pulse) in which one pulse is not composed of a plurality of subpulses. For this reason, a mortar-shaped (conical) perforated portion was formed in the first member of Comparative Example 1.
  • the bonding strength was measured using an electromechanical universal testing machine 5900 manufactured by Instron. Specifically, the test was performed at a tensile speed of 5 mm / min in the shear direction, and the test was terminated when the second member broke or the joint interface broke. And the maximum intensity
  • thermal shock test was performed using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, low temperature exposure at ⁇ 40 ° C. for 30 minutes and high temperature exposure at 85 ° C. for 30 minutes were repeated 100 times.
  • the bonding structures 500 of Examples 1 to 4 had higher bonding strength before and after the thermal shock test than the bonding structure of Comparative Example 1. This is considered to be because, in the joint structures 500 of Examples 1 to 4, the anchor effect was increased and the joint strength was improved because the depth of the perforated part was larger than the opening diameter of the surface.
  • the bonding strength before the thermal shock test can be maintained at 90% or more even after the thermal shock test.
  • the joint structure of Comparative Example 1 the joint strength is greatly reduced after the thermal shock test. Therefore, as in the bonded structure 500 of the first to fourth embodiments, by forming a deep perforated portion with a laser in which one pulse is composed of a plurality of subpulses, it is possible to improve durability in a thermal cycle environment. did it.
  • Experimental Example 2 the material of the first member was changed from Experimental Example 1. Specifically, in the joint structure of Experimental Example 2, PPS (Fortron (registered trademark) 1140 made of Polyplastics) was used as the material of the first member. In addition, with the change in the material of the first member, the laser irradiation conditions common to Examples 5 to 8 were set as follows.
  • Example 5 Laser: Fiber laser (wavelength 1062nm) Frequency: 10kHz Output: 1.1W Scanning speed: 650mm / sec Number of scans: 3 times Irradiation interval: 65 ⁇ m Further, as shown in Table 2, in Example 5, the number of subpulses was set to 20, and one period of the subpulses was set to 15.0 ns. In Example 6, the number of subpulses was set to 2, and one subpulse period was set to 15.0 ns. In Example 7, the number of subpulses was set to 20, and one period of the subpulses was set to 10.5 ns. In Example 8, the number of subpulses was set to 50, and one period of the subpulses was set to 15.0 ns.
  • the depth of the perforated part was larger than the opening diameter of the surface as compared with the joined structure of Comparative Example 2. This is because, in the bonded structures of Examples 5 to 8, a projection is formed in the perforated portion by irradiating a laser in which one pulse is composed of a plurality of subpulses, so that the reflected wave of the laser This is because the laser beam is confined inside, and laser processing proceeds in the depth direction.
  • the bonding structures of Examples 5 to 8 had higher bonding strength before and after the thermal shock test than the bonding structure of Comparative Example 2. This is presumably because, in the bonded structures of Examples 5 to 8, the anchor effect was increased and the bonding strength was improved because the depth of the perforated part was larger than the opening diameter of the surface.
  • the bonding strength before the thermal shock test can be maintained at 90% or more even after the thermal shock test.
  • the joint strength is significantly reduced after the thermal shock test.
  • PPS which is a resin
  • the surface 13 may be flat or curved.
  • the enlarged diameter portion 111 and the reduced diameter portion 112 are formed to be continuous.
  • the present invention is not limited to this, and the depth direction is provided between the enlarged diameter portion and the reduced diameter portion.
  • a straight extending portion may be formed. The same applies to the second embodiment.
  • the present invention is not limited to this, and the opening of the perforated part 11 is not limited to the first member 10a according to the first modification shown in FIG.
  • a bulging portion 14 that bulges upward from the surface 13 may be formed around.
  • the raised portion 14 is formed so as to surround the perforated portion 11 and is formed in a substantially circular shape when seen in a plan view.
  • the raised portion 14 is formed, for example, by depositing the melted first member 10a when a laser in which one pulse is composed of a plurality of sub-pulses is irradiated. If comprised in this way, since the anchor effect will generate
  • the present invention is not limited to this, as in the first member 10b according to the second modification shown in FIG.
  • the shaft center of the perforated part 11 b may be formed so as to be inclined with respect to the surface 13.
  • a protruding portion 12b protruding inward is formed on the inner peripheral surface of the perforated portion 11b.
  • the perforated part 11b is formed, for example, by making the laser irradiation direction oblique to the surface 13 (45 ° or more and less than 90 °). Thereby, even if the obstacle at the time of irradiating a laser exists above the area
  • the present invention is not limited to this, and the first member 10c according to the third modification shown in FIG.
  • a plurality of protruding portions 121c and 122c may be formed on the portion 11c.
  • This perforated part 11c can be formed, for example, by changing the laser output condition and irradiating the same part with the laser. If comprised in this way, while the surface area of the piercing
  • one perforated part 11d may be formed by multiple times of laser irradiation with different positions. That is, one perforated part 11d may be formed by overlapping a part of the perforated part formed by laser irradiation. A protruding portion 12d protruding inward is formed on the inner peripheral surface of the perforated portion 11d.
  • the first to fourth modifications described above may be combined as appropriate.
  • the present invention is applicable to a method for manufacturing a joined structure in which a first member and a second member made of different materials are joined, and a joined structure.

Abstract

　接合構造体（１００，２００）の製造方法は、第１部材（１０，１０ａ，１０ｂ，１０ｃ，１０ｄ，３０）と第２部材（２０）とが接合された接合構造体（１００，２００）の製造方法であり、１パルスが複数のサブパルスで構成されたレーザを第１部材（１０，１０ａ，１０ｂ，１０ｃ，１０ｄ，３０）の表面（１３）に照射することにより、開口を有する穿孔部（１１，１１ｂ，１１ｃ，１１ｄ，３１）を第１部材（１０，１０ａ，１０ｂ，１０ｃ，１０ｄ，３０）の表面（１３）に形成する工程と、第１部材（１０，１０ａ，１０ｂ，１０ｃ，１０ｄ，３０）の穿孔部（１１，１１ｂ，１１ｃ，１１ｄ，３１）に第２部材（２０）を充填して固化させる工程と、を備える。

Description

接合構造体の製造方法および接合構造体
　本発明は、接合構造体の製造方法および接合構造体に関する。
　従来、異なる材料からなる第１部材および第２部材が接合された接合構造体が知られている（たとえば、特許文献１参照）。
　特許文献１には、金属材料に樹脂などの異種材料を接合させる接合方法が開示されている。具体的には、金属材料の表面に、クロス状にレーザースキャニング加工が施されることにより、その表面に多数の突起（凹凸部）が形成される。そして、その突起が形成された金属材料に異種材料が接合された場合には、異種材料が凹状部に入り込むことにより、アンカー効果が発揮されるので、金属材料と異種材料との接合強度が向上される。
特許第４０２０９５７号公報
　しかしながら、従来の接合方法では、レーザにより金属表面に対して穿孔部（凹部）を形成する場合に、表面の開口径に対して穿孔部を深くすることが困難であり、接合強度を向上させることが困難であるという問題点がある。
　本発明は、上記の課題を解決するためになされたものであり、本発明の目的は、接合強度の向上を図ることが可能な接合構造体の製造方法および接合構造体を提供することである。
　本発明による接合構造体の製造方法は、第１部材と第２部材とが接合された接合構造体の製造方法であり、１パルスが複数のサブパルスで構成されたレーザを第１部材の表面に照射することにより、開口を有する穿孔部を第１部材の表面に形成する工程と、第１部材の穿孔部に第２部材を充填して固化させる工程とを備える。
　このように構成することによって、１パルスが複数のサブパルスで構成されたレーザにより穿孔部を形成することにより、表面の開口径に対して穿孔部を深くすることができるので、接合強度の向上を図ることができる。
　上記接合構造体の製造方法において、穿孔部の内周面に、内側に突出する突出部が形成されるようにしてもよい。
　上記接合構造体の製造方法において、第１部材は、金属、熱可塑性樹脂、または、熱硬化性樹脂であってもよい。
　上記接合構造体の製造方法において、第２部材は、熱可塑性樹脂、または、熱硬化性樹脂であってもよい。
　上記接合構造体の製造方法において、サブパルスの１周期は、１５ｎｓ以下であってもよい。
　上記接合構造体の製造方法において、１パルスのサブパルス数は、２以上５０以下であってもよい。
　本発明による接合構造体は、上記したいずれか１つの接合構造体の製造方法によって製造されている。
　このように構成することによって、１パルスが複数のサブパルスで構成されたレーザにより穿孔部を形成することにより、表面の開口径に対して穿孔部を深くすることができるので、接合強度の向上を図ることができる。
　本発明の接合構造体の製造方法および接合構造体によれば、接合強度の向上を図ることができる。
本発明の第１実施形態による接合構造体の断面の模式図である。 図１の接合構造体の製造方法を説明するための図であって、第１部材に穿孔部が形成された状態を示した模式図である。 本発明の第２実施形態による接合構造体の断面の模式図である。 図３の接合構造体の製造方法を説明するための図であって、第１部材に穿孔部が形成された状態を示した模式図である。 実施例の第１部材がレーザにより加工される状態を示した斜視図である。 実施例の接合構造体を示した斜視図である。 第１実施形態の第１変形例による第１部材を示した模式図である。 第１実施形態の第２変形例による第１部材を示した模式図である。 第１実施形態の第３変形例による第１部材を示した模式図である。 第１実施形態の第４変形例による第１部材を示した模式図である。
　以下、本発明の実施形態について図面を参照して説明する。
　（第１実施形態）
　まず、図１を参照して、本発明の第１実施形態による接合構造体１００について説明する。
　接合構造体１００は、図１に示すように、異なる材料からなる第１部材１０および第２部材２０が接合されたものである。第１部材１０の表面１３には、開口を有する穿孔部１１が形成され、その穿孔部１１の内周面には、内側に突出する突出部１２が形成されている。そして、第１部材１０の穿孔部１１には、第２部材２０が充填されて固化されている。なお、図１は、第１部材１０および第２部材２０の接合界面を拡大して模式的に示した図であり、実際には穿孔部１１が複数設けられているが、図１では１つだけ示した。
　第１部材１０の材料は、金属、熱可塑性樹脂、または、熱硬化性樹脂であり、第２部材２０の材料は、熱可塑性樹脂、または、熱硬化性樹脂である。
　上記金属の一例としては、鉄系金属、ステンレス系金属、銅系金属、アルミ系金属、マグネシウム系金属、および、それらの合金が挙げられる。また、金属成型体であってもよく、亜鉛ダイカスト、アルミダイカスト、粉末冶金などであってもよい。
　上記熱可塑性樹脂の一例としては、ＰＶＣ（ポリ塩化ビニル）、ＰＳ（ポリスチレン）、ＡＳ（アクリロニトリル・スチレン）、ＡＢＳ（アクリロニトリル・ブタジエン・スチレン）、ＰＭＭＡ（ポリメチルメタクリレート）、ＰＥ（ポリエチレン）、ＰＰ（ポリプロピレン）、ＰＣ（ポリカーボネート）、ｍ－ＰＰＥ（変性ポリフェニレンエーテル）、ＰＡ６（ポリアミド６）、ＰＡ６６（ポリアミド６６）、ＰＯＭ（ポリアセタール）、ＰＥＴ（ポリエチレンテレフタレート）、ＰＢＴ（ポリブチレンテレフタレート）、ＰＳＦ（ポリサルホン）、ＰＡＲ（ポリアリレート）、ＰＥＩ（ポリエーテルイミド）、ＰＰＳ（ポリフェニレンサルファイド）、ＰＥＳ（ポリエーテルサルホン）、ＰＥＥＫ（ポリエーテルエーテルケトン）、ＰＡＩ（ポリアミドイミド）、ＬＣＰ（液晶ポリマー）、ＰＶＤＣ（ポリ塩化ビニリデン）、ＰＴＦＥ（ポリテトラフルオロエチレン）、ＰＣＴＦＥ（ポリクロロトリフルオロエチレン）、および、ＰＶＤＦ（ポリフッ化ビニリデン）が挙げられる。また、ＴＰＥ（熱可塑性エラストマ）であってもよく、ＴＰＥの一例としては、ＴＰＯ（オレフィン系）、ＴＰＳ（スチレン系）、ＴＰＥＥ（エステル系）、ＴＰＵ（ウレタン系）、ＴＰＡ（ナイロン系）、および、ＴＰＶＣ（塩化ビニル系）が挙げられる。
　上記熱硬化性樹脂の一例としては、ＥＰ（エポキシ）、ＰＵＲ（ポリウレタン）、ＵＦ（ユリアホルムアルデヒド）、ＭＦ（メラミンホルムアルデヒド）、ＰＦ（フェノールホルムアルデヒド）、ＵＰ（不飽和ポリエステル）、および、ＳＩ（シリコーン）が挙げられる。また、ＦＲＰ（繊維強化プラスチック）であってもよい。
　なお、上記した熱可塑性樹脂および熱硬化性樹脂には、充填剤が添加されていてもよい。充填剤の一例としては、無機系充填剤（ガラス繊維、無機塩類など）、金属系充填剤、有機系充填剤、および、炭素繊維などが挙げられる。
　穿孔部１１は、平面的に見てほぼ円形の非貫通孔であり、第１部材１０の表面１３に複数形成されている。穿孔部１１の表面１３の開口径Ｒ１は、３０μｍ以上、１００μｍ以下が好ましい。これは、開口径Ｒ１が３０μｍを下回ると、第２部材２０の充填性が悪化してアンカー効果が低下する場合があるためである。一方、開口径Ｒ１が１００μｍを上回ると、単位面積あたりの穿孔部１１の数が減少してアンカー効果が低下する場合があるためである。
　また、穿孔部１１の間隔（所定の穿孔部１１の中心と、所定の穿孔部１１と隣接する穿孔部１１の中心との距離）は、２００μｍ以下であることが好ましい。これは、穿孔部１１の間隔が２００μｍを上回ると、単位面積あたりの穿孔部１１の数が減少してアンカー効果が低下する場合があるためである。なお、穿孔部１１の間隔の下限の一例としては、穿孔部１１が重畳して潰れない距離である。また、穿孔部１１の間隔は同じであることが好ましい。これは、穿孔部１１が等間隔であると、せん断方向の接合強度が等方的になるためである。
　ここで、第１実施形態の穿孔部１１は、深さ方向（Ｚ方向）において表面１３側から底部１１３に向けて開口径が大きくなる拡径部１１１と、深さ方向において表面１３側から底部１１３に向けて開口径が小さくなる縮径部１１２とが連なるように形成されている。拡径部１１１は、曲線状に拡径するように形成され、縮径部１１２は、曲線状に縮径するように形成されている。
　そして、拡径部１１１が表面１３側に配置されるとともに、縮径部１１２が底部１１３側に配置されている。このため、穿孔部１１において、拡径部１１１と縮径部１１２との境界部分の開口径（内径）Ｒ２が最も大きくなっており、開口径Ｒ１が開口径Ｒ２よりも小さくなっている。これにより、突出部１２が第１部材１０の表面１３側に配置されている。この突出部１２は、たとえば、周方向における全長にわたって形成されており、環状に形成されている。
　この穿孔部１１は、加工用のレーザが照射されることによって形成される。レーザの種類としては、パルス発振が可能な観点から、ファイバレーザ、ＹＡＧレーザ、ＹＶＯ４レーザ、半導体レーザ、炭酸ガスレーザ、エキシマレーザが選択でき、レーザの波長を考慮すると、ファイバレーザ、ＹＡＧレーザ、ＹＡＧレーザの第２高調波、ＹＶＯ４レーザ、半導体レーザが好ましい。なお、レーザの出力は、レーザの照射径、第１部材１０の材料の種類、第１部材１０の形状（たとえば厚み）などを考慮して設定される。たとえば、レーザの出力上限は４０Ｗが好ましい。これは、レーザの出力が４０Ｗを超えると、エネルギが大きく、突出部１２を有する穿孔部１１を形成することが困難であるためである。
　また、穿孔部１１は、１パルスが複数のサブパルスで構成されるレーザが照射されることにより形成されている。なお、このようなレーザを出射する装置の一例としては、オムロン製のファイバレーザマーカＭＸ－Ｚ２０００またはＭＸ－Ｚ２０５０を挙げることができる。具体的には、第１部材１０にレーザが照射されると、第１部材１０が局部的に溶融されることにより穿孔部１１の形成が進行する。このとき、レーザが複数のサブパルスで構成されているため、溶融された第１部材１０が飛散されにくく、穿孔部１１の近傍に堆積されやすい。そして、穿孔部１１の形成が進行すると、溶融された第１部材１０が穿孔部１１の内部に堆積されることにより、突出部１２が形成される。このため、突出部１２により、レーザの反射波が穿孔部１１の内部に閉じ込められるようになり、レーザによる加工がより深さ方向に進行することになる。つまり、レーザのエネルギを深さ方向に集中させやすくなっている。その結果、穿孔部１１では、表面の開口径Ｒ１に対して深さが大きくなる。なお、レーザの照射方向は、たとえば、表面１３に対して垂直方向であり、穿孔部１１の軸心が表面１３に対して垂直になる。
　このように、１パルスが複数のサブパルスで構成されるレーザを照射することにより、表面の開口径Ｒ１に対して穿孔部１１の深さを大きくするができるので、アンカー効果が大きくなり、接合強度の向上を図ることができる。さらに、熱サイクル環境下において、第１部材１０および第２部材２０の線膨張係数差に起因する剥離応力が発生しても、接合強度を維持することができる。すなわち、熱サイクル環境下における耐久性の向上を図ることができる。
　なお、上記ファイバレーザマーカによる加工条件としては、サブパルスの１周期が１５ｎｓ以下であることが好ましい。これは、サブパルスの１周期が１５ｎｓを超えると、熱伝導によりエネルギが拡散しやすくなり、突出部１２を有する穿孔部１１を形成しにくくなるためである。なお、サブパルスの１周期は、サブパルスの１回分の照射時間と、そのサブパルスの照射が終了されてから次回のサブパルスの照射が開始されるまでの間隔との合計時間である。
　また、上記ファイバレーザマーカによる加工条件としては、１パルスのサブパルス数は、２以上５０以下であることが好ましい。これは、サブパルス数が５０を超えると、サブパルスの単位あたりの出力が小さくなり、突出部１２を有する穿孔部１１を形成しにくくなるためである。
　そして、第２部材２０は、穿孔部１１が形成された第１部材１０の表面１３に接合されている。この第２部材２０は、たとえば、射出成形、熱板溶着、レーザ溶着、注型硬化、超音波溶着、または、振動溶着によって第１部材１０に接合されている。これにより、第２部材２０が穿孔部１１に充填された状態で固化されている。
　このような接合構造体１００は、たとえば、光電センサの金属ケース（図示省略）に樹脂カバー（図示省略）を接合させる場合に適用可能である。この場合には、金属ケースが第１部材１０に相当し、樹脂カバーが第２部材２０に相当する。
　－接合構造体の製造方法－
　次に、図１および図２を参照して、第１実施形態による接合構造体１００の製造方法について説明する。
　まず、図２に示すように、第１部材１０の表面１３に１パルスが複数のサブパルスで構成されたレーザを照射することにより、第１部材１０の表面１３に穿孔部１１を形成するとともに、その穿孔部１１の内周面に突出部１２を形成する。このとき、突出部１２が形成されると、レーザの反射波が穿孔部１１の内部に閉じ込められるようになり、レーザによる加工がより深さ方向に進行することになる。これにより、穿孔部１１では、表面の開口径Ｒ１に対して深さが大きくなる。
　その後、第１部材１０の穿孔部１１に第２部材２０を充填し、その第２部材２０を固化させる。これにより、第１部材１０および第２部材２０が接合され、接合構造体１００（図１参照）が形成される。なお、第２部材２０は、たとえば、射出成形、熱板溶着、レーザ溶着、注型硬化、超音波溶着、または、振動溶着によって接合される。
　（第２実施形態）
　次に、図３を参照して、本発明の第２実施形態による接合構造体２００について説明する。
　接合構造体２００は、図３に示すように、異なる材料からなる第１部材３０および第２部材２０が接合されたものである。第１部材３０の表面３３には、開口を有する穿孔部３１が形成され、その穿孔部３１の内周面には、内側に突出する突出部３２が形成されている。そして、第１部材３０の穿孔部３１には、第２部材２０が充填されて固化されている。
　第２実施形態の穿孔部３１は、深さ方向（Ｚ方向）において表面３３側から底部３１４に向けて開口径が小さくなる縮径部３１１と、深さ方向において表面３３側から底部３１４に向けて開口径が大きくなる拡径部３１２と、深さ方向において表面３３側から底部３１４に向けて開口径が小さくなる縮径部３１３とが連なるように形成されている。縮径部３１１は、直線状に縮径するように形成され、拡径部３１２は、曲線状に拡径するように形成され、縮径部３１３は、曲線状に縮径するように形成されている。
　そして、表面３３側から底部３１４側に向けて順に、縮径部３１１、拡径部３１２および縮径部３１３が配置されている。このため、穿孔部３１において、縮径部３１１と拡径部３１２との境界部分の開口径（内径）Ｒ４が、表面３３の開口径Ｒ３、および、拡径部３１２と縮径部３１３との境界部分の開口径Ｒ５よりも小さくなっている。これにより、突出部３２が底部３１４側に入り込んだ位置に配置されている。この突出部３２は、たとえば、周方向における全長にわたって形成されており、環状に形成されている。
　なお、第１部材３０のその他の構成は、上記した第１部材１０と同様である。
　－接合構造体の製造方法－
　次に、図３および図４を参照して、第２実施形態による接合構造体２００の製造方法について説明する。
　まず、図４に示すように、第１部材３０の表面３３に１パルスが複数のサブパルスで構成されたレーザを照射することにより、第１部材３０の表面３３に穿孔部３１を形成するとともに、その穿孔部３１の内周面に突出部３２を形成する。このとき、突出部３２が形成されると、レーザの反射波が穿孔部３１の内部に閉じ込められるようになり、レーザによる加工がより深さ方向に進行することになる。これにより、穿孔部３１では、表面の開口径Ｒ３に対して深さが大きくなる。
　なお、第２実施形態では、第１実施形態と異なり、突出部３２が底部３１４側に入り込んだ位置に配置されるが、このような違いは、たとえば、第１部材３０の材料やレーザ照射条件などの違いに起因する。
　その後、第１部材３０の穿孔部３１に第２部材２０を充填し、その第２部材２０を固化させる。これにより、第１部材３０および第２部材２０が接合され、接合構造体２００（図３参照）が形成される。なお、第２部材２０は、たとえば、射出成形、熱板溶着、レーザ溶着、注型硬化、超音波溶着、または、振動溶着によって接合される。
　－実験例－
　次に、図５および図６を参照して、上記した第２実施形態の効果を確認するために行った実験例１および２について説明する。
　［実験例１］
　この実験例１では、第２実施形態に対応する実施例１～４による接合構造体５００（図６参照）と、比較例１による接合構造体とを作製し、それぞれについての接合評価を行った。なお、接合評価としては、熱衝撃試験を行っていないものについて接合強度を測定するとともに、熱衝撃試験後のものについて接合強度を測定し、その測定結果に基づいて合否判定を行った。その結果を表１に示す。
Figure JPOXMLDOC01-appb-T000001
  
　まず、実施例１～４による接合構造体５００の作製方法について説明する。
　実施例１～４の接合構造体５００では、第１部材５０１の材料としてＳＵＳ３０４を用いた。この第１部材５０１は、図５に示すように、板状に形成されており、長さが１００ｍｍであり、幅が２９ｍｍであり、厚みが３ｍｍである。
　そして、第１部材５０１の表面の所定領域Ｒにレーザを照射する。この所定領域Ｒは、接合構造体５００が接合される面積であり、１２．５ｍｍ×２０ｍｍとした。実施例１～４で共通するレーザの照射条件は、以下のとおりである。
　＜レーザ照射条件＞
　レーザ：ファイバレーザ（波長１０６２ｎｍ）
　周波数：１０ｋＨｚ
　出力：３．８Ｗ
　走査速度：６５０ｍｍ／ｓｅｃ
　走査回数：２０回
　照射間隔：６５μｍ
　また、表１に示すように、実施例１では、サブパルス数を２０に設定するとともに、サブパルスの１周期を１５．０ｎｓに設定した。実施例２では、サブパルス数を２に設定するとともに、サブパルスの１周期を１５．０ｎｓに設定した。実施例３では、サブパルス数を２０に設定するとともに、サブパルスの１周期を１０．５ｎｓに設定した。実施例４では、サブパルス数を５０に設定するとともに、サブパルスの１周期を１５．０ｎｓに設定した。
　なお、周波数は、複数のサブパルスによって構成されるパルスの周波数である。つまり、この照射条件では、１秒間に６５０ｍｍ移動しながら６５μｍの間隔で１万回レーザ（パルス）を照射し、そのパルスが複数のサブパルスによって構成されている。なお、走査回数は、レーザが同じ箇所に繰り返し照射される回数である。また、実施例１、２および４では、サブパルスの１回分の照射時間が７．５ｎｓであり、サブパルスの照射間隔が７．５ｎｓである。また、実施例３では、サブパルスの１回分の照射時間が３ｎｓであり、サブパルスの照射間隔が７．５ｎｓである。
　このように、１パルスが複数のサブパルスで構成されるレーザを照射することにより、第１部材５０１の表面の所定領域Ｒには穿孔部が形成されるとともに、その穿孔部に突出部が形成される。
　そして、インサート成形により、第１部材５０１の表面に第２部材５０２を接合した。実施例１～４の接合構造体５００では、第２部材５０２の材料としてＰＢＴ（ウィンテックポリマー製のジュラネックス（登録商標）３３１６）を用いた。また、成形機は、日本製鋼所製のＪ３５ＥＬ３を用いた。成形条件は以下のとおりである。
　＜成形条件＞
　予備乾燥：１２０℃×５時間
　金型温度：１２０℃
　シリンダ温度：２７０℃
　保圧：１００ＭＰａ
　このようにして、実施例１～４の接合構造体５００を作製した。なお、第２部材５０２は、板状に形成されており、長さが１００ｍｍであり、幅が２５ｍｍであり、厚みが３ｍｍである。
　次に、比較例１による接合構造体の作製方法について説明する。
　比較例１の接合構造体では、第１部材および第２部材の材料として実施例１～４と同じものを用いるとともに、成形条件も同じ設定にした。そして、比較例１の接合構造体では、パルスコントロール機能のないファイバレーザを用いて穿孔部を形成した。すなわち、１パルスが複数のサブパルスで構成されていないレーザ（単一パルス）を照射することにより穿孔部が形成された。このため、比較例１の第１部材には、すり鉢状（円錐状）の穿孔部が形成された。
　そして、実施例１～４の接合構造体５００および比較例１の接合構造体について、接合評価を行った。
　なお、接合強度は、インストロン製の電気機械式万能試験機５９００を用いて測定した。具体的には、せん断方向について引張速度５ｍｍ／ｍｉｎで試験を行い、第２部材の破断または接合界面の破断で試験を終了した。そして、その試験での最大強度を接合強度として採用した。
　また、熱衝撃試験は、エスペック製の冷熱衝撃装置ＴＳＤ－１００を用いて行った。具体的には、－４０℃で３０分間の低温さらしと、８５℃で３０分間の高温さらしとを１００回繰り返し行った。
　そして、熱サイクル環境下での信頼性を判断するために、以下の基準で合否判断を行った。
　合格（○）：「熱衝撃試験後の接合強度」／「熱衝撃試験前の接合強度」≧９０％
　不合格（×）：「熱衝撃試験後の接合強度」／「熱衝撃試験前の接合強度」＜９０％
　上記した表１に示すように、実施例１～４の接合構造体５００は、比較例１の接合構造体に比べて、表面の開口径に対して穿孔部の深さが大きくなっていた。これは、実施例１～４の接合構造体５００では、１パルスが複数のサブパルスで構成されるレーザを照射することにより、穿孔部に突出部が形成されるため、レーザの反射波が穿孔部の内部に閉じ込められるようになり、レーザによる加工がより深さ方向に進行するためである。
　そして、実施例１～４の接合構造体５００は、比較例１の接合構造体に比べて、熱衝撃試験の前後において、接合強度が高くなっていた。これは、実施例１～４の接合構造体５００では、表面の開口径に対して穿孔部の深さが大きいことにより、アンカー効果が大きくなり、接合強度が向上したためであると考えられる。
　さらに、実施例１～４の接合構造体５００では、熱衝撃試験前の接合強度を熱衝撃試験後においても９０％以上維持できることが判明した。これに対して、比較例１の接合構造体では、熱衝撃試験後に接合強度が大幅に低下している。したがって、実施例１～４の接合構造体５００のように、１パルスが複数のサブパルスで構成されるレーザにより深い穿孔部を形成することにより、熱サイクル環境下における耐久性の向上を図ることができた。
　［実験例２］
　この実験例２では、第２実施形態に対応する実施例５～８による接合構造体と、比較例２による接合構造体とを作製し、それぞれについての接合評価を行った。なお、接合評価は実験例１と同様に行った。その結果を表２に示す。
Figure JPOXMLDOC01-appb-T000002
  
　この実験例２では、第１部材の材料を実験例１から変更した。具体的には、実験例２の接合構造体では、第１部材の材料としてＰＰＳ（ポリプラスチックス製のフォートロン（登録商標）１１４０）を用いた。また、第１部材の材料の変更に伴い、実施例５～８で共通するレーザ照射条件を以下のようにした。
　＜レーザ照射条件＞
　レーザ：ファイバレーザ（波長１０６２ｎｍ）
　周波数：１０ｋＨｚ
　出力：１．１Ｗ
　走査速度：６５０ｍｍ／ｓｅｃ
　走査回数：３回
　照射間隔：６５μｍ
　また、表２に示すように、実施例５では、サブパルス数を２０に設定するとともに、サブパルスの１周期を１５．０ｎｓに設定した。実施例６では、サブパルス数を２に設定するとともに、サブパルスの１周期を１５．０ｎｓに設定した。実施例７では、サブパルス数を２０に設定するとともに、サブパルスの１周期を１０．５ｎｓに設定した。実施例８では、サブパルス数を５０に設定するとともに、サブパルスの１周期を１５．０ｎｓに設定した。
　上記した表２に示すように、実施例５～８の接合構造体は、比較例２の接合構造体に比べて、表面の開口径に対して穿孔部の深さが大きくなっていた。これは、実施例５～８の接合構造体では、１パルスが複数のサブパルスで構成されるレーザを照射することにより、穿孔部に突出部が形成されるため、レーザの反射波が穿孔部の内部に閉じ込められるようになり、レーザによる加工がより深さ方向に進行するためである。
　そして、実施例５～８の接合構造体は、比較例２の接合構造体に比べて、熱衝撃試験の前後において、接合強度が高くなっていた。これは、実施例５～８の接合構造体では、表面の開口径に対して穿孔部の深さが大きいことにより、アンカー効果が大きくなり、接合強度が向上したためであると考えられる。
　さらに、実施例５～８の接合構造体では、熱衝撃試験前の接合強度を熱衝撃試験後においても９０％以上維持できることが判明した。これに対して、比較例２の接合構造体では、熱衝撃試験後に接合強度が大幅に低下している。つまり、第１部材の材料として、樹脂であるＰＰＳを用いた場合であっても、１パルスが複数のサブパルスで構成されるレーザにより深い穿孔部を形成することにより、接合強度の向上を図るとともに、熱サイクル環境下における耐久性の向上を図ることができた。
　（他の実施形態）
　なお、今回開示した実施形態は、すべての点で例示であって、限定的な解釈の根拠となるものではない。したがって、本発明の技術的範囲は、上記した実施形態のみによって解釈されるものではなく、特許請求の範囲の記載に基づいて画定される。また、本発明の技術的範囲には、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。
　たとえば、第１実施形態において、表面１３が、平坦であってもよいし、湾曲されていてもよい。なお、第２実施形態についても同様である。
　また、第１実施形態では、拡径部１１１と縮径部１１２とが連なるように形成される例を示したが、これに限らず、拡径部と縮径部との間に深さ方向に真っ直ぐ延びる部分が形成されていてもよい。なお、第２実施形態についても同様である。
　また、第１実施形態では、穿孔部１１の周囲が平坦である例を示したが、これに限らず、図７に示す第１変形例による第１部材１０ａのように、穿孔部１１の開口の周囲に表面１３から上方に隆起する隆起部１４が形成されていてもよい。隆起部１４は、穿孔部１１の周囲を取り囲むように形成されており、平面的に見てほぼ円形に形成されている。この隆起部１４は、たとえば、１パルスが複数のサブパルスで構成されるレーザが照射される際に、溶融された第１部材１０ａが堆積されることによって形成される。このように構成すれば、隆起部１４によってもアンカー効果が発生するので、接合強度をより向上させることができる。なお、第２実施形態についても同様である。
　また、第１実施形態では、穿孔部１１の軸心が表面１３に対して垂直である例を示したが、これに限らず、図８に示す第２変形例による第１部材１０ｂのように、穿孔部１１ｂの軸心が表面１３に対して傾斜するように形成されていてもよい。穿孔部１１ｂの内周面には内側に突出する突出部１２ｂが形成されている。この穿孔部１１ｂは、たとえば、レーザの照射方向を表面１３に対して斜め（４５°以上９０°未満）にすることにより形成される。これにより、穿孔部１１ｂを形成する領域の上方に、レーザを照射する際の障害物が存在する場合であっても、穿孔部１１ｂを形成することができる。なお、第２実施形態についても同様である。
　また、第１実施形態では、穿孔部１１に１つの突出部１２が形成される例を示したが、これに限らず、図９に示す第３変形例による第１部材１０ｃのように、穿孔部１１ｃに複数の突出部１２１ｃおよび１２２ｃが形成されていてもよい。この穿孔部１１ｃは、たとえば、レーザの出力条件を変更して、レーザを同じ箇所に照射することにより形成することが可能である。このように構成すれば、穿孔部１１ｃの表面積が大きくなるとともに、複数の突出部１２１ｃおよび１２２ｃが形成されることにより、接合強度をより向上させることができる。なお、図９では突出部は１２１ｃおよび１２２ｃの２箇所であるが、３箇所以上形成されていてもよい。なお、第２実施形態についても同様である。
　また、図１０に示す第１実施形態の第４変形例による第１部材１０ｄのように、位置をずらした複数回のレーザ照射により１つの穿孔部１１ｄを形成するようにしてもよい。すなわち、レーザ照射によって形成される穿孔部の一部が重畳されることにより、１つの穿孔部１１ｄが形成されるようにしてもよい。穿孔部１１ｄの内周面には内側に突出する突出部１２ｄが形成されている。なお、第２実施形態についても同様である。また、上記した第１～第４変形例を適宜組み合わせるようにしてもよい。
　本発明は、異なる材料からなる第１部材および第２部材が接合された接合構造体の製造方法および接合構造体に利用可能である。
　１０、１０ａ、１０ｂ、１０ｃ、１０ｄ　　　第１部材
　１１、１１ｂ、１１ｃ、１１ｄ　　　　　　　穿孔部
　１２、１２ｂ、１２１ｃ、１２２ｃ、１２ｄ　突出部
　１３　　　表面
　２０　　　第２部材
　３０　　　第１部材
　３１　　　穿孔部
　３２　　　突出部
　３３　　　表面
　１００　　接合構造体
　２００　　接合構造体

Claims (7)

  1. 　第１部材と第２部材とが接合された接合構造体の製造方法であって、
    　１パルスが複数のサブパルスで構成されたレーザを前記第１部材の表面に照射することにより、開口を有する穿孔部を前記第１部材の表面に形成する工程と、
    　前記第１部材の穿孔部に前記第２部材を充填して固化させる工程とを備えることを特徴とする接合構造体の製造方法。
  2. 　請求項１に記載の接合構造体の製造方法において、
    　前記穿孔部の内周面に、内側に突出する突出部が形成されることを特徴とする接合構造体の製造方法。
  3. 　請求項１または２に記載の接合構造体の製造方法において、
    　前記第１部材は、金属、熱可塑性樹脂、または、熱硬化性樹脂であることを特徴とする接合構造体の製造方法。
  4. 　請求項１～３のいずれか１つに記載の接合構造体の製造方法において、
    　前記第２部材は、熱可塑性樹脂、または、熱硬化性樹脂であることを特徴とする接合構造体の製造方法。
  5. 　請求項１～４のいずれか１つに記載の接合構造体の製造方法において、
    　サブパルスの１周期は、１５ｎｓ以下であることを特徴とする接合構造体の製造方法。
  6. 　請求項１～５のいずれか１つに記載の接合構造体の製造方法において、
    　１パルスのサブパルス数は、２以上５０以下であることを特徴とする接合構造体の製造方法。
  7. 　請求項１～６のいずれか１つに記載の接合構造体の製造方法によって製造されたことを特徴とする接合構造体。
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