WO2016015594A1 - 一种高精度高可靠快速响应热敏芯片及其制作方法 - Google Patents
一种高精度高可靠快速响应热敏芯片及其制作方法 Download PDFInfo
- Publication number
- WO2016015594A1 WO2016015594A1 PCT/CN2015/084974 CN2015084974W WO2016015594A1 WO 2016015594 A1 WO2016015594 A1 WO 2016015594A1 CN 2015084974 W CN2015084974 W CN 2015084974W WO 2016015594 A1 WO2016015594 A1 WO 2016015594A1
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- WIPO (PCT)
- Prior art keywords
- ceramic substrate
- semiconductor ceramic
- glass protective
- protective layer
- heat
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/022—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being openable or separable from the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
- H01C13/02—Structural combinations of resistors
Definitions
- the invention belongs to the technical field of thermal chip products, and particularly relates to a high precision, high reliability and fast response thermal chip and a manufacturing method thereof.
- Thermal chip as an electronic component has unparalleled advantages: easy to install, high efficiency, no lead - no parasitic inductance, electrode in epoxy or glass encapsulation - higher reliability.
- the thermal chip as a core component, the thermistor and temperature sensor in different package forms are widely used in various temperature detection, temperature compensation, temperature control circuits, which convert the temperature variables into the required electrons in the circuit.
- the core role of the signal is widely used in various temperature detection, temperature compensation, temperature control circuits, which convert the temperature variables into the required electrons in the circuit.
- thermal chips Due to the wide application of thermal chips, in order to meet the demand for rapid experience of electronic technology, this requires high precision, high reliability and fast response of the thermal chip.
- the manufacturing method of the thermal chip is: heat-sensitive semiconductor ceramic substrate preparation - printing metal electrode layer - dicing - thermal chip, the thermal chip produced by the method has the following deficiencies:
- the thermal chip with the current solderable CP line and the enameled wire or the thermal chip capable of testing the resistance has a response time of more than 2 seconds, and the response takes a long time;
- the object of the present invention is to overcome the deficiencies of the prior art, and specifically to disclose a high-precision, high-reliability, fast-response thermal chip capable of achieving fast response, accurate resistance precision control, high precision, and a glass protective layer thereof.
- the protection makes the thermal chip highly reliable.
- a high-precision, high-reliability, fast-response thermal chip comprises a heat-sensitive semiconductor ceramic substrate, and the surface of the heat-sensitive semiconductor ceramic substrate is sprayed and sintered with a glass protective layer on both surfaces. Both surfaces of the semiconductive ceramic substrate having a glass protective layer are printed with a metal electrode layer.
- the glass protective layers are spaced apart, and the heat-sensitive semiconductor ceramic substrate has two tables.
- the surface of the glass protective layer corresponds to the setting.
- the metal electrode layer is a gold electrode or a silver electrode.
- the invention also discloses a method for manufacturing a high precision, high reliability and fast response thermal chip, the specific steps of which are:
- Spraying glass protective layer spraying the glass frit liquid corresponding to both surfaces of the above-mentioned heat-sensitive semiconductor ceramic substrate to form a glass protective layer which is spaced on each surface of the heat-sensitive semiconductor ceramic substrate Setting
- the step (2) spraying the glass protective layer comprises:
- thermosensitive semiconductor ceramic substrate assembling the thermosensitive semiconductor ceramic substrate to the separator so that the area where the glass is not required to be sprayed is separated by the separator;
- the sintered glass protective layer according to the above step (3) is specifically: removing the separator, and sintering the sprayed thermosensitive semiconductor ceramic substrate at a certain temperature to make the glass powder The melting causes the glass to be tightly bonded to the heat-sensitive semiconductor ceramic substrate.
- the glass protective layer has a sintering temperature in the range of 600 to 650 °C.
- the printed metal electrode layer described in the above step (4) comprises the following steps:
- (4a) printing metal paste uniformly printing the metal paste on the upper and lower surfaces of the heat-sensitive semiconductor ceramic substrate with a glass protective layer by using a printing device;
- Sintered metal electrode layer sintering is performed at a certain temperature to closely bond the metal electrode layer with the glass protective layer and the heat-sensitive semiconductor ceramic layer, and the sintering temperature of the metal electrode layer is 950 to 1100 °C.
- the present invention is provided with a spacer glass protective layer on the surface of the heat-sensitive semiconductor ceramic substrate, and the spaced-apart glass protective layer separates the surface of the heat-sensitive substrate into a non-conductive region having a glass protective layer and The conductive area of the glass protective layer, so that when the thermal chip is operated, when the thermal chip is energized, the current rapidly flows through the conductive area, reducing the flow of non-conductive areas (ie, reducing current flow throughout the chip), and only the conductive area of the thermal chip When the ambient temperature is sensed, the thermal chip quickly reflects the resistance;
- the thermal chip of the invention can effectively avoid the size of the thermal chip being cut, and the resistance error is larger, increasing the size of the thermal chip, and also facilitating the use of the device to test the resistance value, thereby effectively improving the resistance precision. ;
- the heat-sensitive chip of the present invention can effectively protect the heat-sensitive semiconductor ceramic body and improve the reliability of the heat-sensitive chip because of the glass protective layer.
- FIG. 1 is a perspective view of a heat sensitive chip according to the present invention.
- Figure 2 is a side cross-sectional view of the thermal chip of the present invention.
- 3A to 3F are schematic views showing the structure of a thermal chip manufacturing process according to the present invention.
- a high-precision, high-reliability, fast-response thermal chip 10 includes a thermosensitive semiconductor ceramic substrate 1 which is spaced apart on both surfaces of the thermosensitive semiconductor ceramic substrate 1.
- a glass protective layer 2 is sprayed and sintered, and metal electrode layers 3 are printed on both surfaces of the semiconductor ceramic substrate 1 with the glass protective layer 2, and the glass protective layers 2 are spaced apart and strip-shaped, the heat
- the glass protective layer 2 on both surfaces of the semiconductor ceramic substrate 1 is disposed correspondingly, and the metal electrode layer 3 is a gold electrode or a silver electrode layer.
- the invention also discloses a method for manufacturing a high precision, high reliability and fast response thermal chip, the specific steps of which are:
- Fabrication of heat-sensitive semiconductor ceramic substrate 1 This step can be made by using the traditional semiconductor ceramic process in the industry to produce a heat-sensitive semiconductor ceramic substrate.
- the general process of the conventional semiconductor ceramic process batching-powder-isostatic powder-sintering a dense semiconductor ceramic block - a semiconductor ceramic block - a heat-sensitive semiconductor ceramic substrate 1 (as shown in FIG. 3A);
- thermosensitive semiconductor ceramic substrate 1 both surfaces of the above-mentioned thermosensitive semiconductor ceramic substrate 1 are formed with a glass protective layer 2 which is spaced apart on each surface of the heat-sensitive semiconductor ceramic substrate 1 to thereby heat-sensitive semiconductor ceramic substrate
- a glass protective layer 2 which is spaced apart on each surface of the heat-sensitive semiconductor ceramic substrate 1 to thereby heat-sensitive semiconductor ceramic substrate
- Each surface of the sheet 1 corresponds to a non-conductive region separated by a glass protective layer 2 and a conductive region without a glass protective layer;
- Printing metal electrode layer 3 as shown in FIG. 3D, a metal paste is printed on both surfaces of the heat-sensitive semiconductor ceramic substrate 1 having the glass protective layer 2 and sintered into a metal electrode layer 3.
- the specific step is (4a) Printing metal paste: adopted The printing device uniformly prints the metal paste on the upper and lower surfaces of the heat-sensitive semiconductor ceramic substrate 1 with the glass protective layer 2;
- (4b) sintered metal electrode layer 3 sintering is performed at a certain temperature to closely bond the metal electrode layer 3 with the ceramic protective layer 2, the ceramic layer of the heat-sensitive semiconductor ceramic substrate 1, and the sintering temperature of the metal electrode layer 3 It is 950 to 1100 °C.
- a heat-sensitive chip is manufactured.
- the structure of the heat-sensitive chip 10 is as shown in Fig. 3F.
- the metal electrode layer 3 and the glass protective layer 2 are both kept on both sides of the heat-sensitive semiconductor ceramic substrate 1 at the time of dicing.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Thermistors And Varistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (9)
- 一种高精度高可靠快速响应热敏芯片,包括热敏半导体陶瓷基片,其特征在于:所述热敏半导体陶瓷基片的两表面上间隔的喷涂并烧结有玻璃保护层,在该带有玻璃保护层的半导体陶瓷基片的两表面印刷有金属电极层。
- 根据权利要求1所述的高精度高可靠快速响应热敏芯片,其特征在于:所述玻璃保护层间隔设置,所述热敏半导体陶瓷基片两表面的玻璃保护层对应设置。
- 根据权利要求1或2所述的高精度高可靠快速响应热敏芯片,其特征在于:所述金属电极层为金电极或银电极。
- 根据权利要求1至3任一项所述的高精度高可靠快速响应热敏芯片的制作方法,其具体步骤是:(1)制作热敏半导体陶瓷基片;(2)喷涂玻璃保护层:在上述热敏半导体陶瓷基片的两表面对应的喷涂玻璃粉液以形成玻璃保护层,所述玻璃保护层在热敏半导体陶瓷基片的每一表面均为间隔设置;(3)烧结玻璃保护层:将上述喷涂有玻璃保护层的热敏半导体陶瓷基片进行烧结:(4)印刷金属电极层:在上述有玻璃保护层的热敏半导体陶瓷基片的两表面印刷金属浆料并烧结成金属电极层;(5)划片:按照规定的尺寸规格将上述带有玻璃保护层和金属电极层的热敏半导体陶瓷基片划切成方片状;(6)制得热敏芯片。
- 根据权利要求4所述的高精度高可靠快速响应热敏芯片的制作方法,其特征在于:上述步骤(2)喷涂玻璃保护层包括:(2a)装配:将热敏半导体陶瓷基片装配到隔板上,使不需要喷涂玻璃的区域通过隔板隔离开;(2b)喷涂玻璃:用喷头将调配好的玻璃粉液均匀喷涂在装配好的热敏半导体陶瓷基片上下两表面。
- 根据权利要求4所述的高精度高可靠快速响应热敏芯片的制作方法,其特征在于:上述步骤(3)所述的烧结玻璃保护层具体是:取下隔板,将喷涂好的热敏半导体陶瓷基片在一定的温度下进行烧结,使玻璃粉融化,使得玻璃与热敏半导体陶瓷基片紧密结合。
- 根据权利要求6所述的高精度高可靠快速响应热敏芯片的制作方法,其特征在于:所述玻璃保护层的烧结温度范围是600~650℃。
- 根据权利要求4所述的高精度高可靠快速响应热敏芯片的制作方法,其特征在于:上述步骤(4)所述的印刷金属电极层包括以下步骤:(4a)印刷金属浆料:采用印刷设备将金属浆料均匀印刷在带有玻璃保护层的热敏半导体陶瓷基片上下两表面;(4b)烧结金属电极层:在一定的温度下进行烧结,使金属电极层与玻璃保护层、热敏半导体陶瓷层紧密结合。
- 根据权利要求8所述的高精度高可靠快速响应热敏芯片的制作方法,其特征在于:所述金属电极层的烧结温度是950~1100℃。
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US15/328,993 US10330539B2 (en) | 2014-07-30 | 2015-07-23 | High precision high reliability and quick response thermosensitive chip and manufacturing method thereof |
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CN104198079A (zh) * | 2014-07-30 | 2014-12-10 | 肇庆爱晟电子科技有限公司 | 一种高精度高可靠快速响应热敏芯片及其制作方法 |
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CN109637764B (zh) * | 2018-12-29 | 2022-05-17 | 广东爱晟电子科技有限公司 | 高精度高可靠多层低阻热敏芯片及其制作方法 |
WO2022130508A1 (ja) * | 2020-12-15 | 2022-06-23 | 株式会社メイコー | 薄型温度センサ |
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CN104198079A (zh) | 2014-12-10 |
US20170211991A1 (en) | 2017-07-27 |
US10330539B2 (en) | 2019-06-25 |
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