WO2016011911A1 - 一种消抖的按键及其制备方法 - Google Patents

一种消抖的按键及其制备方法 Download PDF

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Publication number
WO2016011911A1
WO2016011911A1 PCT/CN2015/084167 CN2015084167W WO2016011911A1 WO 2016011911 A1 WO2016011911 A1 WO 2016011911A1 CN 2015084167 W CN2015084167 W CN 2015084167W WO 2016011911 A1 WO2016011911 A1 WO 2016011911A1
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Prior art keywords
layer
alloy
rubber
metal
tin
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PCT/CN2015/084167
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English (en)
French (fr)
Inventor
韩辉升
王振兴
丁阳
张红梅
东志豪
施捷
Original Assignee
南通万德科技有限公司
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Priority to US15/318,074 priority Critical patent/US10224156B2/en
Publication of WO2016011911A1 publication Critical patent/WO2016011911A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/10—Bases; Stationary contacts mounted thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C23C18/1692—Heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • C25D5/40—Nickel; Chromium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/025—Composite material having copper as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/06—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/78—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites
    • H01H13/785—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites characterised by the material of the contacts, e.g. conductive polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/06—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier
    • H01H2011/065—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier by plating metal or conductive rubber on insulating substrate, e.g. Molded Interconnect Devices [MID]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2201/00—Contacts
    • H01H2201/002—Contacts bounceless
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2201/00—Contacts
    • H01H2201/022—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2229/00—Manufacturing
    • H01H2229/014—Electro deposition

Definitions

  • the present invention relates to a component (i.e., an electrical contact or contact) between two conductors in a switch or circuit in an electrical or electronic product that is electrically contactable by mutual contact and a method of making the same.
  • a component i.e., an electrical contact or contact
  • the contacts When the mechanical switch containing the metal contacts is turned on or off, the contacts may not be turned on or off stably due to the elastic action of the contacts, but a series of turns are generated at the instant of turning on or off. Jitter, that is, a series of on and off.
  • the jitter time can be more than 20 milliseconds.
  • Contact jitter (or button jitter, switch jitter) can cause a manual switch operation to be misread multiple times. This type of jitter can cause a "battery" response of the circuit, which can lead to complete failure of the circuit design and lead to various accidents. Therefore, in some applications, contact jitter must be eliminated.
  • Methods for eliminating contact jitter include hardware methods and software methods. The hardware method adds a debounce circuit, and the software method has a delay method and a sampling method. These methods are described in the following documents:
  • Patent Document No. 201110340157.5 "A Method, Apparatus and Keyboard for Eliminating Key Jitter", Patent Application No. 200910058845.5
  • a Method and System for Removing Button Jitter discloses a method and system for processing information through a button To eliminate button jitter.
  • the patent document "an anti-jitter circuit” of the application number 201310004739.5 and the patent document “2012, a circuit for eliminating mechanical jitter” are all used to eliminate jitter by an anti-jitter circuit.
  • the patent document “Switching Circuits and Related Debounce Methods" of Application No. 200780034448.3 uses a sigma-delta modulator to debounce the output of the switch.
  • the invention of the patent application No. 201110193369.5 provides a "ply-faced metal-rubber composite conductive particle" which is formed by bonding a metal surface layer to a rubber substrate or by cutting after bonding.
  • the metal surface layer is a pockmark having pits, bumps or both; the pits or bumps are on the outer surface, the inner surface or both surfaces of the metal surface layer.
  • the depth of the pit is smaller than the thickness of the metal surface layer, and the height of the bump is not less than one tenth of the thickness of the metal surface layer.
  • the metal surface layer is made of metal or alloy, and the outer surface can be plated with gold, silver, copper, aluminum, nickel, chromium, bismuth, zinc, molybdenum, tin, cobalt, tungsten or iron and
  • the alloy base is a silicone rubber or a urethane rubber; the metal surface layer and the rubber base may have an adhesive layer, and the adhesive layer is a heat vulcanized adhesive, a primer or the same material as the rubber base.
  • the inner surface of the metal surface layer may be coated with an auxiliary agent such as a coupling agent.
  • the metal surface layer of the present invention has high strength, stable electrical conductivity, high strength of the adhesive layer, and sufficient rubber base.
  • the invention does not propose a solution to solve the problem of jitter of the conductive particles and the problem of arc ablation.
  • the invention also does not teach a specific method of obtaining one or more plating layers on the outer surface of the metal facing layer, and does not explain how to selectively deposit the metal plating layer on the surface of the metal without depositing it on the rubber.
  • the debounce button disclosed in the present invention is composed of a rubber substrate and a metal contact, wherein the metal contact is a layered composite having a three-layered structure, and the typical shape is a cylindrical type or an elliptical column type;
  • the first layer of the metal contact is a rubber layer of 0.1 mm to 10 mm thick, and the second layer is composed of magnesium, aluminum, titanium, chromium, manganese, iron, cobalt, nickel, copper, zinc, lanthanum of 0.01 mm to 1.0 mm thick.
  • the third layer being a 0.01-10 ⁇ m thick tin alloy plating layer or a lead alloy plating layer, as shown in FIG. 1; wherein the third layer is formed by the following three methods Formed by any one of:
  • the first method is to immerse the composite of the first layer and the second layer in a plating solution containing a soluble tin compound or a lead compound, and selectively deposit a tin alloy or a lead alloy on the composite by electroplating. Formed on the metal surface;
  • the second method is to immerse the first layer and the second layer composite in an electroless plating solution containing a soluble tin compound or a lead compound, and selectively deposit a tin alloy or a lead alloy into the composite by chemical deposition. Formed on the surface of the metal in the body;
  • the third method is to apply a tin alloy or a lead alloy on one or both sides of the second metal substrate by electroless plating or electroplating, and then compound the metal substrate and the rubber to form a rubber layer and a metal foil layer. And a layered composite of a three-layer structure of plating.
  • the rubber substrate in this debounce button is made of natural rubber, styrene butadiene rubber, butadiene rubber, ethylene propylene rubber, ethylene propylene diene monomer, urethane rubber, methyl vinyl silicone rubber or methyl vinyl phenyl.
  • the silicone rubber is prepared; the rubber substrate is preferably made of ethylene propylene diene monomer, methyl vinyl silicone rubber or methyl vinyl phenyl silicone rubber.
  • the material of the rubber substrate is preferably the same as the material of the hydrophobic rubber layer in the metal contact, so that the two have good adhesion strength during thermal vulcanization bonding.
  • the first layer is composed of a hydrophobic rubber;
  • the hydrophobic rubber is due to rubber a rubber material having a low carboxyl group, a hydroxyl group, a carbonyl group, an amino group, an amide group, a nitrile group, a nitro group, a halogen group, a thiol group, a sulfonate group, and a benzenesulfonate group, thereby making the water contact angle of the rubber surface greater than 65°, or Because the rubber does not contain or contains a small amount of hydrophilic fillers or additives. Thereby, the rubber surface of the rubber has a water contact angle of more than 65°.
  • Hydrophobic rubber has a repulsive ability to water, and water cannot spread on the surface of hydrophobic rubber.
  • the water contact angle of the rubber substrate needs to be greater than 65°.
  • the carboxyl group, hydroxyl group, carbonyl group, amino group, amide group, nitrile group, nitro group, halo group, sulfhydryl group, sulfonate group and benzenesulfonate on the rubber molecular chain will increase the polarity and hydrophilicity of the rubber.
  • carboxyl, hydroxyl, sulfonate and benzenesulfonate will greatly increase the polarity and hydrophilicity of the rubber. It is therefore necessary to control the content of these groups in the rubber.
  • the hydrophobic rubber layer is prepared from a non-polar or weakly polar rubber.
  • the hydrophobic rubber layer is prepared from ethylene propylene diene monomer, methyl vinyl silicone rubber or methyl vinyl phenyl silicone rubber.
  • EPDM rubber, methyl vinyl silicone rubber and methyl vinyl phenyl silicone rubber are non-polar rubbers, which are highly hydrophobic, and they have good weather resistance and can maintain good elasticity in the atmosphere for a long time. Therefore, they It is a preferred material for the hydrophobic rubber layer.
  • the hydrophobicity of the first layer rubber is not critical. A less hydrophobic rubber can also be used to make a rubber layer in a metal contact.
  • the metal foil layer in the present invention is a metal sheet having bumps or pits, a metal sheet having convex or concave lines, a metal sheet having a convex or concave surface, and a metal sheet having a small hole having an area of less than 1 mm 2 .
  • the material of the metal foil layer is preferably a metal or alloy having a good chemical stability, a high electrical conductivity, and a relatively low price.
  • the foil of the metal foil layer is composed of 0.01-1.0 mm thick stainless steel, copper or copper alloy, nickel or nickel alloy flakes, on one or both sides of stainless steel, copper or copper alloy, nickel or nickel alloy flakes. Or a pure nickel or nickel alloy layer of 0.01-10 ⁇ m, a pure cobalt layer or a cobalt alloy layer; a pure nickel or nickel alloy layer on a stainless steel, copper or copper alloy, a nickel or nickel alloy sheet, a pure cobalt layer or The cobalt alloy layer is prepared by vacuum coating, electroplating or electroless plating.
  • the second layer of metal foil is made of 0.01-1.0 mm thick stainless steel, copper or copper alloy, nickel or nickel. Gold flakes, coated on either or both sides of stainless steel, copper or copper alloy, nickel or nickel alloy sheets, with a layer of pure nickel or nickel alloy of 0.1-10 ⁇ m; on stainless steel, copper or copper alloys, nickel or nickel alloy sheets
  • the nickel alloy layer is prepared by vacuum coating, electroplating or electroless plating. Plating a pure nickel or nickel alloy layer on a stainless steel, copper or copper alloy, nickel or nickel alloy sheet, cobalt or cobalt alloy, molybdenum or molybdenum alloy, can improve the adhesion strength of the metal foil to the coating, avoid plating at the contact Fall off during use.
  • the thickness of the metal foil should not be too thin. If the thickness of the metal foil of the second layer is less than 0.01 mm, the plating layer is not well supported, and is easily broken during processing before, during or after the compounding with the rubber. If the metal foil of the second layer is too thick, the overall hardness of the contact is increased, and the division or punching process becomes difficult, and the metal material is wasted. Therefore, the thickness of the metal foil should not be greater than 1.0 mm.
  • the first layer of the hydrophobic rubber layer and the second layer of the metal foil are formed into a layered composite in advance for the convenience of applying the layered composite as a contact to prepare a rubber button.
  • the hydrophobic rubber on the layered composite can be directly vulcanized or thermoplastically bonded to other rubbers to form a rubber button. If the metal foil without the rubber layer is thermally vulcanized or thermoplastically bonded to form a rubber button, an overflow phenomenon occurs during the molding process.
  • the so-called overflow phenomenon means that during the molding process, the rubber overflows to the front side of the contact, thereby affecting the electrical conductivity of the contact. There is an overflow on the contacts, which is unacceptable for the quality of the contacts.
  • the method for preparing a debounce button of the present invention includes the following steps:
  • the metal foil is a stainless steel, copper or copper alloy, nickel or nickel alloy sheet of 0.01 mm to 1.0 mm thick; the metal foil is degreased and cleaned with a cleaning agent and an organic solvent; or by sandblasting Grinding the surface of the metal sheet by mechanical roughening; or chemical etching to treat pits or bumps having a diameter of less than 1 mm; or plating one or both sides of the metal sheet by plating or electroless plating to 0.1 ⁇ m a pure nickel layer or a nickel alloy layer, a pure cobalt layer or a cobalt alloy layer to 10 micrometers; then the obtained metal foil is degreased and washed with a cleaning agent and an organic solvent;
  • the hydrophobic rubber layer is formed by thermal vulcanization bonding and thermal vulcanization, and bonded to a metal foil coated with a primer or an adhesion promoter to form a layered layer.
  • the electroless plating solution contains 2.5-100 g/L of soluble tin compound and/or lead compound, 5-150 g/L of complexing agent, 10-125 g/L of reducing agent, and 0-50 g/L of pH adjusting agent;
  • the soluble tin compound is stannous chloride, stannous sulfate, tin tetrachloride, sodium stannate, tin fluoroborate, stannous acetate, stannous oxalate.
  • Stannous acetate and stannous oxalate are insoluble in water and are dissolved in dilute hydrochloric acid prior to use.
  • the soluble lead compounds are lead chloride, lead nitrate, and lead acetate.
  • the complexing agent is a sodium salt containing sodium citrate, potassium citrate, ethylenediaminetetraacetic acid (EDTA), aminotriacetic acid
  • the reducing agent is titanium trichloride or sodium hypophosphite.
  • the pH adjusting agent is potassium hydroxide, sodium hydroxide, ammonia water, inorganic acid (such as hydrochloric acid) or organic acid (such as lactic acid, benzenesulfonic acid), strong acid weak base salt (such as ammonium sulfate) or strong base weak acid salt. (such as sodium acetate, sodium carbonate).
  • inorganic acid such as hydrochloric acid
  • organic acid such as lactic acid, benzenesulfonic acid
  • strong acid weak base salt such as ammonium sulfate
  • strong base weak acid salt such as sodium acetate, sodium carbonate.
  • the electroless plating temperature is controlled between 50-95 ° C to ensure a certain reaction speed.
  • the electroless plating time is controlled between 10 minutes and 2 hours to ensure the thickness of the plating.
  • the thickness of the plating layer is 0.3 ⁇ m or more, the time for the contact jitter can be significantly reduced or even not shaken.
  • Post-plating treatment applying the contact obtained in the above step to the step (7), or plating the contact plated with the tin alloy or the lead alloy before or after the application to the step (7),
  • the method of post-plating treatment is:
  • the above metal contact is thermally vulcanized and thermally vulcanized, and the rubber layer in the metal contact is combined with other rubber during molding to prepare a detonated rubber button.
  • the above steps may be changed to prepare a plating layer, and then the plated metal foil and the hydrophobic rubber layer are subjected to a bonding treatment to prepare a coated composite sheet.
  • Another method of preparing the debounced button of the present invention includes the following steps:
  • the metal foil layer is 0.01-1.0 mm thick stainless steel, copper or copper alloy, nickel or nickel alloy flake; on one or both sides of stainless steel, copper or copper alloy, nickel or nickel alloy flakes, Or roughening by mechanical sanding, sand blasting and chemical etching, or vacuum plating, electroplating or electroless plating with a pure nickel or nickel alloy layer of 0.05-10 micron, a pure cobalt or cobalt alloy layer, molybdenum or Molybdenum alloy layer, or only for cleaning;
  • the hydrophobic rubber layer is formed by thermal vulcanization bonding and thermal vulcanization, and is bonded to the metal foil layer coated with the primer or the adhesion promoter to form a composite sheet; or a self-adhesive hydrophobic rubber bonded to a metal coated with or without a primer by thermal vulcanization bonding and thermal vulcanization molding Forming a composite sheet on the sheet layer;
  • the above composite sheet is immersed in a spot plating solution containing a compound of soluble tin or lead, and a tin alloy or a lead alloy plating layer is formed on the metal surface of the composite sheet by electroplating;
  • the plating solution contains 5-100 g/L of soluble tin compound or lead compound, 5-100 g/L of complexing agent, 5-100 g/L of reducing agent, and 2-50 g/L of pH adjusting agent;
  • Post-plating treatment applying the sheet obtained in the above step to the step (5), or applying a post-plating treatment to the sheet coated with the tin alloy or the lead alloy before or after the application to the step (5),
  • the method of post-plating treatment is:
  • cutting treatment dividing or punching the composite sheet in the above step into a cylinder having a diameter of 2-10 mm including a rubber layer and a metal foil layer and a plating layer;
  • the above-mentioned cylinder is thermally vulcanized and thermally vulcanized as a metal contact with a rubber, and the rubber layer in the above metal contact is combined with other rubber during molding to prepare a rubber button.
  • the above steps may be changed to prepare a plating layer, and then the plated metal foil and the hydrophobic rubber layer are subjected to a bonding treatment to prepare a coated composite sheet.
  • the electroless plating solution or the plating solution for preparing the tin alloy plating layer or the lead alloy plating layer may simultaneously contain a soluble tin compound and a soluble lead compound; as an optimization, preparing the plating solution of the tin alloy plating layer or the lead alloy plating layer, It contains 5-100 g/L of stannous chloride and lead chloride, wherein the weight ratio of stannous chloride to lead chloride is 5:1 to 100:1.
  • the coating thus obtained contains more tin and less lead. The presence of a small amount of lead will inhibit the formation of "whisk crystals" (or “whiskers”) in the tin alloy coating during storage and use.
  • the brightener is formaldehyde, acetaldehyde, ⁇ -naphthol, 2-methyl acetal, benzylideneacetone, Furfural, benzophenone, chlorobenzaldehyde, pingpingjia, sevoflurane, butynediol, propynyl alcohol, 1-diethylaminopropan-2-yne, ethoxylated propynyl alcohol, sulfonyl Benzoimide (also known as saccharin), sodium sulfonimide (also known as sodium saccharin), sodium vinyl sulfonate, sodium propyne sulfonate, pyridine-2-hydroxypropane sulfonate, alkane A phenolic ethoxylate or a commercially available brightener.
  • the brightener is formaldehyde, acetaldehyde, ⁇ -naphthol, 2-methyl acetal, benz
  • the metal contacts in the button disclosed in the invention are provided with a layer of tin alloy, lead alloy or tin-lead alloy, which has good resistance to contact jitter, and is resistant to metal contacts of tin alloy, lead alloy or tin-lead alloy. Arc ablation performance is also better than no plating
  • the metal contacts made of metal such as stainless steel, copper and copper alloy, nickel and nickel alloy, cobalt and cobalt alloy are good, which can improve the operational reliability of the contacts. In other words, the present invention eliminates contact jitter and prolongs contact life by applying a coating of tin or lead alloy to the metal contacts.
  • this contact is suitable for thermal vulcanization bonding and thermal vulcanization molding with other rubbers, resulting in a rubber button product with contacts.
  • This type of button is combined with a printed circuit board (PCB) to form a debounce button switch.
  • PCB printed circuit board
  • 1 is a schematic structural view of a debounce button of the present invention; in the figure: 1, a rubber layer; 2, a metal foil layer; 3, a tin alloy or a lead alloy plating layer; 4, a rubber substrate; wherein 1, 2 and 3 constitute Metal contact
  • FIG. 2 is a schematic diagram of a button switch for debounce; in the figure: 1, a rubber layer; 2, a metal foil layer; 3, a tin alloy or a lead alloy plating layer; 4, a rubber substrate; 5, a gold-plated contact on the printed circuit board; 6, printed circuit board;
  • FIG. 3 is a jitter test diagram of a common button nickel plating according to the present invention.
  • Figure 4 is a diagram showing the jitter test on the tinned button of the present invention.
  • 1-2 is a schematic structural view of the present invention: a rubber layer 1, a metal foil layer 2, a tin alloy or a lead alloy plating layer 3, a rubber substrate 4, a gold-plated contact 5 on a printed circuit board, and a printed circuit board. 6.
  • a rubber layer 1 a metal foil layer 2, a tin alloy or a lead alloy plating layer 3, a rubber substrate 4, a gold-plated contact 5 on a printed circuit board, and a printed circuit board. 6.
  • Figure 3-4 there is a trace of jitter in the jitter test chart on the normal button nickel plating.
  • the button On the tinned button of the present invention, the button has no signs of jitter.
  • the metal foil layer was made of 0.1 mm thick stainless steel (model 304; national standard number 0Cr18Ni9).
  • the sheet was rolled into a fine corrugated sheet by a mechanical method, and the peak height of the corrugation was 0.1 mm, and the peak pitch was 0.2 mm. Then, it is cleaned and degreased with an alkaline cleaning solution having a pH of about 9, washed with water, further cleaned with industrial alcohol, and then dried by cold air. It is also possible to carry out cleaning and degreasing by other methods.
  • VTPS vinyl tributyl butyl peroxysilane
  • DCP dicumyl peroxide
  • VTPS is a coupling agent containing a peroxy compound that crosslinks vinyl-containing silicone rubber and promotes vinyl-containing silicone rubber and metals (such as nickel, carbon steel, stainless steel, copper, etc.). The bond between.
  • the fine corrugated stainless steel sheet and the above-mentioned kneaded rubber were subjected to thermal vulcanization bonding and hot vulcanization molding at 165 ° C, and the vulcanization time was 12 minutes.
  • a layered composite sheet of 1.0 mm thick stainless steel and silicone rubber was formed.
  • the cavity surface of the mold of this composite sheet was obtained with a Teflon coating.
  • the presence of the Teflon coating prevents the rubber compound from sticking during hot vulcanization.
  • This composite sheet was die cut into small pieces having a diameter of 5 mm.
  • the small round pellets were washed with an alkaline cleaning solution for a minute, washed with water, then activated in 10% dilute sulfuric acid for 1 min, then washed and drained.
  • the electroless plating solution is now available. Titanium trichloride can be dissolved in deionized water or dilute hydrochloric acid, but added to the plating solution as early as possible.
  • the above 500 small round wafers were placed in the above 300 mL plating solution at 80 ° C, stirred continuously, taken out after 60 minutes, rinsed with distilled water or deionized water, drained, blown cold air or placed in a constant temperature oven at 70 ° C. In the middle drying, small round particles with a tin layer on the metal surface are obtained.
  • the small round particles of the tin-plated layer containing the silicone rubber layer are used as contacts, and are thermally vulcanized and thermally vulcanized with silicone rubber to form a rubber button containing contacts, as shown in FIG.
  • the silicone rubber surface of the small round particles is thermally vulcanized and bonded to other silicone rubbers with the metal plating side facing outward so that the metal plating can form contact with other contacts such as gold-plated contacts on a printed circuit board (PCB). ,as shown in picture 2.
  • PCB printed circuit board
  • the metal foil used was the same as in Example 1, except that the fine-corrugated stainless steel sheet was first plated with a 2.5 ⁇ m thick nickel by electroless plating.
  • the purpose of nickel plating is to reduce the surface resistance of the metal foil (because the conductivity of nickel is larger than that of stainless steel) and to make the adhesion between the stainless steel and the tin alloy coating stronger.
  • the thus treated metal foil is then compounded with silicone rubber, and then die-cut into small discs, electroless tin-plated alloys, and finally detuned and arc-resistant ablation buttons are produced.
  • Example 1 As in Example 1, a small wafer containing a layer of silicone rubber and stainless steel was prepared, and then a small layer of 2.5 ⁇ m thick nickel was plated on the small wafer, and then, as shown in Embodiment 1, on the metal surface of the small wafer, A 2.5-5.0 ⁇ m-thick tin alloy layer was plated, and the object to be plated was used as a metal contact, and then a deflagrating arc-resistant ablation button was produced.
  • composition of the electroless plating bath used is different.
  • the composition of the plating solution used in this embodiment is: 15 g/L of stannous chloride dihydrate, 0.3 g/L of lead chloride, 75 g/L of sodium citrate dihydrate, and disodium 25 mg of diamethylenediaminetetraacetate.
  • L, aminotriacetic acid 15g / L, sodium saccharin 2g / L, titanium trichloride 8g / L, ammonia or 10% acetic acid is added in an appropriate amount to make the pH between 6.0-7.5.
  • the electroless plating temperature was set to 60 ° C and the time was set to 1 hour.
  • the obtained plating layer was a tin-lead alloy plating layer. This coating is more stable during storage and use and does not grow into a tin whisker. Buttons with this plating do not cause contact jitter.
  • Example 2 As in Example 1, a fine corrugated stainless steel sheet and silicone rubber were made into a 1.0 mm thick layered composite sheet of stainless steel and silicone rubber. The composite sheet was washed with a 10% dilute sulfuric acid solution for 3 minutes. This sheet was then plated with a 2.5-5.0 ⁇ m thick tin alloy plating. The bath and conditions used are:
  • benzalkonium is a brightener.
  • Sulfuric acid has the effects of reducing the activity of stannous ions, preventing hydrolysis thereof, improving the conductivity of the plating solution, and the efficiency of the anode current.
  • the amount of sulfuric acid is insufficient, the stannous ion is easily oxidized to tetravalent tin.
  • the sheet coated with the tin alloy was then punched into small discs having a diameter of 5 mm.
  • the small wafer as a metal contact, is thermally vulcanized and thermally vulcanized with silicone rubber to form a rubber button containing a contact.
  • the resulting buttons also have good debounce and arc ablation resistance.
  • the stainless steel plain mesh of 400 mesh (stainless steel model 304) was used instead of the fine corrugated stainless steel sheet of Example 1, and the contact made by the method of the first embodiment also had better debounce effect and comparison. Good resistance to arc ablation.
  • the 400 mesh stainless steel mesh has a small mesh opening, and the silicone rubber does not penetrate the mesh of the stainless steel mesh when molded with the silicone rubber. If a stainless steel mesh with a small mesh size, such as a stainless steel mesh of 80 mesh or less, is used, a process problem in which the silicone rubber penetrates the stainless steel mesh is generated during molding. Therefore, a larger mesh stainless steel mesh is required to prepare a plated switch contact.
  • a rubber button having a contact with a tin-plated layer was prepared as in Examples 1, 2, 3, 5 or 6.
  • the rubber button is treated with an alkaline lead solution to replace the tin portion of the tin plating layer on the contact surface with lead, thereby forming an extremely thin tin-lead alloy on the surface of the contact plating layer.
  • the rubber button has the debounce function and the arc ablation resistance, and the contact plating of the rubber button does not grow "whiskers".

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Abstract

一种消抖的按键及其制备方法，按键由橡胶基材（4）和具有三层层状结构的金属触点（1、2、3）构成，在金属触点的表面，以电镀或化学镀的方法镀有一层锡合金或铅合金（3），镀有锡合金或铅合金的金属触点，具有良好的抗触点抖动性能和耐电弧烧蚀性能，金属触点和橡胶进一步复合成型，制备消抖的橡胶按键。

Description

一种消抖的按键及其制备方法 技术领域
本发明具体涉及一种电力或电子产品中的开关或电路中两个导体之间可通过相互接触从而可供电流通过的零部件(也就是电触头或触点)及其制备方法。
背景技术
在含有金属触点的机械式开关接通或断开时，由于触点的弹性作用，触点可能不会马上稳定地接通或断开，而是在接通或断开的瞬间产生一连串的抖动,也就是一连串的接通和断开。抖动时间可达20毫秒以上。触点抖动(或按键抖动、开关抖动)会引起一次人工开关操作被误读多次。这种抖动，轻者会造成电路“连击”响应，严重的会导致电路设计彻底失败，导致各种事故。因此，在一些应用中，必须消除触点抖动。消除触点抖动的方法有硬件法和软件法等方法。硬件法就加去抖动电路，软件法有延迟法和采样法。这些方法在以下文献中进行了介绍：
[1].李洪宇，黄鹤松，姬培峰.防止机械抖动的三种可靠方法[J],电子元器件应用，2004，6(6)，53-55.
[1].曾旖，奚大顺，李向阳.按键开关的抖动与消除方法[J],电子世界，2005，(9),55-56.
[2].方龙，肖献保，李威.关于消除按键机械抖动的研究[J]，广西轻工业，2008，(1)，92,105.
申请号为201110340157.5的专利文件“一种消除按键抖动的方法、装置及键盘”、申请号为：200910058845.5的专利文件“一种去除按键抖动的方法和系统”公开了通过按键信息的处理方法和系统来消除按键抖动的。申请号为201310004739.5的专利文件“一种防抖动电路”和申请号为201210555174.5的专利文件“一种消除机械抖动的开关电路”都是通过防抖动电路来消除抖动。申请号为200780034448.3的专利文件“开关电路和相关的去抖动方法”是通过西格玛-德尔塔调制器对开关的输出量进行去抖动处理。美国专利7809867“Keypad de-bouncing apparatus and method”和美国专利申请20110004711“Keypad de-bouncing apparatus and method”也是通过电路设计来消除按键抖动。无论是硬件法还是软件法，都是通过电路、电路硬件或软件来消除触点和按键的抖动的影响。本发明将通过在触点的金属材质上镀一层锡合金或铅合金，从根本上弱化或消除触点抖动，并且同时提高触点的耐电弧烧蚀性能或使用寿命。
本专利权人的申请专利号为201110193369.5的发明提供了一种“麻面金属与橡胶复合导电粒”，由金属面层与橡胶基体粘合而成，或者粘合后分切而成。金属面层为麻面，具有凹坑、凸点或者两者均有；凹坑或凸点在金属面层的外表面、内表面或者两个表面均有。凹坑的深度小于金属面层厚度，凸点的高度不小于金属面层厚度的十分之一。金属面层的材质为金属或合金，外表面可镀金、银、铜、铝、镍、铬、铑、锌、钼、锡、钴、钨或铁以及它们 的合金；橡胶基体为硅橡胶或聚氨酯橡胶等；金属面层与橡胶基体之间可有粘接层，粘接层为热硫化胶粘剂、底涂剂或为与橡胶基体相同的材质。金属面层内表面可涂有偶联剂等助剂。本发明的金属面层强度高、导电性稳定，粘接层强度高，橡胶基体弹性足。但该发明没有为解决导电粒的抖动问题和电弧烧蚀问题提出解决方案。该发明也没有提出如何在金属面层的外表面上获得一层或多层镀层的具体方法，没有说明如何让金属镀层选择性地沉积在金属的表面上而不沉积在橡胶的方法。
发明内容
本发明公开的一种消抖的按键由橡胶基材和金属触点构成，其中金属触点是具有三层层状结构的层状复合体，典型的形状是圆柱型的或椭圆柱型的；金属触点的第一层为0.1mm至10mm厚的橡胶层，第二层为0.01mm至1.0mm厚的含镁、铝、钛、铬、锰、铁、钴、镍、铜、锌、铌、钼、银、锡、钽或钨的金属薄片层，第三层为0.01-10μm厚锡合金镀层或铅合金镀层，如图1所示；其中，第三层是由以下三种方法中的任意一种形成的：
第一种方法是将第一层和第二层的复合体浸渍在含有可溶性的锡化合物或铅化合物的电镀液中，用电镀的方法，将锡合金或铅合金选择性地沉积上去在复合体中的金属面上而形成的；
第二种方法是将第一层和第二层的复合体浸渍在含有可溶性的锡化合物或铅化合物的化学镀液中，用化学沉积的方法，将锡合金或铅合金选择性地沉积到复合体中的金属表面上而形成的；
第三种方法是用化学镀或电镀的方法在第二层金属基材的一面或两面，镀上锡合金或铅合金，然后，将金属基材和橡胶复合，形成具有橡胶层、金属薄片层和镀层的三层结构的层状复合体。
由这三种方法，都可得到标示在图1中的金属触点。
这种消抖的按键中的橡胶基材是由天然橡胶、丁苯橡胶、顺丁橡胶、乙丙橡胶、三元乙丙橡胶、聚氨酯橡胶、甲基乙烯基硅橡胶或甲基乙烯基苯基硅橡胶制备而成的；橡胶基材优选由三元乙丙橡胶、甲基乙烯基硅橡胶或甲基乙烯基苯基硅橡胶制备而成。橡胶基材的材质最好和金属触点中疏水性橡胶层的材质相同，以便两者在热硫化粘合时获得良好的粘合强度。
在上述制备金属触点第三层(锡合金镀层或铅合金镀层)的第一种方法和第二种方法中，第一层是由疏水性橡胶构成的；所述的疏水性橡胶是由于橡胶分子链上羧基、羟基、羰基、氨基、酰胺基、腈基、硝基、卤基、巯基、磺酸根和苯磺酸根含量低，从而使橡胶表面的水接触角大于65°的橡胶材料，或者，是由于橡胶中不含或含有少量的亲水性的填料或添加剂， 从而使橡胶表面的水接触角大于65°的橡胶材料。
疏水性橡胶对水具有排斥能力，水不能在疏水性橡胶表面铺展开来。为了实现的选择性电镀或化学镀，在由第一层疏水性橡胶层和第二层金属薄片的复合体中的橡胶材质的疏水性越高越好。为了使沉积在第一层疏水性橡胶层上的金属少得可以忽略不计，橡胶基材的水接触角需大于65°。橡胶分子链上羧基、羟基、羰基、氨基、酰胺基、腈基、硝基、卤基、巯基、磺酸根和苯磺酸根，将增大橡胶的极性和亲水性。特别是羧基、羟基、磺酸根和苯磺酸根，将极大的增大橡胶的极性和亲水性。因此必须控制橡胶中这些基团的含量。高腈基含量的丁腈橡胶和氢化丁腈橡胶、端羧基液体丁腈橡胶、氯磺化聚乙烯橡胶、氯醚橡胶、丙烯酸酯橡胶、聚氨酯橡胶等极性橡胶，以及亲水化的橡胶(如亲水性硅橡胶)、水膨胀橡胶、含有大量亲水性或吸水性填料的橡胶材料、含有表面活性剂或抗静电剂的橡胶材料等材料的极性大、或材料表面的极性大，不宜在本发明中开关触点中使用。如果使用这样的橡胶材料，在进行电镀或化学镀时，将使金属也或多或少地沉积在这些橡胶材料上。如果橡胶材料上有金属的沉积层，将不仅浪费镀液，而且不利于橡胶材质与其它橡胶材质的热硫化粘合或热塑性粘合，而这种热硫化粘合是后续加工中所必需的。
作为优化，所述的疏水性橡胶层由非极性或极性弱的橡胶制备而成。作为进一步的优化，所述的疏水性橡胶层由三元乙丙橡胶、甲基乙烯基硅橡胶或甲基乙烯基苯基硅橡胶制备而成。三元乙丙橡胶、甲基乙烯基硅橡胶和甲基乙烯基苯基硅橡胶是非极性橡胶，疏水性强，同时它们的耐候性好，在大气中能长期保持良好的弹性，因此，它们是所述的疏水性橡胶层的优先选用的材料。
在上述制备金属触点第三层(锡合金镀层或铅合金镀层)的第三种方法中，对第一层橡胶的疏水性不作严格要求。疏水性不强的橡胶也可以用来制作金属触点中的橡胶层。
本发明中的金属薄片层为具有凸点或凹点的金属片材、具有凸线条或凹线条的金属片材、具有凸面或凹面的金属片材、具有面积小于1mm2的小孔的金属片材、金属网、金属泡沫或者金属纤维烧结毡；金属材质为镁、铝、钛、铬、锰、铁、钴、镍、铜、锌、铌、钼、银、锡、钽、钨或含有这些元素的合金；所述的金属薄片是单一金属材质的或不同金属材质层状复合的。金属薄片层的材质优选化学稳定性较好、电导率较高且价格比较低的金属或合金。
作为优化，所述的金属薄片层的金属薄片由0.01-1.0mm厚的不锈钢、铜或铜合金、镍或镍合金薄片构成，在不锈钢、铜或铜合金、镍或镍合金薄片的一面或两面，或镀有0.01-10μm的纯镍层或镍合金层、纯钴层或钴合金层；不锈钢、铜或铜合金、镍或镍合金薄片上的纯镍层或镍合金层、纯钴层或钴合金层是由真空镀膜、电镀或化学镀的方法制备的。
作为优化，所述的第二层的金属薄片由0.01-1.0mm厚的不锈钢、铜或铜合金、镍或镍合 金薄片构成，在不锈钢、铜或铜合金、镍或镍合金薄片的一面或两面，镀有0.1-10μm的纯镍层或镍合金层；不锈钢、铜或铜合金、镍或镍合金薄片上的镍合金层是由真空镀膜、电镀或化学镀的方法制备的。在不锈钢、铜或铜合金、镍或镍合金薄片上镀一纯镍层或镍合金层，钴或钴合金、钼或钼合金，可以提高金属薄片与镀层的粘合强度，避免镀层在触点使用过程中脱落。
金属薄片的厚度不宜过薄。如果第二层的金属薄片厚度低于0.01mm，就不能很好地支撑镀层，在与橡胶复合之前、之中或之后的加工中容易破裂。如果第二层的金属薄片太厚，就会增加触点的整体硬度，分割或冲切加工变得困难，同时浪费金属材料。所以，金属薄片的厚度，不宜大于1.0mm。
预先将第一层的疏水性橡胶层和第二层的金属薄片制成层状复合体，是为了方便将层状复合体作为触点应用于制备橡胶按键。层状复合体上的疏水性橡胶，可直接与其它橡胶进行热硫化粘合或热塑性粘合而形成橡胶按键。如果将没有橡胶层的金属薄片和其它橡胶进行热硫化粘合或热塑性粘合而形成橡胶按键，就会在模塑过程中发生溢胶现象。所谓溢胶现象，是指在模塑过程中，橡胶溢到触点的正面，从而影响触点的导电性能。触点上有溢胶现象，对触点的质量来说是不可接受的。
本发明的公开的一种消抖的按键的制备方法包括如下步骤：
(1)金属薄片的处理：金属薄片为0.01mm至1.0mm厚的不锈钢、铜或铜合金、镍或镍合金薄片；用清洗剂和有机溶剂对金属薄片进行除油、清洗；或通过喷砂、打磨将金属薄片进行表面机械粗化处理；或通过化学蚀刻处理以处理出直径小于1mm的凹坑或凸点；或在金属薄片的一面或两面，用电镀或化学镀的方法镀有0.1微米至10微米的纯镍层或镍合金层、纯钴层或钴合金层；然后用清洗剂和有机溶剂对所得到的金属薄片进行除油、清洗；
(2)疏水性橡胶与金属薄片的粘合处理：疏水性橡胶层通过热硫化粘合和热硫化成型，粘合在涂有底涂剂或粘合促进剂的金属薄片上，形成层状的复合片材；或者将具有自粘性的疏水性橡胶，通过热硫化粘合和热硫化成型，粘合在涂覆有底涂剂或没有涂覆底涂剂的金属薄片上，形成层状的复合片材；
(3)切割处理：将上述步骤中的复合片材分割或冲切成包括疏水性橡胶层和金属薄片层的直径为2-10mm的圆柱体，或者将上述步骤中的复合片材分割或冲切成横截面为椭圆形、多边形、十字形、星形或者新月形或它们的任意组合的物体；用碱性清洗液清洗约5分钟，水洗，然后用5％的盐酸清洗约1分钟，然后用去离子水清洗干净，沥干；
(4)镀层的制备：将上述圆柱体或物体，浸渍在含有可溶性锡化合物或铅化合物的化学镀液中，搅拌，用化学镀的方法在圆柱体或物体的金属表面形成镀层；或者，将上述圆柱体放入含有可溶性锡化合物或铅化合物的化学镀液的滚筒中，让滚筒转动，用化学镀的方法在 上述圆柱体或物体的金属表面，形成镀层；
化学镀液中含有2.5-100g/L的可溶性锡化合物和/或铅化合物、5-150g/L的络合剂、10-125g/L的还原剂、0-50g/L的pH调节剂；
所述的可溶性锡化合物是氯化亚锡、硫酸亚锡、四氯化锡、锡酸钠、氟硼酸锡、乙酸亚锡、草酸亚锡。乙酸亚锡和草酸亚锡不溶于水，使用前先用稀盐酸溶解。
所述的可溶性铅化合物是氯化铅、硝酸铅、乙酸铅。
所述的络合剂是含有柠檬酸钠、柠檬酸钾、乙二胺四乙酸(EDTA)的钠盐、氨基三乙酸
所述的还原剂是三氯化钛、次亚磷酸钠。
所述的pH调节剂是氢氧化钾、氢氧化钠、氨水、无机酸(如盐酸)或有机酸(如乳酸、苯磺酸)、强酸弱碱盐(如硫酸铵)或强碱弱酸盐(如醋酸钠、碳酸钠)。
化学镀温度控制在50-95℃之间，以保证一定的反应速度。
化学镀的时间控制10分钟到2小时之间，以保证镀层的厚度。通常镀层的厚度在0.3μm以上，就可使触点抖动的时间显著减少，甚至不抖动。
(5)清洗、干燥：取出上述被镀物，用蒸馏水或去离子水漂洗、沥干、冷风吹干或放在70℃的恒温烘箱中烘干，即得到金属表面有锡合金或铅合金镀层的开关触点。
(6)镀后处理：将上述步骤所得的触点，应用于步骤(7)，或者在应用于步骤(7)之前或之后，对镀有锡合金或铅合金的触点进行镀后处理，镀后处理的方法是：
在触点锡合金或铅合金的表面，施加一层水溶性的或有机溶剂型的锡合金保护剂或锡镀层表面抗氧化剂，或遵循发明专利申请号为03119045.6“锡镀层表面抗氧化剂及其使用工艺”所描述的方法；或者在触点表面涂一层不导电的具有灭弧润滑效果的润滑油、锂基脂或有机硅脂的复合物，优选选用商品化的灭弧脂；或将镀有锡合金的触点，用含铅的碱性溶液进行处理，使触点表面的部分锡被铅置换，在触点表面形成锡铅合金。
(7)将上述金属触点与橡胶进行热硫化粘合和热硫化成型，成型时上述金属触点中的橡胶层与其它橡胶结合，制备成消抖的橡胶按键。
或者把上述步骤变更为先制备镀层,然后在将有镀层的金属薄片与疏水性橡胶层进行粘合处理，制备有镀层的复合片材。
本发明的公开的消抖的按键的另一种制备方法包括如下步骤：
(1)金属薄片层的处理：金属薄片层为0.01-1.0mm厚的不锈钢、铜或铜合金、镍或镍合金薄片；在不锈钢、铜或铜合金、镍或镍合金薄片的一面或两面，或用机械打磨、喷砂和化学蚀刻进行粗化处理，或真空镀膜、电镀或化学镀的方法镀有0.05-10微米的纯镍层或镍合金层、纯钴层或钴合金层、钼或钼合金层，或只做清洗处理；
(2)疏水性橡胶层与金属薄片层的粘合处理：疏水性橡胶层通过热硫化粘合和热硫化成型，粘合在涂有底涂剂或粘合促进剂的金属薄片层上，形成复合片材；或者将具有自粘性的疏水性橡胶，通过热硫化粘合和热硫化成型，粘合在涂覆有底涂剂或没有涂覆底涂剂的金属 薄片层上，形成复合片材；
(3)镀层的制备：将上述复合片材，浸渍在含有可溶性锡或铅的化合物的点镀液中，用电镀的方法在复合片材的金属表面形成锡合金或铅合金镀层；
镀液中含有5-100g/L的可溶性锡化合物或铅化合物、5-100g/L的络合剂、5-100g/L的还原剂、2-50g/L的pH调节剂；
(4)镀后处理：将上述步骤所得的片材，应用于步骤(5)，或者在应用于步骤(5)之前或之后，对镀有锡合金或铅合金的片材进行镀后处理，镀后处理的方法是：
在片材锡合金或铅合金的表面，施加一层水溶性的或有机溶剂型的锡合金保护剂或锡镀层表面抗氧化剂，或遵循发明专利申请号为03119045.6“锡镀层表面抗氧化剂及其使用工艺”所描述的方法；或者在片材锡合金或铅合金的表面涂一层不导电的具有灭弧润滑效果的润滑油、锂基脂或有机硅脂的复合物，优选选用商品化的灭弧脂；或将镀有锡合金的片材，用含铅的碱性溶液进行处理，使片材表面的部分锡被铅置换，在片材表面形成锡铅合金。
(5)切割处理：将上述步骤中的复合片材分割或冲切成包括橡胶层和金属薄片层和镀层的直径为2-10mm的圆柱体；
(6)将上述圆柱体作为金属触点与橡胶进行热硫化粘合和热硫化成型，成型时上述金属触点中的橡胶层与其它橡胶结合，制备成橡胶按键。
或者把上述步骤变更为先制备镀层,然后在将有镀层的金属薄片与疏水性橡胶层进行粘合处理，制备有镀层的复合片材。
制备所述的锡合金镀层或铅合金镀层的化学镀液或电镀液中，可同时含有可溶性锡化合物和可溶性铅化合物；作为优化，制备所述的锡合金镀层或铅合金镀层的镀液中，含有5-100g/L的氯化亚锡和氯化铅，其中氯化亚锡和氯化铅的重量比为5:1-100:1。这样所得的镀层中含有较多的锡和较少的铅。少量铅的存在，将抑制在存放和使用过程中，锡合金镀层长出“须状结晶”(或称为“须晶”)。
在上述电镀镀液中或化学镀液中，含有0.05-2g/L的光亮剂；所述的光亮剂为甲醛、乙醛、β-萘酚、2-甲基醛缩苯胺、苄叉丙酮、枯茗醛、二苯甲酮、氯苯甲醛、平平加、西佛碱、丁炔二醇、丙炔醇、1-二乙胺基丙-2-炔、乙氧化丙炔醇、邻磺酰苯甲酰亚胺(又称糖精)、邻磺酰苯酰亚胺钠(又称糖精钠)、乙烯基磺酸钠、丙炔磺酸钠、吡啶-2-羟基丙磺酸内盐、烷基酚聚氧乙烯醚或市售的商品化的光亮剂。在锡合金的化学镀液中加入光亮剂如糖精钠后，就会得到“亮锡”镀层。在电镀锡铅合金镀层时使用光亮剂，得到光亮的镀层，但也会改变镀层成分(即锡、铅比例)。所以，使用光亮剂时，要注意相应地改变镀液中亚锡离子和铅离子的比例，才能保证得到所需要成分的锡铅合金镀层。
有益效果：
本发明公开的按键中的金属触点上有层锡合金、铅合金或锡铅合金，具有良好的抗触点抖动性能，而且，有锡合金、铅合金或锡铅合金的金属触点的耐电弧烧蚀性能也比由没有镀 层的不锈钢、铜和铜合金、镍和镍合金、钴和钴合金等金属材质制备的金属触点好，从而能够提高触点的操作可靠性。或者说，本发明通过在金属触点上涂覆锡或铅合金的镀层，消除了触点抖动、延长了触点使用寿命。由于含有橡胶层，这种触点适合于与其它橡胶进行热硫化粘合和热硫化成型，从而制成带有触点的橡胶按键产品。这种按键和印刷电路板(PCB)组合在一起，就构成了一个消抖的按键开关。
附图说明
图1为本发明的消抖的按键的结构示意图；图中：1、橡胶层；2、金属薄片层；3、锡合金或铅合金镀层；4、橡胶基材；其中1、2和3构成金属触点；
图2为消抖的按键开关示意图；图中：1、橡胶层；2、金属薄片层；3、锡合金或铅合金镀层；4、橡胶基材；5、印刷电路板上的镀金触点；6、印刷电路板；
图3为本发明的普通按键镀镍上的抖动测试图；
图4为本发明的镀锡按键上的抖动测试图。
具体实施方式
实施例1：
如图1-2所示，为本发明的结构示意图：橡胶层1、金属薄片层2、锡合金或铅合金镀层3、橡胶基材4、印刷电路板上的镀金触点5、印刷电路板6。如图3-4所示，在普通按键镀镍上的抖动测试图中有一段抖动的痕迹，而本发明的镀锡按键上，按键没有抖动的迹象。
以0.1mm厚的不锈钢(型号为304；国标牌号为0Cr18Ni9)制作其中的金属薄片层。用机械法滚压成有细波纹状的片材，波纹峰高为0.1mm，峰间距为0.2mm。然后用pH值为9左右的碱性清洗液进行清洗除油，水洗，用工业酒精进行进一步清洗除油，然后冷风吹干。用其它方法进行清洗除油和活化也是可以的。
将一种甲基乙烯基苯基硅橡胶(例如采用德国瓦克公司生产的
Figure PCTCN2015084167-appb-000001
R 401/60)和乙烯基三特丁基过氧硅烷(VTPS)和过氧化二异丙苯(DCP)用开炼机混炼均匀。VTPS在混炼胶中的含量是1％，DCP在混炼胶中的含量是0.5％。VTPS是一种含有过氧化合物成份的偶联剂，它既可以使含乙烯基的硅橡胶交联，同时也促进含乙烯基的硅橡胶与金属(如镍、碳钢、不锈钢、铜等)之间的粘合。
将有细波纹状的不锈钢片材和上述混炼胶在165℃下进行热硫化粘合和热硫化成型，硫化时间为12分钟。形成1.0mm厚的不锈钢和硅橡胶的层状复合片材。制得此复合片材的模具的模腔表面，有特氟龙涂层。特氟龙涂层的存在，防止了混炼胶在热硫化过程中粘模。将此复合片材冲切成直径为5mm的小圆片。把这种小圆粒用碱性清洗液清洗分钟，水洗，然后放在10％的稀硫酸中活化1min，然后清洗，沥干。
配置组成如下的化学镀液：
二水氯化亚锡8g/L，二水柠檬酸钠75g/L，二水乙二胺四乙酸二钠20g/L，乙酸钠10g/L， 苯磺酸0.5g/L，糖精钠0.2g/L，三氯化钛8g/L，氨水适量加入，使pH在8.0-9.0之间。化学镀液现配现用。三氯化钛可去离子水或稀盐酸溶解，不过早地加入到镀液中。
将上述的500粒小圆片，放入80℃的上述300mL镀液中，不断搅拌，60分钟后取出，用蒸馏水或去离子水漂洗、沥干、冷风吹干或放在70℃的恒温烘箱中烘干，即得到金属表面镀有锡层的小圆粒。
将这种含有硅橡胶层的镀锡层的小圆粒，作为触点，和硅橡胶进行热硫化粘合和热硫化成型，形成含有触点的橡胶按键，如图1所示。小圆粒中的硅橡胶面和其它硅橡胶热硫化粘合，有金属镀层的一面朝外，以便金属镀层可以和其它触点如印刷电路板(PCB)上的镀金触点接触而形成通路,如图2所示。这种按键中的触点其它触点(如PCB上的镀金触点)接触时，基本上不产生触点抖动现象，或者说其抖动时间接近零。因此，这种按键是一种消抖的按键。我们的测试表明，在触点间的电流为50毫安时，开关次数在10万次以上，触点间的电阻基本不增加，触点的导通性能良好。在触点间电流为300毫安时，开关次数在3.0万次时，触点间的接触电阻基本上不增加，维持在1欧姆以内。相比较地，含有相应的没有镀锡层的不锈钢触点的按键与PCB上的镀金触点接触时，将产生触点抖动现象，抖动时间平均约10毫秒，在触点间电流为300毫安时，开关约3000千次后，触点间的电阻就开始显著增加,升到10欧姆以上。
实施例2：
所用的金属薄片和实施例1一样，只是先将金属薄片以化学镀的方法，将有细波纹的不锈钢片镀上一层2.5μm厚的镍。镀镍的目的，一是使金属薄片的表面电阻降低(因为镍的电导率比不锈钢大)，二是使不锈钢和锡合金镀层之间的粘合更牢固。然后将如此处理的金属薄片，和硅橡胶复合，再冲切成小圆片、化学镀锡合金，最后制作出消抖的和耐电弧烧蚀的按键。
实施例3：
如实施例1，制得含有硅橡胶和不锈钢层的小圆片，再在这小圆片上镀一层2.5μm厚的镍，然后在如实施1所示，在小圆片的金属表面上，镀上2.5-5.0μm厚的锡合金层，以此被镀物作为金属触点，然后制作出消抖的耐电弧烧蚀的按键。
实施例4：
所有过程如实施例1、2或3，只是所使用的化学镀液的组成不同。本实施例中采用的镀液的组成是：二水氯化亚锡15g/L，氯化铅0.3g/L，二水柠檬酸钠75g/L，二水乙二胺四乙酸二钠25/L，氨基三乙酸15g/L，糖精钠2g/L，三氯化钛8g/L，氨水或10％的醋酸适量加入，使pH在6.0-7.5之间。化学镀温度设定为60℃，时间设定为1小时。
使用上述镀液，所得到的镀层是锡铅合金镀层。这种镀层在存放和使用过程中更稳定，不会长成锡的“须晶”。有这种镀层的按键，不产生触点抖动现象。
实施例5：
如实施例1，将有细波纹的不锈钢片材和硅橡胶制成1.0mm厚的不锈钢和硅橡胶的层状复合片材。用10％的稀硫酸溶液清洗此复合片材3分钟。然后将此片材电镀上2.5-5.0μm厚的锡合金镀层。所用的镀液和条件是：
硫酸亚锡50g/L，硫酸90g/L，苄叉丙酮0.4g/L。镀液温度控制在15℃左右，阴极电流密度为1.0A/dm2。
在镀液中，苄叉丙酮是光亮剂。硫酸具有降低亚锡离子的活性、防止其水解、提高镀液导电性能及阳极电流效率等作用。当硫酸量不足时，亚锡离子易氧化成四价锡。
然后将此镀有锡合金的片材冲切成直径为5mm的小圆片。将这种小圆片，作为金属触点，和硅橡胶进行热硫化粘合和热硫化成型，形成含有触点的橡胶按键。所制得的按键同样具有良好的消抖效果和耐电弧烧蚀性能。
实施例6：
以400目的不锈钢平纹网(不锈钢型号为304)代替实施例1中的有细波纹状的不锈钢片，采用实施1中的工艺，所制得的触点，也具有较好的消抖效果和较好的耐电弧烧蚀性能。
400目的不锈钢网网孔很小，在和硅橡胶模压时，硅橡胶不会穿透不锈钢网的网孔。如果选用目数小的不锈钢网，如80目以下的不锈钢网，在模压时就会产生硅橡胶穿透不锈钢网孔的工艺问题。因此，需采用较大目数的不锈钢网来制备有镀层的开关触点。
实施例7：
如实施例1、2、3、5或6制得有含有镀锡层的触点的橡胶按键。将这种橡胶按键用碱性的铅溶液处理，使触点表面锡镀层中的锡部分被铅置换，从而在触点镀层的表面形成极薄的锡铅合金。这样，橡胶按键在具有消抖功能和耐电弧烧蚀的同时，橡胶按键中触点镀层也不会长出“须晶”。

Claims (10)

  1. 一种消抖的按键，其特征在于：按键由橡胶基材和金属触点构成，其中金属触点是具有三层层状结构的层状复合体；第一层为0.1mm至10mm厚的橡胶层，第二层为0.01mm至1.0mm厚的含镁、铝、钛、铬、锰、铁、钴、镍、铜、锌、铌、钼、银、锡、钽或钨的金属薄片层，第三层为0.01-10微米厚锡合金镀层或铅合金镀层；其中，第三层是由以下三种方法中的任意一种形成的：
    第一种方法是将第一层和第二层的复合体浸渍在含有可溶性的锡化合物或铅化合物的电镀液中，用电镀的方法，将锡合金或铅合金选择性地沉积上去在复合体中的金属面上而形成的；
    第二种方法是将第一层和第二层的复合体浸渍在含有可溶性的锡化合物或铅化合物的化学镀液中，用化学沉积的方法，将锡合金或铅合金选择性地沉积到复合体中的金属表面上而形成的；
    第三种方法是用化学镀或电镀的方法在第二层金属基材的一面或两面，镀上锡合金或铅合金，然后，将金属基材和橡胶复合，形成具有橡胶层、金属薄片层和镀层的三层结构的层状复合体。
  2. 根据权利要求1所述的消抖的按键，其特征在于：橡胶基材是由天然橡胶、丁苯橡胶、顺丁橡胶、乙丙橡胶、三元乙丙橡胶、聚氨酯橡胶、甲基乙烯基硅橡胶或甲基乙烯基苯基硅橡胶制备而成的；橡胶基材优选为由三元乙丙橡胶、甲基乙烯基硅橡胶或甲基乙烯基苯基硅橡胶制备而成。
  3. 根据权利要求1所述的消抖的按键，其特征在于：在制备金属触点第三层的第一种方法和第二种方法中，第一层是由疏水性橡胶构成的；所述的疏水性橡胶是由于橡胶分子链上羧基、羟基、羰基、氨基、酰胺基、腈基、硝基、卤基、巯基、磺酸根和苯磺酸根含量低，从而使橡胶表面的水接触角大于65°的橡胶材料，或者，是由于橡胶中不含或含有少量的亲水性的填料或添加剂，从而使橡胶表面的水接触角大于65°的橡胶材料。
  4. 根据权利要求1和3所述的消抖的按键，其特征在于：所述的疏水性橡胶由非极性或极性弱的橡胶制备而成；优选由三元乙丙橡胶、甲基乙烯基硅橡胶或甲基乙烯基苯基硅橡胶制备而成。
  5. 根据权利要求1所述的消抖的按键，其特征在于：所述的金属薄片层为具有凸点或凹点的金属片材、具有凸线条或凹线条的金属片材、具有凸面或凹面的金属片材、具有面积小于1mm2的小孔的金属片材、金属网、金属泡沫或者金属纤维烧结毡；金属材质为镁、铝、钛、铬、锰、铁、钴、镍、铜、锌、铌、钼、银、锡、钽、钨或含有这些元素的合金；所述的金属薄片是单一金属材质的或由不同金属材质层状复合形成。
  6. 根据权利要求1或5所述的消抖的按键，其特征在于：所述的金属薄片层的金属薄片由0.01-1.0mm厚的不锈钢、铜或铜合金、镍或镍合金薄片构成，在不锈钢、铜或铜合金、镍或镍合金薄片的一面或两面，镀有0.01-10微米的纯镍层或镍合金层、纯钴层或钴合金层、 钼或钼合金层；不锈钢、铜或铜合金、镍或镍合金薄片上的纯镍层或镍合金层、纯钴层或钴合金层、钼或钼合金是由真空镀膜、电镀或化学镀的方法制备的。
  7. 一种消抖的按键的制备方法，其特征在于：消抖的按键的制备包括如下步骤：
    (1)金属薄片的处理：金属薄片为0.01mm至1.0mm厚的不锈钢、铜或铜合金、镍或镍合金薄片；用清洗剂和有机溶剂对金属薄片进行除油、清洗；或通过喷砂、打磨将金属薄片进行表面机械粗化处理；或通过化学蚀刻处理以处理出直径小于1mm的凹坑或凸点；或在金属薄片的一面或两面，用电镀或化学镀的方法镀有0.1微米至10微米的纯镍层或镍合金层、钴或钴合金层；然后用清洗剂和有机溶剂对所得到的金属薄片进行除油、清洗；
    (2)疏水性橡胶与金属薄片的粘合处理：疏水性橡胶层通过热硫化粘合和热硫化成型，粘合在涂有底涂剂或粘合促进剂的金属薄片上，形成层状的复合片材；或者将具有自粘性的疏水性橡胶，通过热硫化粘合和热硫化成型，粘合在涂覆有底涂剂或没有涂覆底涂剂的金属薄片上，形成层状的复合片材；
    (3)切割处理：将上述步骤中的复合片材分割或冲切成包括疏水性橡胶层和金属薄片层的直径为2-10mm的圆柱体；或者将上述步骤中的复合片材分割或冲切成横截面为椭圆形、多边形、十字形、星形或者新月形或它们的任意组合的物体；用碱性清洗液清洗约5分钟，水洗，然后用5％的盐酸清洗约1分钟，然后用去离子水清洗干净，沥干；
    (4)镀层的制备：将上述圆柱体，浸渍在含有可溶性锡或铅的化合物的化学镀液中，搅拌，用化学镀的方法在圆柱体或物体的金属表面形成镀层；或者，将上述圆柱体放入含有可溶性锡或铅的化合物的化学镀液的滚筒中，让滚筒转动，用化学镀的方法在上述圆柱体的金属表面，形成镀层；
    化学镀液中含有5-100g/L的可溶性锡化合物或铅化合物、5-100g/L的络合剂、5-100g/L的还原剂、2-50g/L的pH调节剂；
    (5)清洗、干燥：取出上述被镀物，用蒸馏水或去离子水漂洗、沥干、冷风吹干或放在70℃的恒温烘箱中烘干，即得到金属面层镀有锡合金或铅合金的触点；
    (6)镀后处理：将上述步骤所得的触点，应用于步骤(7)，或者在应用于步骤(7)之前或之后，对镀有锡合金或铅合金的触点进行镀后处理，镀后处理的方法是：
    在触点锡合金或铅合金的表面，施加一层水溶性的或有机溶剂型的锡合金保护剂或锡镀层表面抗氧化剂；或者在触点表面涂一层不导电的具有灭弧润滑效果的润滑油、锂基脂或有机硅脂的复合物，优选选用商品化的灭弧脂；或将镀有锡合金的触点，用含铅的碱性溶液进行处理，使触点表面的部分锡被铅置换，在触点表面形成锡铅合金；
    (7)将上述金属触点与橡胶进行热硫化粘合和热硫化成型，成型时上述金属触点中的橡胶层与其它橡胶结合，制备成消抖的橡胶按键；
    或者把上述步骤变更为先制备镀层,然后在将有镀层的金属薄片与疏水性橡胶层进行粘合处理，制备有镀层的复合片材。
  8. 一种消抖的按键的制备方法，其特征在于：消抖的按键的制备包括如下步骤：
    (1)金属薄片层的处理：金属薄片层为0.01-1.0mm厚的不锈钢、铜或铜合金、镍或镍合金薄片；在不锈钢、铜或铜合金、镍或镍合金薄片的一面或两面，或用机械打磨、喷砂和化学蚀刻进行粗化处理，或真空镀膜、电镀或化学镀的方法镀有0.05-10微米的纯镍层或镍合金层、纯钴层或钴合金层、钼或钼合金层，或只做清洗处理；
    (2)疏水性橡胶层与金属薄片层的粘合处理：疏水性橡胶层通过热硫化粘合和热硫化成型，粘合在涂有底涂剂或粘合促进剂的金属薄片层上，形成复合片材；或者将具有自粘性的疏水性橡胶，通过热硫化粘合和热硫化成型，粘合在涂覆有底涂剂或没有涂覆底涂剂的金属薄片层上，形成复合片材；
    (3)镀层的制备：将上述复合片材，浸渍在含有可溶性锡或铅的化合物的点镀液中，用电镀的方法在复合片材的金属表面形成锡合金或铅合金镀层；
    镀液中含有5-100g/L的可溶性锡化合物或铅化合物、0-100g/L的络合剂、10-120g/L的pH调节剂
    (4)镀后处理：将上述步骤所得的片材，应用于步骤(5)，或者在应用于步骤(5)之前或之后，对镀有锡合金或铅合金的片材进行镀后处理，镀后处理的方法是：
    在片材锡合金或铅合金的表面，施加一层水溶性的或有机溶剂型的锡合金保护剂或锡镀层表面抗氧化剂；或者在片材锡合金或铅合金的表面涂一层不导电的具有灭弧润滑效果的润滑油、锂基脂或有机硅脂的复合物，优选选用商品化的灭弧脂；或将镀有锡合金的片材，用含铅的碱性溶液进行处理，使片材表面的部分锡被铅置换，在片材表面形成锡铅合金；
    (5)切割处理：将上述步骤中的复合片材分割或冲切成包括橡胶层和金属薄片层和镀层的直径为2-10mm的圆柱体；
    (6)将上述圆柱体作为金属触点与橡胶进行热硫化粘合和热硫化成型，成型时上述金属触点中的橡胶层与其它橡胶结合，制备成橡胶按键；
    或者把上述步骤变更为先制备镀层,然后在将有镀层的金属薄片与疏水性橡胶层进行粘合处理，制备有镀层的复合片材。
  9. 根据权利要求7或8所述的消抖的按键的制备方法，其特征在于：制备所述的锡合金镀层或铅合金镀层的电镀液或化学镀液中，同时含有可溶性锡化合物和可溶性铅化合物；作为优化，制备所述的锡合金镀层或铅合金镀层的电镀液或化学镀液中，含有5-100g/L的氯化亚锡和氯化铅，其中氯化亚锡和氯化铅的重量比为1:5-1:100。
  10. 根据权利要求7或8所述的消抖的按键的制备方法，其特征在于：制备所述的锡合金镀层或铅合金镀层的电镀液或化学镀液中，含有0.05-50g/L的光亮剂；所述的光亮剂为甲醛、乙醛、β-萘酚、2-甲基醛缩苯胺、苄叉丙酮、枯茗醛、二苯甲酮、氯苯甲醛、平平加、西佛碱、丁炔二醇、丙炔醇、1-二乙胺基丙-2-炔、乙氧化丙炔醇、邻磺酰苯甲酰亚胺、邻磺酰苯酰亚胺钠、乙烯基磺酸钠、丙炔磺酸钠、吡啶-2-羟基丙磺酸内盐、烷基酚聚氧乙烯醚或市售 的商品化的电镀或化学镀光亮剂。
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