CN103700517A - 开关触点元件及其制备方法 - Google Patents

开关触点元件及其制备方法 Download PDF

Info

Publication number
CN103700517A
CN103700517A CN201310748955.0A CN201310748955A CN103700517A CN 103700517 A CN103700517 A CN 103700517A CN 201310748955 A CN201310748955 A CN 201310748955A CN 103700517 A CN103700517 A CN 103700517A
Authority
CN
China
Prior art keywords
thickness
base metal
layer
coating
deck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201310748955.0A
Other languages
English (en)
Other versions
CN103700517B (zh
Inventor
韩辉升
张红梅
陈元
丁阳
邬国强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANTONG WANDE ELECTRONIC INDUSTRY Co Ltd
Original Assignee
NANTONG WANDE ELECTRONIC INDUSTRY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NANTONG WANDE ELECTRONIC INDUSTRY Co Ltd filed Critical NANTONG WANDE ELECTRONIC INDUSTRY Co Ltd
Priority to CN201310748955.0A priority Critical patent/CN103700517B/zh
Publication of CN103700517A publication Critical patent/CN103700517A/zh
Priority to US14/896,405 priority patent/US10026565B2/en
Priority to PCT/CN2014/090915 priority patent/WO2015101110A1/zh
Application granted granted Critical
Publication of CN103700517B publication Critical patent/CN103700517B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/02Contacts characterised by the material thereof
    • H01H1/021Composite material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/06Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/18Layered products comprising a layer of metal comprising iron or steel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1605Process or apparatus coating on selected surface areas by masking
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/32Alkaline compositions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/022Electroplating of selected surface areas using masking means
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/06Contacts characterised by the shape or structure of the contact-making surface, e.g. grooved
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/06Coating on the layer surface on metal layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/20Inorganic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/20Inorganic coating
    • B32B2255/205Metallic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/28Multiple coating on one surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/714Inert, i.e. inert to chemical degradation, corrosion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/75Printability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/78Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites
    • H01H13/785Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites characterised by the material of the contacts, e.g. conductive polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2201/00Contacts
    • H01H2201/022Material
    • H01H2201/032Conductive polymer; Rubber

Abstract

本发明公开了一种开关触点元件,具有三层的层状结构:底层为硅橡胶;中间层为连续的贱金属薄片层;上层为不连续(条纹状、凸点状或网格状)的贵金属镀层或者为不连续的贱金属镀层和贵金属镀层的双金属复合层。条纹的宽度为0.05-2mm,条纹之间的间距为0.2-2mm;凸点的顶面直径为0.2-2mm,凸点之间的间距为0.05-1mm,网格之间的孔洞面积为0.05-5mm2。底层的厚度大于中间层,中间层的厚度大于上层;上层的厚度满足以下条件:保证能够导通的电流大于电路板上导电触点的安全电流,保证设计需要的开关寿命。本发明的制备方法中具有制备局部阻镀层的工序,该局部阻镀层优选采用碱性溶液溶解的方法除去。本发明的开关触点元件,电流导通稳定性好,耐尘性、耐油污性好,原材料成本较低。

Description

开关触点元件及其制备方法
技术领域
 本发明涉及电力或电子工业中的开关或按钮中与电路接触并能够导通电路的接触元件及其制造方法。
背景技术
与开关面板或按键普通的配套使用的接触元件(或称导电粒)通常的结构是:由金属面层与弹性底层(如橡胶层)结合而成。金、银等贵金属具有良好的导电性、较好的化学稳定等性能,常用作触点材料。但其昂贵的价格,限制了它们的应用空间。贱金属如铜等,其化学稳定性不如贵金属理想;贱金属如镍、钛、铁以及包括不锈钢在内的合金,虽有较好的化学稳定性,,但作为触点材料不如贵金属理想,且它们的导电率比银、铜、金低。同贵金属比较起来,贱金属通常价廉易得,作为导电材料或触点材料使用,它们的成本比贵金属低得多。单独使用任何一种金属时优缺点同时存在。
申请专利号为 02152226.X的专利文件公开了一种“活动触点体和使用它的面板开关及装有该面板开关的电子设备”,通过将下面涂敷有粘接剂的可挠性绝缘基板制的盖板粘接在底板的上面,而使各自收容在设于可挠性绝缘基板制的基板的多个贯通孔内的活动触点保持在各贯通孔内,并且作成在除了底板的贯通孔之外的下面设置薄粘接层的活动触点体,利用薄粘接层与具有对应于活动触点的固定触点的固定触点基板贴合,而能够实现防尘性优异的面板开关。该发明采用粘结除尘的方法,不适合长期使用,甚至造成粘附过多的尘埃失去导通性。
申请专利号为201110027418.8的专利文件公开了一种“橡胶导电粒”,含有橡胶基材和其表面上的金属镀膜。金属镀膜可以是一层或者数层,金属镀膜的总厚度为0.05μm至1mm;橡胶导电粒呈柱状或者台状,横截面为圆形、椭圆形或者多边形,横截面直径为1mm至10mm。其制备方法是首先以模压、注射、挤出或者压延成型方式制得橡胶片材,然后在此橡胶片材上表面采用镀膜工艺镀金属膜层,再将此片材冲切、剪切或者激光切割而成。该发明的橡胶导电粒,其金属镀层导电性虽好,但是整体的机械强度很低,镀层一般很薄。作为开关触点,其使用寿命比较短。
申请专利号为201110193369.5 的发明提供了一种“麻面金属与橡胶复合导电粒”,由金属面层与橡胶基体粘合而成,或者粘合后分切而成。金属面层为麻面,具有凹坑、凸点或者两者均有;凹坑或凸点在金属面层的外表面、内表面或者两个表面均有。凹坑的深度小于金属面层厚度,凸点的高度不小于金属面层厚度的十分之一。金属面层的材质为金属或合金,外表面可镀金、银、铜或镍等;橡胶基体为硅橡胶或聚氨酯橡胶等;金属面层与橡胶基体之间可有粘接层,粘接层为热硫化胶粘剂、底涂剂或为与橡胶基体相同的材质。金属面层内表面可涂有偶联剂等助剂。本发明的金属面层强度高、导电性稳定,粘接层强度高,橡胶基体弹性足;该发明的麻面上镀金银等贵金属,由于表面积大,贵金属的用量比平面镀贵金属的用量还多,成本高,实用性受到了一定限制;而且,由于麻点的大小间距等与导通电流大小的关系未能清楚界定,直接使用中尚存在一些未知的技术问题需要解决。
申请专利号为2011100278634的专利文件公开了“一种用于纪念币(章)的局部镀金工艺”,介绍了一种装饰性的镀金工艺及产品。该专利不涉及局部镀金对力学性能、电学性能的影响。
发明内容
第一发明目的:克服传统的触点元件(或导电粒)力学性能、导电性能、成本不能很好兼顾的缺陷,提供一种电流导通性、耐尘性、耐油污性均好且成本较低的开关触点元件。
第一技术方案:本发明提供的开关触点元件(或称导电粒),用作开关(或按钮)的导电触点,能够与电路板(比如PCB)上的导电触点(两个或多个)接触并导通电路,为厚度0.5-8mm、横截面面积0.8-80mm2的(优选5-50 mm2)小圆柱粒、椭圆柱粒或者棱柱粒的形状,具有三层的层状结构:
底层为橡胶(优选硅橡胶);中间层为连续的贱金属薄片层;上层为不连续的全贵金属镀层或者为不连续的贱金属镀层和不连续的贵金属镀层的双金属复合层,贱金属镀层在中间层与贵金属镀层之间。
本文不连续的含义:为条纹状、密布而离散的凸点状或者网格状,所述的条纹、凸点或者网格高出于中间层。
条纹的宽度为0.05-2mm,相邻的条纹之间的间距为0.2-2mm;相邻的条纹之间的间距同时须小于配套应用的电路板上两个需导通的导电触点之间的最小间距(导电触电之间的最小间距小于0.2mm的情况不适合采用本发明的方案,也很罕见,排出在外)。
凸点类似于圆柱体或棱柱体,其顶面直径或外接圆的直径为0.2-2mm,任意相邻的两个凸点之间的间距为0.05-1mm,相邻的凸点之间的间距同时须小于配套应用的电路板上任意两个需导通的导电触点的最小间距的一半,保证同时有两个以上的凸点与某一个电路板上的导电触点接触。
组成网格的线条宽度为0.05-2mm,网格之间的孔洞面积为0.05-5mm2
底层的厚度大于中间层;中间层的厚度大于上层,且50μm<中间层的厚度<1mm。
上层的厚度满足以下条件:为条纹状时,条纹的最小宽度*厚度>2*10-4mm2,以保证能够导通的电流大于电路板的电极的安全电流;并且保证触点设计寿命,保证触点具有足够的开关(导通/断开)次数(注:金层太薄,耐电路接通或断开时产生的电弧烧蚀的次数就少)。为密布的凸点状时,凸点底面外接圆的直径*厚度>1*10-4mm2,以保证能够导通的电流大于电路板的电极的安全电流(本文的安全电流设定为0.5A);同时各自的直流电阻又较小。网格连通性、导通性较好,对镀层厚度可不做过多要求。
复合层中贱金属镀层的厚度是贵金属镀层厚度的1.5-10倍(保证成本较低,同时电阻率较低)。
所述贱金属的材质是:铜、镍、钛、铝、锌或铁,或者是铜、镍、钛、铝、锌或铁等任意一种金属的合金,或者是含有它们中任意一种金属或合金的层状复合物,优选不锈钢。这些贱金属,和贵金属比较起来,价廉易得,在大气中比较化学性质稳定,同时也具有一定导电性。
所述贵金属的材质是:金、银、钌、铑、钯、锇、铱或铂,或者是金、银、钌、铑、钯、锇、铱或铂等任意一种金属的合金,优选金。贵金属耐化学药品的的腐蚀,在一般条件下不易和环境中的污染物起化学反应,而且具有良好的导电性、导热性,导电性能稳定可靠。特别是金,在具有极佳的化学稳定性的同时,在纯金属中其电导率仅次于银和铜。
第二发明目的:提供上述开关触点的一种制备方法。
第二技术方案:该制备方法中可以含有以下先后次序的工序:
第一种工序:
1)以贱金属薄片作为底材,在底材上表面以可溶解于溶剂、酸性溶液或碱性溶液的油墨印刷一层2-10μm厚的局部阻镀层,使得在底材没有局部阻镀层的地方露出密布的凸点状、条纹状或者网格状的底材上表面;
2)在底材上表面缺少局部阻镀层的地方,镀(电镀或者化学镀)一层贵金属镀层;或者先镀一层非贵金属镀层,接着再在非贵金属镀层上面镀一层贵金属镀层;
3)将印刷的局部阻镀层采用溶剂溶解、碱性或酸性溶液溶解的方法除去;
4)将含镀层的薄片的下表面与硅橡胶贴合,进行热硫化复合,制成厚度可至0.25-5mm的复合薄片(在热硫化复合前,可以对片材的下表面用热硫化粘合剂进行底涂处理,以保证片材的下表面与硅橡胶的粘合强度);
5)将复合薄片冲切成横截面面积0.8-80mm2的小圆柱粒、棱柱粒或者椭圆柱粒。
或者,含有以下先后次序的工序:
1)以贱金属薄片为底材,在其下表面上,以热硫化的方式复合一层硅橡胶,制成厚度可至0.25-5mm的复合薄片。
2)在贱金属薄片的另一面,以可溶解于溶剂、酸性溶液或碱性溶液的油墨印刷一层2-10μm厚的局部阻镀层,使得在底材没有局部阻镀层的地方露出凸点状、条纹状或者网格状的贱金属底材;
3)在底材上表面缺少局部阻镀层的地方,镀(电镀或者化学镀)一层全贵金属镀层;或者先镀一层非贵金属镀层,接着再在非贵金属镀层上面镀一层贵金属镀层;
4)将印刷的局部阻镀层采用溶剂溶解、碱性或酸性溶液溶解的方法除去;
5)将有镀层的复合薄片冲切成横截面面积0.8-80mm2的小圆柱粒、椭圆柱粒或者棱柱粒。
5)将复合薄片冲切成直径为1-10mm的小圆粒或者短轴为1-8mm的椭圆柱粒。
有益效果:
本发明的开关触点元件,装在按键或开关里后,在按键或开关上施加相同的按压力时,与开关触点元件的上层接触处的电路板上导电触点能够产生更大的压强,电流导通性更好;电流导通的稳定性更好;而且,导通时的耐尘性、耐油污性好(灰尘和污垢更可能掉落于本发明预先已设定好的条纹或凸点之间的间隙里,上层的贵金属镀层或双金属复合层仍然具有良好的导电性,电路导通的可靠性更高。
由于上层是条纹状或点状的不连续的结构,相比传统的全面层镀金结构的导电粒,可以节省一半左右或更多的黄金等贵金属用量,双金属复合层结构能节省多至90%的贵金属用量,从而大幅度降低小圆粒的原材料成本。
采用多层的复合结构,使得该开关触点元件的机械强度足够高,抗变型能力更好,抗尘性和耐油污性大幅度提高,同时外观更立体更新颖。
附图说明
图1是本发明的一种结构的俯视图;
图2是本发明的另一种结构的俯视图;
图3是本发明的第三种结构的俯视图;
图4是图1的纵向剖面结构示意图;
图5是图1的横向剖面结构示意图;
图中:1、硅橡胶;2、贱金属薄片层;3、贱金属镀层;4、贵金属镀层;5、条纹;6、凸点;7、线条;8、孔洞。
具体实施方式
下面,结合附图和实施例对本发明作更具体的说明。
实施例1:
如图1、4、5所示的开关触点元件,为厚度3mm、横截面面积8mm2的小椭圆柱粒的形状,具有三层的层状结构。
底层为硅橡胶层1;中间层为连续的铜质的贱金属薄片层2;上层为条纹状的镍质的贱金属镀层3和金质的贵金属镀层4的双金属复合层,条纹5的宽度为1mm,相邻的条纹5之间的间距为1.5mm,复合层中贱金属镀层3的厚度是贵金属镀层4厚度的3倍。
所述的镍质的贱金属镀层3在贱金属薄片层2与金质的贵金属镀层4之间。
上层的厚度满足以下条件:条纹5的最小宽度*厚度>1*10-3mm2。底层的厚度大于中间层;中间层的厚度大于上层,且0.5mm<中间层的厚度<1mm。
实施例2: 
将0.05mm厚、长度为100mm的正方形的平整的不锈钢片(例如型号304),用碱性清洗剂清洗,然后用5%的稀盐酸溶液处理3分钟,除掉其表面氧化物,用去离子水漂洗干净,并干燥,将其一面(下表面)用一种橡胶-金属粘合剂(例如Megum 3270)进行底涂处理,然后,将处理过的下表面,和硅橡胶(例如KE 951)进行热硫化粘合,形成1.0mm厚的不锈钢-硅橡胶层状复合片材。在此复合片材中的不锈钢金属表面,局部印刷一层厚度为6微米的可溶解于有机溶剂但不溶于酸性或碱性水溶液的油墨,留下网格(7;8)状的空间,网格(7;8)的线条7宽度为1mm,网格(7;8)之间的孔洞8面积为1mm2。油墨作为局部阻镀层,使得在底材没有被局部阻镀层的地方,呈网格(7;8)状分布,露出不锈钢底材表面;在不锈钢底材表面未印刷阻镀层的部分,以电镀的方式镀一层5微米厚的镍,然后,再镀一层1微米厚的纯度大于99%的黄金;然后用有机溶剂洗去阻镀油墨;将此有有镀层的复合薄片冲切成直径为5mm的小圆柱粒。这小圆柱粒用于硅橡胶按键上,作为和PCB上的导电触点配对的触点元件,所组成的开关具有机械强度好、使用寿命长、抗尘性和油污能力有利。

Claims (5)

1.一种开关触点元件,用作开关的导电触点,能够与电路板上的两个或多个导电触点接触并导通电路,为厚度0.5-8mm、横截面面积0.8-80mm2的小圆柱粒、椭圆柱粒或者棱柱粒的形状,具有三层的层状结构,其特征在于:
底层为橡胶层(1);中间层为连续的贱金属薄片层(2);上层为条纹状、凸点状或网格状的贵金属镀层(4),或者为条纹状、凸点状或网格状的贱金属镀层(3)和贵金属镀层(4)的双金属复合层;所述的贱金属镀层(3)在中间层与贵金属镀层(4)之间;
所述贱金属的材质是铜、镍、钛、铝、锌或铁,或者是它们中任意一种金属的合金,或者是含有它们中任意一种金属或合金的层状复合物;
所述贵金属的材质是:金、银、钌、铑、钯、锇、铱或铂,或者它们中任意一种金属的合金;
条纹(5)的宽度为0.05-2mm,相邻的条纹(5)之间的间距为0.2-2mm,条纹(5)之间的间距同时须小于配套应用的电路板上任意两个导电触点之间的最小间距;
所述的凸点(6)类似于圆柱体或棱柱体,其顶面直径或外接圆的直径为0.2-2mm,相邻的凸点(6)之间的间距为0.05-1mm,相邻的凸点(6)之间的间距同时须小于配套应用的电路板上任意两个导电触点之间的最小间距的一半,保证同时有两个以上的凸点(6)与某一个电路板上的导电触点接触;
组成网格的线条(7)宽度为0.05-2mm,网格之间的孔洞(8)面积为0.05-5mm2
上层的厚度满足以下条件:为条纹状时,条纹(5)的最小宽度*厚度>2*10-4mm2;为密布的凸点状时,凸点(6)底面外接圆的直径*厚度>1*10-4mm2
2.根据权利要求1所述的开关触点元件,其特征在于:底层的厚度大于中间层;中间层的厚度大于上层,且50μm<中间层的厚度<1mm。
3.根据权利要求1所述的开关触点元件,其特征在于:复合层中贱金属镀层(3)的厚度是贵金属镀层(4)厚度的1.5-10倍。
4.根据权利要求1或3所述的开关触点元件,其特征在于:所述橡胶是硅橡胶,所述贱金属的材质是不锈钢,所述贵金属的材质是纯度大于99%的金。
5.一种权利要求1所述的开关触点元件的制备方法,其特征在于:含有以下先后次序的工序:
1)以贱金属薄片(2)作为底材,在底材上表面以可溶解于溶剂、酸性溶液或碱性溶液的油墨印刷一层2-10μm厚的局部阻镀层,使得在底材没有局部阻镀层的地方露出密布的凸点(6)状、条纹(5)状或者网格状的底材上表面;
2)在底材上表面缺少局部阻镀层的地方,镀一层贵金属镀层(4);或者先镀一层非贵金属镀层(3),接着再在非贵金属镀层(4)上面镀一层贵金属镀层;
3)将印刷的局部阻镀层采用溶剂溶解、碱性或酸性溶液溶解的方法除去;
4)将含镀层的薄片的下表面与硅橡胶贴合,进行热硫化复合,制成厚度可至0.25-5mm的复合薄片;
5)将复合薄片冲切成横截面面积0.8-80mm2的小圆柱粒、棱柱粒或者椭圆柱粒;
或者,含有以下先后次序的工序:
1)以贱金属薄片(2)为底材,在其下表面上,以热硫化的方式复合一层硅橡胶,制成厚度可至0.25-5mm的复合薄片;
2)在贱金属薄片的另一面,以可溶解于溶剂、酸性溶液或碱性溶液的油墨印刷一层2-10μm厚的局部阻镀层,使得在底材没有局部阻镀层的地方露出凸点(6)状、条纹(5)状或者网格状的贱金属底材;
3)在底材上表面缺少局部阻镀层的地方,镀一层全贵金属镀层(4);或者先镀一层非贵金属镀层(3),接着再在非贵金属镀层(3)上面镀一层贵金属镀层(4);
4)将印刷的局部阻镀层采用溶剂溶解、碱性或酸性溶液溶解的方法除去;
5)将有镀层的复合薄片冲切成横截面面积0.8-80mm2的小圆柱粒、椭圆柱粒或者棱柱粒。
CN201310748955.0A 2013-12-31 2013-12-31 开关触点元件及其制备方法 Active CN103700517B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201310748955.0A CN103700517B (zh) 2013-12-31 2013-12-31 开关触点元件及其制备方法
US14/896,405 US10026565B2 (en) 2013-12-31 2014-11-12 Switch contact element and its preparation method
PCT/CN2014/090915 WO2015101110A1 (zh) 2013-12-31 2014-11-12 开关触点元件及其制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310748955.0A CN103700517B (zh) 2013-12-31 2013-12-31 开关触点元件及其制备方法

Publications (2)

Publication Number Publication Date
CN103700517A true CN103700517A (zh) 2014-04-02
CN103700517B CN103700517B (zh) 2015-10-07

Family

ID=50362011

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310748955.0A Active CN103700517B (zh) 2013-12-31 2013-12-31 开关触点元件及其制备方法

Country Status (3)

Country Link
US (1) US10026565B2 (zh)
CN (1) CN103700517B (zh)
WO (1) WO2015101110A1 (zh)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104217878A (zh) * 2014-09-15 2014-12-17 南通万德科技有限公司 一种镀贵金属开关触点元件及其制备方法
WO2015101110A1 (zh) * 2013-12-31 2015-07-09 南通万德科技有限公司 开关触点元件及其制备方法
CN104900427A (zh) * 2015-05-19 2015-09-09 东莞万德电子制品有限公司 一种抗污尘防导通不良的新型导电粒及其制作方法
CN105097306A (zh) * 2014-05-06 2015-11-25 徐跃 耐大电流的开关触点及其制备方法
WO2016011912A1 (zh) * 2014-07-21 2016-01-28 南通万德科技有限公司 耐电弧烧蚀的开关触点及其制备方法
WO2016011914A1 (zh) * 2014-07-21 2016-01-28 南通万德科技有限公司 一种镀金的开关触点及其制备方法
WO2016011911A1 (zh) * 2014-07-21 2016-01-28 南通万德科技有限公司 一种消抖的按键及其制备方法
WO2016011909A1 (zh) * 2014-07-21 2016-01-28 南通万德科技有限公司 一种耐电弧烧蚀的开关触点及其制备方法
WO2016011908A1 (zh) * 2014-07-21 2016-01-28 南通万德科技有限公司 一种耐电弧烧蚀的钨合金开关触点及其制备方法
CN106206088A (zh) * 2016-08-30 2016-12-07 南通万德科技有限公司 一种电触点及其制造方法
CN109461603A (zh) * 2018-12-25 2019-03-12 深圳市登科硅橡胶制品有限公司 导电部件、按钮开关及导电部件制造方法
CN109791851A (zh) * 2016-10-07 2019-05-21 信越聚合物株式会社 接点部件、接点部件的制造方法以及具备接点部件的按钮开关用部件
CN111029181A (zh) * 2019-12-20 2020-04-17 南通万德科技有限公司 一种局部镀的电触点
CN111455438A (zh) * 2020-03-11 2020-07-28 贵州振华群英电器有限公司(国营第八九一厂) 一种继电器基座局部电镀夹具

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3806118A4 (en) * 2018-05-29 2022-03-30 Sekisui Polymatech Co., Ltd. METAL CONTACT ELEMENT AND RUBBER SWITCH ELEMENT
JP7195178B2 (ja) * 2019-02-27 2022-12-23 信越ポリマー株式会社 接点部材およびその製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3670129A (en) * 1970-08-17 1972-06-13 Westinghouse Electric Corp Electrical contact members
JPS5292364A (en) * 1976-01-30 1977-08-03 Matsushita Electric Works Ltd Composite contacts and method of manufacturing them
CN101410916A (zh) * 2006-03-27 2009-04-15 Abb股份有限公司 接触器
CN202549630U (zh) * 2012-04-11 2012-11-21 宁波市大银电工合金有限公司 新型结构的触点
CN202930250U (zh) * 2012-11-21 2013-05-08 苏州旲烔机电科技有限公司 一种抗火花的开关电极触点
CN203070943U (zh) * 2013-01-24 2013-07-17 天津博瑞泰电子有限公司 异方性导电胶膜压着块
CN203192608U (zh) * 2011-09-28 2013-09-11 南通万德科技有限公司 异形金属片与橡胶复合导电粒
CN203690124U (zh) * 2013-12-31 2014-07-02 南通万德科技有限公司 开关触点元件

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5876580A (en) 1996-01-12 1999-03-02 Micromodule Systems Rough electrical contact surface
EP1787795A1 (en) * 2004-09-07 2007-05-23 Teijin Limited Transparent electroconductive laminate and transparent touch panel
JP5033740B2 (ja) * 2007-10-26 2012-09-26 帝人株式会社 透明導電性積層体およびタッチパネル
CN102354629B (zh) 2011-07-12 2014-02-05 南通万德科技有限公司 麻面金属与橡胶复合导电粒
CN102958280B (zh) 2011-08-24 2015-06-03 深南电路有限公司 分段金手指的镀金方法
CN103700517B (zh) * 2013-12-31 2015-10-07 南通万德科技有限公司 开关触点元件及其制备方法
CN104112607B (zh) 2014-07-21 2016-08-17 南通万德科技有限公司 一种镀金的开关触点及其制备方法
CN104103432B (zh) 2014-07-21 2015-11-18 南通万德科技有限公司 含有钼合金镀层的开关触点及其制备方法
US10026564B2 (en) * 2014-09-15 2018-07-17 Nantong Memtech Technology Co., Ltd. Precious metal switch contact component and its preparation method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3670129A (en) * 1970-08-17 1972-06-13 Westinghouse Electric Corp Electrical contact members
JPS5292364A (en) * 1976-01-30 1977-08-03 Matsushita Electric Works Ltd Composite contacts and method of manufacturing them
CN101410916A (zh) * 2006-03-27 2009-04-15 Abb股份有限公司 接触器
CN203192608U (zh) * 2011-09-28 2013-09-11 南通万德科技有限公司 异形金属片与橡胶复合导电粒
CN202549630U (zh) * 2012-04-11 2012-11-21 宁波市大银电工合金有限公司 新型结构的触点
CN202930250U (zh) * 2012-11-21 2013-05-08 苏州旲烔机电科技有限公司 一种抗火花的开关电极触点
CN203070943U (zh) * 2013-01-24 2013-07-17 天津博瑞泰电子有限公司 异方性导电胶膜压着块
CN203690124U (zh) * 2013-12-31 2014-07-02 南通万德科技有限公司 开关触点元件

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015101110A1 (zh) * 2013-12-31 2015-07-09 南通万德科技有限公司 开关触点元件及其制备方法
US10026565B2 (en) 2013-12-31 2018-07-17 Nantong Memtech Technology Co., Ltd. Switch contact element and its preparation method
CN105097306A (zh) * 2014-05-06 2015-11-25 徐跃 耐大电流的开关触点及其制备方法
WO2016011908A1 (zh) * 2014-07-21 2016-01-28 南通万德科技有限公司 一种耐电弧烧蚀的钨合金开关触点及其制备方法
CN104112616B (zh) * 2014-07-21 2016-04-27 南通万德科技有限公司 一种消抖的按键及其制备方法
WO2016011914A1 (zh) * 2014-07-21 2016-01-28 南通万德科技有限公司 一种镀金的开关触点及其制备方法
WO2016011911A1 (zh) * 2014-07-21 2016-01-28 南通万德科技有限公司 一种消抖的按键及其制备方法
WO2016011909A1 (zh) * 2014-07-21 2016-01-28 南通万德科技有限公司 一种耐电弧烧蚀的开关触点及其制备方法
US10224156B2 (en) 2014-07-21 2019-03-05 Nantong Memtech Technologies Co., Ltd. De-bouncing keypad and preparation method thereof
US10079119B2 (en) 2014-07-21 2018-09-18 Nantong Memtech Technologies Co., Ltd. Arc ablation-resistant tungsten alloy switch contact and preparation method thereof
WO2016011912A1 (zh) * 2014-07-21 2016-01-28 南通万德科技有限公司 耐电弧烧蚀的开关触点及其制备方法
US9905376B2 (en) 2014-07-21 2018-02-27 Nantong Memtech Technologies Co., Ltd. Arc-ablation resistant switch contact and preparation method thereof
CN104217878A (zh) * 2014-09-15 2014-12-17 南通万德科技有限公司 一种镀贵金属开关触点元件及其制备方法
CN104217878B (zh) * 2014-09-15 2016-06-22 南通万德科技有限公司 一种镀贵金属开关触点元件及其制备方法
US10026564B2 (en) 2014-09-15 2018-07-17 Nantong Memtech Technology Co., Ltd. Precious metal switch contact component and its preparation method
WO2016041244A1 (zh) * 2014-09-15 2016-03-24 南通万德科技有限公司 一种镀贵金属开关触点元件及其制备方法
CN104900427A (zh) * 2015-05-19 2015-09-09 东莞万德电子制品有限公司 一种抗污尘防导通不良的新型导电粒及其制作方法
CN106206088A (zh) * 2016-08-30 2016-12-07 南通万德科技有限公司 一种电触点及其制造方法
CN109791851A (zh) * 2016-10-07 2019-05-21 信越聚合物株式会社 接点部件、接点部件的制造方法以及具备接点部件的按钮开关用部件
CN109461603A (zh) * 2018-12-25 2019-03-12 深圳市登科硅橡胶制品有限公司 导电部件、按钮开关及导电部件制造方法
CN111029181A (zh) * 2019-12-20 2020-04-17 南通万德科技有限公司 一种局部镀的电触点
CN111029181B (zh) * 2019-12-20 2022-05-24 南通万德科技有限公司 一种局部镀的电触点
CN111455438A (zh) * 2020-03-11 2020-07-28 贵州振华群英电器有限公司(国营第八九一厂) 一种继电器基座局部电镀夹具
CN111455438B (zh) * 2020-03-11 2022-07-15 贵州振华群英电器有限公司(国营第八九一厂) 一种继电器基座局部电镀夹具

Also Published As

Publication number Publication date
WO2015101110A1 (zh) 2015-07-09
US20160126024A1 (en) 2016-05-05
US10026565B2 (en) 2018-07-17
CN103700517B (zh) 2015-10-07

Similar Documents

Publication Publication Date Title
CN103700517B (zh) 开关触点元件及其制备方法
JP6268769B2 (ja) 導電性細線の形成方法並びにこれに用いられる線及び基材
WO2009023284A3 (en) Interconnection element with plated posts formed on mandrel
EP3660903B1 (en) Transparent light emitting element display
CN106206088A (zh) 一种电触点及其制造方法
TW200741781A (en) Laminate type solid electrolysis condenser and manufacturing method of the same
CN103096642B (zh) 一种柔性线路板的制作方法
CN102354629A (zh) 麻面金属与橡胶复合导电粒
CN203690124U (zh) 开关触点元件
CN110829080A (zh) 导电端子
CN204130362U (zh) 一种镀贵金属开关触点元件
TW200710280A (en) Usage of a coating for electrical contacting
ES2199827T3 (es) Componente tal como una estructura de celdas y/o placa polar para una pila de combustible pem con resistencia de contacto reducida y procedimiento para reducir la resistencia del contacto.
CN105810376A (zh) 芯片式排列电阻器的制造方法
CN201928511U (zh) 植接式电路板结构
CN111029181B (zh) 一种局部镀的电触点
KR102075469B1 (ko) 커넥터 및 이의 제조방법
CN212542200U (zh) 节约贵金属资源的局部镀的电触点
CN201142273Y (zh) 具树脂金属层的积层陶瓷电容器
CN210576587U (zh) 一种用于端子表面的电镀层及端子、电子接口
CN207603995U (zh) 一种柔性印刷电路板
CN108346884A (zh) 电气连接端子及电气连接端子制造工艺
JP2010009810A (ja) 燃料電池用セパレータの製造方法
CN205452117U (zh) 薄膜开关
CN112181206B (zh) 触控装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant