WO2016006058A1 - 薄板の保持治具 - Google Patents
薄板の保持治具 Download PDFInfo
- Publication number
- WO2016006058A1 WO2016006058A1 PCT/JP2014/068318 JP2014068318W WO2016006058A1 WO 2016006058 A1 WO2016006058 A1 WO 2016006058A1 JP 2014068318 W JP2014068318 W JP 2014068318W WO 2016006058 A1 WO2016006058 A1 WO 2016006058A1
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- WIPO (PCT)
- Prior art keywords
- adhesive layer
- pressure
- sensitive adhesive
- carrier
- holding jig
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Definitions
- the present invention relates to a thin plate holding jig, for example, a thin plate holding jig for holding a semiconductor chip, a semiconductor wafer or the like.
- Patent Document 1 discloses a wafer holding jig that includes a carrier and an adhesive film that covers the surface of the carrier and is bonded to the periphery of the carrier, so that a wafer can be attached to the adhesive film.
- a material for the adhesive film a polyolefin elastomer or urethane rubber having adhesiveness itself, or a film in which an acrylic adhesive is applied on a film that does not exhibit adhesiveness is used.
- a plurality of spacers are provided between the carrier and the adhesive film, and an adhesive is applied to the region between the spacers with the same thickness as the spacer to make the height of the adhesive film from the carrier uniform.
- a non-adhesive processing part such as embossing is provided on the upper surface of the adhesive film is disclosed.
- Patent Document 2 has a support substrate, and an adhesive holding layer that covers the surface of the support substrate and is bonded in an adhesive region partially formed on the surface, and a plurality of semiconductors are provided in the adhesive holding layer.
- a semiconductor chip holder for sticking and holding a chip is described, and as a material for the adhesive holding layer, for example, a self-adhesive polyolefin-based elastomer or urethane rubber, a silicone-based or fluorine-based elastomer having excellent heat resistance, or the like is used. ing.
- the holding jig disclosed in Patent Document 1 or 2 has an adhesive film or an adhesive holding layer (hereinafter referred to as an adhesive film) that adheres a thin plate such as a semiconductor wafer or a semiconductor chip.
- an adhesive film Those having the following properties are suitable. (1) It has heat resistance. Since this type of holding jig is used in a heat-resistant process such as solder reflow (about 250 ° C.), it requires heat resistance. (2) It is easy to peel off the thin plate after adhesion. This is to prevent the thin plate from being damaged during peeling.
- an adhesive is applied to the region between the plurality of spacers provided between the carrier and the adhesive film at the same thickness as the spacer to remove the adhesive film from the carrier.
- processing such as providing a non-adhesive processing part such as embossing on the upper surface of the adhesive film
- peeling may become difficult when the thin plate is further thinned.
- the present invention has been made in view of such circumstances, and the object thereof is to have a heat resistance, and even after a thin plate such as a semiconductor chip or a semiconductor wafer that has been adhered is put into solder reflow, it is easy to use.
- An object of the present invention is to provide a thin plate holding jig that can be peeled off and can be repeatedly performed.
- the present invention is grasped by the following composition.
- the thin plate holding jig of the present invention includes a carrier, a plurality of spacers formed on the surface of the carrier, and an adhesive film adhered to at least the periphery of the carrier so as to cover the surfaces of the plurality of spacers A film substrate, a first pressure-sensitive adhesive layer on the opposite side of the film substrate from the carrier, on which the thin plate is placed, and a second pressure-sensitive adhesive layer on the carrier side of the film substrate.
- the adhesive film having a thickness smaller than the height of the spacer, which adheres the second adhesive layer to the surface of the carrier in a region where the spacer is not formed.
- the second pressure-sensitive adhesive layer has a lower adhesiveness than the first pressure-sensitive adhesive layer so as to be separated from the spacer.
- the second pressure-sensitive adhesive layer of the pressure-sensitive adhesive film is bonded to the surface of the carrier in a region where the spacer is not formed.
- the concave portion reflected in the first pressure-sensitive adhesive layer of the pressure-sensitive adhesive film is filled in order to make it flat, and is substantially the same as the second pressure-sensitive adhesive layer and is more than the first pressure-sensitive adhesive layer.
- a tackiness inhibitor part having low tackiness.
- each of the first and second pressure-sensitive adhesive layers contains a filler, and the second pressure-sensitive adhesive layer is the first pressure-sensitive adhesive layer. It has the content of the said filler higher than an adhesive layer, It is characterized by the above-mentioned.
- the thin plate holding jig of the present invention is the structure of (3), wherein the filler is an inorganic filler such as silica, talc, clay, mica, diatomaceous earth, calcium carbonate, magnesium carbonate, barium sulfate, graphite, water It includes at least one of aluminum oxide, magnesium hydroxide, silicic acid, and metal oxide, and a silicone resin, a phenol resin, a fluororesin, and a polyimide resin, which are organic fillers.
- the filler is an inorganic filler such as silica, talc, clay, mica, diatomaceous earth, calcium carbonate, magnesium carbonate, barium sulfate, graphite, water It includes at least one of aluminum oxide, magnesium hydroxide, silicic acid, and metal oxide, and a silicone resin, a phenol resin, a fluororesin, and a polyimide resin, which are organic fillers.
- the thin plate holding jig of the present invention is characterized in that, in the configuration of (4), the filler contains silica.
- the film base material contains silicone rubber, and the first and second pressure-sensitive adhesive layers are condensed silicone. It is characterized by containing an elastomer.
- the filler of the first pressure-sensitive adhesive layer is other than the filler in the first pressure-sensitive adhesive layer. It has a content in the range of 1.0% to 2.5% by weight with respect to the weight of the solid content.
- a heat-resistant and sticking thin plate such as a semiconductor chip or a semiconductor wafer can be easily peeled even after being put into solder reflow. Can be repeated. It can also be used as a handling jig for testers and plasma cleaning devices used at high temperatures.
- FIG. 3A It is a block diagram which shows embodiment of the thin holding jig of this invention, Comprising: It is the top view. It is sectional drawing of the bb line
- FIG. 4A It is a figure which shows the state which mounted the semiconductor wafer in the holding jig of the thin plate of this invention, Comprising: It is the figure which showed the case where a semiconductor wafer is stuck. It is the figure which showed the case where it is going to peel the semiconductor wafer of FIG. 4A. It is sectional drawing which shows Example 6 of the holding jig of the thin plate of this invention. It is sectional drawing which shows the holding jig of the thin plate of the comparative example 6. It is sectional drawing which shows the holding jig of the thin plate of the comparative example 7. 10 is a cross-sectional view showing a thin plate holding jig of Comparative Example 8. FIG.
- FIG. 1A and 1B are configuration diagrams showing an embodiment of a thin plate holding jig 1 of the present invention.
- 1A is a plan view
- FIG. 1B is a cross-sectional view taken along line bb of FIG. 1A.
- a carrier 10 having a circular shape in a plan view is provided.
- the carrier 10 is constituted by a substrate such as a silicon wafer or a glass wafer.
- spacers 11 having a rectangular shape in a plan view are formed side by side in the vertical and horizontal directions.
- the region where the spacer 11 is not formed on the surface of the carrier 10 is a region where the lattice-like grooves 12 are formed.
- the spacer 11 may be configured by laminating a material layer having a thickness on the surface of the carrier 10 by printing, or may be configured by forming the groove 12 on the surface of the carrier 10 by selective etching. .
- non-adhesive processing such as mat processing, hairline processing, and blast processing on the surface of each spacer 11.
- An adhesive film 13 is arranged on the surface of the carrier 10 on which the spacers 11 are formed so as to cover the spacers 11, and an adhesive (adhesion) applied around the carrier 10 and inside the grooves 12 surrounding the spacers 11. Also referred to as a part).
- the adhesive 14 for example, a condensed silicone elastomer is used, and is formed with a thickness smaller than the height of the spacer 11.
- FIG. 2 which is an enlarged cross-sectional view of the adhesive film 13, the film base 13B, the first adhesive layer 131 formed on the surface of the film base 13B opposite to the carrier 10, and the film And a second pressure-sensitive adhesive layer 132 formed on the surface of the base material 13B on the carrier 10 side.
- the film base 13B is made of a silicone rubber sheet
- the first pressure-sensitive adhesive layer 131 is made of a condensation-type silicone elastomer containing a relatively small amount of filler
- the second pressure-sensitive adhesive layer 132 is a condensation-type containing a relatively large amount of filler.
- the filler plays a role of increasing action, reinforcing action, matting action and the like.
- the type of filler is not particularly limited.
- inorganic fillers such as silica, talc, clay, mica, diatomaceous earth, calcium carbonate, magnesium carbonate, barium sulfate, graphite, aluminum hydroxide, magnesium hydroxide, silicic acid, and metal oxide.
- one or more organic fillers such as a silicone resin, a phenol resin, a fluorine resin, and a polyimide resin can be used.
- silica is particularly preferable from the viewpoint of cost and mechanical strength.
- the shape of a filler is not specifically limited, It can use.
- the content of the filler in the first pressure-sensitive adhesive layer 131 is 1.0% by weight to the weight of the solid content other than the filler in the first pressure-sensitive adhesive layer 131 (for example, a condensed silicone elastomer). It is preferable to set it in the range of 2.5% by weight.
- the first pressure-sensitive adhesive layer 131 can function as a pressure-sensitive adhesive layer by containing a relatively small amount of filler
- the second pressure-sensitive adhesive layer 132 can function as a pressure-sensitive adhesive layer by containing a relatively large amount of filler.
- the adhesive film 13 that covers the surface of the carrier 10 on which the spacer 11 is formed and is adhered by the adhesive 14 in the groove 12 formed on the carrier 10 is adhered to the groove 12 (region where the spacer 11 is not formed).
- the recesses to be reflected are filled (applied) with an adhesion inhibitor (also referred to as an adhesion inhibitor) 15. This is for the purpose of flattening the surface of the adhesive film 13.
- the adhesion suppressing material 15 is configured to contain a filler having a content rate approximately equal to the content rate of the filler of the second pressure-sensitive adhesive layer 132.
- the thin plate holding jig 1 configured in this way can place a semiconductor chip (workpiece) 20 having a relatively small area on an adhesive film 13 for adhesion.
- the semiconductor chip 20 is adhered to the surface of the adhesive film 13 above the spacer 11 and is not adhered to the portion where the adhesion suppression material 15 above the groove 12 is applied.
- FIG. 3B is a diagram showing a case where the semiconductor chip 20 is lifted upward from the holding jig 1 so as to peel off the semiconductor chip 20. Since the contact surface of the adhesive film 13 with the spacer 11 is an adhesion suppression surface, the adhesive film 13 in this portion is separated so as to be lifted upward together with the semiconductor chip 20.
- the pressure-sensitive adhesive surface of the pressure-sensitive adhesive film 13 with the semiconductor chip 20 is the first pressure-sensitive adhesive layer 131 (see FIG. 2) as described above, and an appropriate amount of filler (the above-mentioned amount in the first pressure-sensitive adhesive layer 131). 1% to 2.5% by weight with respect to the solid content other than the filler), the adhesiveness of the first adhesive layer 131 itself is suppressed to be relatively low, and the semiconductor chip 20 Is easily peeled off from the adhesive film 13.
- FIG. 4A is a diagram showing a case where a semiconductor wafer (workpiece) 30 having the same size as that of the carrier 10 is adhered to the adhesive film 13 in a plan view. As shown in FIG. 3A, the semiconductor wafer 30 is adhered to the surface of the adhesive film 13 above the spacer 11 and is not adhered to the portion to which the adhesion suppressing material 15 above the groove 12 is applied.
- FIG. 4B is a diagram showing a case where the semiconductor wafer 30 is lifted upward from the holding jig 1 so as to peel off the semiconductor wafer 30. Since the contact surface of the adhesive film 13 with the spacer 11 is an adhesion suppression surface, the adhesive film 13 at this location is lifted upward together with the semiconductor wafer 30.
- the semiconductor wafer 30 since the adhesiveness of the first adhesive layer 131 itself is suppressed to be relatively low, the semiconductor wafer 30 is easily peeled off from the adhesive film 13. .
- the adhesion suppression material 15 is applied in a lattice pattern on the adhesion surface of the adhesive film 13 with the semiconductor wafer 30, the semiconductor wafer 30 can be easily peeled off from the adhesion film 13 by this adhesion suppression material 15. Become.
- the 1st adhesive layer 131 was prepared as follows. First, 0.2 g of silica (matting agent (trade name, manufactured by Seiko Advance)) as a filler was dispersed in 7 g of toluene. To this dispersion solution, 20 g of a condensation type silicone elastomer (X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) was added and dispersed to prepare an elastomer solution for the first pressure-sensitive adhesive layer.
- silica matrix agent (trade name, manufactured by Seiko Advance)
- X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)
- the first adhesive layer elastomer solution was screen-printed on a silicone rubber sheet 13B (sheet of KE-151K-U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), 200 ⁇ m thick). And cured at room temperature.
- the second pressure-sensitive adhesive layer 132 was prepared as follows. First, 1 g of silica (matting agent (trade name, manufactured by Seiko Advance)) as a filler was dispersed in 9 g of toluene. 20 g of a condensed silicone elastomer (X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) was added to this dispersion solution and dispersed to prepare a second pressure-sensitive adhesive layer elastomer solution. Then, using the 350 mm ⁇ solid plate, the second adhesive layer elastomer solution was screen-printed on the back surface of the silicone rubber sheet 13B on which the first adhesive layer was printed, and cured at room temperature. The adhesive film 13 containing the 1st adhesive layer 131, the silicone rubber sheet 13B, and the 2nd adhesive layer 132 was obtained by the above.
- Carrier 10 was prepared as follows. First, 1 g of silica (matting agent (trade name, manufactured by Seiko Advance)) as a filler was dispersed in 7.3 g of isophorone (T980 (trade name, manufactured by Seiko Advance)). 20 g of polyester / melamine ink (1400N (trade name, manufactured by Seiko Advance Co., Ltd.)) was added to this dispersion and dispersed to prepare a spacer ink solution. Then, using the screen printing method, the spacer ink solution is printed on a mirror surface side of a 200 mm silicon wafer (750 ⁇ m thick) with a 2.5 mm square pattern and a 5 mm pitch, and left in a constant temperature oven at 150 ° C. for 30 minutes. And cured to form a 28 ⁇ m thick spacer.
- the adhesive film 13 was fixed to the carrier 10 as follows. First, the adhesive film 13 was attached to a 200 mm SUS frame, stretched by 7.2% with a 200 mm wafer expander (TEX-218 (manufactured by Technovision)), and fitted to a 200 mm grip ring. Then, the adhesive film 13 around the grip ring was cut off. Then, a condensed silicone elastomer (KE3417 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) is screen-printed in a lattice shape (2 mm line pattern, 5 mm pitch, 18 ⁇ m thickness) on the carrier 10 on which the spacer 11 is formed. I put it.
- KE3417 trade name, manufactured by Shin-Etsu Chemical Co., Ltd.
- the film fitted with the grip ring was affixed, pressurized from the upper surface of the film at room temperature (24 hours), and adhered to the carrier 10 in a lattice shape. And the excess part of the adhesive film 13 around the carrier 10 was cut off.
- the adhesion inhibitor 15 was prepared as follows. First, 1 g of silica (matting agent (trade name, manufactured by Seiko Advance)) as a filler was dispersed in 8.3 g of toluene. 20 g of a condensation type silicone elastomer (X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) was added to this dispersion solution and dispersed to prepare an elastomer solution for an adhesion-suppressing material.
- silica matrix agent (trade name, manufactured by Seiko Advance)
- X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)
- the above-mentioned elastomer solution for adhesion-suppressing material is printed on the surface of the adhesive film 13 fixed to the carrier 10 in a lattice shape (for example, 2 mm line pattern, 5 mm pitch, 10 ⁇ m thickness) at room temperature. And cured. During printing, positioning was performed with reference to the notch of the carrier 10.
- the 1st adhesive layer 131 was prepared as follows. First, 0.3 g of silica (matting agent (trade name, manufactured by Seiko Advance)) as a filler was dispersed in 7 g of toluene. To this dispersion solution, 20 g of a condensation type silicone elastomer (X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) was added and dispersed to prepare an elastomer solution for the first pressure-sensitive adhesive layer.
- silica matrix agent (trade name, manufactured by Seiko Advance)
- X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)
- the first adhesive layer elastomer solution was screen-printed on a silicone rubber sheet (KE-151K-U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), 200 ⁇ m thick). Cured at room temperature.
- KE-151K-U trade name, manufactured by Shin-Etsu Chemical Co., Ltd.
- An adhesive film 13 was prepared as follows. A plurality of perforations (surface cuts) were formed in the pressure-sensitive adhesive film 13 produced by the same method as in Example 2. By forming the perforations at appropriate locations on the adhesive film 13, it is possible to allow outside air to flow between the adhesive film 13 and the carrier 10. When it does in this way, it can avoid that the interface of the carrier 10 and the adhesion film 13 becomes vacuum, and there exists an effect which improves the peelability from the adhesion film 13 of a workpiece
- the 1st adhesive layer 131 was prepared as follows. First, 0.4 g of silica (matting agent (trade name, manufactured by Seiko Advance)) as a filler was dispersed in 7 g of toluene. To this dispersion solution, 20 g of a condensation type silicone elastomer (X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) was added and dispersed to prepare an elastomer solution for the first pressure-sensitive adhesive layer.
- silica matrix agent (trade name, manufactured by Seiko Advance)
- X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)
- the first adhesive layer elastomer solution was screen-printed on a silicone rubber sheet (KE-151K-U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), 200 ⁇ m thick). And cured at room temperature.
- KE-151K-U trade name, manufactured by Shin-Etsu Chemical Co., Ltd.
- the 1st adhesive layer 131 was prepared as follows. First, 0.5 g of silica (matting agent (trade name, manufactured by Seiko Advance)) as a filler was dispersed in 7 g of toluene. To this dispersion solution, 20 g of a condensation type silicone elastomer (X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) was added and dispersed to prepare an elastomer solution for the first pressure-sensitive adhesive layer.
- silica matrix agent (trade name, manufactured by Seiko Advance)
- X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)
- the first adhesive layer elastomer solution was screen-printed on a silicone rubber sheet (KE-151K-U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), 200 ⁇ m thick). And cured at room temperature.
- KE-151K-U trade name, manufactured by Shin-Etsu Chemical Co., Ltd.
- Example 6 An adhesive film 13 was prepared as follows. First, the same material as in Example 1 was used. As another example of the manufacturing method of the carrier 10, etching was performed on a mirror surface side of a 200 mm silicon wafer (thickness: 750 ⁇ m) with a 2 mm line pattern and a pitch of 5 mm, and blast processing was performed on the upper surface of the spacer. Other configurations were the same as those in Example 1.
- FIG. 5 is a view drawn in association with FIG. 1B and shows that the upper surface of the spacer is subjected to blasting (indicated by ⁇ in the drawing).
- the 1st adhesive layer 131 was adjusted as follows. 20 g of a condensed silicone elastomer (X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) was added to 7 g of toluene and dispersed to prepare an elastomer solution for the first pressure-sensitive adhesive layer. Then, using a solid plate of 350 mm ⁇ , the first adhesive layer elastomer solution was screen-printed on a silicone rubber sheet (KE-151K-U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), 200 ⁇ m thick). And cured at room temperature. Other configurations were the same as those in Example 1.
- the 1st adhesive layer 131 was adjusted as follows. As a filler, 0.1 g of silica (matting agent (trade name, manufactured by Seiko Advance)) was dispersed in 7 g of toluene. To this dispersion solution, 20 g of a condensation type silicone elastomer (X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) was added and dispersed to prepare an elastomer solution for the first pressure-sensitive adhesive layer.
- silica matrix agent (trade name, manufactured by Seiko Advance)
- X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)
- the first adhesive layer elastomer solution was screen printed on a silicone rubber sheet (KE-151K-U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), 200 ⁇ m), Cured at room temperature.
- KE-151K-U trade name, manufactured by Shin-Etsu Chemical Co., Ltd.
- Other configurations were the same as those in Example 1.
- the 1st adhesive layer 131 was adjusted as follows. As a filler, 0.6 g of silica (matting agent (trade name, manufactured by Seiko Advance)) was dispersed in 7 g of toluene. To this dispersion solution, 20 g of a condensation type silicone elastomer (X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) was added and dispersed to prepare an elastomer solution for the first pressure-sensitive adhesive layer.
- silica matrix agent (trade name, manufactured by Seiko Advance)
- X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)
- the first adhesive layer elastomer solution was screen printed on a silicone rubber sheet (KE-151K-U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), 200 ⁇ m), Cured at room temperature.
- KE-151K-U trade name, manufactured by Shin-Etsu Chemical Co., Ltd.
- Other configurations were the same as those in Example 1.
- the 1st adhesive layer 131 was adjusted as follows. As a filler, 0.8 g of silica (matting agent (trade name, manufactured by Seiko Advance Co., Ltd.)) was dispersed in 7 g of toluene. To this dispersion solution, 20 g of a condensation type silicone elastomer (X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) was added and dispersed to prepare an elastomer solution for the first pressure-sensitive adhesive layer.
- silica matrix agent (trade name, manufactured by Seiko Advance Co., Ltd.)) was dispersed in 7 g of toluene.
- a condensation type silicone elastomer X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)
- the first adhesive layer elastomer solution was screen printed on a silicone rubber sheet (KE-151K-U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), 200 ⁇ m), Cured at room temperature.
- KE-151K-U trade name, manufactured by Shin-Etsu Chemical Co., Ltd.
- Other configurations were the same as those in Example 1.
- the 1st adhesive layer 131 was adjusted as follows. As a filler, 1 g of silica (matting agent (trade name, manufactured by Seiko Advance)) was dispersed in 7 g of toluene. To this dispersion solution, 20 g of a condensation type silicone elastomer (X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)) was added and dispersed to prepare an elastomer solution for the first pressure-sensitive adhesive layer.
- silica matrix agent (trade name, manufactured by Seiko Advance)
- X-31-2658 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)
- the first adhesive layer elastomer solution was screen printed on a silicone rubber sheet (KE-151K-U (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), 200 ⁇ m), Cured at room temperature.
- KE-151K-U trade name, manufactured by Shin-Etsu Chemical Co., Ltd.
- Other configurations were the same as those in Example 1.
- FIG. 6 is a diagram drawn in association with FIG. 1B, and shows that the first adhesive layer 131 and the adhesion suppression material 15 are not formed on the upper surface of the adhesive film 13.
- FIG. 7 is a diagram drawn in association with FIG. 1B and shows that the second adhesive layer 132 is not formed on the lower surface of the adhesive film 13.
- FIG. 8 is a view drawn in association with FIG. 1B and shows that the height of the spacer 11 and the height of the adhesive 14 in the groove 12 of the spacer 11 are the same. For this reason, since the adhesive film 13 can be flattened, the adhesion suppressing material 15 is unnecessary.
- Table 1 is shown so that the comparison of the constituent elements of Examples 1 to 6 and Comparative Examples 1 to 8 can be clearly understood.
- ⁇ Test 1> The adhesion and releasability at normal temperature to the workpiece holding jig 1 were confirmed. Specifically, the semiconductor wafer 30 (200 mm ⁇ , 50 ⁇ m thickness) was loaded on the holding jig 1 manufactured in Examples 1 to 6 and Comparative Examples 1 to 8, and it was confirmed whether it could be held in close contact. Then, it was confirmed whether the loaded semiconductor wafer 30 could be peeled off. In the same manner, the semiconductor chip 20 (8 mm square, 50 ⁇ m thickness) was also loaded on the holding jig 1 and the adhesion and peelability were confirmed.
- Table 2 shows the results of the above-described test 1 performed on Examples 1 to 6 and Comparative Examples 1 to 8.
- a 200 mm ⁇ , 50 ⁇ m thick silicon wafer and an 8 mm square, 50 ⁇ m thick silicon chip were used as the workpiece.
- the holding jig 1 produced in Examples 1 to 6 had good adhesion retention and peelability of the workpiece.
- Comparative Examples 1 and 2 since the silica compounded as the filler in the first pressure-sensitive adhesive layer was less than in the Examples, the adhesion was excessive and it was difficult to peel the workpiece.
- Comparative Examples 3 to 5 since more silica was added as a filler to the first pressure-sensitive adhesive layer than in the Examples, the adhesiveness of silicone could not be exhibited, and the workpiece could not be held tightly.
- Comparative Example 6 due to the adhesiveness derived from the addition-type silicone rubber, the adhesion was excessive and the workpiece could not be peeled off.
- ⁇ Test 2> A reflow test of the semiconductor chip 20 was performed using the holding jig manufactured in Example 3. Specifically, the semiconductor chip 20 (10 mm square 0.095 mm thick) was loaded with the mirror side facing the adhesive film 13 of the holding jig. Slightly pressing with vacuum tweezers, it was confirmed that the semiconductor chip 20 was tightly held by the holding jig, and the holding jig was put into a reflow furnace. After taking out from the reflow furnace, it was allowed to cool to room temperature. A holding jig was placed on the chuck table, and it was confirmed that the semiconductor chip 20 could be peeled off while being sucked and held from the back. This test was repeated 10 times. For each test, a new semiconductor chip 20 was used and loaded at the same location each time. The reflow profile was a linear temperature profile, and was set to hold at 250 ° C. or higher for 30 seconds and at 230 ° C. or higher for 50 seconds.
- a thin plate such as the semiconductor chip 20 or the semiconductor wafer 30 that has heat resistance and is adhered is put into solder reflow. Later, it can be easily peeled off, and these operations can be repeated.
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Abstract
Description
(1)耐熱性を有する。この種の保持治具は半田リフロー(約250℃)等の耐熱プロセスに用いられることから、耐熱性を必要とする。
(2)粘着後の薄板を剥離がし易い。剥離の際に該薄板が破損してしまうのを回避させるためである。
(1)本発明の薄板の保持治具は、キャリアと、前記キャリアの表面に形成された複数のスペーサと、前記複数のスペーサの表面を覆うように少なくとも前記キャリアの周辺に接着された粘着フィルムであって、フィルム基材と、前記フィルム基材の前記キャリアと反対側にあって前記薄板を載置する第1粘着剤層と、前記フィルム基材の前記キャリアの側の第2粘着剤層とを有する前記粘着フィルムと、前記スペーサが形成されていない領域において前記キャリアの表面に前記第2粘着剤層を接着する、前記スペーサの高さよりも小さい厚みの接着部とを備え、載置された前記薄板を前記第1粘着剤層から剥離するとき、前記第2粘着剤層が前記スペーサから離間するように前記第1粘着剤層よりも低い粘着性を有することを特徴とする。
第1粘着剤層131を次のように調製した。まず、フィラーとして、シリカ(マット剤(セイコーアドバンス社製商品名))0.2gをトルエン7gに分散させた。この分散溶液に縮合系シリコーンエラストマー(X-31-2658(信越化学工業社製商品名))を20g添加し、分散させ、第1粘着剤層用エラストマー溶液を作製した。そして、350mmφのベタ版を用いて、前記第1粘着剤層用エラストマー溶液をシリコーンゴムシート13B(KE-151K-U(信越化学工業社製商品名)をシーティングしたもの、200μm厚)にスクリーン印刷し、常温下で硬化させた。
第1粘着剤層131を次のように調製した。まず、フィラーとして、シリカ(マット剤(セイコーアドバンス社製商品名))0.3gをトルエン7gに分散させた。この分散溶液に縮合系シリコーンエラストマー(X-31-2658(信越化学工業社製商品名))を20g添加し、分散させ、第1粘着剤層用エラストマー溶液を作製した。そして、350mmφベタ版を用いて、前記第1粘着剤層用エラストマー溶液をシリコーンゴムシート(KE-151K-U(信越化学工業社製商品名)をシーティングしたもの、200μm厚)にスクリーン印刷し、常温下で硬化させた。その他の構成は、実施例1の場合と同様とした。
粘着フィルム13を次のように調製した。実施例2と同様の方法で作成した粘着フィルム13に複数の穿孔(表面カット)を形成するようにした。粘着フィルム13の適当な個所に該穿孔を形成することにより、粘着フィルム13とキャリア10の間に外気を流入させることができる。このようにした場合、キャリア10と粘着フィルム13との界面が真空になってしまうことを回避でき、ワークの粘着フィルム13からの剥離性を向上させる効果を奏する。その他の構成は、実施例2の場合と同様とした。
第1粘着剤層131を次のように調製した。まず、フィラーとして、シリカ(マット剤(セイコーアドバンス社製商品名))0.4gをトルエン7gに分散させた。この分散溶液に縮合系シリコーンエラストマー(X-31-2658(信越化学工業社製商品名))を20g添加し、分散させ、第1粘着剤層用エラストマー溶液を作製した。そして、350mmφのベタ版を用いて、前記第1粘着剤層用エラストマー溶液をシリコーンゴムシート(KE-151K-U(信越化学工業社製商品名)をシーティングしたもの、200μm厚)にスクリーン印刷し、常温下で硬化させた。その他の構成は、実施例1の場合と同様とした。
第1粘着剤層131を次のように調製した。まず、フィラーとして、シリカ(マット剤(セイコーアドバンス社製商品名))0.5gをトルエン7gに分散させた。この分散溶液に縮合系シリコーンエラストマー(X-31-2658(信越化学工業社製商品名))を20g添加し、分散させ、第1粘着剤層用エラストマー溶液を作製した。そして、350mmφのベタ版を用いて、前記第1粘着剤層用エラストマー溶液をシリコーンゴムシート(KE-151K-U(信越化学工業社製商品名)をシーティングしたもの、200μm厚)にスクリーン印刷し、常温下で硬化させた。その他の構成は、実施例1の場合と同様とした。
粘着フィルム13を次のように調製した。まず、実施例1と同様の材料を用いた。キャリア10の製造方法の他の実施例として、200mmシリコンウェーハ(750μm厚)の鏡面側に2mmラインパターン、5mmピッチでエッチングを行い、スペーサの上面にはブラスト処理を行った。その他の構成は、実施例1の場合と同様とした。なお、図5は、図1Bと対応づけて描いた図であり、スペーサの上面にブラスト処理(図中αで示す)がなされていることを示している。
第1粘着剤層131を次のように調整した。トルエン7gに縮合系シリコーンエラストマー(X-31-2658(信越化学工業社製商品名))を20g添加し、分散させ、第1粘着剤層用エラストマー溶液を作製した。そして、350mmφのベタ版を用いて、前記第1粘着剤層用エラストマー溶液をシリコーンゴムシート(KE-151K-U(信越化学工業社製商品名)をシーティングしたもの、200μm厚)にスクリーン印刷し、常温下で硬化させた。その他の構成は、実施例1の場合と同様とした。
第1粘着剤層131を次のように調整した。フィラーとして、シリカ(マット剤(セイコーアドバンス社製商品名))0.1gをトルエン7gに分散させた。この分散溶液に縮合系シリコーンエラストマー(X-31-2658(信越化学工業社製商品名))を20g添加し、分散させ、第1粘着剤層用エラストマー溶液を作製した。そして、350mmφのベタ版を用いて、前記第1粘着剤層用エラストマー溶液をシリコーンゴムシート(KE-151K-U(信越化学工業社製商品名)をシーティングしたもの、200μm)にスクリーン印刷し、常温下で硬化させた。その他の構成は、実施例1の場合と同様とした。
第1粘着剤層131を次のように調整した。フィラーとして、シリカ(マット剤(セイコーアドバンス社製商品名))0.6gをトルエン7gに分散させた。この分散溶液に縮合系シリコーンエラストマー(X-31-2658(信越化学工業社製商品名))を20g添加し、分散させ、第1粘着剤層用エラストマー溶液を作製した。そして、350mmφのベタ版を用いて、前記第1粘着剤層用エラストマー溶液をシリコーンゴムシート(KE-151K-U(信越化学工業社製商品名)をシーティングしたもの、200μm)にスクリーン印刷し、常温下で硬化させた。その他の構成は、実施例1の場合と同様とした。
第1粘着剤層131を次のように調整した。フィラーとして、シリカ(マット剤(セイコーアドバンス社製商品名))0.8gをトルエン7gに分散させた。この分散溶液に縮合系シリコーンエラストマー(X-31-2658(信越化学工業社製商品名))を20g添加し、分散させ、第1粘着剤層用エラストマー溶液を作製した。そして、350mmφのベタ版を用いて、前記第1粘着剤層用エラストマー溶液をシリコーンゴムシート(KE-151K-U(信越化学工業社製商品名)をシーティングしたもの、200μm)にスクリーン印刷し、常温下で硬化させた。その他の構成は、実施例1の場合と同様とした。
第1粘着剤層131を次のように調整した。フィラーとして、シリカ(マット剤(セイコーアドバンス社製商品名))1gをトルエン7gに分散させた。この分散溶液に縮合系シリコーンエラストマー(X-31-2658(信越化学工業社製商品名))を20g添加し、分散させ、第1粘着剤層用エラストマー溶液を作製した。そして、350mmφのベタ版を用いて、前記第1粘着剤層用エラストマー溶液をシリコーンゴムシート(KE-151K-U(信越化学工業社製商品名)をシーティングしたもの、200μm)にスクリーン印刷し、常温下で硬化させた。その他の構成は、実施例1の場合と同様とした。
シリコーンゴムシート(KE-151K-U(信越化学工業社製商品名)をシーティングしたもの、200μm)に対して、第1粘着剤層131を形成することなく、第2粘着剤層132のみを形成するようにした。第2粘着剤層132、およびその他の構成は、粘着抑制材15が形成されていないことを除いて実施例1の場合と同様とした。なお、図6は、図1Bと対応づけて描いた図であり、粘着フィルム13の上面に第1粘着剤層131、粘着抑制材15が形成されていないことを示している。
シリコーンゴムシート(KE-151K-U(信越化学工業社製商品名)をシーティングしたもの、200μm)に対して、第2粘着剤層132を形成することなく、第1粘着剤層131のみを形成するようにした。第1粘着剤層131、およびその他の構成は、実施例1の場合と同様とした。なお、図7は、図1Bと対応づけて描いた図であり、粘着フィルム13の下面に第2粘着剤層132が形成されていないことを示している。
スペーサ11の高さおよび該スペーサ11の溝12に充填される接着剤14の高さを同じにした。この場合のスペーサ11の高さ、接着剤14の高さを18μmとした。なお、図8は、図1Bと対応づけて描いた図であり、スペーサ11の高さおよび該スペーサ11の溝12内の接着剤14の高さが同じになっていることを示している。このため、粘着フィルム13の平坦化が図れることから、粘着抑制材15を不要としている。
ワークの保持治具1に対する常温下での密着性、剥離性の確認を行った。具体的には、実施例1~6、比較例1~8で作製した保持治具1に半導体ウェーハ30(200mmφ、50μm厚)を積載して、密着保持できるかを確認した。そして、積載した半導体ウェーハ30を剥離できるかを確認した。同様の方法で、半導体チップ20(8mm角、50μm厚)も保持治具1に積載し、密着性と剥離性の確認を行った。
実施例3で作製した保持治具を用いて、半導体チップ20のリフロー試験を行った。具体的には、半導体チップ20(10mm角 0.095mm厚)の鏡面側を保持治具の粘着フィルム13に向かい合わせて、積載した。バキュームピンセットで少し押さえて、半導体チップ20が保持治具に密着保持されていることを確認し、保持治具をリフロー炉に投入した。リフロー炉から取り出した後、常温に戻るまで放冷した。保持治具をチャックテーブルに載せ、背面から吸引保持したまま、半導体チップ20を剥離することが可能かを確認した。この試験を10回繰り返した。なお、試験ごとに半導体チップ20は新しいものを用い、毎回同じ箇所に積載した。リフロープロファイルはリニア型温度プロファイルで、250℃以上で30秒保持、230℃以上で50秒保持するように設定した。
Claims (7)
- 薄板を保持する保持治具であって、
キャリアと、
前記キャリアの表面に形成された複数のスペーサと、
前記複数のスペーサの表面を覆うように少なくとも前記キャリアの周辺に接着された粘着フィルムであって、フィルム基材と、前記フィルム基材の前記キャリアと反対側にあって前記薄板を載置する第1粘着剤層と、前記フィルム基材の前記キャリアの側の第2粘着剤層とを有する前記粘着フィルムと、
前記スペーサが形成されていない領域において前記キャリアの表面に前記第2粘着剤層を接着する、前記スペーサの高さよりも小さい厚みの接着部とを備え、
載置された前記薄板を前記第1粘着剤層から剥離するとき、前記第2粘着剤層が前記スペーサから離間するように前記第1粘着剤層よりも低い粘着性を有することを特徴とする保持治具。 - さらに、前記スペーサが形成されていない領域において前記キャリアの表面に前記粘着フィルムの前記第2粘着剤層が接着されることにより前記粘着フィルムの前記第1粘着剤層に反映される凹部にそれを平坦にするために充填され、前記第2粘着剤層と実質的に同程度であって前記第1粘着剤層よりも低い粘着性を有する粘着抑制剤部を備えることを特徴とする請求項1に記載の薄板の保持治具。
- 前記第1及び第2粘着剤層がそれぞれフィラーを含有し、前記第2粘着剤層が前記第1粘着剤層よりも高い前記フィラーの含有量を有することを特徴とする請求項1又は2に記載の保持治具。
- 前記フィラーが、無機フィラーであるシリカ、タルク、クレー、マイカ、珪藻土、炭酸カルシウム、炭酸マグネシウム、硫酸バリウム、グラファイト、水酸化アルミニウム、水酸化マグネシウム、ケイ酸、及び金属酸化物、並びに、有機フィラーであるシリコ―ン樹脂、フェノ―ル樹脂、フッ素樹脂、及びポリイミド樹脂のうち少なくとも1つを含むことを特徴とする請求項3に記載の保持治具。
- 前記フィラーがシリカを含むことを特徴とする請求項4に記載の保持治具。
- 前記フィルム基材がシリコーンゴムを含み、前記第1及び第2粘着剤層が縮合系シリコーンエラストマーを含むことを特徴とする請求項1ないし5のいずれか1項に記載の保持治具。
- 前記第1粘着剤層の前記フィラーが、前記第1粘着剤層内の前記フィラー以外の固形分の重量に対して、1.0重量%~2.5重量%の範囲の含有量を有することを特徴とする請求項3ないし5のいずれか1項に記載の保持治具。
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DE202017002152U1 (de) | 2016-11-07 | 2017-05-31 | Shin-Etsu Polymer Co., Ltd. | Haltevorrichtung für Präzisionsteile |
JP2017154815A (ja) * | 2016-03-05 | 2017-09-07 | 平田機工株式会社 | トレイ |
JP7497121B2 (ja) | 2020-09-25 | 2024-06-10 | 株式会社ディスコ | 保持テーブル |
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JP2011222828A (ja) * | 2010-04-12 | 2011-11-04 | Shin Etsu Polymer Co Ltd | 半導体ウェーハの取り扱い方法 |
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JP2012256666A (ja) * | 2011-06-08 | 2012-12-27 | Shin Etsu Polymer Co Ltd | ウェーハ保持ジグ |
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JP2012033737A (ja) * | 2010-07-30 | 2012-02-16 | Shin Etsu Polymer Co Ltd | 半導体ウェーハの取り扱い方法 |
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JP5971764B2 (ja) * | 2013-04-26 | 2016-08-17 | 信越ポリマー株式会社 | 薄板の保持治具 |
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JP2007250790A (ja) * | 2006-03-15 | 2007-09-27 | Shin Etsu Polymer Co Ltd | 半導体チップの製造方法 |
JP2011222828A (ja) * | 2010-04-12 | 2011-11-04 | Shin Etsu Polymer Co Ltd | 半導体ウェーハの取り扱い方法 |
JP2012209522A (ja) * | 2011-03-30 | 2012-10-25 | Shin Etsu Polymer Co Ltd | 半導体チップ用保持具及びその使用方法 |
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JP2017154815A (ja) * | 2016-03-05 | 2017-09-07 | 平田機工株式会社 | トレイ |
DE202017002152U1 (de) | 2016-11-07 | 2017-05-31 | Shin-Etsu Polymer Co., Ltd. | Haltevorrichtung für Präzisionsteile |
JP7497121B2 (ja) | 2020-09-25 | 2024-06-10 | 株式会社ディスコ | 保持テーブル |
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