WO2015184936A1 - 一种防鼠低烟无卤料 - Google Patents

一种防鼠低烟无卤料 Download PDF

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WO2015184936A1
WO2015184936A1 PCT/CN2015/077484 CN2015077484W WO2015184936A1 WO 2015184936 A1 WO2015184936 A1 WO 2015184936A1 CN 2015077484 W CN2015077484 W CN 2015077484W WO 2015184936 A1 WO2015184936 A1 WO 2015184936A1
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low
free
rodent
halogen
smoke
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French (fr)
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朱松年
朱闻雷
周根生
聂琼英
季琼碧
林赛鸣
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桐庐雷泰生物科技有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/134—Phenols containing ester groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/22—Halogen free composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Definitions

  • the invention relates to a rat-proof low-smoke halogen-free plastic material and a preparation method thereof, and more particularly to a rat-proof low-smoke halogen-free plastic material for wires and cables.
  • capsaicin (alkali) chemical name: n-citric acid vanillin
  • capsaicin (alkali) was used as a rodenticide, but none of them mentioned natural purifying or chemically synthesizing capsaicin (alkali), nor providing the purity of capsaicin (alkali).
  • the content of n-valeric acid vanillamide in the rodenticide will result in the content of n-valeric vanillamide in the low-smoke halogen-free material.
  • the content of n-nonantimony vanillamide in the low-smoke halogen-free material will not reach the rodent control. The effect; the high content of the positive-tannic acid vanillamide will double the production cost and cause unnecessary waste.
  • Chinese Patent Application No. 200710045549.2 discloses an anti-ant anti-rat agent including n-nonanoic acid vanadamide, but the content thereof is not disclosed.
  • Chinese Patent Application No. 20090051833.X discloses capsaicin, but does not mention whether it is natural biological purification or chemical synthesis of capsaicin, and does not indicate the purity of capsaicin, and does not mention the content of ortho-marnic acid vanadamide.
  • the main object of the present invention is to provide a rat-proof low-smoke halogen-free plastic material and a preparation method thereof, and the application of the capsaicin (alkali) as a rodenticide to a low-smoke halogen-free plastic material is provided by the present technical solution.
  • the technical defects are to overcome and make up for the deficiencies of the above technical solutions, and to provide a formula and a preparation method for effectively controlling the production cost by applying different purity capsaicin (alkali) as a rodenticide.
  • the component comprises a low-smoke halogen-free base material and at least a repeller material
  • the low-smoke halogen-free base material comprises at least one or two or more copolymers of EVA, polyethylene, polyolefin as a matrix resin, and flame retardant And anti-oxidant
  • the repeller material contains synthetic capsaicin (alkali) (chemical name: ortho-antimonic acid vanadamide), and the content of n-carver vanillamide is 0.31 of the total weight of the anti-rat low-smoke halogen-free material. % ⁇ 0.89%.
  • the content of ortho-marnic acid vanillamide in the repeller material is 0.35% to 0.49% of the total weight of the rodent-proof low-smoke halogen-free material.
  • the content of ortho-marnic acid vanillamide in the repeller material is 0.4% to 0.45% of the total weight of the rodent-proof low-smoke halogen-free material.
  • the hunger-removing material is a high-purity synthetic capsaicin (alkali) having a content of 90% to 99.8% by weight of vanillyl phthalate, and the content of vanillyl amide is the total weight of the anti-rat low-smoke halogen-free material. 0.31% to 0.89%.
  • the repeller material is a synthetic capsaicin (alkali) having a content of 50% to 85% by weight of the vanadic acid amide
  • the content of the vanillyl methacrylate is 0.35% of the total weight of the anti-rat low-smoke halogen-free material. ⁇ 0.75%.
  • the repeller material is a repeller microcapsule having a content of 15% to 35% by weight of the vanadic acid amide
  • the content of the vanillyl phthalate is 0.4% to 0.45 of the total weight of the anti-rat low-smoke halogen-free material. %.
  • the repeller material is a rodent control material having a content of 5% to 15% by weight of vanillyl amide
  • the content of vanillyl amide is 0.4% to 0.7% of the total weight of the rodent low-smoke halogen-free material. %.
  • the preparation method of the rodent-proof low-smoke halogen-free material comprises the following steps: (1) first pulverizing the synthetic capsaicin (alkali) into a powder or granules by a pulverizer, or heating the synthetic capsaicin (alkali) to 40 °C-100 °C slowly melts into a liquid; (2) the pulverized or melted synthetic capsaicin (alkali) and flame retardant are stirred evenly in a high-speed mixer; (3) mixed with synthetic capsaicin (alkali) The uniform flame retardant and other components of the low-smoke halogen-free base material are blended again and uniformly mixed; (4) finally, the blended anti-mouse low-smoke and halogen-free raw materials are sent to the extruder to obtain low rodent control.
  • the smoke is halogen-free.
  • the preparation method of the rodent-proof low-smoke halogen-free material comprises the following steps: (1) uniformly blending the repeller microcapsules and the low-smoke halogen-free matrix resin; (2) further adding a flame retardant, an antioxidant, and the like. The components are mixed with the low-smoke halogen-free matrix resin uniformly mixed with the squirrel microcapsules, and the blending is uniform; (3) finally, the mixed anti-mouse low-smoke and halogen-free raw materials are sent to the extruder to obtain a rat-proof and low-smoke-free product. Halogen.
  • the preparation method of the rodent-proof low-smoke halogen-free material comprises the following steps: (1) firstly mixing the anti-mouse masterbatch and the low-smoke-free halogen-free matrix resin, the flame retardant, the antioxidant, and the like into the blending; (2) Finally, the mixed anti-mouse low-smoke and halogen-free raw materials are sent to an extruder to obtain a rodent-proof low-smoke halogen-free material.
  • the invention adopts different purity capsaicin (alkali) as a rodent control agent to prepare the rodent-proof low-smoke halogen-free material, and passes the mechanical and physical property test of the mechanical industry standard JB/T 10696.10-XXXX wire and cable.
  • the method can achieve a significant level of anti-rat bite function with a protection rate greater than 90%, and reasonable control of production costs.
  • the high-purity capsaicin (alkali) having 95% of the content of vanillyl citrate is pulverized into powder or granules by a pulverizer, or the synthetic capsaicin (alkali) is heated to 40 ° C - 100 ° C. Slowly melt into a liquid;
  • the blended anti-mouse low-smoke and halogen-free raw materials are sent to an extruder to obtain a rodent-proof low-smoke halogen-free material.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Catching Or Destruction (AREA)
  • Physics & Mathematics (AREA)
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Abstract

本发明公开了一种防鼠低烟无卤料及其制备方法，其组分包括有低烟无卤基础材料和驱鼠材料，驱鼠材料中正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.31％～0.89％。本发明的防鼠低烟无卤料将正-壬酸香草酰胺含量控制在有效驱鼠的最小用量范围，以及控制合理的生产成本，能够广泛应用于各类电线电缆的生产，使得大量普及和推广防鼠咬电线电缆成为可能。

Description

一种防鼠低烟无卤料 技术领域
本发明涉及一种防鼠咬低烟无卤塑料材料及其制备方法，更具体地说，关于一种电线、电缆用防鼠咬低烟无卤塑料材料。
背景技术
据不完全统计，各类不明原因的火灾中有25％是由于老鼠咬破电缆塑料护套造成，在国内外60年代就对电线、电缆的防鼠非常重视，特别是辣椒素(碱)添加在各类塑料中作为驱鼠剂的研究也已经有一定的历史。但是，传统的提纯辣椒素(碱)(化学名称：香草基壬酰胺)每公斤达到2万元人民币，用来作为驱鼠剂添加，使塑料的成本过高不能得到推广，因此只是停留在研究阶段。现在市场上的合成辣椒素(碱)(化学名称：正-壬酸香草酰胺)的价格每公斤仅1600元人民币以下，使辣椒素(碱)作为驱鼠剂用于塑料制品的生产成为可能。在之前有不少关于用辣椒素(碱)作为驱鼠剂的案例，但基本均未提到是天然生物提纯还是化学合成辣椒素(碱)，更未提供辣椒素(碱)的纯度。驱鼠剂中正-壬酸香草酰胺的含量将导致低烟无卤料中正-壬酸香草酰胺的含量，正-壬酸香草酰胺在低烟无卤料中的含量过低将达不到防鼠效果；正-壬酸香草酰胺含量过高将成倍提高生产成本，造成不必要的浪费。
经过对现有技术的检索发现，我国专利99113759.0和03136904.9中公开的是香草基壬酰胺，未提供纯度。
我国专利申请号200710045549.2公开了防蚁防鼠剂包括正-壬酸香草酰胺，但未公开其含量。
我国专利申请号20090051833.X公开了辣椒素，但未提到是天然生物提纯还是化学合成辣椒素，未指明辣椒素的纯度，更未提及正-壬酸香草酰胺的含量。
发明内容
本发明的主要目的在于提供一种防鼠咬低烟无卤塑料材料及其制备方法，通过本技术方案，针对现有以辣椒素(碱)为驱鼠剂添加在低烟无卤塑料材料应用的技术缺陷，以克服和弥补上述技术方案的不足，提供应用不同纯度辣椒素(碱)作为防鼠剂都能实际达到防鼠咬功能，并且合理控制生产成本的配方和制备方法。
为了达到上述的目的，本发明的技术方案是这样实现的：
其组分包括有低烟无卤基础材料和驱鼠材料，所述低烟无卤基础材料至少包括有EVA、聚乙烯、聚烯烃中的一种或两种以上共聚物作为基体树脂、阻燃剂及抗氧剂，所述驱鼠材料中含有合成辣椒素(碱)(化学名称：正-壬酸香草酰胺)，正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.31％～0.89％。
所述驱鼠材料中正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.35％～0.49％。
所述驱鼠材料中正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.4％～0.45％。
所述驱鼠材料为正-壬酸香草酰胺含量占其重量90％～99.8％的高纯度合成辣椒素(碱)时，正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.31％～0.89％。
所述驱鼠材料为正-壬酸香草酰胺含量占其重量50％～85％的合成辣椒素(碱)时，正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.35％～0.75％。
所述驱鼠材料为正-壬酸香草酰胺含量占其重量15％～35％的驱鼠微胶囊时，正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.4％～0.45％。
所述驱鼠材料为正-壬酸香草酰胺含量占其重量5％～15％的防鼠母料时，正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.4％～0.7％。
所述防鼠低烟无卤料的制备方法包括下列步骤：(1)先将合成辣椒素(碱)经粉碎机粉碎成粉末状或颗粒状，或将合成辣椒素(碱)加温到40℃－100℃慢慢融化为液体状；(2)将粉碎或融化后的合成辣椒素(碱)和阻燃剂在高速搅拌机内搅拌均匀；(3)再将与合成辣椒素(碱)混合均匀的阻燃剂和低烟无卤基础材料的其它组份再次共混，混合均匀；(4)最后将共混好的防鼠低烟无卤原料送入挤塑机以制得防鼠低烟无卤料。
所述防鼠低烟无卤料的制备方法包括下列步骤：(1)先将驱鼠微胶囊和低烟无卤基体树脂共混均匀；(2)再将阻燃剂、抗氧剂等其它组份投入与驱鼠微胶囊混合均匀的低烟无卤基体树脂继续共混均匀；(3)最后将混合好的防鼠低烟无卤原料送入挤塑机以制得防鼠低烟无卤料。
所述防鼠低烟无卤料的制备方法包括下列步骤：(1)先将防鼠母料和低烟无卤基体树脂、阻燃剂、抗氧剂等组份投入共混均匀；(2)最后将混合好的防鼠低烟无卤原料送入挤塑机以制得防鼠低烟无卤料。
本发明的有益效果是：本发明应用不同纯度辣椒素(碱)作为防鼠剂制备得到的防鼠低烟无卤料，经过(机械行业标准JB/T 10696.10—XXXX电线电缆机械和理化性能试验方法)试验，均能达到防护率大于90％的显著级防鼠咬功能，并且合理控制了生产成本。
具体实施方式
下面结合具体实施例对本发明作进一步说明，以使本领域的技术人员可以更好的理解本发明并能予以实施，但所举实施例不作为对本发明的限定。
实施例1
本实施例的组份如下：
Figure PCTCN2015077484-appb-000001
上述防鼠低烟无卤料的制备方法如下：
(1)先将正-壬酸香草酰胺含量95％的高纯度辣椒素(碱)经粉碎机粉碎成粉末状或颗粒状，或将合成辣椒素(碱)加温到40℃－100℃慢慢融化为液体状；
(2)将粉碎或融化后的正-壬酸香草酰胺含量95％的高纯度合成辣椒素(碱)和氢氧化镁在高速搅拌机内搅拌均匀；
(3)再将与正-壬酸香草酰胺含量95％的高纯度合成辣椒素(碱)混合均匀的氢氧化镁和线性低密度聚乙烯、马来酸酐接枝乙烯-辛烯共聚物、乙烯-丙烯酸共聚物、有机硅、抗氧剂1010一起再共混，混合均匀；
(4)最后将共混好的防鼠低烟无卤原料送入挤塑机以制得防鼠低烟无卤料。
实施例2
本实施例的组份如下：
Figure PCTCN2015077484-appb-000002
上述防鼠低烟无卤料的制备方法同实施例1
实施例3
本实施例的组份如下：
Figure PCTCN2015077484-appb-000003
Figure PCTCN2015077484-appb-000004
上述防鼠低烟无卤料的制备方法如下：
(1)先将正-壬酸香草酰胺含量20％的驱鼠微胶囊和线性低密度聚乙烯、马来酸酐接枝乙烯-辛烯共聚物、乙烯-丙烯酸共聚物共混均匀；
(2)再将有机硅、抗氧剂1010、氢氧化镁投入与驱鼠微胶囊混合均匀的低烟无卤基体树脂继续共混均匀；
(3)最后将混合好的防鼠低烟无卤原料送入挤塑机以制得防鼠低烟无卤料。
实施例4
本实施例的组份如下：
Figure PCTCN2015077484-appb-000005
上述防鼠低烟无卤料的制备方法如下：
(1)先将正-壬酸香草酰胺含量10％的驱鼠母料和线性低密度聚乙烯、马来酸酐接枝乙烯-辛烯共聚物、乙烯-丙烯酸共聚物、有机硅、抗氧剂1010、氢氧化镁投入共混均匀；
(2)最后将混合好的防鼠低烟无卤原料送入挤塑机以制得防鼠低烟无卤料。
以上所述实施例仅是为充分说明本发明而所举的较佳的实施例，本发明的保护范围不限于此。本技术领域的技术人员在本发明基础上所作的等同替代或变换，均在本发明的保护范围之内。本发明的保护范围以权利要求书为准。

Claims (10)

  1. 一种防鼠低烟无卤料，其组分包括有低烟无卤基础材料和驱鼠材料，其中低烟无卤基础材料至少包括有EVA、聚乙烯、聚烯烃中的一种或两种以上共聚物作为基体树脂、阻燃剂及抗氧剂，其特征在于，驱鼠材料中含有合成辣椒素(碱)(化学名称：正-壬酸香草酰胺)，正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.31％～0.89％。
  2. 根据权利要求1所述的防鼠低烟无卤料，其特征在于，驱鼠材料中正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.35％～0.49％。
  3. 根据权利要求2所述的防鼠低烟无卤料，其特征在于，驱鼠材料中正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.4％～0.45％。
  4. 根据权利要求1所述的防鼠低烟无卤料，其特征在于，驱鼠材料为正-壬酸香草酰胺含量占其重量90％～99.8％的高纯度合成辣椒素(碱)时，正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.31％～0.89％。
  5. 根据权利要求1所述的防鼠低烟无卤料，其特征在于，驱鼠材料为正-壬酸香草酰胺含量占其重量50％～85％的合成辣椒素(碱)时，正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.35％～0.75％。
  6. 根据权利要求1所述的防鼠低烟无卤料，其特征在于，驱鼠材料为正-壬酸香草酰胺含量占其重量15％～35％的驱鼠微胶囊时，正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.4％～0.45％。
  7. 根据权利要求1所述的防鼠低烟无卤料，其特征在于，驱鼠材料为正-壬酸香草酰胺含量占其重量5％～15％的防鼠母料时，正-壬酸香草酰胺含量为防鼠低烟无卤料总重量的0.4％～0.7％。
  8. 根据权利要求4或5所述的防鼠低烟无卤料的制备方法，其特征在于，包括以下步骤：(1)先将合成辣椒素(碱)经粉碎机粉碎成粉末状或颗粒状，或将合成辣椒素(碱)加温到40℃－100℃慢慢融化为液体状；(2)将粉碎或融化后的合成辣椒素(碱)和阻燃剂在高速搅拌机内搅拌均匀；(3)再将与合成辣椒素(碱)混合均匀的阻燃剂和低烟无卤基础材料的其它组份再次共混均匀；(4)最后将共混好的防鼠低烟无卤原料送入挤塑机制得防鼠低烟无卤料。
  9. 根据权利要求6所述的防鼠低烟无卤料的制备方法，其特征在于，包括以下步骤：(1)先将驱鼠微胶囊和低烟无卤基体树脂共混均匀；(2)再将阻燃剂、抗氧剂等其它组份投入与驱鼠微胶囊混合均匀的低烟无卤基体树脂继续共混均匀；(3)最后将混合好的防鼠低烟无卤原料送入挤塑机制得防鼠低烟无卤料。
  10. 根据权利要求7所述的防鼠低烟无卤料的制备方法，其特征在于，包括以下步骤：(1)先将防鼠母料和低烟无卤基体树脂、阻燃剂、抗氧剂等组份投入共混均 匀；(2)最后将混合好的防鼠低烟无卤原料送入挤塑机制得防鼠低烟无卤料。
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