WO2015178646A1 - 유리기판의 절단부 가공방법 및 가공장치 - Google Patents

유리기판의 절단부 가공방법 및 가공장치 Download PDF

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Publication number
WO2015178646A1
WO2015178646A1 PCT/KR2015/004968 KR2015004968W WO2015178646A1 WO 2015178646 A1 WO2015178646 A1 WO 2015178646A1 KR 2015004968 W KR2015004968 W KR 2015004968W WO 2015178646 A1 WO2015178646 A1 WO 2015178646A1
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WO
WIPO (PCT)
Prior art keywords
glass substrate
heating member
cutting
cut portion
temperature
Prior art date
Application number
PCT/KR2015/004968
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
손동진
김동환
김종민
탁광용
Original Assignee
동우 화인켐 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동우 화인켐 주식회사 filed Critical 동우 화인켐 주식회사
Publication of WO2015178646A1 publication Critical patent/WO2015178646A1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock

Definitions

  • the present invention relates to a method for processing a cut portion of a glass substrate and a processing apparatus used therefor.
  • Processing of glass substrates used in flat panel displays or the like generally involves cutting a glass substrate into a desired shape and then grinding and / or polishing the edges of the cut glass substrate to remove sharp corners.
  • Korean Patent Application No. 2012-0002573 discloses a method of cutting a corner in a strip form by moving a heated member in contact with a corner of a cooled glass substrate, as shown in FIG. 1. This method can prevent the glass dust generated during the polishing of the edge of the glass substrate inherently, and may be useful in this field.
  • the present invention has been made to solve the above problems of the prior art,
  • the present invention is a.
  • step (c) in order to further process the edge of the cut portion,
  • the method may further include cutting the strip by sequentially contacting the heating member heated before the step (c) with both edges of the glass substrate cutout.
  • a heating member, the heating member support, and a glass substrate support are provided.
  • the heating member support and the glass substrate support in the cutting portion processing apparatus of the glass substrate which is provided to be movable so that the cut portion of the glass substrate fixed to the heating member and the glass substrate support can be sequentially contacted
  • the heating member provides a cutting part processing apparatus of the glass substrate, characterized in that it has a form that can be contacted at a time from one point of one corner of the vertical surface of the cut portion of the glass substrate to one point of the opposite corner to be symmetrical.
  • the method of processing the cut portion of the glass substrate of the present invention it is possible to economically provide a durable glass substrate by removing the chipping and cracks from the entire cut surface by a simple method without performing cleaning, hydrofluoric acid treatment, reinforcing agent treatment or the like. have.
  • FIG. 3 is a view showing a cutting portion processing method of the glass substrate of the present invention
  • Figure 4 shows a photograph of the cut surface of the glass substrate processed by the prior art
  • Figure 5 shows a photograph of the cut surface of the glass substrate processed by the present invention.
  • FIG. 6 is a photograph taken of the cutting unit processing apparatus of the glass substrate as an embodiment of the present invention.
  • the cutting part processing method of the glass substrate uses the principle that the strip is cut at the contact part due to the temperature difference inside the glass when the heated heating member is brought into contact with the processing part of the glass substrate.
  • the strip is formed on the entire vertical surface to process the cut portion of the glass substrate. This removal is characterized by providing a durable glass substrate.
  • the Tg temperature of the glass is varied from 750 °C to 1300 °C depending on the type of glass.
  • the temperature of the heating member is preferably maintained at 50 ° C or higher, preferably 100 ° C or higher, even more preferably 200-500 ° C or higher than the Tg of the glass in order to appropriately cut the processed portion. .
  • the heating member can be cut out of the strip due to the temperature difference in the glass even when the temperature of the glass substrate is 0 to 50 ° C.
  • the cooling may cool the glass substrate as a whole or selectively cool only the processed portion of the glass substrate, but it is preferable to cool the entire glass substrate for stable control.
  • Cooling of the glass substrate may be performed by placing a glass substrate in a working environment maintained at a low temperature for a predetermined time, or by contacting the glass substrate to a cooling plate maintained at a low temperature.
  • the cutting operation is performed in a state of being fixed to a cooling plate maintained at a constant temperature so as to avoid an increase in the temperature of the glass during the operation.
  • the temperature of the glass substrate is preferably 10 °C or less, more preferably in the range 0 ⁇ 10 °C to reduce the energy consumed for excessive cooling.
  • step (c) in order to further process the edge of the cut portion,
  • the step of cutting the strip may be further performed by sequentially contacting both edges of the glass substrate cutout with the heated heating member before step (c).
  • the cut portion of the glass substrate can be processed in the order of processing the vertical surface remaining unprocessed in the cut portion.
  • edge processing of the glass substrate cut portion may be used as a heating member having a portion in contact with the edge of the glass substrate toward the central axis from the outer peripheral surface (see steps 1 to 3 of FIG. 3).
  • the shape tapered from the outer circumferential surface toward the center is not particularly limited, but examples thereof include a cone-like form.
  • the upper portion of the tapered portion is not particularly limited but may have a cylindrical shape.
  • a heating member, the heating member support, and a glass substrate support are provided.
  • the heating member support and the glass substrate support in the cutting portion processing apparatus of the glass substrate which is provided to be movable so that the cut portion of the glass substrate fixed to the heating member and the glass substrate support can be sequentially contacted
  • the heating member relates to a cutting part processing apparatus for a glass substrate, which has a shape that can be contacted at a time from one point of one corner of the vertical surface of the cut part of the glass substrate to one point of the opposite edge to be symmetrical.
  • a polygonal column such as a cylinder, a triangle, a square, a pentagonal column, and the like longer than the thickness of the vertical surface of the cut portion may be used, as shown in step 5 of FIG. 3.
  • a cylindrical form can be preferably used.
  • the heating member may be heated by means commonly used in the art.
  • an electric resistance method, a high frequency induction heating method, or the like can be used.
  • the high frequency induction heating method refers to a method in which a heating member located in the middle of a coil in which a high frequency current flows is heated by a method of heating rapidly by the eddy current EDDYCURRENT generated by the electromagnetic induction action and the heat loss of some HYSTERESIS.
  • the high frequency induction heating method can effectively concentrate energy on the heating member penetrating the coil, so that it is possible to increase the temperature quickly and is particularly advantageous in preventing the temperature drop of the heating member due to contact with the cooling member. Can be used.
  • the heating member support is not particularly limited in form as long as it has a structure capable of fixing the heating member through the pressure member, forms known in the art can be used.
  • the glass substrate support is a component capable of fixing the glass substrate, and may be provided with various forms of fixing means known in the art.
  • the glass substrate support may further include cooling means for cooling the glass substrate.
  • the cooling means may be, for example, a cooling plate formed with a pipe through which a low temperature refrigerant flows is formed at the bottom of the support.
  • the heating member and the glass substrate can be moved relatively. That is, the heating member may move, the glass substrate may move, or the glass substrate and the heating member may move simultaneously. Movement of the heating member and the glass substrate may be performed by operation of the heating member support and the glass substrate support, respectively.
  • the moving speed of the heating member and / or the glass substrate may be adjusted in consideration of productivity, cutting depth, temperature difference, and pressure difference.
  • one of the heating member support and the glass substrate support is fixed, the other one may be installed so as to move while maintaining the processing portion of the heating member and the glass substrate cut.
  • the heating member support is fixed and the glass substrate support moves. This is because, when the heating member support moves, a temperature change occurs in the heating part due to the convection caused by the movement, so that it is difficult to cut the uniform strip.
  • the contact of the heating member and the cut portion of the glass substrate is made by being pressed to apply a pressure of about 0.1-3.0 Kgf / cm 2, more preferably about 0.5-1.5 Kgf / cm 2.
  • the cut portion of the glass substrate (sample: Example 5 and Comparative Example 5) having a thickness of 0.7mm was processed.
  • Example 5-5 all the edges and the vertical surface of the cut part were processed, and in the case of Comparative Examples 1-5, only the edge of the cut part was processed.
  • Equation 2 The distance from the point where the upper span touches the glass substrate to the point at which the glass substrate is broken is measured to evaluate the elongation represented by Equation 2 below, and the results are shown in Table 2 below.
  • T is the thickness (unit) of the window substrate
  • ⁇ is the crosshead displacement (unit)
  • s is the distance (cm) between the support spans.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
PCT/KR2015/004968 2014-05-19 2015-05-18 유리기판의 절단부 가공방법 및 가공장치 WO2015178646A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0059925 2014-05-19
KR1020140059925A KR102218983B1 (ko) 2014-05-19 2014-05-19 유리기판의 절단부 가공방법 및 가공장치

Publications (1)

Publication Number Publication Date
WO2015178646A1 true WO2015178646A1 (ko) 2015-11-26

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Application Number Title Priority Date Filing Date
PCT/KR2015/004968 WO2015178646A1 (ko) 2014-05-19 2015-05-18 유리기판의 절단부 가공방법 및 가공장치

Country Status (3)

Country Link
KR (1) KR102218983B1 (zh)
TW (1) TWI679177B (zh)
WO (1) WO2015178646A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108608591A (zh) * 2016-12-12 2018-10-02 上海新昇半导体科技有限公司 改善晶圆表面切割形貌的线切割系统
KR101867039B1 (ko) * 2017-02-02 2018-06-14 에이펫(주) 면취 장치 및 면취 방법
KR102196544B1 (ko) * 2019-02-13 2020-12-30 삼성전자주식회사 측면 배선이 형성된 글라스 기판을 구비한 디스플레이 모듈 및 디스플레이 모듈 제조 방법
US11056630B2 (en) 2019-02-13 2021-07-06 Samsung Electronics Co., Ltd. Display module having glass substrate on which side wirings are formed and manufacturing method of the same

Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2009035433A (ja) * 2007-07-31 2009-02-19 Asahi Glass Co Ltd ガラス基板の面取り方法および装置、面取りされたガラス基板
KR20090129440A (ko) * 2007-02-23 2009-12-16 코닝 인코포레이티드 열 에지 마감처리
KR20120018765A (ko) * 2009-05-14 2012-03-05 피코드릴 에스 아 기판 에지의 평활화 및/또는 면취 방법
WO2014021606A2 (ko) * 2012-08-01 2014-02-06 주식회사 라미넥스 고주파 유도 가열기를 이용한 유리 모서리 가공 방법 및 장치
WO2014036108A1 (en) * 2012-08-31 2014-03-06 Corning Incorporated Edge treating a cut edge of a glass piece

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WO2008020509A1 (fr) * 2006-08-14 2008-02-21 Asahi Glass Company, Limited Verre trempé thermorésistant et son procédé de fabrication
US20120008183A1 (en) 2009-03-27 2012-01-12 Konica Minolta Opto, Inc. Resin molded article for optical element, method for manufacturing resin molded article for optical element, device for manufacturing resin molded article for optical element, and scanning optical device
EP2507182B1 (en) * 2009-11-30 2014-03-05 Corning Incorporated Methods for laser scribing and separating glass substrates
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090129440A (ko) * 2007-02-23 2009-12-16 코닝 인코포레이티드 열 에지 마감처리
JP2009035433A (ja) * 2007-07-31 2009-02-19 Asahi Glass Co Ltd ガラス基板の面取り方法および装置、面取りされたガラス基板
KR20120018765A (ko) * 2009-05-14 2012-03-05 피코드릴 에스 아 기판 에지의 평활화 및/또는 면취 방법
WO2014021606A2 (ko) * 2012-08-01 2014-02-06 주식회사 라미넥스 고주파 유도 가열기를 이용한 유리 모서리 가공 방법 및 장치
WO2014036108A1 (en) * 2012-08-31 2014-03-06 Corning Incorporated Edge treating a cut edge of a glass piece

Also Published As

Publication number Publication date
TWI679177B (zh) 2019-12-11
KR20150133068A (ko) 2015-11-27
TW201602025A (zh) 2016-01-16
KR102218983B1 (ko) 2021-02-23

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