WO2015174270A1 - チップヒューズ及びその製造方法 - Google Patents
チップヒューズ及びその製造方法 Download PDFInfo
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- WO2015174270A1 WO2015174270A1 PCT/JP2015/062793 JP2015062793W WO2015174270A1 WO 2015174270 A1 WO2015174270 A1 WO 2015174270A1 JP 2015062793 W JP2015062793 W JP 2015062793W WO 2015174270 A1 WO2015174270 A1 WO 2015174270A1
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- WIPO (PCT)
- Prior art keywords
- fuse
- fuse wire
- wire support
- divided body
- hole
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
- H01H85/17—Casings characterised by the casing material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
- H01H85/175—Casings characterised by the casing shape or form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/43—Means for exhausting or absorbing gases liberated by fusing arc, or for ventilating excess pressure generated by heating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
- H01H2085/0412—Miniature fuses specially adapted for being mounted on a printed circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
- H01H2085/0414—Surface mounted fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/143—Electrical contacts; Fastening fusible members to such contacts
- H01H85/157—Ferrule-end contacts
Definitions
- the present invention relates to a small chip fuse, a chip fuse in which a fuse wire is installed in a main body used in a power supply device equivalent to a general household rated current and voltage, and a manufacturing method thereof.
- a tube fuse attached to a fuse holder is generally used as a fuse (primary fuse) used in a primary protection circuit of a transformer applied to a power supply device.
- a fuse primary fuse
- a form in which a fuse is directly surface-mounted on a wiring board has been used due to market demands such as reduction in size and weight of a power supply device. Therefore, instead of a tube fuse using a glass cylindrical case, a rectangular chip fuse is often used, in which a linear or belt-like fuse element is stretched between both electrodes in a box-shaped case made of ceramics. Has been.
- a box-shaped case in the one shown in Japanese Patent Application Laid-Open No.
- a ceramic fuse wire support having a through hole in the center and opposite ends of the fuse wire support across the through hole
- a cylindrical ceramic case in which a fuse wire as a fuse wire support with a fuse wire is inserted, and a fuse wire protruding from both ends of the fuse wire support are made conductive.
- a chip fuse formed from metal caps installed at both ends of a cylindrical body of a case is known.
- the fuse is formed by inserting a fuse combined body composed of a fuse wire and a fuse wire support into a cylindrical ceramic case, and thus occurs when the fuse performs a current interruption operation. There was no place for impact release, and the case could be damaged or deformed. In addition, there is no discharge location for the fuse element evaporant (steam) generated at the time of fusing, and steam remains in the case after fusing, so it is not possible to ensure insulation resistance between the fused fuse terminals or between the fused ends of the fuse wires was there.
- the present invention has been made in order to solve such conventional drawbacks, and an object of the present invention is to provide an improved chip fuse and a method for manufacturing the chip fuse which can discharge shocks and vapors generated at the time of fusing in a well-balanced manner. To do.
- a pair of upper and lower ceramic substrates disposed vertically opposite to each other and the upper and lower ceramic substrates are sandwiched, and a vertical through hole is formed at the center.
- a fuse body having a fuse wire support, a fuse wire mounted across a through hole between both ends of the fuse wire support, and the fuse wire protruding from both ends of the fuse wire support in a conductive state
- a pair of metal caps fitted to both ends of the fuse body, the upper ceramic substrate and the fuse wire support, and the lower ceramic substrate and the fuse wire support are bonded to each other on the opposing surfaces.
- a chip fuse is provided in which the through hole is sealed and a non-bonded portion is formed on a part of the bonding surface.
- the non-adhesive portion may be formed on both sides in the longitudinal direction of the through hole.
- the fuse wire support body is composed of an upper fuse wire support divided body and a lower fuse wire support divided body stacked in the vertical direction, and the through hole includes an upper fuse wire support divided body and a lower fuse wire support divided body. It penetrates in the up-down direction, and the fuse wire may be mounted across the through hole in the longitudinal direction of the fuse wire support.
- the non-bonded portion is between the upper ceramic substrate and the upper fuse wire support divided body, between the upper fuse wire support divided body and the lower fuse wire support divided body, and between the lower fuse wire support divided body and the lower side. Each may be formed between the ceramic substrate.
- the fuse wire support has a unitary structure, and the fuse wire passes through the through hole of the fuse wire support, and has one end on the upper surface and the other end on the lower surface of both ends of the fuse wire support. You may mount in an inclined state in between.
- a fuse wire is mounted across the through hole between both ends of a fuse wire support having a vertical through hole in the center, and the fuse wire is mounted.
- the mounted fuse wire support is sandwiched between a pair of upper and lower ceramic substrates, and the pair of ceramic substrates and the fuse wire support are bonded to each other between the opposing surfaces, and are not bonded to a part of the bonding surface.
- a chip fuse manufacturing method is provided, in which a fuse body is formed, and a metal cap is fitted to both ends of the fuse body in a conductive state with the fuse wire.
- the non-adhesive portion may be formed on both sides in the longitudinal direction of the through hole.
- the fuse wire support is composed of an upper fuse wire support divided body and a lower fuse wire support divided body that are stacked in the vertical direction, and the through hole is formed of an upper fuse wire support divided body and a lower fuse wire support divided body.
- the fuse wire may be mounted across the through hole in the longitudinal direction of the fuse wire support body between the upper fuse wire support split body and the lower fuse wire support split body.
- the non-adhesive portion is formed between the upper ceramic substrate and the upper fuse wire support divided body, between the upper fuse wire support divided body and the lower fuse wire support divided body, and the lower fuse wire support divided body and the lower side. You may form respectively between ceramic substrates.
- the fuse wire support has a unitary structure, and the fuse wire crosses the through hole of the fuse wire support, and one end of the upper surface and the other end of the lower surface of the opposite ends of the fuse wire support. You may mount it diagonally between.
- the present invention there is also provided a method for manufacturing the above-described chip fuse, the upper fuse wire supporting divided body having an upper and lower through hole in the center and an upper ceramic substrate, and a lower fuse wire having an upper and lower through hole in the center.
- the support divided body and the lower ceramic substrate are bonded to each other on the opposing surfaces, a non-bonded portion is formed on a part of the bonding surface, and the through hole is formed between both ends of the lower fuse wire support divided body.
- a fuse wire is mounted, and the lower fuse wire support divided body and the upper fuse wire support divided body on which the fuse wire is mounted are vertically opposed to be bonded to each other and a part of the bonded surface.
- a non-adhesive portion is formed on the fuse body to form a fuse body, and metal caps are fitted to both ends of the fuse body in a conductive state with the fuse wire.
- each non-bonded portion may be formed on both sides in the longitudinal direction of the through hole.
- a fuse body having a pair of upper and lower ceramic substrates, a fuse wire support, and a fuse wire provided on the fuse wire support is a main component, and the upper ceramic substrate and the fuse wire support are included. And between the lower ceramic substrate and the fuse wire support, the opposing surfaces are bonded to each other to seal the through hole, and a non-bonded portion is formed on a part of the bonding surface.
- the shock and vapor generated when the fuse is blown are discharged from the inside of the chip fuse to the outside through the non-bonded portion. Therefore, deformation and breakage of the chip fuse can be avoided. Further, since the vapor does not stay in the chip fuse, it is possible to secure an insulation resistance between the blown fuse terminals or between the blown ends of the fuse wires, and the effect of improving the performance of the chip fuse can be obtained.
- the present invention eliminates fuse breakage at the time of fusing, realizes a fuse that ensures insulation resistance between fuse terminals after fusing or between fusing ends of a fuse wire, and uses relatively high voltage and current for home use etc. Protect each element of the electronic circuit used for switchboards, etc., and ensure safety against fire.
- FIG. 1st embodiment it is a schematic perspective view explaining the process of cutting out a ceramic substrate from a raw material sheet.
- FIG. 1st embodiment it is a schematic perspective view explaining the process of cutting out a fuse wire support division body from a raw material sheet.
- the upper fuse support divided body and the lower fuse support divided body are arranged vertically opposite to each other, and an exploded perspective view showing a state in which a fuse wire and an adhesive are arranged between the fuse support divided bodies. It is.
- FIG. 7 is a perspective view of a fuse body manufactured through the steps up to FIG. 6.
- FIG. 8 is a perspective view showing a state when a metal cap is fitted to both ends of the fuse body shown in FIG. 7.
- it is a perspective view of the metal cap fitted by the both ends of a fuse main body. It is a perspective view which shows the completion state of the chip fuse in the said embodiment.
- FIG. 12 is an exploded cross-sectional view showing the chip fuse according to the embodiment in a cross-section similar to FIG. It is a disassembled perspective view which shows the fuse main body of the chip fuse which concerns on 2nd embodiment of this invention. It is a perspective view showing the state which has arrange
- FIG. 17 is a perspective view of a fuse body manufactured through the steps up to FIG. 16.
- FIG. 18 is a perspective view showing a state when a metal cap is fitted to both ends of the fuse body shown in FIG. 17. It is a perspective view which shows the completion state of the chip fuse in the said embodiment. It is longitudinal direction sectional drawing of the chip fuse which concerns on the said embodiment.
- FIG. 21 is an exploded cross-sectional view showing the chip fuse according to the embodiment in a cross-section similar to FIG.
- FIG. 1 is an exploded perspective view showing a main part (referred to as a fuse main body) of a chip fuse according to a first embodiment of the present invention.
- the fuse body is disposed at the uppermost ceramic substrate 1 disposed at the uppermost portion, the upper fuse wire support divided body 3 bonded to the lower surface of the upper ceramic substrate 1 by the adhesive 2, and the lowermost portion of the fuse body. It has a four-layer structure having a lower ceramic substrate 5 and a lower fuse wire support divided body 7 bonded to the upper surface of the lower ceramic substrate 5 with an adhesive 6.
- the upper fuse wire support divided body 3 and the lower fuse wire support divided body 7 are later bonded by an adhesive 20 to constitute one fuse wire support.
- the upper ceramic substrate 1 and the upper fuse wire support divided body 3 which are bonded to each other with an adhesive 2 constitute an upper fuse support divided body 4, and the lower ceramic substrate 5 and the lower fuse which are bonded to each other with an adhesive 6.
- the wire support divided body 7 constitutes the lower fuse support divided body 8.
- a fuse wire 9 is sandwiched between the upper fuse support divided body 4 and the lower fuse support divided body 8, that is, between the upper fuse wire support divided body 3 and the lower fuse wire supported divided body 7.
- FIG. 2 is a perspective view for explaining a process of cutting out the ceramic substrates 1 and 5 from the ceramic sheet 10 as a material.
- FIG. 2A shows a state in which the slit 11 is put in the sheet 10.
- Each section defined by the slit 11 is the size of one of the ceramic substrates 1 and 5.
- the processed sheet 10 is divided along the slits 11 to obtain ceramic substrates 1 and 5.
- FIG. 3 is a perspective view for explaining a process of cutting out the fuse wire support divided bodies 3 and 7 from the sheet 14 as a material.
- FIG. 3A shows a state where the slit 15 is inserted in the sheet 14. Each section defined by the slit has a size corresponding to one of the fuse wire support divided bodies 3 and 7.
- the sheet 14 with the slits 15 is subjected to an operation such as pressing to form through holes 16 in each section.
- fuse wire holding grooves 17 are formed at both ends in the longitudinal direction of each through hole 16 by dicing.
- the processed sheet 14 is divided along the slit 15 to obtain the fuse wire support divided bodies 3 and 7.
- the fuse wire holding groove 17 is formed over the short-side end surface 18 on the lower surface of the upper fuse wire support divided body 3, and is formed over the short-side end surface 18 on the upper surface of the lower fuse wire support divided body 7. Is done.
- the fuse wire 9 is made of a wire-like or thin rod-like metal material, and is produced, for example, by silver plating on an annealed copper wire or iron-nickel alloy wire.
- the fuse wire 9 is connected to a circuit of an electric device or facility, and a fusing current value is set so as to blow at a predetermined current value.
- the adhesives 2 and 6 are formed as a pair of U-shaped thin plates or thin films in accordance with the upper surface shape of the upper fuse wire support divided body 3 having the through holes 16.
- the length of the pair of U-shaped arms is such that even if a pair of U-shaped adhesives are arranged at both ends of the upper surface of the upper fuse wire support divided body 3 so that the U-shaped openings face each other, It is formed so as to be shorter than the longitudinal dimension.
- the non-bonded portion 26 is provided between the tips of the U-shaped arm portions of the pair of adhesives 2 facing each other on the bonding surface. Is formed.
- a pair of U-shaped adhesives 6 are arranged at both ends of the lower surface of the lower fuse wire support divided body 7 so that the U-shaped openings face each other, and the lower fuse wire support divided body 7 and the lower fuse wire support divided body 7
- a non-bonded portion 28 is formed on the bonding surface.
- the adhesives 2 and 6 are formed in a U shape, but the shapes and dimensions of the adhesives 2 and 6 can be variously changed. Therefore, depending on how to select the shape and dimensions of the adhesive, the non-adhesive portion may be formed at one place or three places.
- FIG. 4 shows an upper fuse support divided body 4 obtained by bonding the upper ceramic substrate 1 and the upper fuse wire support divided body 3 with an adhesive 2, a lower ceramic substrate 5 and a lower fuse wire support divided body 7.
- the lower fuse support divided body 8 obtained by adhering with the adhesive 6 is vertically opposed to each other, and the fuse wire 9 and a pair of U-shaped adhesives 20 are arranged between the fuse support divided bodies 4 and 8. It is a perspective view showing the state which carried out.
- the adhesive 20 is the same as the adhesives 2 and 6 described above. From the state of FIG. 4, a pair of adhesives 20 are placed on both ends of the upper surface of the lower fuse wire support divided body 7 of the lower fuse support divided body 8 and the fuse wire holding groove 17 so that the U-shaped openings face each other.
- the fuse wire 9 is placed between the fuse wire holding grooves 17 with both ends thereof extending outward from the fuse wire holding grooves 17 before the adhesive 20 is cured. This state is shown in FIG. Further, before the adhesive 2 is cured, the upper fuse support divided body 4 having the same shape is overlapped and bonded from above the lower fuse support divided body 8 on which the fuse wires 9 are arranged, so that the fuse body according to the present embodiment is bonded. Intermediate part 21 is formed. At this time, similarly to the above, the non-bonding portion 27 is formed on the bonding surface between the upper fuse wire support divided body 3 of the upper fuse support divided body 4 and the fuse wire support divided body 7 of the lower fuse support divided body 8. It is formed.
- the fuse wire support on which the fuse wire 9 is mounted is formed by bonding the upper fuse wire support divided body 3 and the lower fuse wire support divided body 7 in this manner.
- the non-bonding portions 26, 28, 27 are formed on both sides in the longitudinal direction of the through hole 26 on the bonding surfaces between the members 1 and 3, the members 7 and 5, and the members 3 and 7.
- Each set of members is adhered together as a whole, and is brought into close contact as a whole, and the through holes 16 of the fuse wire support divided bodies 3 and 7 form an internal space, and are kept sealed in a normal state, that is, before shutting off.
- FIG. 8 is a perspective view showing a state before the metal cap 23 is fitted to both ends of the fuse body 22 of FIG.
- a metal cap 23 having a structure shown in FIG. 9, for example, a copper-zinc alloy plated with tin-copper is connected to the fuse wire 9 by solder cream 24 at both ends of the fuse body 22. Fitted. Thereby, the chip fuse 25 as shown in FIG. 10 is completed.
- FIG. 11 is a longitudinal sectional view of the chip fuse 25 according to the present embodiment
- FIG. 12 is an exploded cross-sectional view similar to FIG.
- the chip fuse 25 according to the present embodiment has a four-layer structure.
- the non-adhesive portions 26, 27, and 28 are partially formed on the adhesive surfaces between the four layers, so that three layers of non-adhesive portions are formed on both side surfaces in the longitudinal direction of the fuse body 22.
- an impact (pressure) or vapor generated when an overcurrent flows through the chip fuse 25 and the fuse wire 9 is blown is only buffered by the capacity of the through hole 16.
- the current can be safely interrupted. That is, in the present embodiment, the chip fuse body is not damaged or deformed as seen in the conventional chip fuse. Further, the vapor generated at the time of fusing is released to the outside of the chip fuse 25, so that the insulation resistance between the fuse terminals after fusing or the fusing end of the fuse wire becomes extremely high.
- steam through the non-bonding parts 26, 27, and 28 can be adjusted by changing the shape and dimension of the adhesive agents 2, 6, and 20 variously.
- a fuse support divided body formed by bonding a ceramic substrate and a fuse wire support is arranged in a pair, and a fuse wire is sandwiched between the pair of fuse support divided bodies to be combined.
- the fuse body is then covered with a metal cap on both ends of the fuse body, and the current interruption characteristics of the fuse and the insulation resistance between the fuse terminals after the interruption or between the fused ends of the fuse wires can be improved.
- the upper ceramic substrate 1 and the upper fuse wire support divided body 3 are bonded to form the upper fuse support divided body 4, and the lower ceramic substrate 5 and the lower fuse wire support divided body 7 are bonded to each other.
- the fuse wire 9 is sandwiched between the fuse support divided bodies 4 and 8 after the lower fuse support divided body 8, the fuse is interposed between the upper fuse wire support divided body 3 and the lower fuse wire supported divided body 7.
- the upper fuse wire support divided body 3 and the lower fuse wire support divided body 7 may be bonded to the upper ceramic substrate 1 and the lower ceramic substrate 5, respectively.
- FIG. 13 is an exploded perspective view showing the fuse body of the chip fuse according to the second embodiment of the present invention.
- the fuse body includes an upper ceramic substrate 31 disposed at the uppermost portion, a lower ceramic substrate 32 disposed at the lowermost portion, and a fuse wire support bonded to the upper surface of the lower ceramic substrate 32 with an adhesive 33. 35 and a three-layer structure.
- a fuse wire 36 is sandwiched between the fuse wire support 35 and the upper ceramic substrate 31.
- the upper ceramic substrate 31 and the lower ceramic substrate 32 have a thin flat plate structure, and these ceramic substrates 31 and 32 are variously formed on ceramic sheets having a larger area as shown in FIG. About the point cut out after giving a process, it is the same as that of 1st embodiment.
- the production of the fuse wire support 35 is the same as in the first embodiment, and a through hole 37 is formed.
- the fuse wire holding grooves are formed on the upper and lower surfaces of the fuse wire support 35, and the fuse wire holding grooves 35 are formed on the lower surface of the fuse wire holding groove 38. What is provided is a fuse wire holding groove 39.
- the configuration, material, characteristics, etc. of the fuse wire 36 and the material, etc. of the adhesives 33, 40 are the same as in the first embodiment.
- the adhesives 33 and 40 are formed in a predetermined shape.
- the non-adhesive portions 44 are partially formed on the bonding surfaces of the upper ceramic substrate 31, the fuse wire support 35, and the lower ceramic substrate 32.
- the point where 45 is formed is also the same as in the first embodiment.
- the non-bonding portions 44 and 45 are formed on both sides in the longitudinal direction of the through hole 37 on the bonding surfaces between the member 31 and the member 35 and between the member 35 and the member 32, respectively.
- the through-hole 37 forms an internal space, and is normally the same as the first embodiment in that it is kept sealed before being shut off.
- FIG. 14 is a perspective view showing a state in which the fuse wire 36 is arranged on the fuse wire support 35 from the state of FIG.
- the fuse wire 36 is inserted into the through hole 37 of the fuse wire support 35, and one fuse wire end 36 a is in a fuse wire holding groove 38 formed at one longitudinal end of the upper surface of the fuse wire support 35.
- the other fuse wire end portion 36 b is disposed in a fuse wire holding groove 39 formed at the other end portion in the longitudinal direction of the lower surface of the fuse wire support 35.
- FIG. 15 is a perspective view showing a state in which the fuse wire support 35 on which the fuse wires 36 are arranged as shown in FIG. 14 is adhered to the upper surface of the lower ceramic substrate 32 by the adhesive 33.
- the end 36 b of the fuse wire 36 is fixed to the lower surface side of the fuse wire support 35.
- FIG. 16 is a perspective view showing a state in which the adhesive 40 is disposed on the upper surface of the fuse wire support 35 and the upper ceramic substrate 31 is laminated and bonded before curing, and this is an intermediate part of the fuse body according to the present embodiment. 41.
- the end portions 36a and 36b of the fuse wire 36 still project from both end surfaces.
- the protruding portion is cut and removed to obtain the fuse body 42 shown in FIG.
- FIG. 18 is a perspective view showing a state before the metal cap 23 is fitted to both ends of the fuse body 42 of FIG.
- a metal cap 23 made of, for example, tin-silver-copper alloy having the structure shown in FIG. 9 and a conductive state.
- the chip fuse 43 as shown in FIG. 19 is completed.
- FIG. 20 is a longitudinal sectional view of the chip fuse 43 according to the present embodiment
- FIG. 21 is an exploded sectional view of the chip fuse 43 similar to FIG.
- the chip fuse 43 according to the present embodiment has a three-layer structure.
- the non-adhesive portions 26 are partially formed on the adhesive surfaces between the three layers, so that two layers of the non-adhesive portions 26 are formed on both side surfaces of the fuse body 42 in the longitudinal direction.
- an impact (pressure) or steam generated when an overcurrent flows through the chip fuse 43 and the fuse wire 36 is blown is only buffered by the capacity of the through hole 37.
- the current can be safely interrupted. That is, in the present embodiment, the chip fuse body is not damaged or deformed as seen in the conventional chip fuse. Further, the vapor generated at the time of fusing is released to the outside of the chip fuse 43, so that the insulation resistance between the fuse terminals after the interruption or the fusing end of the fuse wire becomes extremely high.
- steam through the non-bonding parts 44 and 45 can be adjusted by changing the shape and dimension of the adhesive agents 33 and 40 variously.
- the space between the upper ceramic substrate and the fuse wire support and the space between the lower ceramic substrate and the fuse wire support are respectively The opposing surfaces are bonded to each other to seal the through hole, a non-bonded portion is formed on a part of the bonded surface, and the internal through hole is kept sealed in a normal state.
- the shock and vapor generated at the time of interruption are released between the upper ceramic substrate and the fuse wire support and between the lower ceramic substrate and the fuse wire support.
- An exhaust hole may be formed.
- Example A chip fuse having a four-layer structure according to the first embodiment of the present invention was produced.
- Upper and lower ceramic substrates and upper and lower fuse wire support divisions were made from ceramic sheets and silver plated on annealed copper wire, epoxy adhesive, and tin on copper-zinc alloy -Using a metal cap plated with copper and solder cream, a chip fuse No. having a resistance value of 0.011 ⁇ . 1-No. 10 was obtained.
- the obtained chip fuses were blown by energizing 100V AC (phase angle 60 °), 100A, and conducting a current interruption experiment. Table 1 shows measured resistance values and cutoff times.
- Comparative Example A chip fuse according to the prior art disclosed in Japanese Patent Application Laid-Open No. 2012-174443 was produced.
- a fuse wire support body having a central through hole and a fuse wire holding groove is prepared, and the same epoxy adhesive as that of the embodiment is applied to the fuse wire holding groove of the support body and straddling the through hole.
- the same fuse wire as in the example was installed in a straight line at both ends of the fuse wire facing each other to obtain a fuse assembly.
- This fuse assembly was inserted into a square cylindrical alumina ceramic case, and metal caps were fixed to both ends of the case with solder cream in the same manner as in the above embodiment. 1-No. 5 was obtained.
- the electric current interruption experiment was conducted similarly to the Example, and the residual resistance value after interruption
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Abstract
Description
本発明の第一実施形態による四層構造のチップヒューズを作製した。上側及び下側セラミック基板、並びに上側及び下側ヒューズワイヤ支持分割体を、セラミック製シートから作製し、軟銅線に銀めっきをして作成したヒューズワイヤ、エポキシ接着剤、及び銅-亜鉛合金に錫-銅めっきを施したメタルキャップ、及びハンダクリームを用い、抵抗値0.011ΩのチップヒューズNo.1~No.10を得た。得られた各チップヒューズに交流100V(位相角60°)、100Aを通電して溶断させ、電流遮断実験を行った。抵抗の実測値及び遮断時間を表1に示す。次いで、溶断したチップヒューズに500Vで1分間通電し、ヒューズ端子間の残留抵抗値をデジタルマルチメータ(菊水電子工業社製)で測定した。結果を表1に示す。なお表1において、残留抵抗値の欄の「O.L.」(Over Load)とは、残留抵抗値がマルチメータの測定可能範囲(1200MΩ)を越えたことを示す。
特開2012‐174443号公報に開示される従来技術によるチップヒューズを作製した。上記実施例と同様に、中央貫通穴及びヒューズワイヤ保持溝を設けたヒューズワイヤ支持体を作製し、支持体のヒューズワイヤ保持溝に実施例と同じエポキシ接着剤を塗布し、貫通穴を跨いでヒューズワイヤの対向する両端に実施例と同じヒューズワイヤを直線状に架設してヒューズ結合体を得た。このヒューズ結合体を角筒状のアルミナセラミックス製ケース内に挿嵌し、その両端に上記実施例と同様にメタルキャップをハンダクリームによって固定して、抵抗値0.011ΩのチップヒューズNo.1~No.5を得た。得られた各チップヒューズについて、実施例と同様に電流遮断実験を行い、遮断後の残留抵抗値を測定した。結果を表2に示す。
2、6、20、33、40 接着剤
3 上側ヒューズワイヤ支持分割体
4 上側ヒューズ支持分割体
5、32 下側セラミック基板
7 下側ヒューズワイヤ支持分割体
8 下側ヒューズ支持分割体
9、36 ヒューズワイヤ
16、37 貫通穴
17、38,39 ヒューズワイヤ保持溝
22、42 ヒューズ本体
23 メタルキャップ
25、43 チップヒューズ
26,27,28、44,45 非接着部
35 ヒューズワイヤ支持体
Claims (12)
- 上下に対向配置された一対の上側及び下側セラミック基板と、
前記上側及び下側セラミックス基板の間に挟持され、中央に上下方向貫通穴を有するヒューズワイヤ支持体と、
前記ヒューズワイヤ支持体の両端間に貫通穴をわたって載架したヒューズワイヤと
を有するヒューズ本体と、
前記ヒューズワイヤ支持体の両端から突出した前記ヒューズワイヤと導通状態で前記ヒューズ本体の両端に嵌合した一対のメタルキャップと、
を備え、
前記上側セラミック基板とヒューズワイヤ支持体、および前記下側セラミック基板とヒューズワイヤ支持体とは、それぞれ対向する面同士が接着されて前記貫通穴を密閉すると共に、接着面の一部に非接着部が形成されていることを特徴とするチップヒューズ。 - 前記非接着部が、貫通穴の長手方向両側に形成されていることを特徴とする請求項1記載のチップヒューズ。
- 前記ヒューズワイヤ支持体は、上下方向に積層された上側ヒューズワイヤ支持分割体と下側ヒューズワイヤ支持分割体とからなり、前記貫通穴は、上側ヒューズワイヤ指示分割体と下側ヒューズワイヤ支持分割体とを上下方向に貫通し、前記ヒューズワイヤは、前記ヒューズワイヤ支持体の長手方向に貫通穴をわたって載架されていることを特徴とする請求項1記載のチップヒューズ。
- 前記非接着部は、上側セラミック基板と上側ヒューズワイヤ支持分割体との間、上側ヒューズワイヤ支持分割体と下側ヒューズワイヤ支持分割体との間、および下側ヒューズワイヤ支持分割体と下側セラミック基板との間にそれぞれ形成されていることを特徴とする請求項3記載のチップヒューズ。
- 前記ヒューズワイヤ支持体は単体構造を有し、前記ヒューズワイヤは、前記ヒューズワイヤ支持体の貫通穴をわたって、前記ヒューズワイヤ支持体の両端のうち上面の一端と、下面の他端との間に傾斜状態に載架されていることを特徴とする請求項1記載のチップヒューズ。
- 中央に上下方向貫通穴を有するヒューズワイヤ支持体の両端間に前記貫通穴をわたってヒューズワイヤを載架し、
ヒューズワイヤを載架した前記ヒューズワイヤ支持体を、上下に対向する一対のセラミック基板間に挟持し、
前記一対のセラミック基板とヒューズワイヤ支持体とを対向する面同士で接着すると共に、接着面の一部に非接着部を形成して、ヒューズ本体を形成し、
該ヒューズ本体の両端にメタルキャップを、前記ヒューズワイヤと導通状態で嵌合することを特徴とする請求項1記載のチップヒューズの製造方法。 - 前記非接着部を、貫通穴の長手方向両側に形成することを特徴とする請求項6記載の製造方法。
- 前記ヒューズワイヤ支持体を、上下方向に積層される上側ヒューズワイヤ支持分割体と下側ヒューズワイヤ支持分割体とで構成し、前記貫通穴は、上側ヒューズワイヤ支持分割体と下側ヒューズワイヤ支持分割体とを上下方向に貫通し、
前記上側ヒューズワイヤ支持分割体と下側ヒューズワイヤ支持分割体との間で、前記ヒューズワイヤを前記ヒューズワイヤ支持体の長手方向に貫通穴をわたって載架することを特徴とする請求項6記載の製造方法。 - 前記非接着部を、上側セラミック基板と上側ヒューズワイヤ支持分割体との間、上側ヒューズワイヤ支持分割体と下側ヒューズワイヤ支持分割体との間、および下側ヒューズワイヤ支持分割体と下側セラミック基板との間にそれぞれ形成することを特徴とする請求項8記載の製造方法。
- 前記ヒューズワイヤ支持体が単体構造を有し、
前記ヒューズワイヤを、前記ヒューズワイヤ支持体の貫通穴をわたって、前記ヒューズワイヤ支持体の対向する両端のうち上面の一端と、下面の他端との間に斜めに載架することを特徴とする請求項6記載の製造方法。 - 中央に上下方向貫通穴を有する上側ヒューズワイヤ支持分割体と上側セラミック基板、及び中央に上下方向貫通穴を有する下側ヒューズワイヤ支持分割体と下側セラミック基板とをそれぞれ対向する面同士で接着すると共に、接着面の一部に非接着部を形成し、
下側ヒューズワイヤ支持分割体の両端間に前記貫通穴をわたってヒューズワイヤを載架し、
ヒューズワイヤを載架した下側ヒューズワイヤ支持分割体と上側ヒューズワイヤ支持分割体とを上下に対向配置して、対向する面同士で接着すると共に、接着面の一部に非接着部を形成して、ヒューズ本体を形成し、
該ヒューズ本体の両端にメタルキャップを、前記ヒューズワイヤと導通状態で嵌合することを特徴とする、請求項3記載のチップヒューズの製造方法。 - 前記各非接着部を、貫通穴の長手方向両側に形成することを特徴とする請求項11記載の製造方法。
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US10553385B2 (en) | 2020-02-04 |
JPWO2015174270A1 (ja) | 2017-04-20 |
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