WO2015174262A1 - Borne de connecteur - Google Patents

Borne de connecteur Download PDF

Info

Publication number
WO2015174262A1
WO2015174262A1 PCT/JP2015/062671 JP2015062671W WO2015174262A1 WO 2015174262 A1 WO2015174262 A1 WO 2015174262A1 JP 2015062671 W JP2015062671 W JP 2015062671W WO 2015174262 A1 WO2015174262 A1 WO 2015174262A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
connector terminal
alloy layer
electrical contact
base material
Prior art date
Application number
PCT/JP2015/062671
Other languages
English (en)
Japanese (ja)
Inventor
暁博 加藤
喜文 坂
須永　隆弘
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社オートネットワーク技術研究所, 住友電装株式会社, 住友電気工業株式会社 filed Critical 株式会社オートネットワーク技術研究所
Publication of WO2015174262A1 publication Critical patent/WO2015174262A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Definitions

  • the present invention relates to a connector terminal.
  • Patent Document 1 as a connector terminal having high heat resistance and a low coefficient of friction, a base material made of Cu or a Cu alloy for forming a terminal, an Ag—Sn alloy layer covering the surface of the base material, and A connector terminal having an Ag-Sn alloy layer and an Ag layer exposed on the outermost surface of the terminal is disclosed.
  • the connector terminal has a problem that the amount of expensive Ag used is increased.
  • bonding the conductor of an electric wire when the Ag layer is exposed to all the outermost surfaces of a terminal, the following problem will arise. That is, Ag is a metal that easily adheres. Therefore, during the crimping of the crimping part, strong adhesion tends to occur between the Ag layer of the crimping part and the crimping jig. As a result, the caulking shape of the crimping portion is deteriorated, and this may cause a decrease in connection reliability of the crimping portion.
  • the present invention has been made in view of the above background, and it is desirable to provide a connector terminal that can reduce the amount of Ag used and can improve the connection reliability in the crimping portion as compared with the conventional case. It is what.
  • One aspect of the present invention includes a contact portion having an electrical contact for making electrical contact with a mating connector terminal, and a crimp portion for crimping a conductor of an electric wire, and Cu or a Cu alloy is used as a base.
  • a connector terminal made of a material,
  • the electrical contact has, on the base material, an Ag—Sn alloy layer, and an Ag layer disposed on the surface of the Ag—Sn alloy layer and exposed on the outermost surface of the electrical contact.
  • the crimp part has a Sn layer or an Sn alloy layer exposed on the outermost surface of the crimp part on the base material.
  • the electrical contact to be brought into electrical contact with the mating connector terminal is disposed on the base material on the surface of the Ag—Sn alloy layer and the Ag—Sn alloy layer, and on the outermost surface of the electrical contact. And an exposed Ag layer. Therefore, the contact resistance of the connector terminal with the counterpart connector terminal can be lowered by the Ag layer exposed on the outermost surface of the electrical contact.
  • the connector terminal since the connector terminal has an Ag—Sn alloy layer, the thermal stability is increased, and the heat resistance of the electrical contact can be increased.
  • the connector terminal has an Ag—Sn alloy layer having a hardness higher than that of the Ag layer below the Ag layer, the friction coefficient on the surface of the Ag layer is reduced, and the wear resistance of the electrical contact is reduced. Can be improved.
  • the crimp portion has an Sn layer or an Sn alloy layer exposed on the outermost surface of the crimp portion on the base material. That is, since the connector terminal does not have an Ag layer in the crimping portion, the area of use of Ag is reduced compared to the conventional case. Therefore, the connector terminal can reduce the amount of Ag used compared to the conventional case, and can contribute to a reduction in manufacturing cost. Furthermore, Sn or Sn alloy exposed on the outermost surface of the crimping part is a metal that is less likely to adhere than Ag.
  • the connector terminal is less likely to cause adhesion between the Sn layer or Sn alloy layer of the crimping part and the crimping jig during crimping, and the crimping part is connected due to the deterioration of the crimping shape of the crimping part. There is no risk of lowering reliability. As a result, the connector terminal can improve the connection reliability of the crimping portion.
  • FIG. 3 is an explanatory diagram schematically illustrating a configuration of a connector terminal according to the first embodiment.
  • FIG. 6 is an explanatory diagram for explaining an example of a method for manufacturing the configuration of the connector terminal according to the first embodiment. It is explanatory drawing which showed typically the structure of the terminal for connectors of Example 2. FIG. It is explanatory drawing which showed typically the structure of the terminal for connectors of Example 3. FIG.
  • the connector terminal has a contact portion having an electrical contact for making electrical contact with the mating connector terminal, and a crimping portion for crimping the conductor of the electric wire.
  • the contact portion and the crimping portion can be a connecting portion that couples the contact portion and the crimping portion.
  • the shape of the connector terminal may be, for example, the shape of a known female terminal, male terminal, or relay terminal.
  • the connector terminal includes, for example, a cylindrical contact portion provided with an elastic contact piece for elastic contact with a tab portion of a male terminal, and a pair of crimps for crimping a conductor of an electric wire. It can comprise as a female terminal etc. which have the crimping
  • the electrical contact can be configured to be included in a protrusion formed on the elastic contact piece.
  • the connector terminal includes, for example, a contact portion including a tab portion having a flat shape, a pin shape, or the like that elastically contacts the elastic contact piece of the female terminal, and a pair of crimps for crimping the conductor of the electric wire. It can comprise as a male-type terminal etc. which have the crimping
  • the connector terminal is made of Cu or Cu alloy as a base material. That is, the connector terminal is entirely formed based on Cu or Cu alloy.
  • the electrical contact has at least an Ag—Sn alloy layer and an Ag layer disposed on the surface of the Ag—Sn alloy layer and exposed on the outermost surface of the electrical contact on the base material.
  • the surface of the Ag layer is the outermost surface of the electrical contact, and the Ag—Sn alloy layer is disposed so as to be in contact with the lower surface of the Ag layer.
  • the electrical contact may have other layers such as a Ni layer, a Ni alloy layer, and an Ag layer between the Ag—Sn alloy layer and the base material.
  • the lower surface of the Ag—Sn alloy layer and the surface of the base material may be in contact with each other without having another layer between the Ag—Sn alloy layer and the base material.
  • the thickness of the Ag layer can be set to about 0.5 ⁇ m to 3 ⁇ m from the viewpoints of ensuring good electrical conductivity and reducing manufacturing costs by reducing the amount of Ag used.
  • the thickness of the Ag—Sn alloy layer can be about 1 ⁇ m to 9 ⁇ m from the viewpoint of ensuring good heat resistance and ensuring the effect of reducing the friction coefficient of the Ag layer surface.
  • the crimp part has at least an Sn layer or an Sn alloy layer exposed on the outermost surface of the crimp part on the base material.
  • the Sn layer or the Sn alloy layer may be present at least on the jig contact surface that contacts the crimping jig when the crimping portion is crimped.
  • the Sn layer or the Sn alloy layer is preferably also present on the conductor contact surface in contact with the conductor from the viewpoint of obtaining a good electrical connection with the conductor.
  • the pressure-bonding part can have other layers such as a Ni layer and a Ni alloy layer, for example, between the Sn layer or the Sn alloy layer and the base material.
  • the lower surface of the Sn layer or the Sn alloy layer may be in contact with the surface of the base material without having another layer between the Sn layer or the Sn alloy layer and the base material.
  • the thickness of the Sn layer or Sn alloy layer can be set to about 0.1 ⁇ m to 10 ⁇ m from the viewpoint of improving the connection reliability at the crimping portion and ensuring the corrosion resistance.
  • the connector terminal further has a Ni layer or a Ni alloy layer between the Ag—Sn alloy layer and the base material, and between the Sn layer or the Sn alloy layer and the base material.
  • the base material component Cu diffuses to the outermost surface of the terminal and oxidizes. It becomes easy to suppress that a contact resistance increases by forming a thing.
  • the thickness of the Ni layer or Ni alloy layer can be about 0.5 ⁇ m to 2 ⁇ m from the viewpoint of effectively suppressing the diffusion of Cu.
  • the Ag—Sn alloy layer and the Ag layer in the electrical contact can be extended to at least the peripheral portion of the electrical contact in the contact portion.
  • the peripheral part of an electrical contact means the surface part around an electrical contact among the parts except the electrical contact in a contact part.
  • the electrical contact and the peripheral portion of the electrical contact have an Ag—Sn alloy layer and an Ag layer disposed on the surface of the Ag—Sn alloy layer on the base material. Therefore, it is possible to more reliably reduce the contact resistance with the mating connector terminal, improve the heat resistance of the electrical contact, and improve the wear resistance of the electrical contact.
  • the contact portion includes an Ag—Sn alloy layer and an Ag layer disposed on the surface of the Ag—Sn alloy layer and exposed on the outermost surface of the contact portion on the base material. be able to.
  • the Ag—Sn alloy layer is disposed so that the surface of the Ag layer is the outermost surface and the lower surface of the Ag layer is in contact with most of the electrical contact except for the electrical contact at the contact portion. .
  • Such a structure can be formed relatively easily using an electroplating method. Therefore, in this case, a connector terminal excellent in manufacturability is obtained.
  • the outermost surface of the terminal portion excluding the jig contact surface and the electrical contact that comes into contact with the crimping jig when the crimping part is crimped has a base material, an Sn layer, an Sn alloy layer, an Ag layer, and an Ag layer. -At least one selected from the group consisting of a Sn alloy layer, a Ni layer, and a Ni alloy layer may be exposed.
  • a cut surface generated at the time of manufacturing the connector terminal can be exemplified as a typical example.
  • the structure in which the Ag—Sn alloy layer and the Ag layer are sequentially laminated on the base material is, for example, a laminated structure in which Ag plating, Sn plating, and Ag plating are laminated in this order on the base material. After the multilayer plating layer containing is formed, it can be formed by heat treatment.
  • the structure in which the Sn layer or the Sn alloy layer is laminated on the base material is, for example, by using an electroplating method, applying Sn plating or Sn alloy plating on the base material, and performing heat treatment as necessary. Can be formed.
  • an electroplating method may be applied as described above.
  • Example 1 The connector terminal of Example 1 will be described with reference to FIGS. 1 and 2.
  • the connector terminal 1 of this example includes a contact portion 11 having an electrical contact 110 for making electrical contact with a mating connector terminal (not shown), and an electric wire (not shown).
  • a crimping portion 13 for crimping the conductor, and Cu or a Cu alloy is used as the base material 10.
  • a connecting portion 12 that couples the contact portion 11 and the crimping portion 13.
  • the connector terminal 1 is specifically a female terminal.
  • the connector terminal 1 is used for a connector (not shown) of an automobile wire harness.
  • the connector terminal 1 more specifically has a cylindrical portion having an insertion opening for inserting a tab portion of a male terminal as a counterpart connector terminal to be electrically connected. is doing.
  • An elastic contact piece formed by folding the bottom plate inward and rearward is provided inside the tubular portion. The elastic contact piece applies an upward force to the tab portion of the inserted male terminal.
  • the tab portion of the male terminal is pressed against the inner surface of the tubular ceiling plate by the elastic contact piece. Thereby, the tab part of a male terminal is hold
  • An embossed portion is formed at a portion of the elastic contact piece that contacts the male terminal.
  • the embossed portion is a protrusion formed by raising the surface of the elastic contact piece in a hemispherical shape.
  • the embossed portion comes into contact with the tab portion of the male terminal in the vicinity of the top portion.
  • a portion of the embossed portion that substantially contacts the male terminal corresponds to the electrical contact.
  • compression-bonding part 13 consists of a pair of crimping piece more specifically.
  • the electrical contact 110 is disposed on the base material 10 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111 and exposed to the outermost surface of the electrical contact 110. And have.
  • the Ag—Sn alloy layer 111 and the Ag layer 112 are extended to at least the peripheral portion of the electrical contact 110 in the contact portion 11.
  • the connector terminal 1 of this example is disposed on the base material 10 in the contact portion 11 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111 and the contact portion 11.
  • the structure has an Ag layer 112 exposed on the outermost surface. That is, in the connector terminal 1 of this example, not only the electrical contact 110 in the contact portion 11 but also most of the contact portion 11 excluding the electrical contact 110 has the surface of the Ag layer 112 as the outermost surface.
  • An Ag—Sn alloy layer 111 is disposed in contact with the lower surface.
  • the electrical contact 110 and each Ag layer 112 in the part except the electrical contact 110 are continuous with each other.
  • the electrical contact 110 and each Ag—Sn alloy layer 111 in a portion excluding the electrical contact 110 are continuous with each other.
  • the crimping part 13 has an Sn layer 113 exposed on the outermost surface of the crimping part 13 on the base material 10.
  • the Sn layer 113 can be changed to a Sn alloy layer.
  • the Sn layer exists on both the jig contact surface that contacts a crimping jig (not shown) and the conductor contact surface that contacts the conductor when the crimping portion 13 is crimped. .
  • the connecting portion 12 has at least the Sn layer 113 exposed on the outermost surface of the connecting portion 12 on the base material 10.
  • the Sn layer 113 can be changed to a Sn alloy layer.
  • the Sn layer 113 of the connecting portion 12 is continuous with the Sn layer 113 of the crimping portion 13.
  • the connector terminal 1 of this example further includes a Ni layer 114 between the Ag—Sn alloy layer 111 and the base material 10 and between the Sn layer 113 and the base material 10.
  • the Ni layer 114 can be changed to a Ni alloy layer.
  • compression-bonding part 13, and the connection part 12 is mutually continuous.
  • the thickness of the Ag layer 112 is specifically 1 ⁇ m.
  • the thickness of the Ag—Sn alloy layer 111 is 4 ⁇ m.
  • the thickness of the Sn layer 113 is 1.4 ⁇ m.
  • the thickness of the Ni layer 114 is 1 ⁇ m.
  • the connector terminal 1 of this example is configured by punching a plate-shaped terminal material and then bending it, and the base material is exposed at the cut surface generated at the time of punching.
  • the connector terminal 1 of this example can be manufactured as follows, for example.
  • a plate material having a base material 10 of Cu or Cu alloy is prepared. Then, as shown in FIG. 2, for example, a 1 ⁇ m thick Ni plating 21 is formed on the surface of the plate material by electroplating. Next, in the plate material whose surface is covered with the Ni plating 21, for example, an Ag plating 22 having a thickness of 1.3 ⁇ m is formed on the contact portion forming portion 110 that becomes the contact portion 11 by bending after punching the terminal shape described later. . In addition, the crimping part forming part 130 which becomes the crimping part 13 by the bending process after punching the terminal shape and the connecting part forming part 120 which becomes the coupling part 12 by the bending process after punching the terminal shape are the surfaces of the Ni plating 21.
  • a thickness of 1. is applied so as to cover the surface of the Ag plating 22 applied to the contact portion forming portion 110 and the surface of the Ni plating 21 applied to the pressure bonding portion forming portion 130 and the connecting portion forming portion 120.
  • a 4 ⁇ m thick Sn plating 23 is formed.
  • an Ag plating 24 having a thickness of 2.3 ⁇ m is formed so as to cover the surface of the Sn plating 23 in the contact portion forming unit 110 among the surface of the Sn plating 23.
  • a multilayer plating layer 25 having a multilayer structure as shown in FIG. 2 is formed on the base material 10.
  • heat treatment reflow treatment
  • the plate-like terminal material obtained as described above is punched into a terminal development shape and bent to obtain a predetermined connector terminal.
  • the Ag—Sn alloy layer 111 is formed from the Ag plating 22, the Sn plating 23, and the Ag plating 24, and the Ag layer 24 is formed on the surface of the Ag—Sn alloy layer 111.
  • an Ag layer may be formed on the lower surface of the Ag—Sn alloy layer 111 depending on conditions.
  • the Sn layer 113 is formed from the Sn plating 23 by the heat treatment.
  • an electrical contact 110 for making electrical contact with the mating connector terminal is disposed on the base material 10 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111, and the electrical contact And an Ag layer 112 exposed on the outermost surface of 110. Therefore, the contact resistance of the connector terminal 1 with the mating connector terminal can be lowered by the Ag layer 112 exposed on the outermost surface of the electrical contact 110. In addition, since the connector terminal 1 includes the Ag—Sn alloy layer 111, the thermal stability is increased and the heat resistance of the electrical contact 110 can be increased.
  • the connector terminal 1 has the Ag—Sn alloy layer 111 having a hardness higher than that of the Ag layer 112 disposed below the Ag layer 112, the friction coefficient on the surface of the Ag layer 112 decreases, and the electrical contact The wear resistance of 110 can be improved.
  • the crimping part 13 has the Sn layer 23 exposed on the outermost surface of the crimping part 13 on the base material 10. That is, since the connector terminal 1 does not have the Ag layer 110 in the crimping portion 13, the use area of Ag is reduced. Therefore, the connector terminal 1 can reduce the amount of Ag used compared to the conventional case, and can contribute to the reduction of the manufacturing cost. Furthermore, Sn exposed on the outermost surface of the crimping part 13 is a metal that is less likely to adhere than Ag.
  • the connector terminal 1 is less likely to cause adhesion between the Sn layer 113 of the crimping portion 13 and the crimping jig during crimping, and the crimping portion 13 is deteriorated due to the deterioration of the caulking shape. There is no risk of lowering reliability. As a result, the connector terminal 1 can improve the connection reliability of the crimping part 13.
  • the connector terminal 1 of this example has a Ni layer disposed on the surface of the base material 10. Therefore, when the temperature of the connector terminal 1 of this example rises due to heat generated by a large current or when it is exposed to a high temperature environment, Cu as a base material component diffuses to the outermost surface of the terminal and becomes an oxide. As a result, there is an advantage that it is easy to suppress an increase in contact resistance.
  • Example 2 The connector terminal of Example 2 will be described with reference to FIG.
  • the connector terminal 1 of this example is an example in which an Ag—Sn alloy layer 111 and an Ag layer 112 are arranged only at the portion of the electrical contact 110 in the contact portion 11, as shown in FIG.
  • the surface of the contact portion 11 other than the electrical contact 110 is covered with the Sn layer 113.
  • Other configurations are the same as those of the first embodiment.
  • the connector terminal 1 of this example compared with the connector terminal 1 of Example 1, the usage area of Ag is further reduced. Therefore, the connector terminal 1 of this example is advantageous in reducing the manufacturing cost by further reducing the amount of Ag used.
  • Other functions and effects are the same as those of the first embodiment.
  • Example 3 The connector terminal of Example 3 will be described with reference to FIG.
  • the connector terminal 1 of this example is an example in which the Ni layer 114 in the connector terminal 1 of Example 1 is omitted as shown in FIG. Further, in the connector terminal 1 of this example, the electrical contact 110 and the peripheral portion 115 of the electrical contact 110 on the surface of the contact portion 11 are formed on the base material 10 with the Ag—Sn alloy layer 111 and the Ag—Sn. And an Ag layer 112 disposed on the surface of the alloy layer 111. That is, in the connector terminal 1 of this example, the Ag—Sn alloy layer 111 and the Ag layer 112 are not formed on the portion outside the peripheral portion 115 of the electrical contact 110. The surface of the contact portion 11 other than the electrical contact 110 is covered with the Sn layer 113. Other configurations are the same as those of the first embodiment.
  • an electrical contact 110 and a peripheral portion 115 of the electrical contact 110 are formed on the base material 10 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111.
  • the use area of Ag is further reduced. Therefore, the connector terminal 1 of this example is advantageous in reducing the manufacturing cost by further reducing the amount of Ag used.
  • Other functions and effects are the same as those of the first embodiment except for the functions and effects of the Ni layer 114.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

L'invention concerne une borne de connecteur (1) comportant du Cu ou un alliage de Cu en tant que matériau de base (10) et comprenant une partie de contact (11) possédant un point de contact électrique (110) destiné à un contact électrique avec une borne de connecteur homologue, et une partie de sertissage (13) destinée à sertir un conducteur provenant d'un fil électrique. Au-dessus du matériau de base (10), le point de contact électrique (110) comprend une couche d'alliage d'Ag-Sn (111) et une couche d'Ag (112) disposée sur la surface de la couche d'alliage d'Ag-Sn (111) tout en étant exposée au niveau du point de la surface externe du contact électrique (110). Au-dessus du matériau de base (10), la partie de sertissage (13) possède une couche de Sn ou une couche d'alliage de Sn (113) exposée au niveau de la surface externe de la partie de sertissage (13).
PCT/JP2015/062671 2014-05-14 2015-04-27 Borne de connecteur WO2015174262A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014100543A JP2015219975A (ja) 2014-05-14 2014-05-14 コネクタ用端子
JP2014-100543 2014-05-14

Publications (1)

Publication Number Publication Date
WO2015174262A1 true WO2015174262A1 (fr) 2015-11-19

Family

ID=54479805

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/062671 WO2015174262A1 (fr) 2014-05-14 2015-04-27 Borne de connecteur

Country Status (2)

Country Link
JP (1) JP2015219975A (fr)
WO (1) WO2015174262A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3249753A1 (fr) * 2016-05-24 2017-11-29 Delphi Technologies, Inc. Élément de contact électrique
EP3751667A1 (fr) * 2019-06-11 2020-12-16 Yazaki Corporation Terminal électrique

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7195201B2 (ja) * 2019-03-29 2022-12-23 Ｄｏｗａメタルテック株式会社 めっき材およびその製造方法
JP7302248B2 (ja) * 2019-04-09 2023-07-04 三菱マテリアル株式会社 コネクタ用端子材及びコネクタ用端子

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121075A (ja) * 1997-10-17 1999-04-30 Harness Syst Tech Res Ltd 嵌合型接続端子
JP2014005549A (ja) * 2012-04-06 2014-01-16 Auto Network Gijutsu Kenkyusho:Kk めっき部材の製造方法及びコネクタ用めっき端子の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121075A (ja) * 1997-10-17 1999-04-30 Harness Syst Tech Res Ltd 嵌合型接続端子
JP2014005549A (ja) * 2012-04-06 2014-01-16 Auto Network Gijutsu Kenkyusho:Kk めっき部材の製造方法及びコネクタ用めっき端子の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3249753A1 (fr) * 2016-05-24 2017-11-29 Delphi Technologies, Inc. Élément de contact électrique
US9915003B2 (en) 2016-05-24 2018-03-13 Delphi Technologies, Inc. Electrical contact element
EP3751667A1 (fr) * 2019-06-11 2020-12-16 Yazaki Corporation Terminal électrique

Also Published As

Publication number Publication date
JP2015219975A (ja) 2015-12-07

Similar Documents

Publication Publication Date Title
CN102439796B (zh) 连接器端子
JP2005050736A (ja) アルミ電線への端子圧着構造及び端子付アルミ電線の製造方法
WO2014129227A1 (fr) Procédé de production d'une structure de connexion, structure de connexion, faisceau de câblage, élément de sertissage et dispositif de sertissage
JP2010010013A (ja) 圧着端子及び端子付電線並びにこれらの製造方法
WO2015174262A1 (fr) Borne de connecteur
US9831567B2 (en) Crimp terminal having a conductor crimping part with an intermediate material with recessed parts and a thin-film layer on its top
JP2009266469A (ja) 端子の圧着構造
JP2005327690A (ja) アルミ電線への端子圧着構造及び端子圧着方法並びに端子付アルミ電線の製造方法
JP2017162792A (ja) 圧着接続端子及びその製造方法
JP2010055937A (ja) 端子金具及び端子金具付き電線
WO2009116601A1 (fr) Matériau métallique pour connecteur et procédé de production de matériau métallique pour connecteur
JP3562719B2 (ja) 端子
US20170162969A1 (en) Terminal pair and connector
JP5979427B2 (ja) 導電体
JP5786590B2 (ja) 電線、端子金具付き電線、および端子金具付き電線の製造方法
WO2016132908A1 (fr) Paire de contacts électriques et paire de bornes pour connecteurs
JP2010055936A (ja) 端子金具及び端子金具付き電線
JP4268006B2 (ja) アルミ電線への端子圧着構造及び端子付アルミ電線の製造方法
JP2003151668A (ja) 端 子
JP5757226B2 (ja) 端子及び端子付き電線
JP5011173B2 (ja) 端子圧着装置、及びワイヤーハーネスの製造方法
JP2014075255A (ja) コネクタ端子及びコネクタ端子用材料
JP2005353352A (ja) 嵌合型オス端子およびそのメッキ方法
JP2014022082A (ja) コネクタ端子
WO2016147894A1 (fr) Paire de contacts électriques et paire de bornes de connexion

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15792165

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15792165

Country of ref document: EP

Kind code of ref document: A1