WO2015174262A1 - Connector terminal - Google Patents

Connector terminal Download PDF

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Publication number
WO2015174262A1
WO2015174262A1 PCT/JP2015/062671 JP2015062671W WO2015174262A1 WO 2015174262 A1 WO2015174262 A1 WO 2015174262A1 JP 2015062671 W JP2015062671 W JP 2015062671W WO 2015174262 A1 WO2015174262 A1 WO 2015174262A1
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WO
WIPO (PCT)
Prior art keywords
layer
connector terminal
alloy layer
electrical contact
base material
Prior art date
Application number
PCT/JP2015/062671
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French (fr)
Japanese (ja)
Inventor
暁博 加藤
喜文 坂
須永　隆弘
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
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Application filed by 株式会社オートネットワーク技術研究所, 住友電装株式会社, 住友電気工業株式会社 filed Critical 株式会社オートネットワーク技術研究所
Publication of WO2015174262A1 publication Critical patent/WO2015174262A1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Definitions

  • the present invention relates to a connector terminal.
  • Patent Document 1 as a connector terminal having high heat resistance and a low coefficient of friction, a base material made of Cu or a Cu alloy for forming a terminal, an Ag—Sn alloy layer covering the surface of the base material, and A connector terminal having an Ag-Sn alloy layer and an Ag layer exposed on the outermost surface of the terminal is disclosed.
  • the connector terminal has a problem that the amount of expensive Ag used is increased.
  • bonding the conductor of an electric wire when the Ag layer is exposed to all the outermost surfaces of a terminal, the following problem will arise. That is, Ag is a metal that easily adheres. Therefore, during the crimping of the crimping part, strong adhesion tends to occur between the Ag layer of the crimping part and the crimping jig. As a result, the caulking shape of the crimping portion is deteriorated, and this may cause a decrease in connection reliability of the crimping portion.
  • the present invention has been made in view of the above background, and it is desirable to provide a connector terminal that can reduce the amount of Ag used and can improve the connection reliability in the crimping portion as compared with the conventional case. It is what.
  • One aspect of the present invention includes a contact portion having an electrical contact for making electrical contact with a mating connector terminal, and a crimp portion for crimping a conductor of an electric wire, and Cu or a Cu alloy is used as a base.
  • a connector terminal made of a material,
  • the electrical contact has, on the base material, an Ag—Sn alloy layer, and an Ag layer disposed on the surface of the Ag—Sn alloy layer and exposed on the outermost surface of the electrical contact.
  • the crimp part has a Sn layer or an Sn alloy layer exposed on the outermost surface of the crimp part on the base material.
  • the electrical contact to be brought into electrical contact with the mating connector terminal is disposed on the base material on the surface of the Ag—Sn alloy layer and the Ag—Sn alloy layer, and on the outermost surface of the electrical contact. And an exposed Ag layer. Therefore, the contact resistance of the connector terminal with the counterpart connector terminal can be lowered by the Ag layer exposed on the outermost surface of the electrical contact.
  • the connector terminal since the connector terminal has an Ag—Sn alloy layer, the thermal stability is increased, and the heat resistance of the electrical contact can be increased.
  • the connector terminal has an Ag—Sn alloy layer having a hardness higher than that of the Ag layer below the Ag layer, the friction coefficient on the surface of the Ag layer is reduced, and the wear resistance of the electrical contact is reduced. Can be improved.
  • the crimp portion has an Sn layer or an Sn alloy layer exposed on the outermost surface of the crimp portion on the base material. That is, since the connector terminal does not have an Ag layer in the crimping portion, the area of use of Ag is reduced compared to the conventional case. Therefore, the connector terminal can reduce the amount of Ag used compared to the conventional case, and can contribute to a reduction in manufacturing cost. Furthermore, Sn or Sn alloy exposed on the outermost surface of the crimping part is a metal that is less likely to adhere than Ag.
  • the connector terminal is less likely to cause adhesion between the Sn layer or Sn alloy layer of the crimping part and the crimping jig during crimping, and the crimping part is connected due to the deterioration of the crimping shape of the crimping part. There is no risk of lowering reliability. As a result, the connector terminal can improve the connection reliability of the crimping portion.
  • FIG. 3 is an explanatory diagram schematically illustrating a configuration of a connector terminal according to the first embodiment.
  • FIG. 6 is an explanatory diagram for explaining an example of a method for manufacturing the configuration of the connector terminal according to the first embodiment. It is explanatory drawing which showed typically the structure of the terminal for connectors of Example 2. FIG. It is explanatory drawing which showed typically the structure of the terminal for connectors of Example 3. FIG.
  • the connector terminal has a contact portion having an electrical contact for making electrical contact with the mating connector terminal, and a crimping portion for crimping the conductor of the electric wire.
  • the contact portion and the crimping portion can be a connecting portion that couples the contact portion and the crimping portion.
  • the shape of the connector terminal may be, for example, the shape of a known female terminal, male terminal, or relay terminal.
  • the connector terminal includes, for example, a cylindrical contact portion provided with an elastic contact piece for elastic contact with a tab portion of a male terminal, and a pair of crimps for crimping a conductor of an electric wire. It can comprise as a female terminal etc. which have the crimping
  • the electrical contact can be configured to be included in a protrusion formed on the elastic contact piece.
  • the connector terminal includes, for example, a contact portion including a tab portion having a flat shape, a pin shape, or the like that elastically contacts the elastic contact piece of the female terminal, and a pair of crimps for crimping the conductor of the electric wire. It can comprise as a male-type terminal etc. which have the crimping
  • the connector terminal is made of Cu or Cu alloy as a base material. That is, the connector terminal is entirely formed based on Cu or Cu alloy.
  • the electrical contact has at least an Ag—Sn alloy layer and an Ag layer disposed on the surface of the Ag—Sn alloy layer and exposed on the outermost surface of the electrical contact on the base material.
  • the surface of the Ag layer is the outermost surface of the electrical contact, and the Ag—Sn alloy layer is disposed so as to be in contact with the lower surface of the Ag layer.
  • the electrical contact may have other layers such as a Ni layer, a Ni alloy layer, and an Ag layer between the Ag—Sn alloy layer and the base material.
  • the lower surface of the Ag—Sn alloy layer and the surface of the base material may be in contact with each other without having another layer between the Ag—Sn alloy layer and the base material.
  • the thickness of the Ag layer can be set to about 0.5 ⁇ m to 3 ⁇ m from the viewpoints of ensuring good electrical conductivity and reducing manufacturing costs by reducing the amount of Ag used.
  • the thickness of the Ag—Sn alloy layer can be about 1 ⁇ m to 9 ⁇ m from the viewpoint of ensuring good heat resistance and ensuring the effect of reducing the friction coefficient of the Ag layer surface.
  • the crimp part has at least an Sn layer or an Sn alloy layer exposed on the outermost surface of the crimp part on the base material.
  • the Sn layer or the Sn alloy layer may be present at least on the jig contact surface that contacts the crimping jig when the crimping portion is crimped.
  • the Sn layer or the Sn alloy layer is preferably also present on the conductor contact surface in contact with the conductor from the viewpoint of obtaining a good electrical connection with the conductor.
  • the pressure-bonding part can have other layers such as a Ni layer and a Ni alloy layer, for example, between the Sn layer or the Sn alloy layer and the base material.
  • the lower surface of the Sn layer or the Sn alloy layer may be in contact with the surface of the base material without having another layer between the Sn layer or the Sn alloy layer and the base material.
  • the thickness of the Sn layer or Sn alloy layer can be set to about 0.1 ⁇ m to 10 ⁇ m from the viewpoint of improving the connection reliability at the crimping portion and ensuring the corrosion resistance.
  • the connector terminal further has a Ni layer or a Ni alloy layer between the Ag—Sn alloy layer and the base material, and between the Sn layer or the Sn alloy layer and the base material.
  • the base material component Cu diffuses to the outermost surface of the terminal and oxidizes. It becomes easy to suppress that a contact resistance increases by forming a thing.
  • the thickness of the Ni layer or Ni alloy layer can be about 0.5 ⁇ m to 2 ⁇ m from the viewpoint of effectively suppressing the diffusion of Cu.
  • the Ag—Sn alloy layer and the Ag layer in the electrical contact can be extended to at least the peripheral portion of the electrical contact in the contact portion.
  • the peripheral part of an electrical contact means the surface part around an electrical contact among the parts except the electrical contact in a contact part.
  • the electrical contact and the peripheral portion of the electrical contact have an Ag—Sn alloy layer and an Ag layer disposed on the surface of the Ag—Sn alloy layer on the base material. Therefore, it is possible to more reliably reduce the contact resistance with the mating connector terminal, improve the heat resistance of the electrical contact, and improve the wear resistance of the electrical contact.
  • the contact portion includes an Ag—Sn alloy layer and an Ag layer disposed on the surface of the Ag—Sn alloy layer and exposed on the outermost surface of the contact portion on the base material. be able to.
  • the Ag—Sn alloy layer is disposed so that the surface of the Ag layer is the outermost surface and the lower surface of the Ag layer is in contact with most of the electrical contact except for the electrical contact at the contact portion. .
  • Such a structure can be formed relatively easily using an electroplating method. Therefore, in this case, a connector terminal excellent in manufacturability is obtained.
  • the outermost surface of the terminal portion excluding the jig contact surface and the electrical contact that comes into contact with the crimping jig when the crimping part is crimped has a base material, an Sn layer, an Sn alloy layer, an Ag layer, and an Ag layer. -At least one selected from the group consisting of a Sn alloy layer, a Ni layer, and a Ni alloy layer may be exposed.
  • a cut surface generated at the time of manufacturing the connector terminal can be exemplified as a typical example.
  • the structure in which the Ag—Sn alloy layer and the Ag layer are sequentially laminated on the base material is, for example, a laminated structure in which Ag plating, Sn plating, and Ag plating are laminated in this order on the base material. After the multilayer plating layer containing is formed, it can be formed by heat treatment.
  • the structure in which the Sn layer or the Sn alloy layer is laminated on the base material is, for example, by using an electroplating method, applying Sn plating or Sn alloy plating on the base material, and performing heat treatment as necessary. Can be formed.
  • an electroplating method may be applied as described above.
  • Example 1 The connector terminal of Example 1 will be described with reference to FIGS. 1 and 2.
  • the connector terminal 1 of this example includes a contact portion 11 having an electrical contact 110 for making electrical contact with a mating connector terminal (not shown), and an electric wire (not shown).
  • a crimping portion 13 for crimping the conductor, and Cu or a Cu alloy is used as the base material 10.
  • a connecting portion 12 that couples the contact portion 11 and the crimping portion 13.
  • the connector terminal 1 is specifically a female terminal.
  • the connector terminal 1 is used for a connector (not shown) of an automobile wire harness.
  • the connector terminal 1 more specifically has a cylindrical portion having an insertion opening for inserting a tab portion of a male terminal as a counterpart connector terminal to be electrically connected. is doing.
  • An elastic contact piece formed by folding the bottom plate inward and rearward is provided inside the tubular portion. The elastic contact piece applies an upward force to the tab portion of the inserted male terminal.
  • the tab portion of the male terminal is pressed against the inner surface of the tubular ceiling plate by the elastic contact piece. Thereby, the tab part of a male terminal is hold
  • An embossed portion is formed at a portion of the elastic contact piece that contacts the male terminal.
  • the embossed portion is a protrusion formed by raising the surface of the elastic contact piece in a hemispherical shape.
  • the embossed portion comes into contact with the tab portion of the male terminal in the vicinity of the top portion.
  • a portion of the embossed portion that substantially contacts the male terminal corresponds to the electrical contact.
  • compression-bonding part 13 consists of a pair of crimping piece more specifically.
  • the electrical contact 110 is disposed on the base material 10 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111 and exposed to the outermost surface of the electrical contact 110. And have.
  • the Ag—Sn alloy layer 111 and the Ag layer 112 are extended to at least the peripheral portion of the electrical contact 110 in the contact portion 11.
  • the connector terminal 1 of this example is disposed on the base material 10 in the contact portion 11 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111 and the contact portion 11.
  • the structure has an Ag layer 112 exposed on the outermost surface. That is, in the connector terminal 1 of this example, not only the electrical contact 110 in the contact portion 11 but also most of the contact portion 11 excluding the electrical contact 110 has the surface of the Ag layer 112 as the outermost surface.
  • An Ag—Sn alloy layer 111 is disposed in contact with the lower surface.
  • the electrical contact 110 and each Ag layer 112 in the part except the electrical contact 110 are continuous with each other.
  • the electrical contact 110 and each Ag—Sn alloy layer 111 in a portion excluding the electrical contact 110 are continuous with each other.
  • the crimping part 13 has an Sn layer 113 exposed on the outermost surface of the crimping part 13 on the base material 10.
  • the Sn layer 113 can be changed to a Sn alloy layer.
  • the Sn layer exists on both the jig contact surface that contacts a crimping jig (not shown) and the conductor contact surface that contacts the conductor when the crimping portion 13 is crimped. .
  • the connecting portion 12 has at least the Sn layer 113 exposed on the outermost surface of the connecting portion 12 on the base material 10.
  • the Sn layer 113 can be changed to a Sn alloy layer.
  • the Sn layer 113 of the connecting portion 12 is continuous with the Sn layer 113 of the crimping portion 13.
  • the connector terminal 1 of this example further includes a Ni layer 114 between the Ag—Sn alloy layer 111 and the base material 10 and between the Sn layer 113 and the base material 10.
  • the Ni layer 114 can be changed to a Ni alloy layer.
  • compression-bonding part 13, and the connection part 12 is mutually continuous.
  • the thickness of the Ag layer 112 is specifically 1 ⁇ m.
  • the thickness of the Ag—Sn alloy layer 111 is 4 ⁇ m.
  • the thickness of the Sn layer 113 is 1.4 ⁇ m.
  • the thickness of the Ni layer 114 is 1 ⁇ m.
  • the connector terminal 1 of this example is configured by punching a plate-shaped terminal material and then bending it, and the base material is exposed at the cut surface generated at the time of punching.
  • the connector terminal 1 of this example can be manufactured as follows, for example.
  • a plate material having a base material 10 of Cu or Cu alloy is prepared. Then, as shown in FIG. 2, for example, a 1 ⁇ m thick Ni plating 21 is formed on the surface of the plate material by electroplating. Next, in the plate material whose surface is covered with the Ni plating 21, for example, an Ag plating 22 having a thickness of 1.3 ⁇ m is formed on the contact portion forming portion 110 that becomes the contact portion 11 by bending after punching the terminal shape described later. . In addition, the crimping part forming part 130 which becomes the crimping part 13 by the bending process after punching the terminal shape and the connecting part forming part 120 which becomes the coupling part 12 by the bending process after punching the terminal shape are the surfaces of the Ni plating 21.
  • a thickness of 1. is applied so as to cover the surface of the Ag plating 22 applied to the contact portion forming portion 110 and the surface of the Ni plating 21 applied to the pressure bonding portion forming portion 130 and the connecting portion forming portion 120.
  • a 4 ⁇ m thick Sn plating 23 is formed.
  • an Ag plating 24 having a thickness of 2.3 ⁇ m is formed so as to cover the surface of the Sn plating 23 in the contact portion forming unit 110 among the surface of the Sn plating 23.
  • a multilayer plating layer 25 having a multilayer structure as shown in FIG. 2 is formed on the base material 10.
  • heat treatment reflow treatment
  • the plate-like terminal material obtained as described above is punched into a terminal development shape and bent to obtain a predetermined connector terminal.
  • the Ag—Sn alloy layer 111 is formed from the Ag plating 22, the Sn plating 23, and the Ag plating 24, and the Ag layer 24 is formed on the surface of the Ag—Sn alloy layer 111.
  • an Ag layer may be formed on the lower surface of the Ag—Sn alloy layer 111 depending on conditions.
  • the Sn layer 113 is formed from the Sn plating 23 by the heat treatment.
  • an electrical contact 110 for making electrical contact with the mating connector terminal is disposed on the base material 10 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111, and the electrical contact And an Ag layer 112 exposed on the outermost surface of 110. Therefore, the contact resistance of the connector terminal 1 with the mating connector terminal can be lowered by the Ag layer 112 exposed on the outermost surface of the electrical contact 110. In addition, since the connector terminal 1 includes the Ag—Sn alloy layer 111, the thermal stability is increased and the heat resistance of the electrical contact 110 can be increased.
  • the connector terminal 1 has the Ag—Sn alloy layer 111 having a hardness higher than that of the Ag layer 112 disposed below the Ag layer 112, the friction coefficient on the surface of the Ag layer 112 decreases, and the electrical contact The wear resistance of 110 can be improved.
  • the crimping part 13 has the Sn layer 23 exposed on the outermost surface of the crimping part 13 on the base material 10. That is, since the connector terminal 1 does not have the Ag layer 110 in the crimping portion 13, the use area of Ag is reduced. Therefore, the connector terminal 1 can reduce the amount of Ag used compared to the conventional case, and can contribute to the reduction of the manufacturing cost. Furthermore, Sn exposed on the outermost surface of the crimping part 13 is a metal that is less likely to adhere than Ag.
  • the connector terminal 1 is less likely to cause adhesion between the Sn layer 113 of the crimping portion 13 and the crimping jig during crimping, and the crimping portion 13 is deteriorated due to the deterioration of the caulking shape. There is no risk of lowering reliability. As a result, the connector terminal 1 can improve the connection reliability of the crimping part 13.
  • the connector terminal 1 of this example has a Ni layer disposed on the surface of the base material 10. Therefore, when the temperature of the connector terminal 1 of this example rises due to heat generated by a large current or when it is exposed to a high temperature environment, Cu as a base material component diffuses to the outermost surface of the terminal and becomes an oxide. As a result, there is an advantage that it is easy to suppress an increase in contact resistance.
  • Example 2 The connector terminal of Example 2 will be described with reference to FIG.
  • the connector terminal 1 of this example is an example in which an Ag—Sn alloy layer 111 and an Ag layer 112 are arranged only at the portion of the electrical contact 110 in the contact portion 11, as shown in FIG.
  • the surface of the contact portion 11 other than the electrical contact 110 is covered with the Sn layer 113.
  • Other configurations are the same as those of the first embodiment.
  • the connector terminal 1 of this example compared with the connector terminal 1 of Example 1, the usage area of Ag is further reduced. Therefore, the connector terminal 1 of this example is advantageous in reducing the manufacturing cost by further reducing the amount of Ag used.
  • Other functions and effects are the same as those of the first embodiment.
  • Example 3 The connector terminal of Example 3 will be described with reference to FIG.
  • the connector terminal 1 of this example is an example in which the Ni layer 114 in the connector terminal 1 of Example 1 is omitted as shown in FIG. Further, in the connector terminal 1 of this example, the electrical contact 110 and the peripheral portion 115 of the electrical contact 110 on the surface of the contact portion 11 are formed on the base material 10 with the Ag—Sn alloy layer 111 and the Ag—Sn. And an Ag layer 112 disposed on the surface of the alloy layer 111. That is, in the connector terminal 1 of this example, the Ag—Sn alloy layer 111 and the Ag layer 112 are not formed on the portion outside the peripheral portion 115 of the electrical contact 110. The surface of the contact portion 11 other than the electrical contact 110 is covered with the Sn layer 113. Other configurations are the same as those of the first embodiment.
  • an electrical contact 110 and a peripheral portion 115 of the electrical contact 110 are formed on the base material 10 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111.
  • the use area of Ag is further reduced. Therefore, the connector terminal 1 of this example is advantageous in reducing the manufacturing cost by further reducing the amount of Ag used.
  • Other functions and effects are the same as those of the first embodiment except for the functions and effects of the Ni layer 114.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
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  • Electroplating Methods And Accessories (AREA)
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Abstract

The connector terminal (1) has Cu or a Cu alloy as base material (10) and comprises a contact portion (11) having an electrical contact point (110) for electrically contacting a counterpart connector terminal, and a crimp portion (13) for crimping a conductor from an electrical wire. Above the base material (10), the electrical contact point (110) comprises an Ag-Sn alloy layer (111), and an Ag layer (112) disposed on the Ag-Sn alloy layer (111) surface while being exposed at the electrical contact point (110) outermost surface. Above the base material (10), the crimp portion (13) has a Sn layer or a Sn alloy layer (113) exposed at the crimp portion (13) outermost surface.

Description

コネクタ用端子Connector terminal
　本発明は、コネクタ用端子に関する。 The present invention relates to a connector terminal.
　近年、ハイブリッド自動車や電気自動車等の普及に伴い、モーター等へ電力を供給する電力供給線等に大電流用のコネクタ用端子が使用されるようになっている。この種のコネクタ用端子は、大電流が流れるため発熱量が大きい。また、上記コネクタ用端子は、電流容量に合わせて端子サイズも大きくなるため、コネクタ嵌合時における相手方コネクタ用端子との嵌合力が大きくなりやすい。そのため、上記コネクタ用端子は、高い耐熱性、摩擦係数の低減による耐摩耗性の向上などが望まれている。 In recent years, with the spread of hybrid vehicles and electric vehicles, high-current connector terminals are used for power supply lines for supplying power to motors and the like. This type of connector terminal generates a large amount of heat because a large current flows. In addition, since the connector terminal has a large terminal size according to the current capacity, the fitting force with the mating connector terminal during connector fitting tends to increase. Therefore, it is desired that the connector terminal has high heat resistance and improved wear resistance by reducing the friction coefficient.
　例えば、特許文献１には、高い耐熱性、低い摩擦係数を有するコネクタ用端子として、端子を形成するためのＣｕまたはＣｕ合金よりなる母材と、母材表面を被覆するＡｇ－Ｓｎ合金層と、Ａｇ－Ｓｎ合金層を被覆し、端子最表面に露出するＡｇ層とを有するコネクタ用端子が開示されている。 For example, in Patent Document 1, as a connector terminal having high heat resistance and a low coefficient of friction, a base material made of Cu or a Cu alloy for forming a terminal, an Ag—Sn alloy layer covering the surface of the base material, and A connector terminal having an Ag-Sn alloy layer and an Ag layer exposed on the outermost surface of the terminal is disclosed.
特開２０１４－５５４９号公報JP 2014-5549 A
　しかしながら、従来のコネクタ用端子は、端子最表面の全てにＡｇ層が露出している。そのため、上記コネクタ用端子は、高価なＡｇの使用量が多くなるという問題がある。また、電線の導体を圧着するための圧着部を有するコネクタ用端子では、端子最表面の全てにＡｇ層が露出している場合、次の問題が生じる。すなわち、Ａｇは、凝着しやすい金属である。そのため、上記圧着部の圧着時に、圧着部のＡｇ層と圧着治具との間で強い凝着が発生しやすくなる。その結果、圧着部のかしめ形状が悪化し、これに起因して圧着部の接続信頼性が低下するおそれがある。 However, the Ag layer is exposed on the entire outermost surface of the conventional connector terminal. Therefore, the connector terminal has a problem that the amount of expensive Ag used is increased. Moreover, in the connector terminal which has the crimping | compression-bonding part for crimping | bonding the conductor of an electric wire, when the Ag layer is exposed to all the outermost surfaces of a terminal, the following problem will arise. That is, Ag is a metal that easily adheres. Therefore, during the crimping of the crimping part, strong adhesion tends to occur between the Ag layer of the crimping part and the crimping jig. As a result, the caulking shape of the crimping portion is deteriorated, and this may cause a decrease in connection reliability of the crimping portion.
　本発明は、上記背景に鑑みてなされたものであり、従来に比べ、Ａｇ使用量を削減することができ、かつ、圧着部における接続信頼性を向上させることが可能なコネクタ用端子を提供しようとするものである。 The present invention has been made in view of the above background, and it is desirable to provide a connector terminal that can reduce the amount of Ag used and can improve the connection reliability in the crimping portion as compared with the conventional case. It is what.
　本発明の一態様は、相手方コネクタ用端子に電気的に接触させるための電気接点を有する接触部と、電線の導体を圧着するための圧着部とを有しており、ＣｕまたはＣｕ合金を母材とするコネクタ用端子であって、
　上記電気接点は、上記母材上に、Ａｇ－Ｓｎ合金層と、該Ａｇ－Ｓｎ合金層の表面に配置されるとともに上記電気接点の最表面に露出するＡｇ層とを有しており、
　上記圧着部は、上記母材上に、上記圧着部の最表面に露出するＳｎ層またはＳｎ合金層を有していることを特徴とするコネクタ用端子にある。 One aspect of the present invention includes a contact portion having an electrical contact for making electrical contact with a mating connector terminal, and a crimp portion for crimping a conductor of an electric wire, and Cu or a Cu alloy is used as a base. A connector terminal made of a material,
The electrical contact has, on the base material, an Ag—Sn alloy layer, and an Ag layer disposed on the surface of the Ag—Sn alloy layer and exposed on the outermost surface of the electrical contact.
The crimp part has a Sn layer or an Sn alloy layer exposed on the outermost surface of the crimp part on the base material.
　上記コネクタ用端子は、相手方コネクタ用端子に電気的に接触させる電気接点が、母材上に、Ａｇ－Ｓｎ合金層と、Ａｇ－Ｓｎ合金層の表面に配置されるとともに電気接点の最表面に露出するＡｇ層とを有している。そのため、上記コネクタ用端子は、電気接点の最表面に露出するＡｇ層により、相手方コネクタ用端子との接触抵抗を低くすることができる。また、上記コネクタ用端子は、Ａｇ－Ｓｎ合金層を有するので、熱的な安定性が高まり、電気接点の耐熱性を高くすることができる。また、上記コネクタ用端子は、Ａｇ層の下方にＡｇ層に比べて高い硬度を有するＡｇ－Ｓｎ合金層が配置されているので、Ａｇ層表面の摩擦係数が低下し、電気接点の耐摩耗性を向上させることができる。 In the connector terminal, the electrical contact to be brought into electrical contact with the mating connector terminal is disposed on the base material on the surface of the Ag—Sn alloy layer and the Ag—Sn alloy layer, and on the outermost surface of the electrical contact. And an exposed Ag layer. Therefore, the contact resistance of the connector terminal with the counterpart connector terminal can be lowered by the Ag layer exposed on the outermost surface of the electrical contact. In addition, since the connector terminal has an Ag—Sn alloy layer, the thermal stability is increased, and the heat resistance of the electrical contact can be increased. In addition, since the connector terminal has an Ag—Sn alloy layer having a hardness higher than that of the Ag layer below the Ag layer, the friction coefficient on the surface of the Ag layer is reduced, and the wear resistance of the electrical contact is reduced. Can be improved.
　ここで、上記コネクタ用端子は、圧着部が、母材上に、圧着部の最表面に露出するＳｎ層またはＳｎ合金層を有している。つまり、上記コネクタ用端子は、圧着部にＡｇ層を有していないため、従来に比べ、Ａｇの使用面積が減少している。そのため、上記コネクタ用端子は、従来に比べ、Ａｇ使用量を削減することが可能となり、製造コストの低減に寄与することができる。さらに、圧着部の最表面に露出するＳｎまたはＳｎ合金は、Ａｇに比べ、凝着し難い金属である。そのため、上記コネクタ用端子は、圧着時に、圧着部のＳｎ層またはＳｎ合金層と圧着治具との間で凝着が発生し難く、圧着部のかしめ形状の悪化に起因して圧着部の接続信頼性が低下するおそれがない。その結果、上記コネクタ用端子は、圧着部の接続信頼性を向上させることが可能となる。 Here, in the connector terminal, the crimp portion has an Sn layer or an Sn alloy layer exposed on the outermost surface of the crimp portion on the base material. That is, since the connector terminal does not have an Ag layer in the crimping portion, the area of use of Ag is reduced compared to the conventional case. Therefore, the connector terminal can reduce the amount of Ag used compared to the conventional case, and can contribute to a reduction in manufacturing cost. Furthermore, Sn or Sn alloy exposed on the outermost surface of the crimping part is a metal that is less likely to adhere than Ag. For this reason, the connector terminal is less likely to cause adhesion between the Sn layer or Sn alloy layer of the crimping part and the crimping jig during crimping, and the crimping part is connected due to the deterioration of the crimping shape of the crimping part. There is no risk of lowering reliability. As a result, the connector terminal can improve the connection reliability of the crimping portion.
実施例１のコネクタ用端子の構成を模式的に示した説明図である。FIG. 3 is an explanatory diagram schematically illustrating a configuration of a connector terminal according to the first embodiment. 実施例１のコネクタ用端子の構成を製造する方法の一例を説明するための説明図である。FIG. 6 is an explanatory diagram for explaining an example of a method for manufacturing the configuration of the connector terminal according to the first embodiment. 実施例２のコネクタ用端子の構成を模式的に示した説明図である。It is explanatory drawing which showed typically the structure of the terminal for connectors of Example 2. FIG. 実施例３のコネクタ用端子の構成を模式的に示した説明図である。It is explanatory drawing which showed typically the structure of the terminal for connectors of Example 3. FIG.
　上記コネクタ用端子は、相手方コネクタ用端子に電気的に接触させるための電気接点を有する接触部と、電線の導体を圧着するための圧着部とを有している。接触部と圧着部との間は、具体的には、接触部と圧着部とを連結する連結部とすることができる。 The connector terminal has a contact portion having an electrical contact for making electrical contact with the mating connector terminal, and a crimping portion for crimping the conductor of the electric wire. Specifically, the contact portion and the crimping portion can be a connecting portion that couples the contact portion and the crimping portion.
　上記コネクタ用端子の形状は、例えば、公知のメス型端子、オス型端子、中継端子の形状などを適用可能である。具体的には、上記コネクタ用端子は、例えば、オス型端子のタブ部に弾性接触させるための弾性接触片を内部に備える筒状の接触部と、電線の導体を圧着するための一対の圧着片を備えた圧着部とを有するメス型端子などとして構成することができる。この場合、電気接点は、弾性接触片に形成された突起部に含まれる構成とすることができる。また、上記コネクタ用端子は、例えば、メス型端子の弾性接触片と弾性接触する平板状、ピン状等の形状を呈するタブ部を備える接触部と、電線の導体を圧着するための一対の圧着片を備えた圧着部とを有するオス型端子などとして構成することができる。この場合、電気接点は、タブ部に含まれる構成とすることができる。 The shape of the connector terminal may be, for example, the shape of a known female terminal, male terminal, or relay terminal. Specifically, the connector terminal includes, for example, a cylindrical contact portion provided with an elastic contact piece for elastic contact with a tab portion of a male terminal, and a pair of crimps for crimping a conductor of an electric wire. It can comprise as a female terminal etc. which have the crimping | compression-bonding part provided with the piece. In this case, the electrical contact can be configured to be included in a protrusion formed on the elastic contact piece. The connector terminal includes, for example, a contact portion including a tab portion having a flat shape, a pin shape, or the like that elastically contacts the elastic contact piece of the female terminal, and a pair of crimps for crimping the conductor of the electric wire. It can comprise as a male-type terminal etc. which have the crimping | compression-bonding part provided with the piece. In this case, the electrical contact can be included in the tab portion.
　上記コネクタ用端子は、ＣｕまたはＣｕ合金を母材とする。つまり、上記コネクタ用端子は、ＣｕまたはＣｕ合金を基にして全体が形成されている。 The connector terminal is made of Cu or Cu alloy as a base material. That is, the connector terminal is entirely formed based on Cu or Cu alloy.
　上記コネクタ用端子において、電気接点は、母材上に、Ａｇ－Ｓｎ合金層と、Ａｇ－Ｓｎ合金層の表面に配置されるとともに電気接点の最表面に露出するＡｇ層とを少なくとも有している。つまり、電気接点は、Ａｇ層の表面が電気接点の最表面とされており、Ａｇ層の下面に接するようにＡｇ－Ｓｎ合金層が配置されている。電気接点は、Ａｇ－Ｓｎ合金層と母材との間に、例えば、Ｎｉ層、Ｎｉ合金層、Ａｇ層等の他の層を有することができる。他にも、電気接点は、Ａｇ－Ｓｎ合金層と母材との間に、他の層を有することなく、Ａｇ－Ｓｎ合金層の下面と母材表面とが接していてもよい。 In the connector terminal, the electrical contact has at least an Ag—Sn alloy layer and an Ag layer disposed on the surface of the Ag—Sn alloy layer and exposed on the outermost surface of the electrical contact on the base material. Yes. That is, in the electrical contact, the surface of the Ag layer is the outermost surface of the electrical contact, and the Ag—Sn alloy layer is disposed so as to be in contact with the lower surface of the Ag layer. The electrical contact may have other layers such as a Ni layer, a Ni alloy layer, and an Ag layer between the Ag—Sn alloy layer and the base material. In addition, the lower surface of the Ag—Sn alloy layer and the surface of the base material may be in contact with each other without having another layer between the Ag—Sn alloy layer and the base material.
　Ａｇ層の厚みは、良好な導通性の確保、Ａｇ使用量の削減による製造コストの低減などの観点から、０．５μｍ～３μｍ程度とすることができる。Ａｇ－Ｓｎ合金層の厚みは、良好な耐熱性の確保、Ａｇ層表面の摩擦係数の低減効果を確実にするなどの観点から、１μｍ～９μｍ程度とすることができる。 The thickness of the Ag layer can be set to about 0.5 μm to 3 μm from the viewpoints of ensuring good electrical conductivity and reducing manufacturing costs by reducing the amount of Ag used. The thickness of the Ag—Sn alloy layer can be about 1 μm to 9 μm from the viewpoint of ensuring good heat resistance and ensuring the effect of reducing the friction coefficient of the Ag layer surface.
　上記コネクタ用端子において、圧着部は、母材上に、圧着部の最表面に露出するＳｎ層またはＳｎ合金層を少なくとも有している。Ｓｎ層またはＳｎ合金層は、具体的には、圧着部の圧着時に圧着治具に接触する治具接触面に少なくとも存在すればよい。Ｓｎ層またはＳｎ合金層は、好ましくは、導体との良好な電気接続が得られるなどの観点から、導体と接触する導体接触面にも存在しているとよい。圧着部は、Ｓｎ層またはＳｎ合金層と母材との間に、例えば、Ｎｉ層、Ｎｉ合金層等の他の層を有することができる。他にも、圧着部は、Ｓｎ層またはＳｎ合金層と母材との間に、他の層を有することなく、Ｓｎ層またはＳｎ合金層の下面と母材表面とが接していてもよい。 In the connector terminal, the crimp part has at least an Sn layer or an Sn alloy layer exposed on the outermost surface of the crimp part on the base material. Specifically, the Sn layer or the Sn alloy layer may be present at least on the jig contact surface that contacts the crimping jig when the crimping portion is crimped. The Sn layer or the Sn alloy layer is preferably also present on the conductor contact surface in contact with the conductor from the viewpoint of obtaining a good electrical connection with the conductor. The pressure-bonding part can have other layers such as a Ni layer and a Ni alloy layer, for example, between the Sn layer or the Sn alloy layer and the base material. In addition, the lower surface of the Sn layer or the Sn alloy layer may be in contact with the surface of the base material without having another layer between the Sn layer or the Sn alloy layer and the base material.
　Ｓｎ層またはＳｎ合金層の厚みは、圧着部における接続信頼性の向上、耐腐食性の確保などの観点から、０．１μｍ～１０μｍ程度とすることができる。 The thickness of the Sn layer or Sn alloy layer can be set to about 0.1 μm to 10 μm from the viewpoint of improving the connection reliability at the crimping portion and ensuring the corrosion resistance.
　上記コネクタ用端子は、Ａｇ－Ｓｎ合金層と母材との間、Ｓｎ層またはＳｎ合金層と母材との間に、さらに、Ｎｉ層またはＮｉ合金層を有していることが好ましい。 It is preferable that the connector terminal further has a Ni layer or a Ni alloy layer between the Ag—Sn alloy layer and the base material, and between the Sn layer or the Sn alloy layer and the base material.
　この場合には、大電流による発熱によりコネクタ用端子の温度が上昇した場合や、コネクタ用端子が高温環境下に曝された場合等に、母材成分のＣｕが端子最表面に拡散して酸化物が形成されることによって接触抵抗が増大するのを抑制しやすくなる。Ｎｉ層またはＮｉ合金層の厚みは、Ｃｕの拡散を効果的に抑制するなどの観点から、０．５μｍ～２μｍ程度とすることができる。 In this case, when the temperature of the connector terminal rises due to heat generated by a large current, or when the connector terminal is exposed to a high temperature environment, the base material component Cu diffuses to the outermost surface of the terminal and oxidizes. It becomes easy to suppress that a contact resistance increases by forming a thing. The thickness of the Ni layer or Ni alloy layer can be about 0.5 μm to 2 μm from the viewpoint of effectively suppressing the diffusion of Cu.
　上記コネクタ用端子において、電気接点におけるＡｇ－Ｓｎ合金層およびＡｇ層は、接触部における電気接点の少なくとも周辺部まで延設されている構成とすることができる。なお、電気接点の周辺部とは、接触部における電気接点を除いた部分のうち、電気接点の周りの面部分をいう。 In the connector terminal, the Ag—Sn alloy layer and the Ag layer in the electrical contact can be extended to at least the peripheral portion of the electrical contact in the contact portion. In addition, the peripheral part of an electrical contact means the surface part around an electrical contact among the parts except the electrical contact in a contact part.
　この場合には、電気接点と電気接点の周辺部とが、母材上に、Ａｇ－Ｓｎ合金層と、Ａｇ－Ｓｎ合金層の表面に配置されたＡｇ層とを有する。そのため、相手方コネクタ用端子との接触抵抗の低減、電気接点の耐熱性向上、電気接点の耐摩耗性向上をより確実なものとすることができる。 In this case, the electrical contact and the peripheral portion of the electrical contact have an Ag—Sn alloy layer and an Ag layer disposed on the surface of the Ag—Sn alloy layer on the base material. Therefore, it is possible to more reliably reduce the contact resistance with the mating connector terminal, improve the heat resistance of the electrical contact, and improve the wear resistance of the electrical contact.
　上記コネクタ用端子において、接触部は、母材上に、Ａｇ－Ｓｎ合金層と、Ａｇ－Ｓｎ合金層の表面に配置されるとともに接触部の最表面に露出するＡｇ層とを有する構成とすることができる。 In the connector terminal, the contact portion includes an Ag—Sn alloy layer and an Ag layer disposed on the surface of the Ag—Sn alloy layer and exposed on the outermost surface of the contact portion on the base material. be able to.
　この場合には、接触部における電気接点だけでなく、電気接点を除いた大部分において、Ａｇ層の表面が最表面とされ、Ａｇ層の下面に接するようにＡｇ－Ｓｎ合金層が配置される。このような構成は、電気めっき法を用いて比較的簡易に形成することができる。そのため、この場合には、製造性に優れたコネクタ用端子が得られる。 In this case, the Ag—Sn alloy layer is disposed so that the surface of the Ag layer is the outermost surface and the lower surface of the Ag layer is in contact with most of the electrical contact except for the electrical contact at the contact portion. . Such a structure can be formed relatively easily using an electroplating method. Therefore, in this case, a connector terminal excellent in manufacturability is obtained.
　上記コネクタ用端子において、圧着部の圧着時に圧着治具に接触する治具接触面と電気接点とを除いた端子部分の最表面には、母材、Ｓｎ層、Ｓｎ合金層、Ａｇ層、Ａｇ－Ｓｎ合金層、Ｎｉ層、および、Ｎｉ合金層からなる群より選択される少なくとも１つが露出している構成とすることができる。 In the connector terminal, the outermost surface of the terminal portion excluding the jig contact surface and the electrical contact that comes into contact with the crimping jig when the crimping part is crimped has a base material, an Sn layer, an Sn alloy layer, an Ag layer, and an Ag layer. -At least one selected from the group consisting of a Sn alloy layer, a Ni layer, and a Ni alloy layer may be exposed.
　上記端子部分の最表面に母材が露出する場合としては、例えば、コネクタ用端子の製造時に生じた切断面等を典型例として例示することができる。 As a case where the base material is exposed on the outermost surface of the terminal portion, for example, a cut surface generated at the time of manufacturing the connector terminal can be exemplified as a typical example.
　母材上にＡｇ－Ｓｎ合金層、Ａｇ層が順に積層された構成は、例えば、電気めっき法を用い、母材上に、Ａｇめっき、Ｓｎめっき、Ａｇめっきをこの順に積層してなる積層構造を含む積層めっき層を形成した後、加熱処理することにより形成することができる。また、母材上に、Ｓｎ層またはＳｎ合金層が積層された構成は、例えば、電気めっき法を用い、母材上に、ＳｎめっきまたはＳｎ合金めっきを施し、必要に応じて、加熱処理することにより形成することができる。また、母材上に、ＮｉまたはＮｉ合金層を形成する場合も、上記と同様に、電気めっき法を適用すればよい。 The structure in which the Ag—Sn alloy layer and the Ag layer are sequentially laminated on the base material is, for example, a laminated structure in which Ag plating, Sn plating, and Ag plating are laminated in this order on the base material. After the multilayer plating layer containing is formed, it can be formed by heat treatment. The structure in which the Sn layer or the Sn alloy layer is laminated on the base material is, for example, by using an electroplating method, applying Sn plating or Sn alloy plating on the base material, and performing heat treatment as necessary. Can be formed. In addition, when a Ni or Ni alloy layer is formed on a base material, an electroplating method may be applied as described above.
　なお、上述した各構成は、上述した各作用効果等を得るなどのために必要に応じて任意に組み合わせることができる。 In addition, each structure mentioned above can be arbitrarily combined as needed, in order to obtain each effect mentioned above.
　以下、実施例のコネクタ用端子について、図面を用いて説明する。なお、同一部材については同一の符号を用いて説明する。 Hereinafter, the connector terminal of the embodiment will be described with reference to the drawings. In addition, about the same member, it demonstrates using the same code | symbol.
（実施例１）
　実施例１のコネクタ用端子について、図１、図２を用いて説明する。図１、図２に示すように、本例のコネクタ用端子１は、相手方コネクタ用端子（不図示）に電気的に接触させるための電気接点１１０を有する接触部１１と、電線（不図示）の導体を圧着するための圧着部１３とを有しており、ＣｕまたはＣｕ合金を母材１０とする。本例では、接触部１１と圧着部１３との間は、具体的には、接触部１１と圧着部１３とを連結する連結部１２とされている。 Example 1
The connector terminal of Example 1 will be described with reference to FIGS. 1 and 2. As shown in FIGS. 1 and 2, the connector terminal 1 of this example includes a contact portion 11 having an electrical contact 110 for making electrical contact with a mating connector terminal (not shown), and an electric wire (not shown). And a crimping portion 13 for crimping the conductor, and Cu or a Cu alloy is used as the base material 10. In this example, specifically, between the contact portion 11 and the crimping portion 13 is a connecting portion 12 that couples the contact portion 11 and the crimping portion 13.
　本例では、コネクタ用端子１は、具体的には、メス型端子である。コネクタ用端子１は、自動車用ワイヤーハーネスが有するコネクタ（不図示）に用いられるものである。コネクタ用端子１は、詳細は図示しないが、より具体的には、電気接続すべき相手方コネクタ用端子としてのオス型端子が有するタブ部を挿入させるための挿入口が開口した筒状部を有している。筒状部の内部には、底面板が内側後方へ折り返されて形成された弾性接触片が設けられている。弾性接触片は、挿入されたオス型端子のタブ部に上向きの力を加える。オス型端子のタブ部は、弾性接触片によって筒状部の天井板の内側面に押し付けられる。これにより、オス型端子のタブ部が弾性接触片と天井板の内側面との間に挟圧状態で保持される。弾性接触片のオス型端子に接触する部分には、エンボス部が形成されている。エンボス部は、弾性接触片の表面を半球状に隆起させることにより形成された突起部である。エンボス部は、その頂部近傍にてオス型端子のタブ部と接触する。本例では、このエンボス部のうち、オス型端子と実質的に接触する部位が電気接点に該当する。また、コネクタ用端子１において、圧着部１３は、より具体的には、一対の圧着片からなる。 In this example, the connector terminal 1 is specifically a female terminal. The connector terminal 1 is used for a connector (not shown) of an automobile wire harness. Although not shown in detail, the connector terminal 1 more specifically has a cylindrical portion having an insertion opening for inserting a tab portion of a male terminal as a counterpart connector terminal to be electrically connected. is doing. An elastic contact piece formed by folding the bottom plate inward and rearward is provided inside the tubular portion. The elastic contact piece applies an upward force to the tab portion of the inserted male terminal. The tab portion of the male terminal is pressed against the inner surface of the tubular ceiling plate by the elastic contact piece. Thereby, the tab part of a male terminal is hold | maintained in the clamping state between an elastic contact piece and the inner surface of a ceiling board. An embossed portion is formed at a portion of the elastic contact piece that contacts the male terminal. The embossed portion is a protrusion formed by raising the surface of the elastic contact piece in a hemispherical shape. The embossed portion comes into contact with the tab portion of the male terminal in the vicinity of the top portion. In this example, a portion of the embossed portion that substantially contacts the male terminal corresponds to the electrical contact. Moreover, in the connector terminal 1, the crimping | compression-bonding part 13 consists of a pair of crimping piece more specifically.
　コネクタ用端子１において、電気接点１１０は、母材１０上に、Ａｇ－Ｓｎ合金層１１１と、Ａｇ－Ｓｎ合金層１１１の表面に配置されるとともに電気接点１１０の最表面に露出するＡｇ層１１２とを有している。 In the connector terminal 1, the electrical contact 110 is disposed on the base material 10 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111 and exposed to the outermost surface of the electrical contact 110. And have.
　本例では、具体的には、Ａｇ－Ｓｎ合金層１１１およびＡｇ層１１２は、接触部１１における電気接点１１０の少なくとも周辺部まで延設されている。より具体的には、本例のコネクタ用端子１は、接触部１１における母材１０上に、Ａｇ－Ｓｎ合金層１１１と、Ａｇ－Ｓｎ合金層１１１の表面に配置されるとともに接触部１１の最表面に露出するＡｇ層１１２とを有する構成とされている。つまり、本例のコネクタ用端子１は、接触部１１における電気接点１１０だけでなく、接触部１１における電気接点１１０を除いた大部分もＡｇ層１１２の表面が最表面とされ、Ａｇ層１１２の下面に接するようにＡｇ－Ｓｎ合金層１１１が配置されている。したがって、接触部１１において、電気接点１１０と、電気接点１１０を除いた部分における各Ａｇ層１１２とは、互いに連続している。同様に、接触部１１において、電気接点１１０と、電気接点１１０を除いた部分における各Ａｇ－Ｓｎ合金層１１１とは、互いに連続している。 In this example, specifically, the Ag—Sn alloy layer 111 and the Ag layer 112 are extended to at least the peripheral portion of the electrical contact 110 in the contact portion 11. More specifically, the connector terminal 1 of this example is disposed on the base material 10 in the contact portion 11 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111 and the contact portion 11. The structure has an Ag layer 112 exposed on the outermost surface. That is, in the connector terminal 1 of this example, not only the electrical contact 110 in the contact portion 11 but also most of the contact portion 11 excluding the electrical contact 110 has the surface of the Ag layer 112 as the outermost surface. An Ag—Sn alloy layer 111 is disposed in contact with the lower surface. Therefore, in the contact part 11, the electrical contact 110 and each Ag layer 112 in the part except the electrical contact 110 are continuous with each other. Similarly, in the contact portion 11, the electrical contact 110 and each Ag—Sn alloy layer 111 in a portion excluding the electrical contact 110 are continuous with each other.
　コネクタ用端子１において、圧着部１３は、母材１０上に、圧着部１３の最表面に露出するＳｎ層１１３を有している。なお、Ｓｎ層１１３は、Ｓｎ合金層に変更することができる。本例では、具体的には、Ｓｎ層は、圧着部１３の圧着時に圧着治具（不図示）に接触する治具接触面と、導体と接触する導体接触面との両方に存在している。 In the connector terminal 1, the crimping part 13 has an Sn layer 113 exposed on the outermost surface of the crimping part 13 on the base material 10. The Sn layer 113 can be changed to a Sn alloy layer. In this example, specifically, the Sn layer exists on both the jig contact surface that contacts a crimping jig (not shown) and the conductor contact surface that contacts the conductor when the crimping portion 13 is crimped. .
　コネクタ端子１において、連結部１２は、母材１０上に、連結部１２の最表面に露出するＳｎ層１１３を少なくとも有している。なお、Ｓｎ層１１３は、Ｓｎ合金層に変更することができる。本例では、具体的には、連結部１２のＳｎ層１１３は、圧着部１３のＳｎ層１１３と連続している。 In the connector terminal 1, the connecting portion 12 has at least the Sn layer 113 exposed on the outermost surface of the connecting portion 12 on the base material 10. The Sn layer 113 can be changed to a Sn alloy layer. In this example, specifically, the Sn layer 113 of the connecting portion 12 is continuous with the Sn layer 113 of the crimping portion 13.
　本例のコネクタ端子１は、Ａｇ－Ｓｎ合金層１１１と母材１０との間、および、Ｓｎ層１１３と母材１０との間に、さらに、Ｎｉ層１１４を有している。このＮｉ層１１４は、Ｎｉ合金層に変更することができる。なお、接触部１１、圧着部１３、および、連結部１２における各Ｎｉ層１１４は、互いに連続している。 The connector terminal 1 of this example further includes a Ni layer 114 between the Ag—Sn alloy layer 111 and the base material 10 and between the Sn layer 113 and the base material 10. The Ni layer 114 can be changed to a Ni alloy layer. In addition, each Ni layer 114 in the contact part 11, the crimping | compression-bonding part 13, and the connection part 12 is mutually continuous.
　本例のコネクタ用端子１において、Ａｇ層１１２の厚みは、具体的には、１μｍである。Ａｇ－Ｓｎ合金層１１１の厚みは、具体的には、４μｍである。Ｓｎ層１１３の厚みは、具体的には、１．４μｍである。Ｎｉ層１１４の厚みは、具体的には、１μｍである。なお、本例のコネクタ用端子１は、板状の端子材料を打ち抜いた後、折り曲げ加工されて構成されたものであり、打ち抜き時に生じた切断面では母材が露出している。 In the connector terminal 1 of this example, the thickness of the Ag layer 112 is specifically 1 μm. Specifically, the thickness of the Ag—Sn alloy layer 111 is 4 μm. Specifically, the thickness of the Sn layer 113 is 1.4 μm. Specifically, the thickness of the Ni layer 114 is 1 μm. The connector terminal 1 of this example is configured by punching a plate-shaped terminal material and then bending it, and the base material is exposed at the cut surface generated at the time of punching.
　本例のコネクタ用端子１は、具体的には、例えば、以下のようにして製造することができる。 Specifically, the connector terminal 1 of this example can be manufactured as follows, for example.
　ＣｕまたはＣｕ合金を母材１０とする板材を準備する。そして、図２に示されるように、板材の表面に、電気めっき法により、例えば、厚み１μｍのＮｉめっき２１を形成する。次いで、Ｎｉめっき２１により表面が覆われた板材において、後述する端子形状の打ち抜き後の折り曲げ加工により接触部１１となる接触部形成部１１０に、例えば、厚み１．３μｍのＡｇめっき２２を形成する。なお、端子形状の打ち抜き後の折り曲げ加工により圧着部１３になる圧着部形成部１３０と、端子形状の打ち抜き後の折り曲げ加工により連結部１２になる連結部形成部１２０とは、Ｎｉめっき２１の表面にＡｇめっき２２が施されないように予めマスクしておく。次いで、接触部形成部１１０に施されたＡｇめっき２２の表面と、圧着部形成部１３０と連結部形成部１２０とに施されたＮｉめっき２１の表面とを覆うように、例えば、厚み１．４μｍのＳｎめっき２３を形成する。次いで、このＳｎめっき２３の表面のうち、接触部形成部１１０におけるＳｎめっき２３の表面を覆うように、例えば、厚み２．３μｍのＡｇめっき２４を形成する。なお、圧着部形成部１３０と連結部形成部１２０とは、Ｓｎめっき２３の表面にＡｇめっき２４が施されないように予めマスクしておく。このようにして、母材１０上に、図２に示されるような積層構造を有する積層めっき層２５を形成する。次いで、例えば、２００℃で３０分間の加熱処理（リフロー処理）を実施する。次いで、上記のようにして得られた板状の端子材料を端子展開形状に打ち抜き、折り曲げ加工することにより、所定のコネクタ用端子とする。 A plate material having a base material 10 of Cu or Cu alloy is prepared. Then, as shown in FIG. 2, for example, a 1 μm thick Ni plating 21 is formed on the surface of the plate material by electroplating. Next, in the plate material whose surface is covered with the Ni plating 21, for example, an Ag plating 22 having a thickness of 1.3 μm is formed on the contact portion forming portion 110 that becomes the contact portion 11 by bending after punching the terminal shape described later. . In addition, the crimping part forming part 130 which becomes the crimping part 13 by the bending process after punching the terminal shape and the connecting part forming part 120 which becomes the coupling part 12 by the bending process after punching the terminal shape are the surfaces of the Ni plating 21. Is previously masked so that the Ag plating 22 is not applied. Next, for example, a thickness of 1. is applied so as to cover the surface of the Ag plating 22 applied to the contact portion forming portion 110 and the surface of the Ni plating 21 applied to the pressure bonding portion forming portion 130 and the connecting portion forming portion 120. A 4 μm thick Sn plating 23 is formed. Next, for example, an Ag plating 24 having a thickness of 2.3 μm is formed so as to cover the surface of the Sn plating 23 in the contact portion forming unit 110 among the surface of the Sn plating 23. Note that the crimping part forming part 130 and the connecting part forming part 120 are previously masked so that the Ag plating 24 is not applied to the surface of the Sn plating 23. In this manner, a multilayer plating layer 25 having a multilayer structure as shown in FIG. 2 is formed on the base material 10. Next, for example, heat treatment (reflow treatment) is performed at 200 ° C. for 30 minutes. Next, the plate-like terminal material obtained as described above is punched into a terminal development shape and bent to obtain a predetermined connector terminal.
　上記加熱処理により、Ａｇめっき２２、Ｓｎめっき２３、および、Ａｇめっき２４とからＡｇ－Ｓｎ合金層１１１が形成されるとともに、Ａｇ－Ｓｎ合金層１１１の表面にＡｇ層２４が形成される。なお、条件によっては、Ａｇ－Ｓｎ合金層１１１の下面にＡｇ層が形成されることもある。また、上記加熱処理により、Ｓｎめっき２３からＳｎ層１１３が形成される。 By the above heat treatment, the Ag—Sn alloy layer 111 is formed from the Ag plating 22, the Sn plating 23, and the Ag plating 24, and the Ag layer 24 is formed on the surface of the Ag—Sn alloy layer 111. Note that an Ag layer may be formed on the lower surface of the Ag—Sn alloy layer 111 depending on conditions. Moreover, the Sn layer 113 is formed from the Sn plating 23 by the heat treatment.
　次に、本例のコネクタ用端子１の作用効果について説明する。 Next, the effect of the connector terminal 1 of this example will be described.
　コネクタ用端子１は、相手方コネクタ用端子に電気的に接触させる電気接点１１０が、母材１０上に、Ａｇ－Ｓｎ合金層１１１と、Ａｇ－Ｓｎ合金層１１１の表面に配置されるとともに電気接点１１０の最表面に露出するＡｇ層１１２とを有している。そのため、コネクタ用端子１は、電気接点１１０の最表面に露出するＡｇ層１１２により、相手方コネクタ用端子との接触抵抗を低くすることができる。また、コネクタ用端子１は、Ａｇ－Ｓｎ合金層１１１を有するので、熱的な安定性が高まり、電気接点１１０の耐熱性を高くすることができる。また、コネクタ用端子１は、Ａｇ層１１２の下方にＡｇ層１１２に比べて高い硬度を有するＡｇ－Ｓｎ合金層１１１が配置されているので、Ａｇ層１１２表面の摩擦係数が低下し、電気接点１１０の耐摩耗性を向上させることが可能となる。 In the connector terminal 1, an electrical contact 110 for making electrical contact with the mating connector terminal is disposed on the base material 10 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111, and the electrical contact And an Ag layer 112 exposed on the outermost surface of 110. Therefore, the contact resistance of the connector terminal 1 with the mating connector terminal can be lowered by the Ag layer 112 exposed on the outermost surface of the electrical contact 110. In addition, since the connector terminal 1 includes the Ag—Sn alloy layer 111, the thermal stability is increased and the heat resistance of the electrical contact 110 can be increased. Further, since the connector terminal 1 has the Ag—Sn alloy layer 111 having a hardness higher than that of the Ag layer 112 disposed below the Ag layer 112, the friction coefficient on the surface of the Ag layer 112 decreases, and the electrical contact The wear resistance of 110 can be improved.
　ここで、コネクタ用端子１は、圧着部１３が、母材１０上に、圧着部１３の最表面に露出するＳｎ層２３を有している。つまり、コネクタ用端子１は、圧着部１３にＡｇ層１１０を有していないため、Ａｇの使用面積が減少している。そのため、コネクタ用端子１は、従来に比べ、Ａｇ使用量を削減することが可能となり、製造コストの低減に寄与することができる。さらに、圧着部１３の最表面に露出するＳｎは、Ａｇに比べ、凝着し難い金属である。そのため、コネクタ用端子１は、圧着時に、圧着部１３のＳｎ層１１３と圧着治具との間で凝着が発生し難く、圧着部１３のかしめ形状の悪化に起因して圧着部１３の接続信頼性が低下するおそれがない。その結果、コネクタ用端子１は、圧着部１３の接続信頼性を向上させることができる。 Here, in the connector terminal 1, the crimping part 13 has the Sn layer 23 exposed on the outermost surface of the crimping part 13 on the base material 10. That is, since the connector terminal 1 does not have the Ag layer 110 in the crimping portion 13, the use area of Ag is reduced. Therefore, the connector terminal 1 can reduce the amount of Ag used compared to the conventional case, and can contribute to the reduction of the manufacturing cost. Furthermore, Sn exposed on the outermost surface of the crimping part 13 is a metal that is less likely to adhere than Ag. For this reason, the connector terminal 1 is less likely to cause adhesion between the Sn layer 113 of the crimping portion 13 and the crimping jig during crimping, and the crimping portion 13 is deteriorated due to the deterioration of the caulking shape. There is no risk of lowering reliability. As a result, the connector terminal 1 can improve the connection reliability of the crimping part 13.
　また、本例のコネクタ用端子１は、母材１０表面にＮｉ層が配置されている。そのため、本例のコネクタ用端子１は、大電流による発熱によりその温度が上昇した場合や、高温環境下に曝された場合等に、母材成分のＣｕが端子最表面に拡散して酸化物が形成されることにより接触抵抗が増大するのを抑制しやすい利点がある。 Also, the connector terminal 1 of this example has a Ni layer disposed on the surface of the base material 10. Therefore, when the temperature of the connector terminal 1 of this example rises due to heat generated by a large current or when it is exposed to a high temperature environment, Cu as a base material component diffuses to the outermost surface of the terminal and becomes an oxide. As a result, there is an advantage that it is easy to suppress an increase in contact resistance.
（実施例２）
　実施例２のコネクタ用端子について、図３を用いて説明する。 (Example 2)
The connector terminal of Example 2 will be described with reference to FIG.
　本例のコネクタ用端子１は、図３に示されるように、接触部１１における電気接点１１０の部分にだけ、Ａｇ－Ｓｎ合金層１１１およびＡｇ層１１２が配置されている例である。なお、接触部１１における電気接点１１０以外の表面は、Ｓｎ層１１３で覆われている。その他の構成は、実施例１と同様である。 The connector terminal 1 of this example is an example in which an Ag—Sn alloy layer 111 and an Ag layer 112 are arranged only at the portion of the electrical contact 110 in the contact portion 11, as shown in FIG. The surface of the contact portion 11 other than the electrical contact 110 is covered with the Sn layer 113. Other configurations are the same as those of the first embodiment.
　本例のコネクタ用端子１は、実施例１のコネクタ用端子１に比べ、Ａｇの使用面積がさらに減少している。そのため、本例のコネクタ用端子１は、さらなるＡｇ使用量の削減により、製造コストの低減に有利である。その他の作用効果は、実施例１と同様である。 In the connector terminal 1 of this example, compared with the connector terminal 1 of Example 1, the usage area of Ag is further reduced. Therefore, the connector terminal 1 of this example is advantageous in reducing the manufacturing cost by further reducing the amount of Ag used. Other functions and effects are the same as those of the first embodiment.
（実施例３）
　実施例３のコネクタ用端子について、図４を用いて説明する。 Example 3
The connector terminal of Example 3 will be described with reference to FIG.
　本例のコネクタ用端子１は、図４に示されるように、実施例１のコネクタ端子１におけるＮｉ層１１４が省略されている例である。また、本例のコネクタ用端子１は、接触部１１の表面のうち、電気接点１１０と電気接点１１０の周辺部１１５とが、母材１０上に、Ａｇ－Ｓｎ合金層１１１と、Ａｇ－Ｓｎ合金層１１１の表面に配置されたＡｇ層１１２とを有している。つまり、本例のコネクタ用端子１は、電気接点１１０の周辺部１１５よりも外側の部分にＡｇ－Ｓｎ合金層１１１およびＡｇ層１１２が形成されていない。なお、接触部１１における電気接点１１０以外の表面は、Ｓｎ層１１３で覆われている。その他の構成は、実施例１と同様である。 The connector terminal 1 of this example is an example in which the Ni layer 114 in the connector terminal 1 of Example 1 is omitted as shown in FIG. Further, in the connector terminal 1 of this example, the electrical contact 110 and the peripheral portion 115 of the electrical contact 110 on the surface of the contact portion 11 are formed on the base material 10 with the Ag—Sn alloy layer 111 and the Ag—Sn. And an Ag layer 112 disposed on the surface of the alloy layer 111. That is, in the connector terminal 1 of this example, the Ag—Sn alloy layer 111 and the Ag layer 112 are not formed on the portion outside the peripheral portion 115 of the electrical contact 110. The surface of the contact portion 11 other than the electrical contact 110 is covered with the Sn layer 113. Other configurations are the same as those of the first embodiment.
　本例のコネクタ用端子１は、電気接点１１０と電気接点１１０の周辺部１１５とが、母材１０上に、Ａｇ－Ｓｎ合金層１１１と、Ａｇ－Ｓｎ合金層１１１の表面に配置されたＡｇ層１１２とを有する。そのため、本例のコネクタ用端子１は、実施例２のコネクタ用端子１に比べ、相手方コネクタ用端子との接触抵抗の低減、電気接点の耐熱性向上、電気接点の耐摩耗性向上をより確実なものとすることができる。また、実施例１のコネクタ用端子１に比べ、Ａｇの使用面積がさらに減少している。そのため、本例のコネクタ用端子１は、さらなるＡｇ使用量の削減により、製造コストの低減に有利である。その他の作用効果は、Ｎｉ層１１４による作用効果を除いて実施例１と同様である。 In the connector terminal 1 of this example, an electrical contact 110 and a peripheral portion 115 of the electrical contact 110 are formed on the base material 10 on the surface of the Ag—Sn alloy layer 111 and the Ag—Sn alloy layer 111. Layer 112. Therefore, compared with the connector terminal 1 of the second embodiment, the connector terminal 1 of the present example more reliably reduces the contact resistance with the mating connector terminal, improves the heat resistance of the electrical contact, and improves the wear resistance of the electrical contact. Can be. Moreover, compared with the connector terminal 1 of the first embodiment, the use area of Ag is further reduced. Therefore, the connector terminal 1 of this example is advantageous in reducing the manufacturing cost by further reducing the amount of Ag used. Other functions and effects are the same as those of the first embodiment except for the functions and effects of the Ni layer 114.
　以上、本発明の実施例について詳細に説明したが、本発明は上記実施例に限定されるものではなく、本発明の趣旨を損なわない範囲内で種々の変更が可能である。 As mentioned above, although the Example of this invention was described in detail, this invention is not limited to the said Example, A various change is possible within the range which does not impair the meaning of this invention.

Claims (4)

  1. 　相手方コネクタ用端子に電気的に接触させるための電気接点を有する接触部と、電線の導体を圧着するための圧着部とを有しており、ＣｕまたはＣｕ合金を母材とするコネクタ用端子であって、
    　上記電気接点は、上記母材上に、Ａｇ－Ｓｎ合金層と、該Ａｇ－Ｓｎ合金層の表面に配置されるとともに上記電気接点の最表面に露出するＡｇ層とを有しており、
    　上記圧着部は、上記母材上に、上記圧着部の最表面に露出するＳｎ層またはＳｎ合金層を有していることを特徴とするコネクタ用端子。     It has a contact part having an electrical contact for making electrical contact with the mating connector terminal, and a crimp part for crimping the conductor of the electric wire, and is a connector terminal using Cu or Cu alloy as a base material. There,
    The electrical contact has, on the base material, an Ag—Sn alloy layer, and an Ag layer disposed on the surface of the Ag—Sn alloy layer and exposed on the outermost surface of the electrical contact.
    The connector terminal, wherein the crimping part has an Sn layer or an Sn alloy layer exposed on the outermost surface of the crimping part on the base material.
  2. 　上記Ａｇ－Ｓｎ合金層と上記母材との間、上記Ｓｎ層または上記Ｓｎ合金層と上記母材との間に、さらに、Ｎｉ層またはＮｉ合金層を有していることを特徴とする請求項１に記載のコネクタ用端子。 A Ni layer or a Ni alloy layer is further provided between the Ag—Sn alloy layer and the base material, and between the Sn layer or the Sn alloy layer and the base material. Item 2. A connector terminal according to Item 1.
  3. 　上記圧着部の圧着時に圧着治具に接触する治具接触面と上記電気接点とを除いた端子部分の最表面には、上記母材、上記Ｓｎ層、上記Ｓｎ合金層、上記Ａｇ層、上記Ａｇ－Ｓｎ合金層、上記Ｎｉ層、および、上記Ｎｉ合金層からなる群より選択される少なくとも１つが露出していることを特徴とする請求項２に記載のコネクタ用端子。 The base material, the Sn layer, the Sn alloy layer, the Ag layer, the above, and the outermost surface of the terminal portion excluding the jig contact surface that contacts the crimping jig when the crimping portion is crimped and the electrical contact 3. The connector terminal according to claim 2, wherein at least one selected from the group consisting of an Ag—Sn alloy layer, the Ni layer, and the Ni alloy layer is exposed.
  4. 　上記Ａｇ－Ｓｎ合金層および上記Ａｇ層は、上記接触部における上記電気接点の少なくとも周辺部まで延設されていることを特徴とする請求項１～３のいずれか１項に記載のコネクタ用端子。 The connector terminal according to any one of claims 1 to 3, wherein the Ag-Sn alloy layer and the Ag layer are extended to at least a peripheral portion of the electrical contact in the contact portion. .
PCT/JP2015/062671 2014-05-14 2015-04-27 Connector terminal WO2015174262A1 (en)

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
EP3249753A1 (en) * 2016-05-24 2017-11-29 Delphi Technologies, Inc. Electrical contact element
EP3751667A1 (en) * 2019-06-11 2020-12-16 Yazaki Corporation Electrical terminal

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7195201B2 (en) * 2019-03-29 2022-12-23 Ｄｏｗａメタルテック株式会社 Plating material and its manufacturing method
JP7302248B2 (en) * 2019-04-09 2023-07-04 三菱マテリアル株式会社 Connector terminal materials and connector terminals

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JPH11121075A (en) * 1997-10-17 1999-04-30 Harness Syst Tech Res Ltd Fitting connection terminal
JP2014005549A (en) * 2012-04-06 2014-01-16 Auto Network Gijutsu Kenkyusho:Kk Method for producing plated member, and method for producing plated terminal for connector

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Publication number Priority date Publication date Assignee Title
JPH11121075A (en) * 1997-10-17 1999-04-30 Harness Syst Tech Res Ltd Fitting connection terminal
JP2014005549A (en) * 2012-04-06 2014-01-16 Auto Network Gijutsu Kenkyusho:Kk Method for producing plated member, and method for producing plated terminal for connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3249753A1 (en) * 2016-05-24 2017-11-29 Delphi Technologies, Inc. Electrical contact element
US9915003B2 (en) 2016-05-24 2018-03-13 Delphi Technologies, Inc. Electrical contact element
EP3751667A1 (en) * 2019-06-11 2020-12-16 Yazaki Corporation Electrical terminal

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