JPH11121075A - Fitting connection terminal - Google Patents
Fitting connection terminalInfo
- Publication number
- JPH11121075A JPH11121075A JP28578497A JP28578497A JPH11121075A JP H11121075 A JPH11121075 A JP H11121075A JP 28578497 A JP28578497 A JP 28578497A JP 28578497 A JP28578497 A JP 28578497A JP H11121075 A JPH11121075 A JP H11121075A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- terminal
- plating
- thickness
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、自動車、産業機器
などの電気配線に用いられる嵌合型接続端子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fitting connection terminal used for electric wiring of automobiles, industrial equipment and the like.
【０００２】[0002]
【従来の技術】従来より、一般に、自動車、産業機器な
どの電気配線において電線同士の接続に用いられる嵌合
型接続端子には、錫めっきが施されてきた。これは、端
子の接続時に、錫めっきの表面酸化皮膜を摩擦によって
破壊し、新鮮な錫を凝着させることにより、低い接触抵
抗を安定して得ることを目的としたものである。2. Description of the Related Art Conventionally, fitting type connection terminals used for connecting electric wires in electric wiring of automobiles, industrial equipments and the like have been generally plated with tin. This is intended to stably obtain a low contact resistance by breaking the surface oxide film of the tin plating by friction at the time of connecting the terminals and adhering fresh tin.
【０００３】また、自動車のＡＢＳ（アンチロックブレ
ーキシステム）やエアバックなど、特に重要な信号回路
に用いられる電気配線には、接続端子に金めっきを施し
て使用していた。[0003] In addition, electrical wiring used for particularly important signal circuits such as an ABS (anti-lock brake system) and an air bag of a vehicle has been used with gold plated connection terminals.
【０００４】[0004]
【発明が解決しようとする課題】上記錫めっきの凝着
は、錫の硬度が低い（ビッカース硬度４０〜８０）こと
に起因するものである。しかし、錫の硬度が低いこと
は、接続時の挿入力を上昇させるという問題の原因とも
なっている。すなわち、端子の嵌合接続時には錫めっき
の凝着磨耗が発生し、錫の変形抵抗に逆らって嵌合させ
るため、挿入力が上昇することとなる。The adhesion of tin plating is caused by the low tin hardness (Vickers hardness: 40 to 80). However, the low hardness of tin causes a problem of increasing the insertion force at the time of connection. That is, when the terminals are fitted and connected, cohesive wear of the tin plating occurs, and the tin is fitted against the deformation resistance of the tin, so that the insertion force increases.
【０００５】ところで、自動車などの電気配線では複数
の電線の束（以下、「ワイヤーハーネス」と称する）を
１つのコネクタで接続するのが一般的であり、コネクタ
の接続に必要な力は、端子１個当りの挿入力に電線の本
数（従来は、一般に１０極〜２０極）を乗じた値として
概算することができる。従って、端子１個当りの挿入力
が高いと、コネクタの接続に必要な力はワイヤーハーネ
スの電線数に応じた大きな値となる。[0005] By the way, in electric wiring of an automobile or the like, a bundle of a plurality of electric wires (hereinafter, referred to as "wire harness") is generally connected by a single connector. It can be roughly estimated as a value obtained by multiplying the insertion force per unit by the number of electric wires (conventionally, generally 10 to 20 poles). Therefore, when the insertion force per terminal is high, the force required to connect the connector has a large value according to the number of wires of the wire harness.
【０００６】特に、近年のカーエレクトロニクスの著し
い進歩・発展は、自動車に搭載する電子機器やＣＰＵの
数を飛躍的に増加させ、それに伴ってワイヤーハーネス
の電線本数を増加し、コネクタの多極化（３０極〜４０
極）を図りたいとの要望も強まっている。In particular, the remarkable progress and development of car electronics in recent years has dramatically increased the number of electronic devices and CPUs mounted on automobiles, and accordingly, the number of electric wires in a wire harness has been increased, and the number of connectors has been increased (30). Pole to 40
There is also a growing demand for the ultimate goal.
【０００７】しかしながら、上述の如く、コネクタを多
極化すると当該コネクタの接続に必要な力も電線本数に
比例して上昇し、ボルトやてこなどの補助機構なしで
は、コネクタの接続ができなくなる。このため、端子を
小型化しても、補助機構がコネクタの小型化・軽量化を
阻害することとなる。However, as described above, when the connector is multipolarized, the force required for connecting the connector also increases in proportion to the number of electric wires, and the connector cannot be connected without an auxiliary mechanism such as a bolt or lever. For this reason, even if the terminal is miniaturized, the auxiliary mechanism hinders miniaturization and weight reduction of the connector.
【０００８】端子の挿入力を低減するには、接点圧力
（嵌合部で接点に与える押しつけ力）を低下させること
が考えられるが、この場合は、安定した低い接触抵抗が
得られなくなる。換言すれば、安定した接触抵抗を維持
したまま端子の挿入力を低下させることが困難であるた
め、コネクタを多極化する際に補助機構が不可欠とな
り、コネクタの小型化・軽量化を阻害する要因となって
いる。In order to reduce the terminal insertion force, it is conceivable to reduce the contact pressure (the pressing force applied to the contact at the fitting portion). However, in this case, a stable and low contact resistance cannot be obtained. In other words, since it is difficult to reduce the insertion force of the terminal while maintaining stable contact resistance, an auxiliary mechanism is indispensable when multi-polarizing the connector, which is a factor that hinders miniaturization and weight reduction of the connector. Has become.
【０００９】なお、接続端子に金めっきを使用すれば、
低い接点圧力でも低い接触抵抗が安定して得られるた
め、端子の挿入力を低くすることができ、コネクタを多
極化してもその接続に要する力が著しく上昇することは
ないが、金めっきは錫めっきに比較して数倍〜数十倍の
コストを要するため、特に多極化したコネクタには適し
ない。If gold plating is used for the connection terminal,
Even if the contact pressure is low, a low contact resistance can be obtained stably, so that the insertion force of the terminal can be reduced, and even if the connector is multi-pole, the force required for the connection does not increase significantly. Since it requires several times to several tens of times the cost as compared with plating, it is not particularly suitable for a multipolar connector.
【００１０】本発明は、上記課題に鑑みてなされたもの
であり、安定した接触抵抗を維持したまま端子の挿入力
を低下できる嵌合型接続端子を提供することを目的とす
る。[0010] The present invention has been made in view of the above problems, and has as its object to provide a fitting connection terminal capable of reducing the insertion force of a terminal while maintaining stable contact resistance.
【００１１】[0011]
【課題を解決するための手段】上記課題を解決するた
め、請求項１の発明は、雄部品と雌部品との嵌合によっ
て電気的接触を得る嵌合型接続端子であって、前記雄部
品または前記雌部品のうちの一方の母材の前記嵌合によ
る摺動部分に０．１μｍ〜０．３μｍの厚さの錫めっき
を施し、他方の母材の摺動部分に０．１μｍ以上の厚さ
の錫めっきを施し、前記一方の母材および／または前記
他方の母材と電線との圧着部分のうち少なくとも圧着時
において圧着金型と接触する面には０．５μｍ〜２．０
μｍの厚さの錫めっきを施している。According to a first aspect of the present invention, there is provided a fitting type connection terminal for obtaining electrical contact by fitting a male part and a female part. Alternatively, a tin portion having a thickness of 0.1 μm to 0.3 μm is applied to a sliding portion of the female component due to the fitting of one base material, and a sliding portion of the other base material having a thickness of 0.1 μm or more is formed. A tin plating having a thickness of 0.5 μm to 2.0 μm on at least a surface of the crimping portion of the one base material and / or the other base material and the electric wire which is in contact with the crimping die during crimping.
The tin plating having a thickness of μm is applied.
【００１２】また、請求項２の発明は、請求項１の発明
に係る嵌合型接続端子において、前記一方の母材および
／または前記他方の母材の前記圧着部分のうち前記電線
と圧着すべき面には０．５μｍ〜２．０μｍの厚さの錫
めっきを施している。According to a second aspect of the present invention, in the fitting connection terminal according to the first aspect of the present invention, the crimping portion of the one base material and / or the other base material is crimped to the electric wire. The surface to be plated is tin-plated with a thickness of 0.5 μm to 2.0 μm.
【００１３】[0013]
【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態について詳細に説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【００１４】＜Ａ．嵌合型接続端子の形態＞図１は本発
明に係る嵌合型接続端子の側面図であり、また、図２は
当該嵌合型接続端子の接続部分の一部切欠平面図であ
る。<A. Form of Fitting Connection Terminal> FIG. 1 is a side view of a fitting connection terminal according to the present invention, and FIG. 2 is a partially cutaway plan view of a connection portion of the fitting connection terminal.
【００１５】図示のように、本発明に係る嵌合型接続端
子は雄端子１０と雌端子２０とで構成されている。雄端
子１０は、電線との圧着部分であるワイヤバレル１１
と、雌端子２０との嵌合部分であるタブ１２とを形成し
ている。また、タブ１２の上面および下面は平滑な摺動
面としている。As shown, the fitting connection terminal according to the present invention comprises a male terminal 10 and a female terminal 20. The male terminal 10 has a wire barrel 11 which is a crimped portion with an electric wire.
And a tab 12 which is a fitting portion with the female terminal 20. The upper and lower surfaces of the tab 12 are smooth sliding surfaces.
【００１６】雌端子２０は、電線との圧着部分であるワ
イヤバレル２４と、雄端子１０との嵌合部分である嵌合
部２５とを形成している。嵌合部２５は、中空の箱形状
であり、舌片２１、エンボス２２およびビード２３とを
その内部に備えている。なお、図２は、嵌合部２５の内
部を示した一部切欠平面図である。The female terminal 20 forms a wire barrel 24 which is a crimping part for the electric wire, and a fitting part 25 which is a fitting part for the male terminal 10. The fitting portion 25 has a hollow box shape, and includes a tongue piece 21, an emboss 22 and a bead 23 therein. FIG. 2 is a partially cutaway plan view showing the inside of the fitting portion 25.
【００１７】エンボス２２は、舌片２１の上部に設けら
れた凸状の部材であり、雄端子１０との嵌合時には、タ
ブ１２の摺動面と点接触する。舌片２１は、接点圧力す
なわちエンボス２２をタブ１２に押しつける圧力を作用
させるバネとしての機能を有している。また、ビード２
３も凸状の部材であり、タブ１２とエンボス２２が接触
する面と反対側の摺動面で接触し、当該エンボス２２が
タブ１２に及ぼす接点圧力を受ける。The emboss 22 is a convex member provided on the upper part of the tongue piece 21 and makes a point contact with the sliding surface of the tab 12 when the male terminal 10 is fitted. The tongue piece 21 has a function as a spring for applying a contact pressure, that is, a pressure for pressing the emboss 22 against the tab 12. Also bead 2
Reference numeral 3 also denotes a convex member, which comes into contact with the sliding surface opposite to the surface where the tab 12 and the emboss 22 come into contact, and receives the contact pressure applied to the tab 12 by the emboss 22.
【００１８】雄端子１０を雌端子２０に嵌合させる際に
は、タブ１２をエンボス２２とビード２３との間隙に挿
入する。そして、このときにタブ１２の上下面のうちの
一方はエンボス２２と、他方はビード２３と摺動する。
エンボス２２はタブ１２と点接触しているため、エンボ
ス２２の摺動部分は点であり、また、タブ１２の摺動部
分は線である。また、ビード２３についてはタブ１２と
の接触部分がそのまま摺動部分となる。すなわち、嵌合
時の雌端子２０における摺動部分の面積はエンボス２２
およびビード２３がタブ１２と接触する面積となり、ま
た、雄端子１０における摺動部分の面積はタブ１２がエ
ンボス２２およびビード２３と接触した状態で当該雄端
子１０が雌端子２０に対して相対的に移動する距離に応
じた面積となる。したがって、この実施形態において
は、雄端子１０における摺動部分の面積の方が雌端子２
０における摺動部分の面積よりも大きい。When fitting the male terminal 10 to the female terminal 20, the tab 12 is inserted into the gap between the emboss 22 and the bead 23. At this time, one of the upper and lower surfaces of the tab 12 slides on the emboss 22 and the other slides on the bead 23.
Since the emboss 22 is in point contact with the tab 12, the sliding portion of the emboss 22 is a point, and the sliding portion of the tab 12 is a line. Further, the contact portion of the bead 23 with the tab 12 becomes a sliding portion as it is. That is, the area of the sliding portion of the female terminal 20 at the time of mating is
And the area where the bead 23 comes into contact with the tab 12, and the area of the sliding portion of the male terminal 10 is relative to the female terminal 20 when the tab 12 is in contact with the emboss 22 and the bead 23. Is an area corresponding to the moving distance. Therefore, in this embodiment, the area of the sliding portion of the male terminal 10 is larger than that of the female terminal 2.
0 is larger than the area of the sliding portion.
【００１９】＜Ｂ．嵌合型接続端子の製造方法＞次に、
嵌合型接続端子の製造方法について説明する。本実施形
態における嵌合型接続端子は、 板状の条材に錫めっき処理を行う、 条材から型を打ち抜き、図１の形態に加工する、 電線との圧着を行う、 という工程を経て作製される。<B. Manufacturing method of mating type connection terminal>
A method for manufacturing the fitting connection terminal will be described. The fitting-type connection terminal in the present embodiment is manufactured through the steps of performing tin plating on a plate-shaped strip, punching a mold from the strip, processing into a form shown in FIG. 1, and performing crimping with an electric wire. Is done.
【００２０】＜Ｂ−１．条材への錫めっき工程＞本実施
形態では、嵌合型接続端子の母材として銅または銅合金
を使用する。銅または銅合金のままでは、その硬度が高
く（ビッカース硬度１００以上）、雄端子１０と雌端子
２０との接触抵抗が高くなることもあるため、両端子に
は錫めっきを施す。錫めっきによる接触抵抗低減の効果
は既に述べた通りである。<B-1. Step of Tin Plating on Strip Material> In the present embodiment, copper or a copper alloy is used as a base material of the fitting connection terminal. If copper or copper alloy is used, its hardness is high (Vickers hardness of 100 or more) and the contact resistance between the male terminal 10 and the female terminal 20 may be high. Therefore, both terminals are plated with tin. The effect of reducing contact resistance by tin plating is as described above.
【００２１】図３は、嵌合型接続端子の製造に使用され
る銅または銅合金の板状の条材を示す平面図である。図
３（ａ）は雄端子１０用の条材１９であり、また図３
（ｂ）は雌端子２０用の条材２９である。条材１９およ
び条材２９の内部に図示する輪郭形状は、後の工程で打
抜かれてそれぞれ雄端子１０および雌端子２０の成形加
工に供される部分を示している。なお、本実施形態にお
いては、母材である銅または銅合金の条材の両面全表面
にニッケルめっきを施し、さらにその上に錫めっきを行
っているが、この理由については後述する。FIG. 3 is a plan view showing a plate-shaped strip of copper or copper alloy used for manufacturing the fitting type connection terminal. FIG. 3A shows a strip 19 for the male terminal 10.
(B) is a strip 29 for the female terminal 20. The contour shapes illustrated inside the strip members 19 and 29 indicate portions that are punched in a later step and are used for forming the male terminals 10 and the female terminals 20, respectively. In the present embodiment, nickel plating is applied to both surfaces of the copper or copper alloy strip as the base material, and tin plating is further applied thereon. The reason will be described later.
【００２２】本実施形態における錫めっきは２段階に分
けて行われる。すなわち、ニッケルによる下地めっきを
行った条材の両面全表面に錫の薄めっきを施し、その後
条材の特定の領域のみに錫の厚めっきを施している。The tin plating in this embodiment is performed in two stages. That is, a thin plating of tin is applied to all surfaces of both sides of the strip which has been subjected to the base plating with nickel, and then a thick plating of tin is applied only to a specific region of the strip.
【００２３】錫の薄めっきを行うとき、雄端子１０用の
条材１９または雌端子２０用の条材２９のうちの一方の
錫めっき厚さを０．１μｍ〜０．３μｍとし、他方の錫
めっき厚さを０．１μｍ以上としている。When performing thin plating of tin, one of the strip 19 for the male terminal 10 and the strip 29 for the female terminal 20 has a tin plating thickness of 0.1 μm to 0.3 μm and the other tin has a thickness of 0.1 μm to 0.3 μm. The plating thickness is 0.1 μm or more.
【００２４】一方、錫の厚めっきは条材１９の厚めっき
領域１９ａおよび条材２９の厚めっき領域２９ａのそれ
ぞれの片面のみに行う。厚めっき領域１９ａおよび厚め
っき領域２９ａは、それぞれ将来ワイヤバレル１１およ
びワイヤバレル２４に加工される部分を含む領域であ
る。厚めっき領域１９ａ、２９ａにおけるの錫めっき厚
さ、すなわち当該領域における薄めっきと厚めっきとの
累積による錫めっき厚さを０．５μｍ〜２．０μｍとし
ている。なお、薄めっきおよび厚めっきともに公知のめ
っき方法を適用することが可能であるが、厚めっきは特
定領域のみにめっきを行ういわゆるストライプメッキと
なるため、それに適しためっき方法（例えば、治具を使
用する電気メッキ）を採用するのが好ましい。On the other hand, the thick plating of tin is performed only on each one side of the thick plating area 19a of the strip 19 and the thick plating area 29a of the strip 29. The thick plating region 19a and the thick plating region 29a are regions including portions to be processed into the wire barrel 11 and the wire barrel 24 in the future. The thickness of the tin plating in the thick plating regions 19a and 29a, that is, the thickness of the tin plating resulting from the accumulation of the thin plating and the thick plating in the region is set to 0.5 μm to 2.0 μm. A known plating method can be applied to both the thin plating and the thick plating. However, since the thick plating is so-called stripe plating in which plating is performed only in a specific region, a plating method suitable for the plating (for example, using a jig) It is preferable to employ electroplating to be used.
【００２５】図４は、錫めっき終了後の条材１９のＶ−
Ｖ線断面図である。図示のように、銅または銅合金の母
材３の表面全面にニッケルの下地めっき層１が形成さ
れ、その上に錫の薄めっき層２ａが形成されている。さ
らに、厚めっき領域１９ａの片面には、錫の厚めっき層
２ｂが形成されている。なお、厚めっき層２ｂは、厳密
には薄めっきと厚めっきとの双方の累積によって形成さ
れるめっき層であるが、以下においては説明の便宜上当
該めっき層を厚めっき層と称する。FIG. 4 shows the V- of the strip 19 after the tin plating.
It is a V line sectional view. As shown in the drawing, a nickel base plating layer 1 is formed on the entire surface of a copper or copper alloy base material 3, and a tin thin plating layer 2a is formed thereon. Further, a thick tin plating layer 2b is formed on one surface of the thick plating region 19a. Strictly speaking, the thick plating layer 2b is a plating layer formed by accumulation of both thin plating and thick plating, but the plating layer is hereinafter referred to as a thick plating layer for convenience of explanation.
【００２６】また、図４は、条材１９についての断面形
態であるが条材２９についても同様の断面形態となる。FIG. 4 shows the cross section of the strip 19, but the cross section of the strip 29 is the same.
【００２７】＜Ｂ−２．打抜き加工および端子成形加工
工程＞錫めっき終了後の条材１９および条材２９につい
ては打抜き加工が行われ、図３に示す輪郭形状の板片が
打ち抜かれる。打ち抜かれた板片にはプレス成形加工が
施され、図１に示す雄端子１０および雌端子２０の形状
に成形される。<B-2. Punching and Terminal Forming Steps> The strip 19 and the strip 29 after the completion of the tin plating are punched, and a plate piece having a contour shape shown in FIG. 3 is punched. The stamped plate piece is subjected to press forming, and is shaped into the male terminal 10 and the female terminal 20 shown in FIG.
【００２８】なお、プレス成形加工工程においては、錫
の厚めっき層２ｂが形成された面がワイヤバレル１１、
２４の外側面となるように加工する。In the press forming process, the surface on which the tin thick plating layer 2b is formed is the wire barrel 11,
24 so as to form an outer surface.
【００２９】＜Ｂ−３．電線への圧着工程＞成形加工後
の雄端子１０および雌端子２０は、それぞれ電線と圧着
される。図５は、電線Ｌとワイヤバレル１１との圧着の
様子を説明する図である。<B-3. Step of crimping to electric wire> The male terminal 10 and the female terminal 20 after the forming process are each crimped to the electric wire. FIG. 5 is a diagram illustrating a state of crimping of the electric wire L and the wire barrel 11.
【００３０】図示のように、ワイヤバレル１１の内側に
は電線Ｌが置かれ、当該ワイヤバレル１１は下金型４５
にはめ込まれている。そして、上金型４０が降下するこ
とによってワイヤバレル１１が内側に曲げられて、電線
Ｌとの圧着が行われる。図５は、雄端子１０のワイヤバ
レル１１について示しているが、雌端子２０のワイヤバ
レル２４についても同様に電線との圧着が行われる。As shown, an electric wire L is placed inside the wire barrel 11, and the wire barrel 11 is attached to a lower mold 45.
It is embedded in. Then, as the upper mold 40 descends, the wire barrel 11 is bent inward, and the wire barrel 11 is crimped. FIG. 5 shows the wire barrel 11 of the male terminal 10, but the wire barrel 24 of the female terminal 20 is similarly crimped to an electric wire.
【００３１】＜Ｃ．各めっき層の作用＞以上のようにし
て作製された嵌合型接続端子においては、雄端子１０お
よび雌端子２０の双方の嵌合部分には薄めっき層２ａが
形成され、圧着部分の外側には厚めっき層２ｂが形成さ
れている。以下、これらの各めっき層の果たす役割につ
いて説明する。<C. Action of Each Plating Layer> In the fitting connection terminal manufactured as described above, a thin plating layer 2a is formed on both fitting portions of the male terminal 10 and the female terminal 20, and the thin plating layer 2a is formed outside the crimped portion. Has a thick plating layer 2b formed thereon. Hereinafter, the role played by each of these plating layers will be described.
【００３２】＜Ｃ−１．嵌合部分における薄めっき層の
作用＞従来は端子への錫めっき層の厚さを１．０μｍ以
上としていた。これは、錫めっきのコストが比較的安価
なことと、端子の耐食性を考慮した結果である。<C-1. Action of Thin Plating Layer in Fitting Part> Conventionally, the thickness of a tin plating layer on a terminal has been set to 1.0 μm or more. This is a result of considering the relatively low cost of tin plating and the corrosion resistance of the terminals.
【００３３】本発明に係る嵌合型接続端子においては、
嵌合部分の錫めっき層の厚さ（薄めっき層２ａの厚さ）
を１．０μｍ以下に薄くすることによって端子の接触部
分の見かけの硬度を高くして、挿入力を低減させてい
る。このことを以下に示す実験結果を使用して説明す
る。In the fitting type connection terminal according to the present invention,
Thickness of tin plating layer at fitting part (thickness of thin plating layer 2a)
Is reduced to 1.0 μm or less to increase the apparent hardness of the contact portion of the terminal and reduce the insertion force. This will be described using the experimental results shown below.
【００３４】実験は、雄端子１０および雌端子２０の嵌
合部分（タブ１２および嵌合部２５）の錫めっき厚さを
それぞれ０．１μｍ〜１．０μｍまで変化させ、当該雄
端子１０を雌端子２０に嵌合させるときの挿入力を測定
して行った。次の表１はその実験結果である。In the experiment, the tin plating thickness of the fitting portion (tab 12 and fitting portion 25) of the male terminal 10 and the female terminal 20 was changed from 0.1 μm to 1.0 μm, respectively, The measurement was performed by measuring the insertion force when fitting to the terminal 20. Table 1 below shows the experimental results.
【００３５】[0035]
【表１】 [Table 1]
【００３６】また、図６は表１の実験結果を示す図であ
る。従来における端子への錫めっき厚さを１．０μｍと
すると、端子挿入力は０．７４ｋｇｆである。以下、こ
の従来の挿入力を基準値として説明を続ける。FIG. 6 is a view showing the experimental results of Table 1. Assuming that the conventional tin plating thickness on the terminal is 1.0 μm, the terminal insertion force is 0.74 kgf. Hereinafter, the description will be continued using the conventional insertion force as a reference value.
【００３７】実験結果が示すように、雄端子１０または
雌端子２０の嵌合部分うちの一方の錫めっき厚さを０．
１μｍ〜０．３μｍとし、他方の錫めっき厚さを０．１
μｍ以上とすると、基準値と比較して挿入力を少なくと
も１０％以上低減（０．６７ｋｇｆ以下）できる。これ
は、錫めっき層が薄くなるにしたがって、母材である銅
または銅合金の硬度が端子の硬度に影響するようにな
り、端子の見かけの硬度が高くなる。そして、端子の見
かけの硬度が高くなることによって、錫めっきの凝着が
抑制され、挿入力が低くなったのである。As shown by the experimental results, the tin plating thickness of one of the fitting portions of the male terminal 10 or the female terminal 20 was set to 0.1.
1 μm to 0.3 μm, and the other tin plating thickness is 0.1
When the thickness is not less than μm, the insertion force can be reduced by at least 10% or more (0.67 kgf or less) as compared with the reference value. This is because as the tin plating layer becomes thinner, the hardness of the base material copper or copper alloy influences the hardness of the terminal, and the apparent hardness of the terminal increases. Then, by increasing the apparent hardness of the terminal, adhesion of tin plating was suppressed, and the insertion force was reduced.
【００３８】もっとも、錫めっきは摺動部分の潤滑剤と
しての機能も有しており、雄端子１０および雌端子２０
の両方ともに嵌合部分錫めっき厚さを０．１μｍとした
場合には、錫めっきの潤滑剤としての機能を喪失し、母
材の摩擦にともなって多少挿入力が高くなっている。However, the tin plating also has a function as a lubricant for the sliding portion, so that the male terminal 10 and the female terminal 20 can be used.
In both cases, when the thickness of the tin plating at the fitting portion is 0.1 μm, the function of the tin plating as a lubricant is lost, and the insertion force is somewhat increased due to the friction of the base material.
【００３９】また、雄端子１０の嵌合部分錫めっき厚さ
を０．１μｍとし、雌端子２０の嵌合部分錫めっき厚さ
を０．３μｍ〜１．０μｍとした場合には、基準値と比
較して挿入力が３０％以上低減（０．５２ｋｇｆ以下）
している。これは、摺動部分の面積が大きい方の錫めっ
き厚さを薄くした方が挿入力低減の効果が大きいことを
示す結果である。When the tin plating thickness of the fitting portion of the male terminal 10 is 0.1 μm and the tin plating thickness of the fitting portion of the female terminal 20 is 0.3 μm to 1.0 μm, the reference value Insertion force reduced by 30% or more compared to that (0.52kgf or less)
doing. This is a result showing that the effect of reducing the insertion force is greater when the thickness of the tin plating having the larger sliding area is smaller.
【００４０】端子挿入力を０．４６ｋｇｆまで低減でき
れば、例えば、３０極のコネクタの場合、従来当該コネ
クタの接続に約２２ｋｇｆ（０．７４×３０）の力を要
していたのが、約１４ｋｇｆ（０．４６×３０）まで低
下することができる。If the terminal insertion force can be reduced to 0.46 kgf, for example, in the case of a 30-pole connector, the connection of the connector required about 22 kgf (0.74 × 30) in the past, but about 14 kgf (0.46 × 30).
【００４１】ところで、接続端子には、挿入力以外にも
安定して低い接触抵抗および良好な耐食性が要求され
る。接触抵抗は電気配線の接続に使用される端子である
以上当然に要求される特性であり、また端子の母材であ
る銅または銅合金は特に亜硫酸ガス雰囲気において腐食
が進行しやすいため耐食性も要求される。Incidentally, the connection terminal is required to have a stable low contact resistance and good corrosion resistance in addition to the insertion force. Contact resistance is a characteristic that is naturally required as long as it is a terminal used for connection of electric wiring, and copper or copper alloy, which is the base material of the terminal, is also required to have corrosion resistance especially in a sulfurous acid gas atmosphere because corrosion easily progresses Is done.
【００４２】図７は、端子の錫めっき厚さを薄くしたと
きの接触抵抗および耐食性を示す図である。この図は、
錫めっき直後の端子の接触抵抗と錫めっき後さらに腐食
試験を行った後の端子の接触抵抗とを示している。FIG. 7 is a graph showing contact resistance and corrosion resistance when the tin plating thickness of the terminal is reduced. This figure is
The contact resistance of the terminal immediately after the tin plating and the contact resistance of the terminal after the tin plate is further subjected to a corrosion test are shown.
【００４３】図から明らかなように、錫めっき厚さ０．
１μｍの端子は錫めっき厚さ１．０μｍの端子に比較す
ると若干接触抵抗が高くなるものの、めっきを施さない
端子よりは十分に低い接触抵抗を保っている。すなわ
ち、錫めっきを厚さ０．１μｍ以上施していれば、安定
して低い接触抵抗を得ることができると言える。また、
通常、接続端子に要求される接触抵抗は１．０ｍΩ以下
であり、錫めっき厚さ０．１μｍの端子は、この要求を
十分に満たしている。As is clear from the figure, the tin plating thickness is 0.1 mm.
Although the contact resistance of the 1 μm terminal is slightly higher than that of the terminal having a tin plating thickness of 1.0 μm, the contact resistance is sufficiently lower than the terminal having no plating. That is, it can be said that a low contact resistance can be stably obtained if the tin plating is applied to a thickness of 0.1 μm or more. Also,
Usually, the contact resistance required for the connection terminal is 1.0 mΩ or less, and the terminal having a tin plating thickness of 0.1 μm sufficiently satisfies this requirement.
【００４４】次に、腐食試験後の接触抵抗についても錫
めっき厚さ０．１μｍの端子は錫めっき厚さ１．０μｍ
の端子よりも多少高くなるが、めっきを施さない端子よ
りは十分に低い接触抵抗となっている。そして、腐食試
験後の錫めっき厚さ０．１μｍの端子の接触抵抗も１．
０ｍΩ以下となっており、接続端子に要求される接触抵
抗の許容値以下となっている。Next, regarding the contact resistance after the corrosion test, the terminal having a tin plating thickness of 0.1 μm
Although the contact resistance is slightly higher than that of the terminal, the contact resistance is sufficiently lower than the terminal without plating. The contact resistance of the terminal having a tin plating thickness of 0.1 μm after the corrosion test is also 1.
0 mΩ or less, which is below the allowable value of the contact resistance required for the connection terminal.
【００４５】錫めっきは、必ずしも均一に施せるもので
はなく、厚さ０．１μｍ以下の錫めっきを施した場合に
は、部分的に錫めっきで被覆できない部分が現出する。
このような場合は、母材の銅若しくは銅合金または下地
のニッケルと錫との間で局部電池を形成するため、電気
腐食的な特性が著しく劣化する。従って、耐食性の面か
らは、最低限厚さ０．１μｍの錫めっきを施しておく必
要がある。Tin plating cannot always be applied uniformly. If tin plating having a thickness of 0.1 μm or less is applied, a portion that cannot be partially covered with tin plating appears.
In such a case, since a local battery is formed between the base material copper or copper alloy or the base material nickel and tin, the electrocorrosive characteristics are significantly deteriorated. Therefore, from the viewpoint of corrosion resistance, it is necessary to apply tin plating with a minimum thickness of 0.1 μm.
【００４６】以上の内容を総括すると、雄端子１０また
は雌端子２０の嵌合部分のうちの一方の錫めっき厚さを
０．１μｍ〜０．３μｍとし、他方の錫めっき厚さを
０．１μｍ以上とすると、挿入力を１０％以上低減で
き、特に雄端子１０の嵌合部分錫めっき厚さを０．１μ
ｍとし、雌端子２０の嵌合部分錫めっき厚さを０．３μ
ｍ〜１．０μｍとした場合には、挿入力を３０％以上も
低減できる。To summarize the above, one of the fitting portions of the male terminal 10 or the female terminal 20 has a tin plating thickness of 0.1 μm to 0.3 μm and the other tin plating thickness of 0.1 μm. By doing so, the insertion force can be reduced by 10% or more.
m, and the tinning thickness of the fitting portion of the female terminal 20 is 0.3 μm.
When the thickness is from m to 1.0 μm, the insertion force can be reduced by 30% or more.
【００４７】一方、耐食性および接触抵抗の観点から
は、少なくとも０．１μｍ以上の錫めっき厚さが必要で
ある。そして、この制限は、挿入力を低減できる上記数
値範囲と重なるものである。On the other hand, from the viewpoint of corrosion resistance and contact resistance, a tin plating thickness of at least 0.1 μm is required. This restriction overlaps with the above numerical range in which the insertion force can be reduced.
【００４８】＜Ｃ−２．圧着部分における厚めっき層の
作用＞図５に示すように、圧着工程においては、ワイヤ
バレル１１は変形を受けつつその外面が上金型４０に対
して摺動することになる。このときに、摩擦にともなう
上金型４０の損傷を回避すべく、ワイヤバレル１１の外
面と上金型４０との間に潤滑作用を有する物質が必要と
なる。<C-2. Operation of Thick Plating Layer in Crimped Part> As shown in FIG. 5, in the crimping step, the outer surface of the wire barrel 11 slides with respect to the upper mold 40 while being deformed. At this time, a material having a lubricating action between the outer surface of the wire barrel 11 and the upper mold 40 is required to avoid damage to the upper mold 40 due to friction.
【００４９】一般に、潤滑作用を有する物質としては、
例えば潤滑油などが利用されているが、ワイヤバレル１
１は電線との間で電気的接触を得る部分であるため、油
を使用することは好ましくない。Generally, substances having a lubricating action include:
For example, lubricating oil is used.
The use of oil is not preferred because 1 is a part for obtaining electrical contact with the electric wire.
【００５０】本発明に係る嵌合型接続端子は、上述した
ように、ワイヤバレル１１の外面側に錫の厚めっき層２
ｂを形成している。そして、錫は軟らかいため、圧着工
程において、錫の厚めっき層２ｂがワイヤバレル１１の
外面と上金型４０との間に薄く延び、錫が金属の固体潤
滑剤としての役割を果たすこととなる。これにより、硬
い銅または銅合金によって上金型４０が磨耗されること
はなくなり、その寿命を縮める懸念はない。As described above, the fitting type connection terminal according to the present invention has a thick tin plating layer 2 on the outer surface side of the wire barrel 11.
b is formed. Then, since tin is soft, the thick plating layer 2b of tin extends thinly between the outer surface of the wire barrel 11 and the upper mold 40 in the pressure bonding step, so that tin plays a role as a solid lubricant of the metal. . As a result, the upper mold 40 is not worn by hard copper or a copper alloy, and there is no concern that the life of the upper mold 40 is shortened.
【００５１】また、ワイヤバレル１１の曲げ加工にとも
なって、ワイヤバレル１１の外面の錫めっき層に割れが
生じることもあるが、厚めっき層２ｂでは軟らかい錫め
っき層が厚いため、き裂が伝播して、母材表面に達する
ことはない。その結果、母材の露出にともなう耐食性の
低下や母材自身に割れが伝播するおそれもない。In addition, cracks may occur in the tin plating layer on the outer surface of the wire barrel 11 due to the bending of the wire barrel 11, but the cracks propagate in the thick plating layer 2b because the soft tin plating layer is thick. Thus, it does not reach the base material surface. As a result, there is no possibility that the corrosion resistance is reduced due to the exposure of the base material or that the crack propagates to the base material itself.
【００５２】このような錫の効果を得るためには、厚め
っき層２ｂの厚さを０．５μｍ以上にする必要がある
が、当該厚さを２．０μｍより厚くすると製造コストの
上昇などを招くため、錫の厚めっき層２ｂの厚さは０．
５μｍ〜２．０μｍにする必要がある。In order to obtain such an effect of tin, it is necessary to make the thickness of the thick plating layer 2b 0.5 μm or more. However, if the thickness is more than 2.0 μm, the production cost will increase. In this case, the thickness of the tin thick plating layer 2b is set to 0.1.
It needs to be 5 μm to 2.0 μm.
【００５３】一方、ワイヤバレル１１の内面には薄めっ
き層２ａが形成されている。ワイヤバレル１１の内面
は、電線との圧着による接触抵抗を低くできればよく、
このためには錫が薄めっき層２ａの厚さであっても十分
である。On the other hand, a thin plating layer 2a is formed on the inner surface of the wire barrel 11. The inner surface of the wire barrel 11 only needs to reduce the contact resistance by crimping with the electric wire,
For this purpose, it is sufficient that tin has a thickness of the thin plating layer 2a.
【００５４】＜Ｃ−３．ニッケルの下地めっき層の作用
＞既述したように、本実施形態では、母材である銅また
は銅合金の表面に下地としてニッケルめっきを施し、さ
らにその上に錫めっきを行っている。このようなニッケ
ルめっきを行う意義について図８を用いて説明する。<C-3. Action of Nickel Underplating Layer> As described above, in the present embodiment, nickel plating is applied as a base on the surface of copper or a copper alloy as a base material, and tin plating is further applied thereon. The significance of performing such nickel plating will be described with reference to FIG.
【００５５】図８（ａ）に示すように、母材である銅の
表面に直接錫めっきを施すと、銅は常温においても錫中
を拡散するため、銅と錫との合金が生成される。ここ
で、上記実施形態のように錫めっき厚さが薄い場合は、
当該錫めっき層が比較的短期間で全て合金化されること
になる（図５（ｂ）に示す状態）。ここで、形成される
合金は銅と錫との金属間化合物（Ｃｕ6Ｓｎ5）であるた
め、その硬度は非常に高い。従って、錫めっき層が全て
合金化されると、嵌合時に低い接触抵抗を得るのが困難
になる。As shown in FIG. 8A, when tin plating is directly applied to the surface of copper as a base material, copper diffuses in tin even at room temperature, so that an alloy of copper and tin is formed. . Here, when the tin plating thickness is thin as in the above embodiment,
All of the tin plating layers are alloyed in a relatively short period of time (the state shown in FIG. 5B). Here, since the formed alloy is an intermetallic compound of copper and tin (Cu 6 Sn 5 ), its hardness is very high. Therefore, if all the tin plating layers are alloyed, it becomes difficult to obtain a low contact resistance at the time of fitting.
【００５６】そこで、錫めっきの下地としてニッケルめ
っきを施せば（図５（ｃ）に示す状態）、錫中における
ニッケルの拡散係数は銅よりも格段に低いため、錫めっ
き層が合金化される懸念はなくなり、安定して低い接触
抵抗を得ることができる。換言すれば、下地のニッケル
めっきは、銅の拡散障壁層として機能していることにな
る。If nickel plating is applied as a base for tin plating (the state shown in FIG. 5C), the diffusion coefficient of nickel in tin is much lower than that of copper, so that the tin plating layer is alloyed. There is no concern, and a low contact resistance can be stably obtained. In other words, the underlying nickel plating functions as a copper diffusion barrier layer.
【００５７】なお、拡散障壁層としては、ニッケルめっ
きに限らず、錫中に拡散しない物質層であればよく、例
えばチタンナイトライドなどであってもよい。また、図
８による説明は母材が銅合金であっても同様である。The diffusion barrier layer is not limited to nickel plating but may be any material layer that does not diffuse into tin, for example, titanium nitride. The description with reference to FIG. 8 is the same even when the base material is a copper alloy.
【００５８】＜Ｄ．変形例＞以上、本発明の実施の形態
について説明したが、この発明は上記の例に限定される
ものではない。<D. Modifications> While the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described examples.
【００５９】例えば、上記実施形態では、条材１９、２
９の厚めっき領域１９ａ、２９ａの片面にのみストライ
プメッキによる厚めっきを行っていたが、厚めっき領域
はワイヤバレル１１およびワイヤバレル２４に加工され
る部分（電線との圧着を行う圧着部分）を含む領域（た
だし、嵌合部分を除く）であればよく、また条材１９、
２９の両面に厚めっきを行ってもよい。For example, in the above embodiment, the strip members 19, 2
Although the thick plating by stripe plating was performed only on one side of the thick plating regions 19a and 29a of No. 9, the thick plating region is a portion to be processed into the wire barrel 11 and the wire barrel 24 (a crimp portion for crimping to an electric wire). It is sufficient that the area includes the area (excluding the fitting part).
Thick plating may be performed on both sides of the 29.
【００６０】図９は厚めっき領域の他の例を示す図であ
り、図１０は図９の条材１９のＶ−Ｖ線断面図である。
この例では、薄めっき終了後の条材１９を溶融錫中に浸
漬して厚めっきを行っており、条材１９の両面に厚めっ
き層２ｂが形成されるとともに、厚めっき領域１９ｂは
条材１９の端部から設けられている。また、条材２９の
厚めっき領域２９ｂについても同様に、条材２９の両面
に端部から設けられている。FIG. 9 is a view showing another example of the thick plating area, and FIG. 10 is a sectional view of the strip 19 of FIG. 9 taken along the line VV.
In this example, the thin material 19 after the completion of the thin plating is immersed in the molten tin to perform the thick plating, the thick plating layer 2b is formed on both surfaces of the thin material 19, and the thick plating region 19b is formed in the thick material. 19 are provided from the end. Similarly, the thick plating region 29b of the strip 29 is provided on both sides of the strip 29 from the ends.
【００６１】このようにすれば、ワイヤバレル１１、２
９の内面側および外面側の両側に錫の厚めっき層２ｂを
形成することとなるため、上記実施形態と同様の効果が
得られるのに加えて、電線との接触抵抗も安定して低く
保つことができる。In this way, the wire barrels 11, 2
Since the thick plating layer 2b of tin is formed on both the inner surface side and the outer surface side of No. 9, the same effect as in the above embodiment can be obtained, and the contact resistance with the electric wire is also stably kept low. be able to.
【００６２】また、めっき方法は、上記のような湿式め
っき以外にも蒸着やスパッタリングのような乾式めっき
を用いることも可能である。As the plating method, it is also possible to use dry plating such as vapor deposition or sputtering in addition to the above-mentioned wet plating.
【００６３】また、端子の母材としては、銅または銅合
金以外にも、アルミニウム、アルミニウム合金、鉄合
金、ステンレス鋼、ニッケル合金など錫めっきよりも硬
度の大きい金属材料を使用することができる。As the base material of the terminal, a metal material having a higher hardness than tin plating, such as aluminum, an aluminum alloy, an iron alloy, stainless steel, and a nickel alloy, can be used in addition to copper or a copper alloy.
【００６４】さらに、上記実施形態においては、雄端子
１０における摺動部分の面積の方を雌端子２０における
摺動部分の面積よりも大きくしたが、これを逆にしても
よい。すなわち、雄端子１０のタブ１２に凸部を設けて
雌端子２０の嵌合部２５に摺動面を形成するようにして
もよい。Further, in the above embodiment, the area of the sliding portion of the male terminal 10 is larger than the area of the sliding portion of the female terminal 20, but this may be reversed. That is, a projection may be provided on the tab 12 of the male terminal 10 to form a sliding surface on the fitting portion 25 of the female terminal 20.
【００６５】[0065]
【発明の効果】以上説明したように、請求項１の発明に
よれば、雄部品または前記雌部品のうちの一方の母材の
嵌合による摺動部分に０．１μｍ〜０．３μｍの厚さの
錫めっきを施し、他方の母材の摺動部分に０．１μｍ以
上の厚さの錫めっきを施しているため、接続端子の見か
けの硬度が高くなることによって、錫めっきの凝着が抑
制され、安定した接触抵抗を維持したまま端子挿入力を
低減することができる。また、当該一方の母材および／
または他方の母材と電線との圧着部分のうち少なくとも
圧着時において圧着金型と接触する面には０．５μｍ〜
２．０μｍの厚さの錫めっきを施しているため、当該面
には軟らかい錫めっき層が厚く存在することとなり、そ
の結果、圧着用の金型を磨耗させることがなくなるとと
もに圧着部分に割れが生じることもない。As described above, according to the first aspect of the present invention, the sliding portion formed by fitting one of the male component and the female component into the base material has a thickness of 0.1 μm to 0.3 μm. The tin plating of 0.1μm or more is applied to the sliding part of the other base material, and the apparent hardness of the connection terminals is increased. The terminal insertion force can be reduced while suppressing the contact resistance and maintaining the stable contact resistance. In addition, the one base material and / or
Or at least the surface of the crimping portion between the other base material and the wire that comes into contact with the crimping mold at the time of crimping is 0.5 μm or more.
Since the tin plating having a thickness of 2.0 μm is applied, a soft tin plating layer is present on the surface in a large thickness. As a result, the die for crimping is not worn and cracks are formed in the crimping portion. It does not occur.
【００６６】また、請求項２の発明によれば、上記一方
の母材および／または他方の母材の圧着部分のうち電線
と圧着すべき面には０．５μｍ〜２．０μｍの厚さの錫
めっきを施すため、電線との接触抵抗も安定して低く保
つことができる。According to the second aspect of the present invention, the surface of the crimped portion of the one base material and / or the other base material to be crimped with the electric wire has a thickness of 0.5 μm to 2.0 μm. Since the tin plating is applied, the contact resistance with the electric wire can be stably kept low.
【図１】本発明に係る嵌合型接続端子の側面図である。FIG. 1 is a side view of a fitting connection terminal according to the present invention.
【図２】図１の嵌合型接続端子の接続部分の一部切欠平
面図である。FIG. 2 is a partially cutaway plan view of a connection portion of the fitting type connection terminal of FIG. 1;
【図３】図１の嵌合型接続端子の製造に使用される銅ま
たは銅合金の板状の条材を示す平面図である。FIG. 3 is a plan view showing a plate-shaped strip of copper or copper alloy used for manufacturing the fitting connection terminal of FIG. 1;
【図４】錫めっき終了後の図３の条材のＶ−Ｖ線断面図
である。FIG. 4 is a sectional view taken along line VV of the strip shown in FIG. 3 after completion of tin plating.
【図５】電線とワイヤバレルとの圧着の様子を説明する
図である。FIG. 5 is a diagram illustrating a state of crimping of an electric wire and a wire barrel.
【図６】端子の嵌合部分錫めっき厚さを薄くしたときの
挿入力の実験結果を示す図である。FIG. 6 is a view showing an experimental result of an insertion force when a thickness of tin plating at a fitting portion of a terminal is reduced.
【図７】端子の錫めっき厚さを薄くしたときの接触抵抗
および耐食性を示す図である。FIG. 7 is a diagram showing contact resistance and corrosion resistance when the tin plating thickness of the terminal is reduced.
【図８】下地のニッケルめっきを説明するための図であ
る。FIG. 8 is a diagram for explaining nickel plating of a base.
【図９】厚めっき領域の他の例を示す図である。FIG. 9 is a diagram showing another example of a thick plating region.
【図１０】図９の条材のＶ−Ｖ線断面図である。FIG. 10 is a sectional view taken along line VV of the strip shown in FIG. 9;
１０ 雄端子 １１、２４ ワイヤバレル １２ タブ １９、２９ 条材 １９ａ、１９ｂ、２９ａ、２９ｂ 厚めっき領域 ２０ 雌端子 ２１ 舌片 ２２ エンボス ２３ ビード ２５ 嵌合部 DESCRIPTION OF SYMBOLS 10 Male terminal 11, 24 Wire barrel 12 Tab 19, 29 Strip material 19a, 19b, 29a, 29b Thick plating area 20 Female terminal 21 Tongue piece 22 Emboss 23 Bead 25 Fitting part
───────────────────────────────────────────────────── フロントページの続き (72)発明者 塩谷 準 愛知県名古屋市南区菊住１丁目７番10号 株式会社ハーネス総合技術研究所内 (72)発明者 藤井 淳彦 愛知県名古屋市南区菊住１丁目７番10号 株式会社ハーネス総合技術研究所内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Jun Shioya 1-7-10 Kikuzumi, Minami-ku, Nagoya City, Aichi Prefecture Inside Harness Research Institute, Inc. (72) Inventor Atsuhiko Fujii 1-Kikuzumi, Minami-ku, Nagoya City, Aichi Prefecture No. 7-10 Inside Harness Research Institute
Claims (2)
接触を得る嵌合型接続端子であって、 前記雄部品または前記雌部品のうちの一方の母材の前記
嵌合による摺動部分に０．１μｍ〜０．３μｍの厚さの
錫めっきを施し、他方の母材の摺動部分に０．１μｍ以
上の厚さの錫めっきを施し、前記一方の母材および／ま
たは前記他方の母材と電線との圧着部分のうち少なくと
も圧着時において圧着金型と接触する面には０．５μｍ
〜２．０μｍの厚さの錫めっきを施すことを特徴とする
嵌合型接続端子。1. A mating connection terminal for obtaining electrical contact by mating a male part and a female part, wherein said male part or said female part slides by mating one of said base materials. The portion is plated with tin having a thickness of 0.1 μm to 0.3 μm, and the sliding portion of the other base material is plated with tin having a thickness of 0.1 μm or more, and the one base material and / or the other is plated. 0.5 μm on at least the surface of the crimped portion between the base material and the wire that comes into contact with the crimping mold at the time of crimping
A fitting-type connection terminal, which is provided with tin plating having a thickness of about 2.0 μm.
て、 前記一方の母材および／または前記他方の母材の前記圧
着部分のうち前記電線と圧着すべき面には０．５μｍ〜
２．０μｍの厚さの錫めっきを施すことを特徴とする嵌
合型接続端子。2. The fitting type connection terminal according to claim 1, wherein a surface of the one base material and / or the other base material to be crimped with the electric wire is not more than 0.5 μm.
A fitting-type connection terminal, which is provided with tin plating having a thickness of 2.0 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28578497A JP3701448B2 (en) | 1997-10-17 | 1997-10-17 | Mating type connection terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28578497A JP3701448B2 (en) | 1997-10-17 | 1997-10-17 | Mating type connection terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11121075A true JPH11121075A (en) | 1999-04-30 |
| JP3701448B2 JP3701448B2 (en) | 2005-09-28 |
Family
ID=17696033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28578497A Expired - Fee Related JP3701448B2 (en) | 1997-10-17 | 1997-10-17 | Mating type connection terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3701448B2 (en) |
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