JPH10302867A - Manufacture of connection terminal of fitting type - Google Patents
Manufacture of connection terminal of fitting typeInfo
- Publication number
- JPH10302867A JPH10302867A JP11089897A JP11089897A JPH10302867A JP H10302867 A JPH10302867 A JP H10302867A JP 11089897 A JP11089897 A JP 11089897A JP 11089897 A JP11089897 A JP 11089897A JP H10302867 A JPH10302867 A JP H10302867A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- tin plating
- plating layer
- fitting
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、自動車、産業機器
などの電気配線に用いられる嵌合型接続端子の製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a fitting type connection terminal used for electric wiring of automobiles, industrial equipment and the like.
【０００２】[0002]
【従来の技術】従来より、一般に、自動車、産業機器な
どの電気配線において電線同士の接続に用いられる嵌合
型接続端子には、錫めっきが施されてきた。これは、端
子の接続時に、錫めっきの表面酸化皮膜を摩擦によって
破壊し、新鮮な錫を凝着させることにより、低い接触抵
抗を安定して得ることを目的としたものである。2. Description of the Related Art Conventionally, fitting type connection terminals used for connecting electric wires in electric wiring of automobiles, industrial equipments and the like have been generally plated with tin. This is intended to stably obtain a low contact resistance by breaking the surface oxide film of the tin plating by friction at the time of connecting the terminals and adhering fresh tin.
【０００３】また、自動車のＡＢＳ（アンチロックブレ
ーキシステム）やエアバックなど、特に重要な信号回路
に用いられる電気配線には、接続端子に金めっきを施し
て使用していた。Further, the connection terminals have been plated with gold for the electrical wiring used in particularly important signal circuits such as ABS (anti-lock brake system) and airbag of automobiles.
【０００４】[0004]
【発明が解決しようとする課題】上記錫めっきの凝着
は、錫の硬度が低い（ビッカース硬度４０〜８０）こと
に起因するものである。しかし、錫の硬度が低いこと
は、接続時の挿入力を上昇させるという問題の原因とも
なっている。すなわち、端子の嵌合接続時には錫めっき
の凝着磨耗が発生し、錫の変形抵抗に逆らって嵌合させ
るため、挿入力が上昇することとなる。The adhesion of tin plating is caused by the low tin hardness (Vickers hardness: 40 to 80). However, the low hardness of tin causes a problem of increasing the insertion force at the time of connection. That is, when the terminals are fitted and connected, cohesive wear of the tin plating occurs, and the tin is fitted against the deformation resistance of the tin, so that the insertion force increases.
【０００５】ところで、自動車などの電気配線では複数
の電線の束（以下、「ワイヤーハーネス」と称する）を
１つのコネクタで接続するのが一般的であり、コネクタ
の接続に必要な力は、端子１個当たりの挿入力に電線の
本数（従来は、一般に１０極〜２０極）を乗じた値とし
て概算することができる。従って、端子１個当たりの挿
入力が高いと、コネクタの接続に必要な力はワイヤーハ
ーネスの電線数に応じた大きな値となる。By the way, in the electric wiring of an automobile or the like, a bundle of a plurality of electric wires (hereinafter, referred to as "wire harness") is generally connected by one connector, and a force required for connecting the connector is a terminal. It can be roughly estimated as a value obtained by multiplying the insertion force per unit by the number of electric wires (conventionally, generally 10 to 20 poles). Therefore, when the insertion force per terminal is high, the force required to connect the connector has a large value according to the number of wires of the wire harness.
【０００６】特に、近年のカーエレクトロニクスの著し
い進歩・発展は、自動車に搭載する電子機器やＣＰＵの
数を飛躍的に増加させ、それに伴ってワイヤーハーネス
の電線本数を増加し、コネクタの多極化（３０極〜４０
極）を図りたいとの要望も強まっている。In particular, the remarkable progress and development of car electronics in recent years has dramatically increased the number of electronic devices and CPUs mounted on automobiles, and accordingly, the number of electric wires in a wire harness has been increased, and the number of connectors has been increased (30). Pole to 40
There is also a growing demand for the ultimate goal.
【０００７】しかしながら、上述の如く、コネクタを多
極化すると当該コネクタの接続に必要な力も電線本数に
比例して上昇し、ボルトやてこなどの補助機構なしで
は、コネクタの接続ができなくなる。このため、端子を
小型化しても、補助機構がコネクタの小型化・軽量化を
阻害することとなる。However, as described above, when the connector is multipolarized, the force required for connecting the connector also increases in proportion to the number of electric wires, and the connector cannot be connected without an auxiliary mechanism such as a bolt or lever. For this reason, even if the terminal is miniaturized, the auxiliary mechanism hinders miniaturization and weight reduction of the connector.
【０００８】端子の挿入力を低減するには、接点圧力
（嵌合部で接点に与える押しつけ力）を低下させること
が考えられるが、この場合は、安定した低い接触抵抗が
得られなくなる。換言すれば、安定した接触抵抗を維持
したまま端子の挿入力を低下させることが困難であるた
め、コネクタを多極化する際に補助機構が不可欠とな
り、コネクタの小型化・軽量化を阻害する要因となって
いる。In order to reduce the terminal insertion force, it is conceivable to reduce the contact pressure (the pressing force applied to the contact at the fitting portion). However, in this case, a stable and low contact resistance cannot be obtained. In other words, since it is difficult to reduce the insertion force of the terminal while maintaining stable contact resistance, an auxiliary mechanism is indispensable when multi-polarizing the connector, which is a factor that hinders miniaturization and weight reduction of the connector. Has become.
【０００９】なお、接続端子に金めっきを使用すれば、
低い接点圧力でも低い接触抵抗が安定して得られるた
め、端子の挿入力を低くすることができ、コネクタを多
極化してもその接続に要する力が著しく上昇することは
ないが、金めっきは錫めっきに比較して数倍〜数十倍の
コストを要するため、特に多極化したコネクタには適し
ない。If gold plating is used for the connection terminal,
Even if the contact pressure is low, a low contact resistance can be obtained stably, so that the insertion force of the terminal can be reduced, and even if the connector is multi-pole, the force required for the connection does not increase significantly. Since it requires several times to several tens of times the cost as compared with plating, it is not particularly suitable for a multipolar connector.
【００１０】本発明は、上記課題に鑑みてなされたもの
であり、安定した接触抵抗を維持したまま端子の挿入力
を低下できる嵌合型接続端子の製造方法を提供すること
を目的とする。[0010] The present invention has been made in view of the above problems, and has as its object to provide a method of manufacturing a fitting-type connection terminal capable of reducing the insertion force of a terminal while maintaining stable contact resistance.
【００１１】[0011]
【課題を解決するための手段】上記課題を解決するた
め、請求項１の発明は、雄部品および雌部品の嵌合によ
って電気的接触を得る嵌合型接続端子の製造方法であっ
て、(a) 前記雄部品または前記雌部品のうち少なくとも
一方の銅母材の表面に錫めっき層を形成するめっき工程
と、(b) 前記錫めっき層が形成された前記銅母材に熱処
理を行って前記錫めっき層のうち前記銅母材との界面近
傍のみをＣｕ6Ｓｎ5に合金化する工程と、を備えてい
る。Means for Solving the Problems To solve the above problems, the invention of claim 1 is a method of manufacturing a fitting type connection terminal for obtaining electrical contact by fitting a male part and a female part, a) a plating step of forming a tin plating layer on the surface of at least one copper base material of the male component or the female component, and (b) performing a heat treatment on the copper base material on which the tin plating layer is formed. Alloying Cu 6 Sn 5 only in the vicinity of the interface with the copper base material in the tin plating layer.
【００１２】また、請求項２の発明は、請求項１の発明
に係る嵌合型接続端子の製造方法において、前記熱処理
を１５０℃以上１７０℃以下で行わせている。According to a second aspect of the present invention, in the method for manufacturing a fitting type connection terminal according to the first aspect of the present invention, the heat treatment is performed at 150 ° C. or more and 170 ° C. or less.
【００１３】また、請求項３の発明は、請求項１または
請求項２の発明に係る嵌合型接続端子の製造方法におい
て、前記雄部品または前記雌部品のうちの一方の前記嵌
合による摺動部分に０．１μｍ〜０．３μｍの厚さの錫
めっき層を残留させ、他方の前記嵌合による摺動部分に
０．１μｍ以上の厚さの錫めっき層を残留させている。According to a third aspect of the present invention, there is provided a method of manufacturing a fitting type connection terminal according to the first or second aspect of the invention, wherein one of the male part and the female part is slid by the fitting. A tin plating layer having a thickness of 0.1 μm to 0.3 μm remains on the moving portion, and a tin plating layer having a thickness of 0.1 μm or more remains on the other sliding portion formed by the fitting.
【００１４】[0014]
【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態について詳細に説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【００１５】Ａ．嵌合型接続端子の形態：図１は本発明
に係る製造方法によって製造された嵌合型接続端子の側
面図であり、また、図２は当該嵌合型接続端子の接続部
分の一部切欠平面図である。A. Form of Fitting Type Connection Terminal: FIG. 1 is a side view of the fitting type connecting terminal manufactured by the manufacturing method according to the present invention, and FIG. 2 is a partial cutout of a connecting portion of the fitting type connecting terminal. It is a top view.
【００１６】図示のように、本発明に係る嵌合型接続端
子は雄端子１０と雌端子２０とで構成されている。雄端
子１０は、電線との圧着部であるワイヤバレル１１と、
雌端子２０との嵌合部であるタブ１２とを形成してい
る。また、タブ１２の上面および下面は平滑な摺動面と
している。As shown, the fitting connection terminal according to the present invention comprises a male terminal 10 and a female terminal 20. The male terminal 10 has a wire barrel 11 which is a crimping part for an electric wire,
A tab 12 which is a fitting portion with the female terminal 20 is formed. The upper and lower surfaces of the tab 12 are smooth sliding surfaces.
【００１７】雌端子２０は、電線との圧着部であるワイ
ヤバレル２４と、雄端子１０との嵌合部２５とを形成し
ている。嵌合部２５は、中空の箱形状であり、舌片２
１、エンボス２２およびビード２３とをその内部に備え
ている。なお、図２は、嵌合部２５の内部を示した一部
切欠平面図である。The female terminal 20 forms a wire barrel 24 which is a crimping part for the electric wire and a fitting part 25 for the male terminal 10. The fitting portion 25 has a hollow box shape,
1, an emboss 22 and a bead 23 are provided therein. FIG. 2 is a partially cutaway plan view showing the inside of the fitting portion 25.
【００１８】エンボス２２は、舌片２１の上部に設けら
れた凸状の部材であり、雄端子１０との嵌合時には、タ
ブ１２の摺動面と点接触する。舌片２１は、接点圧力す
なわちエンボス２２をタブ１２に押しつける圧力を作用
させるバネとしての機能を有している。また、ビード２
３も凸状の部材であり、タブ１２とエンボス２２が接触
する面と反対側の摺動面で接触し、当該エンボス２２が
タブ１２に及ぼす接点圧力を受ける。The embossing 22 is a convex member provided on the upper portion of the tongue piece 21 and comes into point contact with the sliding surface of the tab 12 when the male terminal 10 is fitted. The tongue piece 21 has a function as a spring for applying a contact pressure, that is, a pressure for pressing the emboss 22 against the tab 12. Also bead 2
Reference numeral 3 also denotes a convex member, which comes into contact with the sliding surface opposite to the surface where the tab 12 and the emboss 22 come into contact, and receives the contact pressure exerted on the tab 12 by the emboss 22.
【００１９】雄端子１０を雌端子２０に嵌合させる際に
は、タブ１２をエンボス２２とビード２３との間隙に挿
入する。そして、このときにタブ１２の上下面のうちの
一方はエンボス２２と、他方はビード２３と摺動する。
エンボス２２はタブ１２と点接触しているため、エンボ
ス２２の摺動部分は点であり、また、タブ１２の摺動部
分は線である。また、ビード２３についてはタブ１２と
の接触部分がそのまま摺動部分となり、タブ１２側の摺
動部分は上記同様線となる。When fitting the male terminal 10 to the female terminal 20, the tab 12 is inserted into the gap between the emboss 22 and the bead 23. At this time, one of the upper and lower surfaces of the tab 12 slides on the emboss 22 and the other slides on the bead 23.
Since the emboss 22 is in point contact with the tab 12, the sliding portion of the emboss 22 is a point, and the sliding portion of the tab 12 is a line. In the bead 23, the portion in contact with the tab 12 becomes a sliding portion as it is, and the sliding portion on the tab 12 side is a line as described above.
【００２０】Ｂ．嵌合型接続端子の製造方法：次に、嵌
合型接続端子の製造方法について説明する。本実施形態
における嵌合型接続端子は、まず板状の条材に錫めっき
処理を行った後、その条材を上記形態に加工し、さらに
加工後の端子に熱処理を施して嵌合型接続端子を製造す
る。B. Manufacturing method of fitting type connection terminal: Next, a manufacturing method of the fitting type connection terminal will be described. The mating connection terminal in the present embodiment is formed by first tin-plating a plate-shaped strip, then processing the strip into the above-described form, and further performing a heat treatment on the processed terminal to form a mated connection. Manufacture terminals.
【００２１】Ｂ−１．錫めっき工程：まず、錫めっき層
の密着性を高めるため板状の条材表面の洗浄や酸化皮膜
の除去などの前処理を行う。そして、次に、条材の表面
に錫めっき処理を施し、錫めっき層を形成する。本実施
形態では、このときの錫めっき層の厚さを１．０μｍと
している。B-1. Tin plating step: First, in order to enhance the adhesion of the tin plating layer, a pretreatment such as cleaning the surface of the plate-shaped strip or removing an oxide film is performed. Then, a tin plating process is performed on the surface of the strip material to form a tin plating layer. In this embodiment, the thickness of the tin plating layer at this time is 1.0 μm.
【００２２】錫めっき処理後、条材を加工して図１およ
び図２に示すような形態の雄端子１０および雌端子２０
に成形する。熱処理前に成形加工を行うのは、後述する
ように熱処理後は錫めっき層の一部が金属間化合物に合
金化されて硬化し、成形性が劣化するからである。After the tin plating process, the strip material is processed to form the male terminal 10 and the female terminal 20 in the form shown in FIGS.
Mold into The reason why the shaping is performed before the heat treatment is that, as described later, after the heat treatment, a part of the tin plating layer is alloyed with the intermetallic compound and hardens, thereby deteriorating the formability.
【００２３】Ｂ−２．熱処理工程：次に、成形後の端子
の熱処理を行う。熱処理時の錫めっき層の変化について
図３を用いて説明する。B-2. Heat treatment step: Next, heat treatment of the molded terminal is performed. The change of the tin plating layer during the heat treatment will be described with reference to FIG.
【００２４】熱処理前においては、図３（ａ）に示す如
く、銅の母材１の表面に錫めっき層２が形成された状態
となっている。そして、この状態で１５０℃以上１７０
℃以下の温度条件において熱処理を施す。錫中における
銅の拡散係数は常温においても比較的大きいが、１５０
℃〜１７０℃の温度条件ではさらに大きくなり、銅は錫
中を容易に拡散して錫めっき層２が母材１との界面近傍
から順にＣｕ6Ｓｎ5層３に変換され、合金化が促進され
る（図３（ｂ）の状態）。ここで、熱処理の温度条件を
１５０℃以上１７０℃以下にしているのは、１５０℃未
満では錫中における銅の拡散速度が著しく遅く合金化に
長時間を要し、また１７０℃より大きいと錫めっき層２
がＣｕ3Ｓｎに変換されるからである。Before the heat treatment, as shown in FIG. 3A, a state is formed in which a tin plating layer 2 is formed on the surface of a copper base material 1. In this state, the temperature is 150 ° C. or more and 170
Heat treatment is performed under a temperature condition of not more than ℃. The diffusion coefficient of copper in tin is relatively large even at room temperature,
Under the temperature condition of from 170 ° C. to 170 ° C., the copper is further diffused in the tin, and the tin plating layer 2 is converted into the Cu 6 Sn 5 layer 3 sequentially from the vicinity of the interface with the base material 1 to promote alloying. (The state of FIG. 3B). Here, the reason why the temperature condition of the heat treatment is set to 150 ° C. or more and 170 ° C. or less is that when the temperature is lower than 150 ° C., the diffusion rate of copper in tin is extremely slow, and a long time is required for alloying. Plating layer 2
Is converted to Cu 3 Sn.
【００２５】金属間化合物Ｃｕ3Ｓｎは１７０℃よりも
大きい温度領域では、金属間化合物Ｃｕ6Ｓｎ5よりも安
定して成長するのであるが、この金属間化合物Ｃｕ3Ｓ
ｎ層４は柱状に成長し、やがてその先端が錫めっき層２
の表面に現出する（図３（ｃ）の状態）。このような状
態になると、錫めっき層２の表面の凹凸が激しくなるた
め、端子の接触抵抗が上昇する。また、錫めっき層２の
表面では異種金属が接触した状態となるため腐食が進行
しやすくなり、耐食性が低下する。Although the intermetallic compound Cu 3 Sn grows more stably than the intermetallic compound Cu 6 Sn 5 in a temperature range higher than 170 ° C., this intermetallic compound Cu 3 Sn
The n-layer 4 grows in a columnar shape, and the tip ends up with the tin plating layer 2.
(FIG. 3 (c)). In such a state, the unevenness of the surface of the tin plating layer 2 becomes severe, so that the contact resistance of the terminal increases. Further, since the dissimilar metals are brought into contact with each other on the surface of the tin plating layer 2, corrosion easily progresses, and corrosion resistance decreases.
【００２６】これに対して、Ｃｕ6Ｓｎ5層３は錫めっき
層２の表面と平行に均一に成長するため、錫めっき層２
の表面が凹凸になることもなく、また、錫めっき層２の
表面は純錫のみであるため耐食性が低下することもな
い。On the other hand, since the Cu 6 Sn 5 layer 3 grows uniformly in parallel with the surface of the tin plating layer 2,
Does not become uneven, and since the surface of the tin plating layer 2 is made of pure tin only, the corrosion resistance does not decrease.
【００２７】熱処理中、金属間化合物Ｃｕ6Ｓｎ5層３は
時間とともに成長し、それに従って残留錫めっき層２の
厚さが薄くなる。錫めっき層２が完全に金属間化合物Ｃ
ｕ6Ｓｎ5層３に変化すると、当該金属間化合物Ｃｕ6Ｓ
ｎ5層３は硬度が高いため、端子の接触抵抗が高くなる
こともある。そこで、本実施形態では、熱処理温度と時
間とを調節して錫めっき層２を残留させるとともに、端
子挿入力の低下を目的としてその残留厚さを制御してい
る。以下この技術について説明する。During the heat treatment, the intermetallic compound Cu 6 Sn 5 layer 3 grows with time, and accordingly the thickness of the residual tin plating layer 2 decreases. Tin plating layer 2 is completely intermetallic compound C
When changed to the u 6 Sn 5 layer 3, the intermetallic compound Cu 6 S
n 5-layer 3 is high hardness, also the contact resistance of the terminal becomes high. Therefore, in the present embodiment, the tin plating layer 2 is left by adjusting the heat treatment temperature and time, and the remaining thickness is controlled for the purpose of reducing the terminal insertion force. Hereinafter, this technique will be described.
【００２８】Ｂ−３．残留錫めっき層の厚さ制御：残留
錫めっき層２の厚さ制御は、主として端子の挿入力低下
の観点から行われる。すなわち、安定して低い接触抵抗
を得るためには錫めっき層２を残留させる必要がある
が、当該錫めっき層２が厚いと既述したように錫の凝着
に起因して挿入力が上昇する。B-3. Control of the thickness of the residual tin plating layer: The thickness of the residual tin plating layer 2 is controlled mainly from the viewpoint of reducing the insertion force of the terminal. That is, in order to stably obtain a low contact resistance, the tin plating layer 2 needs to be left, but if the tin plating layer 2 is thick, the insertion force increases due to the adhesion of tin as described above. I do.
【００２９】そこで本実施形態においては、錫めっき層
２を厚さ０．１μｍ〜１．０μｍの範囲内で残留させる
ことによって端子の接触部分の見かけの硬度を高くし、
挿入力を低減させている。このことを以下に示す実験結
果を使用して説明する。Therefore, in the present embodiment, the apparent hardness of the contact portion of the terminal is increased by leaving the tin plating layer 2 within the range of 0.1 μm to 1.0 μm,
The insertion force has been reduced. This will be described using the experimental results shown below.
【００３０】実験は、雄端子１０および雌端子２０の残
留錫めっき層２の厚さをそれぞれ０．１μｍ〜１．０μ
ｍまで変化させ、当該雄端子１０を雌端子２０に嵌合さ
せるときの挿入力を測定して行った。次の表１はその実
験結果である。In the experiment, the thickness of the residual tin plating layer 2 of the male terminal 10 and the female terminal 20 was set to 0.1 μm to 1.0 μm, respectively.
m, and the insertion force when the male terminal 10 was fitted to the female terminal 20 was measured. Table 1 below shows the experimental results.
【００３１】[0031]
【表１】 [Table 1]
【００３２】従来における端子への錫めっき厚さを１．
０μｍとすると、端子挿入力は０．７４ｋｇｆである。
以下、この従来の挿入力を基準値として説明を続ける。Conventionally, the thickness of tin plating on a terminal is set to 1.
Assuming 0 μm, the terminal insertion force is 0.74 kgf.
Hereinafter, the description will be continued using the conventional insertion force as a reference value.
【００３３】実験結果が示すように、雄端子１０または
雌端子２０のうちの一方の錫めっき層２の厚さを０．１
μｍ〜０．３μｍとし、他方の錫めっき層２の厚さを
０．１μｍ以上とすると、基準値と比較して挿入力を少
なくとも１０％以上低減（０．６７ｋｇｆ以下）でき
る。これは、錫めっき層２が薄くなるにしたがって、金
属間化合物Ｃｕ6Ｓｎ5層３の硬度が端子の硬度に影響す
るようになり、端子の見かけの硬度が高くなる。そし
て、端子の見かけの硬度が高くなることによって、錫め
っきの凝着が抑制され、挿入力が低くなったものであ
る。As shown by the experimental results, the thickness of the tin plating layer 2 of one of the male terminal 10 and the female terminal 20 was set to 0.1
When the thickness is set to μm to 0.3 μm and the thickness of the other tin plating layer 2 is set to 0.1 μm or more, the insertion force can be reduced by at least 10% or more (0.67 kgf or less) as compared with the reference value. That is, as the tin plating layer 2 becomes thinner, the hardness of the intermetallic compound Cu 6 Sn 5 layer 3 affects the hardness of the terminal, and the apparent hardness of the terminal increases. Then, by increasing the apparent hardness of the terminal, adhesion of tin plating was suppressed, and the insertion force was reduced.
【００３４】また、発明者等は、錫めっき層２の厚さが
０．１μｍ以上あれば、耐食性および接触抵抗について
端子に要求される条件を満たすことを実験によって確認
している。Further, the inventors have confirmed by experiments that the tin plating layer 2 having a thickness of 0.1 μm or more satisfies the requirements for the terminal in terms of corrosion resistance and contact resistance.
【００３５】従って、必要な挿入力低減効果を得るため
には、雄端子１０および雌端子２０の錫めっき層２を所
定の厚さだけ残留させるように熱処理の温度および時間
を制御すればよい。以下、一例として、雌端子２０の錫
めっき層２の厚さを１．０μｍとしたとき（雌端子２０
についてはめっき処理のままで熱処理を行わない）に、
雄端子１０の熱処理条件を変化させて所定の厚さの錫め
っき層２を残留させ、必要な挿入力低減効果を得る手法
について説明する。Therefore, in order to obtain the necessary effect of reducing the insertion force, the temperature and time of the heat treatment may be controlled so that the tin plating layer 2 of the male terminal 10 and the female terminal 20 remains at a predetermined thickness. Hereinafter, as an example, when the thickness of the tin plating layer 2 of the female terminal 20 is 1.0 μm (the female terminal 20)
Is not subjected to heat treatment while plating)
A method of changing the heat treatment conditions of the male terminal 10 so that the tin plating layer 2 having a predetermined thickness remains to obtain a necessary effect of reducing the insertion force will be described.
【００３６】図４は、雌端子２０の錫めっき層２の厚さ
を１．０μｍとしたときの、雄端子１０の残留錫めっき
層２の厚さと端子挿入力との相関を示す図である。な
お、この図は表１の結果の一部を示したものである。FIG. 4 is a diagram showing the correlation between the thickness of the residual tin-plated layer 2 of the male terminal 10 and the terminal insertion force when the thickness of the tin-plated layer 2 of the female terminal 20 is 1.0 μm. . This figure shows a part of the results shown in Table 1.
【００３７】図４より、端子挿入力を１０％低減するた
めには雄端子１０の錫めっき層２の厚さを０．４０μ
ｍ、また、２０％低減するためには０．２３μｍ、３０
％低減するためには０．１６μｍそれぞれ残留させれば
よいことが分かる。As shown in FIG. 4, in order to reduce the terminal insertion force by 10%, the thickness of the tin plating layer 2 of the male terminal 10 is set to 0.40 μm.
m, and 0.23 μm, 30
It can be seen that it is sufficient to leave each of them 0.16 μm in order to reduce%.
【００３８】次に、図５は、熱処理時間と残留錫めっき
層２の厚さとの相関を示す図である。なお、この図は初
期の錫めっき層２の厚さを１．０μｍとして予め行った
実験から求められた結果である。Next, FIG. 5 is a diagram showing a correlation between the heat treatment time and the thickness of the residual tin plating layer 2. This figure is a result obtained from an experiment conducted in advance with the initial thickness of the tin plating layer 2 being 1.0 μm.
【００３９】図５によれば、雄端子１０の残留錫めっき
層２の厚さを０．４０μｍに（端子挿入力を１０％低
減）するためには、温度１５０℃で２．７時間、温度１
６０℃では１．６時間、温度１７０℃では０．８時間そ
れぞれ熱処理を行えばよい。また、雄端子１０の残留錫
めっき層２の厚さを０．２３μｍに（端子挿入力を２０
％低減）するためには、温度１６０℃で３．８時間、温
度１７０℃で２時間熱処理を行えばよい。さらに、雄端
子１０の残留錫めっき層２の厚さを０．１６μｍに（端
子挿入力を３０％低減）するためには、温度１７０℃で
３．５時間熱処理を行えばよい。According to FIG. 5, in order to reduce the thickness of the residual tin plating layer 2 of the male terminal 10 to 0.40 μm (reducing the terminal insertion force by 10%), the temperature was set at 150 ° C. for 2.7 hours. 1
The heat treatment may be performed for 1.6 hours at 60 ° C. and 0.8 hours at 170 ° C. Further, the thickness of the residual tin plating layer 2 of the male terminal 10 was reduced to 0.23 μm (the terminal insertion force was reduced to 20 μm).
% Reduction), heat treatment may be performed at a temperature of 160 ° C. for 3.8 hours and at a temperature of 170 ° C. for 2 hours. Further, in order to reduce the thickness of the residual tin plating layer 2 of the male terminal 10 to 0.16 μm (reducing the terminal insertion force by 30%), heat treatment may be performed at a temperature of 170 ° C. for 3.5 hours.
【００４０】なお、上記熱処理パターンは一例であり、
雄端子１０または雌端子２０のうちの一方または両方に
ついて同様の熱処理を行い、所定の錫めっき層２の厚さ
を残留させるようにして、必要な挿入力低減効果を得れ
ばよい。The above heat treatment pattern is an example,
A similar heat treatment may be performed on one or both of the male terminal 10 and the female terminal 20 so that a predetermined thickness of the tin-plated layer 2 remains to obtain a necessary effect of reducing the insertion force.
【００４１】以上、本発明の実施の形態について説明し
たが、この発明は上記の例に限定されるものではなく、
例えば、初期の錫めっき層２の厚さを１．０μｍ以上と
してもよい。勿論、初期の錫めっき層２の厚さが１．０
μｍ以上の場合は、図５の相関関係が異なるため、それ
に応じた熱処理時間とする必要がある。Although the embodiment of the present invention has been described above, the present invention is not limited to the above example.
For example, the thickness of the initial tin plating layer 2 may be 1.0 μm or more. Of course, if the initial thickness of the tin plating layer 2 is 1.0
In the case of μm or more, since the correlation shown in FIG. 5 is different, it is necessary to set the heat treatment time accordingly.
【００４２】また、雄端子１０および雌端子２０の形態
も図１および図２に記載した形態に限定されるものでは
なく、雄端子および雌端子の嵌合によって電気的接触を
得る嵌合型接続端子であればよい。Further, the form of the male terminal 10 and the female terminal 20 is not limited to the form shown in FIGS. 1 and 2, and the fitting type connection for obtaining electrical contact by fitting the male terminal and the female terminal. Any terminal is acceptable.
【００４３】さらに、雄端子１０および雌端子２０の摺
動部分にのみ錫めっき層２を形成した後、熱処理を行え
ば、当該摺動部分については上記の効果が得られ、摺動
部分以外については金属間化合物が形成されないため、
加工性が低下するのを防止することができる。Further, if the tin plating layer 2 is formed only on the sliding portion of the male terminal 10 and the female terminal 20 and then heat treatment is performed, the above effect is obtained for the sliding portion. Does not form intermetallic compounds,
It is possible to prevent the workability from decreasing.
【００４４】[0044]
【発明の効果】以上説明したように、請求項１の発明に
よれば、雄部品または雌部品のうち少なくとも一方の銅
母材の表面に錫めっき層を形成するめっき工程と、錫め
っき層が形成された銅母材に熱処理を行って錫めっき層
のうち銅母材との界面近傍のみをＣｕ6Ｓｎ5に合金化す
る熱処理工程と、を備えているため、厚さの薄い錫めっ
き層を残留させることができ、安定した接触抵抗を維持
したまま端子の挿入力を低下することができる。As described above, according to the first aspect of the present invention, a plating step of forming a tin plating layer on the surface of at least one of the male and female parts of the copper base material, A heat treatment step of heat-treating the formed copper base material to alloy only the vicinity of the interface with the copper base material into Cu 6 Sn 5 in the tin plating layer is provided, and thus the tin plating layer having a small thickness is provided. Can be left, and the insertion force of the terminal can be reduced while maintaining stable contact resistance.
【００４５】また、請求項２の発明によれば、熱処理を
１５０℃以上１７０℃以下で行っているため、Ｃｕ6Ｓ
ｎ5を安定して成長させることができる。According to the second aspect of the present invention, since the heat treatment is performed at 150 ° C. or more and 170 ° C. or less, Cu 6 S
n 5 and can be grown stably.
【００４６】また、請求項３の発明によれば、雄部品ま
たは雌部品のうちの一方の嵌合による摺動部分に０．１
μｍ〜０．３μｍの厚さの錫めっき層を残留させ、他方
の嵌合による摺動部分に０．１μｍ以上の厚さの錫めっ
き層を残留させているため、従来と比較して挿入力を少
なくとも１０％以上低減することができる。According to the third aspect of the present invention, the sliding part formed by fitting one of the male part and the female part is 0.1%.
Since the tin plating layer having a thickness of 0.3 μm to 0.3 μm remains, and the tin plating layer having a thickness of 0.1 μm or more remains on the sliding portion formed by the other fitting, the insertion force is lower than in the conventional case. Can be reduced by at least 10% or more.
【図１】本発明に係る製造方法によって製造された嵌合
型接続端子の側面図である。FIG. 1 is a side view of a fitting connection terminal manufactured by a manufacturing method according to the present invention.
【図２】図１の嵌合型接続端子の接続部分の一部切欠平
面図である。FIG. 2 is a partially cutaway plan view of a connection portion of the fitting type connection terminal of FIG. 1;
【図３】熱処理時の錫めっき層の変化を説明するための
図である。FIG. 3 is a diagram for explaining a change in a tin plating layer during heat treatment.
【図４】雄端子の残留錫めっき層の厚さと端子挿入力と
の相関を示す図である。FIG. 4 is a diagram showing a correlation between the thickness of a residual tin plating layer of a male terminal and a terminal insertion force.
【図５】熱処理時間と残留錫めっき層の厚さとの相関を
示す図である。FIG. 5 is a diagram showing a correlation between a heat treatment time and a thickness of a residual tin plating layer.
１０ 雄端子 １２ タブ ２０ 雌端子 ２１ 舌片 ２２ エンボス ２３ ビード ２５ 嵌合部 DESCRIPTION OF SYMBOLS 10 Male terminal 12 Tab 20 Female terminal 21 Tongue piece 22 Emboss 23 Bead 25 Fitting part
───────────────────────────────────────────────────── フロントページの続き (72)発明者 藤井 淳彦 愛知県名古屋市南区菊住１丁目７番10号 株式会社ハーネス総合技術研究所内 (72)発明者 中村 篤 三重県四日市市西末広町１番14号 住友電 装株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Atsuhiko Fujii 1-7-10 Kikuzumi, Minami-ku, Nagoya City, Aichi Prefecture Inside Harness Research Institute (72) Inventor Atsushi Nakamura 1st Nishi-Suehirocho, Yokkaichi City, Mie Prefecture No. 14 Sumitomo Wiring Systems, Ltd.
Claims (3)
的接触を得る嵌合型接続端子の製造方法であって、 (a) 前記雄部品または前記雌部品のうち少なくとも一方
の銅母材の表面に錫めっき層を形成するめっき工程と、 (b) 前記錫めっき層が形成された前記銅母材に熱処理を
行って前記錫めっき層のうち前記銅母材との界面近傍の
みをＣｕ6Ｓｎ5に合金化する熱処理工程と、を備えるこ
とを特徴とする嵌合型接続端子の製造方法。1. A method of manufacturing a fitting connection terminal for obtaining electrical contact by fitting a male component and a female component, comprising: (a) forming a copper base material of at least one of the male component and the female component; A plating step of forming a tin plating layer on the surface; and (b) performing a heat treatment on the copper base material on which the tin plating layer has been formed, so that only the vicinity of the interface between the tin plating layer and the copper base material is Cu 6 method for producing a fitting-type connection terminal, characterized in that it comprises a heat treatment step of alloying the sn 5.
法において、 前記熱処理は１５０℃以上１７０℃以下で行うことを特
徴とする嵌合型接続端子の製造方法。2. The method for manufacturing a fitting-type connection terminal according to claim 1, wherein the heat treatment is performed at 150 ° C. or more and 170 ° C. or less.
続端子の製造方法において、 前記熱処理工程は、前記雄部品または前記雌部品のうち
の一方の前記嵌合による摺動部分に０．１μｍ〜０．３
μｍの厚さの錫めっき層を残留させ、他方の前記嵌合に
よる摺動部分に０．１μｍ以上の厚さの錫めっき層を残
留させる工程を含むことを特徴とする嵌合型接続端子の
製造方法。3. The method for manufacturing a fitting-type connection terminal according to claim 1, wherein the heat-treating step is performed by setting a sliding portion of one of the male part or the female part by the fitting. .1 μm to 0.3
a tin-plated layer having a thickness of 0.1 μm or more on the other sliding portion formed by the fitting. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11089897A JPH10302867A (en) | 1997-04-28 | 1997-04-28 | Manufacture of connection terminal of fitting type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11089897A JPH10302867A (en) | 1997-04-28 | 1997-04-28 | Manufacture of connection terminal of fitting type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10302867A true JPH10302867A (en) | 1998-11-13 |
Family
ID=14547487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11089897A Pending JPH10302867A (en) | 1997-04-28 | 1997-04-28 | Manufacture of connection terminal of fitting type |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10302867A (en) |
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