WO2015172600A1 - 扬声器模组 - Google Patents

扬声器模组 Download PDF

Info

Publication number
WO2015172600A1
WO2015172600A1 PCT/CN2015/073767 CN2015073767W WO2015172600A1 WO 2015172600 A1 WO2015172600 A1 WO 2015172600A1 CN 2015073767 W CN2015073767 W CN 2015073767W WO 2015172600 A1 WO2015172600 A1 WO 2015172600A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive structure
casing
housing
module
speaker module
Prior art date
Application number
PCT/CN2015/073767
Other languages
English (en)
French (fr)
Inventor
孙洪超
孙野
Original Assignee
歌尔声学股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔声学股份有限公司 filed Critical 歌尔声学股份有限公司
Priority to US15/300,085 priority Critical patent/US9756443B2/en
Priority to KR1020167030689A priority patent/KR101748344B1/ko
Publication of WO2015172600A1 publication Critical patent/WO2015172600A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the invention relates to the technical field of electroacoustic products, and in particular to a speaker module.
  • the speaker module is an important acoustic component in the electronic terminal that converts electrical energy into acoustic energy.
  • the existing speaker module includes a casing, the cavity formed by the casing houses a micro-speaker unit, and an FPCB for electrically connecting the speaker unit and the external circuit of the module (ie, the circuit in the electronic terminal).
  • Flexible Printed Circuit Board flexible printed circuit board.
  • One end of the FPCB is electrically connected to the speaker unit by soldering, and the other end is electrically connected to the circuit board connection terminal of the electronic terminal through the pad, thereby implementing a conduction circuit between the speaker unit and the electronic terminal circuit.
  • the FPCB is made of flexible material, which is prone to failures such as wire breakage and deformation, which makes the conduction circuit unstable.
  • the technician needs to reinforce the FPCB in order to avoid FPCB failure, which increases the difficulty of production of the speaker module.
  • the reinforcing plate needs to be affixed on the back of the FPCB to increase the mechanical strength, and the assembly process of the module is increased, which complicates the assembly process of the module;
  • the technical problem to be solved by the present invention is to provide a speaker module, which has high stability of a conduction circuit between a speaker unit and a terminal circuit, and has a simple module structure, an easy assembly process, and production efficiency. high.
  • the technical solution of the present invention is:
  • the housing includes a speaker unit, the speaker unit is provided with a spring piece, and the housing is provided with a conductive structure electrically connected to the elastic piece, and the conductive structure and the housing of the housing.
  • the surface of the conductive structure is electrically connected to the end plate of the module, and the other end of the conductive structure is electrically connected to the terminal circuit outside the cavity of the module, the conductive structure Made of metal .
  • the outer casing includes at least two shells joined together, the conductive structure being attached to a side surface of one of the shells adjacent to the inner cavity of the module; the housing provided with the conductive structure is Plastic material, One side edge is provided with an outwardly extending extension portion, and a portion of the conductive structure outside the cavity of the module is attached to the extension portion.
  • the side wall of the casing provided with the conductive structure on the side where the extension portion is provided is an inclined plane.
  • the conductive structure is a metal line formed on the surface of the second casing by an LDS process.
  • the conductive structure is a metal patch mounted on the surface of the second shell.
  • the metal patch is attached to the surface of the second shell by an adhesive.
  • the metal patch is mounted on the surface of the second casing by a hot melt process.
  • the conductive structure is a metal foil injection molded on the surface of the second casing.
  • the conductive structure is a metal coating printed on the surface of the second casing.
  • the outer casing includes a first casing and a second casing that are coupled together, and the electrically conductive structure is disposed on the second casing.
  • the outer casing includes a first housing, a second housing, and a third housing that are coupled together, and the conductive structure is disposed on the third housing.
  • the speaker module comprises a casing, the speaker body is accommodated therein, the speaker unit is provided with a spring piece, and the outer casing is provided with a conductive structure electrically connected at one end to the elastic piece, and the conductive structure is matched with the shell surface of the outer casing, and the conductive structure is The other end is electrically connected to the terminal circuit, and the conductive structure is made of metal.
  • the conductive structure of metal material has greater mechanical strength and is not easy to be deformed or broken. Therefore, it is not necessary to add reinforcing plate to increase mechanical strength, and it is not necessary to provide multiple positioning columns on the outer casing to ensure welding and extraction precision.
  • the conductive structure is attached to the surface of the casing, and when the casing is sealed, it is not necessary to apply glue around the outlet, which further simplifies the assembly process of the module.
  • the present invention solves the technical problem that the conductive circuit of the speaker module is unstable and the assembly process is complicated in the prior art; the speaker module of the invention has the advantages of high stability of the conductive path, simple structure, simple assembly process, and the like. .
  • FIG. 1 is a perspective exploded structural view of a speaker module of the present invention
  • Figure 2 is a combination view of Figure 1;
  • FIG. 3 is a schematic cross-sectional structural view of a speaker module of the present invention.
  • first housing 12, sound hole, 20, second housing, 22, conductive structure, 24, extension, 30, speaker unit, 40, shrapnel.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • a speaker module for mounting in an electronic terminal includes a first housing that is coupled together 10 and the second housing 20, the space enclosed by the first housing 10 and the second housing 20
  • the speaker unit 30 is housed, and the speaker unit 30 includes a vibration system and a magnetic circuit system (not shown).
  • the first housing 10 is adjacent to the vibration system, and the first housing 10 is provided with a sound hole 12, and the second housing The body is close to the magnetic circuit system.
  • the first housing 10 and the second housing 20 are both plastic housings.
  • the speaker unit 30 is provided with two elastic pieces 40
  • the second housing 20 is provided with two conductive structures 22
  • the conductive structure 22 is a sheet metal material.
  • One end of the elastic piece 40 is electrically connected to a voice coil (not shown) in the speaker unit 30, and the other end of the elastic piece 40 is electrically connected to the conductive structure 22, and the two elastic pieces 40 are electrically connected to the corresponding conductive structures 22, respectively.
  • the conductive structure 22 is attached to the surface of the second housing 20 on the side close to the first housing 10.
  • One side edge of the second housing 20 is provided with an outwardly extending extension portion 24, and a portion of the conductive structure 22 outside the module cavity is attached to the extension portion 24.
  • the conductive structure 22 is electrically connected to the elastic piece 40 at one end of the inner cavity of the module, and the conductive structure 22 is electrically connected to the terminal circuit at one end of the outer cavity of the module.
  • the conductive structure 22 of metal material has greater mechanical strength than the FPCB.
  • the conductive structure 22 is attached to the surface of the second casing 20, There is no need to apply glue around the outlet when sealing between the shells, so the conductive structure of the metal material not only simplifies the structure of the module housing, but also reduces the assembly process of the module, thereby simplifying the assembly of the module. Process , reducing the difficulty of assembly and improving production efficiency.
  • the sidewall of the second housing 20 on the side of the extension portion 24 is an inclined plane, and the conductive structure 22 extends from the inner cavity of the module to the module along the sidewall. Inclined plane
  • the sidewalls are more advantageous for the bonding of the conductive structures 22 than the other three planar flat sidewalls, and the processing is less difficult.
  • the conductive structure 22 is attached to the surface of the second housing 20 in several ways:
  • the conductive structure 22 is LDS (laser Direct Structuring) , laser direct structuring technology)
  • the conductive structure 22 is a metal patch mounted on the surface of the second casing 20.
  • the metal patch may be adhered to the surface of the second casing 20 by adhesive; a hot-melt column may also be disposed on the second casing 20. , set on the metal patch to fit the hot melt column The hot melt hole is then mounted on the surface of the second casing 20 by a hot melt process.
  • the hot melt bonding method is slightly more complicated than the glue bonding method, but the conductive structure is 22 is more firmly bonded to the surface of the second casing 20.
  • the conductive structure 22 is a metal foil bonded to the surface of the second casing 20 by an injection molding process.
  • the conductive structure 22 is a metal coating printed on the surface of the second housing 20.
  • the present invention is preferably made of copper foil in terms of cost, electrical conductivity, and weight.
  • the names of the first housing and the second housing involved in this embodiment are only for distinguishing technical features. Does not represent the positional relationship and installation order between the two.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • This embodiment is basically the same as the first embodiment, and the difference is that:
  • the housing of the speaker module includes a first housing, a second housing and a third housing that are coupled together, wherein the second housing is an annular housing, and the first housing and the third housing are respectively coupled to the second housing Both ends of the housing.
  • the sound hole of the speaker module is disposed on the first casing, the first casing is adjacent to the vibration system of the speaker unit, the third casing is adjacent to the magnetic circuit system of the speaker unit, and the conductive structure is disposed on the third casing.
  • the names of the first housing, the second housing, and the third housing involved in this embodiment are only for distinguishing technical features. Does not represent the positional relationship and installation order between the three.
  • the present invention has been described in detail by taking the speaker module shown in the drawings as an example. This does not mean that the scope of protection of the present invention is limited to the speaker module of this structure, in practice in plastic.
  • the technical solution of the metal conductive structure on the module shell of the material to replace the FPCB can be applied to the speaker module of any structure, so Is the speaker module rectangular, circular or racetrack? Regardless of the structure of the housing of the speaker module and the internal speaker unit, as long as the metal conductive structure is attached to the surface of the module housing and the FPCB is used instead of the speaker unit and the terminal circuit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

一种扬声器模组，涉及电声产品技术领域，包括外壳（10、20），所述外壳（10、20）内收容有扬声器单体（30），所述扬声器单体（30）上设有弹片（40），所述外壳（10、20）上设有与所述弹片（40）电连接的导电结构（22），所述导电结构（22）与所述外壳（10、20）的壳体表面相贴合，所述导电结构（22）的一端位于模组内腔中与所述弹片（40）电连接，所述导电结构（22）的另一端位于所述模组内腔的外部与终端电路电连接，所述导电结构（22）为金属材质。所述扬声器模组具有导电通路稳定性高，结构简单，组装工艺简便易行等优点，解决了现有技术中扬声器模组导电通路不稳定，组装工艺复杂的技术问题。

Description

扬声器模组 技术领域
本发明涉及电声产品技术领域，特别涉及一种扬声器模组 。
发明背景
扬声器模组是电子终端中的重要声学部件，可以将电能转换为声能辐射出去。现有的扬声器模组包括外壳，外壳构成的腔体内收容有微型扬声器单体，以及用于电连接扬声器单体与模组外部电路（即电子终端中的电路）的FPCB（ Flexible Printed Circuit Board ，柔性印刷电路板）。FPCB的一端通过焊接与扬声器单体电连接，另一端通过焊盘与电子终端的电路板连接端子电连接，从而实现扬声器单体与电子终端电路之间的导通电路。由于 FPCB为柔性材料制得，易发生断线、变形等失效情形，使得导通电路不稳定，技术人员为了避免FPCB失效就需要对FPCB进行补强处理，从而增加了扬声器模组的生产难度，主要表现为以下几点：
一、需要在FPCB背面粘贴补强板以增加机械强度，增加了模组的组装工序，使得模组的组装工艺复杂化；
二、需要在模组的壳体上设计多个定位柱来保证FPCB的焊接及引出精度，然后通过热熔工艺将FPCB固定，不仅增加了模组的组装工序还使得模组外壳的结构变得复杂，进一步的增加了模组的组装难度；
三、对于全密封的模组，需要在FPCB出口的四周涂胶密封。
由上述可知，采用FPCB作为扬声器单体与终端电路之间的导通电路不仅电路稳定性差，还使得模组壳体的结构变得复杂，同时也增加了模组的组装工序，增加了组装难度 。
发明内容
本发明所要解决的技术问题是提供一种扬声器模组，此扬声器模组的扬声器单体与终端电路之间的导通电路稳定性高，且模组结构简单，组装工序简便易行，生产效率高。
为解决上述技术问题，本发明的技术方案是：
一种扬声器模组， 包括外壳，所述外壳内收容有扬声器单体，所述扬声器单体上设有弹片，所述外壳上设有与所述弹片电连接的导电结构，所述导电结构与所述外壳的壳体表面相贴合，所述导电结构的一端位于模组内腔中与所述弹片电连接，所述导电结构的另一端位于所述模组内腔的外部与终端电路电连接，所述导电结构为金属材质 。
其中， 所述外壳包括结合在一起的至少两个壳体，所述导电结构贴合在其中一个所述壳体靠近模组内腔的一侧表面上；设有所述导电结构的所述壳体为塑料材质， 其一侧边缘设有向外延伸的外延部，所述导电结构位于所述模组内腔外部的部分贴合在所述外延部上 。
其中，设有所述导电结构的所述壳体在 设有所述外延部一侧的侧壁为倾斜平面。
其中 ，所述 导电结构为通过LDS工艺在所述第二壳体表面形成的金属线路 。
其中，所述导电结构为在所述第二壳 体 表面贴装的金属贴片 。
其中，所述 金属贴片通过粘胶贴装在 所述 第二壳 体的表面。
其中， 所述 金属贴片通过热熔工艺贴装在所述第二壳体的表面 。
其中，所述 导电结构为注塑在所述第二壳体表面 的 金属薄片。
其中，所述导电结构为印刷在所述第二壳体表面的金属涂层。
作为一种实施方式，所述外壳包括结合在一起的第一壳体和第二壳体，所述导电结构设置在所述第二壳体上。
作为另一种实施方式，所述外壳包括结合在一起的第一壳体、第二壳体和第三壳体，所述导电结构设置在所述第三壳体上。
采用了上述技术方案后，本发明的有益效果是：
由于本发明 扬声器模组包括外壳，外壳内收容有扬声器单体，扬声器单体上设有弹片，外壳上设有一端与弹片电连接的导电结构，导电结构与外壳的壳体表面相贴合，导电结构的另一端与终端电路电连接，导电结构为金属材质。金属材质的导电结构与FPCB相比其机械强度更大，不易变形或断线，故不需要粘贴补强板来增加机械强度，也不需要在外壳上设置多个定位柱来保证焊接及引出精度，从而简化了模组外壳的结构，也减少了模组的组装工序，降低了模组的组装难度。导电结构与壳体的表面相贴合，在进行壳体密封时，则不需要在出口四周涂胶，进一步的简化了模组的组装工艺。
综上所述，本发明解决了现有技术中扬声器模组导电通路不稳定，组装工艺复杂的技术问题；本发明扬声器模组具有导电通路稳定性高，结构简单，组装工艺简便易行等优点。
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，而可依照说明书的内容予以实施，并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂，以下特举本发明的具体实施方式。
附图简要说明
通过阅读下文优选实施方式的详细描述，各种其他的优点和益处对于本领域普通技术人员将变得清楚明了。附图仅用于示出优选实施方式的目的，而并不认为是对本发明的限制。在附图中：
图1是本发明扬声器模组的立体分解结构示意图；
图2是图1的组合图；
图3是本发明扬声器模组的剖面结构示意图；
图中：10、第一壳体，12、声孔，20、第二壳体，22、导电结构，24、外延部，30、扬声器单体，40、弹片 。
具体实施方式
在下面的描述中，只通过说明的方式描述了本发明的某些示范性实施例。毋庸置疑，本领域的普通技术人员可以认识到，在不偏离本发明的精神和范围的情况下，可以用各种不同的方式对所述实施例进行修正。因此，附图和描述在本质上是说明性的，而不是用于限制权利要求的保护范围。在本说明书中，相同的附图标记表示相同或相似的部分。
下面结合附图和实施例，进一步阐述本发明。
实施例一：
如图1 和图2共同 所示，一种扬声器模组， 用于安装在电子终端（图中未示出）内， 包括结合在一起的第一壳体 10 和第二壳体20 ，第一壳体10和第二壳体20 围成的空间 内 收容有扬声器单体30，扬声器单体30包括振动系统和磁路系统（图中未示出），第一壳体10靠近振动系统，且第一壳体10上设有声孔12，第二壳体靠近磁路系统。优选地，第一壳体10和第二壳体20均为塑料壳体。
如图1和图3共同所示，扬声器单体30上设有两个弹片40，第二壳体20上设有两个导电结构 22 ，导电结构22为片状的金属材质。弹片40的一端电连接扬声器单体30内的音圈（图中未示出），弹片40的另一端与导电结构22电连接，两个弹片40分别与相对应的导电结构22电连接。导电结构22贴合在第二壳体20靠近第一壳体10一侧的表面上。第二壳体20的一侧边缘设有向外延伸的外延部24，导电结构22位于模组内腔外部的部分贴合在外延部24上。导电结构22位于模组内腔内部的一端与弹片40电连接，导电结构22位于模组内腔外部的一端与终端电路电连接。 金属材质 的 导 电 结构22与FPCB相比其机械强度更大 ，不易变形或断线，故不需要补强板来增加机械强度，也不需要在壳体上设置多个定位柱来保证焊接及引出精度；导电结构22与第二壳体20表面贴合，在进行壳体间密封时也不需要在出口四周涂胶，故金属材质的导电结构不仅有效的简化了模组壳体的结构，还减少了模组的组装工序，从而简化了模组的组装工艺 ，降低了组装难度，提高了生产效率。
如图1和图3共同所示，第二壳体20设有外延部24一侧的侧壁为倾斜平面，因导电结构22是沿此侧壁从模组的内腔中延伸至模组的内腔外的 ，故倾斜平面 的侧壁与其它三面垂直平面的侧壁相比更有利于导电结构 22 的贴合，加工难度更低。
如图1所示，导电结构22通过以下几种方式贴合在第二壳体20的表面：
第一种方式：导电结构22是采用LDS（ Laser Direct Structuring ，激光直接成型技术 ）工艺在第二壳体20表面形成的金属线路。
第二种方式：导电结构22为在第二壳体20表面贴装的金属贴片。
在此种方式中金属贴片可以通过粘胶粘贴在第二壳体20的表面；还可以在第二壳体20上设置热熔柱 ，在金属贴片上设置与热熔柱相适配 的热熔孔，然后通过热熔工艺将金属贴片贴装在第二壳体20的表面，此种热熔贴合的方式与胶粘贴合的方式相比工艺稍显复杂，但导电结构22与第二壳体20的表面贴合得更牢固。
第三种方式：导电结构22为金属薄片 ，通过注塑工艺结合在第二壳体20的表面。
第四种方式：导电结构22为印刷在第二壳体20表面的金属涂层。
具有导电特性的金属材料很多，比较常见的有铜、铝、铁和银等，本发明从成本、导电率及重量等多方面考虑，导电结构的材质优选为铜箔。
本实施例中涉及到的第一壳体和第二壳体的命名仅是为区别技术特征 ，并不代表二者之间的位置关系与安装顺序等。
实施例二：
本实施方式与实施例一基本相同，其不同之处在于：
扬声器模组的外壳包括结合在一起的第一壳体、第二壳体和第三壳体，其中第二壳体为环状壳体，第一壳体和第三壳体分别结合在第二壳体的两端。扬声器模组的出声孔设置在第一壳体上，第一壳体靠近扬声器单体的振动系统，第三壳体靠近扬声器单体的磁路系统，导电结构设置在第三壳体上。
本实施例中涉及到的第一壳体、第二壳体和第三壳体的命名仅是为区别技术特征 ，并不代表三者之间的位置关系与安装顺序等。
本说明书仅以附图所示出的扬声器模组为例对本发明的发明构思进行了详细的阐述，这并不代表本发明的保护范围就仅限于此种结构的扬声器模组，实际中在塑料材质的模组壳体上设置金属导电结构用以替代FPCB的技术方案可以应用到任何一种结构的扬声器模组上，因此，无论 该扬声器 模组是矩形的、圆形的还是跑道形等其它形状的 ，也不论该扬声器模组的壳体和内部扬声器单体的结构如何，只要是在模组壳体的表面贴合金属导电结构并用此替代FPCB来导通扬声器单体与终端电路的产品均落入本发明的保护范围内。
本发明不局限于上述具体的实施方式，本领域的普通技术人员从上述构思出发，不经过创造性的劳动，所作出的种种变换，均落在本发明的保护范围之内 。

Claims (10)

  1. 一种扬声器模组，包括外壳，所述外壳内收容有扬声器单体，其特征在于，所述扬声器单体上设有弹片，所述外壳上设有与所述弹片电连接的导电结构，所述导电结构与所述外壳的壳体表面相贴合，所述导电结构的一端位于模组内腔中与所述弹片电连接，所述导电结构的另一端位于所述模组内腔的外部与终端电路电连接，所述导电结构为金属材质。
  2. 根据权利要求1所述的扬声器模组，其特征在于，所述外壳包括结合在一起的至少两个壳体，所述导电结构贴合在其中一个所述壳体靠近模组内腔的一侧表面上；设有所述导电结构的所述壳体为塑料材质，其一侧边缘设有向外延伸的外延部，所述导电结构位于所述模组内腔外部的部分贴合在所述外延部上。
  3. 根据权利要求2所述的扬声器模组，其特征在于，设有所述导电结构的所述壳体在设有所述外延部一侧的侧壁为倾斜平面。
  4. 根据权利要求2所述的扬声器模组，其特征在于，所述导电结构为通过激光直接成型LDS工艺在所述壳体表面形成的金属线路。
  5. 根据权利要求2所述的扬声器模组，其特征在于，所述导电结构为在所述壳体表面贴装的金属贴片。
  6. 根据权利要求5所述的扬声器模组，其特征在于，所述金属贴片通过粘胶贴装在所述壳体的表面，或者所述金属贴片通过热熔工艺贴装在所述壳体的表面。
  7. 根据权利要求2所述的扬声器模组，其特征在于，所述导电结构为注塑在所述壳体表面的金属薄片。
  8. 根据权利要求2所述的扬声器模组，其特征在于，所述导电结构为印刷在所述壳体表面的金属涂层。
  9. 根据权利要求2所述的扬声器模组，其特征在于，所述外壳包括结合在一起的第一壳体和第二壳体，所述导电结构设置在所述第二壳体上。
  10. 根据权利要求2所述的扬声器模组，其特征在于，所述外壳包括结合在一起的第一壳体、第二壳体和第三壳体，所述导电结构设置在所述第三壳体上。　
PCT/CN2015/073767 2014-05-13 2015-03-06 扬声器模组 WO2015172600A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15/300,085 US9756443B2 (en) 2014-05-13 2015-03-06 Speaker module
KR1020167030689A KR101748344B1 (ko) 2014-05-13 2015-03-06 스피커 모듈

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201420243507.5 2014-05-13
CN201420243507.5U CN203840519U (zh) 2014-05-13 2014-05-13 扬声器模组

Publications (1)

Publication Number Publication Date
WO2015172600A1 true WO2015172600A1 (zh) 2015-11-19

Family

ID=51518311

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/073767 WO2015172600A1 (zh) 2014-05-13 2015-03-06 扬声器模组

Country Status (4)

Country Link
US (1) US9756443B2 (zh)
KR (1) KR101748344B1 (zh)
CN (1) CN203840519U (zh)
WO (1) WO2015172600A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203840519U (zh) * 2014-05-13 2014-09-17 歌尔声学股份有限公司 扬声器模组
CN104363732A (zh) * 2014-11-11 2015-02-18 昆山金利表面材料应用科技股份有限公司 具振动回馈之塑胶体
CN105228062A (zh) * 2015-09-21 2016-01-06 广东欧珀移动通信有限公司 一种封闭式喇叭及电子终端
CN105208488A (zh) * 2015-09-21 2015-12-30 广东欧珀移动通信有限公司 一种封闭式喇叭及电子终端
CN106060727A (zh) * 2016-06-07 2016-10-26 广东欧珀移动通信有限公司 扬声器组件及移动终端
CN106211016B (zh) * 2016-07-18 2020-02-18 瑞声科技(新加坡)有限公司 电子设备、终端及组装方法
CN107249149A (zh) * 2017-07-31 2017-10-13 广东欧珀移动通信有限公司 麦克风组件及电子设备
CN107613438A (zh) * 2017-10-19 2018-01-19 江苏裕成电子有限公司 音腔机构
CN108513230B (zh) * 2018-06-25 2024-02-09 歌尔股份有限公司 发声器件及便携终端
CN109905820B (zh) * 2018-12-29 2021-06-15 瑞声科技(新加坡)有限公司 扬声器模组

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1453971A (zh) * 2002-04-26 2003-11-05 株式会社村田制作所 压电型电声转换器
JP2006128925A (ja) * 2004-10-27 2006-05-18 Sanyo Electric Co Ltd スピーカユニット
JP2007294135A (ja) * 2006-04-21 2007-11-08 Shin Etsu Polymer Co Ltd 電気コネクタの接続構造及び電気コネクタの接続方法
CN202261781U (zh) * 2011-07-11 2012-05-30 东星电声科技(东莞)有限公司 改良的扬声器及其防尘盖结构
CN202374407U (zh) * 2011-11-24 2012-08-08 比亚迪股份有限公司 一种音腔装置及应用其的电子产品
CN203840519U (zh) * 2014-05-13 2014-09-17 歌尔声学股份有限公司 扬声器模组

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100768137B1 (ko) 2006-09-19 2007-10-17 부전전자 주식회사 마이크로스피커 모듈의 백볼륨 단자구조
KR200474384Y1 (ko) 2013-03-21 2014-11-04 (주) 모토텍 스피커 장치의 배선부재 및 이를 포함하는 스피커 장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1453971A (zh) * 2002-04-26 2003-11-05 株式会社村田制作所 压电型电声转换器
JP2006128925A (ja) * 2004-10-27 2006-05-18 Sanyo Electric Co Ltd スピーカユニット
JP2007294135A (ja) * 2006-04-21 2007-11-08 Shin Etsu Polymer Co Ltd 電気コネクタの接続構造及び電気コネクタの接続方法
CN202261781U (zh) * 2011-07-11 2012-05-30 东星电声科技(东莞)有限公司 改良的扬声器及其防尘盖结构
CN202374407U (zh) * 2011-11-24 2012-08-08 比亚迪股份有限公司 一种音腔装置及应用其的电子产品
CN203840519U (zh) * 2014-05-13 2014-09-17 歌尔声学股份有限公司 扬声器模组

Also Published As

Publication number Publication date
KR20160131125A (ko) 2016-11-15
KR101748344B1 (ko) 2017-06-16
CN203840519U (zh) 2014-09-17
US9756443B2 (en) 2017-09-05
US20170180901A1 (en) 2017-06-22

Similar Documents

Publication Publication Date Title
WO2015172600A1 (zh) 扬声器模组
CN114554367B (zh) 发声装置和电子设备
WO2016169283A1 (zh) 一种硅胶振膜、受话器模组和加工硅胶振膜的方法
WO2016008315A1 (zh) 扬声器模组及该扬声器模组的组装方法
WO2013097330A1 (zh) 微型动圈式发声器
WO2016101746A1 (zh) 扬声器模组
CN109672948B (zh) 发声器件
WO2016034011A1 (zh) 扬声器模组
WO2022143027A1 (zh) 扬声器和电子终端
CN107040851B (zh) 磁路组件及设有该磁路组件的微型发声器
US20130148837A1 (en) Multi-functional microphone assembly and method of manufacturing the same
WO2016169255A1 (zh) 扬声器装置
CN111988711B (zh) 扬声器单体和电子终端
CN110572746A (zh) 一种用于发声装置的导电膜以及发声装置
CN111988713B (zh) 扬声器单体和电子终端
CN212696206U (zh) 扬声器单体和电子终端
WO2019196582A1 (zh) 一种线控组件及线控式蓝牙耳机
CN212727400U (zh) 扬声器单体和电子终端
CN213847006U (zh) 传感器封装结构和电子设备
CN110545505A (zh) 一种用于发声装置的导电膜以及发声装置
CN206948600U (zh) 一种电声转换器及电子设备
CN109040925B (zh) 扬声器和耳机
CN109743662B (zh) 定心支片和发声装置
CN103997709A (zh) 弯曲扬声器模组
CN112312285A (zh) 音圈、扬声器及便携式电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15793391

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 15300085

Country of ref document: US

ENP Entry into the national phase

Ref document number: 20167030689

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205N DATED 09/03/2017)

122 Ep: pct application non-entry in european phase

Ref document number: 15793391

Country of ref document: EP

Kind code of ref document: A1