WO2015172582A1 - 电子器件封装盒及电磁器件 - Google Patents

电子器件封装盒及电磁器件 Download PDF

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Publication number
WO2015172582A1
WO2015172582A1 PCT/CN2015/071623 CN2015071623W WO2015172582A1 WO 2015172582 A1 WO2015172582 A1 WO 2015172582A1 CN 2015071623 W CN2015071623 W CN 2015071623W WO 2015172582 A1 WO2015172582 A1 WO 2015172582A1
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WO
WIPO (PCT)
Prior art keywords
base
electronic device
side wall
cover
space
Prior art date
Application number
PCT/CN2015/071623
Other languages
English (en)
French (fr)
Inventor
王江
黄胜清
李宗正
Original Assignee
深圳市联泰兴电子科技有限公司
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Application filed by 深圳市联泰兴电子科技有限公司 filed Critical 深圳市联泰兴电子科技有限公司
Publication of WO2015172582A1 publication Critical patent/WO2015172582A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a package box, in particular to an electronic device package box and an electromagnetic device.
  • the electronic device package box is used for mounting electronic components such as coils.
  • the existing package includes a base and a cover.
  • the base and the cover are respectively provided with stitches, and a plurality of coils are respectively installed in the base and the cover, and respectively passed through
  • the wires are wound around the base and the pins in the cover to electrically connect the coils and pins.
  • the coil in the cover is located in the concave surface of the cover facing the base, and when the wire of the coil is wound onto the stitch in the cover, since the stitch is long, it is difficult to wrap when the wire is wound, and is also easily affected by the side around the concave surface.
  • Wall blocking inconvenient operation, increased entanglement time, is not conducive to improve production efficiency, while the coil sets of the two spaces will face face to face, there are hidden dangers in electrical insulation and anti-interference performance.
  • a technical problem to be solved by the present invention is to provide an electronic device package that facilitates the saving of the entanglement working hours.
  • Another technical problem to be solved by the present invention is to provide an electromagnetic device that saves wire breakage time, has good anti-interference performance, and is highly reliable.
  • the technical solution adopted by the present invention to solve one of the technical problems is to provide an electronic device package box a first base and a second base that are sequentially combined, a cover that covers the second base, and a plurality of fixed on the first base and the second base, respectively a first pin and a second pin for electrically connecting to the electronic device;
  • the first end of each of the first stitches protrudes from a side of the first base or faces away from a surface of the second base, and the second end of each of the first stitches protrudes
  • the first pedestal faces the surface of the second pedestal, and the second end of the first pin forms a wire end for winding the wire of the electronic device;
  • a first end of each of the second pins extends from a side of the second base or toward a surface of the first base, and a second end of each of the second pins extends from the second base
  • the holder faces the surface of the cover, and the second end of the second stitch forms a wire end for the wire of the electronic device to be wound.
  • the first base corresponds to a plurality of first ends of the first pins, and a plurality of first slots for the wires of the electronic device are disposed, and each of the first slots has a location a first outlet end of the first base facing the surface of the second base; and a first line end located at an inner wall surface of the first space;
  • the second base is provided with a plurality of second slots for the wires of the electronic device corresponding to the second ends of the plurality of second pins, and each of the second slots has a second base a second outlet end on the surface of the closure and a second inlet end on the inner wall of the second space.
  • the first base includes a first substrate, and a first sidewall connected to the first substrate around a circumference of the first substrate, the first space being formed on the first substrate and Between the inner wall surfaces of the first side wall, a first end of the first stitch protrudes from a side of the first side wall or a surface of the first substrate faces away from the second base, the first a second end of the stitch extending from the first sidewall toward a surface of the second pedestal;
  • the second pedestal includes a second substrate, and a second sidewall connected to the second substrate around a circumference of the second substrate, the second space being formed on the second substrate and the first Between the inner wall surfaces of the two side walls, a first end of the second stitch protrudes from a side surface of the second side wall or a second side wall faces an end surface of the first base, the second stitch a second end extending from the second sidewall toward a surface of the cover; the second base passing the second sidewall toward an end of the first base and the first base One side wall fits.
  • the outer end edge of the first substrate is provided with a first engaging portion
  • the second sidewall is provided with a second end surface of the first base that is engaged with the first engaging portion. Card joint.
  • the first base further includes a first plug-in board extending outward from an outer end edge of the first substrate, and the first plug-in board is provided with a plurality of the second stitches a plug hole placed at one end;
  • the second sidewall is joined to the first plug-in board at an end surface of the first base toward the outside of the insertion hole.
  • the cover comprises a sealing plate and a side plate connected to the sealing plate around a circumference of the sealing plate; the cover is fitted to the second side wall by the side plate to cover On the second pedestal; or,
  • the cover is a plate-shaped cover, the second side wall is provided with an engaging portion extending in the direction of the cover, and the engaging portion is located outside the second end of the second stitch, the cover A cover is attached to the joint.
  • a step is provided on a peripheral side of the second side wall, the side plate is engaged on a peripheral side of the second side wall and joined to the step; and/or
  • a first engaging portion and a second engaging portion are respectively disposed on the outer peripheral side of the side plate and the second side wall, and the side plate passes through the first engaging portion and the second engaging portion Engaged on the second side wall;
  • the first engaging portion is a bayonet, and the second engaging portion is a protrusion that cooperates with the bayonet; or the first engaging portion is a bump, and the second engaging portion is A bayonet that mates with the bump.
  • the technical solution adopted by the present invention to solve another technical problem thereof is to provide an electromagnetic device including the above-described electronic device package and an electronic device mounted in the package.
  • the electronic device includes a first electronic device and a second electronic device, the first electronic device being located in a first space of the first base of the package and electrically connected to the first pin, the first The two electronic devices are located in the second space of the second base of the package and are electrically connected to the second pin.
  • the electronic device is respectively mounted by the first base and the second base, and the space opening for placing the electronic device on the second base and the first base faces the same and passes through the second base.
  • the blocks are isolated from each other to facilitate the mounting of the electronic device on the second base and the first base, thereby reducing the entanglement time of the electronic device, thereby improving the production efficiency; in addition, the electronic device mounted on the second base passes
  • the second pedestal is isolated from the electronics on the first pedestal to reduce interference between the electronic devices .
  • the electromagnetic device using the package has high anti-interference performance and high reliability.
  • FIG. 1 is a schematic exploded view of an electronic device package of a first embodiment of the present invention
  • FIG. 2 is a schematic structural view of the electronic device package of FIG. 1;
  • FIG. 3 is a schematic structural view of an embodiment of a first engaging portion and a second engaging portion in the electronic device package of FIG. 1;
  • FIG. 4 is a schematic exploded view of an electronic device package of a second embodiment of the present invention.
  • an electronic device package box As shown in FIG. 1-2, an electronic device package box according to a first embodiment of the present invention, The first base 1 and the second base 2 are sequentially combined, the cover 3 covers the second base 2, the plurality of first pins 4 and the plurality of second pins 5; the first stitch 4 is fixed at On the first base 1, the second pin 5 is fixed to the second base 2, and the first pin 4 and the second pin 5 are respectively used for electrical connection with the electronic device.
  • the first base 1 is formed with a first space 10 having an opening facing the second base 2
  • the second base 2 is formed with a second space 20 having an opening facing the cover 3, the first space 10 and the second space 20 Both are used to house electronic devices (such as coils), and the electronic devices are respectively wound on the first pin 4 and the second pin 5 by wires to achieve electrical connection.
  • the second pedestal 2 covers the open side of the first space 10 of the first susceptor 1, and the cover 3 covers the open side of the second space 20 on the second pedestal 2 to constitute an integral package.
  • the electronic device housed in the first space 10 of the first susceptor 1 is referred to as a first electronic device 100
  • the electronic device housed in the second space 20 of the second susceptor 2 is referred to as The second electronic device 200.
  • the first space 10 and the second space 20 are all open upwards, and the first electronic device 100 and the second electronic device 200 are respectively disposed from the first space 10 and the second space. Placed above 20, and entangled, easy and fast operation, saving entanglement time, which can improve production efficiency.
  • Each of the first pins 4 has a first end 41 and a second end 42 that are connected, and each of the second pins 5 has a first end 51 and a second end 52 that are connected.
  • the first end 41 of each first stitch 4 extends out of the side of the first base 1 or faces away from the surface of the second base 2, and the second end 42 of each first stitch 4 extends toward the first base 1
  • the second end 42 of the first pin 4 forms a wire end for the wire 101 of the electronic device (i.e., the first electronic device 100) to be wound.
  • each second pin 5 extends from the side of the second base 2 or toward the surface of the first base 1, and the second end 52 of each second pin 5 extends out of the second base 2 toward the seal
  • the surface of the cover 3, the second end 52 of the second stitch 5 forms a wire end for the wire 201 of the electronic device (i.e., the second electronic device 200) to be wound.
  • the first pedestal 1 The second ends 42 corresponding to the plurality of first pins 4 are provided with a plurality of first wire grooves 6 each having a first outlet end 61 on the surface of the first base 1 facing the second base 2 And the first wire end 62 located at the inner wall surface of the first space 10, the wires 101 of the first electronic device 100 are inserted into the first wire slot 6 from the first wire end 62, and from the first wire end 61. After being worn out, it is wound on the second end 42 of the corresponding first stitch 4 to realize the connection between the first electronic device 100 and the first stitch 4.
  • the second end 52 of the second base 2 corresponding to the plurality of second pins 5 is provided with a plurality of second slot 7 each having a second outlet end on the surface of the second base 2 facing the cover 3. 71, and a second incoming end 72 located in the inner wall of the second space 20, the wires 201 of the second electronic device 200 are inserted into the second slot 7 from the second incoming end 72, and from the second outgoing end 71 After being worn out, it is wound on the second end 52 of the corresponding second stitch 5 to realize the connection between the second electronic device 200 and the second stitch 5.
  • the first pedestal 1 may include a first substrate 11 and a first sidewall 12 connected to the first substrate 11 around a circumference of the first substrate 11.
  • the first space 10 is formed on the first substrate 11 and the first side Between the inner wall faces of the wall 12.
  • the first end 41 of the first stitch 4 extends beyond the side of the first side wall 12 or the first substrate 11 faces away from the surface of the second pedestal 2 to be electrically connected to the external electronic device; the second end 42 of the first stitch 4
  • the first side wall 12 is extended toward the surface of the second base 2 and can be received between the top of the first base 1 and the second base 2.
  • the first wire slot 6 is disposed on the first side wall 12 corresponding to the first stitch 4 .
  • the second pedestal 2 may include a second substrate 21 and a second sidewall 22 connected to the second substrate 21 around the circumference of the second substrate 21, and the second space 20 is formed on the second substrate 21 and the second sidewall 22 Between the inner walls.
  • the first end 51 of the second stitch 5 extends from the side of the second side wall 22 or the second side wall 22 faces the end surface of the first base 1 to be electrically connected to the external electronic device; the second end of the second stitch 5 52 extends from the second side wall 22 toward the surface of the cover 3 and can be received between the top of the second base 2 and the cover 3.
  • the second wire slot 7 is disposed on the second side wall 22 corresponding to the second stitch 5 .
  • the second base 2 is engaged with the first side wall 12 of the first base 1 through the second side wall 22 toward one end of the first base 1 .
  • the second space 20 is isolated from the first space 10 by the second substrate 21, thereby avoiding between the first electronic device 100 in the first space 10 and the second electronic device 200 in the second space 20.
  • Mutual interference affects the reliability of the package.
  • the second side wall 22 can be firmly engaged with the first side wall 12 by its inner peripheral wall surface being engaged with the outer peripheral side surface of the first side wall 12.
  • a first engaging portion 110 may be disposed at an outer end edge of the first substrate 11, correspondingly, facing the second side wall 22
  • One end end surface of the first base 1 is provided with a second engaging portion 220 that cooperates with the first engaging portion 110.
  • the first latching portion 110 is a concave latching slot
  • the second latching portion 220 is a protruding bump.
  • the first latching portion 110 is a bump and the second latching portion 220 is a latching slot.
  • the first pedestal 1 may further include a first insertion plate 13 extending outward from the outer edge of the first substrate 11.
  • the first insertion plate 13 is provided with a plurality of insertion holes 130 for the second pin 5.
  • the first end 51 is placed.
  • first plug-in board 13 is further provided with a third latching portion 131
  • second sidewall 22 corresponding to the first plug-in board 13 is provided with a fourth latching portion 221
  • the fourth latching portion 221 is passed through the fourth latching portion 221
  • the first The three latching portions 131 can be a card plate or a recessed card slot protruding from the first plug-in board 13
  • the fourth latching portion 221 corresponding to a recessed card slot or a protruding card slot.
  • a plurality of first stitches 4 are arranged in two groups on opposite sides of the first space 10 , and each set of first stitches 4 is divided into two parallel rows and two rows of The first stitches 4 are offset from each other such that the first wire end 62 of the first wire slot 6 corresponding to each of the first stitches 4 is located on the inner wall surface of the first space 10 (ie, the inner wall surface of the first side wall 12).
  • the first outlet end 61 is spaced apart from the surface of the first base 1 facing the second base 2 (ie, the end surface of the first side wall 12 facing the second base 2).
  • the plurality of second stitches 5 are divided into two groups corresponding to the first stitches 4 and disposed on opposite sides of the second space 20, each of which includes a plurality of spaced second stitches 5; the first ends 51 of the second stitches 5 and The first ends 41 of a stitch 4 are parallel to each other and are offset from each other to avoid mutual interference.
  • the opening of the first wire end 62 on the first side wall 12 and the opening of the first wire end 61 on the end face of the first side wall 12 extend toward the opposite corner of the first side wall 12.
  • the second input The opening of the wire end 72 on the second side wall 22 and the opening of the second outlet end 71 on the end surface of the second side wall 22 extend toward each other to meet and communicate at opposite corners of the second side wall 22, forming a opening
  • the slotting on the second side wall 22 facilitates the penetration of the wire 201 of the second electronic device 200, and the second wire slot 7 in the form of a slot is more simple to set.
  • the cover 3 may include a sealing plate 31 and a side plate 32 connected to the sealing plate 31 around the circumference of the sealing plate 31.
  • the cover 3 is engaged with the second side wall 22 through the side plate 32. Covered on the second base 2.
  • the outer side surface of the second side wall 22 is provided with a step 222, and the side plate 32 is engaged with the outer peripheral side surface of the second side wall 22 and joined to the step 222.
  • a first engaging portion 81 and a second engaging portion 82 are respectively disposed on the outer peripheral side surfaces of the side plate 32 and the second side wall 22, and the side plate 32 is coupled to the second engaging portion 82 by the first engaging portion 81.
  • the engagement is on the second side wall 22.
  • the first engaging portion 81 is a bayonet
  • the second engaging portion 82 is a bump that matches the bayonet; or the first engaging portion 81 is a bump
  • the second engaging portion 82 is a bump.
  • the matching bayonet; the number and position of the first engaging portion 81 and the second engaging portion 82 can be set according to actual needs.
  • the step 222 is recessed on the outer peripheral side of the second side wall 22, and the first engaging portion 81 and the second engaging portion 82 are respectively disposed on the side plate 32 and the second side wall 22, respectively. At the position where they overlap each other.
  • the second engaging portion 82 is disposed on the same side of the plurality of second stitches 5
  • the first engaging portions 81 are correspondingly disposed on opposite side faces of the side plates 32 on the opposite sides of the outer side of the second side wall 22; as another embodiment of the first engaging portion 81 and the second engaging portion 82
  • the second engaging portion 82 and a plurality of The second stitch 5 is disposed on the different side
  • the first engaging portions 81 are disposed on opposite sides of the outer side of the second side wall 22, and the first engaging portions 81 are disposed on opposite sides of the side plate 32. It can be understood that the plurality of sides of the outer circumferential side of the second side wall 22 may also be provided with the second engaging portion 82.
  • the side plate 32 can also be engaged only by the step 222 and the second side wall 22, or only by the cooperation of the first engaging portion 81 and the second engaging portion 82 and the second side.
  • the wall 22 is engaged.
  • the first base 1, the second base 2 and the cover 3 can be made of PBT (polybutylene terephthalate) material, and have excellent chemical stability, mechanical strength and electrical insulation properties. And thermal stability; of course, the first base 1, the second base 2 and the cover 3 can also be made of other materials according to requirements.
  • the first pedestal 1 can be coated on the plurality of first stitches 4 by injection molding so that a tight combination is formed between the first stitch 4 and the first pedestal 1; likewise, the second pedestal 2 can be injection molded The molding is coated on the plurality of second pins 5, so that a tight combination is formed between the second pins 5 and the second base 2, thereby improving the reliability of the package.
  • an electronic device package box includes a first base 1 and a second base 2 which are sequentially combined, a cover 3 which is attached to the second base 2, and a plurality of a first stitch 4 and a plurality of second stitches 5; the first stitch 4 is fixed on the first base 1, and the second stitch 5 is fixed on the second base 2, and the first stitch 4 and the second stitch 5 are respectively used Electrically connected to the electronic device.
  • the first base 1 is formed with a first space 10 having an opening facing the second base 2
  • the second base 2 is formed with a second space 20 having an opening facing the cover 3, the first space 10 and the second space 20 Both are used to house electronic devices (such as coils), and the electronic devices are respectively wound on the first pin 4 and the second pin 5 by wires to achieve electrical connection.
  • the second pedestal 2 covers the open side of the first space 10 of the first susceptor 1, and the cover 3 covers the open side of the second space 20 on the second pedestal 2 to constitute an integral package.
  • This embodiment is different from the first embodiment described above in that the first end 41 of the first stitch 4 protrudes from the side of the first side wall 12 of the first base 1 to be electrically connected to the external electronic device; the second stitch 5 The first end 51 extends beyond the side of the second side wall 22 of the second pedestal 2 for electrical connection with external electronics.
  • the first end 41 of the first stitch 4 and the first end 51 of the second stitch 5 are spaced apart from each other in parallel.
  • the second side wall 22 of the second base 2 is engaged with the outer side surface of the first side wall 12 of the first base 1 , and the second side wall 22 of the second side wall 22 can be provided with a recessed groove corresponding to the second end 42 of the first stitch 4 . 223; when the second side wall 22 is fitted to the outer peripheral side of the first side wall 12, the recessed grooves 223 are placed one by one into the first end 41 of the first stitch 4.
  • the first pedestal 1, the second pedestal 2, and the cover 3 of this embodiment can be referred to the foregoing first embodiment, and details are not described herein again.
  • the cover 3 in the above first and second embodiments may also be a plate-shaped cover.
  • the second side wall 22 is provided with an engaging portion extending in the direction of the cover 3, and the engaging portion is located outside the second end of the second stitch 5, and the cover 3 is covered on the engaging portion so as to cover the second base 2 The open side of the second space 20.
  • the electromagnetic device of the present invention The electronic device package box and the electronic device mounted in the package box are the electronic device package boxes in the first embodiment or the second embodiment described above.
  • the electronic device includes a first electronic device 100 and a second electronic device 200.
  • the first electronic device 100 is located in the first space 10 of the first pedestal 1 of the package and is electrically connected to the first pin 4
  • the second electronic device 200 is located in the second space 20 of the second base 2 of the package and is electrically connected to the second pin 5.
  • Electronic devices may include coils or other electronic components such as PCBs, resistors, capacitors, inductors, semiconductor components, and the like.
  • the first electronic device 100 can be placed into the first space 10 from above the first pedestal 1, and the wires 101 of the first electronic device 100 are respectively placed in the first wire slot 6 and wound around the first stitch.
  • the second electronic device 200 can be placed into the second space 20 from above the second pedestal 2, and the second electronic device 200 is
  • the wires 201 are respectively placed in the second wire slot 7 and wound around the second end 52 of the second stitch 5, and the wire 201 and the second end 52 are soldered together by soldering; then the second electronic device 200 is mounted.
  • the two bases 2 cover the open side of the first space 10 of the first base 1, and finally cover the cover 3 to the open side of the second space 20 of the second base 2 to complete the assembly.
  • the cover 3 can also be covered on the second base 2 first, and then the second base 2 with the cover 3 can be covered on the first base 1.
  • first base 1 and the second base 2 are also suitable for A pedestal with a PCB board or a resistor, capacitor, semiconductor, etc. on the PCB.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种电子器件封装盒及电磁器件，电子器件封装盒包括依次组合的第一基座(1)和第二基座(2)、盖合在第二基座(2)上的封盖(3)、以及分别固定在第一基座(1)和第二基座(2)上的数个第一针脚(4)和第二针脚(5)；第一基座(1)上形成有第一空间(10)，第二基座(2)上形成有第二空间(20)；第二基座(2)覆盖在第一空间(10)的开口侧，封盖(3)覆盖在第二空间(20)的开口侧。该电子器件封装盒方便电子器件分别在其第二基座和第一基座上的安装缠线，减少电子器件的缠线工时；使用该封装盒的电磁器件抗干扰性能好，可靠性高。

Description

电子器件封装盒及电磁器件 技术领域
本发明涉及一种封装盒，尤其涉及一种电子器件封装盒及电磁器件。
背景技术
电子器件封装盒用于安装线圈等电子器件，现有的封装盒包括基座和封盖，基座和封盖分别设有针脚，数个线圈分别安装在基座和封盖内，且分别通过导线缠绕基座和封盖内的针脚，实现线圈和针脚的电连接。 然而，封盖内的线圈是位于封盖朝向基座的凹面内，将线圈的导线缠绕到封盖内针脚上时，由于针脚较长，缠线时绕制困难，也容易受凹面四周的侧壁阻挡，操作不便利，增加缠线工时，不利于提高生产效率，同时两个空间的线圈组会面对面朝向，在电器绝缘和抗干扰性能方面存在隐患。
发明内容
本发明要解决的一技术问题在于，提供一种利于节约缠线工时的电子器件封装盒。
本发明要解决的另一技术问题在于，提供一种节约缠线工时、抗干扰性好及可靠性高的电磁器件。
本发明解决其一技术问题所采用的技术方案是：提供一种电子器件封装盒 ，包括依次组合的第一基座和第二基座、盖合在所述第二基座上的封盖、以及分别固定在所述第一基座和所述第二基座上的数个用于与电子器件电连接的第一针脚和第二针脚；
所述第一基座上形成有开口朝向所述第二基座、用于容纳电子器件的第一空间，所述第二基座上形成有开口朝向所述封盖、用于容纳电子器件的第二空间；所述第二基座覆盖在所述第一基座的所述第一空间的开口侧，所述封盖覆盖在所述第二基座上的所述第二空间的开口侧。
优选地，每一所述第一针脚的第一端伸出所述第一基座的侧面或背向所述第二基座的表面，每一所述第一针脚的第二端伸出所述第一基座朝向所述第二基座的表面，所述第一针脚的第二端形成供所述电子器件的导线缠绕的连线端；
每一所述第二针脚的第一端伸出所述第二基座的侧面或朝向所述第一基座的表面，每一所述第二针脚的第二端伸出所述第二基座朝向所述封盖的表面，所述第二针脚的第二端形成供所述电子器件的导线缠绕的连线端。
优选地，所述第一基座对应数个所述第一针脚的第二端设有数个供所述电子器件的导线放入的第一线槽，每一所述第一线槽具有位于所述第一基座朝向所述第二基座的表面上的第一出线端、以及位于所述第一空间内壁面的第一入线端；
所述第二基座对应数个所述第二针脚的第二端设有数个供所述电子器件的导线放入的第二线槽，每一所述第二线槽具有位于所述第二基座朝向所述封盖的表面上的第二出线端、以及位于所述第二空间内壁面的第二入线端。
优选地，所述第一基座包括第一基板、以及围绕所述第一基板的周缘连接在所述第一基板上的第一侧壁，所述第一空间形成在所述第一基板和所述第一侧壁的内壁面之间，所述第一针脚的第一端伸出所述第一侧壁的侧面或第一基板背向所述第二基座的表面，所述第一针脚的第二端伸出所述第一侧壁朝向所述第二基座的表面；
所述第二基座包括第二基板、以及围绕所述第二基板的周缘连接在所述第二基板上的第二侧壁，所述第二空间形成在所述第二基板和所述第二侧壁的内壁面之间，所述第二针脚的第一端伸出所述第二侧壁的侧面或第二侧壁朝向所述第一基座的一端端面，所述第二针脚的第二端伸出所述第二侧壁朝向所述封盖的表面；所述第二基座通过所述第二侧壁朝向所述第一基座的一端与所述第一基座的第一侧壁配合。
优选地，所述第一基板的外端缘设有第一卡接部，所述第二侧壁朝向所述第一基座的一端端面设有与所述第一卡接部配合的第二卡接部。
优选地，所述第一基座还包括自所述第一基板的外端缘向外延伸的第一插接板，所述第一插接板上设有数个供所述第二针脚的第一端放入的插接孔；
所述第二侧壁朝向所述第一基座的一端端面于所述插接孔外侧接合在所述第一插接板上。
优选地，所述封盖包括封板、以及围绕所述封板的周缘连接在所述封板上的侧板；所述封盖通过所述侧板与所述第二侧壁配合而盖合在所述第二基座上；或者，
所述封盖为板状盖板，所述第二侧壁上设有向所述封盖方向延伸的接合部，且所述接合部位于所述第二针脚的第二端外侧，所述封盖盖合在所述接合部上。
优选地，所述第二侧壁的外周侧面上设有台阶，所述侧板卡合在所述第二侧壁的外周侧面上并接合在所述台阶上；和/或，
所述侧板和所述第二侧壁外周侧面上分别设有第一卡合部和第二卡合部，所述侧板通过所述第一卡合部与所述第二卡合部相配合而卡合在所述第二侧壁上；
所述第一卡合部为卡口，所述第二卡合部为与所述卡口相配合的凸块；或，所述第一卡合部为凸块，所述第二卡合部为与所述凸块相配合的卡口。
本发明解决其另一技术问题所采用的技术方案是：提供一种电磁器件，包括上述的电子器件封装盒、以及安装在所述封装盒内的电子器件。
优选地，所述电子器件包括第一电子器件和第二电子器件，所述第一电子器件位于所述封装盒的第一基座的第一空间内并与第一针脚电连接，所述第二电子器件位于所述封装盒的第二基座的第二空间内并与第二针脚电连接。
本发明的电子器件封装盒，通过第一基座和第二基座分别安装电子器件，且第二基座和第一基座上的用于放置电子器件的空间开口朝向相同且通过第二基座相互隔离，方便电子器件分别在第二基座和第一基座上的安装缠线，减少电子器件的缠线工时，利于提高生产效率；此外，安装在第二基座上的电子器件通过第二基座与第一基座上的电子器件相互隔离，减少电子器件之间的干扰 。使用该封装盒的电磁器件，抗干扰性能好，可靠性高。
附图说明
下面将结合附图及实施例对本发明作进一步说明，附图中：
图1是本发明第一实施例的电子器件封装盒的分解结构示意图；
图2是图1所示电子器件封装盒的组合结构示意图；
图3是图1所示电子器件封装盒中第一卡合部和第二卡合部一种实施方式的结构示意图；
图4是本发明第二实施例的电子器件封装盒的分解结构示意图。
具体实施方式
为了对本发明的技术特征、目的和效果有更加清楚的理解，现对照附图详细说明本发明的具体实施方式。
如图1-2所示，本发明第一实施例的电子器件封装盒， 包括依次组合的第一基座1和第二基座2、盖合在第二基座2上的封盖3、数个第一针脚4以及数个第二针脚5；第一针脚4固定在第一基座1上，第二针脚5固定在第二基座2上，该第一针脚4和第二针脚5分别用于与电子器件电连接。
第一基座1上形成有开口朝向第二基座2的第一空间10，第二基座2上形成有开口朝向封盖3的第二空间20，该第一空间10和第二空间20均用于容纳电子器件（例如线圈），电子器件分别通过导线缠绕在第一针脚4和第二针脚5上实现电连接。第二基座2覆盖在第一基座1的第一空间10的开口侧，封盖3覆盖在第二基座2上的第二空间20的开口侧，从而组成整体的封装盒。
如图1中所示，将容纳在第一基座1的第一空间10内的电子器件称为第一电子器件100，容纳在第二基座2的第二空间20内的电子器件称为第二电子器件200。以图1所示封装盒放置方向为例，第一空间10和第二空间20均开口朝上，第一电子器件100和第二电子器件200放置时分别可从第一空间10和第二空间20上方放置其中，并进行缠线，操作方便且快捷，节省缠线工时，从而可提高生产效率。
每一第一针脚4均具有相连接的第一端41和第二端42，每一第二针脚5均具有相连接的第一端51和第二端52。每一第一针脚4的第一端41伸出第一基座1的侧面或背向第二基座2的表面，每一第一针脚4的第二端42伸出第一基座1朝向第二基座2的表面，第一针脚4的该第二端42形成供电子器件（即第一电子器件100）的导线101缠绕的连线端。每一第二针脚5的第一端51伸出第二基座2的侧面或朝向第一基座1的表面，每一第二针脚5的第二端52伸出第二基座2朝向封盖3的表面，第二针脚5的第二端52形成供电子器件（即第二电子器件200）的导线201缠绕的连线端。
为了避免电子器件的导线之间相互缠绕，第一基座1 对应数个第一针脚4的第二端42设有数个第一线槽6，每一第一线槽6具有位于第一基座1朝向第二基座2的表面上的第一出线端61、以及位于第一空间10内壁面的第一入线端62，第一电子器件100的导线101一一从第一入线端62穿进第一线槽6内，并从第一出线端61穿出后缠绕在对应的第一针脚4的第二端42上，以实现第一电子器件100和第一针脚4之间的连接。第二基座2对应数个第二针脚5的第二端52设有数个第二线槽7，每一第二线槽7具有位于第二基座2朝向封盖3的表面上的第二出线端71、以及位于第二空间20内壁面的第二入线端72，第二电子器件200的导线201一一从第二入线端72穿进第二线槽7内，并从第二出线端71穿出后缠绕在对应的第二针脚5的第二端52上，以实现第二电子器件200和第二针脚5之间的连接。
其中，第一基座1可包括第一基板11、以及围绕第一基板11的周缘连接在第一基板11上的第一侧壁12，第一空间10形成在第一基板11和第一侧壁12的内壁面之间。第一针脚4的第一端41伸出第一侧壁12的侧面或第一基板11背向第二基座2的表面，以与外部电子器件电连接；第一针脚4的第二端42则伸出第一侧壁12朝向第二基座2的表面，并可收容到第一基座1顶部和第二基座2之间。第一线槽6对应第一针脚4设置在第一侧壁12上。
第二基座2可包括第二基板21、以及围绕第二基板21的周缘连接在第二基板21上的第二侧壁22，第二空间20形成在第二基板21和第二侧壁22的内壁面之间。第二针脚5的第一端51伸出第二侧壁22的侧面或第二侧壁22朝向第一基座1的一端端面，以与外部电子器件电连接；第二针脚5的第二端52则伸出第二侧壁22朝向封盖3的表面，并可收容到第二基座2顶部和封盖3之间。第二线槽7对应第二针脚5设置在第二侧壁22上。该第二基座2通过第二侧壁22朝向第一基座1的一端与第一基座1的第一侧壁12配合。在该封装盒中，第二空间20通过第二基板21与第一空间10相互隔离，从而避免第一空间10内的第一电子器件100和第二空间20内的第二电子器件200之间相互干扰，影响封装盒的可靠性。
第二侧壁22可通过其内周壁面卡合到第一侧壁12的外周侧面上，而与第一侧壁12稳固配合在一起。进一步地，为了加强第一基座1和第二基座2的配合稳固性，在第一基板11的外端缘可设有第一卡接部110，对应地，在第二侧壁22朝向第一基座1的一端端面设有与第一卡接部110配合的第二卡接部220。第一卡接部110可为内凹的卡槽，第二卡接部220对应为凸出的凸块；或者，第一卡接部110为凸块，第二卡接部220为卡槽。
在本实施例中，第一针脚4的第一端41伸出第一基板11背向第二基座2的表面，第二针脚5的第一端51伸出第二侧壁22朝向第二基座2的一端端面，并延伸至与第一针脚4的第一端41间隔平行。因此，第一基座1还可包括自第一基板11的外端缘向外延伸的第一插接板13，第一插接板13上设有数个插接孔130，供第二针脚5的第一端51放入。当第二基座2组合到第一基座1上时，第二针脚5的第一端51一一对应放入插接孔130而位于第一基板11背向第二基座2的表面该侧。第二侧壁22朝向第一基座1的一端端面则可于插接孔130外侧接合在第一插接板13上。
进一步地，第一插接板13还可设有第三卡接部131，与第一插接板13对应的第二侧壁22设有第四卡接部221，通过第四卡接部221和第三卡接部131相互配合实现第二侧壁22和第一插接板13之间的卡合。该第 三卡接部131可为凸设在第一插接板13上的卡板或凹设的卡槽，第四卡接部221对应为凹设的卡槽或凸设的卡板。
又如图1所示，在本实施例中，数个第一针脚4分成两组设置在第一空间10的相对两侧，每一组第一针脚4分成平行的两排，且两排的第一针脚4相互错开，这样使得每一第一针脚4对应的第一线槽6的第一入线端62均位于第一空间10的内壁面（即是第一侧壁12的内壁面），第一出线端61间隔位于第一基座1朝向第二基座2的表面（即第一侧壁12朝向第二基座2的一端端面）上。数个第二针脚5对应第一针脚4分成两组设置在第二空间20的相对两侧，每一组均包括数个间隔的第二针脚5；第二针脚5的第一端51与第一针脚4的第一端41相互平行且相互错开，避免相互干扰。
在本实施例中，第一入线端62在第一侧壁12上的开口和第一出线端61在第一侧壁12的端面上的开口相向延伸至在第一侧壁12的对角处相接并连通，形成开设在第一侧壁12上的开槽，更加方便第一电子器件100的导线101的穿入，且开槽形式的第一线槽6设置更简单；第二入线端72在第二侧壁22上的开口和第二出线端71在第二侧壁22的端面上的开口相向延伸至在第二侧壁22的对角处相接并连通，形成开设在第二侧壁22上的开槽，更加方便第二电子器件200的导线201的穿入，且开槽形式的第二线槽7设置更简单。
该实施例的封装盒中，封盖3可包括封板31、以及围绕封板31的周缘连接在封板31上的侧板32，封盖3通过侧板32与第二侧壁22配合而盖合在第二基座2上。 在本实施例中，第二侧壁22的外周侧面上设有台阶222，侧板32卡合在第二侧壁22的外周侧面上并接合在台阶222上。
此外，侧板32和第二侧壁22外周侧面上还分别设有第一卡合部81和第二卡合部82，侧板32通过第一卡合部81与第二卡合部82相配合而卡合在第二侧壁22上。其中，第一卡合部81为卡口，第二卡合部82为与卡口相配合的凸块；或者，第一卡合部81为凸块，第二卡合部82为与凸块相配合的卡口；第一卡合部81和第二卡合部82的数量及位置可根据实际需要设置。在图1所示的实施例中，台阶222凹设在第二侧壁22的外周侧面上，第一卡合部81和第二卡合部82分别设置在侧板32和第二侧壁22相互叠合的位置处。
作为第一卡合部81和第二卡合部82的一种实施方式，如图1所示，第二卡合部82与数个 第二针脚5同侧而设置在 第二侧壁22外周相对两侧面上，第一卡合部81相对应设置在侧板32的相对两侧面上；作为第一卡合部81和第二卡合部82的另一种实施方式，如图3所示，第二卡合部82与数个 第二针脚5不同侧而设置在 第二侧壁22外周相对两侧面上，第一卡合部81相对应设置在侧板32的相对两侧面上。可以理解地，第二侧壁22外周侧面的数个侧面也可均设有第二卡合部82。
可以理解地，在其他实施例中，侧板32也可仅通过台阶222和第二侧壁22卡合，或仅通过第一卡合部81和第二卡合部82的配合与第二侧壁22卡合。
优选地，第一基座1、第二基座2以及封盖3均可以采用PBT（聚对笨二甲酸丁二醇酯）材料制成，具有优良的化学稳定性、机械强度、电绝缘特性和热稳定性；当然，第一基座1、第二基座2以及封盖3也可以根据需求，采用其他材质制成。第一基座1可通过注塑成型包覆在数个第一针脚4上，以使得第一针脚4和第一基座1之间形成紧密的组合体；同样，第二基座2可通过注塑成型包覆在数个第二针脚5上，使得第二针脚5和第二基座2之间形成紧密的组合体，提高封装盒的可靠性。
如图4所示，本发明第二实施例的电子器件封装盒，包括依次组合的第一基座1和第二基座2、盖合在第二基座2上的封盖3、数个第一针脚4以及数个第二针脚5；第一针脚4固定在第一基座1上，第二针脚5固定在第二基座2上，该第一针脚4和第二针脚5分别用于与电子器件电连接。
第一基座1上形成有开口朝向第二基座2的第一空间10，第二基座2上形成有开口朝向封盖3的第二空间20，该第一空间10和第二空间20均用于容纳电子器件（例如线圈），电子器件分别通过导线缠绕在第一针脚4和第二针脚5上实现电连接。第二基座2覆盖在第一基座1的第一空间10的开口侧，封盖3覆盖在第二基座2上的第二空间20的开口侧，从而组成整体的封装盒。
该实施例与上述第一实施例不同的在于：第一针脚4的第一端41伸出第一基座1的第一侧壁12的侧面，以与外部电子器件电连接；第二针脚5的第一端51伸出第二基座2的第二侧壁22的侧面，以与外部电子器件电连接。该第一针脚4的第一端41和第二针脚5的第一端51相互间隔平行。第二基座2的第二侧壁22卡合到第一基座1的第一侧壁12外周侧面上，该第二侧壁22对应第一针脚4的第二端42可设有嵌槽223；当第二侧壁22配合到第一侧壁12外周侧面时，嵌槽223一一放入第一针脚4的第一端41。
该实施例的第一基座1、第二基座2及封盖3可参照上述第一实施例中所述，在此不再赘述。
可以理解地，上述第一、第二实施例中的封盖3还可为板状盖板。第二侧壁22上设有向封盖3方向延伸的接合部，且接合部位于第二针脚5的第二端外侧，封盖3盖合在接合部上，从而覆盖在第二基座2的第二空间20的开口侧。
参考图1-图4所示，本发明的电磁器件 ，包括电子器件封装盒、以及安装在封装盒内的电子器件，该封装盒为上述第一实施例或第二实施例中的电子器件封装盒。其中，电子器件包括第一电子器件100和第二电子器件200，第一电子器件100位于封装盒的第一基座1的第一空间10内并与第一针脚4电连接，第二电子器件200位于封装盒的第二基座2的第二空间20内并与第二针脚5电连接。电子器件可包括线圈或其他电子元件，例如PCB、电阻、电容、电感、半导体零件等。
该电磁器件组装时，第一电子器件100可自第一基座1上方放入第一空间10内，将第一电子器件100的导线101分别放入第一线槽6而缠绕在第一针脚4的第二端42上，再通过焊锡将导线101和第二端42焊接在一起；第二电子器件200可自第二基座2上方放入第二空间20内，将第二电子器件200的导线201分别放入第二线槽7而缠绕在第二针脚5的第二端52上，再通过焊锡将导线201和第二端52焊接在一起；接着将安装好第二电子器件200的第二基座2覆盖到第一基座1的第一空间10开口侧，最后将封盖3覆盖到第二基座2的第二空间20开口侧，完成组装。其中，封盖3也可先覆盖到第二基座2上，再将带有封盖3的第二基座2覆盖到第一基座1上。
可以理解地，第一基座1和第二基座2也适用于 安装有PCB板或在PCB上有电阻器、电容器、半导体等零件的基座。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种电子器件封装盒 ，其特征在于，包括依次组合的第一基座（1）和第二基座（2）、盖合在所述第二基座（2）上的封盖（3）、以及分别固定在所述第一基座（1）和所述第二基座（2）上的数个用于与电子器件电连接的第一针脚（4）和第二针脚（5）；
    所述第一基座（1）上形成有开口朝向所述第二基座（2）、用于容纳电子器件的第一空间（10），所述第二基座（2）上形成有开口朝向所述封盖（3）、用于容纳电子器件的第二空间（20）；所述第二基座（2）覆盖在所述第一基座（1）的所述第一空间（10）的开口侧，所述封盖（3）覆盖在所述第二基座（2）上的所述第二空间（20）的开口侧。
  2. 根据权利要求1所述的电子器件封装盒，其特征在于，每一所述第一针脚（4）的第一端（41）伸出所述第一基座（1）的侧面或背向所述第二基座（2）的表面，每一所述第一针脚（4）的第二端（42）伸出所述第一基座（1）朝向所述第二基座（2）的表面，所述第一针脚（4）的第二端（42）形成供所述电子器件的导线缠绕的连线端；
    每一所述第二针脚（5）的第一端（51）伸出所述第二基座（2）的侧面或朝向所述第一基座（1）的表面，每一所述第二针脚（5）的第二端（52）伸出所述第二基座（2）朝向所述封盖（3）的表面，所述第二针脚（5）的第二端（52）形成供所述电子器件的导线缠绕的连线端。
  3. 根据权利要求2所述的电子器件封装盒 ，其特征在于，所述第一基座（1）对应数个所述第一针脚（4）的第二端（42）设有数个供所述电子器件的导线放入的第一线槽（6），每一所述第一线槽（6）具有位于所述第一基座（1）朝向所述第二基座（2）的表面上的第一出线端（61）、以及位于所述第一空间（10）内壁面的第一入线端（62）；
    所述第二基座（2）对应数个所述第二针脚（5）的第二端（52）设有数个供所述电子器件的导线放入的第二线槽（7），每一所述第二线槽（7）具有位于所述第二基座（2）朝向所述封盖（3）的表面上的第二出线端（71）、以及位于所述第二空间（20）内壁面的第二入线端（72）。
  4. 根据权利要求2所述的电子器件封装盒 ，其特征在于，所述第一基座（1）包括第一基板（11）、以及围绕所述第一基板（11）的周缘连接在所述第一基板（11）上的第一侧壁（12），所述第一空间（10）形成在所述第一基板（11）和所述第一侧壁（12）的内壁面之间，所述第一针脚（4）的第一端（41）伸出所述第一侧壁（12）的侧面或第一基板（11）背向所述第二基座（2）的表面，所述第一针脚（4）的第二端（42）伸出所述第一侧壁（12）朝向所述第二基座（2）的表面；
    所述第二基座（2）包括第二基板（21）、以及围绕所述第二基板（21）的周缘连接在所述第二基板（21）上的第二侧壁（22），所述第二空间（20）形成在所述第二基板（21）和所述第二侧壁（22）的内壁面之间，所述第二针脚（5）的第一端（51）伸出所述第二侧壁（22）的侧面或第二侧壁（22）朝向所述第一基座（1）的一端端面，所述第二针脚（5）的第二端（52）伸出所述第二侧壁（22）朝向所述封盖（3）的表面；所述第二基座（2）通过所述第二侧壁（22）朝向所述第一基座（1）的一端与所述第一基座（1）的第一侧壁（12）配合。
  5. 根据权利要求4所述的电子器件封装盒，其特征在于，所述第一基板（11）的外端缘设有第一卡接部（110），所述第二侧壁（22）朝向所述第一基座（1）的一端端面设有与所述第一卡接部（110）配合的第二卡接部（220）。
  6. 根据权利要求4所述的电子器件封装盒 ，其特征在于，所述第一基座（1）还包括自所述第一基板（11）的外端缘向外延伸的第一插接板（13），所述第一插接板（13）上设有数个供所述第二针脚（5）的第一端（51）放入的插接孔（130）；
    所述第二侧壁（22）朝向所述第一基座（1）的一端端面于所述插接孔（130）外侧接合在所述第一插接板（13）上。
  7. 根据权利要求4所述的电子器件封装盒，其特征在于，所述封盖（3）包括封板（31）、以及围绕所述封板（31）的周缘连接在所述封板（31）上的侧板（32）；所述封盖（3）通过所述侧板（31）与所述第二侧壁（22）配合而盖合在所述第二基座（2）上；或者，
    所述封盖（3）为板状盖板，所述第二侧壁（22）上设有向所述封盖（3）方向延伸的接合部，且所述接合部位于所述第二针脚（5）的第二端（52）外侧，所述封盖（3）盖合在所述接合部上。
  8. 根据权利要求7所述的电子器件封装盒，其特征在于，所述第二侧壁（22）的外周侧面上设有台阶（222），所述侧板（32）卡合在所述第二侧壁（22）的外周侧面上并接合在所述台阶（222）上；和/或，
    所述侧板（32）和所述第二侧壁（22）外周侧面上分别设有第一卡合部（81）和第二卡合部（82），所述侧板（32）通过所述第一卡合部（81）与所述第二卡合部（82）相配合而卡合在所述第二侧壁（22）上；
    所述第一卡合部（81）为卡口，所述第二卡合部（82）为与所述卡口相配合的凸块；或，所述第一卡合部（81）为凸块，所述第二卡合部（82）为与所述凸块相配合的卡口。
  9. 一种电磁器件，其特征在于，包括权利要求1-8任一项所述的电子器件封装盒、以及安装在所述封装盒内的电子器件。
  10. 根据权利要求9所述的电磁器件，其特征在于，所述电子器件包括第一电子器件（100）和第二电子器件（200），所述第一电子器件（100）位于所述封装盒的第一基座（1）的第一空间（10）内并与第一针脚（4）电连接，所述第二电子器件（200）位于所述封装盒的第二基座（2）的第二空间（20）内并与第二针脚（5）电连接。
PCT/CN2015/071623 2014-05-15 2015-01-27 电子器件封装盒及电磁器件 WO2015172582A1 (zh)

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