WO2015165745A1 - Système de détection - Google Patents

Système de détection Download PDF

Info

Publication number
WO2015165745A1
WO2015165745A1 PCT/EP2015/058306 EP2015058306W WO2015165745A1 WO 2015165745 A1 WO2015165745 A1 WO 2015165745A1 EP 2015058306 W EP2015058306 W EP 2015058306W WO 2015165745 A1 WO2015165745 A1 WO 2015165745A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
circuit board
printed circuit
air pressure
opening
Prior art date
Application number
PCT/EP2015/058306
Other languages
German (de)
English (en)
Inventor
Uwe Hansen
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2015165745A1 publication Critical patent/WO2015165745A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Definitions

  • the invention relates to a sensor arrangement with a sensor and a printed circuit board.
  • the sensor in particular electrical connections of the sensor, is soldered to the circuit board.
  • the sensor is preferably designed to detect a particular static air pressure and / or humidity.
  • Sensors for detecting an air pressure or a humidity are known with a sensor housing, which surrounds the sensor and a circuit for signal processing of the sensor signal. Both the sensor and the signal processing circuit may be disposed on a common circuit board and connected to the common circuit board.
  • the senor has a surface with a sensor opening for detecting an air pressure, in particular an ambient air pressure surrounding the sensor.
  • the sensor also has at least one electrical connection, which is preferably formed as an electrically conductive surface region on the surface of the sensor.
  • the surface of the sensor faces the printed circuit board, wherein the electrical connection by means of a solder, in particular a solder ball, also called bump in English, is connected to the printed circuit board.
  • the printed circuit board also has a breakthrough, which is arranged so that the sensor can detect the air pressure through the opening through the sensor opening.
  • the senor advantageously can be connected to a printed circuit board, further advantageously a housing surrounding the sensor can be omitted insofar as the sensor opening or an area of the sensor, which is designed to detect the air pressure, through the breakthrough of the circuit board through with the ambient air Contact can have and so the housing surrounding the sensor can be omitted with a breakthrough.
  • the sensor is preferably designed to generate a sensor signal which represents the air pressure and / or the air humidity and to output the sensor signal on the output side.
  • a gap extends between the sensor and the printed circuit board, wherein the gap is preferably circumferentially sealed with a sealing agent, in particular a sealing compound, so that the air pressure can only be detected through the opening.
  • a sealing agent in particular a sealing compound
  • the sealant is formed for example by an epoxy resin, preferably, the sealant is a so-called underfill material comprising epoxy resin.
  • the sealant is thixotropic in such a way that the sealant can be sucked in from the aforementioned gap by means of capillary forces, the sealant reaching as far as the breakthrough and thus not being able to flow into the aperture.
  • the senor is designed as a housing-free semiconductor module, also called Bare-Die.
  • the semiconductor device can be advantageous advantageously connected to the circuit board, so that the electrical connections, which are formed by the so-called bumps or solder balls, can be omitted an otherwise necessary Drahtbonditati.
  • the sensor as a caseless semiconductor component, for example, in a further step after soldering and after sealing with epoxy resin completely by means of a potting compound, such as a further epoxy resin, are closed.
  • the sensor arrangement has an integrated circuit which is designed for signal processing of the sensor signal and which is electrically connected on the input side to the sensor and more preferably is solder-connected to the printed circuit board.
  • the sensor can advantageously advantageously be arranged together with the circuit, in particular a chip for signal processing, together on a printed circuit board, whereby a circuit for signal processing and the housing surrounding the sensor can be dispensed with.
  • the senor and / or the circuit is connected to the printed circuit board by means of flip-chip mounting.
  • the sensor arrangement can advantageously be provided at low cost.
  • the senor and / or the circuit by means of SM D soldering, in particular by means of a reflow soldering, connected to the circuit board.
  • the printed circuit board on a side opposite the sensor on electrical connections for soldering to another circuit board, so that the circuit board and the other circuit board are spaced apart such that an air pressure through the through break can be detected.
  • the circuit board can advantageously be connected as a sensor module, which includes the circuit board, the sensor or additionally the circuit for signal processing of the sensor signal, by means of flip-chip soldering or reflow soldering with the other circuit board.
  • a distance of the printed circuit board from the further printed circuit board is for example at least 100 micrometers, more preferably between 50 micrometers and 300 micrometers.
  • the electrical connections of the sensor are arranged in the gap between the sensor and the printed circuit board. More preferably, the gap of the sealing means - preferably circumferentially - filled in the region of the connections. More preferably, the terminals are embedded in the sealant. As a result, the connections are advantageously protected from moisture of the ambient air, which can pass through the opening in the gap.
  • the sensor arrangement can advantageously be provided at low cost, as far as the electrical connections can not only be arranged at the edge of the circuit board, but can also be distributed on a surface of the circuit board, which is opposite to the other circuit board.
  • the terminals for solder bonding with the further printed circuit board are formed in a region adjacent to the sensor. More preferably, the region of the circuit board on which the sensor is arranged, free of mechanical connections to the other circuit board.
  • the sensor can advantageously oscillate together with a part of the printed circuit board on which the sensor is connected to the printed circuit board relative to the other printed circuit board or experience thermally induced thermal expansions.
  • the sensor signal can be largely free or free of artifacts, which are superimposed on the sensor signal, which represents the measured variable to be detected, and this falsify. It was in fact recognized that the sensor, in particular the previously mentioned housing-less sensor, in particular a semiconductor sensor, is sensitive to mechanical bending of the sensor module. Such transfers can act on the sensor module, for example, from the printed circuit board with which the sensor is soldered.
  • the senor is a MEMS sensor.
  • the sensor can advantageously be designed to save space.
  • a diameter of the aperture in the circuit board is greater than an extension of the gap between the sensor and the circuit board.
  • the aforementioned breakdown in the printed circuit board preferably has a diameter between 20 microns and 300 microns.
  • FIG. 1 shows an exemplary embodiment of a sensor arrangement with a sensor and a printed circuit board connected to the sensor, which is designed to detect an air pressure or a humidity through an opening in a printed circuit board;
  • FIG. 1 shows an exemplary embodiment of a sensor arrangement 1.
  • the sensor 2 has an opening 3, the sensor 2 being designed to detect an air pressure and / or an air humidity of an ambient air present at the opening 3 and to generate a sensor signal representing the air pressure and / or the air humidity.
  • the sensor assembly 1 in this embodiment also includes a printed circuit board 4.
  • the sensor 2 is connected by means of the printed circuit board 4 by means of solder balls in flip-chip mounting.
  • the sensor 2 has a side facing the printed circuit board 4, which forms a surface area of the surface 29 of the sensor 2.
  • the opening 3 for detecting the air pressure and / or the humidity is formed on the circuit board 4 facing side.
  • electrical connections 6, 7, 10 and 11 are formed on the same side and electrical connections, in this embodiment.
  • the electrical connections 6, 7, 10 and 11 are formed in this embodiment by an electrically conductive layer, which forms a surface region of the circuit board 4 facing surface 29.
  • the printed circuit board 4 facing surface 29 of the sensor 2 is flat in this embodiment.
  • the sensor 2 is cuboid in this embodiment and is a caseless semiconductor, also called bare die in English.
  • the electrical connections 6, 7, 10 and 11 are each connected by means of a solder ball, in flip-chip mounting to the circuit board 4.
  • the electrical connection 6 by means of a solder bead 9 and the electrical connection 7 by means of a
  • the electrical connection 10 by means of a solder bead 12 and the electrical connection 1 1 by means of a solder ball 13 to the circuit board 4 and there electrically connected to a corresponding conductor for electrically connecting the sensor 2 to the circuit board 4.
  • the sensor 2 which has the solder balls 8, 9, 12 and 13 already at the corresponding contacts 6, 7, 10 and 1 1, are placed on the circuit board 4 and by means of reflow Soldering be soldered to the circuit board 4.
  • the sensor 2 is arranged at a distance from the printed circuit board 4, so that a gap 18 is formed between the sensor 2 and the printed circuit board 4.
  • the gap 18 is at least partially filled in this embodiment between the sensor 2 and the circuit board 4 by means of a sealant 17.
  • the sealing means 17 is, for example, a highly viscous epoxy resin, which is designed to flow into the gap 18.
  • the circuit board 4 has an opening 5.
  • the opening 5 has a smaller diameter 21 than a flat extension of the sensor 2, so that the opening 5 is covered by the sensor 2 from one side.
  • the opening 3 of the sensor 2 is arranged and formed, through the opening 5 and the gap 18, which is formed in the region of the opening 5 free of the sealing means 17 to detect the air pressure of an ambient air 25 or to detect a humidity of the ambient air 25.
  • the aperture 5 in this embodiment has a diameter 21 between 20 and 50 microns.
  • the aperture 5 is drilled in this embodiment by means of a drill or generated by means of a laser in the circuit board 4.
  • a circuit 14 for signal processing of the sensor signal generated by the sensor 2 is soldered in this embodiment, too.
  • the circuit 14 is connected in this embodiment by means of flip-chip mounting to the circuit board 4.
  • An electrical terminal 15 of the circuit 14 is exemplified, which is electrically connected by means of an exemplary designated solder ball 16 with a corresponding conductor track of the printed circuit board 4.
  • the sensor 2 is connected on the output side to the circuit 14 via a connecting line 24, so that the circuit 14 can receive the sensor signal via the connecting line 24, which is formed in this embodiment as a conductor track.
  • the circuit 14 is sealed in this embodiment by means of a sealing means 17, in this embodiment by means of a sealing mass bead to the circuit board 4 through.
  • FIG. 2 shows the sensor arrangement 1 already shown in FIG. 1, which is soldered by way of example to another printed circuit board 19.
  • the solder connection between the printed circuit board 19 and the printed circuit board 4 in this exemplary embodiment comprises four solder bumps, of which one solder bump 23 is designated by way of example and connects a connection 28 facing the printed circuit board 19 to the further printed circuit board 19.
  • the four solder balls are in this embodiment in a gap 27 on a surface region which is arranged between an areal extent of the circuit 14 and the circuit board 19.
  • An end portion 26 of the printed circuit board 4, on which the sensor 2 is arranged, can thus - in the manner of a springboard - swing free, in particular contactless relative to the circuit board 19 or decouple the sensor 2 from a thermal expansion of the circuit board 4.
  • the printed circuit board 4 is spaced from the printed circuit board 19 by means of a distance 20 at least in the region of the sensor 2, so that a gap with a gap thickness of the distance 20 between the printed circuit board 4 and the printed circuit board 19 is formed.
  • the sensor 2 can thus detect at the opening 3 the air pressure and / or a humidity of the ambient air 25 through the aperture 5 and further via the gap 27 with the gap thickness of the distance 20.
  • the printed circuit board 4, in particular the circuit 14 and the sensor 2 can be closed and covered, for example, by means of a potting compound 22.
  • the sealing compound 22 is formed for example by a damping formed resin, in particular epoxy resin.
  • the printed circuit board 4 can be additionally damped so advantageous by means of the potting compound 22 so that vibrations, in particular structure-borne noise from the circuit board 19, which are transmitted via the solder balls such as the solder ball 23 on the circuit board 4, can be effectively damped in the sensor 2.
  • the sensor 2 can advantageously not experience any deformation of a sensor body, in particular semiconductor material of the sensor 2, which can falsify the sensor signal and generate the aforementioned artifacts in the sensor signal.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Wire Bonding (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne un système de détection (1) comprenant un capteur (2) et une carte de circuit imprimé (4). Le capteur, en particulier les bornes de raccordements électriques du capteur, sont liés par brasage à la carte de circuit imprimé. Le capteur est de préférence conçu pour détecter la pression de l'air, en particulier statique, et/ou l'humidité de l'air. Selon l'invention, le capteur comporte une surface (29) munie d'une ouverture de détection (3) pour la détection de la pression de l'air. Le capteur comporte également au moins une borne de raccordement électrique (6, 7, 10, 11) qui est réalisée sur la surface du capteur faisant face à la carte de circuit imprimé. La borne de raccordement électrique est reliée à la carte de circuit imprimé par un agent de brasage. La carte de circuit imprimé comporte un passage traversant (5) qui est agencée de telle manière que le capteur peut effectuer la détection à travers ce passage traversant par l'intermédiaire de l'ouverture de détection.
PCT/EP2015/058306 2014-04-29 2015-04-16 Système de détection WO2015165745A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014208100.9 2014-04-29
DE102014208100.9A DE102014208100A1 (de) 2014-04-29 2014-04-29 Sensoranordnung

Publications (1)

Publication Number Publication Date
WO2015165745A1 true WO2015165745A1 (fr) 2015-11-05

Family

ID=52998128

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/058306 WO2015165745A1 (fr) 2014-04-29 2015-04-16 Système de détection

Country Status (3)

Country Link
DE (1) DE102014208100A1 (fr)
TW (1) TW201541059A (fr)
WO (1) WO2015165745A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015218355A1 (de) 2015-09-24 2017-03-30 Robert Bosch Gmbh Mikroelektronische Bauelementanordnung und Herstellungsverfahren für eine mikroelektronische Bauelementanordnung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998005935A1 (fr) * 1996-08-08 1998-02-12 Integrated Sensing Systems, Inc. Procede d'assemblage de microdetecteurs
WO1998027411A1 (fr) * 1996-12-17 1998-06-25 Laboratorium Für Physikalische Elektronik Institut Für Quantenelektronik Procede d'application d'un microsysteme ou d'un convertisseur sur un substrat, et dispositif fabrique selon ce procede

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6441503B1 (en) * 2001-01-03 2002-08-27 Amkor Technology, Inc. Bond wire pressure sensor die package
DE10303263B4 (de) * 2003-01-28 2012-01-05 Infineon Technologies Ag Mikrophonanordnung
DE102004003413A1 (de) * 2004-01-23 2005-08-11 Robert Bosch Gmbh Verfahren zum Verpacken von Halbleiterchips und entsprechende Halbleiterchipanordnung
US7781852B1 (en) * 2006-12-05 2010-08-24 Amkor Technology, Inc. Membrane die attach circuit element package and method therefor
EP1970688A3 (fr) * 2007-03-16 2010-06-23 CSEM Centre Suisse d'Electronique et de Microtechnique SA Recherche et Développement Dispositif de mesure de pression et procédé pour sa fabrication et son utilisation
DE102010040370B4 (de) * 2010-09-08 2016-10-06 Robert Bosch Gmbh MEMS-Mikrofon-Package
DE102011005676A1 (de) * 2011-03-17 2012-09-20 Robert Bosch Gmbh Bauteil
DE102011075260B4 (de) * 2011-05-04 2012-12-06 Robert Bosch Gmbh MEMS-Mikrofon
DE102011075822B4 (de) * 2011-05-13 2016-07-14 Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. Vorrichtung zur kapazitiven Druckbestimmung
DE102013217301A1 (de) * 2013-08-30 2015-03-05 Robert Bosch Gmbh Bauteil

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998005935A1 (fr) * 1996-08-08 1998-02-12 Integrated Sensing Systems, Inc. Procede d'assemblage de microdetecteurs
WO1998027411A1 (fr) * 1996-12-17 1998-06-25 Laboratorium Für Physikalische Elektronik Institut Für Quantenelektronik Procede d'application d'un microsysteme ou d'un convertisseur sur un substrat, et dispositif fabrique selon ce procede

Also Published As

Publication number Publication date
TW201541059A (zh) 2015-11-01
DE102014208100A1 (de) 2015-10-29

Similar Documents

Publication Publication Date Title
DE102012206875B4 (de) Verfahren zum Herstellen eines hybrid integrierten Bauteils und entsprechendes hybrid integriertes Bauteil
DE102014200512B4 (de) Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren
DE102010006132B4 (de) Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC
DE102009001930B4 (de) Sensorbaustein
DE102012206854B4 (de) Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung
DE19730914B4 (de) Mikroelektronik-Baugruppe
EP1518098A1 (fr) Capteur haute pression comprenant une membrane de silicium et une couche de brasure
DE102012208031A1 (de) +Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung
DE10205127A1 (de) Halbleiterbauteil mit Sensor- bzw. Aktoroberfläche und Verfahren zu seiner Herstellung
DE102007051178A1 (de) Drucksensor mit einer verbesserten Anordnung eines Sensorchips zum Minimieren eines Einflusses von externen Schwingungen
DE102014211188A1 (de) Vertikal hybrid integriertes Bauteil mit Interposer zur Stressentkopplung einer MEMS-Struktur und Verfahren zu dessen Herstellung
WO2016016078A1 (fr) Capteur
WO1998000692A1 (fr) Capteur de pression a monter sur la face composants d'une carte de circuits imprimes
WO2018224278A1 (fr) Ensemble capteur de pression micromécanique et procédé de fabrication d'un ensemble capteur de pression micromécanique
WO2015165745A1 (fr) Système de détection
DE102014211197B4 (de) Mikromechanische Kombi-Sensoranordnung
WO2016082997A1 (fr) Ensemble comprenant un substrat de support et un composant de puissance mis en contact avec ce dernier par l'intermédiaire de contacts de connexion autour desquels est formée une métallisation
DE202005011253U1 (de) 3-D-Drucksensor
DE19826426C2 (de) Miniaturisiertes elektronisches System und Verfahren zu seiner Herstellung
KR101642142B1 (ko) 질량유량센서 및 질량유량센서를 구비한 차량
CN107646088B (zh) 具有原位印刷的传感器的集成电路
WO2014102121A1 (fr) Composant comprenant un élément de composant et un support
DE102019208867A1 (de) Vorrichtung zum Erfassen eines Drucks eines Fluids
DE10059813A1 (de) Vorrichtung zur Erfassung eines Fluiddrucks
DE102014211558A1 (de) Mikroelektromechanisches System und Verfahren zum Herstellen eines mikroelektromechanischen Systems

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15718190

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15718190

Country of ref document: EP

Kind code of ref document: A1