WO2014102121A1 - Composant comprenant un élément de composant et un support - Google Patents

Composant comprenant un élément de composant et un support Download PDF

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Publication number
WO2014102121A1
WO2014102121A1 PCT/EP2013/077238 EP2013077238W WO2014102121A1 WO 2014102121 A1 WO2014102121 A1 WO 2014102121A1 EP 2013077238 W EP2013077238 W EP 2013077238W WO 2014102121 A1 WO2014102121 A1 WO 2014102121A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
carrier
barrier structure
composite mass
composite
Prior art date
Application number
PCT/EP2013/077238
Other languages
German (de)
English (en)
Inventor
Eckart Schellkes
Ingo Henkel
Sebastian SCHULER-WATKINS
Nico GREINER
Koji MORIYASU
Masayuki NAKAHIRA
Original Assignee
Robert Bosch Gmbh
Bosch Corporation Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh, Bosch Corporation Japan filed Critical Robert Bosch Gmbh
Publication of WO2014102121A1 publication Critical patent/WO2014102121A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
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    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
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Definitions

  • the invention relates generally to the structure and connection technology (AVT) of components having at least one component, in particular a semiconductor component or a passive electronic component, which is mounted on a support, and in particular the AVT of components in which in at least one connection region between the component and the carrier is a composite mass.
  • AVT connection technology
  • the compound is applied point by point.
  • not all composites are suitable for this type of material application.
  • many adhesives can not be applied with sufficient accuracy due to their viscosity properties.
  • the volumes of "glue" generated during dispensing can In the case of an electrically conductive composite, short circuits can also occur in the terminal region of the components disadvantageous to the stability and strength of the mounting connection.
  • the barrier structure depends primarily on the type and material of the carrier. If the carrier is a printed circuit board substrate or a semiconductor substrate, the barrier structure can be easily formed by means of
  • the carrier which is embedded in a plastic molding compound
  • the arrangement and geometry of the barrier structure on the carrier depend on the layout of the device.
  • the mounting surface of the device facing the carrier comprises areas where the composite is required and desirable, areas where the presence of composite is uncritical, and critical areas where the composite is the functionality of the device or the entire device impaired. These critical areas must be separated from the remaining areas by the barrier structure.
  • the barrier structure is advantageously used to prevent penetration of the composite mass into the region below the deflectable structural element.
  • the opening edge of the trench 15 acts as a stop edge for the conductive adhesive 30. Depending on the amount of adhesive, the opening edge is still overcome. In this case, the trench structure forms a compensating volume for the conductive adhesive 30. Overall, the trench structure 15 prevents any confluence of the conductive adhesive 30 from the mutually separate terminal regions 13.
  • a sensor module 201 or 202 is in each case provided with a

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

L'invention se rapporte à des mesures qui, dans un composant (100) comprenant au moins un élément de composant (20) monté sur un support (10) au moyen d'une matière de liaison (30), permettent de limiter l'étalement latéral de la matière de liaison (30) à au moins une zone prédéterminée entre l'élément de composant (20) et le support (10). Selon l'invention, une structure formant barrière (15) est créée à cette fin dans la surface de montage du support (10).
PCT/EP2013/077238 2012-12-27 2013-12-18 Composant comprenant un élément de composant et un support WO2014102121A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012284738A JP2014126507A (ja) 2012-12-27 2012-12-27 圧力センサモジュール
JP2012-284738 2012-12-27

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WO2014102121A1 true WO2014102121A1 (fr) 2014-07-03

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107110726A (zh) * 2014-12-24 2017-08-29 株式会社藤仓 压力传感器以及压力传感器模块
US20210348976A1 (en) * 2019-01-31 2021-11-11 Robert Bosch Gmbh Micromechanical sensor device and corresponding manufacturing method

Citations (2)

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US20080164543A1 (en) * 2007-01-04 2008-07-10 Stmicroelectronics S.R.L. Package, in particular for MEMS devices and method of making same
US20120164775A1 (en) * 2007-01-24 2012-06-28 Stmicroelectronics S.R.L. Electronic device, system, and method comprising differential sensor mems devices and drilled substrates

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080164543A1 (en) * 2007-01-04 2008-07-10 Stmicroelectronics S.R.L. Package, in particular for MEMS devices and method of making same
US20120164775A1 (en) * 2007-01-24 2012-06-28 Stmicroelectronics S.R.L. Electronic device, system, and method comprising differential sensor mems devices and drilled substrates

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107110726A (zh) * 2014-12-24 2017-08-29 株式会社藤仓 压力传感器以及压力传感器模块
EP3239680A4 (fr) * 2014-12-24 2018-08-29 Fujikura Ltd. Capteur de pression et module de capteur de pression
US10720534B2 (en) 2014-12-24 2020-07-21 Fujikura Ltd. Pressure sensor and pressure sensor module
US20210348976A1 (en) * 2019-01-31 2021-11-11 Robert Bosch Gmbh Micromechanical sensor device and corresponding manufacturing method
US11906383B2 (en) * 2019-01-31 2024-02-20 Robert Bosch Gmbh Micromechanical sensor device having an ASIC chip integrated into a capping unit and corresponding manufacturing method

Also Published As

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