WO2014102121A1 - Component comprising component element and a support - Google Patents

Component comprising component element and a support Download PDF

Info

Publication number
WO2014102121A1
WO2014102121A1 PCT/EP2013/077238 EP2013077238W WO2014102121A1 WO 2014102121 A1 WO2014102121 A1 WO 2014102121A1 EP 2013077238 W EP2013077238 W EP 2013077238W WO 2014102121 A1 WO2014102121 A1 WO 2014102121A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
carrier
barrier structure
composite mass
composite
Prior art date
Application number
PCT/EP2013/077238
Other languages
German (de)
French (fr)
Inventor
Eckart Schellkes
Ingo Henkel
Sebastian SCHULER-WATKINS
Nico GREINER
Koji MORIYASU
Masayuki NAKAHIRA
Original Assignee
Robert Bosch Gmbh
Bosch Corporation Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh, Bosch Corporation Japan filed Critical Robert Bosch Gmbh
Publication of WO2014102121A1 publication Critical patent/WO2014102121A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
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    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
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    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Definitions

  • the invention relates generally to the structure and connection technology (AVT) of components having at least one component, in particular a semiconductor component or a passive electronic component, which is mounted on a support, and in particular the AVT of components in which in at least one connection region between the component and the carrier is a composite mass.
  • AVT connection technology
  • the compound is applied point by point.
  • not all composites are suitable for this type of material application.
  • many adhesives can not be applied with sufficient accuracy due to their viscosity properties.
  • the volumes of "glue" generated during dispensing can In the case of an electrically conductive composite, short circuits can also occur in the terminal region of the components disadvantageous to the stability and strength of the mounting connection.
  • the barrier structure depends primarily on the type and material of the carrier. If the carrier is a printed circuit board substrate or a semiconductor substrate, the barrier structure can be easily formed by means of
  • the carrier which is embedded in a plastic molding compound
  • the arrangement and geometry of the barrier structure on the carrier depend on the layout of the device.
  • the mounting surface of the device facing the carrier comprises areas where the composite is required and desirable, areas where the presence of composite is uncritical, and critical areas where the composite is the functionality of the device or the entire device impaired. These critical areas must be separated from the remaining areas by the barrier structure.
  • the barrier structure is advantageously used to prevent penetration of the composite mass into the region below the deflectable structural element.
  • the opening edge of the trench 15 acts as a stop edge for the conductive adhesive 30. Depending on the amount of adhesive, the opening edge is still overcome. In this case, the trench structure forms a compensating volume for the conductive adhesive 30. Overall, the trench structure 15 prevents any confluence of the conductive adhesive 30 from the mutually separate terminal regions 13.
  • a sensor module 201 or 202 is in each case provided with a

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

The invention relates to measurements which, in a component (100) having at least one component element (20) mounted on a support (10) by means of a composite material (30), allows the limited lateral expansion of the composite material (30) on at least one defined area between the component (20) and the support (10). According to the invention, a barrier structure (15) is formed in the mounting area of the support (10)

Description

Beschreibung Titel  Description title
Bauteil mit einem Bauelement und einem Träger Stand der Technik  Component with a component and a carrier prior art
Die Erfindung betrifft ganz allgemein die Aufbau-und Verbindungstechnik (AVT) von Bauteilen mit mindestens einem Bauelement, insbesondere einem Halbleiterbauelement oder einem passiven elektronischen Bauelement, das auf einem Träger montiert ist, und insbesondere die AVT von Bauteilen, bei denen sich in mindestens einem Verbindungsbereich zwischen dem Bauelement und dem Träger eine Verbundmasse befindet. The invention relates generally to the structure and connection technology (AVT) of components having at least one component, in particular a semiconductor component or a passive electronic component, which is mounted on a support, and in particular the AVT of components in which in at least one connection region between the component and the carrier is a composite mass.
Für die Ist- Level- Montage von mikromechanischen und mikroelektronischen Bauelementen auf einem Träger wird in der Praxis häufig eine Verbundmasse verwendet. Dabei kann es sich beispielsweise um einen Klebstoff oder eine Lotpaste handeln, mit dem bzw. der, je nach Materialzusammensetzung, lediglich eine mechanische Fixierung des Bauelements auf dem Träger realisiert wird oder auch eine elektrische Verbindung zwischen Bauelement und Träger hergestellt wird. Im Fall eines flächigen Trägers mit im Wesentlichen planer Oberfläche, wie z.B. einer Leiterplatte, wird die Verbundmasse vorteilhafterweise in einem Siebdruck- oder Schablonendruckverfahren auf den Träger aufgebracht. Mit dieser Technik kann die Verbundmasse sehr exakt positioniert und dosiert werden. Bei Trägern mit unebener Oberfläche, wie z.B. kunststoffumspritzten Stanzgittern, können diese Druckverfahren allerdings nicht angewendet werden. Deshalb wird die Verbundmasse in diesen Fällen meist auf die Trägeroberfläche dispensiert. Dabei wird die Verbundmasse punktweise aufgetragen. Allerdings eignen sich nicht alle Verbundmassen für diese Art des Materialauftrags. So lassen sich viele Klebstoffe aufgrund ihrer Viskositätseigenschaften nicht ausreichend exakt appli- zieren. In jedem Fall können die Volumina der beim Dispensen erzeugten„Kle- bepunkte" nicht sehr genau eingestellt werden und unterliegen vergleichsweise großen Schwankungen. Zu große Mengen an Verbundmasse können die Funktionalität von mikromechanischen Bauelementen beeinträchtigen. Im Fall einer elektrisch leitfähigen Verbundmasse können außerdem Kurzschlüsse im An- Schlussbereich der Bauelemente auftreten. Zu geringe Mengen an Verbundmasse wirken sich nachteilig auf die Stabilität und Festigkeit der Montageverbindung aus. For the actual level mounting of micromechanical and microelectronic components on a support, a composite mass is often used in practice. This may be, for example, an adhesive or a solder paste with which or, depending on the material composition, only a mechanical fixation of the device is realized on the support or an electrical connection between the component and the carrier is made. In the case of a flat carrier with a substantially flat surface, such as a printed circuit board, the composite is advantageously applied to the carrier in a screen printing or stencil printing process. With this technique, the composite mass can be positioned and dosed very accurately. For carriers with an uneven surface, such as plastic-coated punched grids, however, these printing methods can not be used. Therefore, the composite mass is usually dispensed in these cases on the support surface. The compound is applied point by point. However, not all composites are suitable for this type of material application. Thus, many adhesives can not be applied with sufficient accuracy due to their viscosity properties. In any case, the volumes of "glue" generated during dispensing can In the case of an electrically conductive composite, short circuits can also occur in the terminal region of the components disadvantageous to the stability and strength of the mounting connection.
Verbundmassen der hier in Rede stehenden Art werden aber nicht nur zur me- chanischen Fixierung und/oder elektrischen Kontaktierung von Bauelementen auf einem Träger verwendet, sondern auch zum Schutz solcher Verbindungen gegen Umwelteinflüsse, wie z.B. Schmutzpartikel und Feuchte, und zum Abbau von montage- und temperaturbedingten mechanischen Spannungen. Dazu werden in der Praxis beispielsweise Löt- oder Klebestellen häufig nachträglich noch mit ei- nem Underfillermaterial vergossen. Auch diese Verbundmaterialien können dieHowever, composite materials of the type in question are not only used for the mechanical fixation and / or electrical contacting of components on a carrier, but also for protecting such compounds against environmental influences, such as e.g. Dirt particles and moisture, and to reduce assembly and temperature-related mechanical stresses. For this purpose, in practice, for example, soldering or splices are often subsequently potted with an underfiller material. These composite materials can also
Funktionalität des Bauelements beeinträchtigen. Impair functionality of the device.
Offenbarung der Erfindung Disclosure of the invention
Mit der vorliegenden Erfindung werden Maßnahmen vorgeschlagen, durch die die laterale Ausbreitung der Verbundmasse auf mindestens einen definierten Bereich zwischen Bauelement und Träger begrenzt wird. Dies wird erfindungsgemäß durch eine Barrierestruktur in der Montageoberfläche des Trägers erreicht. With the present invention, measures are proposed by which the lateral propagation of the composite mass is limited to at least one defined area between the component and the carrier. This is achieved according to the invention by a barrier structure in the mounting surface of the carrier.
Erfindungsgemäß ist erkannt worden, dass die Anforderungen an einen präzise lokalisierten und dosierten Auftrag der Verbundmasse auf den Träger deutlich reduziert werden können, wenn die Bereiche in der Montageoberfläche des Trägers, die von Verbundmasse frei bleiben sollen, durch eine Barrierestruktur definiert und angelegt werden, und zwar noch vor der Montage des Bauelements auf dem Träger. Die erfindungsgemäßen Maßnahmen erweisen sich insbesondere bei Anwendung eines Dispensverfahrens zum Materialauftrag als vorteilhaft und eignen sich insbesondere für Träger, die ohnehin mit einer Struktur versehen werden, wie z.B. kunststoffumspritzte Stanzgitter eines Premoldgehäuses oder auch Halbleitersubstrate mit einer Medienzugangsöffnung. According to the invention, it has been recognized that the requirements for a precise localized and metered application of the composite to the carrier can be significantly reduced if the regions in the mounting surface of the carrier which are to remain free of composite are defined and applied by a barrier structure, and although still before the assembly of the device on the support. The measures according to the invention prove to be advantageous in particular when using a dispensing method for material application and are particularly suitable for carriers which in any case provide a structure be, such as plastic-coated stamped grid of a premold housing or semiconductor substrates with a media access opening.
Grundsätzlich gibt es verschiedene Möglichkeiten für die Realisierung einer er- findungsgemäßen Barrierestruktur in der Montageoberfläche des Trägers. In principle, there are various possibilities for the realization of a barrier structure according to the invention in the mounting surface of the carrier.
In einer ersten Ausführungsvariante der Erfindung umfasst die Barrierestruktur mindestens ein stegartiges Wandungselement, das von der Montageoberfläche des Trägers abragt. Das stegartige Wandungselement fungiert als Hindernis, das die Ausbreitung der Verbundmasse begrenzt. Die Barrierestruktur kann aber auch in Form einer Grabenstruktur in der Montageoberfläche des Trägers realisiert sein. Im Unterschied zu einem stegartigen Wandungselement bildet die Grabenstruktur kein Hindernis sondern allenfalls eine Stoppkante. Bei einer entsprechend großen Menge an Verbundmasse kann eine solche Grabenstruktur auch als Ausgleichsvolumen für einen etwaigen Überschuss an Verbundmasse fungieren und auf diese Weise ein Austreten der Verbundmasse aus dem definierten Verbindungsbereich verhindern. Selbstverständlich ist es auch möglich, stegartige Wandungselemente mit einer Grabenstruktur zu kombinieren und diese parallel verlaufend oder auch fortlaufend nebeneinander auszubilden. In a first embodiment of the invention, the barrier structure comprises at least one web-like wall element, which protrudes from the mounting surface of the carrier. The web-like wall element acts as an obstacle that limits the propagation of the composite mass. However, the barrier structure can also be realized in the form of a trench structure in the mounting surface of the carrier. In contrast to a web-like wall element, the trench structure forms no obstacle but at most a stop edge. With a correspondingly large amount of composite mass, such a trench structure can also act as a compensating volume for any excess of composite mass and in this way prevent leakage of the composite mass from the defined connection region. Of course, it is also possible to combine web-like wall elements with a trench structure and to form them parallel to each other or continuously next to one another.
Wie bereits erwähnt, kann es sich bei der Verbundmasse, deren laterale Ausbreitung begrenzt werden soll, um einen elektrisch isolierenden oder elektrisch leitfähigen Klebstoff handeln, mit dem das Bauelement auf dem Träger mechanisch fixiert wird und ggf. auch elektrisch kontaktiert wird. Es kann sich aber auch um ein Underfill-Material handeln, in das eine elektrische und/oder mechanischeAs already mentioned, the composite material whose lateral propagation is to be limited can be an electrically insulating or electrically conductive adhesive, with which the component is mechanically fixed on the carrier and possibly also electrically contacted. It can also be an underfill material into which an electrical and / or mechanical
Verbindung zwischen dem Bauelement und dem Träger eingebettet wird. Connection between the device and the carrier is embedded.
Die Herstellung der Barrierestruktur richtet sich in erster Linie nach Art und Material des Trägers. Handelt es sich bei dem Träger um ein Leiterplattensubstrat oder ein Halbleitersubstrat, so kann die Barrierestruktur einfach mit Hilfe vonThe production of the barrier structure depends primarily on the type and material of the carrier. If the carrier is a printed circuit board substrate or a semiconductor substrate, the barrier structure can be easily formed by means of
Standard-Abscheidungs- und Strukturierungsverfahren in der Montageoberfläche erzeugt werden. Standard deposition and patterning processes are created in the mounting surface.
Wird als Träger ein Stanzgitter verwendet, das in eine Kunststoff- Moldmasse eingebettet wird, so empfiehlt es sich, die Barrierestruktur mit Hilfe eines geeig- neten Moldwerkzeugs in der Kunststoff-Moldmasse auszubilden. Anordnung und Geometrie der Barrierestruktur auf dem Träger hängen vom Layout des Bauelements ab. Die dem Träger zugewandte Montageoberfläche des Bauelements umfasst in der Regel Bereiche, in denen die Verbundmasse erforderlich und erwünscht ist, Bereiche, in denen das Vorhandensein von Verbundmasse unkritisch ist, und kritische Bereiche, in denen die Verbundmasse die Funktionalität des Bauelements bzw. des gesamten Bauteils beeinträchtigt. Diese kritischen Bereiche müssen durch die Barrierestruktur von den übrigen Bereichen abgetrennt werden. If a stamped grid is used as the carrier, which is embedded in a plastic molding compound, then it is advisable to form the barrier structure with the aid of a suitable molding tool in the plastic molding compound. The arrangement and geometry of the barrier structure on the carrier depend on the layout of the device. Typically, the mounting surface of the device facing the carrier comprises areas where the composite is required and desirable, areas where the presence of composite is uncritical, and critical areas where the composite is the functionality of the device or the entire device impaired. These critical areas must be separated from the remaining areas by the barrier structure.
Wenn die elektrische Anbindung des Bauelements an den Träger mit Hilfe einer elektrisch leitenden Verbundmasse realisiert ist, so ist die Barriere-struktur in der Montageoberfläche des Trägers vorteilhafterweise so angeordnet, dass sie einen Kurzschluss der elektrischen Anschlüsse des Bauelements über die Verbund- masse verhindert. If the electrical connection of the component to the carrier is realized with the aid of an electrically conductive compound, then the barrier structure in the mounting surface of the carrier is advantageously arranged so as to prevent a short circuit of the electrical connections of the component via the composite.
Im Fall eines MEMS-Bauelements mit einem auslenkbaren Strukturelement, das in der dem Träger zugewandten Bauelementoberfläche ausgebildet ist, wird die Barrierestruktur vorteilhafterweise dazu genutzt, ein Eindringen der Verbund- masse in den Bereich unter dem auslenkbaren Strukturelement zu verhindern. In the case of a MEMS component with a deflectable structural element which is formed in the component surface facing the carrier, the barrier structure is advantageously used to prevent penetration of the composite mass into the region below the deflectable structural element.
Kurze Beschreibung der Zeichnungen Wie bereits voranstehend erörtert, gibt es verschiedene Möglichkeiten, die vorliegende Erfindung in vorteilhafter Weise auszugestalten und weiterzubilden. Dazu wird einerseits auf die dem Patentanspruch 1 nachgeordneten Patentansprüche verwiesen und andererseits auf die nachfolgende Beschreibung mehrerer Ausführungsbeispiele der Erfindung anhand der Figuren. zeigt eine schematische Schnittdarstellung eines ersten erfindungsgemäßen Bauteils 100 mit einem passiven Bauelement 20, Brief Description of the Drawings As discussed above, there are various ways to advantageously design and develop the present invention. For this purpose, reference is made on the one hand to the claims subordinate to claim 1 and on the other hand to the following description of several embodiments of the invention with reference to FIGS. shows a schematic sectional view of a first component 100 according to the invention with a passive component 20,
Fig. 2a, 2b zeigen jeweils eine schematische Schnittdarstellung eines erfindungsgemäß aufgebauten Drucksensormoduls 201 bzw. 202 und Fig. 3 zeigt eine schematische Schnittdarstellung eines erfindungsgemäßen Bauteils 300 mit einem Drucksensormodul 202. 2a, 2b each show a schematic sectional view of a pressure sensor module 201 or 202 and constructed according to the invention FIG. 3 shows a schematic sectional illustration of a component 300 according to the invention with a pressure sensor module 202.
Ausführungsformen der Erfindung Embodiments of the invention
Der in Fig. 1 dargestellte Bauteilaufbau 100 umfasst ein passives elektronisches Bauelement 20, das auf einem Träger 10 montiert ist. Dabei kann es sich beispielsweise um einen Widerstand oder einen Kondensator handeln. Der Träger 10 ist im hier beschriebenen Ausführungsbeispiel in Form eines Stanzgitters 1 1 realisiert, das mit einer Kunststoff-Moldmasse 12 umspritzt ist und Teil eines Premold-Gehäuses bildet. Das Bauelement 20 wurde mit Hilfe einer Verbundmasse 30 auf dem Träger 10 montiert. Dabei wurde nicht nur eine mechanische Verbindung zwischen dem Bauelement 20 und dem Träger 10 hergestellt sondern auch eine elektrische Verbindung. Dazu wurde ein Leitklebstoff 30 als Verbundmasse verwendet. Der Leitklebstoff 30 wurde in einem Dispensprozess auf die Anschlussbereiche 13 des Stanzgitters 1 1 aufgetragen, die frei von Moldmasse 12 sind und mit den Anschlusspads 21 des Bauelements 20 kommunizieren. The component structure 100 shown in FIG. 1 comprises a passive electronic component 20 that is mounted on a carrier 10. This may be, for example, a resistor or a capacitor. The carrier 10 is realized in the embodiment described here in the form of a stamped grid 1 1, which is encapsulated with a plastic molding compound 12 and forms part of a premold housing. The device 20 was mounted on the carrier 10 by means of a compound 30. Not only a mechanical connection between the component 20 and the carrier 10 was made but also an electrical connection. For this purpose, a conductive adhesive 30 was used as a composite. The conductive adhesive 30 was applied in a dispensing process to the terminal portions 13 of the stamped grid 1 1, which are free of molding compound 12 and communicate with the terminal pads 21 of the device 20.
Fig. 1 veranschaulicht, dass der anfänglich noch viskose Leitklebstoff 30 bei der Montage, insbesondere beim Aufsetzen und Andrücken des Bauelements 20 zwischen dem Träger 10 und dem Bauelement 20 verquetscht wird. Dabei breitet sich der Leitklebstoff 30 - je nach Klebstoff menge mehr oder weniger - lateral aus. Im vorliegenden Fall wurde der Leitklebstoff 30 bis über den Anschlussbereich 13 hinaus gedrückt. Fig. 1 illustrates that the initially still viscous conductive adhesive 30 is squeezed during assembly, in particular when placing and pressing the device 20 between the carrier 10 and the device 20. In this case, the conductive adhesive 30 spreads - depending on the amount of adhesive more or less - laterally. In the present case, the conductive adhesive 30 has been pressed beyond the connection area 13.
Erfindungsgemäß ist in der Montageoberfläche des Trägers 10 eine Barrierestruktur 15 ausgebildet, die die laterale Ausbreitung des Leitklebstoffs 30 auf mindestens einen definierten Verbindungsbereich begrenzt. Dadurch wird ein Kurzschluss zwischen den Anschlusspads 21 des Bauelements 20 über den verquetschten Leitklebstoff 30 verhindert. Die Barrierestruktur ist hier in Form eines Grabens 15 in der Montageoberfläche des Trägers 10 ausgebildet, der zwischen den Anschlussbereichen 13 des Stanzgitters 11 verläuft und in der Kunststoff- Moldmasse 12 des Trägers 10 ausgebildet ist. Durch die Grabenstruktur 15 wird der Druck, der bei der Montage auf den Klebstoff 30 ausgeübt wird, reduziert, ohne dass ein Mindestabstand zwischen Bauelement 20 und Träger 10 eingehalten werden muss. Außerdem reduziert die Grabenstruktur 15 etwaige Kapillarkräfte, wenn der Abstand zwischen Bauelement 20 und Träger 10 sehr gering ist. Zunächst wirkt die Öffnungskante des Grabens 15 als Stoppkante für den Leitklebstoff 30. Je nach Klebstoffmenge wird die Öffnungskante dennoch überwunden. In diesem Fall bildet die Grabenstruktur ein Ausgleichsvolumen für den Leitklebstoff 30. Insgesamt verhindert die Grabenstruktur 15 jedenfalls ein Zusammenfließen des Leitklebstoffs 30 aus den voneinander getrennten Anschlussbereichen 13. In den Figuren 2a und 2b ist jeweils ein Sensormodul 201 bzw. 202 mit einemAccording to the invention, a barrier structure 15 is formed in the mounting surface of the carrier 10, which limits the lateral spread of the conductive adhesive 30 to at least one defined connection region. As a result, a short circuit between the connection pads 21 of the component 20 via the pinched conductive adhesive 30 is prevented. The barrier structure is formed here in the form of a trench 15 in the mounting surface of the carrier 10, which extends between the terminal regions 13 of the stamped grid 11 and is formed in the plastic molding compound 12 of the carrier 10. By the trench structure 15, the pressure exerted on the adhesive 30 during assembly, reduced, without a minimum distance between the component 20 and carrier 10 must be complied with. In addition, the trench structure 15 reduces any capillary forces when the distance between the component 20 and the carrier 10 is very small. First, the opening edge of the trench 15 acts as a stop edge for the conductive adhesive 30. Depending on the amount of adhesive, the opening edge is still overcome. In this case, the trench structure forms a compensating volume for the conductive adhesive 30. Overall, the trench structure 15 prevents any confluence of the conductive adhesive 30 from the mutually separate terminal regions 13. In FIGS. 2a and 2b, a sensor module 201 or 202 is in each case provided with a
Drucksensorbauelement 220 dargestellt, das auf einem Träger 210 mit einer Barrierestruktur 215 bzw. 216 montiert ist. Da sich die beiden Sensormodule 201 und 202 lediglich in der Realisierungsform der Barrierestruktur 215 bzw. 216 unterscheiden, werden die übrigen Komponenten des Modulaufbaus nur einmal für das in Fig. 2a dargestellte Sensormodul 201 im Detail beschrieben. Pressure sensor device 220 which is mounted on a support 210 with a barrier structure 215 and 216, respectively. Since the two sensor modules 201 and 202 differ only in the form of realization of the barrier structure 215 or 216, the other components of the module structure are described only once in detail for the sensor module 201 shown in FIG. 2a.
Bei dem Drucksensorbauelement 220 handelt es sich um ein MEMS-Bauelement auf Siliziumbasis, in dessen Vorderseite eine Membran 222 über einer abgeschlossenen Referenzdruckkaverne 223 ausgebildet ist. Druckbedingte Deforma- tionen der Membran 222 werden als Widerstandsänderung mehrerer Piezowi- derstände erfasst, die in die Membran 222 eindiffundiert sind und in einer Brücke verschaltet sind. Das Ausgangssignal dieser Brückenschaltung wird schaltungstechnisch verstärkt und als Drucksignal zu den Anschlusspads 221 auf der Vorderseite des Drucksensorbauelements 220 geleitet. The pressure sensor component 220 is a silicon-based MEMS component, in the front side of which a membrane 222 is formed above a closed reference pressure cavity 223. Pressure-related deformations of the membrane 222 are detected as resistance changes of a plurality of piezoresistors that have diffused into the membrane 222 and are connected in a bridge. The output signal of this bridge circuit is amplified circuitry and passed as a pressure signal to the connection pads 221 on the front of the pressure sensor device 220.
Im den hier beschriebenen Ausführungsbeispielen handelt es sich bei dem Träger 210 um eine Leiterplatte aus einem Glas-Epoxy-Mehrschichtsubstrat, in der eine Durchgangsöffnung als Druckanschlussöffnung 217 für das Drucksensorbauelement 220 ausgebildet ist. Auf der Montagefläche des Trägers 210 befin- den sich Anschlussbereiche 213 für die Flip-Chip-Montage des Drucksensorbau- elements 220, über die nicht nur eine mechanische Verbindung sondern auch eine elektrische Kontaktierung zum Drucksensorbauelement 220 hergestellt wird. In the exemplary embodiments described here, the carrier 210 is a printed circuit board made of a glass-epoxy multilayer substrate, in which a passage opening is formed as a pressure connection opening 217 for the pressure sensor component 220. On the mounting surface of the carrier 210 there are connection areas 213 for the flip-chip mounting of the pressure sensor module. elements 220, via which not only a mechanical connection but also an electrical contact to the pressure sensor component 220 is produced.
Das Drucksensorbauelement 220 wurde face-down, also mit seiner Vorderseite, auf dem Träger 210 montiert, und zwar so, dass die Membran 222 über der Druckanschlussöffnung 217 im Träger 210 positioniert ist. Dazu wurden die An- schlusspads 221 auf der Vorderseite des Drucksensorbauelements 220 mit Lotballs 231 versehen und auf die korrespondierenden Anschlussbereiche 213 des Trägers 210 aufgesetzt. Daraus entstanden in einem Bondprozess elektrisch leitenden Verbindungen 231 zwischen den Anschlusspads 221 des Drucksensorbauelements 220 und den Anschlussbereichen 213 des Trägers 210. Zum Schutz gegen Umwelteinflüsse und zum Abbau von mechanischen Spannungen im Verbindungsbereich wurden diese Verbindungen 231 nachträglich mit einem Underfillermaterial 230 ummantelt. Dazu wurde eine geeignete Menge des Underfillermaterials 230 mit Hilfe eines Dispensers von außen in den Verbindungsbereich eingebracht. The pressure sensor component 220 was mounted face-down, ie with its front side, on the carrier 210 in such a way that the membrane 222 is positioned above the pressure connection opening 217 in the carrier 210. For this purpose, the connection pads 221 on the front side of the pressure sensor component 220 were provided with solder balls 231 and placed on the corresponding connection regions 213 of the carrier 210. This resulted in electrically conductive connections 231 between the connection pads 221 of the pressure sensor component 220 and the connection regions 213 of the carrier 210 in a bonding process. For protection against environmental influences and for reducing mechanical stresses in the connection region, these connections 231 were subsequently encased with an underfiller material 230. For this purpose, a suitable amount of underfill material 230 was introduced from outside into the connection area with the aid of a dispenser.
Die Figuren 2a und 2b veranschaulichen, dass das anfänglich noch viskose Underfillermaterial 230 beim Einbringen in den Aufbau des Sensormoduls 201 bzw. 202 bis in den Bereich unter der Membran 222 und in die Druckanschlussöffnung 217 vordringen kann, wo es die Beweglichkeit der Membran 222 und/oder die Druckeinleitung beeinträchtigen würde. Dabei besteht außerdem die Gefahr eines„Ausblutens", d.h. dass das Underfillermaterial 230nicht im dafür vorgesehenen Bereich verbleibt und die Verbindungen 231 folglich nicht hinreichend ummantelt und geschützt sind. FIGS. 2 a and 2 b illustrate that the initially viscous underfill material 230, when introduced into the structure of the sensor module 201 or 202, can penetrate into the area below the membrane 222 and into the pressure connection opening 217, where the mobility of the membrane 222 and / or or affect the pressure introduction. There is also a risk of "bleeding", that is, the underfill material 230 does not remain in the designated area, and thus the joints 231 are not sufficiently sheathed and protected.
Erfindungsgemäß ist deshalb bei beiden hier dargestellten Ausführungsvarianten in der Montageoberfläche des Trägers 210 eine Barrierestruktur 215 bzw. 216 ausgebildet, die die laterale Ausbreitung des Underfillermaterials 230 zumindest einseitig begrenzt. Dadurch wird verhindert, dass das Underfillermaterial 230 in den Sensierbereich unter der Membran 222 und in die Druckanschlussöffnung 217 einfließt und nicht genügend Underfillermaterial 230 im Bereich der Verbindungen 231 verbleibt. Die Barrierestruktur 215 des Sensormoduls 201 ist, wie im Fall des Bauteils 100, in Form einer Grabenstruktur 215 in der Montageoberfläche des Trägers 210 ausgebildet. Sie ist ringförmig geschlossen und verläuft unter dem Randbereich der Membran 222, so dass sie den Sensierbereich und die Druckanschlussöff- nung 217 umschließt. According to the invention, a barrier structure 215 or 216, which limits the lateral propagation of the underfill material 230 at least on one side, is therefore formed in the mounting surface of the carrier 210 in both embodiments shown here. This prevents the underfiller material 230 from flowing into the sensing region below the membrane 222 and into the pressure connection opening 217 and leaving insufficient underfiller material 230 in the region of the connections 231. The barrier structure 215 of the sensor module 201 is, as in the case of the component 100, designed in the form of a trench structure 215 in the mounting surface of the carrier 210. It is annularly closed and extends below the edge region of the membrane 222, so that it encloses the sensing region and the pressure connection opening 217.
Im Fall des in Fig. 2b dargestellten Sensormoduls 202 dient ein stegartiges Wandungselement 216 als Barrierestruktur, das von der Montageoberfläche des Trägers 210 abragt, ringförmig geschlossen ist und den Sensierbereich und die Druckanschlussöffnung 217 umgibt.  In the case of the sensor module 202 shown in FIG. 2b, a web-like wall element 216 serves as a barrier structure, which protrudes from the mounting surface of the carrier 210, is annularly closed and surrounds the sensing region and the pressure connection opening 217.
An dieser Stelle sei angemerkt, dass die Barrierestruktur 215 bzw. 216 vorteilhafterweise an die Form der Sensormembran 222 angepasst ist. Es können aber auch unterschiedliche Geometrien miteinander kombiniert werden, wie z.B. eine quadratische Membran mit einer kreisrunden Barrierestruktur. It should be noted at this point that the barrier structure 215 or 216 is advantageously adapted to the shape of the sensor membrane 222. However, it is also possible to combine different geometries with one another, such as, for example, a square membrane with a circular barrier structure.
Sowohl die Grabenstruktur 215 des Sensormoduls 201 als auch das stegartige Wandungselement 216 des Sensormoduls 202 können einfach mit Hilfe von Standard-Ätzverfahren in der Montageoberfläche des Trägers 210 erzeugt werden. Both the trench structure 215 of the sensor module 201 and the web-like wall element 216 of the sensor module 202 can be easily produced by means of standard etching processes in the mounting surface of the carrier 210.
Alternativ zu einem Glas-Epoxy-Mehrschichtsubstrat kann auch ein Halbleitersubstrat als Träger verwendet werden. Ein derartiger Träger kann vorteilhafterweise mit weiteren elektrischen und/oder mikromechanischen Funktionen ausgestattet worden. Barrierestrukturen in Form von Gräben und/oder stegartigen Wandungselementen können in diesem Fall einfach mit Strukturierungs- und Ab- scheidungsverfahren erzeugt werden, wie sie in der Halbleiterprozessierung üblich sind.  As an alternative to a glass-epoxy multilayer substrate, a semiconductor substrate may also be used as a carrier. Such a carrier may advantageously be equipped with further electrical and / or micromechanical functions. Barrier structures in the form of trenches and / or web-like wall elements can in this case be produced simply by structuring and deposition methods, as are customary in semiconductor processing.
Bei dem in Fig. 3 dargestellten Sensorbauteil 300 handelt es sich im Wesentlichen um ein Sensormodul 202, wie es in Fig. 2b dargestellt ist, das mit einem Kunststoff-Moldgehäuse 310 versehen worden ist. Dazu wurde das Drucksen- sorbauelement 220 nach der Montage auf dem Träger 210 und nach dem Einbringen des Underfillermaterials 230 in die Verbindungsbereiche 231 mit einer Moldmasse 310 umspritzt, so dass es allseitig in die Moldmasse 310 eingebettet ist, mit Ausnahmen seiner dem Träger 210 zugewandten Oberfläche mit der Membran 222. Außerdem wurde der Träger 210 an die Chipgröße des Sensor- bauelements 220 angepasst und mit Durchkontakten 312 und Anschlusspads 31 1 zur externen elektrischen Kontaktierung des Bauteils 300 versehen. Die An- schlusspads 31 1 sind auf der Rückseite des Trägers 210 angeordnet und über Durchkontakte 312 mit den Anschlussbereichen 213 auf der Trägervorderseite verbunden, an die auch das Sensorbauelement 220 elektrisch angeschlossen ist. The sensor component 300 shown in FIG. 3 is essentially a sensor module 202, as shown in FIG. 2 b, which has been provided with a plastic mold housing 310. For this purpose, after mounting on the carrier 210 and after introducing the underfiller material 230 into the connection regions 231, the pressure sensor component 220 was injection-molded with a molding compound 310, so that it is embedded in the molding compound 310 on all sides, with the exception of its surface facing the carrier 210 In addition, the carrier 210 has been adapted to the chip size of the sensor component 220 and with through contacts 312 and connection pads 31 1 for external electrical contacting of the component 300 is provided. The connection pads 31 1 are arranged on the rear side of the carrier 210 and connected via through-contacts 312 to the connection regions 213 on the carrier front side, to which the sensor component 220 is also electrically connected.

Claims

Bauteil (100) mit mindestens einem Bauelement (20), insbesondere einem Halbleiterbauelement oder einem passiven Bauelement das auf einem Träger (10) montiert ist, wobei sich in mindestens einem Verbindungsbereich zwischen dem Bauelement (20) und dem Träger (10) eine Verbundmasse (30) befindet, Component (100) having at least one component (20), in particular a semiconductor component or a passive component, which is mounted on a carrier (10), wherein in at least one connection region between the component (20) and the carrier (10) a composite mass ( 30),
dadurch gekennzeichnet, dass in der Montageoberfläche des Trägers (10) eine Barrierestruktur (15) ausgebildet ist, die die laterale Ausbreitung der Verbundmasse (30) auf mindestens einen definierten Bereich begrenzt.  characterized in that in the mounting surface of the carrier (10) has a barrier structure (15) is formed, which limits the lateral spread of the composite mass (30) to at least one defined area.
Bauteil (202) nach Anspruch 1, dadurch gekennzeichnet, dass die Component (202) according to claim 1, characterized in that the
Barrierestruktur (216) mindestens ein stegartiges Wandungselement (216) umfasst, das von der Montageoberfläche des Trägers (210) abragt.  Barrier structure (216) comprises at least one web-like wall element (216), which protrudes from the mounting surface of the carrier (210).
Bauteil (100; 201) nach einem der Ansprüche 1 oder 2, dadurch gekennzeichnet, dass die Barrierestruktur (15; 215) eine Grabenstruktur (15; 215) umfasst, die in der Montageoberfläche des Trägers (10; 210) ausgebildet ist. Component (100; 201) according to one of claims 1 or 2, characterized in that the barrier structure (15; 215) comprises a trench structure (15; 215) which is formed in the mounting surface of the carrier (10; 210).
Bauteil (100) nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass das Bauelement (20) über einen elektrisch isolierenden oder elektrisch leitfähigen Klebstoff (30) als Verbundmasse mit dem Träger (10) verbunden ist. Component (100) according to one of claims 1 to 3, characterized in that the component (20) via an electrically insulating or electrically conductive adhesive (30) is connected as a composite mass with the carrier (10).
Bauteil (201; 202) nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass sich in mindestens einem Verbindungsbereich zwischen dem Bauelement (220) und dem Träger (210) ein Underfill-Material (230) als Verbundmasse befindet und dass dieses Underfill-Material (230) eine elektrische Verbindung (231) zwischen dem Bauelement (220) und dem Träger (210) ummantelt. Component (201; 202) according to one of claims 1 to 4, characterized in that in at least one connecting region between the component (220) and the carrier (210) is an underfill material (230) as a composite mass and that this Underfill Material (230) an electrical connection (231) between the component (220) and the carrier (210) sheathed.
6. Bauteil (201; 202) nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass der Träger (210) in Form eines Leiterplattensubstrats oder eines Halbleitersubstrats realisiert ist und dass die Barrierestruktur (215; 216) in bzw. auf der Substratoberfläche ausgebildet ist. 6. component (201; 202) according to one of claims 1 to 5, characterized in that the carrier (210) in the form of a printed circuit board substrate or a Semiconductor substrate is realized and that the barrier structure (215; 216) is formed in or on the substrate surface.
7. Bauteil (100) nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass der Träger (10) als Teil eines Premoldgehäuses in Form eines in eine Kunststoff- Moldmasse (12) eingebetteten Stanzgitters (11) realisiert ist und dass die Barrierestruktur (15) in der Kunststoff-Moldmasse (12) ausgebildet ist. 7. component (100) according to one of claims 1 to 5, characterized in that the carrier (10) is implemented as part of a premold housing in the form of a in a plastic molding compound (12) embedded lead frame (11) and that the barrier structure ( 15) is formed in the plastic molding compound (12).
8. Bauteil (100) nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass die elektrische Anbindung des Bauelements (20) an den Träger (10) mit Hilfe einer elektrisch leitenden Verbundmasse (30) realisiert ist und dass in der Montageoberfläche des Trägers (10) eine Barrierestruktur (15) ausgebildet ist, die verhindert, dass die elektrischen Anschlüssen (21) des Bauelements (20) über die Verbundmasse (30) kurzgeschlossen werden. 8. Component (100) according to one of claims 1 to 7, characterized in that the electrical connection of the component (20) to the carrier (10) by means of an electrically conductive composite material (30) is realized and that in the mounting surface of the carrier (10) a barrier structure (15) is formed, which prevents the electrical connections (21) of the component (20) via the composite material (30) are short-circuited.
9. Bauteil (201; 202) nach einem der Ansprüche 1 bis 8, mindestens umfassend9. component (201, 202) according to one of claims 1 to 8, comprising at least
• ein MEMS-Bauelement (220) mit mindestens einem auslenkbaren Strukturelement (222), das in der Bauelementoberseite ausgebildet ist, undA MEMS device (220) having at least one deflectable structural element (222) formed in the top of the device, and
• einen Träger (210), A carrier (210),
wobei das MEMS-Bauelement (220) mit der Bauelementoberseite auf dem Träger (210) montiert ist und über mindestens eine Verbundmasse (231, 230) mechanisch und/oder elektrisch mit dem Träger (210) verbunden ist, dadurch gekennzeichnet, dass in der Montageoberfläche des Trägers (210) eine umlaufende Barrierestruktur (215; 216) für die Verbundmasse (231, 230) ausgebildet ist, so dass ein Bereich unter dem auslenkbaren Strukturelement (222) des MEMS-Bauelements (220) frei von Verbundmasse (231, 230) ist.  wherein the MEMS device (220) is mounted with the top of the device on the carrier (210) and mechanically and / or electrically connected to the carrier (210) via at least one composite mass (231, 230), characterized in that in the mounting surface the support (210) has a peripheral barrier structure (215; 216) for the composite mass (231, 230), so that an area below the deflectable structural element (222) of the MEMS component (220) is free of composite material (231, 230). is.
10. Drucksensor- Bauteil (300) nach Anspruch 9, mindestens umfassend 10. pressure sensor component (300) according to claim 9, comprising at least
• ein mikromechanisches Sensorelement (220) mit einer Sensormembran (222) zur Druckerfassung, die in der Oberseite des Sensorelements (220) ausgebildet ist, und  A micromechanical sensor element (220) having a sensor diaphragm (222) for pressure detection, which is formed in the upper side of the sensor element (220), and
• ein Trägersubstrat (210),  A carrier substrate (210),
wobei das Sensorbauelement (220) mit seiner Oberseite auf dem Trägersubstrat (210) montiert ist und mindestens eine elektrische Verbindung (231) zwischen der Oberseite des Sensorelements (220) und dem Trägersubstrat (210) mit einer dielektrischen Underfill-Verbundmasse (230) ummantelt ist, dadurch gekennzeichnet, dass auf dem Trägersubstrat (210) umlaufend unter dem Randbereich der Sensormembran (222) eine Barrierestruktur (215) für die Underfill-Verbundmasse (230) ausgebildet ist, so dass der Bereich unter der Sensormembran (222) frei von Underfill-Verbundmasse (230) ist. wherein the sensor component (220) is mounted with its upper side on the carrier substrate (210) and at least one electrical connection (231). between the upper side of the sensor element (220) and the carrier substrate (210) is coated with a dielectric underfill composite mass (230), characterized in that a barrier structure (215) extends circumferentially under the edge region of the sensor membrane (222) on the carrier substrate (210). for the underfill composite mass (230), so that the area under the sensor membrane (222) is free of underfill composite mass (230).
PCT/EP2013/077238 2012-12-27 2013-12-18 Component comprising component element and a support WO2014102121A1 (en)

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