WO2015165745A1 - Sensor arrangement - Google Patents

Sensor arrangement Download PDF

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Publication number
WO2015165745A1
WO2015165745A1 PCT/EP2015/058306 EP2015058306W WO2015165745A1 WO 2015165745 A1 WO2015165745 A1 WO 2015165745A1 EP 2015058306 W EP2015058306 W EP 2015058306W WO 2015165745 A1 WO2015165745 A1 WO 2015165745A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
circuit board
printed circuit
air pressure
opening
Prior art date
Application number
PCT/EP2015/058306
Other languages
German (de)
French (fr)
Inventor
Uwe Hansen
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2015165745A1 publication Critical patent/WO2015165745A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Definitions

  • the invention relates to a sensor arrangement with a sensor and a printed circuit board.
  • the sensor in particular electrical connections of the sensor, is soldered to the circuit board.
  • the sensor is preferably designed to detect a particular static air pressure and / or humidity.
  • Sensors for detecting an air pressure or a humidity are known with a sensor housing, which surrounds the sensor and a circuit for signal processing of the sensor signal. Both the sensor and the signal processing circuit may be disposed on a common circuit board and connected to the common circuit board.
  • the senor has a surface with a sensor opening for detecting an air pressure, in particular an ambient air pressure surrounding the sensor.
  • the sensor also has at least one electrical connection, which is preferably formed as an electrically conductive surface region on the surface of the sensor.
  • the surface of the sensor faces the printed circuit board, wherein the electrical connection by means of a solder, in particular a solder ball, also called bump in English, is connected to the printed circuit board.
  • the printed circuit board also has a breakthrough, which is arranged so that the sensor can detect the air pressure through the opening through the sensor opening.
  • the senor advantageously can be connected to a printed circuit board, further advantageously a housing surrounding the sensor can be omitted insofar as the sensor opening or an area of the sensor, which is designed to detect the air pressure, through the breakthrough of the circuit board through with the ambient air Contact can have and so the housing surrounding the sensor can be omitted with a breakthrough.
  • the sensor is preferably designed to generate a sensor signal which represents the air pressure and / or the air humidity and to output the sensor signal on the output side.
  • a gap extends between the sensor and the printed circuit board, wherein the gap is preferably circumferentially sealed with a sealing agent, in particular a sealing compound, so that the air pressure can only be detected through the opening.
  • a sealing agent in particular a sealing compound
  • the sealant is formed for example by an epoxy resin, preferably, the sealant is a so-called underfill material comprising epoxy resin.
  • the sealant is thixotropic in such a way that the sealant can be sucked in from the aforementioned gap by means of capillary forces, the sealant reaching as far as the breakthrough and thus not being able to flow into the aperture.
  • the senor is designed as a housing-free semiconductor module, also called Bare-Die.
  • the semiconductor device can be advantageous advantageously connected to the circuit board, so that the electrical connections, which are formed by the so-called bumps or solder balls, can be omitted an otherwise necessary Drahtbonditati.
  • the sensor as a caseless semiconductor component, for example, in a further step after soldering and after sealing with epoxy resin completely by means of a potting compound, such as a further epoxy resin, are closed.
  • the sensor arrangement has an integrated circuit which is designed for signal processing of the sensor signal and which is electrically connected on the input side to the sensor and more preferably is solder-connected to the printed circuit board.
  • the sensor can advantageously advantageously be arranged together with the circuit, in particular a chip for signal processing, together on a printed circuit board, whereby a circuit for signal processing and the housing surrounding the sensor can be dispensed with.
  • the senor and / or the circuit is connected to the printed circuit board by means of flip-chip mounting.
  • the sensor arrangement can advantageously be provided at low cost.
  • the senor and / or the circuit by means of SM D soldering, in particular by means of a reflow soldering, connected to the circuit board.
  • the printed circuit board on a side opposite the sensor on electrical connections for soldering to another circuit board, so that the circuit board and the other circuit board are spaced apart such that an air pressure through the through break can be detected.
  • the circuit board can advantageously be connected as a sensor module, which includes the circuit board, the sensor or additionally the circuit for signal processing of the sensor signal, by means of flip-chip soldering or reflow soldering with the other circuit board.
  • a distance of the printed circuit board from the further printed circuit board is for example at least 100 micrometers, more preferably between 50 micrometers and 300 micrometers.
  • the electrical connections of the sensor are arranged in the gap between the sensor and the printed circuit board. More preferably, the gap of the sealing means - preferably circumferentially - filled in the region of the connections. More preferably, the terminals are embedded in the sealant. As a result, the connections are advantageously protected from moisture of the ambient air, which can pass through the opening in the gap.
  • the sensor arrangement can advantageously be provided at low cost, as far as the electrical connections can not only be arranged at the edge of the circuit board, but can also be distributed on a surface of the circuit board, which is opposite to the other circuit board.
  • the terminals for solder bonding with the further printed circuit board are formed in a region adjacent to the sensor. More preferably, the region of the circuit board on which the sensor is arranged, free of mechanical connections to the other circuit board.
  • the sensor can advantageously oscillate together with a part of the printed circuit board on which the sensor is connected to the printed circuit board relative to the other printed circuit board or experience thermally induced thermal expansions.
  • the sensor signal can be largely free or free of artifacts, which are superimposed on the sensor signal, which represents the measured variable to be detected, and this falsify. It was in fact recognized that the sensor, in particular the previously mentioned housing-less sensor, in particular a semiconductor sensor, is sensitive to mechanical bending of the sensor module. Such transfers can act on the sensor module, for example, from the printed circuit board with which the sensor is soldered.
  • the senor is a MEMS sensor.
  • the sensor can advantageously be designed to save space.
  • a diameter of the aperture in the circuit board is greater than an extension of the gap between the sensor and the circuit board.
  • the aforementioned breakdown in the printed circuit board preferably has a diameter between 20 microns and 300 microns.
  • FIG. 1 shows an exemplary embodiment of a sensor arrangement with a sensor and a printed circuit board connected to the sensor, which is designed to detect an air pressure or a humidity through an opening in a printed circuit board;
  • FIG. 1 shows an exemplary embodiment of a sensor arrangement 1.
  • the sensor 2 has an opening 3, the sensor 2 being designed to detect an air pressure and / or an air humidity of an ambient air present at the opening 3 and to generate a sensor signal representing the air pressure and / or the air humidity.
  • the sensor assembly 1 in this embodiment also includes a printed circuit board 4.
  • the sensor 2 is connected by means of the printed circuit board 4 by means of solder balls in flip-chip mounting.
  • the sensor 2 has a side facing the printed circuit board 4, which forms a surface area of the surface 29 of the sensor 2.
  • the opening 3 for detecting the air pressure and / or the humidity is formed on the circuit board 4 facing side.
  • electrical connections 6, 7, 10 and 11 are formed on the same side and electrical connections, in this embodiment.
  • the electrical connections 6, 7, 10 and 11 are formed in this embodiment by an electrically conductive layer, which forms a surface region of the circuit board 4 facing surface 29.
  • the printed circuit board 4 facing surface 29 of the sensor 2 is flat in this embodiment.
  • the sensor 2 is cuboid in this embodiment and is a caseless semiconductor, also called bare die in English.
  • the electrical connections 6, 7, 10 and 11 are each connected by means of a solder ball, in flip-chip mounting to the circuit board 4.
  • the electrical connection 6 by means of a solder bead 9 and the electrical connection 7 by means of a
  • the electrical connection 10 by means of a solder bead 12 and the electrical connection 1 1 by means of a solder ball 13 to the circuit board 4 and there electrically connected to a corresponding conductor for electrically connecting the sensor 2 to the circuit board 4.
  • the sensor 2 which has the solder balls 8, 9, 12 and 13 already at the corresponding contacts 6, 7, 10 and 1 1, are placed on the circuit board 4 and by means of reflow Soldering be soldered to the circuit board 4.
  • the sensor 2 is arranged at a distance from the printed circuit board 4, so that a gap 18 is formed between the sensor 2 and the printed circuit board 4.
  • the gap 18 is at least partially filled in this embodiment between the sensor 2 and the circuit board 4 by means of a sealant 17.
  • the sealing means 17 is, for example, a highly viscous epoxy resin, which is designed to flow into the gap 18.
  • the circuit board 4 has an opening 5.
  • the opening 5 has a smaller diameter 21 than a flat extension of the sensor 2, so that the opening 5 is covered by the sensor 2 from one side.
  • the opening 3 of the sensor 2 is arranged and formed, through the opening 5 and the gap 18, which is formed in the region of the opening 5 free of the sealing means 17 to detect the air pressure of an ambient air 25 or to detect a humidity of the ambient air 25.
  • the aperture 5 in this embodiment has a diameter 21 between 20 and 50 microns.
  • the aperture 5 is drilled in this embodiment by means of a drill or generated by means of a laser in the circuit board 4.
  • a circuit 14 for signal processing of the sensor signal generated by the sensor 2 is soldered in this embodiment, too.
  • the circuit 14 is connected in this embodiment by means of flip-chip mounting to the circuit board 4.
  • An electrical terminal 15 of the circuit 14 is exemplified, which is electrically connected by means of an exemplary designated solder ball 16 with a corresponding conductor track of the printed circuit board 4.
  • the sensor 2 is connected on the output side to the circuit 14 via a connecting line 24, so that the circuit 14 can receive the sensor signal via the connecting line 24, which is formed in this embodiment as a conductor track.
  • the circuit 14 is sealed in this embodiment by means of a sealing means 17, in this embodiment by means of a sealing mass bead to the circuit board 4 through.
  • FIG. 2 shows the sensor arrangement 1 already shown in FIG. 1, which is soldered by way of example to another printed circuit board 19.
  • the solder connection between the printed circuit board 19 and the printed circuit board 4 in this exemplary embodiment comprises four solder bumps, of which one solder bump 23 is designated by way of example and connects a connection 28 facing the printed circuit board 19 to the further printed circuit board 19.
  • the four solder balls are in this embodiment in a gap 27 on a surface region which is arranged between an areal extent of the circuit 14 and the circuit board 19.
  • An end portion 26 of the printed circuit board 4, on which the sensor 2 is arranged, can thus - in the manner of a springboard - swing free, in particular contactless relative to the circuit board 19 or decouple the sensor 2 from a thermal expansion of the circuit board 4.
  • the printed circuit board 4 is spaced from the printed circuit board 19 by means of a distance 20 at least in the region of the sensor 2, so that a gap with a gap thickness of the distance 20 between the printed circuit board 4 and the printed circuit board 19 is formed.
  • the sensor 2 can thus detect at the opening 3 the air pressure and / or a humidity of the ambient air 25 through the aperture 5 and further via the gap 27 with the gap thickness of the distance 20.
  • the printed circuit board 4, in particular the circuit 14 and the sensor 2 can be closed and covered, for example, by means of a potting compound 22.
  • the sealing compound 22 is formed for example by a damping formed resin, in particular epoxy resin.
  • the printed circuit board 4 can be additionally damped so advantageous by means of the potting compound 22 so that vibrations, in particular structure-borne noise from the circuit board 19, which are transmitted via the solder balls such as the solder ball 23 on the circuit board 4, can be effectively damped in the sensor 2.
  • the sensor 2 can advantageously not experience any deformation of a sensor body, in particular semiconductor material of the sensor 2, which can falsify the sensor signal and generate the aforementioned artifacts in the sensor signal.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Wire Bonding (AREA)
  • Measuring Fluid Pressure (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)

Abstract

The invention relates to a sensor arrangement (1) having a sensor (2) and a printed circuit board (4). The sensor, in particular electrical connections of the sensor, is solder-connected to the printed circuit board. The sensor is preferably designed to detect an in particular static air pressure and/or air humidity. The sensor according to the invention has a surface (29) with a sensor opening (3) for detecting an air pressure. The sensor also comprises at least one electrical connection (6, 7, 10, 11) which is designed on the surface of the sensor facing the printed circuit board, wherein the electrical connection is connected to the printed circuit board by means of soldering. The printed circuit board has an aperture (5) which is arranged in such a way that the sensor can detect the air pressure through the aperture via the sensor opening.

Description

Beschreibung  description
Titel title
Sensoranordnung  sensor arrangement
Stand der Technik State of the art
Die Erfindung betrifft eine Sensoranordnung mit einem Sensor und einer Leiterplatte. Der Sensor, insbesondere elektrische Anschlüsse des Sensors, ist mit der Leiterplatte lötverbunden. Der Sensor ist bevorzugt ausgebildet, einen insbesondere statischen Luftdruck und/oder eine Luftfeuchtigkeit zu erfassen.  The invention relates to a sensor arrangement with a sensor and a printed circuit board. The sensor, in particular electrical connections of the sensor, is soldered to the circuit board. The sensor is preferably designed to detect a particular static air pressure and / or humidity.
Sensoren zum Erfassen eines Luftdrucks oder einer Luftfeuchtigkeit sind mit einem Sensorgehäuse bekannt, welches den Sensor und einen Schaltkreis zur Signalverarbeitung des Sensorsignals umgibt. Sowohl der Sensor als auch der Schaltkreis zur Signalverarbeitung können auf einer gemeinsamen Leiterplatte angeordnet und mit der gemeinsamen Leiterplatte verbunden sein. Sensors for detecting an air pressure or a humidity are known with a sensor housing, which surrounds the sensor and a circuit for signal processing of the sensor signal. Both the sensor and the signal processing circuit may be disposed on a common circuit board and connected to the common circuit board.
Offenbarung der Erfindung Disclosure of the invention
Erfindungsgemäß weist der Sensor eine Oberfläche mit einer Sensoröffnung zum Erfassen eines Luftdruckes, insbesondere eines den Sensor umgebenden Umgebungsluftdruckes auf. Der Sensor weist auch wenigstens einen elektrischen Anschluss auf, welcher - bevorzugt als elektrisch leitfähiger Flächenbereich - an der Oberfläche des Sensors ausgebildet ist. Die Oberfläche des Sensors ist der Leiterplatte zugewandt, wobei der elektrisch Anschluss mittels eines Lötmittels, insbesondere einer Lotperle, im Englischen auch Bump genannt, mit der Leiterplatte verbunden ist. Die Leiterplatte weist einen Durchbruch auch, welcher der- art angeordnet ist, dass der Sensor über die Sensoröffnung den Luftdruck durch den Durchbruch hindurch erfassen kann. According to the invention, the sensor has a surface with a sensor opening for detecting an air pressure, in particular an ambient air pressure surrounding the sensor. The sensor also has at least one electrical connection, which is preferably formed as an electrically conductive surface region on the surface of the sensor. The surface of the sensor faces the printed circuit board, wherein the electrical connection by means of a solder, in particular a solder ball, also called bump in English, is connected to the printed circuit board. The printed circuit board also has a breakthrough, which is arranged so that the sensor can detect the air pressure through the opening through the sensor opening.
Auf diese Weise kann der Sensor vorteilhaft aufwandsgünstig mit einer Leiterplatte verbunden werden, weiter vorteilhaft kann ein den Sensor umgebendes Gehäuse entfallen, insoweit die Sensoröffnung oder ein Flächenbereich des Sensors, welcher zum Erfassen des Luftdruckes ausgebildet ist, durch den Durchbruch der Leiterplatte hindurch mit der Umgebungsluft Kontakt haben kann und so das den Sensor umgebende Gehäuse mit einem Durchbruch entfallen kann. In this way, the sensor advantageously can be connected to a printed circuit board, further advantageously a housing surrounding the sensor can be omitted insofar as the sensor opening or an area of the sensor, which is designed to detect the air pressure, through the breakthrough of the circuit board through with the ambient air Contact can have and so the housing surrounding the sensor can be omitted with a breakthrough.
Der Sensor ist bevorzugt ausgebildet, ein Sensorsignal zu erzeugen, das den Luftdruck und/oder die Luftfeuchtigkeit repräsentiert und das Sensorsignal aus- gangsseitig auszugeben. The sensor is preferably designed to generate a sensor signal which represents the air pressure and / or the air humidity and to output the sensor signal on the output side.
In einer bevorzugten Ausführungsform der Sensoranordnung erstreckt sich zwischen dem Sensor und der Leiterplatte ein Spalt, wobei der Spalt mit einem Dichtmittel, insbesondere einer Dichtmasse, bevorzugt umlaufend abgedichtet ist, sodass der Luftdruck nur durch den Durchbruch hindurch erfasst werden kann. Die Dichtmasse ist beispielsweise durch ein Epoxidharz gebildet, bevorzugt ist die Dichtmasse ein sogenanntes Underfill-Material, umfassend Epoxidharz. In a preferred embodiment of the sensor arrangement, a gap extends between the sensor and the printed circuit board, wherein the gap is preferably circumferentially sealed with a sealing agent, in particular a sealing compound, so that the air pressure can only be detected through the opening. The sealant is formed for example by an epoxy resin, preferably, the sealant is a so-called underfill material comprising epoxy resin.
In einer bevorzugten Ausführungsform ist das Dichtmittel derart thixotrop ausgebildet, dass das Dichtmittel von dem zuvor erwähnten Spalt mittels Kapillarkräfte eingesaugt werden kann, wobei das Dichtmittel maximal bis hin zu dem Durchbruch reicht und so nicht in den Durchbruch hinein fließen kann. In a preferred embodiment, the sealant is thixotropic in such a way that the sealant can be sucked in from the aforementioned gap by means of capillary forces, the sealant reaching as far as the breakthrough and thus not being able to flow into the aperture.
Dadurch kann der Durchbruch vorteilhaft frei bleiben, wogegen der Spalt, welcher sich zwischen der Leiterplatte und dem Sensor erstreckt, ausgefüllt werden und die Lotperlen, auch Bumps genannt, umfließen kann. In einer bevorzugten Ausführungsform ist der Sensor als gehäuseloser Halbleiterbaustein, auch Bare-Die genannt, ausgebildet. So kann der Halbleiterbaustein vorteilhaft aufwandsgünstig mit der Leiterplatte verbunden werden, sodass die elektrischen Verbindungen, welche durch die sogenannten Bumps oder Lotperlen gebildet sind, eine sonst notwendige Drahtbondverbindung entfallen lassen können. This allows the breakthrough advantageously remain free, whereas the gap, which extends between the circuit board and the sensor, are filled, and the solder balls, also called bumps, can flow around. In a preferred embodiment, the sensor is designed as a housing-free semiconductor module, also called Bare-Die. Thus, the semiconductor device can be advantageous advantageously connected to the circuit board, so that the electrical connections, which are formed by the so-called bumps or solder balls, can be omitted an otherwise necessary Drahtbondverbindung.
Der Sensor als gehäuseloser Halbleiterbaustein kann beispielsweise in einem weiteren Arbeitsschritt nach dem Verlöten und nach dem Abdichten mit Epoxidharz vollständig mittels einer Vergußmasse, beispielsweise einem weiteren Epoxidharz, verschlossen werden. The sensor as a caseless semiconductor component, for example, in a further step after soldering and after sealing with epoxy resin completely by means of a potting compound, such as a further epoxy resin, are closed.
In einer bevorzugten Ausführungsform weist die Sensoranordnung einen integrierten Schaltkreis auf, welcher zur Signalverarbeitung des Sensorsignals ausgebildet ist und welcher eingangsseitig mit dem Sensor elektrisch verbunden und weiter bevorzugt mit der Leiterplatte lötverbunden ist. So kann der Sensor vorteilhaft aufwandsgünstig zusammen mit dem Schaltkreis, insbesondere einem Chip zur Signalverarbeitung, gemeinsam auf einer Leiterplatte angeordnet sein, wobei ein den Schaltkreis zur Signalverarbeitung und das den Sensor umgebende Gehäuse entfallen kann. In a preferred embodiment, the sensor arrangement has an integrated circuit which is designed for signal processing of the sensor signal and which is electrically connected on the input side to the sensor and more preferably is solder-connected to the printed circuit board. Thus, the sensor can advantageously advantageously be arranged together with the circuit, in particular a chip for signal processing, together on a printed circuit board, whereby a circuit for signal processing and the housing surrounding the sensor can be dispensed with.
In einer bevorzugten Ausführungsform ist der Sensor und/oder der Schaltkreis mittels Flip-Chip-Montage mit der Leiterplatte verbunden. Dadurch kann die Sensoranordnung vorteilhaft aufwandsgünstig bereitgestellt werden. In a preferred embodiment, the sensor and / or the circuit is connected to the printed circuit board by means of flip-chip mounting. As a result, the sensor arrangement can advantageously be provided at low cost.
In einer anderen Ausführungsform ist der Sensor und/oder der Schaltkreis mittels SM D-Löttechnik, insbesondere mittels eines Reflow-Lötverfahrens, mit der Leiterplatte verbunden. In another embodiment, the sensor and / or the circuit by means of SM D soldering, in particular by means of a reflow soldering, connected to the circuit board.
In einer bevorzugten Ausführungsform weist die Leiterplatte auf einer dem Sensor gegenüberliegenden Seite elektrische Anschlüsse zum Lötverbinden mit einer weiteren Leiterplatte auf, sodass die Leiterplatte und die weitere Leiterplatte derart voneinander beabstandet sind, dass einen Luftdruck durch den Durch- bruch hindurch erfasst werden kann. So kann die Leiterplatte vorteilhaft als Sensormodul, welches die Leiterplatte, den Sensor oder zusätzlich den Schaltkreis zur Signalverarbeitung des Sensorsignals umfasst, mittels Flip-Chip-Löttechnik oder Reflow-Löttechnik mit der weiteren Leiterplatte verbunden werden. In a preferred embodiment, the printed circuit board on a side opposite the sensor on electrical connections for soldering to another circuit board, so that the circuit board and the other circuit board are spaced apart such that an air pressure through the through break can be detected. Thus, the circuit board can advantageously be connected as a sensor module, which includes the circuit board, the sensor or additionally the circuit for signal processing of the sensor signal, by means of flip-chip soldering or reflow soldering with the other circuit board.
Ein Abstand der Leiterplatte von der weiteren Leiterplatte beträgt beispielsweise wenigstens 100 Mikrometer, weiter bevorzugt zwischen 50 Mikrometer und 300 Mikrometer. A distance of the printed circuit board from the further printed circuit board is for example at least 100 micrometers, more preferably between 50 micrometers and 300 micrometers.
In einer bevorzugten Ausführungsform sind die elektrischen Anschlüsse des Sensors in dem Spalt zwischen dem Sensor und der Leiterplatte angeordnet. Weiter bevorzugt ist der Spalt von dem Dichtmittel - bevorzugt umlaufend - im Bereich der Anschlüsse ausgefüllt. Weiter bevorzugt sind die Anschlüsse in das Dichtmittel eingebettet. Dadurch sind die Anschlüsse vorteilhaft vor Feuchtigkeit der Umgebungsluft geschützt, welche durch den Durchbruch in den Spalt gelangen kann. In a preferred embodiment, the electrical connections of the sensor are arranged in the gap between the sensor and the printed circuit board. More preferably, the gap of the sealing means - preferably circumferentially - filled in the region of the connections. More preferably, the terminals are embedded in the sealant. As a result, the connections are advantageously protected from moisture of the ambient air, which can pass through the opening in the gap.
So kann die Sensoranordnung vorteilhaft aufwandsgünstig bereitgestellt werden, soweit die elektrischen Anschlüsse nicht nur am Rand der Leiterplatte angeordnet sein können, sondern auch auf einer Fläche der Leiterplatte verteilt sein können, welche der weiteren Leiterplatte gegenüberliegt. Thus, the sensor arrangement can advantageously be provided at low cost, as far as the electrical connections can not only be arranged at the edge of the circuit board, but can also be distributed on a surface of the circuit board, which is opposite to the other circuit board.
In einer bevorzugten Ausführungsform sind die Anschlüsse zum Lötverbinden mit der weiteren Leiterplatte in einem zu dem Sensor benachbarten Bereich ausgebildet. Weiter bevorzugt ist der Bereich der Leiterplatte, auf dem der Sensor angeordnet ist, frei von mechanischen Verbindungen zu der weiteren Leiterplatte hin. So kann der Sensor vorteilhaft zusammen mit einem Teil der Leiterplatte, auf dem der Sensor mit der Leiterplatte verbunden ist, relativ zu der weiteren Leiterplatte schwingen oder thermisch bedingte Wärmeausdehnungen erfahren. Weiter vorteilhaft kann das Sensorsignal so weitgehend frei oder frei von Artefakten sein, welche dem Sensorsignal, das die zu erfassende Messgröße repräsentiert, überlagert sind und dieses verfälschen. Es wurde nämlich erkannt, dass der Sensor, insbesondere der zuvor erwähnte gehäuselos ausgebildete Sensor, insbesondere Halbleitersensor, empfindlich ist gegenüber mechanischen Verbiegungen des Sensorbausteins. Solche Verlegungen können beispielsweise von der Leiterplatte, mit der der Sensor verlötet ist, auf den Sensorbaustein wirken. In a preferred embodiment, the terminals for solder bonding with the further printed circuit board are formed in a region adjacent to the sensor. More preferably, the region of the circuit board on which the sensor is arranged, free of mechanical connections to the other circuit board. Thus, the sensor can advantageously oscillate together with a part of the printed circuit board on which the sensor is connected to the printed circuit board relative to the other printed circuit board or experience thermally induced thermal expansions. Further advantageously, the sensor signal can be largely free or free of artifacts, which are superimposed on the sensor signal, which represents the measured variable to be detected, and this falsify. It was in fact recognized that the sensor, in particular the previously mentioned housing-less sensor, in particular a semiconductor sensor, is sensitive to mechanical bending of the sensor module. Such transfers can act on the sensor module, for example, from the printed circuit board with which the sensor is soldered.
In einer bevorzugten Ausführungsform ist der Sensor ein MEMS-Sensor. So kann der Sensor vorteilhaft platzsparend ausgebildet sein. In a preferred embodiment, the sensor is a MEMS sensor. Thus, the sensor can advantageously be designed to save space.
In einer bevorzugten Ausführungsform ist ein Durchmesser des Durchbruchs in der Leiterplatte größer als eine Erstreckung des Spaltes zwischen dem Sensor und der Leiterplatte. So kann vorteilhaft eine Kapillarwirkung, welche das zuvor erwähnte Dichtmittel in den Spalt saugen kann, vor dem Durchbruch stoppen oder so gering ausgebildet sein, dass das Dichtmittel nicht in den Durchbruch hinein gesaugt werden kann. In a preferred embodiment, a diameter of the aperture in the circuit board is greater than an extension of the gap between the sensor and the circuit board. Thus, advantageously, a capillary action, which can suck the aforementioned sealing means into the gap, stop before the breakthrough or be made so small that the sealant can not be sucked into the opening.
Der zuvor erwähnte Durchbruch in der Leiterplatte weist bevorzugt einen Durchmesser zwischen 20 Mikrometer und 300 Mikrometer auf. The aforementioned breakdown in the printed circuit board preferably has a diameter between 20 microns and 300 microns.
Die Erfindung wird nun im Folgenden anhand von Figuren und weiteren Ausführungsbeispielen beschrieben. Weitere vorteilhafte Ausführungsformen ergeben sich aus den in den abhängigen Ansprüchen und in den Figuren beschriebenen Merkmalen. The invention will now be described below with reference to figures and further embodiments. Further advantageous embodiments will become apparent from the features described in the dependent claims and in the figures.
Figur 1 zeigt ein Ausführungsbeispiel für eine Sensoranordnung mit einem Sensor und einer mit dem Sensor verbundenen Leiterplatte, welche ausgebildet ist, einen Luftdruck oder eine Luftfeuchtigkeit durch einen Durchbruch in einer Leiterplatte hindurch zu erfassen; FIG. 1 shows an exemplary embodiment of a sensor arrangement with a sensor and a printed circuit board connected to the sensor, which is designed to detect an air pressure or a humidity through an opening in a printed circuit board;
Figur 2 zeigt eine Variante der in Figur 1 gezeigten Anordnung, bei der der Sensor zusammen mit der Leiterplatte mit einer weiteren Leiterplatte lötverbunden ist und ein Endabschnitt der Leiterplatte mit dem Sensor berührungsfrei von der weiteren Leiterplatte beabstandet ist. Figur 1 zeigt ein Ausführungsbeispiel für eine Sensoranordnung 1. Die Sensoranordnung 1 umfasst einen Sensor 2, in diesem Ausführungsbeispiel ein MEMS- Sensor (MEMS = Micro-Electrical-Mechanical-System). Figure 2 shows a variant of the arrangement shown in Figure 1, in which the sensor is soldered together with the circuit board with another circuit board and an end portion of the circuit board with the sensor is spaced from the other circuit board without contact. FIG. 1 shows an exemplary embodiment of a sensor arrangement 1. The sensor arrangement 1 comprises a sensor 2, in this exemplary embodiment a MEMS sensor (MEMS = micro-electrical-mechanical system).
Der Sensor 2 weist eine Öffnung 3 auf, wobei der Sensor 2 ausgebildet ist, einen an der Öffnung 3 anliegenden Luftdruck und/oder eine Luftfeuchtigkeit einer Umgebungsluft zu erfassen und ein den Luftdruck und/oder die Luftfeuchtigkeit repräsentierende Sensorsignal zu erzeugen. The sensor 2 has an opening 3, the sensor 2 being designed to detect an air pressure and / or an air humidity of an ambient air present at the opening 3 and to generate a sensor signal representing the air pressure and / or the air humidity.
Die Sensoranordnung 1 umfasst in diesem Ausführungsbeispiel auch eine Leiterplatte 4. Der Sensor 2 ist mittels der Leiterplatte 4 mittels Lotperlen in Flip- Chip-Montage verbunden. The sensor assembly 1 in this embodiment also includes a printed circuit board 4. The sensor 2 is connected by means of the printed circuit board 4 by means of solder balls in flip-chip mounting.
Der Sensor 2 weist eine zu der Leiterplatte 4 zugewandte Seite auf, welche einen Flächenbereich der Oberfläche 29 des Sensors 2 bildet. Die Öffnung 3 zum Erfassen des Luftdruckes und/oder der Luftfeuchtigkeit ist auf der zur Leiterplatte 4 zugewandten Seite ausgebildet. Auf derselben Seite sind auch elektrische Anschlüsse, in diesem Ausführungsbeispiel elektrische Anschlüsse 6, 7, 10 und 11 ausgebildet. Die elektrischen Anschlüsse 6, 7, 10 und 11 sind in diesem Ausführungsbeispiel durch eine elektrisch leitfähige Schicht ausgebildet, welche einen Flächenbereich der zu der Leiterplatte 4 zugewandten Oberfläche 29 bildet. Die zur Leiterplatte 4 zugewandte Oberfläche 29 des Sensors 2 ist in diesem Ausführungsbeispiel eben ausgebildet. Der Sensor 2 ist in diesem Ausführungsbeispiel quaderförmig ausgebildet und ist ein gehäuseloser Halbleiter, im Englischen auch Bare-Die genannt. The sensor 2 has a side facing the printed circuit board 4, which forms a surface area of the surface 29 of the sensor 2. The opening 3 for detecting the air pressure and / or the humidity is formed on the circuit board 4 facing side. On the same side and electrical connections, in this embodiment, electrical connections 6, 7, 10 and 11 are formed. The electrical connections 6, 7, 10 and 11 are formed in this embodiment by an electrically conductive layer, which forms a surface region of the circuit board 4 facing surface 29. The printed circuit board 4 facing surface 29 of the sensor 2 is flat in this embodiment. The sensor 2 is cuboid in this embodiment and is a caseless semiconductor, also called bare die in English.
Die elektrischen Anschlüsse 6, 7, 10 und 11 sind jeweils mittels einer Lotperle, in Flip-Chip-Montage mit der Leiterplatte 4 verbunden. Dazu ist der elektrische An- schluss 6 mittels einer Lotperle 9 und der elektrische Anschluss 7 mittels einerThe electrical connections 6, 7, 10 and 11 are each connected by means of a solder ball, in flip-chip mounting to the circuit board 4. For this purpose, the electrical connection 6 by means of a solder bead 9 and the electrical connection 7 by means of a
Lotperle 8, der elektrische Anschluss 10 mittels einer Lotperle 12 und der elektrische Anschluss 1 1 mittels einer Lotperle 13 mit der Leiterplatte 4 und dort mit einer entsprechenden Leiterbahn zum elektrischen Verbinden des Sensors 2 mit der Leiterplatte 4 elektrisch verbunden. Zu einer Montage des Sensors 2 auf der Leiterplatte 4 kann der Sensor 2, welcher die Lotperlen 8, 9, 12 und 13 bereits an den entsprechenden Kontakten 6, 7, 10 und 1 1 aufweist, auf die Leiterplatte 4 aufgesetzt werden und mittels Reflow- Löttechnik mit der Leiterplatte 4 verlötet werden. Lotperle 8, the electrical connection 10 by means of a solder bead 12 and the electrical connection 1 1 by means of a solder ball 13 to the circuit board 4 and there electrically connected to a corresponding conductor for electrically connecting the sensor 2 to the circuit board 4. For an assembly of the sensor 2 on the circuit board 4, the sensor 2, which has the solder balls 8, 9, 12 and 13 already at the corresponding contacts 6, 7, 10 and 1 1, are placed on the circuit board 4 and by means of reflow Soldering be soldered to the circuit board 4.
Der Sensor 2 ist von der Leiterplatte 4 beabstandet angeordnet, sodass zwischen dem Sensor 2 und der Leiterplatte 4 ein Spalt 18 ausgebildet ist. Der Spalt 18 ist in diesem Ausführungsbeispiel zwischen dem Sensor 2 und der Leiterplatte 4 mittels eines Dichtmittels 17 wenigstens teilweise gefüllt. Das Dichtmittel 17 ist beispielsweise ein hoch viskos ausgebildetes Epoxidharz, welches ausgebildet ist, in den Spalt 18 hineinzufließen. The sensor 2 is arranged at a distance from the printed circuit board 4, so that a gap 18 is formed between the sensor 2 and the printed circuit board 4. The gap 18 is at least partially filled in this embodiment between the sensor 2 and the circuit board 4 by means of a sealant 17. The sealing means 17 is, for example, a highly viscous epoxy resin, which is designed to flow into the gap 18.
Die Leiterplatte 4 weist einen Durchbruch 5 auf. Der Durchbruch 5 weist einen kleineren Durchmesser 21 auf, als eine flache Erstreckung des Sensors 2, sodass der Durchbruch 5 durch den Sensor 2 von einer Seite abgedeckt ist. The circuit board 4 has an opening 5. The opening 5 has a smaller diameter 21 than a flat extension of the sensor 2, so that the opening 5 is covered by the sensor 2 from one side.
Die Öffnung 3 des Sensors 2 ist angeordnet und ausgebildet, durch den Durchbruch 5 und den Spalt 18, welcher im Bereich des Durchbruchs 5 frei von dem Dichtmittel 17 gebildet ist, den Luftdruck einer Umgebungsluft 25 zu erfassen oder eine Luftfeuchtigkeit der Umgebungsluft 25 zu erfassen. The opening 3 of the sensor 2 is arranged and formed, through the opening 5 and the gap 18, which is formed in the region of the opening 5 free of the sealing means 17 to detect the air pressure of an ambient air 25 or to detect a humidity of the ambient air 25.
Der Durchbruch 5 weist in diesem Ausführungsbeispiel einen Durchmesser 21 zwischen 20 und 50 Mikrometer auf. Der Durchbruch 5 ist in diesem Ausführungsbeispiel mittels eines Bohrers gebohrt oder mittels eines Lasers in der Leiterplatte 4 erzeugt. The aperture 5 in this embodiment has a diameter 21 between 20 and 50 microns. The aperture 5 is drilled in this embodiment by means of a drill or generated by means of a laser in the circuit board 4.
Mit der Leiterplatte 4 ist in diesem Ausführungsbeispiel auch ein Schaltkreis 14 zur Signalverarbeitung des von dem Sensor 2 erzeugten Sensorsignals verlötet. Der Schaltkreis 14 ist in diesem Ausführungsbeispiel durch ein ASIC (ASIC = Application-Specific-Integrated-Circuit), ein FPGA (FPGA = Field-Programmable- Gate-Array) oder einen DSP (DSP = Digitaler-Signal-Prozessor) gebildet. Der Schaltkreis 14 ist in diesem Ausführungsbeispiel mittels Flip-Chip-Montage mit der Leiterplatte 4 verbunden. Ein elektrischer Anschluss 15 des Schaltkreises 14 ist beispielhaft bezeichnet, welcher mittels einer beispielhaft bezeichneten Lotperle 16 mit einer entsprechenden Leiterbahn der Leiterplatte 4 elektrisch verbunden ist. Der Sensor 2 ist ausgangsseitig mit dem Schaltkreis 14 über eine Verbindungsleitung 24 verbunden, sodass der Schaltkreis 14 das Sensorsignal über die Verbindungsleitung 24, welche in diesem Ausführungsbeispiel als Leiterbahn ausgebildet ist, empfangen kann. With the circuit board 4, a circuit 14 for signal processing of the sensor signal generated by the sensor 2 is soldered in this embodiment, too. In this exemplary embodiment, the circuit 14 is formed by an ASIC (Application Specific Integrated Circuit), an FPGA (FPGA = Field Programmable Gate Array) or a DSP (DSP = Digital Signal Processor). The circuit 14 is connected in this embodiment by means of flip-chip mounting to the circuit board 4. An electrical terminal 15 of the circuit 14 is exemplified, which is electrically connected by means of an exemplary designated solder ball 16 with a corresponding conductor track of the printed circuit board 4. The sensor 2 is connected on the output side to the circuit 14 via a connecting line 24, so that the circuit 14 can receive the sensor signal via the connecting line 24, which is formed in this embodiment as a conductor track.
Der Schaltkreis 14 ist in diesem Ausführungsbeispiel mittels eines Dichtmittels 17, in diesem Ausführungsbeispiel mittels einer Dichtmassenraupe zur Leiterplatte 4 hin abgedichtet. The circuit 14 is sealed in this embodiment by means of a sealing means 17, in this embodiment by means of a sealing mass bead to the circuit board 4 through.
Figur 2 zeigt die in Figur 1 bereits dargestellte Sensoranordnung 1 , welche beispielhaft mit einer weiteren Leiterplatte 19 verlötet ist. FIG. 2 shows the sensor arrangement 1 already shown in FIG. 1, which is soldered by way of example to another printed circuit board 19.
Die Lotverbindung zwischen der Leiterplatte 19 und der Leiterplatte 4 umfasst in diesem Ausführungsbeispiel vier Lotperlen, von denen eine Lotperle 23 beispielhaft bezeichnet ist und einen zu der Leiterplatte 19 gewandten Anschluss 28 mit der weiteren Leiterplatte 19 verbindet. Die vier Lotperlen befinden sich in diesem Ausführungsbeispiel in einem Spalt 27 auf einem Flächenbereich, welcher zwischen einer Flächenerstreckung des Schaltkreises 14 und der Leiterplatte 19 angeordnet ist. The solder connection between the printed circuit board 19 and the printed circuit board 4 in this exemplary embodiment comprises four solder bumps, of which one solder bump 23 is designated by way of example and connects a connection 28 facing the printed circuit board 19 to the further printed circuit board 19. The four solder balls are in this embodiment in a gap 27 on a surface region which is arranged between an areal extent of the circuit 14 and the circuit board 19.
Ein Endabschnitt 26 der Leiterplatte 4, auf dem der Sensor 2 angeordnet ist, kann somit - nach Art eines Sprungbrettes - frei, insbesondere berührungsfrei relativ zur Leiterplatte 19 schwingen oder den Sensor 2 von einer thermischen Ausdehnung der Leiterplatte 4 entkoppeln. Die Leiterplatte 4 ist dazu wenigstens im Bereich des Sensors 2 von der Leiterplatte 19 mittels eines Abstandes 20 beabstandet, sodass ein Spalt mit einer Spaltdicke des Abstandes 20 zwischen der Leiterplatte 4 und der Leiterplatte 19 ausgebildet ist. Der Sensor 2 kann somit an der Öffnung 3 den Luftdruck und/oder eine Luftfeuchtigkeit der Umgebungsluft 25 durch den Durchbruch 5 hindurch und weiter über den Spalt 27 mit der Spaltdicke des Abstandes 20 erfassen. An end portion 26 of the printed circuit board 4, on which the sensor 2 is arranged, can thus - in the manner of a springboard - swing free, in particular contactless relative to the circuit board 19 or decouple the sensor 2 from a thermal expansion of the circuit board 4. For this purpose, the printed circuit board 4 is spaced from the printed circuit board 19 by means of a distance 20 at least in the region of the sensor 2, so that a gap with a gap thickness of the distance 20 between the printed circuit board 4 and the printed circuit board 19 is formed. The sensor 2 can thus detect at the opening 3 the air pressure and / or a humidity of the ambient air 25 through the aperture 5 and further via the gap 27 with the gap thickness of the distance 20.
Die Leiterplatte 4, insbesondere der Schaltkreis 14 und der Sensor 2, können beispielsweise mittels einer Vergußmasse 22 verschlossen und abgedeckt sein. Die Vergußmasse 22 ist beispielsweise durch ein dämpfend ausgebildetes Harz, insbesondere Epoxidharz, gebildet. Die Leiterplatte 4 kann so vorteilhaft mittels der Vergußmasse 22 zusätzlich bedämpft werden, sodass Schwingungen, insbesondere Körperschall von der Leiterplatte 19, welche über die Lotperlen wie die Lotperle 23 auf die Leiterplatte 4 übertragen werden, im Bereich des Sensors 2 wirksam bedämpft werden können. Der Sensor 2 kann so vorteilhaft keine Deformationen eines Sensorkörpers, insbesondere Halbleitermaterials des Sensors 2, erfahren, welche das Sensorsignal verfälschen und in dem Sensorsignal die zuvor erwähnten Artefakte erzeugen können. The printed circuit board 4, in particular the circuit 14 and the sensor 2, can be closed and covered, for example, by means of a potting compound 22. The sealing compound 22 is formed for example by a damping formed resin, in particular epoxy resin. The printed circuit board 4 can be additionally damped so advantageous by means of the potting compound 22 so that vibrations, in particular structure-borne noise from the circuit board 19, which are transmitted via the solder balls such as the solder ball 23 on the circuit board 4, can be effectively damped in the sensor 2. The sensor 2 can advantageously not experience any deformation of a sensor body, in particular semiconductor material of the sensor 2, which can falsify the sensor signal and generate the aforementioned artifacts in the sensor signal.

Claims

Ansprüche claims
1. Sensoranordnung (1) mit einem Sensor (2) und einer Leiterplatte (4), wobei der Sensor (2), mit der Leiterplatte (4) lötverbunden ist, und der Sensor (2) ausgebildet ist einen statischen Luftdruck und/oder eine Luftfeuchtigkeit zu erfassen,  1. Sensor arrangement (1) with a sensor (2) and a printed circuit board (4), wherein the sensor (2), with the circuit board (4) is soldered, and the sensor (2) is formed a static air pressure and / or a To detect humidity
dadurch gekennzeichnet, dass characterized in that
der Sensor (2) eine Oberfläche (29) mit einer Sensoröffnung (3) zum Erfassen des Luftdruckes und/oder der Luftfeuchtigkeit aufweist, und wenigstens einen elektrischen Anschluss (6, 7, 10, 1 1), welcher an der Oberfläche (29) ausgebildet ist, wobei die Oberfläche (29) der Leiterplatte (4) zugewandt ist und der elektrische Anschluss (6, 7, 10, 11) mittels eines Lotmittels, insbesondere Lotperle mit der Leiterplatte (4) verbunden ist und die Leiterplatte (4) einen Durchbruch (5) aufweist, welcher derart angeordnet ist, dass der Sensor (2) über die Sensoröff- nung (3) den Luftdruck durch den Durchbruch (5) hindurch erfassen kann. the sensor (2) has a surface (29) with a sensor opening (3) for detecting the air pressure and / or the air humidity, and at least one electrical connection (6, 7, 10, 11) which is arranged on the surface (29). is formed, wherein the surface (29) of the printed circuit board (4) faces and the electrical connection (6, 7, 10, 11) by means of a Lotmittels, in particular solder bead with the circuit board (4) is connected and the circuit board (4) Breakthrough (5) which is arranged such that the sensor (2) via the sensor opening (3) can detect the air pressure through the opening (5).
2. Sensoranordnung (1) nach Anspruch 1 , 2. Sensor arrangement (1) according to claim 1,
dadurch gekennzeichnet, dass characterized in that
ein sich zwischen dem Sensor (2) und der Leiterplatte (4) erstreckender Spalt (18) mit einem Dichtmittel (17) abgedichtet ist, so dass der Luftdruck nur durch den Durchbruch (5) erfasst werden kann. a gap (18) extending between the sensor (2) and the printed circuit board (4) is sealed with a sealing means (17), so that the air pressure can only be detected by the opening (5).
3. Sensoranordnung (1) nach einem der Ansprüche 1 oder 2, 3. Sensor arrangement (1) according to one of claims 1 or 2,
dadurch gekennzeichnet, dass characterized in that
der Sensor (2) als gehäuseloser Halbleiterbaustein ausgebildet ist. the sensor (2) is designed as a housing-free semiconductor module.
4. Sensoranordnung (1) nach einem der vorhergehenden Ansprüche, 4. Sensor arrangement (1) according to one of the preceding claims,
dadurch gekennzeichnet, dass characterized in that
die Sensoranordnung (1) einen integrierten Schaltkreis (14) aufweist, welcher zurthe sensor arrangement (1) has an integrated circuit (14) which is connected to the
Signalverarbeitung des Sensorsignals ausgebildet ist und welcher eingangsseitig mit dem Sensor (2) elektrisch verbunden und mit der Leiterplatte (4) Signal processing of the sensor signal is formed and which on the input side electrically connected to the sensor (2) and to the circuit board (4)
lötverbunden ist. is soldered.
5. Sensoranordnung (1) nach Anspruch 4, 5. Sensor arrangement (1) according to claim 4,
dadurch gekennzeichnet, dass characterized in that
der Sensor (2) und/oder der Schaltkreis (14) mittels Flip-Chip-Montage mit der Leiterplatte (4) verbunden ist. the sensor (2) and / or the circuit (14) is connected to the printed circuit board (4) by means of flip-chip mounting.
6. Sensoranordnung (1) nach einem der vorhergehenden Ansprüche, 6. Sensor arrangement (1) according to one of the preceding claims,
dadurch gekennzeichnet, dass characterized in that
die Leiterplatte (4) auf einer dem Sensor (2) gegenüberliegenden Seite elektrische Anschlüsse (28) zum Lötverbinden mit einer weiteren Leiterplatte (19) aufweist, so dass die Leiterplatte (4) und die weitere Leiterplatte (19) derart voneinander beabstandet sind, dass ein Luftdruck durch den Durchbruch (5) hindurch erfasst werden kann. the printed circuit board (4) has electrical connections (28) for soldering connection to another printed circuit board (19) on a side opposite the sensor (2) so that the printed circuit board (4) and the further printed circuit board (19) are spaced apart from one another an air pressure through the opening (5) can be detected.
7. Sensoranordnung (1) nach Anspruch 6, 7. Sensor arrangement (1) according to claim 6,
dadurch gekennzeichnet, dass die elektrischen Anschlüsse des Sensors (6, 7, 10, 11) in dem Spalt (18) angeordnet sind, wobei der Spalt (18) von dem Dichtmittel (17) im Bereich der Anschlüsse (6, 7, 10, 11) ausgefüllt ist, so dass die Anschlüsse (6, 7, 10, 1 1) in das Dichtmittel (17) eingebettet sind. characterized in that the electrical connections of the sensor (6, 7, 10, 11) in the gap (18) are arranged, wherein the gap (18) of the sealing means (17) in the region of the terminals (6, 7, 10, 11) is filled in that the connections (6, 7, 10, 11) are embedded in the sealing means (17).
5  5
8. Sensoranordnung (1) nach einem der vorhergehenden Ansprüche,  8. Sensor arrangement (1) according to one of the preceding claims,
dadurch gekennzeichnet, dass 0 die Anschlüsse (28) zum Lötverbinden mit der weiteren Leiterplatte (19) in einem zu dem Sensor (2) benachbarten Bereich ausgebildet sind, so dass der Sensor (2) zusammen mit einem Teil (26) der Leiterplatte (4), auf dem der Sensor (2) mit der Leiterplatte (4) verbunden ist, relativ zu der weiteren Leiterplatte (19) schwingen kann.characterized in that the terminals (28) for solder connection to the further circuit board (19) are formed in a region adjacent to the sensor (2) so that the sensor (2) together with a part (26) of the circuit board (4 ), on which the sensor (2) is connected to the printed circuit board (4), can oscillate relative to the further printed circuit board (19).
5 5
9. Sensoranordnung (1) nach einem der vorhergehenden Ansprüche,  9. Sensor arrangement (1) according to one of the preceding claims,
dadurch gekennzeichnet, dass characterized in that
o der Sensor (2) ein Micro-Electrical-Mechanical-Systems-Sensor ist. o the sensor (2) is a micro-electrical-mechanical-system sensor.
10. Sensoranordnung (1) nach einem der vorhergehenden Ansprüche, 10. Sensor arrangement (1) according to one of the preceding claims,
dadurch gekennzeichnet, dasscharacterized in that
5 5
ein Durchmesser (21) des Durchbruchs (5) größer ist als eine Erstreckung des Spaltes (18) zwischen dem Sensor (2) und der Leiterplatte (4).  a diameter (21) of the aperture (5) is greater than an extension of the gap (18) between the sensor (2) and the printed circuit board (4).
PCT/EP2015/058306 2014-04-29 2015-04-16 Sensor arrangement WO2015165745A1 (en)

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