WO2015150397A1 - Dispositif de contrôle de la température de modules électroniques - Google Patents

Dispositif de contrôle de la température de modules électroniques Download PDF

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Publication number
WO2015150397A1
WO2015150397A1 PCT/EP2015/057051 EP2015057051W WO2015150397A1 WO 2015150397 A1 WO2015150397 A1 WO 2015150397A1 EP 2015057051 W EP2015057051 W EP 2015057051W WO 2015150397 A1 WO2015150397 A1 WO 2015150397A1
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WO
WIPO (PCT)
Prior art keywords
air
air flow
fastening
air duct
multiple arrangement
Prior art date
Application number
PCT/EP2015/057051
Other languages
German (de)
English (en)
Inventor
Armin MEININGER
Original Assignee
Meininger Armin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meininger Armin filed Critical Meininger Armin
Publication of WO2015150397A1 publication Critical patent/WO2015150397A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/015—Boards, panels, desks; Parts thereof or accessories therefor
    • H02B1/04—Mounting thereon of switches or of other devices in general, the switch or device having, or being without, casing
    • H02B1/052—Mounting on rails
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56—Cooling; Ventilation

Definitions

  • the invention relates to a device for air conditioning electronic assemblies.
  • control cabinets or control panels are known in which electronic circuits are installed, for example, in DIN rail housings.
  • temperature-sensitive electronic circuits it is often necessary for temperature-sensitive electronic circuits to be conditioned within the control cabinet or the control panel.
  • control cabinets are ventilated by means of fans on the side wall of the control cabinet. If only one or only a few DIN rail housings with temperature-sensitive electronic circuits are located in a control cabinet, the entire control cabinet is nevertheless ventilated in order to keep the electronic circuits within their specified temperature limits.
  • additional smaller fans are installed in the DIN rail housing.
  • control cabinets are usually ventilated according to the prior art by means of fans on the side wall of the cabinet, which is located within the cabinet an electric heater, either via its own fan or through the fan of the side wall ensures air circulation.
  • an electric heater either via its own fan or through the fan of the side wall ensures air circulation.
  • the entire cabinet is heated in order to meet the specified temperature limits can.
  • the electrical heating must be designed much stronger than it would actually require the volume of the cabinet.
  • a fan system for power distribution systems which has a fan and an attached adapter for mounting the fan on a profile rail.
  • the fan is rotatably mounted on the adapter for adjusting the air flow direction. It is also possible to set the distance between the fan and the adapter for adjusting the air outlet location of the fan.
  • a fan with a nozzle wherein the nozzle is fixed to a base plate having on its rear wall a fastening device with an upper and lower holding means for securing the fan in a DIN rail.
  • the upper and lower holding device are arranged in the attached state offset from one another, so that they point parallel to the longitudinal axis of the DIN rail in the mounted state of the fan.
  • the fan can be tilted in an insertion direction by one Tilting axis can be used perpendicular to a DIN rail longitudinal direction in the top hat rail.
  • an apparatus for air conditioning of electronic assemblies comprising a housing in which a plurality of electronic assemblies can be arranged by means of a fastening system in at least a first array along a mounting direction, the electronic assemblies in the fastening direction open and closed along an outer surface enclosing the attachment direction are formed to form an air duct, and a fixable by means of the fastening system and in communication with the air duct fan device comprises, so that the plurality of electronic components along the mounting direction with an air flow in the air duct are flowed around.
  • the invention is based on the recognition that the heat distribution in housings such as control cabinets or the like is not uniform. Accordingly, in some electronic assemblies so-called heat esters can arise, which in the prior art for dimensioning the Weghausen- would be used. The electronic assemblies are now flowed around directly with an air flow, so that an air conditioning of the often sensitive electronics is performed where the heat source or heat sink is located. To the air conditioning of the entire housing of the cabinet so much lower demands are made or can be completely eliminated. The electronic assemblies are for this purpose strung together by means of the fastening system, so that an air duct is formed, within which an air conditioning of the sensitive components can be performed.
  • the electronic assemblies must have an air passage along the attachment direction, and be equipped with an at least partially closed outer surface, so that an air flow can be passed through the air duct.
  • the air flow is generated by a suitable fan device, which may be for example an axial fan or a correspondingly adapted radial fan, wherein the
  • Blower device can also be arranged by means of the fastening system within the housing.
  • the fan device is in communication with the air duct, so that along the mounting direction, a cooling or warming air flow in the air duct for air conditioning of the electronic modules can be formed.
  • the multiple arrangement will usually be oriented horizontally, so that the fan device provides a horizontal air flow.
  • the electronic components then have an open lateral passage, so that the air duct is formed.
  • the multiple arrangement can be formed in any orientation, in particular, a rotated relative to the horizontal direction arrangement is conceivable.
  • further electronic assemblies are arranged in a second multiple arrangement along the attachment direction, wherein an air shaft is provided which the air Ström in the first multiple arrangement to the other electronic assembly in the second multiple arrangement directs, so that the other electronic assembly along the mounting direction of the second multiple arrangement is flowed around.
  • second multiple arrangements can also be integrated into the air duct, so that they are conditioned by a warming or cooling air flow.
  • the second multiple arrangement may be mounted above or below the first multiple arrangement, with conventional designs, in particular when using the device in a control cabinet or a control panel prefer a parallel orientation of the multiple arrangements.
  • the air shaft can also be fixed by means of the fastening system, so that an air conditioning device is formed, which is modular in a simple manner.
  • the air shaft is adjustable in length, preferably by means of telescoping outer shells executed.
  • a telescopically adjustable air duct via which the air duct can be bridged between adjacent multiple arrangements.
  • larger or smaller gaps may arise between the multiple arrangements, which, however, according to this embodiment can be bridged with a single air duct in which it can be adapted to the spacings of the multiple arrangements.
  • a climatic element adjacent to the fan device, a climatic element, in particular a heating element or a cooling element, mounted by means of the fastening system, so that the air flow in the air duct is air-conditioned.
  • the air conditioning is expanded by means of an air flow in the air duct, in which the air flow is provided cooled or heated. Accordingly, depending on the climatic conditions, electronic assemblies can be adapted to their specified temperature ranges.
  • the air conditioning element is also arranged by means of the fastening system within the housing, so that the conditioned air flow is supplied to the electronic components directly.
  • a cooling element for example, a Peltier cooler can be provided, so that the air flow is provided in the air duct as cold air.
  • the air flow through the electronic modules is performed circumferentially.
  • a circulating air flow is generated in which corresponding air ducts at both ends of the multiple arrangements provide for a closed air duct.
  • Another embodiment provides an outlet opening from which the air stream conducted through the electronic assemblies can emerge from the air duct.
  • the air flow is then guided into the interior of the housing, which is particularly useful if only a few heat sources or sinks are present within the housing or the other electronic components are less sensitive to temperature.
  • According to a further embodiment of the invention can be switched by means of a mounted on the mounting system and controllable Umlenkklappe between all-round and open operation.
  • a temperature measuring module is attached to the fastening system, which can be traversed by the air flow and emits a signal representing the temperature of the air flow.
  • the temperature of the air stream within the air duct is extended with a temperature measuring module, which can be designed, for example, as an analogue temperature sensor or as a bi-metal element, so that a temperature measurement can take place.
  • a temperature measuring module which can be designed, for example, as an analogue temperature sensor or as a bi-metal element, so that a temperature measurement can take place.
  • the temperature measuring module is designed with an external additional analogue temperature sensor or bimetallic element in order to detect the internal temperature of the control cabinet.
  • the internal cabinet temperature is in particular a measured variable that is needed to control the Luftumlenkklappe. This will in particular re a stable, rule vibration-free control of Gutumlenkklappe allows.
  • the temperature measuring module can be connected to a control device which, depending on the signal and possibly further parameters, carries out a control by means of the air conditioning element and / or controls the controllable deflecting flap.
  • the combination of temperature measuring module and control device allows the construction of a complete control system, which depends both on the temperature of the air flow and other parameters, such. B. ambient temperature or the like, can perform a corresponding control, for example, the climate element, but also controls the controllable flap so that is switched between rotating and open operation. Accordingly, an energetically optimal solution for air conditioning of the electronic assemblies can be created, which reacts independently of external inputs to the actual situation within the housing. According to another embodiment of the invention, further electronic assemblies are arranged to form three arrayed multiple arrays on the mounting system.
  • the example discussed above with two multiple arrangements is extended to three electronic assemblies arranged in rows. These can each be connected individually with a corresponding fan device as well as in pairs with an air shaft as described above.
  • the first multiple arrangement in a first direction of the air flow and the second and third multiple arrangement in a direction opposite to the first direction second direction are flowed through by the air flow.
  • This embodiment describes the special case of three multiple arrays of electronic assemblies, with two of the three arrays being provided with a blower device.
  • two of the multiple arrangements, in which the blower devices are mounted it is advantageous to allow two of the multiple arrangements, in which the blower devices are mounted, to flow through opposite to that multiple arrangement of the air flow.
  • a preferably exchangeable air filter is arranged in the air duct on the fastening system.
  • a replaceable air filter makes it possible to regularly maintain the device according to the invention, but it may also be provided to completely replace the air filter element attached to the fastening system.
  • the fastening system is a DIN rail system.
  • Top hat rail systems are often used in the industrial production of control cabinets or control panels and represent a proven and reliable mounting system.
  • the components described above, such as Blower device, air ducts, air conditioning elements or air filters can be attached to the hat rail system without great constructive effort. Accordingly, a modular system is created, which can be adapted in many ways to the respective requirements, in which, for example, additional elements can be added.
  • open and preferably closed-length outer surfaces which are closed along one of the attachment directions are arranged, preferably empty-lengthable empty modules, in order to bridge unoccupied locations of the multiple assembly.
  • the open spaces within the array may be bridged by one or more dummy modules.
  • the dummy module can be designed to be adjustable in length similar to the air shaft described above.
  • the housing is a control cabinet or a control panel.
  • the inventive device can be used both in closed systems, such. As cabinets, but also in example fortified by wall mounting systems such. As panels, are applied. Due to its flexibility, it is possible to use the device for the air conditioning of electronic assemblies for different types of applications.
  • the housing is provided with a fan on its outer wall.
  • the discharged warm air is removed from the interior of the housing by means of the additional fan.
  • the housing is provided with an opening in the outer wall, which is connectable by means of a hollow connecting element with the air duct.
  • the air flow in the air duct is not guided into the interior of the housing, but can be discharged via the hollow connecting element via the opening in the outer wall to the environment.
  • an additional fan can be arranged for this purpose.
  • the hollow connecting element may also be part of the above-described dummy module.
  • redundancy is multiple
  • Blower devices provided to make the air flow fail-safe.
  • blower devices are mounted, wherein in case of failure of one of the blower devices still sufficient airflow is provided.
  • This can be particularly in remote installations that can not be maintained regularly, or provide for very sensitive electronic assemblies for a longer life or lower risk of failure.
  • Fig. 1 shows schematically a device for air conditioning of electronic assemblies according to an embodiment of the invention
  • 2A shows a module for a device according to the invention for air conditioning in a perspective side view.
  • 2B shows a module for a device according to the invention for air conditioning in a perspective side view.
  • Fig. 3 shows another module for a device according to the invention for
  • FIG. 4A shows a further module for a device according to the invention for air conditioning in a perspective side view
  • FIG. 4B shows a further module for a device according to the invention for air conditioning in a perspective side view
  • Fig. 5 shows a further module for a device according to the invention for
  • Air conditioning in a perspective side view shows a further module for a device according to the invention for air conditioning in a perspective side view;
  • 6B shows a further module for a device according to the invention for air conditioning in a perspective side view
  • 7A shows a further module for a device according to the invention for air conditioning in a perspective side view
  • 7B shows a further module for a device according to the invention for air conditioning in a perspective side view
  • Fig. 8 shows another module for a device according to the invention for
  • Fig. 9 shows another module for a device according to the invention for
  • FIG. 10 shows schematically a device for air conditioning of electronic assemblies according to a further embodiment of the invention.
  • 1 1 shows schematically a device for air conditioning electronic assemblies according to another embodiment of the invention
  • 12 shows schematically a device for air conditioning electronic assemblies according to a further embodiment of the invention
  • FIG. 14 shows schematically a device for air conditioning of electronic assemblies according to a further embodiment of the invention.
  • identical or functionally identical components are provided with the same reference numerals.
  • a housing GE for air conditioning of electronic assemblies, a housing GE is provided, which is provided, for example, closed in the form of a cabinet or open in the form of a control panel.
  • an inlet opening EO and an outlet opening AO can be provided, which are suitable for delivering SSL air from the interior IR of the housing GE to the environment, for example via a fan.
  • several electronic assemblies EB are shown by way of example on a mounting system BS.
  • the fastening system BS is designed in particular as DIN rail system.
  • a plurality of electronic assemblies EB may be arranged as a first array MA1 along a mounting direction BR.
  • the electronic assemblies EB are formed closed along an outer surface enclosing the attachment direction BR and provided with suitable openings in the attachment direction BR. Accordingly, the electronic assemblies EB of the first multiple arrangement MA1 form by means of their outer surfaces an air channel LK, which points in the direction of the fastening direction BR.
  • a blower device GV is attached to the mounting system BS, which is in communication with the air duct LK, so that the electronic assemblies EB of the first multiple assembly MA1 can be flowed around with an air flow. Accordingly, an air conditioning of the electronic assemblies EB in the first multiple arrangement MA1 via the fan device GV via the air flow LU, the electronic components groups is generated immediately adjacent by the blower device GV. Air conditioning of the entire interior IR of the housing GE, as is done in the prior art, this is no longer required or claimed less energy. Since the air conditioning takes place directly on heat sources or heat sinks of the electronic assemblies EB, a much more efficient approach is possible.
  • the embodiment shown in the middle part of FIG. 1 comprises a first multiple arrangement MA1 'and a second multiple arrangement MA2', which are arranged directly adjacent to adjacent attachment systems BS.
  • a circumferential air duct LK is formed, wherein adjacent multiple arrangements MA1 'and MA2' by means of an air duct LS, which is arranged respectively at the beginning or end of the respective array MA1 'and MA2', is deflected.
  • a circulating air flow LU is created which ensures both the air conditioning of the electronic assemblies EB of the first multiple arrangement MA1 'and the electronic assemblies EB of the second multiple arrangement MA2'.
  • an air duct LS is arranged at the right end of the fastening systems BS, which directs the air flow LU from the first multiple arrangement MA1 'to the second multiple arrangement MA2'.
  • a deflecting flap UK At the end of the air flow LU to the second multiple arrangement MA2 'is mounted a deflecting flap UK, so that depending on the position of the flap UK the air flow LU either as a circulating air flow back to the first multiple array MA' is passed or leaves the air duct LK.
  • the air duct LK was designed as an open air duct, so that the Blower device GV directs air from the environment via a corresponding inlet in the air duct LK.
  • FIG. 1 show some basic configurations of the device according to the invention. Consequently, open air ducts, circulating air ducts or controllable circulating / open air ducts can be formed.
  • the modules required for constructing a device according to the invention are described below schematically with reference to FIGS. 2 to 8.
  • FIGS. 2A and 2B show the blower device GV in a perspective side view.
  • the blower device GV may be provided as an axial fan as shown in FIGS. 2A and 2B, but it is also possible to form the blower device GV by a correspondingly designed radial fan.
  • the blower device GV On the side facing the fastening system BS, the blower device GV has two DIN rail holders HH, which are either fixedly mounted as shown in FIG. 2B or removable as shown in FIG. 2A.
  • the blower device GV can still be provided with additional features such. B. with an alarm message that could indicate a defective or stiff fan. It is also possible to equip the blower device GV with a speed control.
  • FIG. 4A shows a temperature measuring module TM according to a first embodiment.
  • the temperature measuring module TM can be designed as a bi-metal thermostat, which in turn is designed on its rear side with corresponding Hutschalterhaltern HH. If the temperature measuring module TM is not mounted inside the air duct LK, it can also be used to measure the temperature in the interior IR of the housing GE.
  • the temperature measuring module TM may also include a corresponding control electronics or be connected to such.
  • FIG. 4B shows a second embodiment of the temperature measuring module TM.
  • a measurement of the temperature by means of a temperature sensor TS, which is arranged for example centrally in the air duct LK.
  • an air conditioner can be provided.
  • a corresponding example is shown in FIG. 5.
  • the air conditioning element for heating KH can in turn be connected via DIN rail holder HH to the fastening system BS and can heat the air flow LU within the air duct LK.
  • Another air conditioning element according to FIG. 6A is the air conditioning element for cooling KKA.
  • the Peltier cooling unit PK is mounted on the side wall of the housing GE so that the hot heat sink PKH of the Peltier cooler is located outside the housing.
  • the cold heat sink of the Peltier cooler PKK is located inside the housing GE.
  • the cold heat sink is traversed in the mounting direction BR of the electronic modules with cooling channels, so that the cold air with the help of the blower device GV can be transferred into the open air duct LK.
  • the cold heat sink is perpendicular to this mounting direction BR with holes throughout and pierced on all sides, so that the supply air LZ can be removed from the housing GE.
  • the cold heat sink is dimensioned such that a flush connection to, for example, an air filter Fl or a blower device GV can take place in the fastening direction BR.
  • FIG. 6B Another embodiment according to FIG. 6B is the air conditioning element for cooling KKB for a circumferential flow direction of the air duct LK.
  • the embodiment corresponds to that of the embodiment Fig. 6A.
  • the cold heat sink PKK is sealed parallel to the mounting direction BR on three surfaces, so that only one supply air opening, coming from below or coming from above, can be performed as a shaft.
  • the air duct LS can be integrated into the circulating air duct LK.
  • FIG. 7A an embodiment of the air duct LS is shown.
  • the air shaft LS can in turn be connected to the mounting system BS via DIN rail holders HH.
  • DIN rail holders HH To bridge adjacent multiple arrangements of the duct is made adjustable in length, which can be done in particular by means of telescopically movable outer shells AH in a simple manner. Accordingly, a telescopic displacement, so that different distances between adjacent multiple arrangements can be bridged.
  • FIG. 7B shows an empty module LE with which, for example, missing electronic assemblies EB can be bridged within a multiple arrangement MA.
  • This too similar to the module of the air shaft LS described in connection with FIG. 7A, can be made adjustable in length, in which case the adjustability takes place in the fastening direction BR.
  • FIG. 8 shows a further embodiment of the air shaft LS, which comprises the reversing flap UK already described in connection with FIG.
  • the air shaft LS is shown in Fig. 8 in a partially broken view, so that the interior of the air shaft LS is visible.
  • the air shaft LS has a side wall to a first opening OE1, which serves as a horizontal air inlet.
  • a vertical air outlet in the form of second openings OE2 is provided, so that when the deflecting flap UK is in the form of an open air channel, the air flow LU can escape through the second openings OE2.
  • the blower device GV would introduce air from the interior IR of the housing GE into the air channel LK via the first openings OE1.
  • an electronic assembly EB is shown schematically, which is connectable to the mounting system BS via corresponding DIN rail holder HH.
  • the electronic assembly EB has outer surfaces AU, so that there is a generally extending in the horizontal direction air duct.
  • passage openings DU are provided on the two side walls, so that the air flow can pass through the electronic assembly EB.
  • the through-holes can be designed as a grid DUA, as a removable and reusable lid DUB or as a pre-punched hole DUC, which can be broken if necessary.
  • On the fastening system BS side facing DIN rail HH are attached.
  • Fig. 10 shows another embodiment of the invention.
  • the air filter F1, the blower device GV and three electronic assemblies EB and a temperature measuring module TM are arranged one behind the other on the top rail of the fastening system BS, the electronic assemblies EB forming the first multiple arrangement MA1.
  • an open air duct LK is formed, so that an air flow LU, as indicated in FIG. 10 by means of the arrow, flows through the electronic assemblies EB.
  • air is in turn drawn in via the blower device GV from the interior IR of the housing GE via the air filter F1 and brought into the air duct LK.
  • This is formed in this example by a plurality of electronic assemblies, which are arranged one above the other as the first multiple array MA1 'and second multiple array MA2'. Between the first multiple arrangement MA1 'and the second multiple arrangement MA2', the air shaft LS is arranged, which bridges the two multiple arrangements MA1 'and MA2'.
  • a second blower device GV can be provided, which can also be used for a certain redundancy in particularly sensitive electronic assemblies EB.
  • the second blower device GV does not blow the air flow into the interior IR of the housing GE but supplies it to the outlet opening AO of the housing GE, which is achieved via a suitable outlet shaft AS as a hollow connecting element.
  • the example shown in Fig. 1 1 comprises electronic assemblies EB, which are arranged in three rows of the fastening system BS.
  • the different multiple arrangements MA1 to MA3 are in turn connected by means of air ducts LS.
  • the locations of the fastening system BS remaining free in the third multiple arrangement MA3 are bridged by means of an empty module LE.
  • temperature measuring modules TM are respectively arranged, which may also be provided with an electronic control system to perform a temperature control or monitoring.
  • Fig. 12 two embodiments are shown, which have a circumferential air passage LK, wherein in both air ducts each air conditioning element heating KH is provided which provides the heating.
  • the deflecting flap UK is additionally provided on the lower rail of the fastening system BS, which, depending on the position, permits switching between open and closed operation.
  • FIG. 13 two embodiments are shown having an open air duct LK and a closed air duct, wherein in the upper air duct an air conditioner KKA and in the lower circumferential air duct, an air conditioner KKB is installed, which cools the air duct LK.
  • the deflecting flap UK is additionally provided on the lower rail of the fastening system BS, which, depending on the position, permits switching between open and closed operation.
  • FIG. 14 the special case of a device with three multiple arrangements is shown. Blower devices are respectively mounted on the upper two rails of the fastening system BS, the first multiple arrangement MA1 and the second multiple arrangement MA2 being connected to the third multiple arrangement MA3 via corresponding air shafts LS.
  • the third Multiple arrangement has at its end a deflecting flap UK, so that it can be changed between open and closed operation.
  • the air flow LU When the operation is closed, the air flow LU would reach the third multiple arrangement along the first multiple arrangement and the second multiple arrangement and be led back there via the air shaft LS arranged on the right side to the blower devices GV.
  • the airflow would exit the third manifold, with the two blower devices GV drawing air through the air filter F1.
  • both a cooling KKB and, in addition, a heater KH may be provided in order to be able to operate the electronics in a very wide temperature range. It is also possible, for example, to arrange parts of the climate element KE outside the housing GE. An extension to several modules or multiple rails of the mounting system BS is readily possible.

Abstract

L'invention concerne un dispositif de contrôle de la température de modules électroniques, le dispositif comportant un boîtier dans lequel une pluralité modules électroniques peuvent être disposés en au moins un premier agencement multiple dans un sens de fixation au moyen d'un système de fixation, les modules électroniques étant conçus pour être ouverts dans le sens de fixation et fermés le long d'une surface extérieure entourant le sens de fixation pour former un conduit d'air, et comportant un dispositif de ventilation pouvant être fixé au moyen du système de fixation et communiquant avec le conduit d'air, de sorte qu'un flux d'air peut circuler dans le conduit d'air dans la direction de fixation autour la pluralité de modules électroniques.
PCT/EP2015/057051 2014-04-04 2015-03-31 Dispositif de contrôle de la température de modules électroniques WO2015150397A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014104857.1 2014-04-04
DE102014104857.1A DE102014104857A1 (de) 2014-04-04 2014-04-04 Vorrichtung zur Klimatisierung elektronischer Baugruppen

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WO2015150397A1 true WO2015150397A1 (fr) 2015-10-08

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CN113328365A (zh) * 2021-06-18 2021-08-31 田徐泳 一种配电柜

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