WO2015149364A1

WO2015149364A1 - Printed circuit board

Info

Publication number: WO2015149364A1
Application number: PCT/CN2014/074827
Authority: WO
Inventors: 史利利
Original assignee: 史利利
Priority date: 2014-04-04
Filing date: 2014-04-04
Publication date: 2015-10-08
Also published as: CN203840635U

Abstract

A printed circuit board comprising: a buried layer (1), an insulating layer (2) provided at both sides of the buried layer (1), and a metal layer (3) provided at a side of the insulating layer (2) opposite the buried layer (1). Both sides of the buried layer (1) are symmetrically provided with at least one groove (11) used for accommodating an electronic component (4). As such, the symmetric grooves (11) for accommodating the electronic component (4) are provided on both sides of the buried layer (1) to form a symmetric structure, which allows stress to be applied evenly to both sides of a circuit board while being pressed, thus preventing bending of the circuit board and damages to the electronic component.

Description

Description book printed circuit board technical field

[0001] The present application relates to the field of circuits, and in particular, to a printed circuit board.

Background technique

[0002] With the development of the information society, the amount of information processing of various electronic devices is increasing day by day, and the demand for high-frequency, high-speed signal transmission is also increasing. By embedding the semiconductor electronic components in the package substrate, the connection distance between the electronic components and the package substrate can be effectively shortened, which provides a strong guarantee for high-frequency and high-speed signal transmission, and can also meet the development requirements of high integration of the package and miniaturization of electronic products.

1 shows a conventional printed wiring board including an outer metal layer 101 and an insulating layer 102, and an inner buried layer 103. The buried layer 103 is provided with a slit 104, and an electron Element 105 is embedded in slot 104. Since the electronic component is generally located on the side of the buried layer, during the pressing process, due to uneven force on both sides of the panel, the wiring board is easily warped, and even the embedded electronic components are damaged.

Summary of the invention

The present application aims to solve at least one of the above technical problems at least to some extent.

[0005] The present application provides a printed wiring board, including: a buried layer, an insulating layer disposed on two sides of the buried layer, and a metal layer disposed on a side of the insulating layer opposite to the buried layer The two sides of the buried layer are symmetrically disposed with at least one slot for accommodating electronic components.

Further, an outer layer circuit is formed on the metal layer.

[0007] Further, an inner layer circuit is disposed on a surface of the buried layer opposite to the insulating layer, and the inner layer circuit and the outer layer circuit are electrically connected by a metallized blind hole.

[0008] The beneficial effects of the application are:

Providing a printed wiring board comprising: a buried layer, an insulating layer disposed on both sides of the buried layer, and a metal layer disposed on a side of the insulating layer opposite to the buried layer, the buried The two sides of the entry layer are symmetrically disposed with at least one slot for receiving the electronic component. In this way, symmetric slots are formed on both sides of the buried layer to accommodate electronic components. Such a symmetrical structure makes the plates uniformly stressed on both sides during the pressing process, thereby avoiding warpage of the circuit board and electronic components. damage.

DRAWINGS

1 is a cross-sectional view of a prior art printed wiring board.

2 is a cross-sectional view of a printed wiring board according to an embodiment of the present application.

detailed description Description

The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative, and are not to be construed as limiting.

[0012] In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "previous" "," "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. Orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present application and simplified description, and does not indicate or imply that the device or component referred to has a specific orientation, is constructed in a specific orientation, and Operation is therefore not to be construed as limiting the application.

In addition, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first", "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless specifically defined otherwise.

[0014] In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be, for example, a fixed connection or a Removable connection, or integral connection; can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, which can be the internal communication between the two components. For those skilled in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.

[0015] In the present application, the first feature is "on" or "on" the second feature, unless otherwise explicitly stated and defined.

"Bottom" may include direct contact of the first and second features, and may also include that the first and second features are not in direct contact but are contacted by additional features therebetween. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is less than the second feature.

[0016] The present application will be further described in detail below with reference to the accompanying drawings.

[0017] Please refer to FIG. 2, the embodiment provides a printed circuit board, including: a buried layer 1, an insulating layer 2 disposed on two sides of the buried layer 1, and a buried layer disposed on the insulating layer 2 The metal layer 3 on the opposite side of the layer 1 is introduced. The two sides of the buried layer 1 are symmetrically provided with at least one slot 11 for accommodating the electronic component 4. The insulating layer 2 may be a prepreg. Further, an outer layer circuit is formed on the metal layer 3.

[0018] In another embodiment, the side of the buried layer 1 opposite the insulating layer 2 is provided with an inner layer circuit, and the inner layer circuit and the outer layer circuit are electrically connected by a metallized blind via. Instruction manual

[0019] In this way, symmetric slots are formed on both sides of the buried layer of the printed circuit board to accommodate the electronic components. Such a symmetrical structure makes the plates have uniform forces on both sides during the pressing process, thereby avoiding the circuit board. Warpage and damage to electronic components.

[0020] In the description of the present specification, the terms "one embodiment", "some embodiments", "one embodiment", "some embodiments", "example", "specific examples", or "some examples" are referred to. The descriptions of the equivalents, such as the specific features, structures, materials or features described in connection with the embodiments or examples, are included in at least one embodiment or example of the present application. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

[0021] The above is a further detailed description of the present application in conjunction with the specific embodiments, and the specific implementation of the present application is not limited to the description. For those skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit of the present application.

Claims

Claim

A printed wiring board comprising: a buried layer, an insulating layer disposed on both sides of the buried layer, and a metal layer disposed on a side of the insulating layer opposite to the buried layer, wherein The two sides of the buried layer are symmetrically disposed with at least one slot for accommodating electronic components.

2. The printed wiring board according to claim 1, wherein an outer layer circuit is formed on the metal layer.

3. The printed wiring board according to claim 1, wherein an inner layer circuit is disposed on a side of the buried layer opposite to the insulating layer, and between the inner layer circuit and the outer layer circuit Electrical connection through metallized blind holes.