WO2015149366A1

WO2015149366A1 - Printed circuit board

Info

Publication number: WO2015149366A1
Application number: PCT/CN2014/074839
Authority: WO
Inventors: 魏晓敏
Original assignee: 魏晓敏
Priority date: 2014-04-04
Filing date: 2014-04-04
Publication date: 2015-10-08
Also published as: CN203827601U

Abstract

A printed circuit board comprises a substrate (1). A stepped hole (11) and an auxiliary hole (12) are arranged on the substrate (1). The stepped hole (11) comprises a counterbore part (112) located above a step surface and a through hole part (111) located under the step surface. The auxiliary hole (12) is communicated with the stepped hole (11). The auxiliary hole (12) communicated with the stepped hole (11) is arranged on a side of the stepped hole (11). Thus solder tin can be filled in the auxiliary hole (12) and the stepped hole (11) at the same time, thereby making the solder tin difficult to fall off the substrate (1) and ensuring product quality.

Description

Printed circuit board

[0001] The present application relates to the field of circuits, and in particular, to a printed circuit board.

Background technique

[0002] At present, as shown in FIG. 1 and FIG. 2, a stepped groove or a stepped hole 910 is provided on the substrate 900 of the printed wiring board at a position where soldering is required, and the stepped groove or the stepped hole 910 has a small contact area when soldering. The internal stress is concentrated, and the solder is easily detached from the substrate 900, causing serious quality problems of the product.

Summary of the invention

The present application aims to solve at least one of the above technical problems at least to some extent.

[0004] The present application provides a printed circuit board, including: a substrate, the substrate is provided with a stepped hole and an auxiliary hole, the stepped hole includes a countersunk hole portion located above the stepped surface and located below the stepped surface a through hole portion, the auxiliary hole being in communication with the stepped hole.

[0005] Further, the auxiliary hole is a blind hole.

[0006] Further, the lower end surface of the counterbore portion is provided with a process hole.

[0007] Further, the process hole is a through hole or a blind hole.

[0008] Further, an outer layer circuit is printed on the outer side of the substrate.

[0009] The beneficial effects of the application are:

A step of providing a printed circuit board includes: a substrate having a stepped hole and an auxiliary hole, wherein the stepped hole includes a counterbore portion above the stepped surface and a through hole portion located below the stepped surface The auxiliary hole is in communication with the stepped hole. An auxiliary hole communicating with the stepped hole is provided, so that the solder can be simultaneously filled in the auxiliary hole and the stepped hole, so that the solder is not easily detached from the substrate, and the quality of the product is ensured.

DRAWINGS

1 is a schematic structural view of a printed wiring board according to an embodiment of the present application.

detailed description

The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative, and are not to be construed as limiting.

[0012] In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "previous"","after","left","right","vertical","horizontal","top","bottom" The orientation or positional relationship of "inside", "outside", "clockwise", "counterclockwise" and the like is based on the orientation or positional relationship shown in the drawings, for convenience of description of the present application and simplified description, rather than indication It is to be understood that the device or elements referred to have a particular orientation, are constructed and operated in a particular orientation and are therefore not to be construed as limiting.

In addition, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first", "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless specifically defined otherwise.

[0014] In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be, for example, a fixed connection or a Removable connection, or integral connection; can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, which can be the internal communication between the two components. For those skilled in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.

[0015] In the present application, the first feature is "on" or "on" the second feature, unless otherwise explicitly stated and defined.

"Bottom" may include direct contact of the first and second features, and may also include that the first and second features are not in direct contact but are contacted by additional features therebetween. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is less than the second feature.

[0016] The present application will be further described in detail below with reference to the accompanying drawings.

[0017] Please refer to FIG. 1. The embodiment provides a printed circuit board, including: a substrate 1, and a stepped hole 11 and an auxiliary hole 12 are formed on the substrate 1. The stepped hole 12 includes a counterbore portion 121 above the stepped surface and a through hole portion 122 located below the stepped surface. The auxiliary hole 12 is in communication with the stepped hole 11. The auxiliary hole 12 is a blind hole.

[0018] Thus, in the soldering, the solder can be simultaneously filled in the auxiliary hole and the stepped hole, so that the solder is not easily detached from the substrate, and the quality of the product is ensured.

[0019] In addition, the lower end surface of the countersunk hole portion may further be provided with a process hole. The process holes are through holes or blind holes. Therefore, the solder is further filled in the process hole, so that the solder is not easily detached from the substrate, thereby further ensuring the quality of the product.

[0020] Typically, an outer layer circuit is also printed on the outside of the substrate.

[0021] In the description of the present specification, the terms "one embodiment", "some embodiments", "one embodiment", "some embodiments", "example", "specific examples", or "some examples" are referred to. The descriptions of the equivalents, such as the specific features, structures, materials or features described in connection with the embodiments or examples, are included in at least one embodiment or example of the present application. In this In the specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

[0022] The above is a further detailed description of the present application in connection with the specific embodiments, and the specific implementation of the present application is not limited to the description. For those skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit of the present application.

Claims

Claim

A printed circuit board, comprising: a substrate, wherein the substrate is provided with a stepped hole and an auxiliary hole, wherein the stepped hole comprises a countersunk hole portion located above the stepped surface and located below the stepped surface a through hole portion, the auxiliary hole being in communication with the stepped hole.

2. The printed wiring board according to claim 1, wherein the auxiliary hole is a blind hole.

3. The printed wiring board according to claim 1, wherein the lower end surface of the counterbore portion is provided with a process hole.

4. The printed wiring board according to claim 3, wherein the process hole is a through hole or a blind hole.

The printed wiring board according to any one of claims 1 to 4, characterized in that the outer side of the substrate is printed with an outer layer.