WO2015139190A1 - Cadre de del et éclairage à del - Google Patents

Cadre de del et éclairage à del Download PDF

Info

Publication number
WO2015139190A1
WO2015139190A1 PCT/CN2014/073565 CN2014073565W WO2015139190A1 WO 2015139190 A1 WO2015139190 A1 WO 2015139190A1 CN 2014073565 W CN2014073565 W CN 2014073565W WO 2015139190 A1 WO2015139190 A1 WO 2015139190A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
metal substrate
grooves
chip
plating layer
Prior art date
Application number
PCT/CN2014/073565
Other languages
English (en)
Chinese (zh)
Inventor
游志
Original Assignee
深圳市瑞丰光电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市瑞丰光电子股份有限公司 filed Critical 深圳市瑞丰光电子股份有限公司
Priority to PCT/CN2014/073565 priority Critical patent/WO2015139190A1/fr
Publication of WO2015139190A1 publication Critical patent/WO2015139190A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the utility model relates to the technical field of LED illumination, in particular to an LED bracket and an LED lighting component.
  • LED is one of the widely used light sources.
  • the dam is usually made around the chip to facilitate the coating of fluorescent glue or encapsulant, or to block the absorption of light by the sidewall of the chip.
  • the existing dam manufacturing method is to make a dam on the substrate before packaging, and then install the chips one by one in the middle of the dam. This method is complicated, the efficiency is low, the cost is increased, and the dam is independent. On the substrate, long-term use has a hidden danger, which affects the reliability of the LED.
  • the purpose of the utility model is to provide a novel LED bracket, which aims to simplify the process, improve the production efficiency and improve the reliability.
  • an LED bracket comprises a metal substrate, wherein the metal substrate is provided with a plurality of grooves for mounting LED chips, the grooves having two sets of opposite sides, each set of opposite sides
  • the opening angle is less than 60°
  • the depth of the groove is 1/3 to 3 times the thickness of the LED chip.
  • the LED holder further includes a plastic reflective cup surrounding the periphery of the groove, and the groove is provided with a plastic reflective layer adjacent to a pair of opposite sides of the plastic reflective cup, the plastic layer and the plastic layer
  • the plastic reflective cup is integrally formed. This design not only precisely controls the shape and size of the sinker cup, but also does not destroy the optical structure of the reflector cup due to the sinker design.
  • the surface of the metal substrate is provided with a laminated structure of one or more of a gold plating layer, a silver plating layer, a copper plating layer, a nickel plating layer, and a palladium plating layer.
  • Another object of the present invention is to provide an LED lighting device, comprising the LED bracket, wherein the LED bracket is provided with an LED chip.
  • a fluorescent glue is disposed outside the LED chip and the recess.
  • a transparent encapsulant is disposed on the outside of the LED chip and the recess.
  • the LED bracket provided by the utility model directly forms a groove on the metal substrate to prevent the side of the chip from absorbing light, and does not need to additionally set a dam on the metal substrate, thereby saving the process and improving the production efficiency; and, because the groove is integrated with the metal substrate Forming, there is no possibility of deformation, peeling, etc., thus ensuring The reliability of the LED improves the quality of the LED; the depth of the groove is designed to be 1/3 to 3 times the thickness of the LED chip, and the opening angle of the opposite surface is limited to 60°, and the front surface of the chip can be ensured at the same time. Avoid side light absorption and improve the light output efficiency of the LED.
  • FIG. 1 is a front elevational view of an LED bracket provided by an embodiment of the present invention.
  • Figure 2 is a cross-sectional view taken along the line A-A of the LED holder shown in Figure 1;
  • Figure 3 is a cross-sectional view taken along the line B-B of the LED holder shown in Figure 1.
  • an LED bracket provided by an embodiment of the present invention includes a metal substrate 1 , which is fabricated by chemical etching, stamping, forging, machining, and the like to form a plurality of LED chips 5 .
  • the number of the grooves 2 and the arrangement of the grooves 2 are naturally the same as the number and arrangement of the preset LED chips 5.
  • the size of the grooves 2 is slightly larger than the size of the LED chips 5, and the depth is the thickness of the LED chips 5. 1/3 to 3 times, and preferably 1 to 2 times.
  • the groove 2 is generally quadrangular in shape, having two opposite sides, namely two opposite first sides 21 and two opposite second sides 22, two first sides 21 and two second sides 22 The opening angles ⁇ and ⁇ are both less than 60°.
  • the surface of the metal substrate 1 may be provided with a laminated structure of one or more of a gold plating layer, a silver plating layer, a copper plating layer, a nickel plating layer, and a palladium plating layer for electrically connecting the LED chip 5 to the power supply line.
  • the side of the LED chip 5 has light absorbing capability, and the light emitted by the chip itself and the light emitted by other chips are irradiated to the side thereof to be absorbed in a large amount, resulting in light loss, and the depth of the groove 2 is designed to be 1/3 of the thickness of the LED chip 5. ⁇ 3 times, while the opening angle of the opposite surface is limited to 60 °, so that the light can not be irradiated to the side of the LED chip 5, to avoid side light absorption. The definition of the opening angle is necessary. If the opening angle is too large, the light cannot be blocked from illuminating the side of the chip.
  • the depth of the groove 2 is designed to be 1/3 to 3 times the thickness of the LED chip 5, and it is a preferred solution to limit the opening angle of the opposite surface to 60°, which can simultaneously ensure the front side of the chip and avoid side light absorption.
  • the fluorescent glue or the transparent glue covers the LED chip 5 and the groove 2, and when the size of the groove 2 is large, the fluorescent glue or the transparent glue fills the groove 2, and To some extent, the coating of fluorescent glue or transparent glue is facilitated. When the size of the groove 2 is small, the fluorescent glue or the transparent glue does not fill the inside of the groove 2, and neither of them will affect the LED light.
  • the LED bracket directly forms the groove 2 on the metal substrate 1 to prevent the side of the chip from absorbing light, and does not need to additionally set a dam on the metal substrate 1, thereby saving the process and improving the production efficiency; and, due to the groove 2 and the metal substrate 1 One-piece molding, there is no possibility of deformation, peeling, etc., thereby ensuring the reliability of the LED and improving the quality of the LED.
  • the LED bracket further includes a plastic reflective cup 3 surrounding the periphery of the recess 2, and the material thereof may be a thermosetting or thermoplastic highly reflective plastic material such as PPA, PCT, epoxy resin or silica gel.
  • the shape of the plastic reflector cup 3 may be a rectangle whose short side is slightly larger than the width of the side surface of the groove 2.
  • the pair of opposite first side faces 21 of the groove 2 adjacent to the plastic reflector cup 3 are provided with a plastic reflective layer 4, and the plastic reflection is The layer 4 is integrally formed with the plastic reflector cup 3.
  • a series of plastic reflector cups 3 are formed on the metal substrate 1 to form a plastic reflective layer 4 directly on the side of the recess 2 adjacent to the plastic reflector cup 3.
  • the plastic reflective layer 4 on the side of each groove 2 is integrated with the plastic reflective cup 3, further enhancing the bonding of the plastic reflective cup 3 and the metal substrate 1, enhancing the reliability of the LED and facilitating the reflection of light.
  • the utility model also provides an LED lighting component, comprising the above LED bracket, and an LED chip 5 disposed in the recess 2 of the LED bracket.
  • a fluorescent glue or a transparent encapsulant is disposed on the outside of the LED chip 5 and the recess 2 to form an optical lens.
  • the light-emitting lens can be formed in the plastic reflector cup 3. Of course, it is also possible to form a light lens on the LED chip 5 and the groove 2 without providing a reflector cup.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un cadre de DEL comprenant un substrat métallique (1). Le substrat métallique (1) est pourvu de multiples rainures (2) utilisées pour monter une puce de DEL (5). Les rainures (2) comprennent deux ensembles de côtés opposés (21 et 22). Les angles d'ouverture de chaque ensemble de côtés opposés (21 et 22) sont inférieurs à 60°. La profondeur des rainures (2) représente de 1/3 à 3 fois l'épaisseur de la puce de DEL (5). Les rainures (2) du cadre de DEL sont fabriquées directement sur le substrat métallique (1) pour empêcher l'absorption de lumière par les côtés de la puce (5) et, grâce au cadre de DEL, il n'est pas nécessaire de prévoir en plus un remblai d'encerclement sur le substrat métallique (1), ce qui permet de réduire le nombre de processus, et d'accroître la productivité. Les rainures (2) et le substrat métallique (1) sont formés d'un seul tenant et ne présentent pas de possibilités de déformation et d'écaillage, ce qui permet d'assurer la fiabilité d'une DEL et d'augmenter la qualité de la DEL. Du fait que profondeur des rainures (2) est conçue de manière à représenter de 1/3 à 3 fois l'épaisseur de la puce de DEL (5), et qu'en même temps, les angles d'ouverture des côtés opposés (21 et 22) sont limités à 60° ou moins, il est possible de garantir simultanément l'émission de lumière par le côté avant de la puce (5) et la prévention de l'absorption de lumière par les côtés, ce qui permet d'augmenter l'efficacité d'émission de lumière de la DEL.
PCT/CN2014/073565 2014-03-18 2014-03-18 Cadre de del et éclairage à del WO2015139190A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/073565 WO2015139190A1 (fr) 2014-03-18 2014-03-18 Cadre de del et éclairage à del

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/073565 WO2015139190A1 (fr) 2014-03-18 2014-03-18 Cadre de del et éclairage à del

Publications (1)

Publication Number Publication Date
WO2015139190A1 true WO2015139190A1 (fr) 2015-09-24

Family

ID=54143623

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/073565 WO2015139190A1 (fr) 2014-03-18 2014-03-18 Cadre de del et éclairage à del

Country Status (1)

Country Link
WO (1) WO2015139190A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109065696A (zh) * 2018-10-29 2018-12-21 博罗县正润光电有限公司 一种led新型支架
CN113359248A (zh) * 2021-06-02 2021-09-07 青岛海信宽带多媒体技术有限公司 一种光模块

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201237155Y (zh) * 2008-07-25 2009-05-13 弘凯光电(深圳)有限公司 发光二极管
CN101939852A (zh) * 2007-12-24 2011-01-05 三星Led株式会社 发光二极管封装件
CN202474016U (zh) * 2011-12-20 2012-10-03 中山市世耀光电科技有限公司 一种led 光源的封装结构
WO2012169717A1 (fr) * 2011-06-08 2012-12-13 Seoul Semiconductor Co., Ltd. Ensemble de diodes électroluminescentes
CN202796945U (zh) * 2012-09-07 2013-03-13 绍兴温家环保新材料有限公司 一种led及灯具
CN103066183A (zh) * 2011-09-14 2013-04-24 夏普株式会社 发光装置
CN103633079A (zh) * 2012-08-23 2014-03-12 Lg伊诺特有限公司 发光器件
CN103872219A (zh) * 2014-03-18 2014-06-18 深圳市瑞丰光电子股份有限公司 一种led封装支架及led发光体
CN203733840U (zh) * 2014-03-18 2014-07-23 深圳市瑞丰光电子股份有限公司 一种led支架及led发光件
CN203787455U (zh) * 2014-03-18 2014-08-20 深圳市瑞丰光电子股份有限公司 一种led封装支架及led发光体

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101939852A (zh) * 2007-12-24 2011-01-05 三星Led株式会社 发光二极管封装件
CN201237155Y (zh) * 2008-07-25 2009-05-13 弘凯光电(深圳)有限公司 发光二极管
WO2012169717A1 (fr) * 2011-06-08 2012-12-13 Seoul Semiconductor Co., Ltd. Ensemble de diodes électroluminescentes
CN103066183A (zh) * 2011-09-14 2013-04-24 夏普株式会社 发光装置
CN202474016U (zh) * 2011-12-20 2012-10-03 中山市世耀光电科技有限公司 一种led 光源的封装结构
CN103633079A (zh) * 2012-08-23 2014-03-12 Lg伊诺特有限公司 发光器件
CN202796945U (zh) * 2012-09-07 2013-03-13 绍兴温家环保新材料有限公司 一种led及灯具
CN103872219A (zh) * 2014-03-18 2014-06-18 深圳市瑞丰光电子股份有限公司 一种led封装支架及led发光体
CN203733840U (zh) * 2014-03-18 2014-07-23 深圳市瑞丰光电子股份有限公司 一种led支架及led发光件
CN203787455U (zh) * 2014-03-18 2014-08-20 深圳市瑞丰光电子股份有限公司 一种led封装支架及led发光体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109065696A (zh) * 2018-10-29 2018-12-21 博罗县正润光电有限公司 一种led新型支架
CN113359248A (zh) * 2021-06-02 2021-09-07 青岛海信宽带多媒体技术有限公司 一种光模块

Similar Documents

Publication Publication Date Title
US20190097091A1 (en) Display device and led emitting light on four sides thereof
WO2012113249A1 (fr) Structure de support d'encapsulation de diode électroluminescente et dispositif à diodes électroluminescentes
TW201117434A (en) A light emitting diode package
CN102709454A (zh) 一种表面粗化的双层胶构造led光源及制作方法
WO2015139190A1 (fr) Cadre de del et éclairage à del
CN103872219A (zh) 一种led封装支架及led发光体
CN203787455U (zh) 一种led封装支架及led发光体
WO2015103812A1 (fr) Filament et luminaire à del
TWI714481B (zh) 立體燈杯式的發光二極體支架
CN203250781U (zh) 一种led封装结构
US9568164B2 (en) Light-emitting device with air ring
CN104515064A (zh) 一种透镜和包括该透镜的照明装置
CN204596838U (zh) 一种led封装结构
CN203733835U (zh) Led灯丝及发光装置
CN203733840U (zh) 一种led支架及led发光件
CN203395710U (zh) 发光二极管日光灯
WO2015127698A1 (fr) Filament de del et dispositif d'éclairage
WO2015139194A1 (fr) Cadre à del et source de lumière à del
JP3186293U (ja) Ｌｅｄモジュール及び照明装置
CN202111091U (zh) Led集成封装结构
CN103855145B (zh) 一种led灯丝及照明器具
WO2015139191A1 (fr) Structure de mise sous boitier de del et source de lumière à del
CN203491259U (zh) Led芯片集成封装的大功率白光器件
TW200620694A (en) Process and structure for packaging LED's
CN202674896U (zh) 内置凸透镜的白光led光源模块

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14885875

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205 DATED 24.11.2016)

122 Ep: pct application non-entry in european phase

Ref document number: 14885875

Country of ref document: EP

Kind code of ref document: A1