WO2015135230A1 - 蚀刻液浓度测量装置及方法 - Google Patents
蚀刻液浓度测量装置及方法 Download PDFInfo
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- WO2015135230A1 WO2015135230A1 PCT/CN2014/074265 CN2014074265W WO2015135230A1 WO 2015135230 A1 WO2015135230 A1 WO 2015135230A1 CN 2014074265 W CN2014074265 W CN 2014074265W WO 2015135230 A1 WO2015135230 A1 WO 2015135230A1
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
Definitions
- the invention relates to the field of etching liquid technology, and more particularly to an etching liquid concentration measuring device and method.
- wet etching is to pattern the metal film layer with an acid etching solution in the TFT manufacturing process to form a gate, a source and a drain ( Source-Drain ), pixels (Indium Tin Oxides, ITO).
- an acid etching solution in the TFT manufacturing process to form a gate, a source and a drain ( Source-Drain ), pixels (Indium Tin Oxides, ITO
- the core process of the electrode aluminum and molybdenum are often used as conductive materials to form the gate electrode, and the etching liquid can use a plurality of different acids, but most of them are dissolved and redoxed by a strong acid mixture (phosphoric acid, nitric acid and glacial acetic acid). Patterning of the gate film layer.
- the composition of the etchant mixed acid is generally phosphoric acid (70 ⁇ 72%), nitric acid (1.8 ⁇ 2.0%), acetic acid (9.5 ⁇ 10.5%), wherein nitric acid plays the role of providing H 3 O + and is etched with oxidized metal aluminum molybdenum.
- Phosphoric acid provides a phosphate and forms a complex with the oxidized metal to dissolve the metal oxide; acetic acid can adhere to the surface of the reactant, reduce the viscosity of the etchant, increase its wettability, and adjust the etch rate.
- nitric acid and acetic acid are continuously consumed, resulting in a gradual decrease in the acid concentration, which affects the etching quality.
- the existing online monitoring device based on Lambert - Beer's Law's online optical concentration measurement mechanism monitors the concentration of each acid in the etchant during the etching process.
- the measuring principle is that the light source 210 emits light of multiple wavelengths through the monochromator 220 After the specific wavelength of light is generated, the detector 250 detects the sample cell 230 and the reference cell 240 after passing through the parallel reference cells 240 and the sample cell 230 containing the mixed acid. The difference in absorbance, and finally using Lambert-Beer's law to calculate the concentration of each acid in the sample cell.
- the in-line optical concentration measuring mechanism is a sealed container, the in-line optical concentration measuring mechanism is always in a negative pressure state and is transported to the sample cell through an external pipe, compared with the external pipe.
- the mixed acid in the acid supply line and the sample cell 230 There is inevitably a small amount of volatilization on the contact surface, especially the low boiling point acetic acid volatilization is more serious.
- a kind of lingering acid mist will form in the negative pressure closed system of the online optical concentration measuring mechanism, and the acid mist will be in the sample pool.
- 230 or reference pool 240 The surface affects the absorption of light, which in turn affects the measured value of the acid concentration.
- the measured acid concentration will be lower or higher than the actual, causing too much or insufficient acid in the acid supplement system, and finally the concentration of acid in the etching solution is too large or too small, resulting in large batch defects and rework of etching. Repair, causing significant losses to production.
- it is necessary to periodically disassemble the online optical concentration measuring mechanism or wipe the measuring cell, which not only destroys the precision of the measuring mechanism, but also reinstalls the online optical concentration measuring mechanism. To be recalibrated before it can be put into use, it will cause a lot of inconvenience to actual production.
- the technical problem to be solved by the present invention is to provide an etching liquid concentration measuring device and method for etching defects in the prior art online optical measuring mechanism to form an acid mist inside, thereby causing interference to the mixed acid concentration measurement.
- the acid concentration in the etching solution is measured quickly, economically and accurately.
- the technical solution adopted by the present invention to solve the technical problem thereof is: constructing an etching liquid concentration measuring device, comprising a concentration measuring mechanism and an acid mist removing mechanism connected to the concentration measuring mechanism, An acid mist removing mechanism for removing acid mist inside the concentration measuring mechanism, wherein the concentration measuring mechanism is configured to receive the etching liquid in real time and The absorbance of each acid in the mixed acid of the etching solution is measured in an acid-free environment, and the concentration of each acid in the mixed acid of the etching solution is calculated according to the absorbance.
- a supply tank containing the etching liquid connected to the concentration measuring mechanism for supplying an etching liquid to the concentration measuring mechanism in real time is further included.
- the acid mist eliminating mechanism has a drying gas, and the acid mist eliminating mechanism and the concentration measuring mechanism A circulation loop is formed between the dry gas in the acid mist eliminating mechanism, and after the acid mist in the concentration measuring mechanism is taken out and the taken acid mist is dried, the treated dry gas is circulated again. to Within the concentration measuring mechanism.
- the acid mist removing mechanism includes:
- an intake line, a concentration measuring mechanism, an outlet line, and a drying tank form the circulation loop, and the drying tank is provided with a desiccant.
- the drying gas contained in the air tank is air or nitrogen.
- the desiccant is a mixture of calcium oxide and sodium hydroxide.
- a unidirectional pipeline for communicating the drying tank and the gas tank is further included, and the drying gas after drying of the drying tank is returned to the unidirectional pipeline to Inside the gas storage tank.
- the etching liquid comprises, by weight percentage, 70% to 72% phosphoric acid, 1.8%. ⁇ 2.0% nitric acid, 9.5% to 10.5% acetic acid and the balance of water.
- the intake line is provided with a first valve for regulating the flow rate of the drying gas in the gas tank, and the unidirectional line is provided with the drying for adjusting the drying A second valve for the flow of dry gas within the tank.
- an etchant concentration measuring device including a concentration measuring mechanism a supply tank for supplying an etchant to the concentration measuring mechanism in real time and an acid mist removing mechanism connected to the concentration measuring mechanism, the acid mist removing mechanism comprising:
- a gas storage tank fixedly connected to the intake pipe, wherein the gas storage tank is filled with a dry gas
- the gas storage tank, the gas inlet pipeline, the concentration measuring mechanism, the gas outlet pipeline and the drying tank form a circulation loop, and the drying tank is provided with a desiccant;
- the drying gas enters the concentration measuring mechanism through the intake pipe and takes out the acid mist in the concentration measuring mechanism, and after drying through the drying tank, the processed drying gas is recycled to the Within the concentration measuring mechanism;
- the concentration measuring mechanism is configured to receive the etching solution in real time and The absorbance of each acid in the mixed acid of the etching solution is measured in an acid-free environment, and the concentration of each acid in the mixed acid of the etching solution is calculated according to the absorbance.
- the drying gas contained in the air tank is air or nitrogen.
- the desiccant is a mixture of calcium oxide and sodium hydroxide.
- a unidirectional line for communicating the drying tank and the gas tank is also included, and the drying gas after drying of the drying tank is returned to the gas tank through the one-way line.
- the etching liquid comprises, by weight percentage, 70% to 72% phosphoric acid, 1.8% to 2.0% nitric acid, 9.5% to 10.5% acetic acid and the balance of water.
- the intake line is provided with a first valve for regulating the flow rate of the drying gas in the air tank, and the one-way line is provided with a second valve for adjusting the flow rate of the drying gas in the drying tank.
- the invention also provides a method for measuring the concentration of an etchant,
- the etching liquid in the supply tank flows into the concentration measuring mechanism, and the acid mist removing mechanism is turned on, so that the acid mist inside the concentration measuring mechanism is taken out and the taken acid mist is dried and then circulated to Within the concentration measuring mechanism Bring out acid mist again;
- the concentration measuring mechanism measures the absorbance of each acid in the mixed acid of the etching liquid in an acid mist-free environment, and calculates the concentration of each acid in the mixed acid of the etching liquid according to the absorbance.
- the apparatus and method for measuring an etchant concentration according to the present invention have the following advantageous effects: by providing an acid mist eliminating mechanism in communication with a concentration measuring mechanism, and forming a circulation loop between the acid mist eliminating mechanism and the concentration measuring mechanism, and for eliminating concentration
- the acid mist formed by the evaporation of the etching liquid in the measuring mechanism overcomes the interference of the acid mist on the acid concentration in the mixed acid of the etching liquid, and achieves the rapid and accurate on-line determination of the concentration of various acids in the mixed acid of the etching liquid, and achieves drying.
- the recycling of gas has achieved the goal of saving resources.
- Figure 1 is a block diagram showing the internal structure of the existing concentration measuring mechanism
- FIG. 2 is a block diagram showing the structure of an etchant concentration measuring apparatus according to a preferred embodiment of the present invention.
- an etchant concentration measuring apparatus includes an acid mist removing mechanism 1 and a concentration measuring mechanism 2 And supply tank 3 .
- the supply tank 3 contains an etchant and is used to supply an etchant in real time to the concentration measuring mechanism 2, and the acid mist removing mechanism 1 is connected to the concentration measuring mechanism 2, and Used to eliminate the acid mist inside the concentration measuring mechanism 2 so that the concentration measuring mechanism 2
- the absorbance of each acid in the mixed acid of the etching solution is measured in real time without acid mist, and the concentration of each acid in the mixed acid of the etching liquid is calculated according to the absorbance, so that the concentration measurement is more accurate, thereby accurately controlling and monitoring the acid in the mixed acid of the etching liquid. Concentration, the purpose of improving the quality of the etching.
- the acid mist eliminating mechanism 1 has a dry gas, an acid mist eliminating mechanism 1 and a concentration measuring mechanism 2 A circulation loop is formed between the drying gas in the acid mist eliminating mechanism 1 at the concentration measuring mechanism 2 After the acid mist is taken out, the acid mist that has been taken out is dried, and then the dried gas after the drying process is recycled to the concentration measuring mechanism 2 to bring out the acid mist again, thus repeating the acid mist removing mechanism 1 and Concentration measuring mechanism 2 A loop is formed between them to achieve rational use of resources.
- the supply tank 3 is for holding an etching liquid, and the supply tank 3 passes through a connecting line to enter an etching machine (not shown), which is a TFT
- the manufacturing process provides the necessary etchant.
- the supply tank 3 is bidirectionally connected to the concentration measuring mechanism 2 so that the etching liquid in the supply tank 3 flows to the concentration measuring mechanism 2 Then, the measurement of the acid concentration in the mixed acid of the etching liquid is completed, and then the measured etching liquid flows back into the supply tank 3 through the pipeline to realize the recycling of the etching liquid.
- the etching solution is an aluminum etching solution, and the etching solution comprises 70% to 72% phosphoric acid, 1.8% to 2.0% nitric acid, and 9.5% to 10.5% by weight. Acetic acid and the balance of water.
- the concentration measuring mechanism 2 quantitatively measures the concentration of each acid in the mixed acid of the etching liquid based on Lambert-Beer's law, and the concentration measuring mechanism 2 and the supply tank 3 Online connection for real-time online measurement of the absorbance and concentration of various acids in the etchant mixed acid in supply tank 3.
- the concentration measuring mechanism 2 is a sealed container including a sealed chamber 21 and a light source 24 housed in the sealed chamber 21, a monochromator 25, sample cell 22, reference cell 23 and detector 26 .
- the sealed cavity 21 is compared with other pipes outside the concentration measuring mechanism 2, and the sealed cavity 21 It is always in a negative pressure state so that the etching liquid in the external supply tank 3 flows into the sealed chamber 21.
- the sample cell 22 and the reference cell 23 have the same optical path and are arranged in parallel, the monochromator 25 and the detector 26 Set on both sides of the sample cell 22 and the reference cell 23, the concentration measuring mechanism 2 measures the principle that the light emitted by the light source 24 passes through the monochromator 25 and then passes through the parallel sample cells 22 And the reference cell 23, so that the detector 26 obtains the difference in absorbance between the sample cell 22 and the reference cell 23, and finally calculates the difference in absorbance obtained to obtain the sample cell 22 and the reference cell 23
- the difference in concentration, the working principle of the specific concentration measuring mechanism 2 is the prior art, and will not be described here.
- the sample cell 22 is bidirectionally connected to the supply tank 3 so that the supply tank 3
- the etching liquid flows into the sample cell 22, and the real-time on-line monitoring of the acid concentration in the mixed acid of the etching liquid is completed, and the acid mixture of the etching liquid after the measurement is flowed back to the supply tank through the pipeline. Internally, the recycling of the etching solution is achieved.
- the reference cell 23 contains an aqueous solution, and the sample cell 22 is an etchant, thereby passing the concentration measuring mechanism 2
- the difference in the measured concentration is actually the concentration of each acid in the mixed acid of the etching solution in the sample cell 22, that is, the concentration measuring mechanism 2
- the respective concentrations of nitric acid, phosphoric acid, and acetic acid in the etching solution during the etching were measured. Then, during the etching process, by comparing the measured concentrations of nitric acid, phosphoric acid and acetic acid with the concentration of each acid in the standard etching solution required in the etching process, it is possible to obtain nitric acid or phosphoric acid which needs to be added to the etching solution.
- the reference cell 23 can also be empty, i.e., no solution is contained within the reference cell 23.
- the acid mist elimination mechanism 1 forms a circulation loop with the concentration measuring mechanism 2 and is used to eliminate the concentration measuring mechanism 2
- the acid mist elimination mechanism 1 includes an intake line 11 , an outlet line 12 , a gas storage tank 13 , a drying tank 14 , and a one-way line 15 .
- the intake line 11 and the outlet line 12 are both disposed outside the concentration measuring mechanism 2, and the intake line 11 and the outlet line 12 Both are connected to the concentration measuring mechanism 2.
- the gas storage tank 13 is filled with a dry gas, and the gas storage tank 13 is connected to the intake line 11; one end of the drying tank 14 and the gas outlet line 12 The other end is connected to the gas storage tank 13 through a one-way line 15, that is, the drying tank 14 is disposed between the gas outlet line 12 and the gas storage tank 13.
- the gas storage tank 13 and the intake line 11 , the concentration measuring mechanism 2, the outlet pipe 12, the drying tank 14 and the one-way pipe 15 are sequentially connected, and form a closed circulation circuit; and the drying tank 14
- a desiccant capable of absorbing acid mist and water vapor is contained therein, and specifically the desiccant is a mixture of calcium oxide and sodium hydroxide.
- the drying gas contained in the gas storage tank 13 is air or nitrogen, and preferably the drying gas is inert gas nitrogen.
- the gas tank 13 When the dry gas flows into the sealed chamber 21 through the intake line 11, the internal pressure of the sealed chamber 21 becomes larger and larger as the dry gas is continuously introduced, when the sealed chamber 21 When the internal pressure is equal to or greater than the external pressure, the dry gas in the sealed chamber 21 carries the acid mist in the sealed chamber 21 through the outlet line 12 into the drying tank 14;
- the desiccant is contained therein, and the acidic substance and water vapor flowing out of the sealed chamber 21 are adsorbed and dried by the desiccant in the drying tank 14, so that the drying tank 14 is dried.
- the gas flowing out is only a dry gas (excluding acid mist and water vapor), and the dry gas further flows into the gas storage tank 13 through the one-way pipe 15, and then flows into the concentration measuring mechanism 2 to carry the acid mist.
- the recycling of dry gas is achieved to save resources.
- the drying tank 14 when the drying gas carries the acid mist in the sealed chamber 21 from the outlet line 12 to the drying tank 14, the drying tank 14
- the calcium oxide in the inside absorbs the water vapor in the mixed gas, and the sodium hydroxide absorbs the acidic substance therein, and the gas flowing out of the drying tank 14 has only the dry gas, thereby realizing the rational use of resources; and when the drying tank 14 When the desiccant absorbs moisture and acid to a certain extent, the desiccant will fail, and the desiccant in the drying tank 14 can be replaced at this time.
- the intake line 11 and the outlet line 12 and the concentration measuring mechanism 2 The connection between the two can be a conventional manner, such as welding, riveting, and screwing, and is not limited herein.
- a first valve is provided on the intake line 11 16 , that is, the first valve 16 is used for adjusting the flow rate of the dry gas in the gas storage tank 13, when the acid mist in the concentration measuring mechanism 2 is large, the flow rate of the dry gas can be increased by the first valve correspondingly.
- a second valve 17 for regulating the flow of the dry gas is also provided on the one-way line 15, that is, the second valve 17 is used to regulate the flow of the dried tank 14 into the gas storage tank 13 Dry gas flow inside.
- the etching liquid concentration measuring device of the present invention is provided in contact with the concentration measuring mechanism 2, the acid mist eliminating mechanism 1 and the acid mist eliminating mechanism 1 Form a circulation loop with the concentration measuring mechanism 2 and use it to eliminate the concentration measuring mechanism 2
- the acid mist formed by the evaporation of the etching liquid overcomes the interference of the acid mist on the acid concentration in the mixed acid of the etching liquid, and achieves the purpose of accurately controlling and monitoring the acid concentration in the mixed acid of the etching liquid.
- the concentration measuring mechanism 2, the outlet pipe 12 and the drying tank 14 form the circulation circuit, so that the dry gas in the gas storage tank 13 flows into the concentration measuring mechanism through the intake pipe 11
- the acid mist in the concentration measuring mechanism 2 is carried out from the gas outlet line 12 to the drying tank 14, and after the acid mist is dried and absorbed by the desiccant in the drying tank 14, the drying gas is circulated through the one-way loop.
- gas tank In the 13th the acid mist is interfered with the measurement of the mixed acid concentration of the etching liquid, and the concentration of various acids in the mixed acid of the etching liquid is measured quickly and accurately, and the drying gas is recycled.
- the purpose of saving resources is achieved; and the concentration measuring mechanism 2 is not required to be disassembled and wiped, thereby improving the service life of the concentration measuring mechanism 2.
- a method for measuring an etchant concentration is provided, which is performed by using the etchant concentration measuring device described above,
- the concentration measuring device includes a concentration measuring mechanism 2, a supply tank 3 for supplying the etching liquid to the concentration measuring mechanism 2, and an acid mist eliminating mechanism 1 for eliminating the acid mist in the concentration measuring mechanism 2, and the acid mist eliminating mechanism 1
- a circulation loop is formed between the concentration measuring mechanism 2 and the concentration measuring mechanism 2, and the connection relationship between the acid mist removing mechanism 1 and the concentration measuring mechanism 2 and the supply tank 3 has been described in detail in the above measuring device, and will not be described herein.
- the etchant concentration measurement method includes the following steps:
- the etching liquid in the supply tank 1 flows into the concentration measuring mechanism 2, and the acid mist removing mechanism 1 is turned on to make the concentration measuring mechanism 2
- the internal acid mist is taken out and the taken acid mist is dried and then circulated to the concentration measuring mechanism 2 to bring out acid mist;
- the concentration measuring mechanism 2 The absorbance of each acid in the mixed acid of the etching solution is measured in real time in an acid-free environment, and the concentration of each acid in the mixed acid of the etching solution is calculated according to the absorbance.
- the gas storage tank 13, the intake line 11, the concentration measuring mechanism 2, and the gas outlet line 12 The drying tank 14 and the one-way line 15 are sequentially connected to form a circulation loop; then the reference solution water is filled in the reference tank 23, and the supply tank 3 and the concentration measuring mechanism equipped with the etching liquid are provided.
- the two-way connection, specifically, the supply tank 3 and the sample cell 22 are bidirectionally connected in-line so that the etching liquid in the supply tank 3 flows into the sample cell 22; then the first valve on the intake line 11 is opened.
- the concentration measuring mechanism 2 measures the difference in absorbance between the etching liquid in the sample cell 22 and the aqueous solution in the reference cell 23, and the difference in absorbance is also Sample cell twenty two
- the medium etchant mixes the absorbance of each acid in the acid, and then the concentration of each acid in the etchant can be calculated based on the absorbance.
- the method of calculating the concentration specifically based on the absorbance is prior art and will not be described in detail herein.
- the method for measuring the concentration of the etching solution of the present invention can timely measure the concentration measuring mechanism 2
- the acid mist is taken out to overcome the interference of the acid mist on the concentration measurement of the etching solution, thereby achieving the purpose of accurately controlling and monitoring the acid concentration in the mixed acid of the etching liquid; and real-time online measurement of the concentration of each acid in the mixed acid of the etching liquid, Add new nitric acid, acetic acid and acid during the etching process / or phosphoric acid and ensure accurate acid combination ratio, to ensure high precision etching images.
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Abstract
一种蚀刻液浓度测量装置及方法,其中所述测量装置包括浓度测量机构及与所述浓度测量机构相连的酸雾消除机构,所述酸雾消除机构用于消除所述浓度测量机构内部的酸雾,所述浓度测量机构用于实时接收蚀刻液并在无酸雾环境下测量所述蚀刻液混酸中各酸的吸光度,并根据所述吸光度计算所述蚀刻液混酸中各酸的浓度。浓度测量装置克服了酸雾对蚀刻液混酸中酸浓度的测量干扰,达到快速、准确地在线测定蚀刻液混酸中各种酸的浓度,并实现干燥气体的循环使用,达到了节约资源的目的。
Description
本发明涉及蚀刻液技术领域,更具体地说,涉及一种蚀刻液浓度测量装置及方法。
湿式蚀刻是 TFT 制造过程中用酸性腐蚀液对金属膜层进行图形化,进而形成栅极( Gate )、源漏极(
Source-Drain )、像素( Indium Tin Oxides, ITO
)电极的核心工艺。其中,铝和钼常作为导电材料来形成栅极,其蚀刻液可使用多种不同的酸,但大多都是利用强酸混合物(磷酸、硝酸和冰醋酸)对其进行溶解和氧化还原,从而实现栅极膜层的图形化。
蚀刻液混酸的组成一般为磷酸( 70~72% )、硝酸( 1.8~2.0% )、醋酸( 9.5~10.5%
),其中,硝酸扮演提供 H3O+
的角色,以氧化金属铝钼进行蚀刻;磷酸是提供磷酸根,并与氧化的金属形成络合物从而溶解金属氧化物;醋酸可附着于反应物表面,降低蚀刻液黏度以及提高其浸润性和调整蚀刻速率。在形成栅极和源漏极的蚀刻过程中,硝酸和醋酸会不断地消耗,导致酸的浓度逐渐降低,影响到蚀刻质量。为了避免蚀刻不良的发生,保持所需的蚀刻速度和蚀刻质量,控制硝酸和醋酸的浓度精确显得十分重要,因此在蚀刻过程中需要不断补加新的硝酸和醋酸以确保蚀刻液混酸中的酸组合配比。因此,在生产过程中需要一种混酸在线监测装置来控制各酸浓度,从而保证合适的蚀刻速率和良好的蚀刻质量。
如图 1 所示,现有的在线监测装置,利用基于朗伯 -
比尔定律的在线光学式浓度测量机构来监测蚀刻过程中蚀刻液中各酸的浓度。其测量原理为:光源 210 发出多个波长的光,通过单色器 220
后产生特定波长的光,光线透过并行排列的参考池 240 和盛装混酸的样品池 230 后,检测器 250 检测出样品池 230 和参比池 240
的吸光度的差值,最后利用朗伯 - 比尔定律可计算出样品池中各酸的浓度。
但在实际生产中,由于在线光学式浓度测量机构是一个密封的容器,其与外部管路相比,在线光学式浓度测量机构始终处于负压状态,而通过外部管路输送到样品池 230
中的混酸在送酸管路和样品池 230
接触面上不可避免地会有少量挥发,尤其是低沸点的醋酸挥发比较严重。日积月累,在在线光学式浓度测量机构负压封闭系统内会形成一种挥之不去的酸雾,酸雾蒙在样品池
230 或参比池 240
的表面,就会影响光的吸收,进而影响酸浓度的测定值。即量测出的酸浓度会比实际偏低或偏高,造成补酸系统补酸过多或不足,最终使蚀刻液中酸的浓度偏大或偏小,从而造成蚀刻的大批次不良和返工修复,给生产造成重大损失。在实际运用中,为克服此雾化现象,需要定期对在线光学式浓度测量机构进行拆机或对测量池进行擦拭,不但破坏测量机构的精密度,重装后的在线光学式浓度测量机构还要重新校准才能投入使用,给实际生产造成诸多不便。
本发明要解决的技术问题在于,针对现有技术的在线光学式测量机构内部会形成酸雾,从而对混酸浓度测量造成干扰的缺陷,提供一种蚀刻液浓度测量装置及方法,以便在蚀刻中快速、经济、准确地测定蚀刻液中各酸浓度。
本发明解决其技术问题所采用的技术方案是:构造一种蚀刻液浓度测量装置,包括浓度测量机构及与所述浓度测量机构相连的酸雾消除机构 ,所述
酸雾消除机构用于消除所述浓度测量机构内部的酸雾 , 所述浓度测量机构用于 实时接收 蚀刻液 并
在无酸雾环境下测量所述蚀刻液混酸中各酸的吸光度,并根据所述吸光度计算所述蚀刻液混酸中各酸的浓度。
在本发明所述的蚀刻液浓度测量装置中,
还包括与所述浓度测量机构相连的盛装所述蚀刻液的供应槽,所述供应槽用于实时向所述浓度测量机构供应蚀刻液。
在本发明所述的蚀刻液浓度测量装置中, 所述酸雾消除机构内有干燥气体,且 所述酸雾消除机构 与所述浓度测量机构
之间形成循环回路,所述酸雾消除机构 内的干燥气体在 将所述浓度测量机构内的酸雾带出并对带出的酸雾 进行 干燥 处理 后 ,所述处理后的干燥气体又 循环 至
所述浓度测量机构内 。
在本发明所述的蚀刻液浓度测量装置中,所述酸雾消除机构包括:
分别与所述浓度测量机构连接的进气管路和出气管路;
与所述进气管路固定连接的储气罐, 所述干燥气体装在 所述储气罐内;
设置在所述出气管路与所述
储气罐之间的干燥罐,且所述储气罐、进气管路、浓度测量机构、出气管路和干燥罐形成所述循环回路,所述干燥罐内装有干燥剂。
在本发明所述的蚀刻液浓度测量装置中,所述储气罐内装的干燥气体为空气或氮气。
在本发明所述的蚀刻液浓度测量装置中,所述干燥剂为氧化钙和氢氧化钠的混合物。
在本发明所述的蚀刻液浓度测量装置中,还包括用于连通所述干燥罐和储气罐的单向管路,所述干燥罐干燥后的干燥气体经所述单向管路回流至所述储气罐内。
在本发明所述的蚀刻液浓度测量装置中,所述蚀刻液按重量百分含量包括: 70% ~ 72% 磷酸, 1.8%
~ 2.0% 硝酸, 9.5% ~ 10.5% 醋酸和余量的水。
在本发明所述的蚀刻液浓度测量装置中,所述进气管路上设有用于调节所述储气罐内的干燥气体流量的第一阀门,所述单向管路上设有用于调节所述干燥罐内的干燥气体流量的第二阀门。
本发明的另一方面,还提供了 一种蚀刻液浓度测量装置,包括浓度测量机构
、用于实时向所述浓度测量机构供应蚀刻液的供应槽及与 所述浓度测量机构相连的酸雾消除机构 , 所述酸雾消除机构包括:
分别与所述浓度测量机构连接的进气管路和出气管路;
与所述进气管路固定连接的储气罐,所述储气罐内 装有干燥气体 ;
设置在所述出气管路与所述
储气罐之间的干燥罐,且所述储气罐、进气管路、浓度测量机构、出气管路和干燥罐形成循环回路,所述干燥罐内装有干燥剂 ;
所述干燥气体经进气管路进入所述浓度测量机构内并将所述浓度测量机构内的酸雾带出,经所述干燥罐进行干燥处理后,所述处理后的干燥气体又循环至所述浓度测量机构内;
所述浓度测量机构用于 实时接收 蚀刻液 并
在无酸雾环境下测量所述蚀刻液混酸中各酸的吸光度,并根据所述吸光度计算所述蚀刻液混酸中各酸的浓度。
在本发明所述的 蚀刻液浓度测量装置中, 所述 储气罐内装的干燥气体为空气或氮气。
在本发明所述的 蚀刻液浓度测量装置中, 所述干燥剂为氧化钙和氢氧化钠的混合物。
在本发明所述的 蚀刻液浓度测量装置中,
还包括用于连通所述干燥罐和储气罐的单向管路,所述干燥罐干燥后的干燥气体经所述单向管路回流至所述储气罐内。
在本发明所述的 蚀刻液浓度测量装置中, 所述蚀刻液按重量百分含量包括: 70% ~ 72% 磷酸,
1.8% ~ 2.0% 硝酸, 9.5% ~ 10.5% 醋酸和余量的水。
在本发明所述的 蚀刻液浓度测量装置中,
所述进气管路上设有用于调节所述储气罐内的干燥气体流量的第一阀门,所述单向管路上设有用于调节所述干燥罐内的干燥气体流量的第二阀门。
本发明还提供了一种 蚀刻液浓度测量方法 ,
利用蚀刻液浓度测量装置进行测量,所述蚀刻液浓度测量装置包括浓度测量机构、为所述浓度测量机构供应蚀刻液的供应槽及用于消除所述浓度测量机构内的酸雾的酸雾消除机构;所述测量方法
包括以下步骤:
连接所述 酸雾消除机构与浓度测量机构;
将所述供应槽与浓度测量机构在线连接起来;
所述供应槽内的蚀刻液流向所述浓度测量机构内,开启所述酸雾消除机构,使所述浓度测量机构内部的酸雾被带出并将带出的酸雾进行 干燥 处理后循环至所述浓度测量机构内
再带出酸雾 ;
所述浓度测量机构在无酸雾环境下实时测量所述蚀刻液混酸中各酸的吸光度,并根据所述吸光度计算所述蚀刻液混酸中各酸的浓度。
实施本发明的蚀刻液浓度测量装置及方法,具有以下有益效果:通过设置与浓度测量机构相连通酸雾消除机构,且该酸雾消除机构与浓度测量机构之间形成循环回路,并用于消除浓度测量机构内的由于蚀刻液挥发所形成的酸雾,从而克服了酸雾对蚀刻液混酸中酸浓度的测量干扰,达到快速、准确地在线测定蚀刻液混酸中各种酸的浓度,并实现干燥气体的循环使用,达到了节约资源的目的。
下面将结合附图及实施例对本发明作进一步说明,附图中:
图 1 是现有的浓度测量机构的内部结构框图;
图 2 是本发明较佳实施例提供的蚀刻液浓度测量装置的结构框图。
为了对本发明的技术特征、目的和效果有更加清楚的理解,现对照附图详细说明本发明的具体实施方式。
如图 1 所示,本发明较佳实施例提供的蚀刻液浓度测量装置, 包括酸雾消除机构 1 、浓度测量机构 2
和供应槽 3 。其中供应槽 3 内盛装有蚀刻液,并用于为浓度测量机构 2 实时 在线供应蚀刻液,酸雾消除机构 1 与浓度测量机构 2 相连,并
用于消除浓度测量机构 2 内部的酸雾,以使浓度测量机构 2
在无酸雾环境下实时测量蚀刻液混酸中各酸的吸光度,并根据该吸光度计算蚀刻液混酸中各酸的浓度,使浓度测量更加精确,从而达到准确控制和监控蚀刻液混酸中各酸的浓度,提高蚀刻质量的目的。
进一步地,酸雾消除机构 1 内具有干燥气体,酸雾消除机构 1 与浓度测量机构 2
之间形成循环回路,酸雾消除机构 1 内的干燥气体在将浓度测量机构 2
内的酸雾带出后,并对带出的酸雾进行干燥处理,然后经干燥处理后的干燥气体又循环至浓度测量机构 2 内再次带出酸雾,如此反复在酸雾消除机构 1 与浓度测量机构 2
之间形成循环回路,实现资源的合理利用。
供应槽 3 用于盛装蚀刻液,且该供应槽 3 经过连接管线进入蚀刻机台(未示出),为 TFT
制造过程提供必需的蚀刻液。本实施例中,该供应槽 3 与浓度测量机构 2 双向 在线 连接,以使供应槽 3 中的蚀刻液流向浓度测量机构 2
内,完成对蚀刻液混酸中各酸浓度的测量,然后测量完毕的蚀刻液又通过管路流回至供应槽 3 内,实现蚀刻液的循环使用。优选地,供应槽 3
内的蚀刻液为铝蚀刻液,且蚀刻液按重量百分含量包括 70% ~ 72% 磷酸, 1.8% ~ 2.0% 硝酸, 9.5% ~ 10.5%
醋酸和余量的水。
浓度测量机构 2 是基于朗伯 - 比尔定律定量测定蚀刻液混酸中各酸的浓度,且该浓度测量机构 2 与供应槽
3 在线连接,以实现对供应槽 3 中的蚀刻液混酸中各种酸的吸光度和浓度进行实时在线测量。
浓度测量机构 2 为一个密封的容器,包括密封腔 21 、以及容纳在密封腔 21 内的光源 24 、单色器
25 、样品池 22 、参比池 23 和检测器 26 。其中,密封腔 21 与浓度测量机构 2 外部其它管路相比,密封腔 21
始终处于负压状态,以使外部供应槽 3 内的蚀刻液流入密封腔 21 内。样品池 22 和参比池 23 具有相同的光程且并行排列,单色器 25 和检测器 26
设置在样品池 22 和参比池 23 的两侧,该浓度测量机构 2 的测量原理为:光源 24 发出的光经过单色器 25 后,再分别经过平行排列的样品池 22
和参比池 23 ,从而检测器 26 获得样品池 22 和参比池 23 中的吸光度的差值,最后将得到的吸光度的差值进行计算,从而获得样品池 22 和参比池 23
中的浓度差值 ,具体的浓度测量机构 2 的工作原理为现有技术,在此不再赘述 。本实施例中,样品池 22 与供应槽 3 之间双向连接,以使供应槽 3
内的蚀刻液流入样品池 22 内,完成对蚀刻液混酸中各酸浓度的实时在线监测,且量测完毕后的蚀刻液混酸又通过管路流回至供应槽 3
内,实现蚀刻液的循环使用。
参比池 23 内装的是水溶液,样品池 22 内是蚀刻液,由此通过该浓度测量机构 2
测量出的浓度差值实际上就是样品池 22 内蚀刻液混酸中各酸的浓度,也即该浓度测量机构 2
测量出的是蚀刻过程中蚀刻液中的硝酸、磷酸和醋酸各自的浓度。则在蚀刻过程中,通过将测量的硝酸、磷酸和醋酸的浓度与在蚀刻过程中需要的标准的蚀刻液中各酸的浓度进行比较,从而可以得出需要向蚀刻液中加入的硝酸、磷酸和醋酸的量,以实现及时地向供应槽
3 内补充硝酸、磷酸和 / 或醋酸,保证蚀刻速度和蚀刻质量。在其它实施例中,参比池 23 也可为空的,即在参比池 23 内不装任何溶液。
同时在将供应槽 3 内的蚀刻液送入样品池 22 时,外部送酸管路与样品池 22
的接触面上不可避免地会有少许酸挥发,尤其是蚀刻液中低沸点的醋酸挥发比较严重。久而久之,越来越多的酸雾弥漫在浓度测量机构 2 的内部,即酸雾在浓度测量机构 2
内部不断扩散,使密封腔 21 内形成挥之不去的酸雾,且随着时间的延长,密封腔 21 内的酸雾越来越多。
酸雾消除机构 1 与浓度测量机构 2 之间形成循环回路,并用于消除浓度测量机构 2
内的酸雾,该酸雾消除机构 1 包括进气管路 11 、出气管路 12 、储气罐 13 、干燥罐 14 和单向管路 15 。
进气管路 11 和出气管路 12 均设置在浓度测量机构 2 的外部,且进气管路 11 和出气管路 12
均与浓度测量机构 2 连接。储气罐 13 内装有干燥气体,且储气罐 13 与进气管路 11 连接;干燥罐 14 的一端与出气管路 12
连接,另一端通过单向管路 15 与储气罐 13 连接,即干燥罐 14 设置在出气管路 12 与储气罐 13 之间。由此,储气罐 13 、进气管路 11
、浓度测量机构 2 、出气管路 12 、干燥罐 14 和单向 管 路 15 依次连接,并形成了一个闭合的循环回路;且干燥罐 14
内装有能吸收酸雾和水汽的干燥剂,具体地干燥剂为氧化钙和氢氧化钠的混合物。
其中,储气罐 13 内装的干燥气体为空气或氮气,优选地干燥气体为惰性气体氮气。当储气罐 13
内的干燥气体经进气管路 11 流入密封腔 21 时,随着干燥气体的不断通入,密封腔 21 内部压强越来越大,当密封腔 21
的内部压强等于或大于外部压强时,密封腔 21 内的干燥气体会携带密封腔 21 内的酸雾通过出气管路 12 流入干燥罐 14 内;由于干燥罐 14
内装有干燥剂,则从密封腔 21 内流出的酸性物质和水汽被干燥罐 14 内的干燥剂吸附干燥,使从干燥罐 14
流出的气体仅为干燥气体(不包含酸雾和水汽),则该干燥气体进一步经单向管路 15 再流入储气罐 13 内, 进而又可流入浓度测量机构 2 内携带酸雾,
实现干燥气体的循环使用,达到节约资源的目的。具体地,当干燥气体携带密封腔 21 内的酸雾从出气管路 12 流至干燥罐 14 内时,干燥罐 14
内的氧化钙吸收混合气体中的水汽,氢氧化钠吸收其中的酸性物质,则从干燥罐 14 流出的气体只有干燥气体,实现了资源的合理利用;而且当干燥罐 14
内的干燥剂吸收水汽和酸性物质达到一定程度时,干燥剂会失效,此时可对干燥罐 14 内的干燥剂进行更换。
本实施例中,进气管路 11 和出气管路 12 与浓度测量机构 2
之间的连接方式可为焊接、铆接、螺纹连接等现有的常规方式,在此不做限定。而且为了控制储气罐 13 内的干燥气体的流 量 ,在进气管路 11 上设有 第一 阀门
16 ,即第一阀门 16 用于调节储气罐 13 内的干燥气体的流量,则当浓度测量机构 2 内的酸雾较多时,相应地可通过第一阀门加大干燥气体的流量
;同理,在单向管路 15 上也设有用于 调节 干燥气体流 量 的 第二 阀门 17 ,即通过第二阀门 17 来调节经干燥罐 14 流入储气罐 13
内的干燥气体流量 。
本发明的蚀刻液浓度测量装置,通过设置 与 浓度测量机构 2 相连通 酸雾消除机构 1 ,且该酸雾消除机构
1 与浓度测量机构 2 之间形成循环回路,并用于消除浓度测量机构 2
内的由于蚀刻液挥发所形成的酸雾,从而克服了酸雾对蚀刻液混酸中酸浓度的测量干扰,达到准确控制和监控蚀刻液混酸中各酸浓度的目的。具体地 储气罐 13 、进气管路
11 、浓度测量机构 2 、出气管路 12 和干燥罐 14 形成所述循环回路 ,使储气罐 13 内的干燥气体经进气管路 11 流入浓度测量机构 2
内,并携带浓度测量机构 2 内的酸雾从出气管路 12 流出至干燥罐 14 内,并经干燥罐 14 内的干燥剂将酸雾干燥吸收后,干燥气体又经单向回路循环流至储气罐
13 内,克 服了酸雾对蚀刻液混酸浓度测量的干扰,达到快速、准确地在线测定蚀刻液 混酸中 各种酸的浓度 ,并 实现 干燥气体 的 循环使用,
达到了节约资源的目的;且无需对浓度测量机构 2 进行拆机和擦拭,提高了浓度测量机构 2 的使用寿命。
本发明的另一方面,还提供了一种蚀刻液浓度的测量方法,该测量方法是利用上述的蚀刻液浓度测量装置完成的,
该浓度测量装置包括浓度测量机构 2 、为浓度测量机构 2 供应蚀刻液的供应槽 3 及用于消除浓度测量机构 2 内的酸雾的酸雾消除机构 1 ,且酸雾消除机构 1
与浓度测量机构 2 之间形成循环回路,具体地酸雾消除机构 1 、浓度测量机构 2 和供应槽 3 的连接关系在上述测量装置中已经详述过,在此不再赘述。
该蚀刻液浓度 测量方法包括以下步骤:
连接 所述 酸雾消除机构 1 与浓度测量机构 2 ;
将 所述 供应槽 3 与浓度测量机构 2 在线连接起来;
所述供应槽 1 内的蚀刻液流向所述浓度测量机构 2 内,开启所述酸雾消除机构 1 ,使所述浓度测量机构 2
内部的酸雾被带出并将带出的酸雾进行 干燥 处理后循环至所述浓度测量机构 2 内 再带出酸雾 ;
所述浓度测量机构 2
在无酸雾环境下实时测量所述蚀刻液混酸中各酸的吸光度,并根据所述吸光度计算所述蚀刻液混酸中各酸的浓度。
本发明的蚀刻液浓度测量方法, 首先将储气罐 13 、进气管路 11 、浓度测量机构 2 、出气管路 12
、干燥罐 14 和单向管路 15 依次连接起来,形成一个循环回路;然后 在参比池 23 内装入参比溶液水,将装有蚀刻液的供应槽 3 与浓度测量机构 2
双向连接起来,具体地是将供应槽 3 与样品池 22 在线双向连接,以实现供应槽 3 内的蚀刻液在线流向样品池 22 内 ;接着打开进气管路 11 上的第一阀门
16 和单向管路 15 上的第二阀门 17 ,使储气罐 13 内的干燥气体流入浓度测量机构 2 内部并将浓度测量机构 2
内的酸雾带出,并实现干燥气体的循环使用;最后浓度测量机构 2 测量出样品池 22 中的蚀刻液与参比池 23 中的水溶液之间的吸光度之差,该吸光度之差也即样品池
22
中蚀刻液混酸中各酸的吸光度,然后根据该吸光度就可计算出蚀刻液中各酸的浓度。具体地根据吸光度计算浓度的方法为现有技术,在此不再详述。完成对蚀刻液混酸中各酸浓度的测量后,样品池
22 内的蚀刻液混酸又通过管路流回至供应槽 3 内,实现蚀刻液的循环使用。
本发明的蚀刻液浓度的测量方法,能够及时将浓度测量机构 2
内的酸雾带出,克服了酸雾对蚀刻液浓度测量的干扰,从而达到准确控制和监控蚀刻液混酸中各酸浓度的目的;且能够实时在线测量蚀刻液混酸中各酸的浓度,在蚀刻过程中及时补加新的硝酸、醋酸和
/ 或磷酸并保证准确的酸组合配比,保证获得高精度的蚀刻图像。
上面结合附图对本发明的实施例进行了描述,但是本发明并不局限于上述的具体实施方式,上述的具体实施方式仅仅是示意性的,而不是限制性的,本领域的普通技术人员在本发明的启示下,在不脱离本发明宗旨和权利要求所保护的范围情况下,还可做出很多形式,这些均属于本发明的保护之内。
Claims (16)
- 一种蚀刻液浓度测量装置,其中,包括浓度测量机构及与所述浓度测量机构相连的酸雾消除机构 ,所述 酸雾消除机构用于消除所述浓度测量机构内部的酸雾 , 所述浓度测量机构用于 实时接收 蚀刻液 并 在无酸雾环境下测量所述蚀刻液混酸中各酸的吸光度,并根据所述吸光度计算所述蚀刻液混酸中各酸的浓度。
- 根据权利要求 1 所述的 蚀刻液浓度测量装置,其中, 还包括与所述浓度测量机构相连的盛装所述蚀刻液的供应槽,所述供应槽用于实时向所述浓度测量机构供应蚀刻液。
- 根据权利要求 1 所述的 蚀刻液浓度测量装置,其中, 所述酸雾消除机构内有干燥气体,且 所述酸雾消除机构 与所述浓度测量机构 之间形成循环回路,所述酸雾消除机构 内的干燥气体在 将所述浓度测量机构内的酸雾带出并对带出的酸雾 进行 干燥 处理 后 ,所述处理后的干燥气体又 循环 至 所述浓度测量机构内 。
- 根据权利要求 3 所述的 蚀刻液浓度测量装置,其中,所述酸雾消除机构包括:分别与所述浓度测量机构连接的进气管路和出气管路;与所述进气管路固定连接的储气罐, 所述干燥气体装在 所述储气罐内;设置在所述出气管路与所述 储气罐之间的干燥罐,且所述储气罐、进气管路、浓度测量机构、出气管路和干燥罐形成所述循环回路,所述干燥罐内装有干燥剂。
- 根据权利要求 4 所述的 蚀刻液浓度测量装置,其中,所述储气罐内装的干燥气体为空气或氮气。
- 根据权利要求 4 所述的 蚀刻液浓度测量装置,其中,所述干燥剂为氧化钙和氢氧化钠的混合物。
- 根据权利要求 4 所述的 蚀刻液浓度测量装置,其中,还包括用于连通所述干燥罐和储气罐的单向管路,所述干燥罐干燥后的干燥气体经所述单向管路回流至所述储气罐内。
- 根据权利要求 1 所述的蚀刻液浓度测量装置,其中,所述蚀刻液按重量百分含量包括: 70% ~ 72% 磷酸, 1.8% ~ 2.0% 硝酸, 9.5% ~ 10.5% 醋酸和余量的水。
- 根据权利要求 7 所述的 蚀刻液浓度测量装置,其中,所述进气管路上设有用于调节所述储气罐内的干燥气体流量的第一阀门,所述单向管路上设有用于调节所述干燥罐内的干燥气体流量的第二阀门。
- 一种蚀刻液浓度测量装置,其中,包括浓度测量机构 、用于实时向所述浓度测量机构供应蚀刻液的供应槽及与 所述浓度测量机构相连的酸雾消除机构 , 所述酸雾消除机构包括:分别与所述浓度测量机构连接的进气管路和出气管路;与所述进气管路固定连接的储气罐,所述储气罐内 装有干燥气体 ;设置在所述出气管路与所述 储气罐之间的干燥罐,且所述储气罐、进气管路、浓度测量机构、出气管路和干燥罐形成循环回路,所述干燥罐内装有干燥剂 ;所述干燥气体经进气管路进入所述浓度测量机构内并将所述浓度测量机构内的酸雾带出,经所述干燥罐进行干燥处理后,所述处理后的干燥气体又循环至所述浓度测量机构内;所述浓度测量机构用于 实时接收 蚀刻液 并 在无酸雾环境下测量所述蚀刻液混酸中各酸的吸光度,并根据所述吸光度计算所述蚀刻液混酸中各酸的浓度。
- 根据权利要求 10 所述的 蚀刻液浓度测量装置,其中,所述储气罐内装的干燥气体为空气或氮气。
- 根据权利要求 10 所述的 蚀刻液浓度测量装置,其中,所述干燥剂为氧化钙和氢氧化钠的混合物。
- 根据权利要求 10 所述的 蚀刻液浓度测量装置,其中,还包括用于连通所述干燥罐和储气罐的单向管路,所述干燥罐干燥后的干燥气体经所述单向管路回流至所述储气罐内。
- 根据权利要求 10 所述的 蚀刻液浓度测量装置,其中,所述蚀刻液按重量百分含量包括: 70% ~ 72% 磷酸, 1.8% ~ 2.0% 硝酸, 9.5% ~ 10.5% 醋酸和余量的水。
- 根据权利要求 10 所述的 蚀刻液浓度测量装置,其中,所述进气管路上设有用于调节所述储气罐内的干燥气体流量的第一阀门,所述单向管路上设有用于调节所述干燥罐内的干燥气体流量的第二阀门。
- 一种 蚀刻液浓度测量方法 , 利用蚀刻液浓度测量装置进行测量, 其中, 所述蚀刻液浓度测量装置包括浓度测量机构、为所述浓度测量机构供应蚀刻液的供应槽及用于消除所述浓度测量机构内的酸雾的酸雾消除机构;所述测量方法 包括以下步骤:连接 所述 酸雾消除机构与浓度测量机构;将 所述 供应槽与浓度测量机构在线连接起来;所述供应槽内的蚀刻液流向所述浓度测量机构内,开启所述酸雾消除机构,使所述浓度测量机构内部的酸雾被带出并将带出的酸雾进行 干燥 处理后循环至所述浓度测量机构内 再带出酸雾 ;所述浓度测量机构在无酸雾环境下实时测量所述蚀刻液混酸中各酸的吸光度,并根据所述吸光度计算所述蚀刻液混酸中各酸的浓度。
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| CN110736693A (zh) * | 2019-11-14 | 2020-01-31 | 际华三五零二职业装有限公司 | 纺织面料吸附有毒气体检测装置 |
| CN112763404A (zh) * | 2021-01-27 | 2021-05-07 | 太原理工大学 | 一种盐雾腐蚀与疲劳荷载共同耦合作用的试验系统 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105866049B (zh) * | 2016-05-20 | 2019-04-26 | 深圳市华星光电技术有限公司 | 蚀刻液酸浓度量测装置 |
| CN106053537B (zh) * | 2016-05-24 | 2019-01-22 | 深圳市华星光电技术有限公司 | 显影液的浓度监测系统及方法 |
| CN107727789B (zh) * | 2017-09-28 | 2020-12-25 | Tcl华星光电技术有限公司 | 一种浓度测量装置及其浓度系数自校正方法、蚀刻装置 |
| CN113820308A (zh) * | 2020-06-18 | 2021-12-21 | 厦门大学 | 一种基于机器视觉的蚀刻液浓度实时监测方法及系统 |
| CN115853758A (zh) * | 2022-12-22 | 2023-03-28 | 惠州宏剑工业设备有限公司 | 一种蚀刻液泵流量监测系统以及装置 |
| CN117538246B (zh) * | 2023-12-24 | 2024-06-18 | 中国兵器装备集团西南技术工程研究所 | 一种盐雾-疲劳载荷工况耦合试验装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5897378A (en) * | 1995-05-17 | 1999-04-27 | Matsushita Electric Industrial Co., Ltd. | Method of monitoring deposit in chamber, method of plasma processing, method of dry-cleaning chamber, and semiconductor manufacturing apparatus |
| CN1667514A (zh) * | 2004-03-11 | 2005-09-14 | 株式会社东进世美肯 | 实时监控光刻过程所用组合物的系统和方法 |
| CN101567309A (zh) * | 2008-04-22 | 2009-10-28 | 株式会社平间理化研究所 | 蚀刻液调合装置及蚀刻液浓度测定装置 |
| CN102778532A (zh) * | 2012-08-10 | 2012-11-14 | 深圳市华星光电技术有限公司 | 铝蚀刻液混酸浓度的电位滴定方法 |
| CN202683059U (zh) * | 2012-08-24 | 2013-01-23 | 成都虹华环保科技有限公司 | 用于蚀刻液回收领域的酸碱废气处理系统 |
| CN103180029A (zh) * | 2010-09-15 | 2013-06-26 | 索尔维公司 | 从气体中去除f2和/或of2的方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100534482B1 (ko) * | 2005-04-29 | 2005-12-07 | 영진산업 주식회사 | 에칭폐액의 재생방법 |
| CN101727023A (zh) * | 2008-10-28 | 2010-06-09 | 浩硕科技股份有限公司 | 蚀刻液浓度控制方法 |
| CN101958228B (zh) * | 2009-07-13 | 2012-06-20 | 弘塑科技股份有限公司 | 具有移动式泄液槽的清洗蚀刻机台 |
| CN102981523A (zh) * | 2012-11-14 | 2013-03-20 | 杭州格林达化学有限公司 | 在线测定和控制铝蚀刻液中各种酸浓度的方法 |
-
2014
- 2014-03-12 CN CN201410091097.1A patent/CN103868866B/zh not_active Expired - Fee Related
- 2014-03-28 WO PCT/CN2014/074265 patent/WO2015135230A1/zh not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5897378A (en) * | 1995-05-17 | 1999-04-27 | Matsushita Electric Industrial Co., Ltd. | Method of monitoring deposit in chamber, method of plasma processing, method of dry-cleaning chamber, and semiconductor manufacturing apparatus |
| CN1667514A (zh) * | 2004-03-11 | 2005-09-14 | 株式会社东进世美肯 | 实时监控光刻过程所用组合物的系统和方法 |
| CN101567309A (zh) * | 2008-04-22 | 2009-10-28 | 株式会社平间理化研究所 | 蚀刻液调合装置及蚀刻液浓度测定装置 |
| CN103180029A (zh) * | 2010-09-15 | 2013-06-26 | 索尔维公司 | 从气体中去除f2和/或of2的方法 |
| CN102778532A (zh) * | 2012-08-10 | 2012-11-14 | 深圳市华星光电技术有限公司 | 铝蚀刻液混酸浓度的电位滴定方法 |
| CN202683059U (zh) * | 2012-08-24 | 2013-01-23 | 成都虹华环保科技有限公司 | 用于蚀刻液回收领域的酸碱废气处理系统 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110736693A (zh) * | 2019-11-14 | 2020-01-31 | 际华三五零二职业装有限公司 | 纺织面料吸附有毒气体检测装置 |
| CN112763404A (zh) * | 2021-01-27 | 2021-05-07 | 太原理工大学 | 一种盐雾腐蚀与疲劳荷载共同耦合作用的试验系统 |
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