WO2015119342A1 - 하우징 내장형 커패시터 - Google Patents

하우징 내장형 커패시터 Download PDF

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Publication number
WO2015119342A1
WO2015119342A1 PCT/KR2014/006886 KR2014006886W WO2015119342A1 WO 2015119342 A1 WO2015119342 A1 WO 2015119342A1 KR 2014006886 W KR2014006886 W KR 2014006886W WO 2015119342 A1 WO2015119342 A1 WO 2015119342A1
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WO
WIPO (PCT)
Prior art keywords
capacitor
housing
side wall
wall plate
long side
Prior art date
Application number
PCT/KR2014/006886
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English (en)
French (fr)
Korean (ko)
Inventor
박대진
전용원
박창근
한기주
박진아
Original Assignee
주식회사 뉴인텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 뉴인텍 filed Critical 주식회사 뉴인텍
Publication of WO2015119342A1 publication Critical patent/WO2015119342A1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H01G2/106—Fixing the capacitor in a housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals

Definitions

  • the present invention relates to a housing-integrated capacitor which is excellent in heat generating ability and durability and enables a compact configuration.
  • capacitors for electric devices, fastening devices, electronic devices, and the like are widely used in various industrial fields. These capacitors use plastic films such as polyethylene terephthalate (PET) resin, polypropylene (PP) resin, polyethylene naphthalate (PEN) resin, polycarbonate (PC) resin, and polyphenylene sulfide (PPS) resin as dielectrics.
  • PET polyethylene terephthalate
  • PP polypropylene
  • PEN polyethylene naphthalate
  • PC polycarbonate
  • PPS polyphenylene sulfide
  • Capacitor capacitance varies according to the purpose of the capacitor, so the capacitors are manufactured by adding or subtracting the number of capacitor elements (hereinafter, referred to as the following) to other N-pole bus bars and P-pole bus bars. Wire and the large capacity capacitor is connected to a plurality of devices to manufacture the capacitor.
  • Japanese Patent Laid-Open No. 2001-0072178 discloses a capacitor and a capacitor manufacturing method.
  • the present invention is to provide a housing-integrated capacitor excellent in heat dissipation characteristics of the housing and does not overheat even long time operation.
  • it is to provide a housing-integrated capacitor which can minimize the deformation caused by cooling after the injection of the housing and minimize the deformation of the housing that can occur during the epoxy molding process after the assembly of the capacitor to maximize product precision and operability.
  • the housing-embedded capacitor of the present invention includes a capacitor device 100 formed by winding a dielectric film and conductive spray surfaces formed on both sides thereof, and the capacitor device 100 embedded and arranged in a state in which the capacitor devices 100 are laid side by side in a plurality of rows.
  • a housing case 200 having an element settling space H, and first and second busbar forming units 300 electrically connected to the thermal spraying surfaces of the capacitor elements 100,
  • the housing case 200 may include: a bottom plate 10 partitioning a plurality of partition walls 15 vertically and vertically to form a device settlement space H in which the capacitor devices 200 are placed; It is characterized in that it comprises a long side wall plate (20) facing the thermal spraying surface of the capacitor element 200, and horizontal wall plates (30, 40) connecting both ends of the long side wall plate (20).
  • the partition wall 15 of the bottom plate 10 includes an upward inclined portion 12 protruding upwardly inclined from one point of the bottom plate 10 and the upward inclined portion. And a heat generating groove portion 14 formed concave by a lower surface of the upwardly inclined portion 11a and a ridge portion 13 formed by the upper end of the upper portion 12. Is formed in parallel with each other in a plurality of spaced apart state from the bottom surface of the bottom plate (10).
  • the long side wall plate 20 is formed by the vertical reinforcement bar 25 indenting and protruding from one point of the long side wall plate 20, and the vertical reinforcement bar 25.
  • Vertically indented grooves 26 formed on the outer side of the formed, the vertical reinforcement bar 25 is characterized in that a plurality of vertically parallel to each other in a state spaced apart from the inner wall of the long side wall plate (20).
  • FIG. 1 is a perspective view of a housing-built capacitor assembly according to an embodiment of the present invention.
  • Figure 2 is an exploded perspective view of a housing built-in capacitor according to an embodiment of the present invention.
  • Figure 3 is a perspective view of the housing case according to an embodiment of the present invention.
  • Figure 4 is a cross-sectional perspective view of the housing case according to an embodiment of the present invention.
  • FIG. 5 is a plan view of the housing case according to an embodiment of the present invention.
  • 6 and 7 are Y capacitor configuration and circuit diagram according to an embodiment of the present invention.
  • the housing-embedded capacitor of the present invention includes a capacitor device 100 formed by winding a dielectric film and conductive spray surfaces formed on both sides thereof, and the capacitor device 100 embedded and arranged in a state in which the capacitor devices 100 are laid side by side in a plurality of rows.
  • a housing case 200 having an element settling space H, and first and second busbar forming units 300 electrically connected to the thermal spraying surfaces of the capacitor elements 100,
  • the housing case 200 may include: a bottom plate 10 partitioning a plurality of partition walls 15 vertically and vertically to form a device settlement space H in which the capacitor devices 200 are placed; It is characterized in that it comprises a long side wall plate (20) facing the thermal spraying surface of the capacitor element 200, and horizontal wall plates (30, 40) connecting both ends of the long side wall plate (20).
  • the partition wall 15 of the bottom plate 10 includes an upward inclined portion 12 protruding upwardly inclined from one point of the bottom plate 10 and the upward inclined portion. And a heat generating groove portion 14 formed concave by a lower surface of the upwardly inclined portion 11a and a ridge portion 13 formed by the upper end of the upper portion 12. Is formed in parallel with each other in a plurality of spaced apart state from the bottom surface of the bottom plate (10).
  • the long side wall plate 20 is formed by the vertical reinforcement bar 25 indenting and protruding from one point of the long side wall plate 20, and the vertical reinforcement bar 25.
  • Vertically indented grooves 26 formed on the outer side of the formed, the vertical reinforcement bar 25 is characterized in that a plurality of vertically parallel to each other in a state spaced apart from the inner wall of the long side wall plate (20).
  • FIG. 1 is a perspective view of the assembly of the housing-integrated capacitor according to an embodiment of the present invention
  • Figure 2 is an exploded perspective view of the housing-integrated capacitor according to an embodiment of the present invention
  • Figure 3 is a detailed perspective view of the housing case according to an embodiment of the present invention
  • 4 is a sectional perspective view of a housing case according to an embodiment of the present invention
  • FIG. 5 is a plan view of a housing case according to an embodiment of the present invention
  • FIGS. 6 and 7 are diagrams illustrating a configuration of a Y capacitor according to an embodiment of the present invention. And a circuit diagram.
  • the housing-embedded capacitor includes capacitor devices 100 formed by winding a dielectric film and conductive spray surfaces formed on both sides thereof, and the capacitor device.
  • a housing case 200 having an element settling space H that is embedded and arranged in a state in which 100 is laid side by side in a plurality of rows, and first and second electrically connected to the thermal spraying surfaces of the capacitor elements 100. It is configured to include two busbar forming unit 300.
  • the housing case 200 the partition wall 15 is formed in a plurality of vertically protruding in the vertical direction the capacitor element
  • the bottom plate 10 partitioning the device settlement space (H) in which the 200 is placed, the long side wall plate 20 facing the thermal spraying surface of the capacitor element 200, and the long side wall plate 20 It comprises a horizontal wall plate (30, 40) connecting both ends.
  • the partition wall 15 of the bottom plate 10 protrudes obliquely upward from one point of the bottom plate 10.
  • the heat generating groove 14 is preferably formed in parallel with each other in a state where a plurality of spaced apart from the bottom surface of the bottom plate (10).
  • the long side wall plate 20, the vertical reinforcement bar 25 is one point of the long side wall plate 20 Are formed to protrude inwardly, and the vertical inlet grooves 26 formed on the outer side of the vertical reinforcement bar 25 are formed, and the vertical reinforcement bar 25 is parallel to each other in a state spaced apart from the inner wall of the long side wall plate 20. It is preferable that a plurality of vertically formed.
  • the cross-sectional shape of the vertical reinforcement bar 25 is preferably one selected from a semicircular arc or a "c" shape.
  • the partition wall 15 of the bottom plate 10 protrudes obliquely upward from one point of the bottom plate 10.
  • the vertical reinforcement bar 25 is formed at the position where the partition wall 15 is formed, and the vertical reinforcement bar ( 25 is preferably extended from the upper end of the long side wall plate 20 to the ridge 13.
  • the housing-embedded capacitor discharges residual charge charged in the capacitor when the capacitor is separated from the input terminal, thereby causing an electric shock accident. It further comprises a discharge resistor to prevent.
  • the discharge resistor is mounted on an outer surface of the long side wall plate 20 of the housing case 200, and the housing case 200 includes a stepped portion 80 for mounting a discharge resistor formed on an outer surface of the long side wall plate 20.
  • the discharge resistor mounting stepped portion 80 is formed of two first and second stepped portions 81 and 85 facing and protruded to be spaced apart from each other horizontally.
  • the housing built-in capacitor includes a Y capacitor for preventing electromagnetic interference
  • the housing case 200 includes the housing. Further comprising a Y capacitor mounting portion 60 formed on one side in the longitudinal direction of the case 200, the Y capacitor mounting portion 60, the two Y capacitor elements (S1, S2) constituting the Y capacitor is placed, embedded First and second auxiliary separation walls 61 and 63 formed between the first and second Y capacitor grooves 61a and 63a, the first and second Y capacitor grooves 61a and 63a, and the device settling space H. It is preferable that it consists of.
  • a gap 64a is formed between one side wall plate 30 and the first and second auxiliary separation walls 61 and 63, and the gap 64a is formed in the first and second Y capacitor grooves 61a and 63a. It is preferable to communicate with each other.
  • the housing case 200 having a square shape includes a fixing part for fixing the capacitor to the mother at four corners.
  • the first fixing piece (70) which is one of the fixing parts, is fixed to one side wall plate (30) and then extends horizontally to protrude horizontally in the horizontal direction (71) and to the end of the horizontal body piece (71). It is preferable that the formed fastening hole 72 and the reinforcing piece 75 protruded upright from the center of the upper surface of the horizontal body piece 71.
  • the reinforcing piece 75 is preferably composed of a curved reinforcing piece 75a and a flat extension piece 75b extending along the horizontal body piece 71 from the reinforcing piece 75a.
  • a third auxiliary separation wall between the second auxiliary separation wall 63 and the long side wall plate 20 is formed. 64) is preferably formed.
  • a support protrusion 91 protrudes in a vertical direction outside the one horizontal wall plate 30 of one of the horizontal wall plates 30 and 40 to support the rear of the input terminal, and one horizontal wall plate of the horizontal wall plates 30 and 40 ( 30)
  • the auxiliary horizontal plate 95 protrudes horizontally from the outside and a separation protrusion 96 is formed on the upper portion of the auxiliary horizontal plate 95 so as to separate and support the input terminals so as not to move laterally from each other. .

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/KR2014/006886 2014-02-04 2014-07-28 하우징 내장형 커패시터 WO2015119342A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0012344 2014-02-04
KR1020140012344A KR101436790B1 (ko) 2014-02-04 2014-02-04 하우징 내장형 커패시터

Publications (1)

Publication Number Publication Date
WO2015119342A1 true WO2015119342A1 (ko) 2015-08-13

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PCT/KR2014/006886 WO2015119342A1 (ko) 2014-02-04 2014-07-28 하우징 내장형 커패시터

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KR (1) KR101436790B1 (zh)
CN (1) CN203895271U (zh)
WO (1) WO2015119342A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105140030A (zh) * 2015-09-23 2015-12-09 纽茵泰克株式会社 提高散热性与轻量化的异种材料外壳内置型电容器
KR101733417B1 (ko) * 2015-11-03 2017-05-24 주식회사 뉴인텍 출력단자 전방 인출식 커패시터용 하우징 케이스
CN105244164B (zh) * 2015-11-13 2020-09-01 纽茵泰克株式会社 改善了散热性及轻量化的外壳内置型电容器的放电电阻器加装结构
CN105355426B (zh) * 2015-11-13 2020-05-12 纽茵泰克株式会社 改善了散热性及轻量化的输出端子前方引出式电容器用外壳
KR20180051162A (ko) * 2016-11-08 2018-05-16 (주)호이스 박막형태의 내장형 축전기 제조방법 및 그로써 제조된 박막형태의 내장형 축전기
KR102331490B1 (ko) * 2020-11-06 2021-12-01 (주)뉴인텍 메탈 케이스 커패시터
KR102332168B1 (ko) * 2020-12-10 2021-12-01 (주)뉴인텍 충진면 수평도 개선 케이스 몰딩 커패시터
CN114242453A (zh) * 2021-12-20 2022-03-25 安徽铜峰电子股份有限公司 基于电容器注塑用的下定位套

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008204988A (ja) * 2007-02-16 2008-09-04 Matsushita Electric Ind Co Ltd キャパシタユニット、およびその製造方法
KR20100005399A (ko) * 2008-07-07 2010-01-15 주식회사 뉴인텍 커패시터용 부스바 조립방법 및 그 제품
KR20110135233A (ko) * 2010-06-10 2011-12-16 현대자동차주식회사 자동차의 인버터용 커패시터

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008204988A (ja) * 2007-02-16 2008-09-04 Matsushita Electric Ind Co Ltd キャパシタユニット、およびその製造方法
KR20100005399A (ko) * 2008-07-07 2010-01-15 주식회사 뉴인텍 커패시터용 부스바 조립방법 및 그 제품
KR20110135233A (ko) * 2010-06-10 2011-12-16 현대자동차주식회사 자동차의 인버터용 커패시터

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KR101436790B1 (ko) 2014-09-11
CN203895271U (zh) 2014-10-22

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