WO2015119342A1 - Capacitor built into housing - Google Patents

Capacitor built into housing Download PDF

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Publication number
WO2015119342A1
WO2015119342A1 PCT/KR2014/006886 KR2014006886W WO2015119342A1 WO 2015119342 A1 WO2015119342 A1 WO 2015119342A1 KR 2014006886 W KR2014006886 W KR 2014006886W WO 2015119342 A1 WO2015119342 A1 WO 2015119342A1
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WO
WIPO (PCT)
Prior art keywords
capacitor
housing
side wall
wall plate
long side
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PCT/KR2014/006886
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French (fr)
Korean (ko)
Inventor
박대진
전용원
박창근
한기주
박진아
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주식회사 뉴인텍
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Publication of WO2015119342A1 publication Critical patent/WO2015119342A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H01G2/106—Fixing the capacitor in a housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals

Definitions

  • the present invention relates to a housing-integrated capacitor which is excellent in heat generating ability and durability and enables a compact configuration.
  • capacitors for electric devices, fastening devices, electronic devices, and the like are widely used in various industrial fields. These capacitors use plastic films such as polyethylene terephthalate (PET) resin, polypropylene (PP) resin, polyethylene naphthalate (PEN) resin, polycarbonate (PC) resin, and polyphenylene sulfide (PPS) resin as dielectrics.
  • PET polyethylene terephthalate
  • PP polypropylene
  • PEN polyethylene naphthalate
  • PC polycarbonate
  • PPS polyphenylene sulfide
  • Capacitor capacitance varies according to the purpose of the capacitor, so the capacitors are manufactured by adding or subtracting the number of capacitor elements (hereinafter, referred to as the following) to other N-pole bus bars and P-pole bus bars. Wire and the large capacity capacitor is connected to a plurality of devices to manufacture the capacitor.
  • Japanese Patent Laid-Open No. 2001-0072178 discloses a capacitor and a capacitor manufacturing method.
  • the present invention is to provide a housing-integrated capacitor excellent in heat dissipation characteristics of the housing and does not overheat even long time operation.
  • it is to provide a housing-integrated capacitor which can minimize the deformation caused by cooling after the injection of the housing and minimize the deformation of the housing that can occur during the epoxy molding process after the assembly of the capacitor to maximize product precision and operability.
  • the housing-embedded capacitor of the present invention includes a capacitor device 100 formed by winding a dielectric film and conductive spray surfaces formed on both sides thereof, and the capacitor device 100 embedded and arranged in a state in which the capacitor devices 100 are laid side by side in a plurality of rows.
  • a housing case 200 having an element settling space H, and first and second busbar forming units 300 electrically connected to the thermal spraying surfaces of the capacitor elements 100,
  • the housing case 200 may include: a bottom plate 10 partitioning a plurality of partition walls 15 vertically and vertically to form a device settlement space H in which the capacitor devices 200 are placed; It is characterized in that it comprises a long side wall plate (20) facing the thermal spraying surface of the capacitor element 200, and horizontal wall plates (30, 40) connecting both ends of the long side wall plate (20).
  • the partition wall 15 of the bottom plate 10 includes an upward inclined portion 12 protruding upwardly inclined from one point of the bottom plate 10 and the upward inclined portion. And a heat generating groove portion 14 formed concave by a lower surface of the upwardly inclined portion 11a and a ridge portion 13 formed by the upper end of the upper portion 12. Is formed in parallel with each other in a plurality of spaced apart state from the bottom surface of the bottom plate (10).
  • the long side wall plate 20 is formed by the vertical reinforcement bar 25 indenting and protruding from one point of the long side wall plate 20, and the vertical reinforcement bar 25.
  • Vertically indented grooves 26 formed on the outer side of the formed, the vertical reinforcement bar 25 is characterized in that a plurality of vertically parallel to each other in a state spaced apart from the inner wall of the long side wall plate (20).
  • FIG. 1 is a perspective view of a housing-built capacitor assembly according to an embodiment of the present invention.
  • Figure 2 is an exploded perspective view of a housing built-in capacitor according to an embodiment of the present invention.
  • Figure 3 is a perspective view of the housing case according to an embodiment of the present invention.
  • Figure 4 is a cross-sectional perspective view of the housing case according to an embodiment of the present invention.
  • FIG. 5 is a plan view of the housing case according to an embodiment of the present invention.
  • 6 and 7 are Y capacitor configuration and circuit diagram according to an embodiment of the present invention.
  • the housing-embedded capacitor of the present invention includes a capacitor device 100 formed by winding a dielectric film and conductive spray surfaces formed on both sides thereof, and the capacitor device 100 embedded and arranged in a state in which the capacitor devices 100 are laid side by side in a plurality of rows.
  • a housing case 200 having an element settling space H, and first and second busbar forming units 300 electrically connected to the thermal spraying surfaces of the capacitor elements 100,
  • the housing case 200 may include: a bottom plate 10 partitioning a plurality of partition walls 15 vertically and vertically to form a device settlement space H in which the capacitor devices 200 are placed; It is characterized in that it comprises a long side wall plate (20) facing the thermal spraying surface of the capacitor element 200, and horizontal wall plates (30, 40) connecting both ends of the long side wall plate (20).
  • the partition wall 15 of the bottom plate 10 includes an upward inclined portion 12 protruding upwardly inclined from one point of the bottom plate 10 and the upward inclined portion. And a heat generating groove portion 14 formed concave by a lower surface of the upwardly inclined portion 11a and a ridge portion 13 formed by the upper end of the upper portion 12. Is formed in parallel with each other in a plurality of spaced apart state from the bottom surface of the bottom plate (10).
  • the long side wall plate 20 is formed by the vertical reinforcement bar 25 indenting and protruding from one point of the long side wall plate 20, and the vertical reinforcement bar 25.
  • Vertically indented grooves 26 formed on the outer side of the formed, the vertical reinforcement bar 25 is characterized in that a plurality of vertically parallel to each other in a state spaced apart from the inner wall of the long side wall plate (20).
  • FIG. 1 is a perspective view of the assembly of the housing-integrated capacitor according to an embodiment of the present invention
  • Figure 2 is an exploded perspective view of the housing-integrated capacitor according to an embodiment of the present invention
  • Figure 3 is a detailed perspective view of the housing case according to an embodiment of the present invention
  • 4 is a sectional perspective view of a housing case according to an embodiment of the present invention
  • FIG. 5 is a plan view of a housing case according to an embodiment of the present invention
  • FIGS. 6 and 7 are diagrams illustrating a configuration of a Y capacitor according to an embodiment of the present invention. And a circuit diagram.
  • the housing-embedded capacitor includes capacitor devices 100 formed by winding a dielectric film and conductive spray surfaces formed on both sides thereof, and the capacitor device.
  • a housing case 200 having an element settling space H that is embedded and arranged in a state in which 100 is laid side by side in a plurality of rows, and first and second electrically connected to the thermal spraying surfaces of the capacitor elements 100. It is configured to include two busbar forming unit 300.
  • the housing case 200 the partition wall 15 is formed in a plurality of vertically protruding in the vertical direction the capacitor element
  • the bottom plate 10 partitioning the device settlement space (H) in which the 200 is placed, the long side wall plate 20 facing the thermal spraying surface of the capacitor element 200, and the long side wall plate 20 It comprises a horizontal wall plate (30, 40) connecting both ends.
  • the partition wall 15 of the bottom plate 10 protrudes obliquely upward from one point of the bottom plate 10.
  • the heat generating groove 14 is preferably formed in parallel with each other in a state where a plurality of spaced apart from the bottom surface of the bottom plate (10).
  • the long side wall plate 20, the vertical reinforcement bar 25 is one point of the long side wall plate 20 Are formed to protrude inwardly, and the vertical inlet grooves 26 formed on the outer side of the vertical reinforcement bar 25 are formed, and the vertical reinforcement bar 25 is parallel to each other in a state spaced apart from the inner wall of the long side wall plate 20. It is preferable that a plurality of vertically formed.
  • the cross-sectional shape of the vertical reinforcement bar 25 is preferably one selected from a semicircular arc or a "c" shape.
  • the partition wall 15 of the bottom plate 10 protrudes obliquely upward from one point of the bottom plate 10.
  • the vertical reinforcement bar 25 is formed at the position where the partition wall 15 is formed, and the vertical reinforcement bar ( 25 is preferably extended from the upper end of the long side wall plate 20 to the ridge 13.
  • the housing-embedded capacitor discharges residual charge charged in the capacitor when the capacitor is separated from the input terminal, thereby causing an electric shock accident. It further comprises a discharge resistor to prevent.
  • the discharge resistor is mounted on an outer surface of the long side wall plate 20 of the housing case 200, and the housing case 200 includes a stepped portion 80 for mounting a discharge resistor formed on an outer surface of the long side wall plate 20.
  • the discharge resistor mounting stepped portion 80 is formed of two first and second stepped portions 81 and 85 facing and protruded to be spaced apart from each other horizontally.
  • the housing built-in capacitor includes a Y capacitor for preventing electromagnetic interference
  • the housing case 200 includes the housing. Further comprising a Y capacitor mounting portion 60 formed on one side in the longitudinal direction of the case 200, the Y capacitor mounting portion 60, the two Y capacitor elements (S1, S2) constituting the Y capacitor is placed, embedded First and second auxiliary separation walls 61 and 63 formed between the first and second Y capacitor grooves 61a and 63a, the first and second Y capacitor grooves 61a and 63a, and the device settling space H. It is preferable that it consists of.
  • a gap 64a is formed between one side wall plate 30 and the first and second auxiliary separation walls 61 and 63, and the gap 64a is formed in the first and second Y capacitor grooves 61a and 63a. It is preferable to communicate with each other.
  • the housing case 200 having a square shape includes a fixing part for fixing the capacitor to the mother at four corners.
  • the first fixing piece (70) which is one of the fixing parts, is fixed to one side wall plate (30) and then extends horizontally to protrude horizontally in the horizontal direction (71) and to the end of the horizontal body piece (71). It is preferable that the formed fastening hole 72 and the reinforcing piece 75 protruded upright from the center of the upper surface of the horizontal body piece 71.
  • the reinforcing piece 75 is preferably composed of a curved reinforcing piece 75a and a flat extension piece 75b extending along the horizontal body piece 71 from the reinforcing piece 75a.
  • a third auxiliary separation wall between the second auxiliary separation wall 63 and the long side wall plate 20 is formed. 64) is preferably formed.
  • a support protrusion 91 protrudes in a vertical direction outside the one horizontal wall plate 30 of one of the horizontal wall plates 30 and 40 to support the rear of the input terminal, and one horizontal wall plate of the horizontal wall plates 30 and 40 ( 30)
  • the auxiliary horizontal plate 95 protrudes horizontally from the outside and a separation protrusion 96 is formed on the upper portion of the auxiliary horizontal plate 95 so as to separate and support the input terminals so as not to move laterally from each other. .

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

The present invention relates to a capacitor built into a housing, and comprises: capacitor devices (100) having a dielectric film wound and formed thereon and conductive thermal spray surfaces formed on both sides thereof; a housing case (200) including device housing spaces (H) built therein and arranged in which the capacitor devices (100) are laid side by side in a plurality of rows; and first and second bus bar forming portions (300) electrically connected to the thermal spray surfaces of the capacitor devices (100). The housing case (200) comprises: a floor plate (10) having a plurality of partitioning walls (15) formed projecting vertically along a longitudinal direction so as to partition and form the device housing spaces (H) in which the capacitor devices (200) are housed; elongated sidewall plates (20) facing the thermal spray surfaces of the capacitor devices (200); and cross wall plates (30 and 40) connecting both respective ends of the elongated sidewall plates (20).

Description

하우징 내장형 커패시터Capacitors with Housing
본 발명은 발열 능력 및 내구성이 우수하며 컴팩트한 구성을 가능하게 하는 하우징 내장형 커패시터에 관한 것이다.The present invention relates to a housing-integrated capacitor which is excellent in heat generating ability and durability and enables a compact configuration.
일반적으로, 전기기기용, 진상용, 전자기기용 커패시터 등은 각종 산업분야에서 널리 사용되고 있다. 이러한 커패시터는 유전체로 폴리에칠렌텔레프타레이트(PET) 수지, 폴리프로필렌(PP) 수지, 폴리에칠렌나프탈레이트(PEN) 수지, 폴리카보네이트(PC) 수지, 폴리페닐렌설파이드(PPS) 수지 등의 프라스틱필름을 사용하여, 프라스틱필름의 한 면 또는 양면에 금속을 증착한 증착필름을 권취하고, 권취된 증착필름의 양면에는 아연, 아연 합금, 주석 또는 1차 아연 2차 주석을 용사하여, 용사면을 만들어 커패시터 소자를 제조한다.In general, capacitors for electric devices, fastening devices, electronic devices, and the like are widely used in various industrial fields. These capacitors use plastic films such as polyethylene terephthalate (PET) resin, polypropylene (PP) resin, polyethylene naphthalate (PEN) resin, polycarbonate (PC) resin, and polyphenylene sulfide (PPS) resin as dielectrics. By winding a deposited film in which metal is deposited on one or both sides of the plastic film, and by spraying zinc, zinc alloy, tin or primary zinc secondary tin on both sides of the wound deposited film to form a thermal spraying capacitor element To prepare.
커패시터의 정전용량은 커패시터의 용도에 따라 차이가 있으므로 다른 N극부스바와 P극 부스바에 커패시터 소자 (이하 소자)의 갯수를 가감하여 결선하여 커패시터를 제조하게 되는데, 작은 용량의 커패시터는 적은 수량의 소자를 결선하고 대용량 커패시터는 다수의 소자를 결선하여 커패시터를 제조한다.Capacitor capacitance varies according to the purpose of the capacitor, so the capacitors are manufactured by adding or subtracting the number of capacitor elements (hereinafter, referred to as the following) to other N-pole bus bars and P-pole bus bars. Wire and the large capacity capacitor is connected to a plurality of devices to manufacture the capacitor.
공개특허 특2001-0072178호(파나소닉)는 커패시터 및 커패시터 제조방법을 게시한다.Japanese Patent Laid-Open No. 2001-0072178 (Panasonic) discloses a capacitor and a capacitor manufacturing method.
본 발명은 하우징의 방열 특성이 우수하여 장시간 작동에도 과열되지 않으며 내구성이 뛰어난 하우징 내장형 커패시터를 제공하기 위함이다. 또한, 하우징 사출 후 냉각에 의한 변형이 적고 커패시터 조립 후 에폭시 몰딩 공정중에서 발생할 수 있는 하우징의 형성 변형으로 최소화 하여 제품 정밀도와 작동성을 최대화 시킬수 있는 하우징 내장형 커패시터를 제공하기 위함이다.The present invention is to provide a housing-integrated capacitor excellent in heat dissipation characteristics of the housing and does not overheat even long time operation. In addition, it is to provide a housing-integrated capacitor which can minimize the deformation caused by cooling after the injection of the housing and minimize the deformation of the housing that can occur during the epoxy molding process after the assembly of the capacitor to maximize product precision and operability.
본 발명의 하우징 내장형 커패시터는, 유전체 필름이 권취되어 형성되고 양측에 전도성의 용사면이 형성된 커패시터 소자(100)들과, 상기 커패시터 소자(100)들이 복수열로 나란하게 눕힌 상태로 내장, 배열되는 소자 안치공간(H)를 구비한 하우징 케이스(200)와, 상기 커패시터 소자(100)들의 용사면에 전기적으로 연결되는 제1, 제2 부스바 형성부(300)를 포함하여 구성되되,The housing-embedded capacitor of the present invention includes a capacitor device 100 formed by winding a dielectric film and conductive spray surfaces formed on both sides thereof, and the capacitor device 100 embedded and arranged in a state in which the capacitor devices 100 are laid side by side in a plurality of rows. A housing case 200 having an element settling space H, and first and second busbar forming units 300 electrically connected to the thermal spraying surfaces of the capacitor elements 100,
상기 하우징 케이스(200)는, 구획벽(15)이 세로방향으로 세로로 복수개 돌출 형성되어 상기 커패시터 소자(200)들이 안치되는 소자 안치공간(H)를 구획 형성하는 바닥판(10)과, 상기 커패시터 소자(200)들의 용사면과 마주보는 장측벽판(20)과, 상기 장측벽판(20)의 양단을 연결하는 횡벽판(30, 40),을 포함하여 구성되는 것을 특징이다.The housing case 200 may include: a bottom plate 10 partitioning a plurality of partition walls 15 vertically and vertically to form a device settlement space H in which the capacitor devices 200 are placed; It is characterized in that it comprises a long side wall plate (20) facing the thermal spraying surface of the capacitor element 200, and horizontal wall plates (30, 40) connecting both ends of the long side wall plate (20).
또한, 본 발명의 하우징 내장형 커패시터에 있어서, 바닥판(10)의 구획벽(15)은, 상기 바닥판(10)의 일지점으로부터 상향 경사지게 돌출되는 상향 경사부(12)와, 상기 상향 경사부(12)의 상단이 만나서 형성하는 리지부(Ridge, 13)와, 상기 상향 경사부(11a)의 하면에 의해 오목하게 형성된 발열홈부(14),를 포함하여 구성되고, 상기 발열홈부(14)는 상기 바닥판(10)의 하면에서 복수개가 이격된 상태로 서로 평행하게 형성된다.In the housing-embedded capacitor of the present invention, the partition wall 15 of the bottom plate 10 includes an upward inclined portion 12 protruding upwardly inclined from one point of the bottom plate 10 and the upward inclined portion. And a heat generating groove portion 14 formed concave by a lower surface of the upwardly inclined portion 11a and a ridge portion 13 formed by the upper end of the upper portion 12. Is formed in parallel with each other in a plurality of spaced apart state from the bottom surface of the bottom plate (10).
또한, 본 발명의 하우징 내장형 커패시터에 있어서, 장측벽판(20)은, 수직 보강살(25)이 상기 장측벽판(20)의 일지점에서 내입 돌출되어 형성되고, 상기 수직 보강살(25)의 외측에 형성된 수직내입홈(26)이 형성되고, 상기 수직 보강살(25)은 상기 장측벽판(20)의 내벽에 이격된 상태로 서로 평행하게 수직으로 복수개 형성되는 것을 특징이다. In addition, in the housing-embedded capacitor of the present invention, the long side wall plate 20 is formed by the vertical reinforcement bar 25 indenting and protruding from one point of the long side wall plate 20, and the vertical reinforcement bar 25. Vertically indented grooves 26 formed on the outer side of the formed, the vertical reinforcement bar 25 is characterized in that a plurality of vertically parallel to each other in a state spaced apart from the inner wall of the long side wall plate (20).
본 발명에 따르는 경우 방열 특성이 우수하여 장시간 작동에도 과열되지 않으며 내구성이 뛰어난 하우징 내장형 커패시터가 제공된다. 또한, 하우징 사출 후 냉각에 의한 변형이 적고 커패시터 조립 후 에폭시 몰딩 공정중에서 발생할 수 있는 하우징의 형성 변형으로 최소화 하여 제품 정밀도와 작동성을 최대화 시킬수 있는 하우징 내장형 커패시터가 제공된다.According to the present invention, excellent heat dissipation characteristics are provided, which do not overheat even after a long time operation, and have a durable housing-integrated capacitor. In addition, there is provided a housing-integrated capacitor which minimizes deformation by cooling after injection of the housing and minimizes the deformation of the housing that may occur during the epoxy molding process after assembly of the capacitor to maximize product precision and operability.
도 1은 본 발명의 일실시예에 따른 하우징 내장형 커패시터 조립 사시도.1 is a perspective view of a housing-built capacitor assembly according to an embodiment of the present invention.
도 2는 본 발명의 일실시예에 따른 하우징 내장형 커패시터 분해 사시도.Figure 2 is an exploded perspective view of a housing built-in capacitor according to an embodiment of the present invention.
도 3은 본 발명의 일실시예에 따른 하우징 케이스 상세 사시도.Figure 3 is a perspective view of the housing case according to an embodiment of the present invention.
도 4는 본 발명의 일실시예에 따른 하우징 케이스 단면 사시도.Figure 4 is a cross-sectional perspective view of the housing case according to an embodiment of the present invention.
도 5는 본 발명의 일실시예에 따른 하우징 케이스 평면도.5 is a plan view of the housing case according to an embodiment of the present invention.
도 6, 도 7은 본 발명의 일실시예에 따른 Y 커패시터 구성도 및 회로도.6 and 7 are Y capacitor configuration and circuit diagram according to an embodiment of the present invention.
본 발명의 하우징 내장형 커패시터는, 유전체 필름이 권취되어 형성되고 양측에 전도성의 용사면이 형성된 커패시터 소자(100)들과, 상기 커패시터 소자(100)들이 복수열로 나란하게 눕힌 상태로 내장, 배열되는 소자 안치공간(H)를 구비한 하우징 케이스(200)와, 상기 커패시터 소자(100)들의 용사면에 전기적으로 연결되는 제1, 제2 부스바 형성부(300)를 포함하여 구성되되,The housing-embedded capacitor of the present invention includes a capacitor device 100 formed by winding a dielectric film and conductive spray surfaces formed on both sides thereof, and the capacitor device 100 embedded and arranged in a state in which the capacitor devices 100 are laid side by side in a plurality of rows. A housing case 200 having an element settling space H, and first and second busbar forming units 300 electrically connected to the thermal spraying surfaces of the capacitor elements 100,
상기 하우징 케이스(200)는, 구획벽(15)이 세로방향으로 세로로 복수개 돌출 형성되어 상기 커패시터 소자(200)들이 안치되는 소자 안치공간(H)를 구획 형성하는 바닥판(10)과, 상기 커패시터 소자(200)들의 용사면과 마주보는 장측벽판(20)과, 상기 장측벽판(20)의 양단을 연결하는 횡벽판(30, 40),을 포함하여 구성되는 것을 특징이다.The housing case 200 may include: a bottom plate 10 partitioning a plurality of partition walls 15 vertically and vertically to form a device settlement space H in which the capacitor devices 200 are placed; It is characterized in that it comprises a long side wall plate (20) facing the thermal spraying surface of the capacitor element 200, and horizontal wall plates (30, 40) connecting both ends of the long side wall plate (20).
또한, 본 발명의 하우징 내장형 커패시터에 있어서, 바닥판(10)의 구획벽(15)은, 상기 바닥판(10)의 일지점으로부터 상향 경사지게 돌출되는 상향 경사부(12)와, 상기 상향 경사부(12)의 상단이 만나서 형성하는 리지부(Ridge, 13)와, 상기 상향 경사부(11a)의 하면에 의해 오목하게 형성된 발열홈부(14),를 포함하여 구성되고, 상기 발열홈부(14)는 상기 바닥판(10)의 하면에서 복수개가 이격된 상태로 서로 평행하게 형성된다.In the housing-embedded capacitor of the present invention, the partition wall 15 of the bottom plate 10 includes an upward inclined portion 12 protruding upwardly inclined from one point of the bottom plate 10 and the upward inclined portion. And a heat generating groove portion 14 formed concave by a lower surface of the upwardly inclined portion 11a and a ridge portion 13 formed by the upper end of the upper portion 12. Is formed in parallel with each other in a plurality of spaced apart state from the bottom surface of the bottom plate (10).
또한, 본 발명의 하우징 내장형 커패시터에 있어서, 장측벽판(20)은, 수직 보강살(25)이 상기 장측벽판(20)의 일지점에서 내입 돌출되어 형성되고, 상기 수직 보강살(25)의 외측에 형성된 수직내입홈(26)이 형성되고, 상기 수직 보강살(25)은 상기 장측벽판(20)의 내벽에 이격된 상태로 서로 평행하게 수직으로 복수개 형성되는 것을 특징이다. In addition, in the housing-embedded capacitor of the present invention, the long side wall plate 20 is formed by the vertical reinforcement bar 25 indenting and protruding from one point of the long side wall plate 20, and the vertical reinforcement bar 25. Vertically indented grooves 26 formed on the outer side of the formed, the vertical reinforcement bar 25 is characterized in that a plurality of vertically parallel to each other in a state spaced apart from the inner wall of the long side wall plate (20).
이하에서 본 발명의 일실시예에 따른 하우징 내장형 커패시터에 대하여 첨부된 도면을 참조하여 상세하게 설명한다. 도 1은 본 발명의 일실시예에 따른 하우징 내장형 커패시터 조립 사시도, 도 2는 본 발명의 일실시예에 따른 하우징 내장형 커패시터 분해 사시도, 도 3은 본 발명의 일실시예에 따른 하우징 케이스 상세 사시도, 도 4는 본 발명의 일실시예에 따른 하우징 케이스 단면 사시도, 도 5는 본 발명의 일실시예에 따른 하우징 케이스 평면도이고, 도 6, 도 7은 본 발명의 일실시예에 따른 Y 커패시터 구성도 및 회로도이다.Hereinafter, a housing built-in capacitor according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 1 is a perspective view of the assembly of the housing-integrated capacitor according to an embodiment of the present invention, Figure 2 is an exploded perspective view of the housing-integrated capacitor according to an embodiment of the present invention, Figure 3 is a detailed perspective view of the housing case according to an embodiment of the present invention, 4 is a sectional perspective view of a housing case according to an embodiment of the present invention, FIG. 5 is a plan view of a housing case according to an embodiment of the present invention, and FIGS. 6 and 7 are diagrams illustrating a configuration of a Y capacitor according to an embodiment of the present invention. And a circuit diagram.
도 1 내지 도 5에 도시된 바와 같이, 본 발명의 일실시예에 따른 하우징 내장형 커패시터는, 유전체 필름이 권취되어 형성되고 양측에 전도성의 용사면이 형성된 커패시터 소자(100)들과, 상기 커패시터 소자(100)들이 복수열로 나란하게 눕힌 상태로 내장, 배열되는 소자 안치공간(H)를 구비한 하우징 케이스(200)와, 상기 커패시터 소자(100)들의 용사면에 전기적으로 연결되는 제1, 제2 부스바 형성부(300)를 포함하여 구성된다. As shown in FIGS. 1 to 5, the housing-embedded capacitor according to an embodiment of the present invention includes capacitor devices 100 formed by winding a dielectric film and conductive spray surfaces formed on both sides thereof, and the capacitor device. A housing case 200 having an element settling space H that is embedded and arranged in a state in which 100 is laid side by side in a plurality of rows, and first and second electrically connected to the thermal spraying surfaces of the capacitor elements 100. It is configured to include two busbar forming unit 300.
도 3, 도 4에 도시된 바와 같이, 본 발명의 일실시예에 따른 하우징 내장형 커패시터에 있어서, 하우징 케이스(200)는, 구획벽(15)이 세로방향으로 세로로 복수개 돌출 형성되어 상기 커패시터 소자(200)들이 안치되는 소자 안치공간(H)를 구획 형성하는 바닥판(10)과, 커패시터 소자(200)들의 용사면과 마주보는 장측벽판(20)과, 상기 장측벽판(20)의 양단을 연결하는 횡벽판(30, 40)을 포함하여 구성된다.As shown in Figure 3, 4, in the housing-embedded capacitor according to an embodiment of the present invention, the housing case 200, the partition wall 15 is formed in a plurality of vertically protruding in the vertical direction the capacitor element The bottom plate 10 partitioning the device settlement space (H) in which the 200 is placed, the long side wall plate 20 facing the thermal spraying surface of the capacitor element 200, and the long side wall plate 20 It comprises a horizontal wall plate (30, 40) connecting both ends.
도 3, 도 4에 도시된 바와 같이, 본 발명의 일실시예에 따른 하우징 내장형 커패시터에 있어서, 바닥판(10)의 구획벽(15)은, 바닥판(10)의 일지점으로부터 상향 경사지게 돌출되는 상향 경사부(12)와, 상향 경사부(12)의 상단이 만나서 형성하는 리지부(Ridge, 13)와, 상향 경사부(11a)의 하면에 의해 오목하게 형성된 발열홈부(14)를 포함하여 구성된다. 발열홈부(14)는 상기 바닥판(10)의 하면에서 복수개가 이격된 상태로 서로 평행하게 형성되는 것이 바람직하다.3 and 4, in the housing-embedded capacitor according to the embodiment of the present invention, the partition wall 15 of the bottom plate 10, protrudes obliquely upward from one point of the bottom plate 10. The upper inclined portion 12, the ridge portion 13 formed by the upper end of the upward inclined portion 12, and the heat generating groove portion 14 formed concave by the lower surface of the upward inclined portion 11a. It is configured by. The heat generating groove 14 is preferably formed in parallel with each other in a state where a plurality of spaced apart from the bottom surface of the bottom plate (10).
도 3, 도 4에 도시된 바와 같이, 본 발명의 일실시예에 따른 하우징 내장형 커패시터에 있어서, 장측벽판(20)은, 수직 보강살(25)이 상기 장측벽판(20)의 일지점에서 내입 돌출되어 형성되고, 수직 보강살(25)의 외측에 형성된 수직내입홈(26)이 형성되고, 수직 보강살(25)은 상기 장측벽판(20)의 내벽에 이격된 상태로 서로 평행하게 수직으로 복수개 형성되는 것이 바람직하다. 수직 보강살(25)의 횡단면 형상은 반원호 또는 "ㄷ"자형 중에서 선택된 하나 인 것이 바람직하다.3 and 4, in the housing-embedded capacitor according to an embodiment of the present invention, the long side wall plate 20, the vertical reinforcement bar 25 is one point of the long side wall plate 20 Are formed to protrude inwardly, and the vertical inlet grooves 26 formed on the outer side of the vertical reinforcement bar 25 are formed, and the vertical reinforcement bar 25 is parallel to each other in a state spaced apart from the inner wall of the long side wall plate 20. It is preferable that a plurality of vertically formed. The cross-sectional shape of the vertical reinforcement bar 25 is preferably one selected from a semicircular arc or a "c" shape.
도 3, 도 4에 도시된 바와 같이, 본 발명의 일실시예에 따른 하우징 내장형 커패시터에 있어서, 바닥판(10)의 구획벽(15)은, 바닥판(10)의 일지점으로부터 상향 경사지게 돌출되는 상향 경사부(12)와, 상향 경사부(12)의 상단이 만나서 형성하는 리지부(Ridge, 13)와, 상향 경사부(11a)의 하면에 의해 오목하게 형성된 발열홈부(14)를 포함하여 구성된다.3 and 4, in the housing-embedded capacitor according to the embodiment of the present invention, the partition wall 15 of the bottom plate 10, protrudes obliquely upward from one point of the bottom plate 10. The upper inclined portion 12, the ridge portion 13 formed by the upper end of the upward inclined portion 12, and the heat generating groove portion 14 formed concave by the lower surface of the upward inclined portion 11a. It is configured by.
도 3, 도 4에 도시된 바와 같이, 본 발명의 일실시예에 따른 하우징 내장형 커패시터에 있어서, 수직 보강살(25)은 상기 구획벽(15)이 형성된 위치에 같이 형성되고, 수직 보강살(25)은 상기 장측벽판(20)의 상단으로부터 하향 연장되어 상기 리지부(Ridge, 13)까지 형성되어 있는 것이 바람직하다.3 and 4, in the housing-embedded capacitor according to the embodiment of the present invention, the vertical reinforcement bar 25 is formed at the position where the partition wall 15 is formed, and the vertical reinforcement bar ( 25 is preferably extended from the upper end of the long side wall plate 20 to the ridge 13.
도 1 내지 도 7에 도시된 바와 같이, 본 발명의 일실시예에 따른 하우징 내장형 커패시터에 있어서, 하우징 내장형 커패시터는 커패시터가 입력단자와 분리된 경우 커패시터에 충전되어 있는 잔류 전하를 방전시켜 감전 사고를 방지하는 방전 저항기를 더 포함하여 구성된다. 방전 저항기는 상기 하우징 케이스(200)의 장측벽판(20) 외면에 장착되고, 상기 하우징 케이스(200)는 상기 장측벽판(20) 외면에 형성된 방전저항기 탑재용 단턱부(80)를 포함하고, 상기방전저항기 탑재용 단턱부(80)는 수평하게 외곽으로 서로 이격되게 돌출되어 대향되는 두개의 제1, 제2 단턱(81, 85)들로 구성되는 것이 바람직하다.As shown in FIGS. 1 to 7, in the housing-embedded capacitor according to an embodiment of the present invention, the housing-embedded capacitor discharges residual charge charged in the capacitor when the capacitor is separated from the input terminal, thereby causing an electric shock accident. It further comprises a discharge resistor to prevent. The discharge resistor is mounted on an outer surface of the long side wall plate 20 of the housing case 200, and the housing case 200 includes a stepped portion 80 for mounting a discharge resistor formed on an outer surface of the long side wall plate 20. Preferably, the discharge resistor mounting stepped portion 80 is formed of two first and second stepped portions 81 and 85 facing and protruded to be spaced apart from each other horizontally.
도 1 내지 도 7에 도시된 바와 같이, 본 발명의 일실시예에 따른 하우징 내장형 커패시터에 있어서, 하우징 내장형 커패시터는 전자기 간섭 현상을 방지하기 위한 Y 커패시터를 포함하고, 하우징 케이스(200)는 상기 하우징 케이스(200)의 종방향 일측에 형성된 Y 커패시터 장착부(60)를 더 포함하되, Y 커패시터 장착부(60)는, Y 커패시터를 구성하는 두개의 Y 커패시터 소자(S1, S2)가 안치, 내장되는 제1, 제2 Y 커패시터홈(61a, 63a)과, 제1, 제2 Y 커패시터홈(61a, 63a)과 소자 안치공간(H) 사이에 형성된 제1, 제2 보조분리벽(61, 63)으로 구성되는 것이 바람직하다. 일측 횡벽판(30)과 상기 제1, 제2 보조분리벽(61, 63) 사이에 갭(64a)이 형성되고 상기 갭(64a)는 상기 제1, 제2 Y 커패시터홈(61a, 63a)을 서로 연통시키는 것이 바람직하다.As shown in FIGS. 1 to 7, in a housing built-in capacitor according to an embodiment of the present invention, the housing built-in capacitor includes a Y capacitor for preventing electromagnetic interference, and the housing case 200 includes the housing. Further comprising a Y capacitor mounting portion 60 formed on one side in the longitudinal direction of the case 200, the Y capacitor mounting portion 60, the two Y capacitor elements (S1, S2) constituting the Y capacitor is placed, embedded First and second auxiliary separation walls 61 and 63 formed between the first and second Y capacitor grooves 61a and 63a, the first and second Y capacitor grooves 61a and 63a, and the device settling space H. It is preferable that it consists of. A gap 64a is formed between one side wall plate 30 and the first and second auxiliary separation walls 61 and 63, and the gap 64a is formed in the first and second Y capacitor grooves 61a and 63a. It is preferable to communicate with each other.
도 1 내지 도 7에 도시된 바와 같이, 본 발명의 일실시예에 따른 하우징 내장형 커패시터에 있어서, 사각 형상의 상기 하우징 케이스(200)는 네 귀퉁이에 커패시터를 모체에 고정시는 고정부를 포함하고, 고정부 중의 하나인 제1 고정편(70)은, 일측 횡벽판(30)에 고정된 후 횡방향으로 수평하게 돌출 연장되는 수평몸체편(71)과, 수평몸체편(71)의 단부에 형성된 체결홀(72)과, 수평몸체편(71)의 상면 중앙으로부터 상향으로 직립 돌출된 보강편(75)으로 구성되는 것이 바람직하다. 보강편(75)은 만곡진 보강결합편(75a)과 상기 보강결합편(75a)으로부터 수평몸체편(71)을 따라 연장된 평평한 연장편(75b)로 구성되는 것이 바람직하다.As shown in FIGS. 1 to 7, in a housing-embedded capacitor according to an embodiment of the present invention, the housing case 200 having a square shape includes a fixing part for fixing the capacitor to the mother at four corners. The first fixing piece (70), which is one of the fixing parts, is fixed to one side wall plate (30) and then extends horizontally to protrude horizontally in the horizontal direction (71) and to the end of the horizontal body piece (71). It is preferable that the formed fastening hole 72 and the reinforcing piece 75 protruded upright from the center of the upper surface of the horizontal body piece 71. The reinforcing piece 75 is preferably composed of a curved reinforcing piece 75a and a flat extension piece 75b extending along the horizontal body piece 71 from the reinforcing piece 75a.
도 1 내지 도 7에 도시된 바와 같이, 본 발명의 일실시예에 따른 하우징 내장형 커패시터에 있어서, 상기 제2 보조분리벽(63)과 상기 장측벽판(20) 사이에 제3보조분리벽(64)이 형성되는 것이 바람직하다. 횡벽판(30, 40) 중 하나의 횡벽판(30) 외측에 수직방향으로 지지돌기(91)가 돌출형성되어 입력단자의 후방을 지지하고, 횡벽판(30, 40) 중 하나의 횡벽판(30) 외측에 수평으로 보조수평판(95)이 돌출되고 상기 보조수평판(95)의 상부에 상기 입력단자가 서로 횡으로 움직이지 않게 분리 지지하는 분리돌기(96)가 형성되어 있는 것이 바람직하다.As shown in FIGS. 1 to 7, in the housing-embedded capacitor according to the embodiment of the present invention, a third auxiliary separation wall between the second auxiliary separation wall 63 and the long side wall plate 20 is formed. 64) is preferably formed. A support protrusion 91 protrudes in a vertical direction outside the one horizontal wall plate 30 of one of the horizontal wall plates 30 and 40 to support the rear of the input terminal, and one horizontal wall plate of the horizontal wall plates 30 and 40 ( 30) It is preferable that the auxiliary horizontal plate 95 protrudes horizontally from the outside and a separation protrusion 96 is formed on the upper portion of the auxiliary horizontal plate 95 so as to separate and support the input terminals so as not to move laterally from each other. .
본 발명은 상기에서 언급한 바람직한 실시예와 관련하여 설명됐지만, 본 발명의 범위가 이러한 실시예에 한정되는 것은 아니며, 본 발명의 범위는 이하의 특허청구범위에 의하여 정하여지는 것으로 본 발명과 균등 범위에 속하는 다양한 수정 및 변형을 포함할 것이다.Although the present invention has been described in connection with the above-mentioned preferred embodiments, the scope of the present invention is not limited to these embodiments, and the scope of the present invention is defined by the following claims, and equivalent scope of the present invention. It will include various modifications and variations belonging to.
아래의 특허청구범위에 기재된 도면부호는 단순히 발명의 이해를 보조하기 위한 것으로 권리범위의 해석에 영향을 미치지 아니함을 밝히며 기재된 도면부호에 의해 권리범위가 좁게 해석되어서는 안될 것이다.The reference numerals set forth in the claims below are merely to aid the understanding of the present invention, not to affect the interpretation of the scope of the claims, and the scope of the claims should not be construed narrowly.
본 발명에 따르는 경우 방열 특성이 우수하여 장시간 작동에도 과열되지 않으며 내구성이 뛰어난 하우징 내장형 커패시터가 제공된다. 또한, 하우징 사출 후 냉각에 의한 변형이 적고 커패시터 조립 후 에폭시 몰딩 공정중에서 발생할 수 있는 하우징의 형성 변형으로 최소화 하여 제품 정밀도와 작동성을 최대화 시킬수 있는 하우징 내장형 커패시터가 제공된다.According to the present invention, excellent heat dissipation characteristics are provided, which do not overheat even after a long time operation, and have a durable housing-integrated capacitor. In addition, there is provided a housing-integrated capacitor which minimizes deformation by cooling after injection of the housing and minimizes the deformation of the housing that may occur during the epoxy molding process after assembly of the capacitor to maximize product precision and operability.

Claims (12)

  1. 유전체 필름이 권취되어 형성되고 양측에 전도성의 용사면이 형성된 커패시터 소자(100)들과,Capacitor elements 100 formed by winding a dielectric film and having conductive sprayed surfaces formed on both sides thereof,
    상기 커패시터 소자(100)들이 복수열로 나란하게 눕힌 상태로 내장, 배열되는 소자 안치공간(H)를 구비한 하우징 케이스(200)와,A housing case (200) having an element settling space (H) which is embedded and arranged in a state in which the capacitor elements (100) are laid side by side in a plurality of rows;
    상기 커패시터 소자(100)들의 용사면에 전기적으로 연결되는 제1, 제2 부스바 형성부(300)를 포함하여 구성되되,Including the first and second busbar forming portion 300 is electrically connected to the thermal sprayed surface of the capacitor element 100,
    상기 하우징 케이스(200)는,The housing case 200,
    구획벽(15)이 세로방향으로 세로로 복수개 돌출 형성되어 상기 커패시터 소자(200)들이 안치되는 소자 안치공간(H)를 구획 형성하는 바닥판(10)과,A bottom plate 10 having a plurality of partition walls 15 protruding vertically in a vertical direction to define a device settlement space H in which the capacitor devices 200 are placed;
    상기 커패시터 소자(200)들의 용사면과 마주보는 장측벽판(20)과,Long side wall plate 20 facing the thermal sprayed surface of the capacitor element 200,
    상기 장측벽판(20)의 양단을 연결하는 횡벽판(30, 40),Horizontal wall plates 30 and 40 connecting both ends of the long side wall plate 20,
    을 포함하여 구성되는 것을 특징으로 하는 하우징 내장형 커패시터.Housing embedded capacitor, characterized in that comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 바닥판(10)의 구획벽(15)은,The partition wall 15 of the bottom plate 10,
    상기 바닥판(10)의 일지점으로부터 상향 경사지게 돌출되는 상향 경사부(12)와,An upward inclined portion 12 protruding obliquely upward from one point of the bottom plate 10;
    상기 상향 경사부(12)의 상단이 만나서 형성하는 리지부(Ridge, 13)와,A ridge portion 13 formed by the upper end of the upwardly inclined portion 12,
    상기 상향 경사부(12)의 하면에 의해 오목하게 형성된 발열홈부(14),A heat generating groove 14 formed concave by a lower surface of the upwardly inclined portion 12,
    를 포함하여 구성되고,It is configured to include,
    상기 발열홈부(14)는 상기 바닥판(10)의 하면에서 복수개가 이격된 상태로 서로 평행하게 형성되는 것을 특징으로 하는 하우징 내장형 커패시터.The heating groove portion 14 is a housing built-in capacitor, characterized in that formed in parallel with each other in a state in which a plurality of spaced apart from the bottom of the bottom plate (10).
  3. 제1항에 있어서,The method of claim 1,
    상기 장측벽판(20)은,The long side wall plate 20,
    수직 보강살(25)이 상기 장측벽판(20)의 일지점에서 내입 돌출되어 형성되고,Vertical reinforcement bar 25 is formed to be indented protruding at one point of the long side wall plate 20,
    상기 수직 보강살(25)의 외측에 형성된 수직내입홈(26)이 형성되고,A vertical indentation groove 26 formed on the outside of the vertical reinforcement bar 25 is formed,
    상기 수직 보강살(25)은 상기 장측벽판(20)의 내벽에 이격된 상태로 서로 평행하게 수직으로 복수개 형성되는 것을 특징으로 하는 하우징 내장형 커패시터.The vertical reinforcing bar (25) is a housing built-in capacitor, characterized in that formed in a plurality of vertically parallel to each other in a state spaced apart from the inner wall of the long side wall plate (20).
  4. 제3항에 있어서,The method of claim 3,
    상기 수직 보강살(25)의 횡단면 형상은 반원호, "ㄷ"자형, "V"자형, 또는 끝이 날카로운 송곳 모양 중에서 선택된 하나 인 것을 특징으로 하는 하우징 내장형 커패시터.The cross-sectional shape of the vertical reinforcement (25) is a housing-in built-in capacitor, characterized in that one selected from a half circle arc, "c" shape, "V" shape, or a sharp awl shape.
  5. 제3항에 있어서,The method of claim 3,
    상기 바닥판(10)의 구획벽(15)은,The partition wall 15 of the bottom plate 10,
    상기 바닥판(10)의 일지점으로부터 상향 경사지게 돌출되는 상향 경사부(12)와,An upward inclined portion 12 protruding obliquely upward from one point of the bottom plate 10;
    상기 상향 경사부(12)의 상단이 만나서 형성하는 리지부(Ridge, 13)와,A ridge portion 13 formed by the upper end of the upwardly inclined portion 12,
    상기 상향 경사부(11a)의 하면에 의해 오목하게 형성된 발열홈부(14),A heat generating groove 14 formed concave by the lower surface of the upwardly inclined portion 11a,
    를 포함하여 구성되고,It is configured to include,
    상기 수직 보강살(25)은 상기 구획벽(15)이 형성된 위치에 같이 형성되고, 상기 수직 보강살(25)은 상기 장측벽판(20)의 상단으로부터 하향 연장되어 상기 리지부(Ridge, 13)까지 형성되어 있는 것을 특징으로 하는 하우징 내장형 커패시터.The vertical reinforcement bar 25 is formed at a position where the partition wall 15 is formed, and the vertical reinforcement bar 25 extends downward from an upper end of the long side wall plate 20 so that the ridge portion 13 Capacitor with built-in housing, characterized in that up to.
  6. 제2항에 있어서,The method of claim 2,
    상기 하우징 내장형 커패시터는 커패시터가 입력단자와 분리된 경우 커패시터에 충전되어 있는 잔류 전하를 방전시켜 감전 사고를 방지하는 방전 저항기를 더 포함하여 구성되고,The housing embedded capacitor further comprises a discharge resistor for discharging the residual charge charged in the capacitor when the capacitor is separated from the input terminal to prevent an electric shock accident,
    상기 방전 저항기는 상기 하우징 케이스(200)의 장측벽판(20) 외면에 장착되고, 상기 하우징 케이스(200)는 상기 장측벽판(20) 외면에 형성된 방전저항기 탑재용 단턱부(80)를 포함하고, 상기방전저항기 탑재용 단턱부(80)는 수평하게 외곽으로 서로 이격되게 돌출되어 대향되는 두개의 제1, 제2 단턱(81, 85)들로 구성되는 것을 특징으로 하는 하우징 내장형 커패시터.The discharge resistor is mounted on an outer surface of the long side wall plate 20 of the housing case 200, and the housing case 200 includes a stepped portion 80 for mounting a discharge resistor formed on an outer surface of the long side wall plate 20. And, the discharge resistor mounting step portion (80) is a housing built-in capacitor, characterized in that consisting of two first, second step (81, 85) protruding spaced apart from each other horizontally outward.
  7. 제1항에 있어서,The method of claim 1,
    상기 하우징 내장형 커패시터는 전자기 간섭 현상을 방지하기 위한 Y 커패시터를 포함하고, The housing embedded capacitor includes a Y capacitor to prevent the electromagnetic interference phenomenon,
    상기 하우징 케이스(200)는 상기 하우징 케이스(200)의 종방향 일측에 형성된 Y 커패시터 장착부(60)를 더 포함하되,The housing case 200 further includes a Y capacitor mounting part 60 formed at one side in the longitudinal direction of the housing case 200,
    상기 Y 커패시터 장착부(60)는,The Y capacitor mounting unit 60,
    Y 커패시터를 구성하는 두개의 Y 커패시터 소자(S1, S2)가 안치, 내장되는 제1, 제2 Y 커패시터홈(61a, 63a)과,First and second Y capacitor grooves 61a and 63a in which two Y capacitor elements S1 and S2 constituting the Y capacitor are placed and embedded;
    상기 제1, 제2 Y 커패시터홈(61a, 63a)과 소자 안치공간(H) 사이에 형성된 제1, 제2 보조분리벽(61, 63)으로 구성되는 것을 특징으로 하는 하우징 내장형 커패시터.And the first and second auxiliary separation walls (61, 63) formed between the first and second Y capacitor grooves (61a, 63a) and the device settling space (H).
  8. 제7항에 있어서,The method of claim 7, wherein
    일측 횡벽판(30)과 상기 제1, 제2 보조분리벽(61, 63) 사이에 갭(64a)이 형성되고 상기 갭(64a)는 상기 제1, 제2 Y 커패시터홈(61a, 63a)을 서로 연통시키는 것을 특징으로 하는 하우징 내장형 커패시터.A gap 64a is formed between one side wall plate 30 and the first and second auxiliary separation walls 61 and 63, and the gap 64a is formed in the first and second Y capacitor grooves 61a and 63a. Capacitors with a housing, characterized in that to communicate with each other.
  9. 제2항 또는 제3항에 있어서,The method according to claim 2 or 3,
    사각 형상의 상기 하우징 케이스(200)는 네 귀퉁이에 커패시터를 모체에 고정시는 고정부를 포함하고,The housing case 200 of the square shape includes a fixing part for fixing the capacitor to the mother at four corners,
    상기 고정부 중의 하나인 제1 고정편(70)은,The first fixing piece 70, which is one of the fixing parts,
    일측 횡벽판(30)에 고정된 후 횡방향으로 수평하게 돌출 연장되는 수평몸체편(71)과,A horizontal body piece 71 which is fixed to one side wall plate 30 and then protrudes horizontally in a horizontal direction;
    상기 수평몸체편(71)의 단부에 형성된 체결홀(72)과,A fastening hole 72 formed at an end of the horizontal body piece 71;
    상기 수평몸체편(71)의 상면 중앙으로부터 상향으로 직립 돌출된 보강편(75),Reinforcement piece 75 protruding upright from the center of the upper surface of the horizontal body piece 71,
    으로 구성되는 것을 특징으로 하는 하우징 내장형 커패시터.Housing built-in capacitor, characterized in that consisting of.
  10. 제9항에 있어서,The method of claim 9,
    상기 보강편(75)은 만곡진 보강결합편(75a)과 상기 보강결합편(75a)으로부터 상기 수평몸체편(71)을 따라 연장된 평평한 연장편(75b)로 구성되는 것을 특징으로 하는 하우징 내장형 커패시터.The reinforcing piece 75 is a housing built-in type, characterized in that composed of a curved reinforcement piece 75a and a flat extension piece (75b) extending along the horizontal body piece 71 from the reinforcement piece (75a) Capacitors.
  11. 제7항에 있어서,The method of claim 7, wherein
    상기 제2 보조분리벽(63)과 상기 장측벽판(20) 사이에 제3보조분리벽(64)이 형성되는 것을 특징으로 하는 하우징 내장형 커패시터.Capacitors, characterized in that the third auxiliary separation wall (64) is formed between the second auxiliary separation wall (63) and the long side wall plate (20).
  12. 제1항에 있어서,The method of claim 1,
    상기 횡벽판(30, 40) 중 하나의 횡벽판(30) 외측에 수직방향으로 지지돌기(91)가 돌출형성되어 입력단자의 후방을 지지하고, A support protrusion 91 protrudes in a vertical direction outside the one horizontal wall plate 30 of one of the horizontal wall plates 30 and 40 to support the rear of the input terminal.
    상기 횡벽판(30, 40) 중 하나의 횡벽판(30) 외측에 수평으로 보조수평판(95)이 돌출되고 상기 보조수평판(95)의 상부에 상기 입력단자가 서로 횡으로 움직이지 않게 분리 지지하는 분리돌기(96)가 형성되어 있는 것을 특징으로 하는 하우징 내장형 커패시터.The auxiliary horizontal plate 95 protrudes horizontally outside the horizontal wall plate 30 of one of the horizontal wall plates 30 and 40, and the input terminals are separated from each other so that the input terminals do not move laterally from each other. Capacitors having a housing, characterized in that the support for separating projection 96 is formed.
PCT/KR2014/006886 2014-02-04 2014-07-28 Capacitor built into housing WO2015119342A1 (en)

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