WO2015115155A1 - Composition de résine permettant de former une microlentille - Google Patents

Composition de résine permettant de former une microlentille Download PDF

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Publication number
WO2015115155A1
WO2015115155A1 PCT/JP2015/050510 JP2015050510W WO2015115155A1 WO 2015115155 A1 WO2015115155 A1 WO 2015115155A1 JP 2015050510 W JP2015050510 W JP 2015050510W WO 2015115155 A1 WO2015115155 A1 WO 2015115155A1
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WIPO (PCT)
Prior art keywords
formula
group
microlens
resin composition
forming
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PCT/JP2015/050510
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English (en)
Japanese (ja)
Inventor
崇洋 坂口
安達　勲
Original Assignee
日産化学工業株式会社
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Application filed by 日産化学工業株式会社 filed Critical 日産化学工業株式会社
Priority to KR1020167018087A priority Critical patent/KR102122293B1/ko
Priority to CN201580003526.8A priority patent/CN105874355B/zh
Priority to JP2015559848A priority patent/JP6478053B2/ja
Publication of WO2015115155A1 publication Critical patent/WO2015115155A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/32—Monomers containing only one unsaturated aliphatic radical containing two or more rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
    • C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • C08L39/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041—Lenses
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • C08F222/402—Alkyl substituted imides

Definitions

  • the present invention relates to a resin composition for forming a microlens. More specifically, the present invention relates to a resin composition used for forming a microlens by an etch back method.
  • An etch back method is known as one of the methods for manufacturing a microlens for a CCD / CMOS image sensor (Patent Document 1 and Patent Document 2). That is, a resist pattern is formed on the microlens resin layer formed on the color filter layer, and this resist pattern is reflowed by heat treatment to form a lens pattern. Using the lens pattern formed by reflowing the resist pattern as an etching mask, the lower microlens resin layer is etched back, and the lens pattern shape is transferred to the microlens resin layer to produce a microlens.
  • the present invention has been made based on the above-mentioned circumstances, and its purpose is to form a cured film having excellent transparency, heat resistance, solvent resistance, flatness, and a dry etching rate equivalent to that of a resist film.
  • An object of the present invention is to provide a thermosetting resin composition having excellent storage stability.
  • Another object of the present invention is to provide a microlens having excellent transparency, heat resistance and solvent resistance.
  • the present invention provides a resin composition for forming a microlens comprising a copolymer having a structural unit represented by the following formula (1), formula (2), formula (3) and formula (4), and a solvent. It is.
  • X represents a cyclohexyl group or a phenyl group
  • Y represents a phenyl group, a biphenylyl group or a naphthyl group
  • R 0 independently represents a hydrogen atom or a methyl group
  • R 1 represents a hydrogen atom or the number of carbon atoms 1 to 3 alkyl groups
  • R 2 represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms
  • R 1 and R 2 are bonded to each other to form a 4- to 7-membered ring.
  • R 3 represents a single bond or an alkylene group having 1 to 5 carbon atoms, the alkylene group may have an ether bond therein, and R 4 represents an epoxy group Or an organic group having 5 to 12 carbon atoms having an epoxy ring.
  • the present invention is also a cured film obtained from the resin composition for forming a microlens. Furthermore, the present invention is a microlens produced from the resin composition for forming a microlens and a production method thereof.
  • the microlens is manufactured, for example, by the above-described etch back method. That is, applying the microlens-forming resin composition of the present invention on the color filter layer and baking to form a resin layer; forming a resist pattern on the resin layer using a resist composition;
  • the microlens is manufactured by a method including a step of reflowing the resist pattern to form a lens pattern and a step of etching back the resin layer using the lens pattern as an etching mask. The reflow is performed by heating the resist pattern at a temperature not lower than the glass transition temperature (Tg) of the resist pattern and usually lower than 200 ° C.
  • Tg glass transition temperature
  • the copolymer contained in the composition is a self-crosslinking type, it is not always necessary to add a crosslinking agent. Since the carboxyl group is blocked in the structural unit represented by (), the storage stability is excellent. Furthermore, the film formed from the resin composition for forming a microlens of the present invention has excellent transparency, heat resistance, solvent resistance, a glass transition temperature (Tg) of 200 ° C. or higher, and an etching rate equivalent to that of a resist film. Have.
  • the microlens is colored when heat treatment is performed at a high temperature in the formation process or the formation process of peripheral devices such as wiring.
  • the possibility that the lens shape is deformed can be significantly reduced.
  • a resin layer is formed from the resin composition for forming a microlens of the present invention and a resist solution is applied thereon, and when an electrode / wiring forming step is performed after the microlens is formed, mixing with the resist is performed.
  • problems such as deformation and peeling of the microlens due to the organic solvent can be significantly reduced. Therefore, the resin composition for forming a microlens of the present invention is suitable as a material for forming a microlens.
  • the present invention is a resin composition containing a copolymer and a solvent.
  • the solid content obtained by removing the solvent from the resin composition of the present invention is usually 1% by mass to 50% by mass.
  • the copolymer contained in the resin composition of the present invention is a copolymer having structural units represented by the aforementioned formula (1), formula (2), formula (3) and formula (4).
  • the compound (monomer) forming the structural unit represented by the formula (1) include N-cyclohexylmaleimide and N-phenylmaleimide. These compounds may be used alone or in combination of two or more.
  • the compound (monomer) forming the structural unit represented by the formula (2) include styrene, ⁇ -methylstyrene, 2-vinylbiphenyl, 3-vinylbiphenyl, 4-vinylbiphenyl, and 1-vinylnaphthalene. And 2-vinylnaphthalene. These compounds may be used alone or in combination of two or more.
  • the structural unit represented by the formula (3) is, for example, a structural unit represented by the following formula (3-1) or formula (3-2). (Wherein R 0 independently represents a hydrogen atom or a methyl group, R 2 represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, and b represents 1 or 2) .)
  • Specific examples of the compound (monomer) forming the structural unit represented by the formula (3) include 1-methoxyethyl (meth) acrylate, 1-ethoxyethyl (meth) acrylate, and 1-propoxyethyl (meth) acrylate.
  • monomers such as (meth) acrylate and tetrahydro-2H-pyran-2-yl (meth) acrylate. These monomers may be used alone or in combination of two or more.
  • the compound (monomer) forming the structural unit represented by the formula (3) is a method of polymerizing an acrylate or methacrylate having a protected carboxyl group obtained by reacting acrylic acid or methacrylic acid with an alkenyl ether compound, Alternatively, it can be obtained by a method of reacting a polymer of acrylic acid or methacrylic acid with an alkenyl ether compound.
  • the alkenyl ether compound used here is a compound represented by the following formula (5). (Wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, R 2 represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, and R 1 and R 2 may be bonded to each other to form a 4- to 7-membered oxygen-containing ring structure.)
  • the reaction of a compound having a carboxyl group and an alkenyl ether compound can be carried out, for example, by stirring at 70 ° C. using monooctyl phosphate, which is one of phosphate esters, as a catalyst.
  • alkenyl ether compound represented by the formula (5) examples include methyl vinyl ether, ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, tert-butyl vinyl ether, n-hexyl vinyl ether, cyclohexyl vinyl ether, 2 -Aliphatic vinyl ether compounds such as ethylhexyl vinyl ether, norbornyl vinyl ether, 1-adamantyl vinyl ether, 2-adamantyl vinyl ether, 2,3-dihydrofuran, 4-methyl-2,3-dihydrofuran, 2,3-dihydro-4H -Cyclic vinyl ether compounds such as pyran.
  • the structural unit represented by the formula (4) is, for example, a structural unit represented by the following formula (4-1), formula (4-2), or formula (4-3). (In the formula, each R 0 independently represents a hydrogen atom or a methyl group.)
  • the compound (monomer) forming the structural unit represented by the formula (4) include glycidyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate glycidyl ether, 3,4-epoxycyclohexylmethyl. (Meth) acrylate is mentioned. These monomers may be used alone or in combination of two or more.
  • the rate is 5 mol% to 80 mol%, preferably 10 mol% to 70 mol%
  • the content of the structural unit represented by the formula (2) is 5 mol% to 80 mol%, preferably 10 mol% to 70 mol%
  • the content of the structural unit represented by the formula (3) is 5 mol% to 40 mol%, preferably 10 mol% to 30 mol%
  • the content of the structural unit represented by the formula (4) is 5 mol% to 40 mol%. And preferably It is 10mol% to 30mol%.
  • the weight average molecular weight of the copolymer is usually 1,000 to 100,000, preferably 3,000 to 50,000.
  • the weight average molecular weight is a value obtained by using gel as a standard sample by gel permeation chromatography (GPC).
  • the content of the copolymer in the resin composition of the present invention is usually 1% by mass to 99% by mass, preferably 5% by mass to based on the content in the solid content of the resin composition. 95% by mass.
  • the method for obtaining the copolymer is not particularly limited, but generally the structural units represented by the formula (1), formula (2), formula (3) and formula (4) are formed.
  • the compound (monomer) to be obtained is usually subjected to a polymerization reaction in a solvent in the presence of a polymerization initiator at a temperature of usually 50 ° C to 120 ° C.
  • the copolymer thus obtained is usually in a solution state dissolved in a solvent, and can be used in the resin composition of the present invention without isolation in this state.
  • the copolymer solution obtained as described above is poured into a stirred poor solvent such as hexane, diethyl ether, methanol, water and the like to reprecipitate the copolymer, and the generated precipitate is obtained.
  • the copolymer can be made into powder by drying at normal temperature or under reduced pressure at room temperature or heating. By such an operation, a polymerization initiator and an unreacted compound that coexist with the copolymer can be removed.
  • the powder of the copolymer may be used as it is, or the powder may be redissolved, for example, in a solvent described later and used as a solution.
  • the preparation method of the resin composition of this invention is not specifically limited,
  • the copolymer which has a structural unit represented by said Formula (1), Formula (2), Formula (3), and Formula (4) is used.
  • dissolving in a solvent and making it a uniform solution is mentioned.
  • the solvent is not particularly limited as long as it can dissolve the copolymer.
  • examples of such solvents include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, propylene glycol, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate.
  • propylene glycol monomethyl ether propylene glycol monomethyl ether acetate, 2-heptanone, ethyl lactate are used from the viewpoint of improving leveling properties of a coating film formed by applying the resin composition of the present invention on a substrate.
  • Butyl lactate, cyclopentanone and cyclohexanone are preferred.
  • the resin composition of this invention can also contain surfactant for the purpose of improving applicability
  • the surfactant include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, polyoxyethylene alkyl ethers such as polyoxyethylene oleyl ether, polyoxyethylene octyl phenyl ether, polyoxyethylene Polyoxyethylene alkyl aryl ethers such as ethylene nonylphenyl ether, polyoxyethylene / polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan Sorbitan fatty acid esters such as tristearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene Nonionic surfactants such as polyoxyethylene sorbitan fatty acid esters such as rubitan monopalmitate, polyoxyethylene
  • Fluorosurfactant such as Footent series (manufactured by Neos Co., Ltd.) and organosiloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.) can be mentioned. These surfactants may be used alone or in combination of two or more.
  • content in the resin composition of this invention is 3 mass% or less based on content in the solid content of the said resin composition, Preferably it is 1 mass%. Or less, more preferably 0.5% by mass or less.
  • the resin composition of the present invention may contain a crosslinking agent, a curing aid, an ultraviolet absorber, a sensitizer, a plasticizer, an antioxidant, and a light stabilizer as necessary, as long as the effects of the present invention are not impaired.
  • Additives such as adhesion aids can be included.
  • a substrate for example, a semiconductor substrate such as silicon covered with a silicon oxide film, a semiconductor substrate such as silicon covered with a silicon nitride film or a silicon oxynitride film, a semiconductor substrate such as silicon formed with a color filter, or nitride
  • the resin of the present invention is applied on a silicon substrate, a quartz substrate, a glass substrate (including non-alkali glass, low alkali glass, crystallized glass, glass substrate on which an ITO film is formed) by an appropriate coating method such as a spinner or a coater.
  • the microlens resin layer is formed by baking and curing using a heating means such as a hot plate.
  • the baking conditions are appropriately selected from baking temperatures of 80 ° C. to 300 ° C. and baking times of 0.3 minutes to 60 minutes. Bake may be processed in two steps or more.
  • the film thickness of the film formed from the resin composition of the present invention is, for example, 0.001 ⁇ m to 100 ⁇ m, and preferably 0.01 ⁇ m to 10 ⁇ m.
  • a resist solution is applied onto the microlens resin layer formed from the resin composition of the present invention, exposed through a predetermined mask, and post-exposure heating (PEB) is performed as necessary, followed by alkali development and rinsing.
  • PEB post-exposure heating
  • a predetermined resist pattern is formed by drying.
  • g-line, i-line, KrF excimer laser, ArF excimer laser can be used.
  • a heat treatment is performed to reflow the resist pattern to form a lens pattern.
  • the microlens resin layer is etched back using this lens pattern as an etching mask, and the lens pattern shape is transferred to the microlens resin layer to produce a microlens.
  • the mixture was further reacted for 18 hours to obtain a copolymer solution (solid content concentration: 25% by mass).
  • the weight average molecular weight Mw of the obtained copolymer was 20,000 (polystyrene conversion).
  • the mixture was further reacted for 18 hours to obtain a copolymer solution (solid content concentration: 25% by mass).
  • the weight average molecular weight Mw of the obtained copolymer was 20,000 (polystyrene conversion).
  • Example 2 As a surfactant, 0.01 g of Megafac [registered trademark] R-30 (manufactured by DIC Corporation) was dissolved in 40.0 g of the copolymer solution obtained in Synthesis Example 2 (containing 10.0 g of solid content). It was. Then, it filtered using the polyethylene micro filter with a hole diameter of 0.10 micrometer, and prepared the fat composition for microlens formation.
  • Megafac [registered trademark] R-30 manufactured by DIC Corporation
  • Example 3 As a surfactant, 0.01 g of Megafac [registered trademark] R-30 (manufactured by DIC Corporation) was dissolved in 40.0 g of the copolymer solution obtained in Synthesis Example 3 (containing 10.0 g of solid content). It was. Then, it filtered using the polyethylene micro filter with a hole diameter of 0.10 micrometer, and prepared the fat composition for microlens formation.
  • Megafac [registered trademark] R-30 manufactured by DIC Corporation
  • Example 4 As a surfactant, 0.01 g of Megafac [registered trademark] R-30 (manufactured by DIC Corporation) was dissolved in 40.0 g of the copolymer solution obtained in Synthesis Example 4 (including 10.0 g of solid content). It was. Then, it filtered using the polyethylene micro filter with a hole diameter of 0.10 micrometer, and prepared the fat composition for microlens formation.
  • Megafac [registered trademark] R-30 manufactured by DIC Corporation
  • Example 5 As a surfactant, 0.01 g of Megafac [registered trademark] R-30 (manufactured by DIC Corporation) was dissolved in 40.0 g of the copolymer solution obtained in Synthesis Example 5 (including 10.0 g of solid content). It was. Then, it filtered using the polyethylene micro filter with a hole diameter of 0.10 micrometer, and prepared the fat composition for microlens formation.
  • Megafac [registered trademark] R-30 manufactured by DIC Corporation
  • ⁇ Reference Example 1> As a surfactant, 0.01 g of MegaFace (registered trademark) R-30 (manufactured by DIC Corporation) was dissolved in 40.0 g of the copolymer solution obtained in Synthesis Example 6 (containing 10.0 g of solid content). It was. Then, it filtered using the polyethylene micro filter with a hole diameter of 0.10 micrometer, and prepared the fat composition for microlens formation.
  • MegaFace registered trademark
  • R-30 manufactured by DIC Corporation
  • Table 1 shows the values of the minimum transmittance measured in the wavelength range of 400 nm to 800 nm before and after heating at 260 ° C. for 5 minutes.
  • Each of the microlens forming resin compositions prepared in Examples 1 to 5, Reference Examples 1 to 3 and Comparative Examples 1 to 5 was applied onto a silicon wafer using a spin coater, and then hot plate The film was baked at 100 ° C. for 1 minute and further at 230 ° C. for 10 minutes to form a film having a thickness of 2 ⁇ m. Using the etcher and the etching gas, the dry etching rates of these films were measured. Similarly, a resist solution (THMR-iP1800 (manufactured by Tokyo Ohka Kogyo Co., Ltd.)) was applied on a silicon wafer using a spin coater, and was heated on a hot plate at 90 ° C. for 1.5 minutes and at 110 ° C. for 1.5 minutes.
  • THMR-iP1800 manufactured by Tokyo Ohka Kogyo Co., Ltd.
  • the resist film was baked for 1 minute at 180 ° C. for 1 minute to form a resist film having a thickness of 1 ⁇ m, and the dry etching rate was measured, and Examples 1 to 5 and Reference Examples 1 to 1 for the resist film were measured. 3 and the dry etching rate of the film
  • the microlens-forming resin composition of the present invention has a result satisfying this. It became.
  • the Tg of the film formed from the resin composition for forming a microlens is preferably 200 ° C. or higher, and at a temperature exceeding 200 ° C. More preferably. 200 ° C. is a temperature equal to or higher than the heating temperature necessary for forming a resist pattern on the film in the process of manufacturing a microlens from the film, and is also equal to or higher than the reflow temperature of the resist pattern.
  • the film formed from the resin composition for forming a microlens according to the present invention satisfied that Tg was 200 ° C. or higher.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention concerne une composition de résine qui permet de former une microlentille, et qui contient un copolymère ayant des unités structurales représentées par les formules (1), (2), (3) et (4) ainsi qu'un solvant. (Dans les formules, X représente un groupe cyclohexyle ou un groupe phényle ; Y représente un groupe phényle, un groupe biphénylyle ou un groupe naphthyle ; chaque R0 représente individuellement un atome d'hydrogène ou un groupe méthyle ; R1 représente un atome d'hydrogène ou un groupe alkyle contenant 1 à 3 atomes de carbone ; R2 représente un groupe alkyle linéaire, ramifié ou cyclique contenant 1 à 10 atomes de carbone ; R1 et R2 peuvent se combiner pour former une structure cyclique contenant de l'oxygène à 4 à 7 chaînons ; R3 représente une liaison simple ou un groupe alkylène contenant 1 à 5 atomes de carbone, et le groupe alkylène peut comporter une liaison éther ; et R4 représente un groupe époxy ou un groupe organique contenant un cycle époxy et 5 à 12 atomes de carbone.)
PCT/JP2015/050510 2014-01-30 2015-01-09 Composition de résine permettant de former une microlentille WO2015115155A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020167018087A KR102122293B1 (ko) 2014-01-30 2015-01-09 마이크로렌즈 형성용 수지 조성물
CN201580003526.8A CN105874355B (zh) 2014-01-30 2015-01-09 微透镜形成用树脂组合物
JP2015559848A JP6478053B2 (ja) 2014-01-30 2015-01-09 マイクロレンズ形成用樹脂組成物

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JP2014015564 2014-01-30

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